Method, device and equipment for regulating cooling water flow, and storage medium

Abstract

The disclosure provides a cooling water flow regulation method, device, equipment and storage medium. The regulation method comprises: obtaining a current grinding tooth height parameter of a grinding wheel; obtaining a current processing state parameter of a grinding equipment, wherein the current processing state parameter at least comprises a parameter representing a grinding load state; obtaining a preset mapping relationship between the current grinding tooth height parameter, the current processing state parameter and a target cooling water flow; determining the target cooling water flow based on the current grinding tooth height parameter, the current processing state parameter and the preset mapping relationship; and adjusting the cooling water flow in a cooling water supply path based on the target cooling water flow. The regulation method can dynamically match the cooling water flow with the grinding wheel wear state and the processing load state, and improve the problems of insufficient cooling and excessive lubrication.

Description

Technical Field

[0001] This disclosure relates to the field of semiconductor polishing technology, and more specifically, to a method, apparatus, device, and storage medium for adjusting cooling water flow rate. Background Technology

[0002] In double-sided vertical grinding of silicon wafers, two opposing grinding wheels simultaneously process both sides of the wafer. To dissipate grinding heat and remove grinding debris, cooling water is typically supplied continuously to the grinding zone during the grinding process to suppress thermal deformation of the silicon wafer and ensure overall flatness, warpage, and surface quality after processing. As the grinding wheels continue to be used, the height of the grinding teeth on the wheel surface gradually decreases due to wear, and the flow and thermal characteristics of the grinding zone also change accordingly.

[0003] Currently, the industry standard for cooling the grinding zone and removing grinding debris is to continuously supply a constant flow of cooling water to the grinding zone. This method delivers cooling water to the grinding zone between the opposing grinding wheel and the silicon wafer surface via a cooling water supply path, maintaining a constant cooling water flow rate throughout the processing. This method has fewer control parameters, a simple water supply path structure, and can maintain basic cooling and chip removal functions even under conditions where the grinding wheel's condition changes little, thus it is widely used.

[0004] However, this method is prone to alternating periods of insufficient cooling and excessive lubrication during the polishing process, affecting the overall flatness, warpage, and surface quality of the silicon wafer. Therefore, how to improve the balance between insufficient cooling and excessive lubrication in double-sided vertical polishing equipment for silicon wafers has become a pressing technical problem to be solved in this field. Summary of the Invention

[0005] To address the aforementioned technical problems, this disclosure provides a method, apparatus, equipment, and storage medium for regulating cooling water flow rate.

[0006] The first aspect of this disclosure provides a method for adjusting the cooling water flow rate of a vertical grinding apparatus for double-sided silicon wafers. The grinding apparatus includes grinding wheels for grinding both sides of the silicon wafer and a cooling water supply path for supplying cooling water to the grinding area. The adjustment method includes: acquiring the current grinding tooth height parameter of the grinding wheel; acquiring the current processing state parameter of the grinding apparatus, wherein the current processing state parameter includes at least a parameter characterizing the grinding load state; acquiring a preset mapping relationship between the current grinding tooth height parameter, the current processing state parameter, and the target cooling water flow rate; determining the target cooling water flow rate based on the current grinding tooth height parameter, the current processing state parameter, and the preset mapping relationship; and adjusting the cooling water flow rate in the cooling water supply path based on the target cooling water flow rate.

[0007] In one specific embodiment of the first aspect of this disclosure, obtaining the preset mapping relationship between the current grinding height parameter, the current processing state parameter, and the target cooling water flow rate includes: acquiring multiple sets of process test data, wherein each set of process test data includes at least historical grinding height parameters, historical processing state parameters, historical cooling water flow rate, and historical grinding effect data; using the historical grinding effect data as constraints, inversely solving for the target cooling water flow rate corresponding to the historical grinding height parameter and historical processing state parameter conditions, wherein the historical cooling water flow rate serves as a reference benchmark for inverse solving; and establishing a multidimensional flow control map based on the historical grinding height parameter, the historical processing state parameter, and the target cooling water flow rate obtained through inverse solving, wherein the multidimensional flow control map is used to characterize the correspondence between the input parameter set composed of the grinding height parameter and the processing state parameter and the target cooling water flow rate.

[0008] In one specific embodiment of the first aspect of this disclosure, the target cooling water flow rate is determined based on the current grinding height parameter, the current machining state parameter, and a preset mapping relationship, including: using the current grinding height parameter and the current machining state parameter as indexes, performing a lookup table or interpolation in a multi-dimensional flow control graph to obtain the target cooling water flow rate.

[0009] In one specific embodiment of the first aspect of this disclosure, the multidimensional flow control map is stored as a continuous function expression or a data model capable of continuous interpolation between multiple calibration operating points.

[0010] In one specific embodiment of the first aspect of this disclosure, the multidimensional flow control map includes multiple cooling water flow data sets corresponding to multiple grinding load levels, and in at least one cooling water flow data set, the target cooling water flow rate change rate corresponding to adjacent grinding tooth height intervals is different.

[0011] In one specific embodiment of the first aspect of this disclosure, determining the target cooling water flow rate based on the current grinding height parameter, the current processing state parameter, and a preset mapping relationship includes: determining a basic target flow rate based on the current grinding height parameter, the current processing state parameter, and the preset mapping relationship; obtaining a current load parameter from the current processing state parameter, wherein the current load parameter is used to reflect the current load state of the grinding equipment; obtaining a reference load parameter and determining the change in the current load parameter relative to the reference load parameter; when the change does not exceed a preset threshold, determining the basic target flow rate as the target cooling water flow rate; when the change exceeds the preset threshold, determining an enhanced target flow rate greater than the basic target flow rate as the target cooling water flow rate within the current grinding cycle.

[0012] In one specific embodiment of the first aspect of this disclosure, the enhanced target traffic is determined by a first formula, which is: ,in, To enhance target traffic, Based on the target traffic, This represents the change in current load parameters relative to reference load parameters. For reference load parameters, This is the preset enhancement coefficient.

[0013] In one specific embodiment of the first aspect of this disclosure, the current load parameter is the current spindle torque, the reference load parameter is the maximum spindle torque of the previous grinding cycle, and the preset threshold is a preset proportion of the maximum spindle torque of the previous grinding cycle.

[0014] In one specific embodiment of the first aspect of this disclosure, the adjustment method further includes: reacquiring the current load parameters in a subsequent grinding cycle; and determining whether to maintain the target cooling water flow rate of the previous grinding cycle or to redetermine the target cooling water flow rate based on whether the change in the reacquiring current load parameters relative to the reference load parameters exceeds a preset threshold.

[0015] In one specific embodiment of the first aspect of this disclosure, the current processing state parameters include parameters characterizing the grinding load state and the grinding wheel speed, wherein the parameters characterizing the grinding load state include at least one of spindle torque, spindle current, spindle power, grinding pressure, vibration parameters, acoustic emission parameters, or grinding zone temperature.

[0016] In one specific embodiment of the first aspect of this disclosure, the historical grinding effect data includes at least one of warpage, curvature, and surface quality parameters.

