Bga test socket

Abstract

An exemplary embodiment of the present application discloses a BGA test socket for implementing impedance matching, which includes contact pieces including ground pins and signal pins, and a socket body for inserting and elastically supporting the contact pieces and formed with a plurality of holes, the socket body including first holes for inserting the ground pins, second holes for inserting the signal pins, and a through hole corresponding to a pin pattern of the test socket and formed between a plurality of the contact pieces, a first shielding plating layer being formed on an inner surface of the through hole by a conductive member, and a second shielding plating layer for connecting the first shielding plating layer being formed on upper and lower surfaces of the socket body by a conductive member.

Description

Technical Field

[0001] This invention relates to a test socket for testing semiconductor devices. Background Technology

[0002] Semiconductor devices are densely integrated with microcircuits, and undergo testing processes during manufacturing to ensure the proper functioning of each circuit. The testing process uses an inspection device to apply test signals to the terminals of the semiconductor device under test (DUT). However, the inspection device is not directly connected to the terminals of the DUT; instead, it is connected via a test socket. The test socket consists of probes that connect the various terminals of the semiconductor device to the terminals of the test PCB of the inspection device, and sockets that support the probes.

[0003] The probes and sockets that make up the test socket vary greatly depending on the operating frequency of the semiconductor device, the terminal type (BGA, LGA, etc.), and the spacing between the terminals.

[0004] Figure 1 A cross-sectional view of a semiconductor device test socket device according to the prior art is provided. The socket device includes multiple probes 1 and socket bodies 2 and 3 supporting the multiple probes 1.

[0005] The socket bodies 2 and 3 are used to electrically insulate multiple probes 1. They consist of an upper body 2 supporting the upper end of the probes 1 and a lower body 3 supporting the lower end of the probes 1. The probes 1 are supported at the upper and lower ends of the socket bodies 2 and 3, and are elastic in the longitudinal direction (vertical direction) to electrically connect the terminals of the semiconductor devices mounted on the upper part of the socket assembly to the terminals (pads) of the test PCB mounted on the lower part.

[0006] On the other hand, with the development of semiconductor devices, the speed is constantly increasing and the terminal spacing is constantly decreasing. Crosstalk between probes will become a problem. Therefore, noise shielding between probes has become a very important factor.

[0007] To address these issues, various technologies have been developed for test socket devices. For example, coaxial probes are used where the inner surface of the holes accommodating the probes is electroplated within the socket body of an insulator, or the socket body is made of metal to shield noise between the probes.

[0008] However, due to the miniaturization and high speed of semiconductor devices, the rapid increase in terminals, and the fine spacing between terminals, these existing socket devices face many difficulties in noise shielding between probes, and also have complex and difficult manufacturing processes. Summary of the Invention Technical problems to be solved

[0009] Therefore, in order to solve the above problems, the present invention aims to provide a BGA test socket for achieving impedance matching.

[0010] One of the technical problems to be solved by the present invention is to provide a test socket for achieving impedance matching, which transmits maximum power and prevents signal distortion when testing a device optimized for a specific impedance according to customer needs.

[0011] One of the technical problems to be solved by the present invention is to provide a test socket whose corresponding pinmap has improved noise shielding effect between fine pitches.

[0012] One of the technical problems to be solved by the present invention is to provide a test socket, which, in order to improve the economy in manufacturing the test socket, uses contact elements with the same shape but different physical resistance values ​​by means of diameter difference. Technical solution

[0013] Various embodiments of the present invention disclose a BGA test socket for achieving impedance matching, comprising: a contact including a ground pin and a signal pin; and a socket body for inserting and elastically supporting the contact, and having a plurality of holes, the plurality of holes including: a first hole for inserting the ground pin; a second hole for inserting the signal pin; and a through hole corresponding to the pin diagram of the test socket, formed between the plurality of contacts, wherein a first shielding plating layer is formed on the inner surface of the through hole through a conductive component, and a second shielding plating layer for connecting the first shielding plating layer is formed on the upper and lower surfaces of the socket body through conductive components.

[0014] The second shielding coating may be formed around the second hole on the upper and lower surfaces of the socket body.

[0015] The grounding pin and the signal pin can be formed to have the same shape.

[0016] The maximum diameter of the grounding pin and the signal pin may be different.

[0017] The grounding pin and the signal pin can be formed in different shapes.

[0018] It may also include a float plate disposed on one side of the socket body and having a third hole for receiving a contact end of the contact member that contacts the terminals of the BGA.

[0019] The float plate may include a fourth hole formed at a position corresponding to the through hole.

