Partition-controllable thermal simulation device and method for direct cooling plate test
Patent Information
- Application Number
- CN202611146596.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2026-07-30
- Publication Date
- 2026-08-28
AI Technical Summary
[0004]CN118913747A采用多组并联发热单元配合均温板模拟电池发热,通过上位机统一控制功率,可测算液冷板换热量,规避了实包测试的成本与安全隐患,但仍存在以下缺陷:1)每个发热单元配置均温板强制板面均温,仅可模拟全域均匀发热,无法还原电池中心、极耳局部高热、边缘低热的真实非均匀产热,难以校核直冷板热点散热、均温性能;2)无法精准复现快充、倍率切换等动态热冲击,不支持瞬态响应、过热度相关测试;3)直接以电池总产热作为加热输入,输出热流幅值、滞后性与直冷板实际承受净热流偏差大;4)装配压力依赖人工手感,界面接触热阻随机波动,同一样件多次测试数据离散,没有横向对比依据;5)每次测试需重复录入全部参数,迭代效率低
1)本申请采用接触式模拟热源完全替代真实电池包参与直冷板性能测试中所需的热模拟,从根源解决传统实包测试存在的多重短板,无需配置电芯模组、充放电设备及配套装配辅料,省去电芯采购、模组组装、拆换复原等冗长工序,规避电芯循环衰减、单体一致性差异引发的多批次数据无法横向对标问题,大幅压缩直冷板研发迭代周期;同时彻底消除高倍率充放电过程中的热失控起火安全隐患,无需搭建高等级防爆测试环境,显著降低实验室物料成本与安全管控门槛。
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Figure CN122651386A_ABST
Abstract
Description
Technical Field
[0001] This invention belongs to the field of energy storage thermal management testing technology, specifically relating to a zoned controllable thermal simulation device and method for testing direct cooling plates. Background Technology
[0002] With the rapid development of power batteries and electrochemical energy storage systems towards higher energy density, higher charge / discharge rates, and longer cycle life, battery thermal management has become a core technological aspect for ensuring system safety, efficiency, and lifespan. Refrigerant direct cooling systems, with their advantages of high heat exchange efficiency, compact structure, fast temperature response, and direct reuse of air conditioning / heat pump circuits, are gradually replacing traditional air cooling and conventional liquid cooling, becoming the mainstream heat dissipation solution for high-power-density energy storage and power battery packs. As the core heat exchange component of refrigerant direct cooling systems, the flow channel design, heat exchange performance, temperature uniformity, flow distribution characteristics, and control strategy matching of the direct cooling plate directly determine the thermal safety and reliability of the battery pack. Therefore, precise, efficient, and low-cost laboratory performance testing is required throughout the entire product development cycle.
[0003] Currently, the performance testing of cold-cooled plates in the industry mainly falls into two categories: one is to conduct charge-discharge tests using real battery packs, and the other is to use electric heating to simulate heat sources instead of battery cells for bench testing. While testing with real battery packs can closely simulate actual heat generation conditions, the entire testing system requires dedicated charge-discharge equipment, complete cell modules, and structural auxiliary materials, resulting in long material procurement and module assembly cycles and high testing costs. High-rate charge-discharge processes pose a risk of thermal runaway and fire, leading to high safety management thresholds. Furthermore, battery cells suffer from cyclic degradation and individual cell consistency deviations, making it difficult to cross-reference data from multiple tests and resulting in low R&D iteration efficiency. Therefore, the industry is gradually adopting electric heating to simulate heat sources instead of real batteries. Existing related technologies can be found in invention patent document CN118913747A, which discloses a liquid-cooled plate performance testing device and method using a battery heat source simulation system.
[0004] CN118913747A uses multiple parallel heating units with a heat spreader to simulate battery heating. The power is controlled uniformly by a host computer, and the heat exchange of the liquid cooling plate can be calculated, avoiding the cost and safety hazards of actual package testing. However, it still has the following defects: 1) Each heating unit is equipped with a heat spreader to force the plate surface to be uniformly heated, which can only simulate uniform heating over the whole area. It cannot reproduce the real non-uniform heat generation of the battery center, local high heat of the tabs and low heat of the edges, and it is difficult to verify the heat dissipation and temperature uniformity performance of the direct cooling plate; 2) It cannot accurately reproduce dynamic thermal shocks such as fast charging and rate switching, and does not support transient response and overheating related tests; 3) It directly uses the total heat generation of the battery as the heating input, and the output heat flow amplitude and hysteresis deviate greatly from the actual net heat flow borne by the direct cooling plate; 4) The assembly pressure depends on manual feel, the interface contact thermal resistance fluctuates randomly, and the test data of the same part is discrete after multiple tests, without any basis for horizontal comparison; 5) All parameters need to be repeatedly entered for each test, resulting in low iteration efficiency.
[0005] In summary, traditional real-world battery heating solutions are costly, risky, and have poor data repeatability. While existing electric heating simulation equipment used in cold plate testing avoids the risks associated with cell usage, it suffers from problems such as low fidelity in thermal field simulation, distortion of transient operating conditions, uncontrollable interface thermal resistance, and narrow compatibility. These issues cannot meet the current R&D needs for refined, standardized, and multi-condition parallel testing of high-power direct-cooled plates. Summary of the Invention
[0006] The purpose of this invention is to address the shortcomings of the existing technology by proposing a simulation device and a matching simulation method that highly replicates the actual heat generation of a battery pack in an energy storage system. The main method is to replace the real battery with a controllable contact-type simulated heat source. This contact-type simulated heat source can reproduce the spatial distribution and temporal variation of heat generation in the battery pack. Its output heat directly corresponds to the net heat flow transferred from the battery pack to the direct cooling plate under test. The repeatability of the results is ensured by controlling the contact thermal resistance at the interface between the heat source and the direct cooling plate under test.
[0007] To achieve the above objectives, the present invention adopts the following technical solution: A zoned controllable thermal simulation device for testing direct-cooled plates includes a contact-type simulated heat source, a bonding and pressure application device, and a heating control unit. The contact-type simulated heat source comprises several zoned heating modules arranged in a matrix, each zoned heating module being attached to the heat exchange plate surface of the direct-cooled plate under test via thermally conductive gel. The bonding and pressure application device applies normal bonding pressure to each zoned heating module and the direct-cooled plate under test, forming a contact interface with constant contact thermal resistance between each zoned heating module and the direct-cooled plate under test, in conjunction with the thermally conductive gel. Each zoned heating module is mutually insulated and electrically connected to the heating control unit. The heating control unit has built-in steady-state and transient simulation control programs, and binds a unique device address and drive channel ID to each zoned heating module. A multi-channel independent addressing matching mechanism is used to allocate and output heating drive power corresponding to each zoned heating module, thereby controlling the independent heating of each zoned heating module. This allows all zoned heating modules to work together to simulate the uniform or non-uniform heating conditions of a battery pack under steady-state or transient conditions, matching the thermal simulation requirements for testing the overall heat dissipation performance of a direct-cooled plate.
[0008] Preferably, the heat generation control unit includes a human-machine interface, a central controller, a multi-channel programmable power supply, and a data acquisition unit. The human-machine interface is connected to the central controller and is used to configure thermal simulation parameters, execute thermal simulation control operations, and display thermal simulation status data. The thermal simulation parameters include steady-state simulation power data, transient simulation power data, and thermal field distribution data. The thermal simulation status data includes the electrical parameters of each output channel of the multi-channel programmable power supply and the heating temperature of each zone heating module. The central controller is connected to the multi-channel programmable power supply and, based on its built-in steady-state and transient simulation control programs, analyzes the configured thermal simulation parameters. Combining the unique device address of each zone heating module with a multi-channel independent addressing matching mechanism, it generates several digital power signals corresponding one-to-one with each zone heating module and issues a power output command containing all digital power signals. The multi-channel programmable power supply has several independent output channels, each connected to a zone heating module. It analyzes the digital power signals in the power output command and outputs the corresponding heating drive power for each zone heating module according to the drive channel ID. The data acquisition unit is connected to the central controller, the multi-channel programmable power supply, and the built-in temperature sensors of each zone heating module. It is used to collect the thermal simulation status data in real time and temporarily store the thermal simulation status data in the central controller for use by the human-machine interface.
[0009] Preferably, each zone heating module is printed with a visual module number, which corresponds to the unique device address of the zone heating module.
[0010] Preferably, the partitioned heating module is a PI film heating element or a silicone rubber heating element.
[0011] Preferably, the bonding and pressure application device includes a rigid base, a pressure equalizing plate, and several adjustable pressing units; The rigid base has a placement area for the direct cooling plate to be tested. Several positioning holes are provided around the placement area of the direct cooling plate on the rigid base, each corresponding to one of the adjustable clamping units. Each adjustable clamping unit includes a bolt and an adjusting nut. The bottom of the bolt is fixedly connected to the rigid base through the corresponding positioning hole, and the top of the bolt vertically penetrates the pressure equalizing plate, forming a detachable threaded transmission pair with the adjusting nut. Pressure is applied to the pressure equalizing plate by rotating the adjusting nut, and all adjustable clamping units cooperate to apply normal pressure to the pressure equalizing plate and adjust the pressure accordingly.
[0012] Preferably, the upper surface of the rigid base is provided with an edge positioning beam along the edge of the placement area of the straight cold plate to be tested, and the positioning mounting hole is opened on the edge positioning beam.
[0013] Preferably, the adjustable clamping unit further includes a spring; the spring is coaxially sleeved outside the bolt and located between the adjusting nut and the pressure equalizing plate, and is used to control the pressure applied to the pressure equalizing plate by the adjustable clamping unit according to its compression amount.
[0014] Preferably, a pressure sensor is provided on the rigid base; the pressure sensor is electrically connected to the heating control unit and is used to collect and feedback the normal pressure applied by the bonding pressure device to each zone heating module and the direct cooling plate to be tested, and the normal pressure is equivalent to the normal bonding pressure.
[0015] A zoned controllable thermal simulation method for testing direct-cooled plates comprises the following steps using the aforementioned zoned controllable thermal simulation device for testing direct-cooled plates: S1. After uniformly applying thermal conductive gel to the heat exchange plate surface of the direct cooling plate to be tested, a contact-type simulated heat source is placed on the heat exchange plate surface of the direct cooling plate to be tested. S2, using a bonding pressure device to apply a preset normal bonding pressure to the contact-type simulated heat source and the direct cooling plate to be tested, forming a contact interface with constant contact thermal resistance; S3, based on the thermal simulation requirements for the full-area heat dissipation performance test of the direct cooling plate, configures thermal simulation parameters in the heat dissipation control unit; the thermal simulation parameters include steady-state simulation power data, transient simulation power data, and thermal field distribution data; S4, the thermal simulation control process is started through the heating control unit. Based on the steady-state and transient simulation control program, the configured thermal simulation parameters are analyzed. The multi-channel independent addressing matching mechanism is used to allocate and output the heating drive power corresponding to each zone heating module, and control each zone heating module to heat independently. S5, under the control of the heat dissipation control unit, simulates the uniform or non-uniform heating conditions of the battery pack under steady-state or transient conditions on the heat exchange plate surface of the direct cooling plate under test, matching the thermal simulation requirements of the full-area heat dissipation performance test of the direct cooling plate.