[0017] A second aspect of this disclosure provides a device for adjusting the cooling water flow rate of a vertical grinding machine for double-sided silicon wafers. The grinding machine includes grinding wheels for grinding both sides of the silicon wafer and a cooling water supply path for supplying cooling water to the grinding area. The adjustment device includes a first acquisition module, a second acquisition module, a third acquisition module, a determination module, and an execution module. The first acquisition module is configured to acquire the current grinding tooth height parameter of the grinding wheel. The second acquisition module is configured to acquire the current processing state parameter of the grinding machine, wherein the current processing state parameter includes at least a parameter characterizing the grinding load state. The third acquisition module is configured to acquire a preset mapping relationship between the current grinding tooth height parameter, the current processing state parameter, and the target cooling water flow rate. The determination module is configured to determine the target cooling water flow rate based on the current grinding tooth height parameter, the current processing state parameter, and the preset mapping relationship. The execution module is configured to adjust the cooling water flow rate in the cooling water supply path based on the target cooling water flow rate.

[0018] A third aspect of this disclosure provides a computing device including a processor and a memory, the processor being configured to execute instructions stored in the memory to implement the adjustment method described in the first aspect above.

[0019] The fourth aspect of this disclosure provides a computer storage medium storing at least one instruction, which is executed by a processor to implement the adjustment method of the first aspect described above.

[0020] The cooling water flow rate adjustment method provided in this disclosure obtains the current grinding tooth height parameter of the grinding wheel and the current processing state parameter, which includes at least parameters characterizing the grinding load state. Based on the preset mapping relationship between the current grinding tooth height parameter, the current processing state parameter and the target cooling water flow rate, the target cooling water flow rate is determined. Then, the cooling water flow rate in the cooling water supply path is adjusted based on the target cooling water flow rate, so that the cooling water supply can be dynamically matched with the wear state of the grinding wheel and the grinding load state. This avoids the problems of insufficient cooling and excessive lubrication caused by constant water supply before and after grinding tooth wear, thereby reducing silicon wafer thermal warpage and hydrolubrication effect and improving grinding uniformity. Attached Figure Description

[0021] Figure 1 This is a schematic flowchart illustrating a method for adjusting cooling water flow rate according to an embodiment of the present disclosure.

[0022] Figure 2 This is a partial flowchart illustrating a method for adjusting cooling water flow rate according to an embodiment of the present disclosure.

[0023] Figure 3 This is a schematic flowchart illustrating another method for adjusting cooling water flow rate according to an embodiment of the present disclosure.

[0024] Figure 4 This is a partial flowchart illustrating a method for adjusting cooling water flow rate according to an embodiment of the present disclosure.

[0025] Figure 5 This is a partial flowchart illustrating a method for adjusting cooling water flow rate according to an embodiment of the present disclosure.

[0026] Figure 6 A schematic diagram of a cooling water flow rate adjustment device for a double-sided vertical grinding equipment for silicon wafers, provided as another embodiment of this disclosure.

[0027] Figure 7 A schematic block diagram of a computing device provided in an embodiment of this disclosure. Detailed Implementation

[0028] The technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this disclosure, and not all embodiments. Based on the embodiments of this disclosure, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this disclosure.

[0029] In double-sided vertical grinding of silicon wafers, a common practice to achieve cooling and debris removal in the grinding zone is to continuously supply a constant flow of cooling water. The basic principle of this approach is that the cooling water flows through the grooves and teeth of the grinding wheel, carrying away grinding heat and removing grinding debris particles from the grinding zone. However, when this approach is applied to the double-sided vertical grinding process of silicon wafers, where the grinding wheel is continuously used and the tooth height gradually decreases with wear, its cooling and chip removal effects are insufficient to meet the requirements of temperature control and debris removal in the double-sided vertical grinding process.

[0030] Specifically, to maintain the simplicity and stability of water supply control, this scheme fixes the cooling water flow rate. This inherent design inevitably leads to a mismatch between the cooling water supply and the thermal state of the grinding zone at different wear stages, potentially causing either insufficient or excessive cooling. Specifically, at higher tooth heights, the grooves are deeper, the chip space is larger, and the flow resistance of the cooling water is lower. If the cooling water flow rate is insufficient at this stage, it can easily cause thermal warping deformation of the silicon wafer. At lower tooth heights, the grooves are shallower, the residence time of the cooling water in the grinding zone is longer, and debris is more easily accumulated, intensifying localized frictional heat. If the cooling water flow rate is too high at this stage, an excessively thick water film will form between the abrasive grains and the silicon wafer surface, making it difficult for the abrasive grains to effectively penetrate the silicon wafer surface, resulting in a decrease in material removal rate and uneven removal.

[0031] In view of this, this disclosure provides a method for adjusting the cooling water flow rate of a double-sided vertical grinding equipment for silicon wafers. The grinding equipment includes grinding wheels for grinding both sides of the silicon wafer and a cooling water supply path for supplying cooling water to the grinding area. The adjustment method includes: obtaining the current grinding tooth height parameter of the grinding wheel; obtaining the current processing state parameter of the grinding equipment, wherein the current processing state parameter includes at least a parameter characterizing the grinding load state; obtaining a preset mapping relationship between the current grinding tooth height parameter, the current processing state parameter and the target cooling water flow rate; determining the target cooling water flow rate based on the current grinding tooth height parameter, the current processing state parameter and the preset mapping relationship; and adjusting the cooling water flow rate in the cooling water supply path based on the target cooling water flow rate.

[0032] Thus, this adjustment method improves the constant flow supply method. The cooling water flow rate is no longer used as a constant control quantity. Instead, a follow-up relationship is established between it and the current height of the grinding teeth and the processing state parameters that characterize the grinding load state. This allows the cooling water supply to be jointly determined and coordinated by the grinding teeth height and the processing state parameters.

[0033] Specifically, since the grinding height and processing parameters are simultaneously incorporated into the flow rate regulation, the cooling water supply can be dynamically matched according to the combined changes in grinding height and grinding load. When the grinding wheel gradually decreases in grinding height due to continuous use, the groove volume decreases accordingly, and the flow resistance of cooling water in the grinding zone increases accordingly. If the grinding load changes at this time, the cooling water supply can be actively reduced under the combined effect of grinding height and processing parameters, thereby avoiding the formation of an excessively thick water film in the low grinding stage, ensuring that the abrasive grains can effectively cut into the silicon wafer surface and maintain a stable material removal rate. When the grinding height is high and the groove chip space is large, the cooling water supply increases accordingly, thereby timely removing grinding heat and grinding particles, reducing the risk of thermal warping deformation of the silicon wafer due to insufficient cooling.

[0034] Meanwhile, the cooling water supply is also affected by the grinding load state characterized by the processing state parameters, so that the amount of water entering the grinding zone can change with the changes in frictional heat generation and chip generation rate, and cooperate with the groove volume and flow resistance determined by the grinding tooth height, so as to maintain appropriate cooling and chip removal conditions at different wear stages of the grinding wheel, and achieve overall dynamic matching between the cooling water supply and the wear state and grinding load state of the grinding wheel.

