Domain controller driving apparatus and vehicle

Abstract

The application relates to a domain controller driving device and a vehicle, and relates to the technical field of domain control design. The domain controller driving device comprises a first power supply interface, a second power supply interface, a driving module, a compensation module and a protection module; the second power supply interface is connected with the first power supply interface through a voltage drop module; the compensation module simultaneously collects a first power supply voltage and a second power supply voltage to calculate a dynamic loss voltage of the voltage drop module, and converts the first measurement voltage; and the protection module controls the driving module to be powered off according to the first measurement voltage. Since the first measurement voltage can represent the first power supply voltage and is not affected by the dynamic loss voltage, when the first power supply voltage really falls below a safety threshold, the first measurement voltage is synchronously reduced. The device can be applied to a vehicle with an intelligent cabin, can provide reliable under-voltage protection for power loads and intelligent cabin peripheral load, and thus the accuracy of hardware under-voltage protection triggering can be improved.

Description

Technical Field

[0001] This application relates to the field of domain controller design technology, and in particular to a domain controller drive device and vehicle. Background Technology

[0002] The power domain controller of new energy vehicles typically carries high-power loads such as motor drives and high-voltage converters. The low-voltage power supply circuit of the vehicle contains impedance components such as fuses, relays, long wires, and power inductors, which together constitute the voltage drop module. Under conditions of instantaneous high-load start-up and continuous high-power output, the circuit current increases significantly. The voltage drop module will generate a dynamic voltage drop that changes in real time with the current, resulting in a fixed difference between the voltage at the power supply input terminal and the actual power supply voltage inside the controller.

[0003] Currently, the single-sampling-point undervoltage protection logic is fixed, and the protection threshold is a hardware-preset fixed value. When the vehicle battery supply voltage is still within the safe range, but a large current causes an excessive voltage drop, the actual supply voltage inside the controller will drop to the protection threshold prematurely. The protection circuit will directly cut off the power supply to the drive module, causing the power load to stop abnormally, affecting the continuity of vehicle power output and the driving experience. If the protection threshold is manually lowered to avoid false triggering, the protection will lag when the vehicle power supply is truly undervoltage. Therefore, how to more accurately trigger the hardware protection is an urgent problem to be solved. Summary of the Invention

[0004] This application provides a domain controller driver device to at least partially solve the above-mentioned technical problems.

[0005] To achieve the above objectives, according to a first aspect of this application, a domain controller driver device is provided, comprising: The first power interface is used to connect to the first power supply voltage; The second power interface is connected to the first power interface through a voltage drop module, and is used to receive the second power voltage output by the voltage drop module after the first power voltage is stepped down. The driver module is used to drive the load module; The compensation module is connected to the first power interface and the second power interface respectively, and is used to obtain the dynamic loss voltage of the voltage drop module according to the first power voltage and the second power voltage, and determine the first measurement voltage based on the dynamic loss voltage. A protection module, connected to the compensation module and the drive module, is used to trigger the drive module to power off based on the first measured voltage, so that the drive module stops driving the load module.

[0006] Optionally, the compensation module includes: The differential circuit is connected to the first power interface and the second power interface to perform differential processing on the first power supply voltage and the second power supply voltage to obtain the dynamic loss voltage. An adder circuit, connected to the differential circuit and the second power interface, is used to superimpose the dynamic loss voltage and the second power supply voltage to obtain the first measured voltage.

[0007] Optionally, the differential circuit includes a first operational amplifier, a first resistor, and a second resistor; The first operational amplifier includes a first input terminal connected to the first power interface, a second input terminal connected to the second power interface, and an output terminal connected to the adder circuit; the first resistor is connected between the second input terminal and the output terminal of the first operational amplifier, and the second resistor is connected between the first input terminal and ground of the first operational amplifier; The adder circuit includes a second operational amplifier, a third resistor, and a fourth resistor; The second operational amplifier includes a first input terminal connected to the third resistor and the fourth resistor, a second input terminal connected to the second power interface, and an output terminal connected to the compensation module; the third resistor is connected between the second input terminal of the second operational amplifier and ground, and the fourth resistor is connected between the second input terminal and the output terminal of the second operational amplifier.