[0016] Preferably, in step S1, when the contact-type simulated heat source is arranged on the heat exchange plate surface of the direct cooling plate to be tested, the arrangement position of the corresponding zone heating module is determined according to the visible module number printed on the zone heating module, so that all zone heating modules are arranged in a matrix on the heat exchange plate surface of the direct cooling plate to be tested.
[0017] Preferably, in step S2, the bonding pressure device includes a rigid base and a pressure equalizing plate; the rigid base has a placement area for the cold plate to be tested, and a plurality of adjustable clamping units are arranged around the placement area; the adjustable clamping unit includes a bolt and an adjusting nut; the bottom of the bolt is fixedly connected to the rigid base, and the top of the bolt and the adjusting nut form a detachable threaded transmission pair; applying a preset normal bonding pressure to the contact-type simulated heat source and the cold plate to be tested using the bonding pressure device includes the following steps: S21, place the rigid base of the pressure application device on the test platform, and then place the direct cooling plate to be tested with the partition heating module on the rigid base; S22, heat insulation cotton is laid on the upper surface of the contact-type simulated heat source so that the heat insulation cotton evenly covers all zone heating modules; S23, place the pressure equalizing plate of the pressure application device on the insulation cotton, so that the bolts of each adjustable clamping unit pass vertically through the pressure equalizing plate; S24, assemble adjusting nuts on the bolts of each adjustable clamping unit; during this period, apply pressure to the equalizing plate by rotating each adjusting nut to uniformly control the pressing force between the entire contact-type simulated heat source and the direct cooling plate to be tested, until the preset normal bonding pressure is generated.
[0018] Preferably, in step S24, when assembling the adjusting nut on the bolt of each adjustable clamping unit, a spring with known stiffness and the same model is fitted on all bolts. After rotating the adjusting nut, the spring is compressed. The pressure applied to the pressure equalizing plate by the adjustable clamping unit is controlled according to the amount of compression, so that the pressure applied to the pressure equalizing plate by each adjustable clamping unit is the same. The normal contact pressure is monitored by a pressure sensor set on the rigid base.
[0019] Preferably, in step S3, the heat generation control unit is equipped with a human-machine interface and a central controller, and configuring the thermal simulation parameters includes the following steps: S31, enter key parameters in the index window of the human-machine interface to initiate a historical thermal simulation parameter query command; key parameters include battery pack model and heating condition type; S32, the central controller traverses the built-in thermal simulation condition database according to the query command, and determines whether there is battery pack heating data that matches the key parameters in the thermal simulation condition database; if not, proceed to S33; if yes, proceed to S34. S33: Open the new window for battery pack heat dissipation data through the human-machine interface. Input key parameters and thermal simulation parameters according to the thermal simulation requirements of the actual direct cooling plate full-area heat dissipation performance test. The central controller binds the key parameters and thermal simulation parameters to generate battery pack heat dissipation data and saves the battery pack heat dissipation data to the thermal simulation working condition database, and returns to S31. S34, confirm the selection of battery pack heat dissipation data that matches the key parameters, and load the thermal simulation parameters in the battery pack heat dissipation data into a thermal simulation data list presented on the human-machine interface by data reuse; the operator adjusts or directly reuses the data in the thermal simulation data list according to the actual thermal simulation requirements of the direct cooling plate full-area heat dissipation performance test, thus completing the thermal simulation parameter configuration.
[0020] Preferably, in S3, the steady-state simulation power data includes the total steady-state heating power of the battery pack and the steady-state simulation duration; the transient simulation power data includes the dynamic power time-series curve of the transient heating of the battery pack; the thermal field distribution data adopts the spatial power distribution matrix corresponding to the arrangement structure of each zone heating module, the spatial power distribution matrix of uniform thermal field simulation is a one matrix, and the spatial power distribution matrix of non-uniform thermal field simulation is established according to the weight of the thermal field distribution area of the battery pack heating.
[0021] Preferably, in step S4, a multi-channel programmable power supply is configured in the heating control unit to output heating drive power corresponding to each zone heating module. Specifically: when the heating condition is a steady-state thermal field simulation, the central controller loads a spatial power distribution matrix, performs constant power allocation to each zone heating module according to the total steady-state heating power, generates a power output command containing several constant digital power signals, and controls the multi-channel programmable power supply to complete the constant power output corresponding to each zone heating module. When the heating condition is a transient thermal field simulation, the central controller synchronously loads the spatial power distribution matrix and a dynamic power timing curve, refreshes the calculation with fixed time slices, couples the dynamic power timing curve with the spatial power distribution matrix, generates a power output command containing several dynamic digital power signals, and controls the multi-channel programmable power supply in the heating control unit to complete the dynamic power output corresponding to each zone heating module.
[0022] Preferably, the method for obtaining the dynamic power time-series curve is as follows: obtaining the instantaneous total heat generation power curve of the battery pack under set operating conditions through experimental simulation. Simultaneously, the power absorption curve of the battery pack due to its own temperature rise was obtained. Based on power curves and power curve The equivalent heat source power curve was calculated. The equivalent heat source power curve This is the dynamic power timing curve. Wherein: , ; Indicates the mass of the battery pack. This indicates the average constant-pressure specific heat capacity of the battery pack; This indicates the rate of temperature rise of the battery pack. Indicates temperature. Indicates time.
[0023] The beneficial effects of this invention are: 1) This application uses a contact-type simulated heat source to completely replace the thermal simulation required for the performance testing of the direct-cooling plate, thus fundamentally solving the multiple shortcomings of traditional real-pack testing. It eliminates the need for cell modules, charging and discharging equipment and supporting assembly materials, saving the lengthy processes of cell procurement, module assembly, and disassembly and restoration. It also avoids the problem of data mismatch caused by cell cycle degradation and individual cell consistency differences, significantly shortening the R&D iteration cycle of the direct-cooling plate. At the same time, it completely eliminates the safety hazards of thermal runaway and fire during high-rate charging and discharging, eliminating the need to build a high-level explosion-proof testing environment, and significantly reducing laboratory material costs and safety control thresholds.
[0024] 2) This application significantly improves the fidelity of thermal field simulation under battery pack heat generation conditions, making up for the defects of simulation distortion in existing integrated heating heat sources. The matrix-style partitioned heating modules, which are mutually insulated and have independent visible module numbers, are combined with multi-channel programmable power supply independent closed-loop power control. Based on the battery pack thermal simulation cloud map, a spatial power distribution matrix can be constructed to accurately reproduce real non-uniform heat generation scenarios such as uniform heating across the entire area and local high heat at the cell tabs / center and low heat at the module edges. This meets the requirements for direct cooling plate hot spot heat dissipation and performance verification of uniform temperature across the entire area. At the same time, the heat generation control unit is equipped with steady-state and transient dual-type simulation control programs. Under transient conditions, the dynamic power timing curve is coupled with the spatial power distribution matrix through a fixed time slice to update the partitioned power frame by frame, completely replicating dynamic thermal shock conditions such as fast charging and rate switching. Furthermore, by subtracting the heat absorption power of the cell's own temperature rise from the total heat generation power of the battery pack, the battery thermal capacity buffering effect is removed, so that the simulated output heat flow is completely matched with the actual net heat dissipation of the direct cooling plate under test. This effectively solves the problems of heat flow amplitude and response timing distortion in traditional solutions.
[0025] 3) This application is equipped with a dedicated bonding and pressure application device, which enables quantifiable and uniformly controllable normal bonding pressure between the zoned heating module and the direct cooling plate under test, completely eliminating the problems of manual assembly errors and random fluctuations in contact thermal resistance. Furthermore, the bonding and pressure application device includes a rigid base, a multi-point independently adjustable pressing unit, and a pressure equalization plate. The pressing unit is equipped with a linear spring with known stiffness, and the pressure is calibrated at a single point by the compression of the spring. With the help of a diagonal step-by-step pre-tightening process, the pressure is made uniform throughout the entire area. The pressure sensor on the rigid base can collect the normal bonding pressure in real time and feed it back to the heating control unit, transforming the pressing operation into a digitally reproducible standard process. At the same time, the thermally conductive gel fills the micro gaps at the interface, and the low thermal conductivity insulation cotton laid above the contact simulated heat source not only eliminates the air gap at the contact interface to form a stable and controllable contact thermal resistance boundary, but also blocks the upward and surrounding convection and radiation of the heat source, avoiding interference from environmental airflow and temperature fluctuations. This significantly reduces the data dispersion of multiple retests of the same part and comparative tests of different samples, making the test results have a reliable basis for horizontal comparison.
[0026] 4) The heating control unit matched with the present application has intelligent measurement and control capabilities, which effectively reduces manual operation costs and manual input errors. The heating control unit has a built-in local thermal simulation working condition database, which uses the battery pack model and the type of heating working condition as retrieval indexes, supports one-key calling and reuse of historical steady-state power, transient sequence and thermal field distribution parameters, and allows new parameters to be created, bound and stored when there is no matching working condition, so there is no need to completely input a full set of working condition data for each test; the data acquisition unit synchronously acquires electrical parameters of each output channel, built-in temperature of the partition heating module and interface bonding pressure, all data is uploaded to the human-computer interaction interface in real time, supports visual display of matrix temperature lists and temperature cloud maps, and the global temperature, pressure and power states can be monitored throughout the whole process, and the complete data can be traced; each output channel of the multi-channel programmable power supply is electrically isolated and independently adjusts the output power in a closed loop, automatically compensates the power deviation caused by cable voltage drop and resistance drift of the heating module, continuously ensures that each partition heating module stably outputs the target heat, and avoids thermal simulation distortion.
[0027] 5) The entire system of the present application has strong hardware compatibility and complete test coverage scenarios, which can adapt to the direct cooling plate test requirements in the whole R&D cycle of energy storage and power batteries. The number of partition heating modules and the matrix arrangement form can be flexibly adjusted according to the test requirements of component-level single direct cooling plates and system-level multi-cluster direct cooling plates, and the number of adjustable pressing units can be increased or decreased along with the size of the cooling plate; a single set of thermal simulation system can meet the test requirements of the whole R&D process of direct cooling plates, and can replace multiple sets of traditional test devices such as real battery charge-discharge test benches and integrated single-zone heating devices, effectively reducing the investment cost of multiple types of test equipment in the laboratory. Description of Drawings
[0028] Figure 1 is a layout principle block diagram of a partitioned controllable thermal simulation device for direct cooling plate testing; Figure 2 is a pressure applying schematic diagram of a partitioned controllable thermal simulation device for direct cooling plate testing; Figure 3 is a basic flow block diagram of a partitioned controllable thermal simulation method for direct cooling plate testing; Figure 4 is a preferred flow block diagram of a partitioned controllable thermal simulation method for direct cooling plate testing Figure 1 ; Figure 5 is a preferred flow block diagram of a partitioned controllable thermal simulation method for direct cooling plate testing Figure 2 ; Figure 6 is an example of a thermal simulation temperature distribution cloud map of a battery pack.