[0035] Therefore, this adjustment method introduces a flow regulation mechanism that combines the grinding height and processing state parameters into the cooling water supply chain. This transforms the originally fixed cooling water flow rate into a control quantity that adapts to the working conditions. Furthermore, it allows the combined effects of changes in grinding height and grinding load on the water flow state to be uniformly reflected in the target cooling water flow rate. This overcomes the fundamental contradiction of the mismatch between the cooling water supply and the heat flow state in the grinding zone under a constant flow supply method, thereby improving the cooling effect, chip removal capacity, and processing quality stability of double-sided vertical grinding of silicon wafers.

[0036] In addition, since the cooling water flow rate can be dynamically matched with the grinding tooth height and grinding load, the grinding wheel abrasive grains can always work under more suitable cooling and lubrication conditions, the wear process of the grinding wheel is more gradual, and the service life of the grinding wheel can be extended compared with the constant flow water supply method, for example, by 10% to 15%.

[0037] The following describes, with reference to the accompanying drawings, a method, apparatus, device, and storage medium for adjusting cooling water flow rate according to at least one embodiment of the present disclosure.

[0038] This disclosure provides a method for adjusting the cooling water flow rate of a vertical grinding equipment for double-sided silicon wafers. The grinding equipment includes grinding wheels for grinding both sides of the silicon wafer and a cooling water supply path for supplying cooling water to the grinding area.

[0039] Exemplarily, the grinding equipment includes a main machine bed, two grinding wheels mounted on the main machine bed, and a cooling water supply path. The two grinding wheels are positioned opposite each other on the main machine bed and are used to grind two surfaces of a silicon wafer, respectively. Each grinding wheel is connected to a drive spindle, which rotates the grinding wheel. The cooling water supply path includes a path that sequentially connects a cooling water source, an electric proportional control valve, and a grinding zone nozzle. Cooling water is supplied from the cooling water source to the grinding zone nozzle via the electric proportional control valve to supply cooling water to the grinding zone. The electric proportional control valve adjusts its opening according to a flow rate adjustment signal, thereby changing the cooling water flow rate in the cooling water supply path. During the grinding process, cooling water is sprayed from the grinding zone nozzle between the silicon wafer and the grinding wheels to remove grinding heat and grinding debris.

[0040] like Figure 1 As shown, the method for adjusting the cooling water flow rate includes the following steps S100 to S500.

[0041] Step S100: Obtain the current grinding tooth height parameter of the grinding wheel.

[0042] Specifically, the grinding wheel surface has grinding teeth and grooves located between adjacent grinding teeth. The grinding tooth height parameter is used to characterize the current height state of the grinding teeth relative to the bottom of the grooves, the grinding wheel reference surface, or a preset measurement reference surface. The current grinding tooth height parameter can be the absolute height value of the grinding teeth, or it can be the remaining height of the grinding teeth, the amount of grinding tooth wear, the percentage of grinding tooth height, the equivalent height calculated from the initial grinding tooth height and the cumulative wear, or a dimensionless parameter obtained by normalizing the above parameters.

[0043] For example, the current grinding height parameter can be obtained by a grinding height detection module installed on a double-sided vertical grinding equipment for silicon wafers, such as a grinding wheel dressing device, a grinding wheel support mechanism, or a detection station. The grinding height detection module may include a contact displacement sensor, a non-contact displacement sensor, an optical distance sensor, a laser displacement meter, an eddy current sensor, or a machine vision measurement unit. The current grinding height parameter can also be calculated based on the cumulative number of processed wafers, the cumulative grinding time, the cumulative material removal amount, the cumulative spindle load integral, or the cumulative dressing amount.

[0044] Step S200: Obtain the current processing status parameters of the grinding equipment, wherein the current processing status parameters include at least parameters characterizing the grinding load state.

[0045] Specifically, the current processing status parameter is used to characterize the processing status of the grinding equipment in the current grinding cycle or at the current sampling time, while the parameter characterizing the grinding load status is used to reflect the contact friction between the grinding wheel, silicon wafer and grinding zone, the material removal burden and the heat generation status.

[0046] In at least one embodiment of this disclosure, parameters characterizing the grinding load state may include at least one of spindle torque, spindle current, spindle power, grinding pressure, vibration parameters, acoustic emission parameters, or grinding zone temperature. Current processing state parameters also include grinding wheel speed.

[0047] For example, the current processing status parameters include any one of the following: original sampled value, filtered value, statistical value, rate of change, peak value, mean value, root mean square value, and normalized value.

[0048] Step S300: Obtain the preset mapping relationship between the current grinding height parameter, the current machining status parameter and the target cooling water flow rate.

[0049] Specifically, the preset mapping relationship is used to describe the correspondence between the input parameter set consisting of the current grinding height parameter and the current machining state parameter and the target cooling water flow rate.

[0050] Step S400: Determine the target cooling water flow rate based on the current grinding height parameters, current machining status parameters, and preset mapping relationship.

[0051] Step S500: Adjust the cooling water flow rate in the cooling water supply path based on the target cooling water flow rate.

[0052] Specifically, the cooling water flow rate in the cooling water supply path can be adjusted by changing the valve core opening of the electric proportional regulating valve, changing the pumping frequency, changing the bypass return ratio, changing the number of nozzles opened, or a combination of these control measures.

[0053] Therefore, step S100 obtains the current grinding tooth height state of the grinding wheel, providing a geometric basis for the adjustment of cooling water flow rate based on the grinding wheel wear state, so that the flow rate adjustment can change with the grinding tooth wear state throughout the entire life cycle of the grinding wheel.

[0054] Step S200 obtains the current processing state of the grinding equipment, such as parameters characterizing the grinding load state, to provide a basis for adjusting the cooling water flow rate that reflects the load and friction state of the grinding zone, so that the flow rate adjustment can simultaneously consider the grinding gear geometry and the actual processing state.

[0055] Step S300 establishes a mapping basis between input parameters and target flow rate by acquiring the correspondence rules between grinding height parameters, machining state parameters and target cooling water flow rate, providing a data foundation for the subsequent determination of target cooling water flow rate.

[0056] Step S400 calculates or retrieves the target cooling water flow rate that matches the current working condition based on the real-time acquired grinding height parameters and machining status parameters through a preset mapping relationship, thus completing the decision from working condition parameters to flow rate set value.

[0057] Step S500 applies the determined target cooling water flow rate to the cooling water supply path, and adjusts the cooling water flow rate entering the grinding zone through the flow actuator to match the cooling water supply with the wear state of the grinding wheel and the grinding load state.

[0058] It should be noted that the adjustment method provided in this disclosure is not limited to the specific implementation described in the above embodiments. For example, the data acquisition operations in each step can be performed synchronously or in any reasonable order according to the actual working conditions and equipment configuration; similarly, the acquisition, calculation, and transmission processes of each input parameter are not limited to a fixed order. Any equivalent transformations or adjustments to the adjustment method based on the inventive concept that fall within the scope of this disclosure and can be understood by those skilled in the art should be considered to fall within the scope of protection claimed in this disclosure.

