Resin supply device, resin molded article manufacturing device, resin molded article manufacturing method, and resin supply method

Abstract

A resin supply device is obtained that can supply resin material as uniformly as possible to the spraying surface within a short supply time. In the resin supply device, resin material (13) in the receiving section is extruded from the ejection section (12a), and the resin material (13) lands at the ejection start point (A1) within the spraying surface (60s). The control section (70) is configured to control the moving mechanism (20) in a first mode and a second mode. In the first mode, after the resin material (13) lands at the ejection start point (A1), the ejection section (12a) moves relative to the spraying surface (60s) at a first speed (V1). In the second mode, The ejector (12a) moves relative to the spray surface (60s) at a second speed (V2) that is faster than the first speed (V1). The control unit (70) switches from the first mode to the second mode at the following time points: the time point when the straight distance between the predetermined reference position (A0) and the ejector (12a) exceeds a predetermined value (L1), or the time point when a predetermined time has elapsed since the pressing unit (32) started moving to expel the resin material (13) from the ejector (12a).

Description

Technical Field

[0001] This specification relates to a resin supply device, a resin molding article manufacturing device, a resin molding article manufacturing method, and a resin supply method. Background Technology

[0002] As disclosed in Japanese Patent Application Publication No. 2018-134846 (Patent Document 1), a resin supply device for supplying resin material to a target object is known. Patent Document 1 points out that if the resin material supplied to the target object contains gas, the presence of gas may cause voids. Patent Document 1 indicates that by increasing the moving speed of the ejector (nozzle), the amount of resin material supplied at that location can be reduced compared to other locations, thereby facilitating the removal of gas from the resin material during the compression process.

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 2018-134846 Summary of the Invention

[0006] The problem that the invention aims to solve

[0007] When supplying resin material extensively to the spray surface of an object, the nozzle is positioned above the spray surface and moved relative to it. By continuously spraying resin material from the nozzle while scanning the spray surface, a wide supply of resin material can be achieved. Here, we focus on the situation immediately following the spraying of resin material from the nozzle.

[0008] Figure 9 This diagram shows the immediate situation where the resin material 73 contained in the receiving section 71 is ejected from the ejector section 72a onto the spraying surface 75, and the movement of the ejector section 72a begins. After being ejected from the ejector section 72a, the resin material 73 moves downwards as if hanging down from the ejector section 72a, and then lands on the spraying surface 75, the target object. The resin material 73 is continuously ejected from the ejector section 72a. In this state, the movement of the ejector section 72a begins (arrow AR). Starting from the position where the resin material 73 lands on the spraying surface 75, the resin material 73 begins to draw a predetermined trajectory on the spraying surface 75.

[0009] Immediately after the resin material 73 lands on the spray surface 75, it is not yet fully fixed to the spray surface 75. If the spraying part 72a begins to move in this state, the resin material 73 may be dragged along with the spraying part 72a, causing the resin material 73 to deviate from its initial position on the spray surface 75. In this case, it will be difficult to supply the resin material 73 evenly to the spray surface 75.

[0010] This phenomenon is more likely to occur when a highly viscous liquid resin material is ejected from an ejector with a small nozzle diameter. For example... Figure 10 As shown, when the high-viscosity resin material 73 lands on the spray surface 75, the contact angle θ increases. When the contact angle θ increases, the contact area AA between the resin material 73 and the spray surface 75 decreases relatively. Since the adhesion between the resin material 73 and the spray surface 75 also weakens, the resin material 73 is prone to shifting from its initial landing position on the spray surface 75 as the spray nozzle moves.

[0011] As a countermeasure to prevent the resin material 73 from shifting, it is possible to reduce the moving speed of the spray section 72a. However, if the spray section 72a moves at a low speed while supplying the resin material 73, it may take a long time to supply the resin material 73 over a wide range of the spray surface 75, or the resin material 73 in the storage box provided in the receiving section 71 may be insufficient before the resin material 73 is supplied to the entire specified range, which may result in the resin material 73 not being supplied evenly to the spray surface 75.

[0012] The purpose of this specification is to disclose a resin supply device, a resin molding article manufacturing device, a resin molding article manufacturing method, and a resin supply method, which can supply resin material to the spraying surface as uniformly as possible in the shortest possible supply time.

[0013] Technical means to solve the problem

[0014] The resin supply device of this disclosure supplies resin material to the sprayed surface of the object to be supplied, the resin supply device comprising:

[0015] A receiving section for receiving the resin material, and having an ejection section for ejecting the resin material;

[0016] The pressing mechanism has a pressing part that is inserted into the receiving part;

[0017] The moving mechanism, by moving the spraying part relative to the spraying surface, causes the spraying part to scan the spraying surface; and

[0018] The control unit controls the moving mechanism.