[0029] In the diagram: 1. Contact-type simulated heat source; 1.1. Zoned heating module; 2. Direct cooling plate under test; 3. Thermocouple; 4. Pressure sensor; 5. Rigid base; 6. Pressure equalizing plate; 7. Adjustable clamping unit; 7.1. Bolts; 7.2. Adjusting nuts; 8. Thermal conductive gel; 9. Insulation cotton; 10. Test platform; 11. Heating control unit; 11.1. Central controller; 11.2. Human-machine interface; 11.3. Data acquisition unit; 11.4. Multi-channel programmable power supply. Detailed Implementation
[0030] To make the purpose, technical solution and advantages of the invention clearer, the technical solution of the invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are some embodiments of the invention, but not all embodiments.
[0031] Therefore, the following detailed description of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the invention without inventive effort are within the scope of protection of the invention.
[0032] Example 1 This embodiment discloses a zoned controllable thermal simulation device for direct-cooling plate testing. As a preferred embodiment of the present invention, it is adapted for component-level single direct-cooling plate performance verification and system-level multi-cluster direct-cooling plate joint testing of refrigerant direct-cooling plates for power batteries / energy storage batteries. It is used to completely replace real battery packs in a laboratory environment, constructing high-fidelity, repeatable thermal excitation boundaries, and specifically addressing the following practical problems existing in current direct-cooling plate testing: high cost and significant safety risks in actual pack testing; the inability of integrated heating heat sources to reproduce the non-uniform heat generation of battery packs; and the lack of standardized clamping structures in manual assembly, resulting in large fluctuations in interface contact thermal resistance and discrete test data. Specifically, in conjunction with... Figure 1 and Figure 2 As shown, this thermal simulation system includes a contact-type simulated heat source 1, a bonding and pressure application device, and a heat control unit 11. The three work together to complete the entire process of heat source layout, interface clamping, and power regulation, which can cover the testing needs of the entire R&D process from direct cooling plate flow channel design and sample verification to system thermal management matching.
[0033] The contact-type simulated heat source 1 serves as the heat carrier for simulating the heat generation of the battery pack. It adopts a discrete design approach, characterized by electrical insulation, independent addressability, and independent temperature control for each zone. Specifically, it comprises several independent zone heating modules 1.1 arranged in a matrix, each with a visible module number printed on it. The exact number of zone heating modules 1.1 is flexibly determined based on system-level and component-level testing scenarios, combined with the required thermal simulation accuracy (e.g., 104 zone heating modules 1.1 are used to simulate the heating of a single battery pack in a component-level testing scenario). Based on this, the zone heating modules 1.1 are arranged in a matrix on the heat exchange plate surface of the direct cooling plate 2 under test, according to their visible module numbers. Simultaneously, the zone heating modules 1.1 are attached to the heat exchange plate of the direct cooling plate 2 using thermally conductive gel 8. The thermally conductive gel 8 fills the tiny gaps between the zone heating modules 1.1 and the direct cooling plate 2 under test, reducing the contact thermal resistance at the interface between them.
[0034] The bonding and pressing device, serving as a contact thermal resistance control module, employs a mechanical structure with uniform pressure across the entire surface area. It is used to uniformly and controllably press the heating modules 1.1 of each zone with the direct cooling plate 2 under test, creating a quantifiable, repeatable, and uniformly distributed normal bonding pressure at the contact interface. Simultaneously, the thermally conductive gel 8 filling the contact interface completely eliminates microscopic air gaps between the heating modules 1.1 and the direct cooling plate 2, transforming the originally random and uncontrollable contact thermal resistance into stable and controllable known fixed boundary conditions. This results in a contact interface with constant thermal resistance between the heating modules 1.1 and the direct cooling plate 2. This standardized pressing ensures completely consistent interface heat transfer conditions for each test, avoiding test errors caused by manual assembly and uneven pressure. It also provides direct comparative value for results from different direct cooling plates 2 under test and different test batches, meeting the needs of laboratory performance calibration and R&D iteration comparison.
[0035] Each zone heating module 1.1 is electrically connected to the heating control unit 11. High-temperature resistant insulating materials can be used to electrically isolate and thermally decouple the zone heating modules 1.1, preventing current crosstalk and heat crosstalk between adjacent zone heating modules 1.1, and ensuring that the power and temperature of each heating zone can be independently controlled. The heating control unit 11 has built-in steady-state and transient simulation control programs, and binds a unique device address and drive channel ID to each zone heating module 1.1. A multi-channel independent addressing matching mechanism is used to allocate and output heating drive power corresponding to each zone heating module 1.1, thereby controlling the independent heating of each zone heating module 1.1. This allows all zone heating modules 1.1 to work together to simulate the uniform or non-uniform heating conditions of the battery pack under steady-state or transient conditions, matching the thermal simulation requirements of the direct cooling plate's full-area heat dissipation performance test.
[0036] The steady-state and transient simulation control program is an embedded algorithm logic package embedded within the heat control unit 11. It is divided into steady-state calculation subroutines, transient timing coupling subroutines, and operating condition database scheduling subroutines. It is the core underlying operation for the entire system to realize the partitioned differentiated thermal field replication: The steady-state calculation subroutine reads the steady-state total power, spatial power distribution matrix, etc., allocates constant power according to weight, and outputs a constant digital power signal to maintain the constant heating power of each partition heating module 1.1 for a long time. It can be used to simulate the constant rate steady-state charging and discharging of the battery; The transient timing coupling subroutine uses a fixed time slice as the refresh period to synchronously load the dynamic power timing curve and spatial power distribution matrix, and updates the dynamic power of each partition frame by frame through coupling calculation. It automatically removes the heat absorption component of the battery pack thermal capacity and can restore dynamic thermal shocks such as fast charging, rate switching, and intermittent discharge; The operating condition database scheduling subroutine connects to the retrieval command issued by the human-machine interface 11.2 in the heat control unit 11, completes the index matching of battery pack model and heating condition type, and realizes the reading, new storage, and data reuse of historical operating condition parameters.
[0037] The unique device address is a read-only fixed code pre-programmed into the built-in temperature sensing chip and heating drive interface of each zone heating module 1.1 at the factory. It is globally unique and uniquely identifies each single zone heating module 1.1. It is not bound to fixed matrix row and column information. The read-only fixed code is an independent hardware serial number, mapped one-to-one with the visible module number printed on the surface of the zone heating module 1.1. It does not embed matrix row or column number fields and is unaffected by adjustments to the matrix row and column numbers during testing. The visible module number printed on the surface of the zone heating module 1.1 serves only as a manual physical identifier. After the system powers on, it automatically scans and identifies the unique device addresses of all single zone heating modules 1.1, and then temporarily establishes a dynamic mapping table of "unique hardware device address - current matrix grid position" based on the actual matrix arrangement configured in this simulation. The unique device address serves as the underlying identifier for each independent heating unit in the heating control unit 11, distinguishing between different zone heating modules 1.1 and preventing zone confusion and power mismatch when distributing power across multiple channels. Even if modules are added or removed, or the matrix row and column arrangement is adjusted, the unique device address itself remains unchanged; only the correspondence between the unique device address and the grid position is dynamically updated. After power-on, the zone heating module 1.1 automatically reports its unique device address to the heating control unit 11. The heating control unit 11 automatically scans all drive channel IDs of the multi-channel programmable power supply 11.4, establishes a temporary "unique device address - drive channel ID" binding relationship, and completes automatic hardware topology identification without manual pairing.
[0038] The drive channel ID is the logical sequence number of each independent output channel within the multi-channel programmable power supply 11.4 in the heating control unit 11. It is fixedly assigned by the power supply hardware and sequentially numbered starting from 001. Each drive channel ID corresponds to an electrically isolated independent output channel. The output cable of a single drive channel ID connects only to a single zone heating module 1.1 and is bound one-to-one with the unique device address of the zone heating module 1.1, forming a unique mapping link of "unique device address - drive channel ID - zone heating module 1.1". The power output commands issued by the central controller 11.1 inside the heating control unit 11 carry the drive channel ID corresponding to each group of digital power signals. The multi-channel programmable power supply 11.4 only outputs the corresponding voltage and current to the channel matching the drive channel ID; other channels are unaffected. The data acquisition unit 11.3 in the heating control unit 11 synchronously collects the corresponding channel electrical parameters and zone temperature data according to the drive channel ID. The human-machine interface 11.2 displays the full-domain temperature matrix and power list sorted by ID, facilitating zone fault location and hotspot tracing.
[0039] The multi-path independent addressing matching mechanism is the addressing scheduling logic of the heat dissipation control unit 11 to achieve precise distribution of partitioned power. It connects the mapping relationship of "unique device address, drive channel ID, and spatial power distribution matrix". The complete process logic is as follows: After the system is powered on, all zone heating modules 1.1 report their unique device addresses. The central controller 11.1 automatically scans all drive channel IDs of the multi-channel programmable power supply 11.4, establishes a global binding mapping table of "unique device address - drive channel ID", and locks the dedicated output channel corresponding to each zone heating module 1.1.
[0040] Load the spatial power distribution matrix (uniform / non-uniform thermal field weight matrix). The row and column numbers of each grid element in the spatial power distribution matrix correspond one-to-one with the matrix arrangement position and unique device address of the partitioned heating module 1.1, thus completing the binding of the thermal field spatial weights to the hardware partition position.
[0041] When the heating condition is a steady-state thermal field simulation, the total steady-state heating power is read, and the target constant power for each zone is calculated using the spatial power distribution matrix. The target constant power value is then bound to the unique device address of the corresponding zone's heating module 1.1, and converted to the corresponding drive channel ID through a mapping table, generating a constant digital power signal with the drive channel ID identifier. When the heating condition is a transient thermal field simulation, the instantaneous total power in the dynamic power timing curve is read at fixed time slices. The dynamic power of each zone is calculated frame by frame using the synchronously coupled spatial power distribution matrix. After binding to the unique device address, it is converted to the corresponding drive channel ID, generating a dynamic digital power signal with the drive channel ID identifier.
[0042] All digital power signals with drive channel IDs are integrated and packaged into a power output command, which is then sent to the multi-channel programmable power supply 11.4. The multi-channel programmable power supply 11.4 distributes power to the corresponding output channel according to the drive channel ID, and simultaneously transmits back the actual electrical parameters of each output channel in real time.
[0043] This multi-channel independent addressing matching mechanism can achieve completely independent decoupling control of thousands of zone heating modules 1.1. Any adjustment of the power of a single zone will not interfere with the thermal output of other zones, completely solving the defects of traditional integrated heat sources that generate heat synchronously across the entire area and cannot replicate local hot spots of the battery. At the same time, it ensures that the addressing logic of the thermal zone is completely consistent in multiple tests, and the test data has horizontal comparability.
[0044] Example 2 This embodiment discloses a zoned controllable thermal simulation device for testing direct cooling plates. As a preferred embodiment of the present invention, the overall thermal simulation system architecture is consistent with that of Embodiment 1. The improvement is focused on the material selection of the zoned heating module 1.1. That is, the zoned heating module 1.1 adopts a flexible heating substrate, such as a PI film heating sheet or a silicone rubber heating sheet, and each zoned heating module 1.1 has a built-in temperature sensor embedded in it.