[0059] In some disclosed embodiments, the adjustment method further includes an initialization step before performing step S100. The initialization step includes recording parameters such as the initial grinding tooth height and initial grinding wheel diameter of the grinding wheel, and loading a multi-dimensional flow control spectrum corresponding to the current grinding wheel, the current silicon wafer specification, and the current process formulation.

[0060] Specifically, the initialization step is performed when the grinding equipment is put into production, the grinding wheel is changed, the silicon wafer specification is changed, or the process formula is switched. The initial grinding tooth height is used as the benchmark for obtaining subsequent grinding tooth height parameters and calculating the amount of grinding tooth height change; the grinding wheel diameter is used to characterize the overall size of the grinding wheel and can participate in determining the flow field scale of the grinding zone and setting the flow rate benchmark in the cooling water supply path. The loaded multidimensional flow control map is matched with the current grinding wheel type, silicon wafer size, target removal amount, and process formula, so that the subsequent step S400 can directly use the current grinding tooth height parameter and the current processing state parameter as an index to look up the table or interpolate in the corresponding map to obtain the target cooling water flow rate.

[0061] Thus, this initialization step loads a multi-dimensional flow control map that matches the current operating conditions, ensuring that the subsequent flow determination process is carried out under the correct map constraints. This avoids the target cooling water flow rate deviating from the actual operating conditions due to the use of mismatched maps, thereby improving the initial adaptability and control accuracy of the adjustment method.

[0062] In some embodiments of this disclosure, step S500, which adjusts the cooling water flow rate in the cooling water supply path based on the target cooling water flow rate, may also include inner-loop closed-loop feedback adjustment. Thus, this adjustment method enables the actual supply flow rate to accurately track the target cooling water flow rate, avoiding deviations between the actual and target flow rates caused by valve nonlinearity, pipeline pressure fluctuations, or load changes. This ensures that the target cooling water flow rate is truly applied to the grinding zone, improving the accuracy and stability of flow rate adjustment.

[0063] Specifically, in step S500, the regulating device mentioned below converts the target cooling water flow rate into a flow command for the electric proportional regulating valve. The electric proportional regulating valve adjusts its valve core opening according to the flow command to change the cooling water flow rate in the cooling water supply path. Simultaneously, the flow meter in the cooling water supply path detects the actual cooling water flow rate supplied to the grinding zone in real time and feeds the measured flow rate back to the control unit. The regulating device compares the measured flow rate with the target cooling water flow rate to obtain the flow deviation, and corrects the opening of the electric proportional regulating valve based on this flow deviation, making the actual flow rate approach the target cooling water flow rate. This forms an inner-loop closed-loop control with the target cooling water flow rate as the setpoint and the measured flow rate as the feedback quantity. The inner-loop closed-loop control can be implemented using proportional control, proportional-integral control, proportional-integral-derivative control, or model predictive control.

[0064] Based on the above embodiments, in some embodiments of this disclosure, such as Figure 2 As shown, step S300 obtains the preset mapping relationship between the current grinding height parameter, the current machining state parameter and the target cooling water flow rate, including the following steps S310 to S330.

[0065] Step S310: Obtain multiple sets of process test data, wherein each set of process test data includes at least historical grinding height parameters, historical processing state parameters, historical cooling water flow rate, and historical grinding effect data.

[0066] Specifically, multiple sets of process test data can come from calibration batches, engineering test batches, equipment acceptance batches, or periodic calibration batches of the actual production line. Historical grinding height parameters are used to characterize the grinding height state of the grinding wheel when the data set is collected; historical processing state parameters are used to characterize the rotational speed, load, pressure, temperature, vibration, or other processing states in the corresponding grinding cycle; historical cooling water flow rate is used to characterize the actual cooling water flow rate supplied to the grinding zone in the grinding cycle, which can be the set flow rate, measured flow rate, cycle average flow rate, peak flow rate, or staged flow rate; historical grinding effect data is used to characterize the processing results of the silicon wafer under the process conditions.

[0067] Step S320: Using historical grinding effect data as constraints, reverse-engineer the target cooling water flow rate corresponding to the historical grinding height parameter and historical processing state parameter, wherein the historical cooling water flow rate serves as the reference benchmark for reverse-engineering.

[0068] Specifically, reverse engineering refers to determining the optimal cooling water flow rate that best matches the target grinding result under similar or identical historical grinding height and machining condition parameters, based on the correlation between historical cooling water flow rates and historical grinding effect data, with the goal of achieving the desired grinding effect or meeting grinding effect constraints. Using historical cooling water flow rates as a reference benchmark allows the solution process to be corrected around the existing process window, preventing the target flow rate from deviating too much from the feasible range.

[0069] Step S330: Based on the historical grinding height parameters, historical machining state parameters, and the target cooling water flow rate obtained by reverse solving, establish a multi-dimensional flow control map. The multi-dimensional flow control map is used to characterize the correspondence between the input parameter set composed of grinding height parameters and machining state parameters and the target cooling water flow rate.

[0070] Specifically, a multidimensional flow control map refers to a multidimensional correspondence model that uses grinding height parameters and machining state parameters as inputs and the target cooling water flow rate as the output. For example, a multidimensional flow control map can be a two-dimensional, three-dimensional, or higher-dimensional data structure.

[0071] For example, a multidimensional flow control graph may include, but is not limited to, a three-dimensional flow control graph with grinding tooth height, spindle torque, and grinding wheel speed as variables. This graph can be stored as a continuous function expression or a data model capable of continuous interpolation across multiple calibration operating points. When the input parameters include grinding tooth height H, spindle torque T, and grinding wheel speed ω, the multidimensional flow control graph can be represented as Q. target =f(H,T,ω), where Q target The target cooling water flow rate.

[0072] Therefore, step S310 collects process test data containing multi-dimensional information such as grinding height, processing status, cooling water flow rate and grinding effect, providing a source of actual process data for the establishment of the preset mapping relationship.

[0073] Step S320 uses grinding effect data as a quality constraint and historical cooling water flow rate as a reference benchmark to solve for cooling water flow rate that better matches the target processing result, so that the preset mapping relationship can be obtained from the actual processing result, rather than relying solely on linear assumptions or fixed empirical flow rates.

[0074] Step S330 establishes a multi-dimensional flow control map based on the target cooling water flow rate obtained from the reverse solution and the corresponding input parameters, so that the subsequent real-time flow determination process has both a data basis and quality guidance, thereby improving the process adaptability and accuracy of the target flow rate determination.

[0075] It should be noted that the preset mapping relationship can include any pre-established correspondence that can determine the target cooling water flow rate based on the current grinding height parameter and the current machining state parameter. It can be stored in the control unit, or in the host computer, edge computing node or device management server that communicates with the control unit.

[0076] In some embodiments of this disclosure, step S400 determines the target cooling water flow rate based on the current grinding height parameter, the current machining state parameter, and a preset mapping relationship, including: using the current grinding height parameter and the current machining state parameter as indexes, performing a lookup table or interpolation in the multidimensional flow control graph to obtain the target cooling water flow rate.