[0019] The pressing part moves within the receiving part, causing the resin material within the receiving part to be expelled from the spraying part, so that the resin material lands at the spraying start point within the spraying surface.

[0020] The control unit is configured to control the moving mechanism in a first mode and a second mode.

[0021] In the first mode, after the resin material lands at the spray initiation point, the spraying portion moves relative to the spray surface at a first velocity.

[0022] In the second mode, the spraying part moves relative to the spraying surface at a second speed that is faster than the first speed.

[0023] The control unit switches from the first mode to the second mode at the following times:

[0024] The time point at which the straight-line distance between the pre-defined reference position and the ejector exceeds a predetermined value.

[0025] or,

[0026] A predetermined time has elapsed since the point at which the pressing part begins to move to expel the resin material from the ejection part.

[0027] The apparatus for manufacturing resin molded articles disclosed herein includes the resin supply device.

[0028] The method for manufacturing resin molded articles disclosed herein is a method using the apparatus for manufacturing said resin molded articles, comprising: a step of supplying the resin material to a target object by the resin supply device; and

[0029] The process of using the resin material to perform resin molding on the supplied object.

[0030] The resin supply method disclosed herein supplies resin material to the sprayed surface of the object to be supplied, the resin supply method comprising:

[0031] The pressing part moves within the receiving part, causing the resin material extruded from the ejection part to land at the ejection start point within the spraying surface;

[0032] Implementing a first mode, in which, after the resin material lands at the spray initiation point, the spraying portion supplies the resin material to the spray surface while moving relative to the spray surface at a first velocity; and

[0033] In the second mode, the spraying section moves relative to the spraying surface at a second speed that is faster than the first speed while supplying the resin material to the spraying surface.

[0034] The switch from the first mode to the second mode will be performed at the following time points:

[0035] The time point at which the straight-line distance between the pre-defined reference position and the ejector exceeds a predetermined value.

[0036] or,

[0037] A predetermined time has elapsed since the point at which the pressing part begins to move to expel the resin material from the ejection part.

[0038] The effects of the invention

[0039] Based on the technical concept disclosed in this specification, a resin supply device, a resin molding article manufacturing device, a resin molding article manufacturing method, and a resin supply method can be obtained, which can supply resin material to the spraying surface as evenly as possible in the shortest possible supply time. Attached Figure Description

[0040] [ Figure 1 [] is a diagram showing the functional blocks of the resin molding manufacturing apparatus 1000.

[0041] [ Figure 2 [Illustration 1] is a cross-sectional view of the molding section 80 included in the resin molding manufacturing apparatus 1000 in the state before mold closing.

[0042] [ Figure 3 [Illustration 1] is a cross-sectional view showing the molding section 80 included in the resin molding manufacturing apparatus 1000 in the state after mold closing.

[0043] [ Figure 4 [ ] is a flowchart illustrating a method for manufacturing resin molded articles using a resin molding article manufacturing apparatus 1000.

[0044] [ Figure 5 [Illustration 1] is a cross-sectional view of the resin supply device 100 included in the resin molding manufacturing apparatus 1000.

[0045] [ Figure 6 [This is a perspective view showing the situation where the spraying part 12a of the resin supply device 100 supplies resin material 13 onto the spraying surface 60s.]

[0046] [ Figure 7 [Illustration] is a plan view showing the shape of the resin material 13 formed when the ejector 12a operates along a spiral trajectory on the spray surface 60s.

[0047] [ Figure 8 [ ] is a flowchart illustrating a resin supply method using the resin supply device 100.

[0048] [ Figure 9 [ ] is a diagram showing the immediate state of the resin material 73 contained in the containment section 71 being sprayed from the ejector section 72a onto the spray surface 75, and the ejector section 72a starting to move.

[0049] [ Figure 10 [Figure 1] is used to illustrate the situation where the contact angle θ increases when the high-viscosity resin material 73 lands on the spray surface 75. Detailed Implementation

[0050] The embodiments of this disclosure will be described below. In the embodiments described below, when terms such as number or quantity are mentioned, unless specifically stated otherwise, the scope of this disclosure is not necessarily limited to the stated number or quantity. Each component is not necessarily essential to this disclosure unless specifically stated otherwise. Identical parts and equivalent parts will be marked with the same reference numerals, and repeated descriptions may not be repeated.

[0051] [Resin Molding Manufacturing Apparatus 1000]

[0052] Figure 1 This is a diagram showing the functional blocks of a resin molding manufacturing apparatus 1000. Figure 2 This is a cross-sectional view of the molding section 80 included in the resin molding manufacturing apparatus 1000 in the state before mold closing. Figure 3 This is a cross-sectional view showing the molding section 80 included in the resin molding manufacturing apparatus 1000 in the state after mold closing.