[0045] The PI film heating element uses polyimide film as the insulating substrate, with internally etched metal heating circuitry. It features a thin overall thickness, good surface temperature uniformity, and fast thermal response. The substrate itself has stable insulation properties, eliminating the need for additional insulating gaskets between modules and allowing for direct matrix arrangement. The thickness is typically controlled between 0.1 and 0.3 mm, preventing additional gaps between the partitioned heating module 1.1 and the tested direct cooling plate 2 after installation. Combined with thermally conductive gel 8, the interface thermal resistance fluctuation is even smaller. A miniature platinum resistance temperature sensing core is etched in the center of the metal heating circuitry as a built-in temperature sensor. The temperature sensor is isolated from the metal heating circuitry in layers, with the insulating layer preventing interference from the heat source's electrical signal to the temperature measurement circuit. The temperature sensor is in close contact with the heat exchange interface of the PI film heating element, with the measurement point coinciding with the simulated heat generation area. This allows for real-time acquisition of the actual temperature at the contact interface between the PI film heating element and the tested direct cooling plate 2, without requiring additional temperature probes to occupy assembly gaps.
[0046] The silicone rubber heating element uses high-temperature resistant silicone rubber as the outer layer and embeds an alloy resistance wire inside, resulting in higher flexibility and superior pressure and wear resistance. The silicone rubber material has a certain degree of deformation capability, allowing it to slightly adapt to the minute irregularities and flow channel protrusions on the surface of the direct-cooling plate 2 under test. Its good elasticity further fills interface gaps and enhances heat transfer contact during the uniform pressure application process of the bonding device. During the molding stage, a miniature thermocouple 3 is pre-embedded in the middle layer of silicone rubber, staggered from the heating wire, and completely encased in external silicone rubber for insulation protection. The built-in temperature sensor deforms synchronously with the silicone rubber heating element, conforming to the uneven surface of the direct-cooling plate 2 under test. This avoids the problem of external thermocouple 3 being suspended or having poor contact, which could lead to temperature measurement distortion. It can withstand continuous, adjustable pressure bonding without damage over a long period.
[0047] The built-in temperature sensor signal circuit of the zone heating module 1.1 is electrically isolated from the power circuit to avoid electromagnetic interference caused by high-power heating and ensure stable temperature data acquisition. Each zone heating module 1.1 has a visible module number on its surface, and the temperature measurement signal is bound to the corresponding zone power supply channel. Operators can quickly locate high-temperature and low-temperature areas by referring to the visible module number. All built-in temperature sensors are connected to the heating control unit 11 to continuously and synchronously collect the temperature of all zones. Based on the heating control unit 11, a matrix temperature cloud map is displayed visually, intuitively showing the complete temperature distribution on the direct cooling plate 2 under test.
[0048] Operators can view the overall temperature gradient, hot spot locations, and regional temperature differences in real time. They can compare the measured temperature distribution with the battery pack heating data from simulation and actual battery pack testing to determine whether the current simulated thermal field's temperature level, temperature difference distribution, and hot spot locations match the actual battery pack heating characteristics. This allows them to adjust the output power of each zone and correct the operating parameters.
[0049] Example 3 This embodiment discloses a zoned controllable thermal simulation device for testing direct-cooling plates. As a preferred embodiment of the present invention, based on Embodiment 1 or 2, it clarifies the specific structure and assembly relationship of the bonding and pressing device, solving technical problems such as uneven pressure, localized poor bonding, thermal resistance fluctuations, and poor test repeatability caused by traditional manual pressing through a simple mechanical structure. Figure 2 As shown, the pressure application device adopts a rigid support and multi-point adjustable pressure design concept. Specifically, it is designed with a rigid base 5, a pressure equalizing plate 6, and several adjustable pressing units 7. The specific number of adjustable pressing units 7 is determined according to the area of the contact simulated heat source 1 to be covered, so as to ensure that even a large-size direct cooling plate 2 under test can achieve uniform pressure. For example, a small direct cooling plate can be pressurized at 4 points, and a large direct cooling plate can be pressurized at 6, 8 or 12 points.
[0050] The rigid base 5 serves as the load-bearing base for the entire bonding and pressure application device. It can be manufactured from a high-flatness, rigid metal sheet, making it resistant to deformation under pressure. This provides a flat support surface for the direct cooling plate 2 under test, preventing it from being suspended or sinking under pressure during pressurization. This ensures that pressure is applied only to the contact surface between the simulated heat source 1 and the direct cooling plate 2, without causing structural deformation. This fundamentally prevents localized gaps, poor contact, or sudden changes in contact thermal resistance between the direct cooling plate 2 and the various zone heating modules 1.1 due to deformation. A placement area for the direct cooling plate 2 is provided above the rigid base 5. Several positioning holes are provided around this area, each corresponding to one of the adjustable pressing units 7.
[0051] The adjustable clamping unit 7 is an actuator that fits into the pressure application device to achieve adjustable, controllable, and lockable normal pressure. It adopts a pure mechanical threaded transmission scheme and features simple structure, high precision, high reliability, low cost, and convenient maintenance. It is suitable for long-term, high-frequency testing in the laboratory. Specifically, each adjustable clamping unit 7 is equipped with an independent bolt 7.1 and adjusting nut 7.2 to form a complete threaded clamping pair.
[0052] Bolt 7.1 is locked and fixed in the positioning and mounting hole corresponding to the rigid base 5, extending vertically upward. Its screw passes vertically through the upper pressure equalizing plate 6, and a small gap is reserved between the screw and the through hole of the pressure equalizing plate 6 to ensure that the pressure equalizing plate 6 can float freely up and down without jamming or eccentric load, ensuring that the pressure is transmitted vertically downward and without generating lateral force.
[0053] The adjusting nut 7.2 can be a high-tightness nut, and can be equipped with anti-slip teeth, anti-loosening washers, or a double-nut locking structure. A handwheel or sleeve interface can be added to the outer ring for easy manual / tool adjustment. The adjusting nut 7.2 is located above the pressure equalizing plate 6 and matches the external thread of the bolt 7.1, forming a detachable threaded transmission pair. During actual assembly and pressure application, the operator rotates the adjusting nut 7.2 of each adjustable clamping unit 7. The adjusting nut 7.2 moves downward along the bolt 7.1, vertically pressing down on the pressure equalizing plate 6, with the downward stroke precisely controlled by the thread feed.
[0054] Each adjustable clamping unit 7 is independent of each other. A single adjustable clamping unit 7 applies pressure at a point, which can lead to pressure concentration, local overheating, and uneven adhesion. By detachably covering the pressure equalizing plate 6 above the overall contact simulated heat source 1 and setting multiple sets of adjustable clamping units 7 to work synchronously on the pressure equalizing plate 6, multiple point pressures can be converted into continuous and uniform surface pressure.
[0055] All bolts 7.1 of the adjustable clamping units 7 have the same length, thread specifications, and torque control of the adjusting nuts 7.2. A symmetrical step-by-step adjustment method can be adopted: first pre-tighten diagonally, then tighten evenly around the perimeter. This avoids excessive pressure on one side at a time, which could cause the pressure equalizing plate 6 to tilt or jam. Ultimately, this ensures that the pressure at all points is consistent, achieving uniform pressure across the entire area. Based on this, the operator can individually adjust the feed amount of some adjusting nuts 7.2 to correct minor assembly deviations, ensuring uniform downward stroke at all points on the bottom surface of the pressure equalizing plate 6. This makes the normal contact pressure between all zone heating modules 1.1 and the tested direct cooling plate 2 consistent, achieving uniform pressure contact across the entire area. The pressure remains constant and without deviation throughout the testing process, eliminating the pressure dispersion problems caused by manual tightening and single-point pressure application.
[0056] Example 4 This embodiment discloses a zoned controllable thermal simulation device for testing a direct-cooling plate. As a preferred embodiment of the present invention, based on embodiment 3, an edge positioning beam is integrally provided on the upper surface of the rigid base 5. The edge positioning beam encloses and forms a limiting area that matches the shape of the direct-cooling plate 2 to be tested. After the direct-cooling plate 2 to be tested is placed, it can be limited laterally and longitudinally by relying on the edge positioning beam, and no slippage or misalignment will occur during the entire testing process. At the same time, the aforementioned positioning and mounting holes are uniformly opened on the edge positioning beam body, which does not occupy the effective heat exchange area of the direct-cooling plate 2 to be tested, and can make the assembly structure of the adjustable clamping unit 7 more robust.
[0057] Example 5 This embodiment discloses a zoned controllable thermal simulation device for testing a direct cooling plate. As a preferred embodiment of the present invention, based on embodiment 3 or 4, its adjustable clamping unit 7 further includes a spring with known stiffness.
[0058] The spring is coaxially sleeved outside the bolt 7.1 and positioned between the adjusting nut 7.2 and the pressure equalizing plate 6. It controls the pressure applied to the pressure equalizing plate 6 by the adjustable clamping unit 7 based on its compression. More specifically, the adjusting nut 7.2, the spring, and the pressure equalizing plate 6 form a top-to-bottom axial force transmission path. The pressure applied by the downward movement of the adjusting nut 7.2 is elastically transmitted to the pressure equalizing plate 6 through the spring, allowing the pressure to be transmitted through the compression of the spring. Precise calibration.
[0059] Furthermore, the spring element can employ a stiffness coefficient... Known for its high precision, good linearity, and low hysteresis, cylindrical helical compression springs; all adjustable clamping units 7 use the same specifications and stiffness coefficient. The spring components; the spring stroke meets the pressure adjustment range, and under pressure, they do not coil out or become unstable. According to Hooke's Law, the normal pressure output by a single adjustable clamping unit 7... Due to the stiffness coefficient of all spring components Therefore: if the spring compression of all adjustable clamping units 7 is exactly the same, If they are consistent, then the normal pressure output by all adjustable clamping units 7 will be consistent. They are completely identical. The multi-point input forces on the equalizing plate 6 are completely equal, and the pressure of the contact simulated heat source 1 and the pressure of the direct cooling plate 2 under test are uniform and consistent throughout the entire area.
[0060] Example 6 This embodiment discloses a zoned controllable thermal simulation device for testing direct-cooling plates. As a preferred embodiment of the present invention, based on any of embodiments 3 to 5, a pressure sensor 4 is installed on the rigid base 5. The pressure sensor 4 is electrically connected to the heating control unit 11 and is used to collect and feedback the normal pressure applied by the bonding pressure device to each zone heating module 1.1 and the direct-cooling plate 2 under test. This normal pressure is equivalent to the normal bonding pressure. This achieves the following: transforming the fuzzy pressure that is manually adjusted into a precise pressure value that can be displayed, recorded, and reproduced digitally; real-time monitoring of the pressure throughout the testing process to prevent contact thermal resistance drift caused by loosening, attenuation, or offset; providing real-time pressure feedback to the heating control unit 11 for subsequent contact thermal resistance calculation and automatic power compensation; and ensuring that the interface conditions are completely consistent for each test, improving data repeatability and comparability.