[0077] Specifically, table lookup refers to finding the corresponding calibration point in the multidimensional flow control graph based on the current gear grinding height parameters and current machining status parameters, and then reading the target cooling water flow rate corresponding to that calibration point. Interpolation refers to calculating the target cooling water flow rate of the current calibration point based on the target cooling water flow rates of adjacent calibration points when the current input parameter set is located between multiple calibration points. For example, interpolation can include linear interpolation, bilinear interpolation, trilinear interpolation, multilinear interpolation, spline interpolation, radial basis function interpolation, or interpolation based on a local model.

[0078] Therefore, step S400 aims to use the current grinding height parameter and current machining state parameter obtained by real-time detection or real-time calculation as an index to make the target cooling water flow rate correspond to the current actual working point. By looking up the table, the calculation speed is improved, or by interpolation, the flow rate step caused by discrete calibration is reduced, thereby improving the continuity of flow output and the accuracy of working condition matching.

[0079] In some embodiments of this disclosure, such as Figure 3 As shown, the adjustment method includes the following steps S31 to S330.

[0080] Step S10: Obtain the current grinding tooth height parameter of the grinding wheel.

[0081] Step S20: Obtain the current processing status parameters of the grinding equipment, wherein the current processing status parameters include at least parameters characterizing the grinding load state.

[0082] Step S31: Obtain multiple sets of process test data, wherein each set of process test data includes at least historical grinding height parameters, historical processing state parameters, historical cooling water flow rate, and historical grinding effect data.

[0083] Step S32: Using historical grinding effect data as constraints, reverse-engineer the target cooling water flow rate corresponding to the historical grinding height parameter and historical processing state parameter. The historical cooling water flow rate serves as the reference benchmark for the reverse-engineering.

[0084] Step S33: Based on the historical grinding height parameters, historical machining state parameters, and the target cooling water flow rate obtained by reverse solving, establish a multi-dimensional flow control map. The multi-dimensional flow control map is used to characterize the correspondence between the input parameter set composed of grinding height parameters and machining state parameters and the target cooling water flow rate.

[0085] Step S40: Using the current grinding height parameter and the current machining status parameter as indexes, perform a lookup or interpolation in the multi-dimensional flow control graph to obtain the target cooling water flow rate.

[0086] Step S50: Adjust the cooling water flow rate in the cooling water supply path based on the target cooling water flow rate.

[0087] In some embodiments of this disclosure, the multidimensional flow control map is stored as a continuous function expression or a data model capable of continuous interpolation between multiple calibration operating points. This allows the grinding equipment to obtain the target cooling water flow rate at any actual operating point outside the calibration points, reducing abrupt changes in flow output between calibration points. Consequently, the flow command received by the electric proportional control valve changes smoothly, which helps stabilize the pressure and flow rate in the cooling water supply path, avoiding instability in nozzle water output due to command abrupt changes, thereby improving the stability of heat exchange and chip removal in the grinding zone.

[0088] Specifically, a calibration point refers to a discrete operating condition state with a clear correspondence, recorded as a sampling node in the multidimensional flow control graph after process testing and parameter calibration during the establishment of the graph. A calibration point typically consists of two parts: an input parameter set and an output parameter set. For example, the input parameter set includes the grinding height parameter and machining state parameters corresponding to that operating point, such as a grinding height H, a spindle torque T, and a grinding wheel speed ω, used to uniquely determine the position of that operating point in the input parameter space. The output parameter is the target cooling water flow rate Q corresponding to that input parameter set.

[0089] Therefore, in a certain set of process tests, if the current grinding tooth height is measured to be H1, the spindle torque to be T1, and the grinding wheel speed to be ω1, and the target cooling water flow rate corresponding to this working condition is obtained by reverse calculation as Q1, then (H1, T1, ω1) → Q1 constitutes a calibration working condition point. Multiple such calibration working condition points, after being organized according to dimensions such as grinding tooth height and processing state parameters, form discrete sampling nodes in the multidimensional flow control spectrum.

[0090] For example, if the current grinding height parameter and the current machining status parameter obtained in real time happen to fall on a certain calibrated working point, the corresponding target cooling water flow rate is directly read from the table; if they fall between two or more calibrated working points, the continuous target flow rate value is calculated by interpolation between the target flow rates of these calibrated working points.

[0091] Specifically, a continuous function expression refers to a mathematical function that describes the mapping relationship between the input parameter set and the target cooling water flow rate, such as a polynomial function, exponential function, logarithmic function, piecewise function, spline function, or a combination function containing multiple basis functions.

[0092] Specifically, a data model capable of continuous interpolation refers to retaining data from multiple calibration operating points and defining interpolation rules between adjacent calibration operating points, so that any set of input parameters falling within the calibration range can obtain a continuous target cooling water flow output.

[0093] It should be noted that the table lookup or interpolation process can be performed before the start of each grinding cycle, or it can be performed during the grinding cycle according to a fixed sampling period. The sampling period can be set according to the equipment response speed, sensor sampling capability, and valve execution delay. For example, the target cooling water flow rate can be updated every 0.1s, 0.2s, 0.5s, 1s, 2s, or 5s, or it can be triggered when a change in load status, an update in grinding tooth height, or a process stage switch is detected. These can be designed according to actual production needs and will not be elaborated upon here.

[0094] In some embodiments of this disclosure, the multidimensional flow control map includes multiple cooling water flow data sets corresponding to multiple grinding load levels, and in at least one cooling water flow data set, the target cooling water flow rate change rate is different for adjacent grinding tooth height intervals.

[0095] Specifically, the grinding load level refers to the load state level divided according to the parameters characterizing the grinding load state, such as low load level, medium load level and high load level, or multiple torque levels represented by spindle torques T1, T2 and T3 respectively.

[0096] The cooling water flow rate data set refers to the collection of target cooling water flow rate data corresponding to different grinding tooth height ranges under the same grinding load level. The different rates of change of target cooling water flow rate corresponding to adjacent grinding tooth height ranges means that the slope or incremental ratio of the target cooling water flow rate with the grinding tooth height is different in different grinding tooth height ranges. That is, the influence of the grinding tooth height change on the flow field, chip space, flow resistance, residence time and local heat transfer state of the grinding zone is not linear.

[0097] Thus, under the same grinding tooth height but different load levels, the target cooling water flow rate can be increased or decreased as a whole; under the same load level but different grinding tooth height ranges, the variation range of the target cooling water flow rate can be adjusted according to the actual flow field and thermal field characteristics, thereby avoiding the problem that a monotonous linear curve cannot adapt to different wear stages of the grinding wheel.

[0098] It should be noted that multiple grinding load levels can be divided according to spindle torque, spindle current, spindle power, grinding pressure, vibration amplitude, acoustic emission intensity, or grinding zone temperature. Cooling water flow data can be stored as curves, surface slices, matrices, arrays, or function segments. Adjacent grinding tooth height intervals can be divided by equal spacing or by non-equal spacing according to grinding tooth wear-sensitive intervals. For example, denser height nodes can be set in intervals where grinding tooth heights are close to those affecting chip space changes to improve flow regulation resolution. All of these can be designed according to actual needs and will not be elaborated here.