[0020] The inner surface of the fourth hole can be coated with a third shielding layer through a conductive component.

[0021] The contact may include: a pair of contact pins; and a spring, connected between the pair of contact pins, and providing elasticity.

[0022] The pair of styluses may have different shapes and are connected in intersecting directions.

[0023] Each feature of the above embodiments may be implemented in combination with other embodiments without contradicting or excluding them. Beneficial effects

[0024] According to various embodiments of the present invention, by forming a shielding plating layer between the via holes surrounding the signal pins, the signal is grounded separately, thereby improving impedance matching and the transmission of high-frequency signals.

[0025] Furthermore, by using shielding material surrounding the contact area on the pin diagram, the noise shielding effect between fine pitches can be improved.

[0026] Furthermore, since the signal pins and ground pins use the same shape but with different diameters, it facilitates the manufacture of test sockets.

[0027] Furthermore, in a test socket device for testing semiconductor devices, a plurality of ground probes and a plurality of signal probes are included. The device includes: an insulating socket body having ground holes and signal holes formed therein; a conductive grounding plating layer formed on the surface of the ground holes; and a conductive shielding element penetrating the upper and lower surfaces of the socket body for shielding noise between adjacent signal probes. Thus, the noise shielding effect between signal probes is excellent and easy to manufacture.

[0028] The effects of the present invention are not limited to those described above, and those skilled in the art will clearly recognize other effects not mentioned from the following description. Attached Figure Description

[0029] Figure 1 This is a cross-sectional view of a semiconductor device test socket device according to the prior art.

[0030] Figure 2 This is a schematic diagram of the pinout of a test socket according to an exemplary embodiment of the present invention.

[0031] Figure 3 for Figure 2 AA cross-section view.

[0032] Figure 4 for Figure 2 BB cross-section.

[0033] Figure 5 and Figure 6 This is a schematic diagram of a contact element according to an exemplary embodiment of the present invention.

[0034] Figure 7 This is a cross-sectional view of a test socket according to another embodiment of the present invention. Detailed Implementation

[0035] Specific embodiments of the present invention will now be described with reference to the accompanying drawings. The detailed description provided below will help to fully understand the methods, apparatus, and / or systems described herein. However, these are merely examples, and the present invention is not limited thereto.

[0036] In describing embodiments of the present invention, detailed descriptions of well-known technologies related to the present invention will be omitted if it is determined that such detailed descriptions may unnecessarily obscure the essence of the invention. Furthermore, the terminology used herein is defined in consideration of the functionality of the invention and may be changed according to the intent or convention of the user or operator. Therefore, definitions should be based on the entire contents of this specification.

[0037] The terminology used in this detailed description is for illustrative purposes only and should not be construed as limiting. Unless otherwise expressly stated, the singular form includes the meaning of the plural form.

[0038] In this specification, expressions such as “comprising” or “possessing” are intended to indicate certain features, figures, steps, operations, elements, or parts or combinations thereof, and should not be construed as excluding the presence or possibility of one or more other features, figures, steps, operations, elements, or parts or combinations thereof other than those described.

[0039] Furthermore, when describing the components of embodiments of the present invention, terms such as first, second, A, B, (a), (b) may be used. These terms are used only to distinguish the components from other components, and the nature, order, or sequence of the components are not limited by these terms.

[0040] Figure 2 This is a schematic diagram of the pinout of a test socket according to an exemplary embodiment of the present invention. Figure 3 for Figure 2 Sectional view of AA in the middle. Figure 4 for Figure 2 Cross-sectional view of BB in the middle.

[0041] Figure 3 The AA cross-section in the figure represents the section containing ground pin 15, via 13h, signal pin 11, via 13h, and ground pin 15, starting from the left side. Figure 4The BB cross-section is a diagram showing the cross-section of the part containing signal pin 11, ground pin 15, and signal pin 11 from the left side of the diagram.

[0042] Right now, Figure 3 The AA section represents the section with the through hole 13h. Figure 4 The BB section represents the section without the through hole 13h.

[0043] The following will refer to Figures 2 to 4 This describes a test socket according to an embodiment of the present invention.

[0044] Test socket 10 can generate various pin maps according to the device under test (IC chip or module, etc.). Figure 2 This is one example of various pin diagrams that can be applied to the test socket in this embodiment.

[0045] In a test socket, a pin diagram provides pin layout information for a specific device or chip and defines the function performed by each pin and what electrical connections are made, thus showing the information needed to properly contact each pin and transmit signals during the test.