[0061] Furthermore, ultra-thin film or distributed pressure sensors 4 can be used to avoid affecting interface flatness and heat transfer. Depending on the size of the direct-cooling plate 2 under test, a single-point central arrangement or a multi-point symmetrical arrangement can be selected to accurately collect the true normal contact pressure across the entire interface between the contact-type simulated heat source 1, the thermally conductive gel 8, and the direct-cooling plate 2 under test. The pressure sensor 4 signal is connected to the heating control unit 11 via a shielded cable, enabling real-time acquisition, uploading, digital display, and curve recording of pressure data through high-frequency sampling. Based on this, a pressure monitoring and safety protection program can be built into the heating control unit 11 as needed. This program provides alarms and protection against pressure abnormalities throughout the pressurization, stabilization, and testing processes. Simultaneously, the pressure data is used as a core feedback quantity to retrieve a pre-stored pressure-thermal resistance calibration curve to calculate the current contact thermal resistance, thereby achieving automatic compensation and correction of the output power of the zoned heating module 1.1. Ultimately, this allows for quantifiable, monitorable, traceable, and closed-loop control of the interface pressure, significantly improving the repeatability, stability, and thermal simulation fidelity of the test, and ensuring lateral comparability of data from multiple tests and different samples.
[0062] Example 7 This embodiment discloses a zoned controllable thermal simulation device for testing a direct cooling plate. As a preferred embodiment of the present invention, based on any one of embodiments 1 to 6, its heat generation control unit 11 includes a human-machine interface 11.2, a central controller 11.1, a multi-channel programmable power supply 11.4, and a data acquisition unit 11.3.
[0063] The human-machine interface 11.2 connects to the central controller 11.1. It can be an industrial touch screen or paired with PC host computer software, serving as the information interaction entry point between the operator and the entire thermal simulation system. It does not participate in the underlying power calculation and logic scheduling. The human-machine interface 11.2 is divided into dedicated function windows, supporting the input of core thermal simulation parameters such as thermal field distribution data, steady-state simulation power data, and transient simulation power data. After the operator completes the retrieval of historical battery pack heating data and / or parameter editing, they can execute thermal simulation control operations, such as issuing operation control commands for start, pause, data saving, and export. At the same time, the human-machine interface 11.2 retrieves the thermal simulation status data temporarily stored in the backend central controller 11.1, visually displaying electrical parameters such as voltage, current, and heating drive power of each output channel, as well as the heating temperature data of each zone heating module 1.1. It supports two viewing modes: matrix temperature list and simplified temperature cloud map. All parameters and commands are transmitted to the central controller via standardized communication lines.
[0064] The central controller 11.1 connects to the multi-channel programmable power supply 11.4. It can use an industrial embedded controller or a small PLC as the system's computational and scheduling core, and has built-in steady-state and transient simulation control programs, as well as a local thermal simulation operating condition database, supporting the storage of new operating conditions and the retrieval and matching of historical operating conditions. During the implementation of thermal simulation control, the thermal simulation parameters configured in the human-machine interface 11.2 are first analyzed to distinguish between steady-state and transient operating conditions, separating and buffering thermal field distribution data, steady-state simulation power data, and transient simulation power data. Then, based on the one-to-one binding relationship between each zone heating module 1.1 and the output channel, a multi-channel independent addressing matching mechanism is used to allocate power according to the thermal field distribution data, generating a dedicated digital power signal for each output channel (a constant power value corresponding to each zone heating module 1.1 under steady-state thermal field simulation; and a dynamic power value corresponding to each zone heating module 1.1 output by refreshing frame by frame at a fixed time step under transient thermal field simulation). Subsequently, all digital power signals are integrated to form a power output command, which is sent to the multi-channel programmable power supply 11.4, while simultaneously storing the thermal simulation status data.
[0065] The multi-channel programmable power supply 11.4 is a multi-channel electrically isolated independent output power supply with several independent output channels. Each output channel is matched one-to-one with a single-channel zone heating module 1.1, and is the core component for system power execution and local voltage and current regulation. The multi-channel programmable power supply 11.4 receives power output commands from the central controller 11.1, parses the digital power signals of each channel in the power output commands, decomposes them to obtain the target output power of each output channel, and matches the output heating drive power according to the drive channel ID to control the heating of the corresponding zone heating module 1.1. Each output channel collects its own output electrical parameters in real time, automatically compares them with the target power, and fine-tunes the output to offset the power deviation caused by cable voltage drop and small fluctuations in the resistance of the zone heating module 1.1, realizing independent closed-loop control of the heating drive power of each channel and ensuring the stability of the heating drive power of a single zone. At the same time, it continuously transmits the actual voltage, current, and heating drive power of each output channel back to the data acquisition unit 11.3 to provide raw electrical data for test data verification and operating condition recording.
[0066] The data acquisition unit 11.3 is connected to the central controller 11.1, the multi-channel programmable power supply 11.4, and the built-in temperature sensors of each zone heating module 1.1. It is also connected to the pressure sensor 4 mounted on the rigid base 5. It is responsible for processing and uploading the sensing signals, such as: performing noise reduction and filtering on the temperature and pressure analog signals and converting them into readable digital quantities; synchronously receiving the electrical parameters returned by the multi-channel programmable power supply 11.4; and uploading the data to the central controller 11.1 in real time after data aggregation. It also has a short-term local caching mechanism to avoid the problem of instantaneous signal loss and ensure that the temperature, interface bonding pressure, and power supply operation data are complete and traceable throughout the simulation process.
[0067] Based on the aforementioned structure of the heating control unit 11, the entire thermal simulation system operates in a clear and orderly manner: the operator creates or retrieves thermal simulation parameters through the human-machine interface 11.2 and issues a simulation start command; the central controller 11.1 parses the thermal simulation parameters and distinguishes the heating condition type, completes power allocation according to the unique device address, generates a power output command, and issues it to the multi-channel programmable power supply 11.4; each output channel of the multi-channel programmable power supply 11.4 independently outputs heating drive power to drive the corresponding heating module to heat up, and simultaneously collects its own output electrical parameters; the data acquisition unit 11.3 simultaneously collects the temperature, normal bonding pressure, and output channel electrical parameters of the full-area zone heating module 1.1 and continuously transmits them back; the central controller 11.1 summarizes all data and forwards it to the human-machine interface 11.2 for visualization display, and cyclically executes the power allocation and data acquisition process until the entire simulation process is completed or the operator issues a stop command.
[0068] Example 8 This embodiment discloses a zoned controllable thermal simulation method for testing a direct-cooling plate. As a preferred embodiment of the present invention, it employs any of the zoned controllable thermal simulation devices for testing direct-cooling plates described in embodiments 1-7. A high-fidelity simulation of the heat flow transferred from the battery pack to the direct-cooling plate 2 under test is achieved through a standardized process. Specifically, as follows... Figure 3 As shown, it includes the following steps: S1. After uniformly applying thermally conductive gel 8 to the heat exchange plate surface of the direct cooling plate 2 under test, the contact-type simulated heat source 1 is placed on the heat exchange plate surface of the direct cooling plate 2 under test. Specifically, according to the visible module number on the surface of the zone heating module 1.1, all zone heating modules 1.1 are attached to the heat exchange plate surface of the direct cooling plate 2 under test in a matrix arrangement according to the configuration of the current simulation. The purpose of applying thermally conductive gel 8 is to fill the microscopic uneven gaps between each zone heating module 1.1 and the direct cooling plate 2 under test, and to expel the air trapped in the contact interface, thereby reducing the initial contact thermal resistance of the contact interface. The orderly placement according to the visible module number ensures that each zone heating module 1.1 corresponds one-to-one with the output channel in the heating control unit 11, avoiding zone address confusion. The matrix arrangement completely matches the heat exchange plate surface structure of the direct cooling plate 2 under test, ensuring that the spatial distribution of the zone heating modules 1.1 matches the actual heat generation area from a structural perspective.
[0069] S2, using a bonding and pressure application device, a preset normal bonding pressure is applied to the contact-type simulated heat source 1 and the direct cooling plate 2 under test, forming a contact interface with constant (controllable and repeatable) contact thermal resistance. The contact thermal resistance between the zoned heating module 1.1 and the direct cooling plate 2 under test changes significantly with the bonding and pressure application force. Manual bonding lacks a uniform pressure standard, which can cause the heat exchange and temperature distribution data of the same direct cooling plate 2 to be inconsistent in multiple tests. By applying pressure uniformly through the bonding and pressure application device, the degree of contact interface compression can be fixed, and a stable heat transfer channel can be formed with the thermal conductive gel 8. Each test can reproduce a consistent contact interface heat transfer boundary, allowing for a basis for horizontal comparison of test results of different samples and batches.
[0070] S3. Based on the thermal simulation requirements for the full-area heat dissipation performance test of the direct cooling plate, the operator configures the thermal simulation parameters in the heat dissipation control unit 11. These parameters include steady-state simulated power data, transient simulated power data, and thermal field distribution data. The steady-state simulated power data can be used to simulate the continuous constant charging and discharging heat generation scenario of the battery pack. The transient simulated power data can be used to reproduce the dynamic heat generation process under fast charging and variable rate operation. The thermal field distribution data can distinguish the heat generation differences in areas such as the center, tabs, and edges of the battery pack. The heat dissipation control unit 11 has a built-in thermal simulation operating condition database, which can directly retrieve previously saved thermal simulation parameters. This eliminates the need to repeatedly enter all data; configuration can be completed by fine-tuning the values as needed, reducing repetitive operations.
[0071] S4, the thermal simulation control process is initiated through the heating control unit 11. Based on the steady-state and transient simulation control programs, the configured thermal simulation parameters are analyzed, and a multi-channel independent addressing matching mechanism is used to allocate and output the heating drive power corresponding to each zone heating module 1.1, controlling each zone heating module 1.1 to heat independently. The control logic distinguishes between steady-state and transient conditions: under steady-state thermal field simulation conditions, constant power is allocated directly based on the thermal field distribution data; under transient conditions, the timing power is refreshed at fixed time intervals, synchronously coupling the thermal field distribution data to update the output power of each zone in real time; the multi-channel programmable power supply 11.4 independently adjusts the output of each output channel in a closed loop to offset power fluctuations caused by line losses and resistance drift of the zone heating modules 1.1, ensuring that each zone heating module 1.1 can stably output the allocated target heat.
[0072] S5, under the control of the heat dissipation control unit 11, each zone heating module 1.1 simulates the uniform or non-uniform heating conditions of the battery pack under steady-state or transient conditions on the heat exchange plate surface of the direct cooling plate 2 under test (including steady-state heating conditions such as uniform heating across the entire area and concentrated high heat in local areas, as well as transient dynamic heating conditions with continuously changing power), matching the thermal simulation requirements of the direct cooling plate's overall heat dissipation performance test. Furthermore, the built-in temperature sensors of each zone heating module 1.1 continuously collect the surface temperature of the zones, the pressure sensor 4 on the rigid base 5 monitors the feedback interface clamping force (normal contact pressure), and the multi-channel programmable power supply 11.4 synchronously feeds back the output electrical parameters of each channel. All measured data are synchronously uploaded to the heat dissipation control unit 11 for storage. Operators can intuitively view the overall temperature gradient, hot spot locations, and regional temperature differences of the contact-type simulated heat source 1 through the human-machine interface 11.2 to determine whether the heating characteristics match those of the actual battery pack.