[0053] like Figure 1 As shown, the resin molding manufacturing apparatus 1000 includes a substrate module 101, a pressing module 102, an ejection module 103, and a film module 104. Substrate 90 ( Figure 2 ) is removed from substrate module 101, thin film 60 ( Figure 2 The liquid resin material 13 is removed from the thin film module 104. The ejection module 103 supplies the thermosetting resin material 13 onto the thin film 60. The pressing module 102 uses the liquid resin material 13 supplied to the thin film 60 to resin mold the substrate 90. Figure 3 ).

[0054] In the resin molding manufacturing apparatus 1000, the substrate module 101, pressing module 102, ejection module 103, and film module 104 are described as separate modules. Each module can be detachable from other modules, and the number of modules can be increased or decreased. For example, two or three ejection modules 103 can be arranged between the pressing module 102 and the film module 104.

[0055] The resin molding manufacturing apparatus 1000 also includes a conveying mechanism 91 and a conveying mechanism 92. The conveying mechanism 91 conveys the substrate 90 removed from the substrate module 101 to the molding section 80 of the pressing module 102. Figure 2 The upper mold 81 of the forming mold Figure 2 The molding die includes an upper mold 81 and a lower mold 87. Resin material 13 is supplied to the thin film 60 (the object to be supplied) to form a silicon wafer (substrate 90) on which the chip is mounted. That is, the object to be formed is, for example, a so-called thin wafer-level package.

[0056] The conveying mechanism 92 will convey the thin film 60 of resin material 13 sprayed from the ejection module 103 to the lower mold 87 of the forming mold of the forming part 80 of the pressing module 102. Figure 2 The conveying mechanism 92 also transports the film 60, which is not loaded with resin material 13, from the film module 104 to the ejection module 103.

[0057] [Manufacturing method of resin molded articles]

[0058] Figure 4 This is a flowchart illustrating a method for manufacturing resin molded articles using a resin molding manufacturing apparatus 1000. Figure 5 This is a cross-sectional view of the resin supply device 100 included in the resin molding article manufacturing apparatus 1000. The manufacturing method of the resin molded article will be explained here, and the detailed structure and operation of the resin supply device 100 will be described later.

[0059] Reference Figures 1-5 In the method for manufacturing resin molded articles, firstly, the resin supply device 100 ( Figure 5 The resin material 13 is supplied onto the film 60 (step S101). For example, the conveying mechanism 92 transports the film 60 and the frame-shaped tray cover 54 disposed on the film 60. Figure 5 It is transferred from the thin film module 104 to the ejection module 103.

[0060] Next, the resin supply device 100 of the ejection module 103 supplies resin material 13 onto the film 60 inside the tray cover 54. The details of this operation will be described later. Then, the conveying mechanism 91 transports the substrate 90 from the substrate module 101 to the pressing module 102 and places it on the lower surface of the upper mold 81 of the forming mold of the pressing module 102 (process S102).

[0061] The conveying mechanism 91 places the film 60, on which resin material 13 has been supplied, on the upper surface of the lower mold 87 (step S103). The conveying mechanism 92 transports the film 60, on which resin material 13 has been supplied from the ejection module 103, together with the tray cover 54, to the pressing module 102, and places the film 60 carrying resin material 13 on the upper surface of the lower mold 87 of the forming mold of the pressing module 102. The conveying mechanism 92 does not place the tray cover 54 inside the pressing module 102, but instead transports the tray cover 54 to the film module 104.

[0062] like Figure 2 As shown, in the forming section 80, the block-shaped fixed platform 88 is supported by a tie rod or a support frame. An upper mold 81 is provided on the lower side of the fixed platform 88. A movable platform 86 is disposed on the lower side of the fixed platform 88. A lower mold 87 is provided on the upper side of the movable platform 86.

[0063] The lower mold 87 includes a bottom component 82, side components 83, multiple elastic components 84, and a base plate 85. The lower mold 87 has a downwardly recessed portion. The conveying mechanism 92 places the film 60 on the upper surface of the lower mold 87, such that the resin material 13 on the film 60 is located at the bottom surface of the recess. The conveying mechanism 92, as described above... Figure 2 As shown, the substrate 90 is placed on the lower surface of the upper mold 81.

[0064] By moving the lower mold 87 toward the upper mold 81 in the upward direction, the upper mold 81 and the lower mold 87 are locked together (step S104). For example, a locking mechanism (not shown) moves the movable platform 86 in the upward direction. As a result, the lower mold 87 moves toward the upper mold 81 in the upward direction. As the movable platform 86 moves in the upward direction, the frame-shaped side member 83 first contacts the substrate 90 through the thin film 60.