[0099] In some embodiments of this disclosure, such as Figure 4 As shown, step S400 determines the target cooling water flow rate based on the current grinding height parameter, the current machining state parameter, and the preset mapping relationship, including the following steps S410 to S432.

[0100] Step S410: Determine the basic target flow rate based on the current grinding height parameters, current machining status parameters, and preset mapping relationship.

[0101] Specifically, the basic target flow rate is a flow rate value directly determined based on the current grinding tooth height parameter, the current processing status parameter, and a preset mapping relationship. It can reflect the target water supply demand under normal operating conditions. The basic target flow rate can be obtained by looking up a table or interpolating in the multi-dimensional flow control graph using the current grinding tooth height parameter and the current processing status parameter as indexes.

[0102] Step S420: Obtain the current load parameter from the current processing status parameter, wherein the current load parameter is used to reflect the current load status of the grinding equipment.

[0103] Specifically, the current load parameters are parameters used to reflect the load status of the grinding equipment in the current processing status parameters. They can be the current spindle torque, current spindle current, current spindle power, current grinding pressure, current vibration parameters, current acoustic emission parameters, or current grinding zone temperature.

[0104] Step S430: Obtain the reference load parameters and determine the change in the current load parameters relative to the reference load parameters.

[0105] Specifically, the reference load parameter is a benchmark parameter used to compare with the current load parameter. It can be derived from the previous polishing cycle, statistical values ​​from multiple historical polishing cycles, load statistics from previous silicon wafers in the same batch, or preset calibration values.

[0106] The current polishing cycle refers to the polishing process currently in progress, that is, the polishing process of the silicon wafer currently being processed. The previous polishing cycle refers to the polishing process of the previous silicon wafer or batch of silicon wafers that was completed immediately before the current polishing cycle.

[0107] The change can be the difference between the current load parameters and the reference load parameters, or it can be the absolute value of the difference, the relative rate of change, or the normalized change.

[0108] Step S431: When the change does not exceed the preset threshold, the basic target flow rate is determined as the target cooling water flow rate.

[0109] Specifically, when the change does not exceed the preset threshold, it means that the current load state is within the allowable fluctuation range relative to the reference load state. The basic target flow rate can meet the heat exchange, lubrication and chip removal requirements of the current grinding zone. Therefore, the basic target flow rate is determined as the target cooling water flow rate.

[0110] Step S432: When the change exceeds the preset threshold, the enhanced target flow rate that is greater than the basic target flow rate is determined as the target cooling water flow rate in the current grinding cycle.

[0111] Specifically, when the change exceeds the preset threshold, it indicates that the grinding load has increased significantly or changed abnormally. Using an enhanced target flow rate greater than the basic target flow rate can increase the cooling and debris flushing capacity within the current grinding cycle, and promptly alleviate the adverse effects caused by local heating, debris accumulation, or increased friction. Therefore, the enhanced target flow rate is determined as the target cooling water flow rate.

[0112] Therefore, step S410 determines the basic target flow rate under normal operating conditions based on the grinding height, processing state, and preset mapping relationship, providing a reference flow rate for subsequent determination of the target cooling water flow rate. Step S420 extracts the current load parameters reflecting the current load state of the grinding equipment from the current processing state parameters, providing input for load change judgment.

[0113] Step S430 involves acquiring reference load parameters and calculating the change in current load parameters relative to the reference load parameters, comparing the current load state with the baseline state to provide a quantitative basis for identifying load abrupt changes. Step S431, when the load change is within the allowable fluctuation range, directly uses the basic target flow rate as the target cooling water flow rate to maintain normal flow output. Step S432, when the load change exceeds a preset threshold, uses an enhanced target flow rate greater than the basic target flow rate as the target cooling water flow rate to achieve an enhanced response to transient load increases.

[0114] In some embodiments of this disclosure, the enhanced target traffic is determined by a first formula, which is: ,in, To enhance target traffic, Based on the target traffic, This represents the change in current load parameters relative to reference load parameters. For reference load parameters, A preset enhancement coefficient is used. Thus, by setting the enhanced target flow rate as a function of the base target flow rate and the relative change in load, the enhanced water supply can increase with the degree of load deviation. Specifically, when the load change is only slightly higher than the preset threshold, the flow rate enhancement is small, avoiding over-supply; when the load change increases significantly, the flow rate enhancement increases accordingly, enhancing the heat exchange and scouring effect in the grinding zone. Compared to a fixed increase of the same flow rate value, this method allows the transient cooling enhancement to match the degree of load anomaly.

[0115] Specifically, This indicates the degree of deviation of the current load parameters from the reference load parameters; Used to adjust the effect of relative deviation on the magnitude of flow enhancement. Preset enhancement coefficient. The settings can be made based on at least one of the following: the response speed of the cooling water supply path, the sensitivity of the grinding zone to changes in flow rate, the controllable range of the electric proportional control valve, and the process characteristics of different grinding wheels.

[0116] For example, the preset enhancement factor is 0.1 to 2.0. Further, the preset enhancement factor... The value ranges from 0.3 to 1.2. For example, the preset enhancement factor... The values ​​are 0.1, 0.15, 0.25, 0.3, 0.35, 0.4, 0.45, 0.5, 0.55, 0.6, 0.65, 0.7, 0.75, 0.8, 0.85, 0.9, 0.95, 1.0, 1.05, 1.10, 1.15, 1.20, 1.25, 1.30, 1.35, 1.40, 1.45, 1.50, 1.55, 1.60, 1.65, 1.70, 1.75, 1.80, 1.85, 1.90, 1.95, and 2.0. If the enhancement coefficient is preset... If the value is too low, the increase in the target flow rate will be insufficient when the load increases, making it difficult to improve cooling and flushing capabilities in a timely manner; if the enhancement coefficient is preset... If the value is too high, even a small change in load can lead to a significant increase in flow rate, which can easily form an excessively thick water film and increase flow rate fluctuations.

[0117] In some embodiments of this disclosure, the current load parameter is the current spindle torque, the reference load parameter is the maximum spindle torque of the previous grinding cycle, and the preset threshold is a preset proportion of the maximum spindle torque of the previous grinding cycle. Thus, using the maximum spindle torque of the previous grinding cycle as the reference load parameter allows the judgment benchmark to adapt to recent operating conditions, rather than using a fixed constant that does not change with the equipment status. Using the preset proportion of the maximum spindle torque of the previous grinding cycle as the preset threshold allows the threshold to be correlated with the actual load level, ensuring consistency in judgments across different equipment, different grinding wheel states, or different process conditions.

[0118] For example, the preset threshold can be a preset percentage of the maximum spindle torque in the previous grinding cycle that is greater than or equal to 5% and less than or equal to 12%. Specifically, the preset percentage can be any one of 5%, 6%, 7%, 8%, 9%, 10%, 11%, and 12%.

[0119] In some embodiments of this disclosure, such as Figure 5 As shown, the adjustment method further includes steps S610 to S620.