[0008] Optionally, the protection module includes a fifth resistor, a hysteresis comparator, and a first power supply chip; The hysteresis comparator includes a first input terminal for receiving the first measured voltage, a second input terminal for receiving a reference threshold voltage, and an output terminal connected to the first power chip to output an enable signal; the fifth resistor is connected between the first input terminal and the output terminal of the hysteresis comparator. The first power chip is connected to the drive module and is used to stop supplying power to the drive module according to the enable signal, so as to trigger the drive module to power off.

[0009] Optionally, it also includes a control module connected to the second power interface and the drive module, for sampling the second power supply voltage to obtain a second measured voltage, and outputting an undervoltage protection signal to the drive module according to the second measured voltage, so that the drive module stops driving the load module according to the undervoltage protection signal.

[0010] Optionally, the domain controller driver further includes a printed circuit board with main control chip pads, wherein the main control chip pads include base pads and extended pads; wherein: The control module includes a first control chip, and the base pad is used to connect to the pins of the first control chip; Alternatively, the control module may include a first control chip and a second control chip, wherein the base pad is used to connect to the pins of the first control chip, and the extended pad is used to connect to the pins of the second control chip.

[0011] Optionally, the base pad is located in a first region of the printed circuit board; the extended pad is located in a second region of the printed circuit board; and the extended pad is arranged around the base pad. The first region includes a first base region, a second base region, and a third base region; The second region includes a first extended region adjacent to the first basic region, a second extended region adjacent to the second basic region, and a third extended region adjacent to the third basic region; The base pads include a first sub-pad located in the first base region, a second sub-pad located in the second base region, and a third sub-pad located in the third base region; the extended pads include a fourth sub-pad located in the first extended region, a fifth sub-pad located in the second extended region, and a sixth sub-pad located in the third extended region. The first and fourth sub-pads are used to provide sampling connection points, the second and fifth sub-pads are used to provide signal transmission connection points, and the third and sixth sub-pads are used to provide communication connection points.

[0012] Optionally, the domain controller driver further includes a second power chip for supplying power to the control module; if the control module includes the first control chip and the second control chip, the domain controller driver further includes a current amplification circuit disposed between the second power chip and the control module to increase the current supplied by the second power chip to the control module.

[0013] Optionally, the current amplification circuit includes a sixth resistor, a first switching transistor, and a first capacitor; the first switching transistor includes a control electrode connected to the signal output pin of the second power chip, a first electrode connected to the first output pin of the second power chip, and a second electrode connected to the second output pin of the second power chip and the control module; the sixth resistor is connected between the signal output pin and the second output pin of the second power chip; the first capacitor is connected between the first output pin of the second power chip and ground; Alternatively, the current amplification circuit includes a voltage regulator chip and a second capacitor; the voltage regulator chip includes a first terminal connected to a first output pin of the second power chip and a second terminal connected to the control module; the second capacitor is connected between the second terminal of the voltage regulator chip and ground.

[0014] Secondly, this application provides a vehicle including the aforementioned domain controller drive unit.

[0015] In summary, in the domain controller driver device of this application embodiment, by setting monitoring points at the first power interface and the second power interface respectively, and having the compensation module calculate the dynamic loss voltage of the voltage drop module and generate a first measured voltage, the judgment benchmark of the protection module can be equivalent to the first power supply voltage rather than the second power supply voltage affected by the voltage drop. Under high current conditions, the dynamic voltage drop of the voltage drop module increases, and the second power supply voltage decreases accordingly. However, the first measured voltage remains consistent with the first power supply voltage due to the superposition of the dynamic loss voltage. The protection module will not be falsely triggered due to the temporary decrease in the second power supply voltage, and dynamic correction of the undervoltage protection threshold can be achieved. At the same time, since the first measured voltage can represent the first power supply voltage and is not affected by the dynamic loss voltage, when the first power supply voltage truly drops below the safety threshold, the first measured voltage decreases synchronously, and the protection module can promptly trigger the driver module to power off. Thus, the accuracy of hardware undervoltage protection triggering can be improved.

[0016] Other features and advantages of this application will be described in detail in the following detailed description section. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] To gain a more complete understanding of this application and its beneficial effects, the following description will be provided in conjunction with the accompanying drawings, wherein the same reference numerals in the following description denote the same parts.