[0073] The entire method is designed around two core objectives: unified heat transfer boundary and accurate replication of battery pack heat generation. All control logic and assembly operations are based on measurable and calibrable physical parameters. Ordinary laboratory operators can complete the standardized test by following the steps, which effectively reduces human error and improves the repeatability and reliability of the heat dissipation performance test data of the direct cooling plate 2 under test.
[0074] Example 9 This embodiment discloses a zoned controllable thermal simulation method for testing direct-cooling plates. As a preferred embodiment of the present invention, based on embodiment 8, in S2, a preset normal bonding pressure is applied using a bonding and pressure-applying device. This is achieved through multi-layer structure superposition and multi-point synchronous pressure application, eliminating uneven pressure and localized loose bonding issues caused by manual bonding. This stabilizes the contact thermal resistance between the zoned heating module 1.1 and the direct-cooling plate 2 under test, ensuring uniform heat transfer boundary conditions for each test and improving the comparability of test data. Specifically, as follows... Figure 4 As shown, it includes the following steps: S21, the rigid base 5 of the pressure application device is placed stably on the test platform 10, and then the direct cooling plate 2 to be tested, which is equipped with the partition heating module 1.1, is placed on the rigid base 5 (or the direct cooling plate 2 to be tested can be placed first, and then the contact simulated heat source 1 can be laid). The rigid base 5 is made of high flatness rigid plate material, which has minimal deformation under pressure and can provide complete and flat support for the direct cooling plate 2 to be tested; with the positioning beam on the edge of the base, the lateral and longitudinal sliding of the direct cooling plate 2 to be tested can be restricted, avoiding the displacement of the direct cooling plate 2 to be tested during the pressurization process, and ensuring that the pressure is only applied perpendicularly to the contact surface between the partition heating module 1.1 and the direct cooling plate 2 to be tested, and that no interface gaps are generated due to the direct cooling plate 2 being suspended or deformed by local stress.
[0075] S22, thermal insulation cotton 9 is laid on the upper surface of the contact-type simulated heat source 1, so that the thermal insulation cotton 9 evenly covers all the zone heating modules 1.1. After the zone heating modules 1.1 are powered on and generate heat, there are two heat transfer paths, one upward and one downward. The heat transferred downward to the direct cooling plate 2 under test is the effective heat flow required for the test, while the heat lost upward to the air is ineffective heat loss. The thermal insulation cotton 9 has a low thermal conductivity, which can significantly block the upward convection and radiation heat dissipation of the heat source, reduce heat loss, avoid deviations in the heat exchange calculation of different batches of tests due to inconsistent upward heat dissipation loss, and improve the accuracy of heat measurement.
[0076] S23, the pressure equalizing plate 6 of the pressure application device is placed flat on the surface of the insulation cotton 9, so that the bolts 7.1 of each adjustable clamping unit 7 pass vertically upward through the reserved through holes of the pressure equalizing plate 6. The pressure equalizing plate 6 has overall rigidity, which can convert the single-point thread clamping force into uniform surface pressure; a small gap is reserved between the bolts 7.1 and the through holes of the pressure equalizing plate 6, so that the pressure equalizing plate 6 can float freely up and down without jamming or uneven wear with the bolts 7.1, ensuring that the downward pressing force is always vertically downward and will not generate lateral force to cause local pressure concentration.
[0077] S24, assemble adjusting nuts 7.2 onto the bolts 7.1 of each adjustable clamping unit 7; that is, assemble adjusting nuts 7.2 onto each bolt 7.1 in sequence, and pressurize the pressure equalizing plate 6 by rotating the adjusting nuts 7.2 downwards, simultaneously controlling the contact force between each zone heating module 1.1 and the direct cooling plate 2 to be tested, until the preset normal contact pressure is generated. The thread feed directly determines the downward stroke, and the operator can control the number of rotations of the adjusting nuts 7.2 to unify the clamping degree at each point. Furthermore, during assembly, follow the operation sequence of diagonal step-by-step pre-tightening and uniform locking around the perimeter to avoid tilting of the pressure equalizing plate 6 or localized insufficient pressure caused by tightening the adjusting nuts 7.2 on one side all at once.
[0078] The entire pressurization process is progressive, from bottom support and limiting, upper insulation and heat loss reduction, to rigid pressure equalization and multi-point synchronous pressure control. Each step addresses actual test interference factors such as interface heat transfer, pressure uniformity, and heat loss. The entire process relies on mechanical structure to achieve standardized operation, eliminating the need for manual judgment of the degree of compression and allowing for repeated reproduction of the same interface bonding conditions.
[0079] Furthermore, during the actual full-area heat dissipation performance test of the direct-cooling plate 2, the insulation cotton 9 was precisely cut according to the full-area contour of the contact-type simulated heat source 1, with the edges appropriately expanded to form a fully enclosed thermal seal. Simultaneously, through-holes were reserved for the thermocouple 3 leads and power supply lines to ensure smooth wiring and not affect the uniform transmission of pressure. For example... Figure 2 As shown, the thermocouples 3 are positioned above the contact-type simulated heat source 1 and below the direct cooling plate 2 under test. The specific positions are determined based on the actual test temperature required in the full-area heat dissipation performance test of the direct cooling plate 2 under test, and are unrelated to the thermal simulation of this application. The insulation cotton 9 can be made of flexible high-temperature resistant insulation material with a thermal conductivity ≤0.05W / (m·K) and small compression deformation, ensuring effective blocking of upward and convective heat loss from the partitioned heating module 1.1 to the surrounding area. This forces heat to be transferred unidirectionally to the direct cooling plate 2 under test only through the thermally conductive gel 8, highly replicating the real thermal environment of the battery pack's closed, insulated, and airless interior, significantly reducing the interference of airflow and temperature fluctuations in the laboratory environment on the test results, and improving the fidelity and data stability of the thermal simulation.
[0080] Example 10 This embodiment discloses a zoned controllable thermal simulation method for testing direct-cooling plates. As a preferred embodiment of the present invention, based on embodiment 9, it supplements the supporting operational logic of spring-assisted pressure control and real-time pressure monitoring. It utilizes the elastic deformation law of a standard spring to achieve pressure equalization at each pressure point, and uses pressure sensor 4 to confirm the contact pressure in real time. This completely eliminates the crude operation method of relying on manual judgment of the tightness, stabilizing the interface contact thermal resistance for each test. Specifically: In step S24, when assembling the adjusting nut 7.2 onto the bolts 7.1 of each adjustable clamping unit 7, it is necessary to first coaxially mount springs of identical specifications and stiffness parameters onto all bolts 7.1 before installing the adjusting nut 7.2. The springs are sandwiched between the adjusting nut 7.2 and the pressure equalizing plate 6. Rotating the adjusting nut 7.2 downwards will cause axial compression of the springs. According to Hooke's Law, the compression of the springs is linearly related to the output pressure. Since the stiffness of all springs is uniform, as long as the compression stroke of each spring is controlled to be consistent, the downward pressure output by each adjustable clamping unit 7 can be kept equal, avoiding excessive pressure at a single point or poor contact of the local heating module 1.1. Furthermore, the operator can measure the length of the springs to unify the compression of the springs at each point, thus initially completing the multi-point pressure equalization adjustment and reducing the workload of repeatedly fine-tuning the adjusting nut 7.2. The entire pressure application structure relies on the elastic buffer of spring components to avoid the sudden increase in pressure and local deformation of the plate caused by the hard pressing of the threads, so that the pressure equalizing plate 6 is subjected to force more gently, and the degree of fit between the full-area zone heating module 1.1 and the direct cooling plate 2 under test is consistent.
[0081] Throughout the assembly and pressurization process, pressure sensors 4 mounted on the rigid base 5 continuously collect pressure values and provide real-time feedback to the heating control unit 11. The pressure values collected by the pressure sensors 4 are equivalent to the actual clamping force (normal contact pressure) between each zone heating module 1.1 and the direct cooling plate 2 under test. Operators can fine-tune the adjusting nuts 7.2 by referring to the pressure readings on the human-machine interface 11.2 to stabilize the overall pressure at the preset test value. The pressure can also be continuously monitored during the simulation to prevent the adjusting nuts 7.2 from loosening or the springs from creeping, which would cause the clamping force to decrease and avoid the contact thermal resistance from drifting with pressure changes.
[0082] The aforementioned spring component pressure control and real-time pressure monitoring are integrated into the pressurization process. By combining quantitative pressure control through mechanical structure with numerical verification through electrical sensors, the originally ambiguous manual pressing operation is transformed into a quantifiable and reproducible standardized procedure. This eliminates the pressure dispersion problem caused by different operators and different test batches, ensures the uniformity of heat transfer boundary conditions in multiple tests, and improves the reliability of horizontal comparison of heat dissipation test data of the tested direct cooling plate 2.
[0083] Example 11 This embodiment discloses a zoned controllable thermal simulation method for testing a direct-cooling plate. As a preferred embodiment of the present invention, based on any one of embodiments 8-10, in step S3, the thermal simulation parameters are configured as follows: Figure 5 As shown, it includes the following steps: S31, the operator fills in the key search parameters in the index window of the human-machine interface 11.2 and initiates a query command for historical thermal simulation parameters. The key search parameters mainly include information such as battery pack model and heating condition type; among them, the battery pack model is used to distinguish battery products with different capacities and cell layout schemes, and the heating condition type distinguishes heating scenarios such as steady-state thermal field simulation and transient thermal field simulation. The combination of two or more key parameters can accurately locate the complete set of thermal simulation parameters already stored in the database and avoid confusion in search results.
[0084] In step S32, after receiving the query command, the central controller 11.1 automatically traverses the locally built-in thermal simulation condition database, matches key parameters, and determines whether corresponding battery pack heating data exists. The thermal simulation condition database groups and stores thermal simulation parameters using key parameters such as battery pack model and heating condition type as indexes. The retrieval logic only performs precise matching and does not automatically generate or correct parameters. If no matching battery pack heating data is found, the process jumps to step S33; if the corresponding battery pack heating data is successfully retrieved, the process jumps to step S34.
[0085] In step S33, the operator opens the battery pack heat dissipation data creation window on the human-machine interface 11.2. Based on the actual thermal simulation requirements for the full-area heat dissipation performance test of the direct cooling plate, the operator enters and retrieves key parameters and the complete set of thermal simulation parameters one by one. After the data entry is completed, the central controller 11.1 performs basic verification on the parameter format and numerical range, eliminating erroneous values that are obviously outside the reasonable range. After verification, the key parameters are bound to the thermal simulation parameters to generate a complete set of battery pack heat dissipation data, which is then saved to the thermal simulation operating condition database. After archiving, the system returns to step S31, allowing the operator to retrieve the set of operating conditions again.
[0086] S34, confirm the selected battery pack heating data that matches the key parameters, and load the thermal simulation parameters from the battery pack heating data into the thermal simulation data list in the human-machine interface 11.2 through data reuse. The operator can adjust or directly reuse the data in the thermal simulation data list according to the actual thermal simulation requirements of the direct cooling plate full-area heat dissipation performance test. After the parameters are confirmed and saved, the thermal simulation parameter configuration for this test is completed. There is no need to enter all the operating condition data from scratch, which greatly shortens the time spent on operating condition setup.