[0046] Pin diagrams are particularly important for Ball Grid Array (BGA) or other complex packages because the pins in a BGA package are arranged in a grid of small balls, making them difficult to approach directly. Therefore, pin diagrams can ensure that test sockets are correctly connected to each pin in the package.

[0047] That is, as mentioned above, the pin diagram may vary depending on the design of the test socket and the pin layout of a particular device or chip, and an accurate pin diagram is required when performing test work so that the correct pins can be accessed to send and receive test signals.

[0048] In addition, a shielding plating layer can be formed on the test socket of this embodiment to improve the insulation between fine pitches when testing high-frequency or high-speed signal semiconductor devices.

[0049] More specifically, the test socket includes: contacts, including a ground pin 15 and a signal pin 11; and socket bodies 110 and 120, which are inserted into and elastically support the contacts and have multiple holes.

[0050] The socket body includes an upper plate 120 and a lower plate 110, and the plurality of holes are formed by passing through the upper plate 120 and the lower plate 110.

[0051] The plurality of holes may include: a first hole 15h for inserting a ground pin 15; a second hole 11h for inserting a signal pin 11; and a via hole 13h, corresponding to the pin diagram of the test socket formed between the contacts 11 and 15.

[0052] The first hole 15h and the second hole 11h are formed in the upper plate 120 and the lower plate 110 in the form of step holes, so that the ground pin 15 and the signal pin 11 can be inserted respectively, and can be formed through the socket body by connecting the upper plate 120 and the lower plate 110.

[0053] If we describe the stepped hole in more detail with reference to the grounding pin 15, we can form the stepped hole by forming a hole with a diameter d2 corresponding to the maximum diameter of the grounding pin 15 and a hole with a diameter d1 corresponding to the contact portion of the grounding pin in sequence.

[0054] A via 13h can be formed between contacts 11 and 15. That is, according to the reference lines such as the horizontal or vertical axis of the pin diagram, the via 13h can be located between ground pin 15 and ground pin 15, or between ground pin 15 and signal pin 11, or between signal pin 11 and signal pin 11.

[0055] Preferably, the via 13h can be formed around the signal pin 11. In this embodiment, the via 13h can be formed on the top, bottom, left and right sides of the signal pin 11.

[0056] Furthermore, the first shielding plating layer 131 formed on the inner surface of the through hole 13h can prevent crosstalk between fine pitches. More specifically, the first shielding plating layer 131 can be formed on the inner surface of the through hole 13h by means of conductive components, and a second shielding plating layer 133 connecting the first shielding plating layer 131 can be formed on the upper and lower surfaces of the socket bodies 110 and 120 by means of conductive components.

[0057] In this structure, the second shielding plating layer 133 can be grounded separately by connecting the through-hole 13h formed around the signal pin 11 on the pin diagram (upper and lower surfaces of the socket body), thereby improving impedance matching and high-frequency signal transmission.

[0058] Furthermore, for example, the first shielding plating layer 131 and the second shielding plating layer 133 can be conductive components such as gold, copper, or nickel, but are not limited to these. Of course, the first shielding plating layer 131 and the second shielding plating layer 133 can also be made of different materials.

[0059] On the other hand, the ground pin 15 and the signal pin 11 can have different resistance values. More specifically, the resistance value of the ground pin 15 can be higher than that of the signal pin 11, thereby ensuring the accuracy of the signal during testing of the test socket.

[0060] In this embodiment, the difference in resistance value is formed by the physical difference between the ground pin 15 and the signal pin 11, which makes it easier to design accurately and optimize the resistance value when testing high-frequency or high-speed signals.

[0061] More specifically, the ground pin 15 and the signal pin 11 may have the same shape, but their maximum diameters may be different. That is, in this embodiment, the difference in resistance between the ground pin 15 and the signal pin 11 is not formed by the difference in shape, but by the difference in diameter (size).

[0062] For example, ground pin 15 and signal pin 11 can be formed with the same shape and height, but different maximum diameters. The maximum diameter of ground pin 15 can be formed smaller than the maximum diameter of signal pin 11. In this way, the pin of signal pin 11 is formed to be thicker than that of ground pin 15, thereby improving current flow and forming lower resistance.

[0063] As described above, by making the maximum diameter of the ground pin 15 smaller than the maximum diameter of the signal pin 11, the resistance value of the ground pin 15 can be made higher than the resistance value of the signal pin 11.

[0064] Of course, the resistance difference between ground pin 15 and signal pin 11 is not limited to the above situation. The resistance difference can be formed by making the ground pin 15 and signal pin 11 have different shapes.