[0019] Figure 1 This is a schematic diagram of a domain controller driver device provided in an exemplary embodiment of this application; Figure 2 This is a circuit diagram of a domain controller driver device provided in an exemplary embodiment of this application; Figure 3 This is a schematic diagram of a printed circuit board provided in an exemplary embodiment of this application; Figure 4This is an architecture diagram of the domain controller driver device provided in an exemplary embodiment of this application; Figure 5 This is a schematic diagram illustrating the triggering of software protection provided in an exemplary embodiment of this application; Figure 6 This is a schematic diagram illustrating the triggering of hardware protection provided in an exemplary embodiment of this application; Figure 7 This is a circuit diagram of the first current amplification circuit provided in an exemplary embodiment of this application; Figure 8 This is a circuit diagram of a second current amplification circuit provided in an exemplary embodiment of this disclosure.

[0020] Explanation of reference numerals in the attached diagram: VBAT, First Power Interface; VIN, Second Power Interface; 1, Drive Module; 2, Compensation Module; 21, Differential Circuit; 22, Adder Circuit; 3, Protection Module; 4, Control Module; 5, Printed Circuit Board; 51, Base Pad; 511, First Sub-Pad; 512, Second Sub-Pad; 513, Third Sub-Pad; 52, Extension Pad; 521, Fourth Sub-Pad; 522, Fifth Sub-Pad; 523, Sixth Sub-Pad; A, First Region; a1, First Base Region; a2, Second Base Region; a3, Third Base Region; B, Second Region; b1, First Extension Region; b2, Second Extension Region; b3, Third Extension Region; 6, Current Amplification Circuit. Detailed Implementation

[0021] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the protection scope of this application.

[0022] According to the first aspect of this application, referring to Figure 1This disclosure provides a domain controller driver device, including a first power interface VBAT, a second power interface VIN, a driver module 1, a compensation module 2, and a protection module 3. The first power interface VBAT is used to connect to a first power supply voltage; the second power interface VIN is connected to the first power interface VBAT via a voltage drop module, and is used to connect to the second power supply voltage output by the voltage drop module after stepping down the first power supply voltage; the driver module 1 is used to drive a load module; the compensation module 2 is connected to both the first power interface VBAT and the second power interface VIN, and is used to obtain the dynamic loss voltage of the voltage drop module based on the first and second power supply voltages, and determine a first measured voltage based on the dynamic loss voltage; the protection module 3 is connected to the compensation module 2 and the driver module 1, and is used to trigger the driver module 1 to power off based on the first measured voltage, so that the driver module 1 stops driving the load module.

[0023] The first power interface VBAT can be the connection port between the domain controller drive and the vehicle's low-voltage power supply network, used to connect to a first power supply voltage. The first power supply voltage can be provided by the vehicle's low-voltage battery, with a voltage range of 9V to 16V. The first power supply voltage is the original power source for the domain controller drive, and its voltage level reflects the actual state of the vehicle's low-voltage power grid.

[0024] The voltage drop module is connected between the first power interface VBAT and the second power interface VIN. It can be the sum of all impedance-containing components and paths that the current passes through during the flow from the first power interface VBAT to the second power interface VIN. The voltage drop module can include any one or a combination of the following components connected in sequence: fuse, relay, long wire, printed circuit board (PCB) traces, reverse polarity protection diode, and the DC equivalent resistance (DCR) of the power inductor. A voltage drop is generated when current passes through the components of the voltage drop module, and the magnitude of the voltage drop changes dynamically with the current; the larger the current, the larger the voltage drop. In vehicle power domain control scenarios, when a large load is instantaneously applied, such as when the drive motor starts or the power steering pump operates, the current can increase in a short time, causing the voltage drop module to generate a large dynamic voltage drop.

[0025] The second power interface VIN is the connection port of the voltage drop module output, used to connect to the second power supply voltage. The second power supply voltage is the actual supply voltage after the first power supply voltage is stepped down by the voltage drop module. Due to the presence of the voltage drop module, the second power supply voltage is lower than the first power supply voltage, and the difference between the two varies with the current. Under low current conditions, the voltage drop is small, and the second power supply voltage is close to the first power supply voltage; under high current conditions, the voltage drop is large, and the second power supply voltage may be significantly lower than the first power supply voltage.