[0120] Step S610: Reacquire the current load parameters in the next grinding cycle following the current grinding cycle.

[0121] Specifically, the polishing cycle following the current polishing cycle can be the polishing cycle of the next silicon wafer, or a subsequent polishing stage of the same silicon wafer. Reacquiring the current load parameters refers to collecting or calculating the parameters reflecting the load status again in a subsequent polishing cycle.

[0122] Step S620: Determine whether to maintain the target cooling water flow rate of the previous grinding cycle or to redetermine the target cooling water flow rate based on whether the change in the current load parameter obtained again relative to the reference load parameter exceeds a preset threshold.

[0123] Specifically, maintaining the target cooling water flow rate of the previous grinding cycle means that when the load condition has been reacquired and returned to the allowable fluctuation range, the flow rate will not be increased or changed, but the target flow rate that has been confirmed to be effective in the previous grinding cycle will be maintained.

[0124] Re-determining the target cooling water flow rate means that when the re-acquired load state still exceeds the preset threshold, a new target cooling water flow rate is calculated again based on the current grinding height parameter, the current machining state parameter, the preset mapping relationship, and the load change.

[0125] Therefore, step S610 obtains parameters reflecting the load state again in subsequent grinding cycles, providing new input data for closed-loop iterative judgment. Step S620 determines whether the load state has recovered based on the change of the newly obtained load parameters relative to the reference load parameters, thereby deciding whether to maintain the target cooling water flow rate of the previous grinding cycle or to redetermine the target cooling water flow rate, thus achieving cycle-by-cycle closed-loop iterative control.

[0126] In some embodiments of this disclosure, the current processing state parameters include parameters characterizing the grinding load state and the grinding wheel speed, wherein the parameters characterizing the grinding load state include at least one of spindle torque, spindle current, spindle power, grinding pressure, vibration parameters, acoustic emission parameters, or grinding zone temperature.

[0127] In some embodiments of this disclosure, historical grinding effect data includes at least one of warpage, curvature, and surface quality parameters. Thus, by using at least one of warpage, curvature, and surface quality parameters as constraints for inversely solving the target cooling water flow rate, the determination of the target cooling water flow rate can be directly linked to the processing quality of the silicon wafer. Since the cooling water flow rate simultaneously affects heat exchange, lubrication, chip removal, and the abrasive grain action state in the grinding zone, using the aforementioned grinding effect data allows the multidimensional flow control graph to not only reflect the mathematical relationships between equipment parameters but also the impact of flow rate settings on the processing results, thereby improving the targeting of flow control for the final processing quality.

[0128] This disclosure also provides a cooling water flow rate regulating device 800 for a double-sided vertical grinding equipment for silicon wafers. The grinding equipment includes grinding wheels for grinding both sides of the silicon wafer and a cooling water supply path for supplying cooling water to the grinding area. Figure 6As shown, the adjustment device 800 includes a first acquisition module 810, a second acquisition module 820, a third acquisition module 830, a determination module 840, and an execution module 850. The first acquisition module 810 is configured to acquire the current grinding tooth height parameter of the grinding wheel. The second acquisition module 820 is configured to acquire the current processing state parameter of the grinding equipment, wherein the current processing state parameter includes at least a parameter characterizing the grinding load state. The third acquisition module 830 is configured to acquire a preset mapping relationship between the current grinding tooth height parameter, the current processing state parameter, and the target cooling water flow rate. The determination module 840 is configured to determine the target cooling water flow rate based on the current grinding tooth height parameter, the current processing state parameter, and the preset mapping relationship. The execution module 850 is configured to adjust the cooling water flow rate in the cooling water supply path based on the target cooling water flow rate.

[0129] In some embodiments of this disclosure, the third acquisition module 830 is further configured to acquire multiple sets of process test data, wherein each set of process test data includes at least historical grinding height parameters, historical processing state parameters, historical cooling water flow rates, and historical grinding effect data; using the historical grinding effect data as constraints, the target cooling water flow rate corresponding to the historical grinding height parameters and historical processing state parameters is solved in reverse, wherein the historical cooling water flow rate is used as a reference benchmark for the inverse solution; based on the historical grinding height parameters, historical processing state parameters, and the target cooling water flow rate obtained by the inverse solution, a multidimensional flow control map is established, wherein the multidimensional flow control map is used to characterize the correspondence between the input parameter set composed of grinding height parameters and processing state parameters and the target cooling water flow rate.

[0130] In some embodiments of this disclosure, the determining module 840 is further configured to use the current grinding height parameter and the current machining state parameter as indexes to perform a lookup or interpolation in the multidimensional flow control graph to obtain the target cooling water flow rate.

[0131] In some embodiments of this disclosure, the determining module 840 is further configured to determine a basic target flow rate based on the current grinding height parameter, the current processing state parameter, and a preset mapping relationship; obtain a current load parameter from the current processing state parameter, wherein the current load parameter is used to reflect the current load state of the grinding equipment; obtain a reference load parameter and determine the amount of change of the current load parameter relative to the reference load parameter; when the amount of change does not exceed a preset threshold, determine the basic target flow rate as the target cooling water flow rate; when the amount of change exceeds the preset threshold, determine the enhanced target flow rate, which is greater than the basic target flow rate, as the target cooling water flow rate in the current grinding cycle.

[0132] In some embodiments of this disclosure, the execution module 850 is further configured to reacquire the current load parameters in a subsequent grinding cycle; and determine whether to maintain the target cooling water flow rate of the previous grinding cycle or to redetermine the target cooling water flow rate based on whether the change in the reacquired current load parameters relative to the reference load parameters exceeds a preset threshold.

[0133] This disclosure also provides a computing device, such as... Figure 7 As shown, the computing device 900 includes a processor 910 and a memory 920. The processor 910 is used to execute instructions stored in the memory 920 to implement the adjustment method in the above embodiments.

[0134] In at least one embodiment of this disclosure, the computing device 900 includes one or more processors 910. The application program stored in the memory 920 may include one or more modules, each module corresponding to a set of instructions. Furthermore, the processor 910 is configured to execute instructions to perform the adjustment methods described in the above embodiments.

[0135] In at least one embodiment of this invention, the computing device 900 may further include a power supply component configured to perform power management of the computing device 900, a wired or wireless network interface configured to connect the computing device 900 to a network, and an input / output (I / O) interface. The computing device 900 may operate on an operating system stored in memory 920, such as Windows Server™, Mac OS X™, Unix™, Linux™, FreeBSD™, or similar.

[0136] This disclosure provides a computer storage medium storing at least one instruction, which is executed by the processor 910 of the computing device 900 to implement the adjustment method described in the above embodiment.

[0137] Those skilled in the art will recognize that the units and algorithm steps of the various examples described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementations should not be considered beyond the scope of this invention.

[0138] Those skilled in the art will understand that, for the sake of convenience and brevity, the specific working processes of the systems, devices, and units described above can be referred to the corresponding processes in the foregoing method embodiments, and will not be repeated here.