[0087] The entire parameter configuration process adopts the logic of retrieval reuse and new archiving. It relies on the local thermal simulation operating condition database to achieve long-term retention of operating condition parameters. When conducting multiple batches of tests on the same model of battery pack using the direct cooling plate 2, there is no need to repeatedly build the thermal field and power parameters, reducing the input error caused by manual repetitive operations. All parameter input, storage, and retrieval processes are based on the measured heat generation data of the battery pack. The parameters are traceable and modifiable, adapting to the needs of repeated iterative testing in the laboratory.
[0088] Example 12 This embodiment discloses a zoned controllable thermal simulation method for testing a direct-cooling plate. As a preferred embodiment of the present invention, based on any one of embodiments 8 to 11, in step S3: Steady-state simulation power data includes the total steady-state heat generation power of the battery pack and the steady-state simulation duration. The total steady-state heat generation power corresponds to the average heat generation level of the battery pack during long-term constant-rate charging and discharging, while the steady-state simulation duration sets the continuous running time of a single steady-state test. This set of parameters is mainly used to conduct calibration tests on the long-term uniform temperature performance and stable heat transfer capacity of the tested direct-cooling plate 2, simulating the normal operating conditions of continuous constant-power heat generation of the battery pack.
[0089] The core carrier of transient simulation power data is the dynamic power time-series curve of the battery pack's transient heating. The dynamic power time-series curve records the equivalent net heat power output by the battery pack at different times, which is used to restore the dynamic scenarios of continuous changes in heat generation power such as fast charging, variable rate, and intermittent charging and discharging, so as to adapt to the transient thermal response and short-term hot spot impact related performance tests of the direct cooling plate under test.
[0090] The thermal field distribution data uses a spatial power distribution matrix corresponding to the matrix arrangement structure of each zone heating module 1.1. Each element in the spatial power distribution matrix corresponds to the power allocation weight of a single zone heating module 1.1. It is constructed in two ways: for uniform thermal field simulation, the spatial power distribution matrix is a one-matrix matrix with all elements assigned a value of 1, and the output power of each zone is completely equal; for non-uniform thermal field simulation, the grid projection average discretization method, the region block integral discretization method, or the pixel grayscale quantitative discretization method can be used to analyze the battery pack thermal simulation temperature distribution cloud map output by the CFD simulation (e.g., ...). Figure 6 The temperature cloud map (as shown) is discretized to complete the assignment of partition weights. The preferred method is the grid projection average discretization method, which divides the temperature cloud map into grids according to the size of the partitioned heating module 1.1, and normalizes the average temperature of a single grid to generate weights. The regional block integration discretization method divides the battery pack thermal simulation temperature distribution cloud map into regions according to the structure of cells, tabs, and edges, and calculates the equivalent heat generation level of each partition through area integration, weakening single-point temperature errors and highlighting the weights of local hot spots. The pixel grayscale quantitative discretization method converts the battery pack thermal simulation temperature distribution cloud map into a grayscale image, and calculates the weights by statistically analyzing the pixel mean in blocks. All three discretization methods rely on conventional thermal simulation post-processing tools or general image processing software such as Fluent, STAR-CCM+, and Icepak. The output weight values can be directly imported into the heating control unit 11 to form a spatial power distribution matrix, without the need for additional custom virtual algorithms. The discretization process is reproducible, and the weight values are traceable, ensuring the uniformity of the thermal field boundaries in multiple tests.
[0091] Example 13 This embodiment discloses a zoned controllable thermal simulation method for testing direct-cooling plates. As a preferred embodiment of the present invention, based on embodiment 12, in step S4: When the heating condition is a steady-state thermal field simulation, the central controller 11.1 retrieves the steady-state simulation power data and the spatial power distribution matrix to perform calculations: first, it reads the total steady-state heating power of the battery pack, then sums the values of all elements in the spatial power distribution matrix, and divides the total steady-state heating power by the sum of the elements to obtain the unit power; the unit power is multiplied by each element in the spatial power distribution matrix to generate a constant digital power signal corresponding to each zone heating module 1.1, and after integrating all the digital power signals, a power output command is sent to the multi-channel programmable power supply 11.4. The multi-channel programmable power supply 11.4 independently analyzes the constant power value for each output channel, enabling each output channel to continuously output stable heating power, thereby achieving a uniform or non-uniform (zone-differentiated) steady-state thermal field under long-term constant charging and discharging scenarios of the battery pack.
[0092] When the heating condition is a transient thermal field simulation, the central controller 11.1 synchronously calls the spatial power distribution matrix and the dynamic power time-series curve. Using a coupled computation mechanism with fixed-time-slice rolling refresh, it extracts the instantaneous equivalent thermal power value from the dynamic power time-series curve at uniform time intervals. Following the element allocation calculation logic of the spatial power distribution matrix in steady-state thermal field simulation, it divides the instantaneous total power according to the spatial power distribution matrix elements, updating the dynamic digital power signal corresponding to each partition frame by frame. After each frame of numerical calculation is completed, a new power output command is immediately issued to the multi-channel programmable power supply 11.4. The output channels of the multi-channel programmable power supply 11.4 respond to power changes in real time, dynamically adjusting the output voltage and current. Simultaneously, it suppresses power deviations caused by line losses and resistance drift of the partition heating modules 1.1 through closed-loop control, thereby reproducing continuously changing thermal shock conditions such as fast charging, variable rate operation, and intermittent charging and discharging.
[0093] Both heating conditions share the same spatial power distribution matrix, distinguishing only by the input form of the total power: steady-state is a fixed, constant total power, while transient is a time-series total power that changes continuously over time. The underlying computational allocation logic is unified, facilitating operators to switch between steady-state and transient tests within the same partitioned layout without needing to readjust the heat source arrangement or matrix parameters, thus reducing the operational costs of switching conditions. The entire power generation process is based solely on imported measured / simulated heat generation data, and the output power is matched with the heat flow transferred from the battery pack to the direct-cooling plate 2 under test.
[0094] Example 14 This embodiment discloses a zoned controllable thermal simulation method for testing a direct-cooling plate. As a preferred embodiment of the present invention, based on Embodiment 12 or 13, its dynamic power time-series curve is completed based on the battery pack simulation and measured basic thermal parameters. The heat absorption component of the cell's own heat capacity is removed from the total heat generation of the original battery pack, resulting in the equivalent net heat power borne only by the direct-cooling plate 2 under test. This solves the problem of simulated heat flow lag and amplitude distortion caused by directly using the total heat generation curve of the battery pack. Specifically: The instantaneous total heat generation curve of the battery pack under set operating conditions can be obtained by experimental simulation (such as electrochemical-thermal coupling simulation calculation based on existing physics simulation software) or by actual measurement and calibration of the battery pack's charge and discharge temperature rise. Synchronous acquisition of battery pack data over time Real-time temperature changes Combined with the quality of the battery pack Average constant-pressure specific heat capacity of the battery pack The power absorption curve of the battery pack due to its own temperature rise was obtained by differential calculation. The calculation formula is: In the formula This indicates the rate of temperature rise of the battery pack.
[0095] This represents the heat stored due to the temperature rise of the battery pack itself. This heat is not transferred to the direct cooling plate 2 under test; it is only stored inside the cells and casing. If the heating power is directly included, it will cause the simulated heat load to be too large and the thermal response to be lagging. Therefore, a thermal balance difference calculation is performed. According to the law of conservation of heat, the total heat generated by the battery pack is divided into two parts: one part is absorbed by the battery pack body for temperature rise, and the other part is transferred to the direct cooling plate 2 under test. Therefore, the difference calculation is used to remove the heat capacity buffer term to obtain the equivalent heat source power curve. The calculation formula is: The equivalent heat source power curve This represents the net heat dissipation that the tested direct cooling plate 2 needs to remove at any given moment, completely eliminating the thermal hysteresis effect caused by the battery's thermal capacity.
[0096] Equivalent heat source power curve As a dynamic power timing curve, the heat dissipation control unit 11 is incorporated into the transient coupling calculation to filter out the self-buffering effect of the battery's heat capacity and directly reflect the heat that needs to be dissipated in time by the direct cooling plate 2 under test. This dynamic power timing curve is a discrete array with a one-to-one correspondence between time and power. It can be directly coupled and split with the spatial power distribution matrix according to fixed time slices, and the output power of the corresponding output channel of each zone heating module 1.1 is updated in time-division. This accurately reproduces dynamic thermal shock conditions such as fast charging, rate switching, and intermittent charging and discharging, improving the data authenticity and benchmarking value of transient heat dissipation tests.
Claims
1. A zoned controllable thermal simulation device for testing direct-cooling plates, characterized in that: It includes a contact-type simulated heat source (1), a pressure application device, and a heat control unit (11). The contact-type simulated heat source (1) includes several partitioned heating modules (1.1) arranged in a matrix. Each partitioned heating module (1.1) is attached to the heat exchange plate surface of the direct cooling plate (2) to be tested through thermal conductive gel (8). The bonding pressure device is used to apply normal bonding pressure to each zone heating module (1.1) and the direct cooling plate (2) to be tested, and in conjunction with the thermal conductive gel (8), a contact interface with constant contact thermal resistance is formed between each zone heating module (1.1) and the direct cooling plate (2) to be tested; Each zone heating module (1.1) is insulated from each other and electrically connected to the heat dissipation control unit (11); the heat dissipation control unit (11) has a built-in steady-state and transient simulation control program, and binds a unique device address and drive channel ID to each zone heating module (1.1), and uses a multi-channel independent addressing matching mechanism to allocate and output the heat dissipation drive power corresponding to each zone heating module (1.1) in order to control each zone heating module (1.1) to heat independently, so that all zone heating modules (1.1) cooperate to simulate the uniform or non-uniform heat dissipation conditions of the battery pack under steady-state or transient conditions, and match the thermal simulation requirements of the full-area heat dissipation performance test of the direct cooling plate.
2. The zoned controllable thermal simulation device for testing a direct-cooling plate as described in claim 1, characterized in that: The heat control unit (11) includes a human-machine interface (11.2), a central controller (11.1), a multi-channel programmable power supply (11.4), and a data acquisition unit (11.3). The human-machine interface (11.2) is connected to the central controller (11.1) and is used to configure thermal simulation parameters, execute thermal simulation control operations, and display thermal simulation status data. The thermal simulation parameters include steady-state simulation power data, transient simulation power data, and thermal field distribution data. The thermal simulation status data includes the electrical parameters of each output channel of the multi-channel programmable power supply (11.4) and the heating temperature of each zone heating module (1.1). The central controller (11.1) is connected to a multi-channel programmable power supply (11.4). Based on the built-in steady-state and transient simulation control program, it analyzes the configured thermal simulation parameters, combines the unique device address of each zone heating module (1.1) with the multi-channel independent addressing matching mechanism, generates several digital power signals that correspond one-to-one with each zone heating module (1.1), and issues a power output command containing all digital power signals. The multi-channel programmable power supply (11.4) is equipped with several independent output channels, and each zone heating module (1.1) is connected to the output channel one by one. It is used to parse the digital power signals in the power output command and output the heating drive power of each zone heating module (1.1) according to the drive channel ID. The data acquisition unit (11.3) is connected to the built-in temperature sensors of the central controller (11.1), the multi-channel programmable power supply (11.4), and each zone heating module (1.1) to collect the thermal simulation status data in real time and temporarily store the thermal simulation status data in the central controller (11.1) for the human-machine interface (11.2) to call.