[0026] The drive module 1 is a power drive circuit in the domain controller drive device used to drive the load module. It may include a gate drive chip and power switching devices (such as insulated-gate bipolar transistors or metal-oxide-semiconductor field-effect transistors). After receiving a control signal, the drive module 1 drives the load module to work by turning the power switching devices on and off. The load module is a functional unit driven by the drive module 1, and may include any one or a combination of the following: a generator motor (GM) for converting mechanical energy into electrical energy, a traction motor (TM) for converting electrical energy into mechanical energy to drive the vehicle, a boost DC-DC converter (BDC), and a vehicle control unit (VCU) responsible for the energy management and coordinated control of the entire vehicle.

[0027] As an example, compensation module 2 is connected to the first power interface VBAT and the second power interface VIN, simultaneously acquiring voltage signals from two monitoring points: the first power supply voltage and the second power supply voltage. Compensation module 2 performs differential processing on the first and second power supply voltages to obtain the difference between them; this difference is the dynamic loss voltage of the voltage drop module. Then, it superimposes the dynamic loss voltage with the second power supply voltage to obtain the first measured voltage. Since the first measured voltage equals the second power supply voltage plus the dynamic loss voltage of the voltage drop module, the first measured voltage is numerically approximately equal to the first power supply voltage. In this way, compensation module 2 replicates a measurement signal equivalent to the first power supply voltage within the domain controller, avoiding the noise and interference problems caused by direct long-line sampling from the first power interface VBAT.

[0028] As an example, protection module 3 is connected to compensation module 2 and drive module 1, and is used to trigger drive module 1 to cut off power based on a first measured voltage. When the first measured voltage is lower than the set undervoltage protection threshold, protection module 3 activates, cutting off the power supply to drive module 1 or shutting off the control signal of drive module 1, causing drive module 1 to stop driving the load module. Since the first measured voltage is approximately equal to the first power supply voltage, the trigger point of protection module 3 actually corresponds to the real voltage level of the vehicle's low-voltage power grid, and is not affected by the second power supply voltage. This avoids the problem of protection module 3 being falsely triggered due to the second power supply voltage being too low under high current conditions caused by a large voltage drop. Thus, by detecting the dynamic loss voltage of the voltage drop module in real time through the first power interface VBAT and the second power interface VIN, and compensating the dynamic loss voltage into the measurement reference of protection module 3 through compensation module 2, the trigger threshold of undervoltage protection can be dynamically corrected with the voltage drop, thereby solving the problem of inaccurate undervoltage protection action point caused by the dynamic voltage drop of the voltage drop module.

[0029] In the above embodiments, by setting monitoring points at the first power interface VBAT and the second power interface VIN respectively, the compensation module 2 calculates the dynamic loss voltage of the voltage drop module and generates a first measured voltage. This allows the judgment benchmark of the protection module 3 to be equivalent to the first power supply voltage rather than the second power supply voltage affected by the voltage drop. Under high current conditions, the dynamic voltage drop of the voltage drop module increases, and the second power supply voltage decreases accordingly. However, the first measured voltage remains consistent with the first power supply voltage due to the superposition of the dynamic loss voltage. The protection module 3 will not be falsely triggered due to the temporary decrease in the second power supply voltage, thus achieving dynamic correction of the undervoltage protection threshold. Simultaneously, since the first measured voltage can represent the first power supply voltage and is not affected by the dynamic loss voltage, when the first power supply voltage truly drops below the safety threshold, the first measured voltage decreases synchronously, and the protection module 3 can promptly trigger the drive module 1 to cut off power. This improves the accuracy of hardware undervoltage protection triggering.

[0030] Reference Figure 2 In some embodiments, the compensation module 2 includes a differential circuit 21 and an adder circuit 22. The differential circuit 21 is connected to the first power interface VBAT and the second power interface VIN, and is used to perform differential processing on the first power supply voltage and the second power supply voltage to obtain the dynamic loss voltage. The adder circuit 22 is connected to the differential circuit 21 and the second power interface VIN, and is used to superimpose the dynamic loss voltage and the second power supply voltage to obtain the first measurement voltage.