[0065] On the other hand, the test socket of this embodiment may also include a floating plate 130, which is disposed on one side of the socket body. A third hole is formed in the floating plate, which is used to accommodate the contact end of the contact member 11, 15 that contacts the BGA terminal (Ball).

[0066] Since BGA packages have multiple grid-like contacts composed of small balls, which are not easy to contact, the test socket in this embodiment can improve IC semiconductor testing and connectivity through the floating plate 130.

[0067] More specifically, the float plate 130 is connected to the upper plate 120 via a flexible connection structure to ensure stable contact with each ball of the BGA package. Therefore, in this configuration, the connection remains stable even if the package moves or is subjected to pressure.

[0068] The third hole has a predetermined diameter d3 to accommodate the ball of the BGA package, and can be formed with a diameter d1 corresponding to the contact end in the contact element that contacts the ball and a stepped hole.

[0069] Figure 5 and Figure 6 This is a schematic diagram of a contact element according to an exemplary embodiment of the present invention.

[0070] The contact in this embodiment includes a signal pin 11 and a ground pin 15. As described above, exemplarily, the signal pin 11 and the ground pin 15 have the same shape and structure, only differing in diameter. Therefore, with Figure 5 and Figure 6 The signal pin 11 shown is a reference to illustrate the contact in this embodiment.

[0071] The signal pin 11 includes a first contact pin 11a, a second contact pin 12a, and a spring 113, which is a spring pin that is elastic in the pressing direction by means of the spring 113.

[0072] The first contact pin 11a and the second contact pin 12a can be assembled relative to the spring 113 in mutually intersecting directions, so that they are elastically supported by the spring 113.

[0073] Spring 113 may be a helical compression spring having a predetermined thickness through its outer and inner diameters and a predetermined length along the length direction of signal pin 11, and may be located between the first contact pin 11a and the second contact pin 12a in signal pin 11. When the first contact pin 11a and the second contact pin 12a are compressed in the length direction, a restoring force can be provided to restore each contact pin 11a, 12a to its position before compression, with reference to spring 113.

[0074] The first stylus 11a may include a contact portion 111, a main body portion 113, and a leg portion 115.

[0075] The contact portion 111 is formed at one end of the main body portion 113. When the semiconductor device IC is tested through the test socket, it can contact the circuit pattern of the inspection printed circuit board installed in the inspection device, or contact one of the contact balls or pads of the BGA or LGA type semiconductor IC.

[0076] The contact portion 111 in this embodiment can be crown-shaped, formed by rolling a plate-shaped strip with multiple pointed portions 1111. Exemplarily, the contact portion 111 can be stamped to form a strip shape with multiple pointed portions 1111 before being rolled. This shape improves the contact capability with BGA terminals.

[0077] The main body 113 may include: a guide groove S1 formed along the length direction of the main body 113; and shoulders 1131 protruding from both sides of the main body 113.

[0078] The shoulder 1131 together with the shoulder 1231 of the second contact pin 12a enables the spring 113 to be elastically supported and connected between the first contact pin 11a and the second contact pin 12a.

[0079] Alternatively, the signal pin 11 can be supported in a stepped hole formed on the upper plate 120 via the shoulder 1131, or it can be supported in a stepped hole formed on the lower plate 110 via the shoulder 1231.

[0080] When the guide groove S1 is assembled in the direction where the first contact pin 11a and the second contact pin 12a intersect, it guides the leg 125 of the second contact pin 12a, thereby improving the assemblability of the second contact pin 12a and improving the electrical contact capability.

[0081] More specifically, the legs of the second stylus 12a form a predetermined space S2 at a predetermined distance from the main body 123, and extend to form a symmetrical pair. Each stylus can be interconnected through the predetermined space S2 formed by its legs.

[0082] On the other hand, a tip 1251 is formed at one end of the leg 125, a contact surface 1252 is formed from the tip 1251 toward the direction in which the pair of legs face each other, and a locking protrusion 1253 may be formed in a stepped manner on the leg from the contact surface 1252 toward the outside.

[0083] This structure allows the contact surface 1252 to move along the guide groove S1 while in contact with the bottom surface of the guide groove S1 when the first contact pin 11a and the second contact pin 12a are assembled in the intersecting direction. This improves the assemblability of the first contact pin 11a and the second contact pin 12a, thereby improving the electrical contact capability.

[0084] In addition, a slot 1133 is formed in the guide groove S1. When the signal pin 11 is stretched to its maximum by the spring, the locking protrusion 1253 is locked in the slot 1133, thereby preventing the signal pin 11 from separating.