3. The zoned controllable thermal simulation device for testing a direct-cooling plate as described in claim 1, characterized in that: Each zone heating module (1.1) is printed with a visual module number, which corresponds to the unique device address of the zone heating module (1.1).
4. The zoned controllable thermal simulation device for testing a direct-cooling plate as described in claim 1, characterized in that: The partitioned heating module (1.1) is a PI film heating element or a silicone rubber heating element.
5. The zoned controllable thermal simulation device for testing a direct-cooling plate as described in claim 1, characterized in that: The bonding and pressure application device includes a rigid base (5), a pressure equalizing plate (6), and several adjustable pressing units (7). The rigid base (5) is provided with a placement area for the direct cooling plate (2) to be tested. The rigid base (5) is provided with a number of positioning mounting holes around the placement area of the direct cooling plate (2) to be tested. Each positioning mounting hole corresponds to each adjustable clamping unit (7). The adjustable clamping unit (7) includes a bolt (7.1) and an adjusting nut (7.2); the bottom of the bolt (7.1) is fixedly connected to the rigid base (5) through a corresponding positioning mounting hole, and the top of the bolt (7.1) vertically penetrates the pressure equalizing plate (6) and forms a detachable threaded transmission pair with the adjusting nut (7.2); by rotating the adjusting nut (7.2), pressure is applied to the pressure equalizing plate (6), and all the adjustable clamping units (7) cooperate to apply pressure to the pressure equalizing plate (6) in the normal direction and adjust the pressure.
6. The zoned controllable thermal simulation device for testing a direct-cooling plate as described in claim 5, characterized in that: An edge positioning beam is provided on the upper surface of the rigid base (5) along the edge of the placement area of the straight cooling plate (2) to be tested, and the positioning mounting hole is opened on the edge positioning beam.
7. The zoned controllable thermal simulation device for testing a direct-cooling plate as described in claim 5, characterized in that: The adjustable clamping unit (7) also includes a spring; the spring is coaxially sleeved outside the bolt (7.1) and located between the adjusting nut (7.2) and the pressure equalizing plate (6), and is used to control the pressure applied by the adjustable clamping unit (7) to the pressure equalizing plate (6) according to its compression amount.
8. The zoned controllable thermal simulation device for testing a direct-cooling plate as described in claim 5, characterized in that: A pressure sensor (4) is provided on the rigid base (5); the pressure sensor (4) is electrically connected to the heating control unit (11) and is used to collect and feedback the normal pressure applied by the bonding pressure device to each zone heating module (1.1) and the direct cooling plate (2) to be tested. The normal pressure is equivalent to the normal bonding pressure.
9. A zoned controllable thermal simulation method for testing a direct-cooling plate, characterized in that: The following steps are performed using the zoned controllable thermal simulation device for direct-cooling plate testing as described in any one of claims 1-8: S1, After uniformly applying thermal conductive gel (8) to the heat exchange plate surface of the direct cooling plate (2) to be tested, place the contact simulated heat source (1) on the heat exchange plate surface of the direct cooling plate (2) to be tested. S2, using the bonding pressure device to apply a preset normal bonding pressure to the contact simulated heat source (1) and the direct cooling plate (2) to be tested, forming a contact interface with constant contact thermal resistance; S3, according to the thermal simulation requirements of the full-area heat dissipation performance test of the direct cooling plate, thermal simulation parameters are configured in the heat dissipation control unit (11); the thermal simulation parameters include steady-state simulation power data, transient simulation power data and thermal field distribution data; S4, the thermal simulation control process is started through the heating control unit (11), the configured thermal simulation parameters are analyzed based on the steady state and transient simulation control program, and the heating drive power corresponding to each zone heating module (1.1) is allocated and output using a multi-way independent addressing matching mechanism, so as to control the independent heating of each zone heating module (1.1); S5, under the control of the heating control unit (11), each zone heating module (1.1) simulates the uniform or non-uniform heating conditions of the battery pack under steady state or transient state on the heat exchange plate surface of the direct cooling plate (2) to be tested, matching the thermal simulation requirements of the full-domain heat dissipation performance test of the direct cooling plate.
10. The partitioned controllable thermal simulation method for testing a direct-cooling plate as described in claim 9, characterized in that: In S1, when the contact-type simulated heat source (1) is arranged on the heat exchange plate surface of the direct cooling plate (2) to be tested, the arrangement position of the corresponding partition heating module (1.1) is determined according to the visible module number printed on the partition heating module (1.1), so that all partition heating modules (1.1) are arranged in a matrix on the heat exchange plate surface of the direct cooling plate (2) to be tested.
11. The partitioned controllable thermal simulation method for testing a direct-cooling plate as described in claim 9, characterized in that: In S2, the bonding pressure device includes a rigid base (5) and a pressure equalizing plate (6); the rigid base (5) is provided with a placement area for the direct cooling plate (2) to be tested, and a number of adjustable clamping units (7) are provided around the placement area; the adjustable clamping unit (7) includes a bolt (7.1) and an adjusting nut (7.2); the bottom of the bolt (7.1) is fixedly connected to the rigid base (5), and the top of the bolt (7.1) and the adjusting nut (7.2) form a detachable threaded transmission pair; applying a preset normal bonding pressure to the contact simulated heat source (1) and the direct cooling plate (2) to be tested using the bonding pressure device includes the following steps: S21, place the rigid base (5) of the pressure application device on the test platform (10), and then place the direct cooling plate (2) to be tested with the partition heating module (1.1) on the rigid base (5); S22, heat insulation cotton (9) is laid on the upper surface of the contact simulated heat source (1) so that the heat insulation cotton (9) evenly covers all the partition heating modules (1.1). S23, place the pressure equalizing plate (6) of the pressure application device on the insulation cotton (9) so that the bolts (7.1) of each adjustable clamping unit (7) pass vertically through the pressure equalizing plate (6). S24, assemble adjusting nuts (7.2) on the bolts (7.1) of each adjustable clamping unit (7); during this period, apply pressure to the equalizing plate (6) by rotating each adjusting nut (7.2) to uniformly control the pressing force between the contact simulated heat source (1) and the direct cooling plate (2) to be tested, until the preset normal bonding pressure is generated.
12. The partitioned controllable thermal simulation method for testing a direct-cooling plate as described in claim 11, characterized in that: In step S24, when assembling the adjusting nut (7.2) on the bolt (7.1) of each adjustable clamping unit (7), it also includes fitting a spring with known stiffness and the same model on all bolts (7.1), and compressing the spring after rotating the adjusting nut (7.2). The pressure applied by the adjustable clamping unit (7) to the pressure equalizing plate (6) is controlled according to the amount of compression, so that the pressure applied by each adjustable clamping unit (7) to the pressure equalizing plate (6) is the same; the normal contact pressure is monitored by the pressure sensor (4) set on the rigid base (5).
13. The partitioned controllable thermal simulation method for testing a direct-cooling plate as described in claim 9, characterized in that: In S3, the heat control unit (11) is equipped with a human-machine interface (11.2) and a central controller (11.1). Configuring the thermal simulation parameters includes the following steps: S31, enter the key parameters in the index window of the human-machine interface (11.2) and initiate the historical thermal simulation parameter query command; the key parameters include battery pack model and heating condition type; S32, the central controller (11.1) traverses the built-in thermal simulation condition database according to the query instruction and determines whether there is battery pack heating data that matches the key parameters in the thermal simulation condition database; if not, proceed to S33; if yes, proceed to S34. S33, open the new window for battery pack heat dissipation data through the human-machine interface (11.2), input key parameters and thermal simulation parameters according to the thermal simulation requirements of the actual direct cooling plate full-area heat dissipation performance test, the central controller (11.1) binds the key parameters and thermal simulation parameters to generate battery pack heat dissipation data, and saves the battery pack heat dissipation data to the thermal simulation working condition database, and returns to S31; S34, confirm the selection of battery pack heating data that matches the key parameters, and load the thermal simulation parameters in the battery pack heating data into a thermal simulation data list presented on the human-machine interface (11.2) by data reuse; the operator adjusts or directly reuses the data in the thermal simulation data list according to the actual thermal simulation requirements of the direct cooling plate full-area heat dissipation performance test, thus completing the thermal simulation parameter configuration.
14. The partitioned controllable thermal simulation method for testing a direct-cooling plate as described in claim 13, characterized in that: In S3, the steady-state simulation power data includes the total steady-state heating power of the battery pack and the steady-state simulation duration; the transient simulation power data includes the dynamic power time-series curve of the transient heating of the battery pack; the thermal field distribution data adopts the spatial power distribution matrix corresponding to the arrangement structure of each zone heating module (1.1). The spatial power distribution matrix of uniform thermal field simulation is a one matrix, and the spatial power distribution matrix of non-uniform thermal field simulation is established according to the weight of the thermal field distribution area of the battery pack heating.
15. The partitioned controllable thermal simulation method for testing a direct-cooling plate as described in claim 14, characterized in that: In S4, the output of heating drive power corresponding to each zone heating module (1.1) is realized by configuring a multi-channel programmable power supply (11.4) in the heating control unit (11); wherein: when the heating condition type is steady-state thermal field simulation, the central controller (11.1) loads the spatial power distribution matrix, performs constant power distribution to each zone heating module (1.1) according to the steady-state total heating power, generates a power output command containing several constant digital power signals, and controls the multi-channel programmable power supply (11.4) to complete the constant power output corresponding to each zone heating module (1.1); when the heating condition type is transient thermal field simulation, the central controller (11.1) synchronously loads the spatial power distribution matrix and the dynamic power timing curve, refreshes the calculation with a fixed time slice, couples the dynamic power timing curve with the spatial power distribution matrix, generates a power output command containing several dynamic digital power signals, and controls the multi-channel programmable power supply (11.4) in the heating control unit (11) to complete the dynamic power output corresponding to each zone heating module (1.1).
16. The partitioned controllable thermal simulation method for testing a direct-cooling plate as described in claim 14, characterized in that: The method for obtaining the dynamic power timing curve is as follows: The instantaneous total heat generation curve of the battery pack under set operating conditions was obtained through experimental simulation. Simultaneously, the power absorption curve of the battery pack due to its own temperature rise was obtained. ;in, ; Indicates the mass of the battery pack. This indicates the average constant-pressure specific heat capacity of the battery pack; This indicates the rate of temperature rise of the battery pack. Indicates temperature. Indicates time; Based on power curve and power curve The equivalent heat source power curve was calculated. ,Right now ; Equivalent heat source power curve This serves as the dynamic power timing curve.
Citation Information
Patent Citations
Liquid cooling plate performance detection device and detection method using battery heat source simulation system
CN118913747A