[0031] As an example, the dynamic loss voltage output by differential circuit 21 is a signal proportional to the current. The larger the current, the greater the voltage drop of the voltage drop module, and the larger the amplitude of the dynamic loss voltage. Under low current conditions, the dynamic loss voltage may only be tens to hundreds of millivolts; under high current conditions, the dynamic loss voltage may reach more than 1V. The gain of differential circuit 21 can be set according to actual needs through the resistor ratio to ensure that the amplitude of the dynamic loss voltage is suitable for processing by adder circuit 22. The first measured voltage output by adder circuit 22 is sent to protection module 3 as the basis for protection module 3 to determine whether to trigger undervoltage protection. Since the first measured voltage is equivalent to the first power supply voltage, the trigger point of protection module 3 can be unified to the actual voltage level of the vehicle's low-voltage power grid, rather than the second power supply voltage affected by current and voltage drop.

[0032] Thus, the cascaded structure of the differential circuit 21 and the adder circuit 22 enables the compensation module 2 to have the ability to provide real-time dynamic compensation. When the current changes and causes the voltage drop of the voltage drop module to change, the dynamic loss voltage output by the differential circuit 21 changes synchronously, and the first measurement voltage output by the adder circuit 22 is also adjusted synchronously. It can track the rapid changes in current without the need for software intervention.

[0033] In some embodiments, the differential circuit 21 includes a first operational amplifier U1, a first resistor R1, and a second resistor R2; the first operational amplifier U1 includes a first input terminal connected to a first power interface VBAT, a second input terminal connected to a second power interface VIN, and an output terminal connected to the adder circuit 22; the first resistor R1 is connected between the second input terminal and the output terminal of the first operational amplifier U1, and the second resistor R2 is connected between the first input terminal of the first operational amplifier U1 and ground; As an example, the differential circuit 21 adopts a differential amplification structure composed of the first operational amplifier U1. The high common mode rejection ratio (CMRR, an indicator that measures the amplifier's ability to suppress common mode signals) of the first operational amplifier U1 can be used to suppress the noise and ripple shared by the two first power interfaces VBAT and the second power interface VIN, and only amplify the difference signal between the two to ensure the accuracy of the dynamic loss voltage calculation.

[0034] As an example, the first and second input terminals can also be connected in series with a small-value current-limiting resistor to limit the input current, prevent electrostatic discharge (ESD, the phenomenon of rapid transfer of electrostatic charge) damage, and form a low-pass filter with the input capacitor. Since the resistance value is small, its effect on the gain of the differential amplifier can be ignored.

[0035] As an example, the first resistor R1 is connected between the second input terminal and the output terminal of the first operational amplifier U1, forming a negative feedback path and determining the closed-loop gain of the differential circuit 21. The second resistor R2 is connected between the first input terminal of the first operational amplifier U1 and ground, providing a DC bias path for the first input terminal, and also working with the first resistor R1 to set the gain of the differential amplifier. When the resistance values ​​of the first resistor R1 and the second resistor R2 satisfy a certain proportional relationship, the output voltage of the differential circuit 21 is proportional to the difference between the two input voltages, and the proportionality coefficient is determined by the ratio of the first resistor R1 to the second resistor R2.

[0036] As an example, the resistance values ​​of the first resistor R1 and the second resistor R2 can be configured according to the required gain. For example, if a gain of 1 is required, the first resistor R1 and the second resistor R2 should have equal resistance values; if the dynamic loss voltage needs to be amplified for subsequent processing, the ratio of the first resistor R1 to the second resistor R2 can be increased.

[0037] It should be noted that in practical applications, a standard differential amplifier with a four-resistor structure (i.e., an input resistor connected in series at each of the two input terminals, along with a feedback resistor and a grounding resistor) can also be used, or an integrated differential amplifier chip can be used. As long as the structure can calculate the difference between the first power supply voltage and the second power supply voltage to obtain the dynamic loss voltage, it is acceptable. No specific limitations are made here.