[0065] Afterwards, the movable platform 86 continues to move upward. With the side member 83 stopped moving upward, the bottom member 82 moves upward, and the multiple elastic members 84 retract. When the upper surface of the side member 83 reaches the predetermined position, the movable platform 86 stops moving upward, and the mold-locking process of step S104 ends.

[0066] After the lower mold 87 stops moving and the mold locking is completed, the temperature of the forming mold is increased (step S105). The resin material 13 is thermosetting. Therefore, as the temperature of the resin material 13 rises, the resin material 13 hardens into cured resin 18 (…). Figure 3 (Step S106). After the resin material 13 has hardened, the lower mold 87 is moved downward by moving the base plate 85 downward. Thus, the mold is opened, and a resin molded article with the lower surface of the substrate 90 sealed by resin is produced (Step S107).

[0067] In the content, for example, Figure 2 and Figure 3 As shown, a pressing module 102 is included, which places the substrate 90 on the upper mold 81 to manufacture a resin molded article. Figure 1 The resin molding article manufacturing apparatus 1000 shown includes an ejection module 103 equipped with the resin supply device 100 of the described embodiment, but may also include, for example, a pressing module 102 for placing a substrate 90 in a lower mold 87 to manufacture a resin molding article. Figure 1 The ejection module 103 of the resin molding manufacturing apparatus 1000 shown may also be equipped with the resin supply device 100 of the embodiment described above.

[0068] [Resin supply device 100]

[0069] Reference Figure 5 The resin supply device 100 supplies liquid resin material 13 to the spraying surface 60s of the object to be supplied, such as the film 60. Specifically, the resin supply device 100 includes, for example, a storage tank 10, a moving mechanism 20, a pressing mechanism 30, an opening and closing mechanism 40, a detection unit 50, a placement stage 52, and a control unit 70.

[0070] (Storage box 10)

[0071] The storage container 10 has a cover 11, a receiving portion 12, and resin material 13. The receiving portion 12 receives the resin material 13, and the cover 11 is disposed on the surface of the resin material 13. The cover 11 seals the resin material 13 to prevent the resin material 13 from leaking out of the receiving portion 12. The receiving portion 12 of the storage container 10 is disposed inside the cylindrical portion 23 of the moving mechanism 20 described later. An ejection portion 12a is provided at the end of the receiving portion 12. The storage container 10 ejects the resin material 13 through the ejection portion 12a.

[0072] (Testing Department 50)

[0073] A mounting platform 52 is disposed on the lower side of the ejection section 12a, on which a film 60 conveyed from the film module 104 is placed. A frame-shaped tray cover 54 is disposed on the film 60. The upper surface of the film 60 is a spray surface 60s to which resin material 13 is supplied, and the resin material 13 is supplied to the inside of the tray cover 54 on the spray surface 60s. A detection unit 50 is connected to the mounting platform 52 for detecting the weight of the resin material 13 extruded from the ejection section 12a and supplied to the film 60.

[0074] (Mobile Agency 20)

[0075] The moving mechanism 20 has a peripheral wall 21, locking members 22, and a cylindrical portion 23, and holds the storage box 10. Multiple locking members 22 are provided on the inner periphery of the peripheral wall 21, and the cylindrical portion 23 is locked into the multiple locking members 22. The storage box 10 is detachably disposed inside the cylindrical portion 23.

[0076] The moving mechanism 20 supports the position of the ejector 12a in a variable manner via a drive system (not shown), for example, it can be... Figure 5 The left and right directions and the up and down directions within the paper, as well as the vertical directions. Figure 5 The ejector portion 12a is moved in the direction of the paper surface. By moving the ejector portion 12a relative to the spray surface 60s of the film 60, the ejector portion 12a can be scanned on the spray surface 60s.

[0077] (Pressing mechanism 30)

[0078] The pressing mechanism 30 includes a servo motor 31 and a pressing part 32. The pressing part 32 is inserted into the receiving part 12 of the storage tank 10 and is configured to contact the cover 11. By moving the pressing part 32, the pressing part 32 presses the resin material 13 through the cover 11, causing the resin material 13 to be extruded from the ejection part 12a of the storage tank 10.

[0079] (Opening and closing mechanism 40)

[0080] The opening and closing mechanism 40 has a drive unit 41 and a pair of clamps 42 and 43. The clamps 42 and 43 are configured to open and close the ejection part 12a. The clamps 42 and 43 are configured to be able to form an open state and a closed state, and these states can be switched by driving the drive unit 41.