[0085] Furthermore, a groove 1135 is formed at the part where the main body 113 connects to the leg 115, so that when the second contact pin 12a and the first contact pin 11a are connected at an intersection, the connection can be made more easily by contacting the contact surface 1252.

[0086] On the other hand, the structure of the leg 115 of the first stylus 11a is the same as the structure of the leg 125 of the second stylus 12a described above.

[0087] The contact portion 121 of the second stylus 12a can be formed in a shape that gradually narrows as it approaches the contact end 1211.

[0088] The guide groove S2 can be formed to extend from the slot 1233 along the length of the main body 123 and pass through the contact end 1211. In this structure, when the first contact pin 11a and the second contact pin 12a are assembled in the intersecting direction, the first contact pin 11a moves along the guide groove S2 while the contact surface 1152 of the first contact pin 11a is in contact with the bottom surface of the guide groove S2 of the second contact pin 12a. When the signal pin 11 is compressed to the maximum, the tip 1151 of the first contact pin 11a and the contact end 1211 of the second contact pin 12a are located on the same plane, which can improve the electrical connection with the terminal.

[0089] That is, when the signal pin 11 is compressed, the leg 115 of the first contact pin 11a moves along the guide groove S2 of the second contact pin 12a. When the signal pin 11 is compressed to the maximum, the tip 1151 of the first contact pin 11a and the contact end 1211 of the second contact pin 12a together form an electrical contact point with the test terminal (e.g., PCB pad).

[0090] Figure 7 This is a cross-sectional view of a test socket according to another embodiment of the present invention. This embodiment of the test socket also forms a shielding plating layer on the float 130 to improve the noise signal shielding and impedance matching effect between fine-pitch areas. The following will refer to... Figure 7 The main explanation is in conjunction with the above. Figures 2 to 6 The differences between the described embodiments of the present invention.

[0091] In this embodiment, the float 130 may include a plurality of fourth holes 1301 penetrating the float 130.

[0092] More specifically, the fourth hole 1301 can be formed in the float plate 130 at a position corresponding to the through hole 13h formed on the socket body 110, 120, and a third shielding plating layer 1302 made of conductive material can be formed on the inner surface of the fourth hole 1301. In this structure, the shielding plating layer extends to the contact end of the contact element (the part that contacts the BGA terminal), thereby further improving the noise signal shielding and impedance matching effect between fine pitches.

[0093] Although various embodiments of the present invention have been described in detail above, those skilled in the art will understand that various modifications can be made to the above embodiments without departing from the scope of the invention. Therefore, the scope of protection of the present invention should not be limited to the described embodiments, but should be determined not only by the appended claims, but also by the equivalents of the claims.

Claims

1. A BGA test socket for achieving impedance matching, characterized in that, include: Contacts, including ground pins and signal pins; as well as The socket body, for inserting and elastically supporting the contact element, has multiple holes. The plurality of holes include: The first hole is used to insert the grounding pin; A second hole is used to insert the signal pin; and The vias, corresponding to the pin diagram of the test socket, are formed between the multiple contacts. A first shielding coating is formed on the inner surface of the through hole through a conductive component. A second shielding layer for connecting the first shielding layer is formed on the upper and lower surfaces of the socket body via conductive components.

2. The BGA test socket for impedance matching according to claim 1, characterized in that, The second shielding coating is formed around the second hole on the upper and lower surfaces of the socket body.

3. The BGA test socket for impedance matching according to claim 2, characterized in that, The ground pin and the signal pin are formed with the same shape.

4. The BGA test socket for impedance matching according to claim 3, characterized in that, The grounding pin has a different maximum diameter than the signal pin.

5. The BGA test socket for impedance matching according to claim 2, characterized in that, The ground pin and the signal pin are formed with different shapes.

6. The BGA test socket for impedance matching according to claim 1, characterized in that, It also includes a float plate disposed on one side of the socket body and having a third hole for accommodating the contact end of the contact member that contacts the terminal of the BGA.

7. The BGA test socket for impedance matching according to claim 6, characterized in that, The float plate includes a fourth hole formed at a position corresponding to the through hole.

8. The BGA test socket for impedance matching according to claim 7, characterized in that, The inner surface of the fourth hole is covered with a third shielding coating formed by a conductive component.

9. The BGA test socket for impedance matching according to claim 1, characterized in that, The contact element includes: A pair of styluses; and A spring is connected between the pair of contact pins and provides elasticity.

10. The BGA test socket for impedance matching according to claim 9, characterized in that, The pair of styluses have different shapes and are connected in intersecting directions.

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