[0038] Reference Figure 2 In some embodiments, the adder circuit 22 includes a second operational amplifier U2, a third resistor R3, and a fourth resistor R4; the second operational amplifier U2 includes a first input terminal connected to the third resistor R3 and the fourth resistor R4, a second input terminal connected to the second power interface VIN, and an output terminal connected to the compensation module 2; the third resistor R3 is connected between the second input terminal of the second operational amplifier U2 and ground, and the fourth resistor R4 is connected between the second input terminal and the output terminal of the second operational amplifier U2.

[0039] As an example, the third resistor R3 provides a DC bias path for the inverting input of the second operational amplifier U2, ensuring that the inverting input has a defined DC potential. The fourth resistor R4 provides a feedback path for the second operational amplifier U2. The third resistor R3 and the fourth resistor R4 together determine the gain of the inverting input channel.

[0040] As an example, since the first measured voltage is equal to the sum of the second power supply voltage and the dynamic loss voltage, and the dynamic loss voltage is equal to the difference between the first power supply voltage and the second power supply voltage, the first measured voltage is numerically equal to the first power supply voltage. Thus, the adder circuit 22 can compensate the dynamic voltage drop back to the second power supply voltage, thereby enabling the measurement of the first power supply voltage.

[0041] In the above embodiment, the two-stage cascaded structure of differential circuit 21 and adder circuit 22 enables real-time calculation and compensation of the dynamic loss voltage of the voltage drop module. Differential circuit 21 uses a first operational amplifier U1 in conjunction with a first resistor R1 and a second resistor R2 to differentially process the first and second power supply voltages. Utilizing the common-mode rejection characteristic of the operational amplifier, common-mode noise and ripple at the two monitoring points are suppressed, resulting in a dynamic loss voltage that accurately reflects the magnitude of the voltage drop. Adder circuit 22 uses a second operational amplifier U2 in conjunction with a third resistor R3 and a fourth resistor R4 to superimpose the dynamic loss voltage with the second power supply voltage, generating a first measurement voltage equivalent to the first power supply voltage. Both circuit stages operate in a closed-loop negative feedback state, tracking the dynamic changes in current and voltage drop. The gain of the second operational amplifier U2 is configured by the resistance ratio of the third resistor R3 and the fourth resistor R4 to accommodate different voltage drop ranges. This allows for dynamic correction of the undervoltage protection threshold through hardware circuitry without increasing software complexity, improving the accuracy of undervoltage protection.

[0042] In some embodiments, the protection module 3 includes a fifth resistor R5, a hysteresis comparator U3, and a first power chip U4; the hysteresis comparator U3 includes a first input terminal for receiving a first measurement voltage, a second input terminal for receiving a reference threshold voltage, and an output terminal connected to the first power chip U4 to output an enable signal; the fifth resistor R5 is connected between the first input terminal and the output terminal of the hysteresis comparator U3; the first power chip U4 is connected to the drive module 1 and is used to stop supplying power to the drive module 1 according to the enable signal, so as to trigger the drive module 1 to power off.

[0043] As an example, the hysteresis comparator U3, the fifth resistor R5, and the first power chip U4 constitute a hardware undervoltage lockout (UVLO) protection circuit to shut down the output when the supply voltage is lower than a set threshold.

[0044] Hysteresis comparator U3 is used to compare a first measured voltage with a reference threshold voltage and output an enable signal based on the comparison result. Hysteresis comparator U3 includes a first input terminal, a second input terminal, and an output terminal. The first input terminal is connected to the first measured voltage output by compensation module 2, and the second input terminal is connected to the reference threshold voltage. The reference threshold voltage is a stable reference voltage that can be generated by a bandgap reference source or a voltage divider circuit.

[0045] The fifth resistor R5 is connected between the first input and the output of the hysteresis comparator U3, forming a positive feedback path. When the output state of the hysteresis comparator U3 flips, the change in output voltage is fed back to the first input through the fifth resistor R5, causing the voltage at the first input to change with the output state, thus forming two different flip thresholds, namely the rising threshold and the falling threshold.