[0081] The ejector section 12a, for example, has a flexible raw material tubular structure that allows resin material 13 to pass through it. By pressing the tubular structure with clamps 42 and 43, the state in which the resin material 13 can pass through the tubular structure (open state) can be switched to a state in which it cannot pass through (closed state). The opening and closing mechanism 40 allows the resin material 13 extruded from the ejector section 12a to reach the film 60 when the clamps 42 and 43 are open, and prevents the resin material 13 extruded from the ejector section 12a from reaching the film 60 when the clamps 42 and 43 are closed.

[0082] The control unit 70 is connected to the moving mechanism 20, the pressing mechanism 30 (servo motor 31), the opening and closing mechanism 40 (drive unit 41), and the detection unit 50, etc. It can control the operation state of the mechanism by sending instruction signals to these devices. In addition, it can also perform sensing and servo control by receiving signals from these devices.

[0083] Figure 6 This is a perspective view showing the supply of resin material 13 from the ejector section 12a of the resin supply device 100 onto the spray surface 60s. The moving mechanism 20, for example, causes the ejector section 12a to scan the spray surface 60s along a spiral trajectory. Figure 6 The image shows the ejector section 12a scanning outwards from the center side of the spiral.

[0084] Figure 7 This is a plan view showing the shape of the resin material 13 formed when the ejector 12a operates along the spiral trajectory TR on the spray surface 60s. The trajectory TR is formed to extend spirally around the center point A0 with a predetermined spiral pitch. Details will be explained later, but in the inner region of the spiral trajectory TR (the range from the ejection start point A1 to the mode switching point A2), the trajectory TR extends spirally with a spiral pitch P1, while in the outer region of the spiral trajectory TR (the range from the mode switching point A2 to the supply end point A3), the trajectory TR extends spirally with a spiral pitch P2.

[0085] As described above, by pressing part 32 ( Figure 5 The resin material 13 moves within the containment section 12 and is expelled from the ejection section 12a. The resin material 13 lands on the spray surface at the ejection start point A1 within 60 seconds. Figure 7 In other words, the control unit 70 controls the moving mechanism 20 and the pressing mechanism 30, etc., so that the resin material 13 ejected from the ejection unit 12a lands at the ejection start point A1.

[0086] Here, the control unit 70 is configured to control the moving mechanism 20 in a first mode and a second mode. In the first mode, after the resin material 13 lands at the spraying start point A1, the spraying part 12a moves relative to the spraying surface 60s at a first speed V1. In the second mode, the spraying part 12a moves relative to the spraying surface 60s at a second speed V2, which is faster than the first speed V1.

[0087] Figure 7 In the example shown, a spiral trajectory TR is formed by the resin material 13. The spiral trajectory TR starts at the ejection start point A1, extends to the mode switching point A2 while drawing a spiral shape, and then further extends to the supply endpoint A3. In other words, the control unit 70 controls the movement mechanism 20 and the pressing mechanism 30, etc., to cause the resin material 13 to draw a spiral shape from the ejection start point A1 to the mode switching point A2 from the ejection part 12a. Figure 7 The spiral shape shown is further drawn from the mode switching point A2 to the supply endpoint A3 as follows. Figure 7 The spiral shape shown.

[0088] After the resin material 13 lands at the spray start point A1, the control unit 70 drives the moving mechanism 20 in a first mode until the resin material 13 sprayed from the spraying part 12a reaches the mode switching point A2 from the spray start point A1. In the first mode, the spraying part 12a moves relative to the spray surface 60s at a first speed V1. The first speed V1 is, for example, a value calculated as the tangential velocity of a spiral trajectory TR.

[0089] The control unit 70 further drives the moving mechanism 20 in a second mode until the resin material 13 ejected from the ejector 12a reaches the supply endpoint A3 from the mode switching point A2. In the second mode, the ejector 12a moves relative to the spray surface 60s at a second speed V2, which is faster than the first speed V1. The second speed V2 is, for example, a value calculated as the tangential speed of the spiral trajectory TR.

[0090] Here, the straight-line distance between the control unit 70 and the ejector 12a at a predetermined reference position (here, the center point A0 of the spiral trajectory TR) exceeds a predetermined value L1. Figure 7 At a specific time point, the system switches from the first mode to the second mode. The mode switching point A2 is set at such a position. Not limited to this structure, the control unit 70 can also switch from the first mode to the second mode at a time point after a predetermined time has elapsed since the pressing unit 32 starts moving to expel the resin material 13 from the ejection unit 12a.

[0091] (Example)

[0092] Various parameters applicable to the described embodiment are illustrated below, for example. The silicon wafer package to be formed has a diameter of 290 mm and a thickness of 0.05 mm.