[0139] In the embodiments provided in this disclosure, it should be understood that the disclosed systems, apparatuses, and methods can be implemented in other ways. For example, the apparatus embodiments described above are merely illustrative; for instance, the division of units is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the coupling or direct coupling or communication connection shown or discussed may be through some interfaces; the indirect coupling or communication connection between apparatuses or units may be electrical, mechanical, or other forms.

[0140] The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the units can be selected to achieve the purpose of this embodiment according to actual needs.

[0141] In addition, the functional units in the various embodiments of the present invention can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit.

[0142] If the functionality is implemented as a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of this invention, or the part that contributes to the prior art, or a part of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute all or part of the steps of the methods of the various embodiments of this invention. The aforementioned storage medium includes various media capable of storing program verification codes, such as USB flash drives, portable hard drives, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks.

[0143] Furthermore, it should be noted that the combination of the various technical features in this case is not limited to the combination methods described in the claims of this case or the combination methods described in the specific embodiments. All technical features described in this case can be freely combined or combined in any way, unless they contradict each other.

[0144] It should be noted that the above examples are merely specific embodiments of the present invention, and the present invention is obviously not limited to the above embodiments, with many similar variations. All modifications that can be directly derived or conceived by those skilled in the art from the content disclosed in this invention should fall within the protection scope of this invention.

[0145] It should be understood that the terms "first," "second," etc., mentioned in the embodiments of the present invention are merely for the purpose of more clearly describing the use of the technical solutions in the embodiments of the present invention, and are not intended to limit the scope of protection of the present invention.

[0146] The above are merely preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A method for adjusting the cooling water flow rate of a double-sided vertical grinding equipment for silicon wafers, characterized in that, The grinding equipment includes grinding wheels for grinding both sides of a silicon wafer and a cooling water supply path for supplying cooling water to the grinding area. The adjustment method includes: Obtain the current grinding tooth height parameter of the grinding wheel; Obtain the current processing status parameters of the grinding equipment, wherein the current processing status parameters include at least parameters characterizing the grinding load state; Obtain the preset mapping relationship between the current gear grinding height parameter, the current machining state parameter, and the target cooling water flow rate; The target cooling water flow rate is determined based on the current grinding height parameter, the current machining state parameter, and the preset mapping relationship; Based on the target cooling water flow rate, adjust the cooling water flow rate in the cooling water supply path.

2. The adjustment method according to claim 1, characterized in that, The step of obtaining the preset mapping relationship between the current grinding height parameter, the current machining state parameter, and the target cooling water flow rate includes: Multiple sets of process test data are obtained, wherein each set of process test data includes at least historical grinding height parameters, historical processing state parameters, historical cooling water flow rate and historical grinding effect data; Using the historical grinding effect data as constraints, the target cooling water flow rate corresponding to the historical grinding height parameter and the historical processing state parameter is solved in reverse. The historical cooling water flow rate is used as the reference benchmark for the inverse solution. Based on the historical grinding height parameters, the historical machining state parameters, and the target cooling water flow rate obtained by reverse calculation, a multidimensional flow control map is established. The multidimensional flow control map is used to characterize the correspondence between the input parameter set composed of grinding height parameters and machining state parameters and the target cooling water flow rate.

3. The adjustment method according to claim 2, characterized in that, The step of determining the target cooling water flow rate based on the current grinding height parameter, the current machining state parameter, and the preset mapping relationship includes: Using the current grinding height parameter and the current machining state parameter as indexes, the target cooling water flow rate is obtained by looking up a table or interpolating in the multidimensional flow control graph.

4. The adjustment method according to claim 3, characterized in that, The multidimensional flow control map is stored as a continuous function expression or a data model that can be continuously interpolated between multiple calibration operating points.

5. The adjustment method according to claim 2, characterized in that, The multidimensional flow control map includes multiple cooling water flow data sets corresponding to grinding load levels, and in at least one of the cooling water flow data sets, the target cooling water flow rate change rate is different for adjacent grinding tooth height intervals.

6. The adjustment method according to claim 1, characterized in that, The step of determining the target cooling water flow rate based on the current grinding height parameter, the current machining state parameter, and the preset mapping relationship includes: The basic target flow rate is determined based on the current grinding height parameter, the current processing state parameter, and the preset mapping relationship; The current load parameter is obtained from the current processing status parameter, wherein the current load parameter is used to reflect the current load status of the grinding equipment; Obtain reference load parameters and determine the amount of change of the current load parameters relative to the reference load parameters; When the change does not exceed a preset threshold, the basic target flow rate is determined as the target cooling water flow rate; When the change exceeds the preset threshold, the enhanced target flow rate that is greater than the basic target flow rate is determined as the target cooling water flow rate in the current grinding cycle.

7. The adjustment method according to claim 6, characterized in that, The enhanced target traffic is determined by a first formula, which is: ， in, To enhance the target traffic, For the aforementioned basic target traffic, The change in the current load parameter relative to the reference load parameter. The reference load parameters are... This is the preset enhancement coefficient.

8. The adjustment method according to claim 7, characterized in that, The current load parameter is the current spindle torque, the reference load parameter is the maximum spindle torque of the previous grinding cycle, and the preset threshold is a preset proportion of the maximum spindle torque of the previous grinding cycle.

9. The adjustment method according to claim 6, characterized in that, Also includes: The current load parameters are reacquired in the next grinding cycle. Based on whether the change in the current load parameter relative to the reference load parameter exceeds the preset threshold, it is determined whether to maintain the target cooling water flow rate of the previous grinding cycle or to redetermine the target cooling water flow rate.

10. The adjustment method according to claim 1, characterized in that, The current processing state parameters include parameters characterizing the grinding load state and the grinding wheel speed, wherein the parameters characterizing the grinding load state include at least one of spindle torque, spindle current, spindle power, grinding pressure, vibration parameters, acoustic emission parameters, or grinding zone temperature.

11. The adjustment method according to claim 2, characterized in that, The historical grinding effect data includes at least one of warpage, curvature, and surface quality parameters.

12. A device for adjusting the cooling water flow rate of a double-sided vertical grinding machine for silicon wafers, characterized in that, The grinding equipment includes grinding wheels for grinding both sides of a silicon wafer and a cooling water supply path for supplying cooling water to the grinding area. The adjusting device includes: The first acquisition module is configured to acquire the current grinding tooth height parameter of the grinding wheel; The second acquisition module is configured to acquire the current processing status parameters of the grinding equipment, wherein the current processing status parameters include at least parameters characterizing the grinding load state; The third acquisition module is configured to acquire a preset mapping relationship between the current grinding height parameter, the current processing state parameter and the target cooling water flow rate; The determination module is configured to determine the target cooling water flow rate based on the current gear grinding height parameter, the current machining state parameter, and the preset mapping relationship; The execution module is configured to adjust the cooling water flow rate in the cooling water supply path based on the target cooling water flow rate.

13. A computing device, characterized in that, It includes a processor and a memory, the processor being configured to execute instructions stored in the memory to implement the adjustment method as described in any one of claims 1 to 11.

14. A computer storage medium, characterized in that, The storage medium stores at least one instruction, which is executed by a processor to implement the adjustment method as described in any one of claims 1 to 11.

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