[0046] As an example, a voltage divider circuit can also be provided between the output of the second operational amplifier U2 and ground to divide the first measurement signal to the operating range of the hysteresis comparator U3. For example, the voltage divider circuit may include two resistors connected in series, and the first input of the hysteresis comparator U3 is connected to the series node of the two resistors. Thus, the rising threshold can be expressed as ra·(ra / / rb / / r5)·VT; where VT represents the reference threshold voltage, ra represents the resistance value of the resistor connected in series between the output of the second operational amplifier U2 and the series node, rb represents the resistance value of the resistor connected in series between the series node and ground, r5 represents the resistance value of the fifth resistor R5, and ra / / rb / / r5 is the value of the three resistors connected in parallel. The falling threshold can be expressed as ra·(ra / / rb / / r5)·VT -(ra / r5)·Vsup; where Vsup represents the power supply voltage of the hysteresis comparator U3.

[0047] When the first measured voltage rises from low to high, the hysteresis comparator U3 outputs a low-level enable signal. When the first measured voltage rises above the rising threshold, the hysteresis comparator U3 starts outputting a high-level enable signal. After the hysteresis comparator U3 starts outputting a high-level enable signal, when the first measured voltage falls from high to low, the hysteresis comparator U3 continues to output a high-level enable signal until the first measured voltage falls below the falling threshold, at which point the hysteresis comparator U3 starts outputting a low-level enable signal.

[0048] As an example, when the hysteresis comparator U3 outputs a high-level enable signal, the first power supply chip U4 is enabled, supplying power to the drive module 1 normally. When the hysteresis comparator U3 outputs a low-level enable signal, the first power supply chip U4 is turned off, stopping the supply of power to the drive module 1, thereby triggering the drive module 1 to power off and stop driving the load module. The difference between the rising threshold and the falling threshold is called the hysteresis window. The rising threshold corresponds to the undervoltage recovery voltage of the vehicle's low-voltage power grid (e.g., 9.5V), and the falling threshold corresponds to the undervoltage action voltage (e.g., 8.5V). The hysteresis window is approximately 1V. When the first measured voltage drops below the falling threshold, the hysteresis comparator U3 flips to output an enable signal that controls the first power supply chip U4 to turn off. When the first measured voltage recovers to above the rising threshold, the hysteresis comparator U3 flips again to output an enable signal that controls the first power supply chip U4 to operate, restoring power supply to the first power supply chip U4.

[0049] Thus, the hysteresis characteristic of the hysteresis comparator U3 can prevent the state of the enable signal output by the hysteresis comparator U3 from repeatedly flipping due to noise, ripple or transient fluctuations near the threshold voltage of the first measured voltage, thereby avoiding frequent switching of the first power chip U4 and improving the stability and reliability of the protection circuit.

[0050] Since the first measured voltage is a signal output by compensation module 2 that is equivalent to the first power supply voltage, the judgment benchmark of hysteresis comparator U3 actually corresponds to the real voltage level of the vehicle's low-voltage power grid. Under high current conditions, the second power supply voltage is lower due to a large voltage drop, but the first measured voltage remains consistent with the first power supply voltage because of the superimposed dynamic loss voltage. Therefore, hysteresis comparator U3 will not be falsely triggered due to a temporary drop in the second power supply voltage. Only when the first power supply voltage actually drops below the undervoltage threshold will the first measured voltage be below the threshold, and the protection module 3 will then activate.

[0051] In the above embodiments, the hysteresis comparator U3, in conjunction with the fifth resistor R5, forms a hysteresis comparator structure with a hysteresis window, thus creating a dual-threshold judgment. This prevents the comparator from repeatedly flipping due to noise or ripple near the threshold voltage, improving the stability of the protection action. The first power chip U4 controls the power supply of the drive module 1 according to the enable signal, and can quickly cut off the power source of the drive module 1 under undervoltage conditions, preventing logic confusion or half-conduction damage of power devices when the drive module 1 is under power shortage. Since the first measured voltage is equivalent to the first power supply voltage, the trigger point of the protection module 3 can be unified to the actual voltage level of the vehicle's low-voltage power grid. This avoids false triggering caused by the second power supply voltage being too low under high current conditions, and provides timely protection when the first power supply voltage is truly undervoltage.

[0052] Reference Figure 2 In some embodiments, a control module 4 is also included, which is connected to the second power interface VIN and the drive module 1. The control module 4 samples the second power supply voltage to obtain a second measured voltage and outputs an undervoltage protection signal to the drive module 1 according to the second measured voltage, so that the drive module 1 stops driving the load module according to the undervoltage protection signal.