[0093] The nozzle of the ejection section 12a is 4 mm. The amount of resin material 13 capable of forming a spiral trajectory TR is 6 g to 10 g. As a liquid resin material 13, a high-viscosity material (a material with a coefficient of linear expansion close to that of a silicon wafer) can be used, for example. High viscosity means, for example, a material with a viscosity exceeding 500 Pa·s (Pascal-seconds). The weight of resin material 13 ejected from the ejection section 12a per unit time (ejection velocity) is 0.1 g / second. The ejection velocity can be set to a fixed value from the start to the end of ejection. The time required to form the spiral trajectory TR (resin amount / ejection velocity) is 100 seconds.

[0094] The time from the moment the pressing part 32 begins to move to expel the resin material 13 from the ejector part 12a to the moment the ejector part 12a begins to move in the first mode (first speed V1) (T0) is 10 seconds. The execution time of the first mode, that is, the time from the moment the ejector part 12a begins to move in the first mode (first speed V1) to the moment it switches to the second mode (second speed V2), is 57.5 seconds. The time from the moment the ejector part 12a begins to move in the second mode (second speed V2) to the moment the ejector part 12a reaches the supply endpoint A3 is 32.5 seconds.

[0095] The distance between the center point A0 of the spiral trajectory TR and the ejection start point A1 is 10 mm. Alternatively, the spiral trajectory TR can be represented by, for example, an Archimedean spiral. The distance (specified value L1) between the center point A0 and the mode switching point A2 is 30 mm (diameter equivalent to 60 mm). The distance L2 between the center point A0 and the supply endpoint A3 is 130 mm (diameter equivalent to 260 mm).

[0096] Furthermore, the first speed V1 is 4.3 mm / s, and the second speed V2 is 309.5 mm / s. The helical pitch P1 is 10 mm, and the helical pitch P2 is 5 mm. That is, the helical pitch P1 when the control unit 70 controls the moving mechanism 20 in the first mode is larger than the helical pitch P2 when the control unit 70 controls the moving mechanism 20 in the second mode. The larger helical pitch results in a smaller resin supply per unit area. The faster movement speed of the ejector section 12a results in a smaller resin supply per unit area.

[0097] For example, if the amount of resin is small, the length of resin that can be sprayed will be shorter. Furthermore, if the nozzle diameter of the spray section 12a is large, the length of resin that can be sprayed will also be shorter. When the length of the sprayable resin is shorter than the spiral length, spraying will end midway through drawing the spiral, making it difficult to supply resin to the outer edge of the desired area. If the resin distribution is uneven in the center and outer edges of the resin supply area, the margin for encapsulation thickness and flatness will be reduced, potentially leading to wire flow due to resin flow, or product defects such as appearance defects (flow marks) or component segregation. Therefore, various parameters are optimized to ensure that the resin material 13 is evenly distributed on the spray surface within 60 seconds. For example, when the spray section 12a moves at high speed, it is best to reduce the spiral pitch.

[0098] (Resin supply method)

[0099] Figure 8 This is a flowchart illustrating a resin supply method using the resin supply device 100. Resin supply device 100 ( Figure 5 First, read the setting values ​​from a pre-prepared reference table, etc. Figure 8 Process t101).

[0100] For example, the various parameters will differ when using a resin material 13 with a first viscosity versus a second viscosity with a higher viscosity. Alternatively, the various parameters may differ not only from the type of resin material 13, but also from the nozzle diameter of the spray section 12a, the distance between the spray section 12a and the spray surface 60s, and the area of ​​the spray surface 60s. These various parameters have been optimized based on past resin supply practices and are stored in a reference table.

[0101] For example, when a resin material 13 having a first viscosity is supplied to the spray surface 60s, the time from when the resin material 13 lands at the spray start point A1 to when switching from the first mode to the second mode is defined as the first time interval. When a resin material 13 having a second viscosity, which is higher than the first viscosity, is supplied to the spray surface 60s, the time from when the resin material 13 lands at the spray start point A1 to when switching from the first mode to the second mode is defined as the second time interval. In this case, various parameters can be set so that the second time interval is shorter than the first time interval. In the case of the embodiment described above, the first time interval (the length of time the first mode is implemented) is 57.5 seconds, and the second time interval (the length of time the second mode is implemented) is 32.5 seconds.

[0102] After the necessary settings are read, the pressing part 32 begins to move. Figure 8(Process t102). As the amount of movement of the pressing part 32 increases, the resin material 13 is extruded from the ejection part 12a. Before the resin material 13 reaches the spraying surface 60s of the film 60, it is detected by the detection part 50 ( Figure 5 The detected value will not change.

[0103] The resin material 13 can be determined from the detection results (increase in detected weight) of, for example, the detection unit 50, that it has landed on the spraying surface 60s (spraying start point A1) of the film 60. Figure 8 (Process t103). Alternatively, the resin material 13 may be considered to have landed on the spraying surface 60s of the film 60 after a predetermined time has elapsed since the pressing part 32 begins to move and extrudes the resin material 13 from the ejection part 12a. In addition, optical or other methods may be used to detect whether the resin material 13 has landed on the spraying surface 60s of the film 60.

[0104] Subsequently, the ejector section 12a is driven in a first mode of operation, and the ejector section 12a begins to move at a first speed V1. Figure 8 (Process t104). Starting from the ejection start point A1, a spiral trajectory TR is drawn using resin material 13.

[0105] The straight-line distance between the pre-defined reference position (in this case, the center point A0 of the spiral trajectory TR) and the ejector 12a exceeds the specified radius. Figure 7 The specified value L1) indicates the time point at which the switch from the first mode to the second mode occurs. Figure 8 The switching can be based on, for example, a value output from an encoder. Thus, the ejector 12a is driven to operate in a second mode, and the ejector 12a begins to move at a second speed V2. Figure 8 Process t106).

[0106] At the time point when the ejector section 12a reaches the outermost edge of the spiral trajectory TR (supply endpoint A3) ( Figure 8 If step t107 is "YES", the movement of the pressing part 32 is stopped (step t108). Even after the pressing part 32 stops moving, the resin material 13 continues to be ejected from the ejection part 12a in the form of droplets, so a predetermined dehydration operation is performed (step t109). During the dehydration operation, for example, the ejection part 12a is moved up and down to stop the further falling of droplets. If necessary, the weight is detected by the detection part 50, etc., and a correction operation is performed for any insufficient weight (step t110). Through the above, the resin supply is completed. If necessary, the next resin supply is performed to another film 60.

[0107] (Functions and Effects)

[0108] As mentioned earlier, immediately after the resin material 13 lands on the spray surface 60s, it is not yet sufficiently fixed to the spray surface 60s. If the spraying part 12a begins to move in this state, the resin material 13 may be dragged along with the spraying part 12a, causing the resin material 13 to deviate from its initial landing position on the spray surface 60s (spraying start point A1). In this case, it will be difficult to supply the resin material 13 evenly to the spray surface 60s.

[0109] As a countermeasure to prevent the resin material 13 from shifting, it is possible to reduce the moving speed of the spray section 12a. However, if the spray section 12a moves at a low speed while continuously supplying the resin material 13, it may take a long time to supply the resin material 13 to a wide range of the spray surface 60s. Alternatively, before the resin material 13 is supplied to the entire specified range, the resin material 13 (in the storage cassette provided in the receiving section 12) may be insufficient, which may result in the resin material 13 not being supplied evenly to the spray surface 60s.

[0110] In contrast, in this embodiment, after the resin material 13 lands at the spray start point A1, the control unit 70 drives the moving mechanism 20 in a first mode until the resin material 13 sprayed from the spray section 12a moves from the spray start point A1 to the mode switching point A2. In the first mode, the spray section 12a moves relative to the spray surface 60s at a first speed V1.

[0111] Then, the straight-line distance between the control unit 70 and the ejection unit 12a at a predetermined reference position (here, the center point A0 of the spiral trajectory TR) exceeds a predetermined value L1. Figure 7 At the specified time point, the switch from the first mode to the second mode is performed. The resin material 13 ejected from the ejector 12a moves in the second mode from the mode switching point A2 to the supply endpoint A3. In the second mode, the ejector 12a moves relative to the spray surface at a second speed V2, which is faster than the first speed V1.

[0112] In other words, by moving the spraying section 12a at a low speed immediately after spraying, the resin material 13 is fully fixed on the spray surface 60s, and then the spraying section 12a is moved at a high speed after fixing. In this way, the resin material 13 can be supplied to the spray surface 60s as evenly as possible in the shortest possible supply time. Not only in the first and second modes, the control unit 70 can also be configured to control the movement mechanism 20 in a third mode, in which the spraying section 12a moves relative to the spray surface 60s at a third speed different from the second speed V2. Resin supply can also be performed in three or more modes.

[0113] The embodiments of this disclosure have been described above, but it should be considered that the embodiments disclosed herein are illustrative and not restrictive in all respects. The scope of this disclosure is indicated by the claims, and is intended to include all modifications within the scope and meaning of the claims and their equivalents.

[0114] Explanation of icon numbers

[0115] 10 Storage box, 11 Cover, 12, 71 Receiving part, 12a, 72a Ejection part, 13, 73 Resin material, 18 Curing resin, 20 Moving mechanism, 21 Peripheral wall, 22 Locking member, 23 Cylindrical part, 30 Pressing mechanism, 31 Servo motor, 32 Pressing part, 40 Opening and closing mechanism, 41 Drive unit, 42, 43 Clamp, 50 Detection unit, 52 Placement stage, 54 Tray cover, 60 Film, 60s, 75 Spraying surface, 70 Control unit, 80 Forming part, 81 Upper mold, 82 Bottom component, 83 Side component, 84 Elastic component, 85 Base plate, 86 Movable platform, 87 Lower mold, 88 Fixed platform, 90 Base plate, 91, 92 Conveying mechanism, 100 Resin supply device, 101 Substrate module, 102 pressing module, 103 ejection module, 104 thin film module, 1000 manufacturing apparatus for resin molded articles, A0 center point, A1 ejection start point, A2 mode switching point, A3 supply end point, AA contact area, AR arrow, L1 specified value, L2 distance, P1, P2 helical pitch, TR trajectory, V1 first velocity, V2 second velocity

Claims

1. A resin supply device for supplying resin material to a sprayed surface of an object, the resin supply device comprising: A receiving section for receiving the resin material, and having an ejection section for ejecting the resin material; The pressing mechanism has a pressing part that is inserted into the receiving part; The moving mechanism, by moving the spraying part relative to the spraying surface, causes the spraying part to scan the spraying surface; and The control unit controls the moving mechanism. The pressing part moves within the receiving part, causing the resin material within the receiving part to be expelled from the spraying part, so that the resin material lands at the spraying start point within the spraying surface. The control unit is configured to control the moving mechanism in a first mode and a second mode. In the first mode, after the resin material lands at the spray initiation point, the spraying portion moves relative to the spray surface at a first velocity. In the second mode, the spraying part moves relative to the spraying surface at a second speed that is faster than the first speed. The control unit switches from the first mode to the second mode at the following times: The time point at which the straight-line distance between the pre-defined reference position and the ejector exceeds a predetermined value. or, A predetermined time has elapsed since the point at which the pressing part begins to move to expel the resin material from the ejection part.

2. The resin supply device according to claim 1, wherein, When the resin material having a first viscosity is supplied to the spray surface, the time from when the resin material lands at the spray initiation point to when the switch from the first mode to the second mode is performed is defined as the first time interval. When the resin material having a second viscosity, which is higher than the first viscosity, is supplied to the spray surface, the time from when the resin material lands at the spray initiation point to when the switch from the first mode to the second mode is performed is defined as the second time interval. The second time interval is shorter than the first time interval.

3. The resin supply device according to claim 1 or 2, wherein, The moving mechanism causes the spray nozzle to scan the spray surface along a spiral trajectory.

4. The resin supply device according to claim 3, wherein, The control unit switches from the first mode to the second mode at the time point when the straight-line distance between the pre-defined reference position and the ejection part exceeds a predetermined value. The predefined reference position is the center point of the spiral trajectory.

5. The resin supply device according to claim 3 or 4, wherein, The pitch of the helical mechanism controlled by the control unit in the first mode is larger than the pitch of the helical mechanism controlled by the control unit in the second mode.

6. The resin supply device according to claim 5, wherein, The control unit is configured to control the moving mechanism in a third mode, in which the spraying part moves relative to the spraying surface at a third speed different from the second speed.

7. An apparatus for manufacturing resin molded articles, comprising a resin supply device as described in any one of claims 1 to 6.

8. The apparatus for manufacturing resin molded articles according to claim 7, comprising: A molding die for resin molding a silicon wafer carrying a chip using the resin material supplied to the object to be supplied.

9. A method for manufacturing a resin molded article, using the resin molded article manufacturing apparatus as described in claim 7 or 8, the method comprising: The process of the resin supply device supplying the resin material to the object to be supplied; as well as The process of using the resin material to perform resin molding on the supplied object.

10. A resin supply method, wherein resin material is supplied to a spraying surface of an object to be supplied, the resin supply method comprising: The pressing part moves within the receiving part, causing the resin material extruded from the ejection part to land at the ejection start point within the spraying surface; In the first mode, after the resin material lands at the spraying start point, the spraying part moves relative to the spraying surface at a first speed while supplying the resin material to the spraying surface. as well as In the second mode, the spraying section moves relative to the spraying surface at a second speed that is faster than the first speed while supplying the resin material to the spraying surface. The switch from the first mode to the second mode will be performed at the following time points: The time point at which the straight-line distance between the pre-defined reference position and the ejector exceeds a predetermined value. or, A predetermined time has elapsed since the point at which the pressing part begins to move to expel the resin material from the ejection part.

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