[0053] As an example, in addition to the hardware protection of protection module 3, software protection can also be implemented through control module 4, forming a two-level undervoltage protection architecture that combines hardware and software. Control module 4 can be a microcontroller unit (MCU), responsible for functions such as execution of control algorithms for power domain control, signal acquisition, communication processing, and fault diagnosis.

[0054] As an example, control module 4 is connected to the second power interface VIN. It samples the second power supply voltage through its internal analog-to-digital converter (ADC), converting the analog voltage signal into a digital value to obtain the second measured voltage. The second measured voltage is a digital representation of the second power supply voltage, and control module 4 can perform software filtering, threshold judgment, and logic processing on it.

[0055] Reference Figure 5 When the second measured voltage is below the software undervoltage threshold for multiple consecutive sampling cycles, control module 4 outputs an undervoltage protection signal. This can filter out instantaneous drops and ripples in the second power supply voltage, avoiding false triggering caused by transient interference. For example, if a large load is instantaneously applied, causing a short-term drop in the second power supply voltage that quickly recovers, control module 4 will not trigger protection because the duration is insufficient for the number of consecutive sampling cycles.

[0056] Reference Figure 5 The undervoltage protection signal can be multiplexed from the pulse width modulation (PWM) signal used to control the operation of the power module. For example, the output of the undervoltage protection signal can be considered as the output of the pulse width modulation signal when no PWM signal is output. When the control module 4 determines that the second measured voltage is lower than the set software undervoltage threshold, it outputs the undervoltage protection signal to the drive module 1 to shut down the PWM output of the drive module 1 or to put the drive module 1 into a safe state, thereby stopping the drive module 1 from driving the load module.

[0057] Reference Figure 6 As an example, the difference between the software protection of control module 4 and the hardware protection of protection module 3 is as follows: Hardware protection determines whether the vehicle's low-voltage power grid is undervoltage by measuring the first voltage (equivalent to the first power supply voltage). When triggered, it directly cuts off the power supply to drive module 1, resulting in severe consequences; after power failure, re-initialization is required. Software protection, on the other hand, determines whether the actual power supply is too low by measuring the second voltage (the sampled value of the second power supply voltage). When triggered, it shuts off the control signal of drive module 1, while the drive chip continues to receive power. Normal operation can be quickly restored after the voltage recovers.

[0058] As an example, the software undervoltage threshold can be set lower than the drop threshold of the hysteresis comparator U3 to be closer to the minimum operating voltage of the driver chip. Thus, when the second power supply voltage begins to decrease, the software protection of control module 4 activates first, shutting down the PWM signal output to driver module 1, thereby reducing the load and helping to mitigate further voltage drops. If the voltage continues to drop below the drop threshold of the hysteresis comparator U3, protection module 3 then activates, cutting off the power supply to the power module.

[0059] In the above embodiments, by adding a control module 4 to sample and software-determine the second power supply voltage, software protection can be formed in addition to hardware protection. The control module 4 adopts a triggering mechanism that continuously samples voltages below a threshold, which can filter out instantaneous drops and ripples in the second power supply voltage and avoid false triggering caused by transient interference. The software protection shuts down the control signal of the drive module 1 instead of cutting off the power supply, and can quickly resume operation after the voltage recovers, reducing the impact of protection actions on normal operation.

[0060] Reference Figure 3 In some embodiments, the domain controller driver further includes a printed circuit board 5 with main control chip pads, the main control chip pads including a base pad 51 and an extension pad 52. As a first configuration example, the control module 4 includes a first control chip U5, and the base pad 51 is used to connect to the pins of the first control chip U5; or, as a second configuration example, the control module 4 includes a first control chip U5 and a second control chip U6, the base pad 51 is used to connect to the pins of the first control chip U5, and the extension pad 52 is used to connect to the pins of the second control chip U6.

[0061] As an example, the main control chip pad is the pad area on the printed circuit board 5 used for soldering the control chip in the control module 4. The main control chip pad is divided into a basic pad 51 and an expansion pad 52. The basic pad 51 is used to connect the pins of the control module 4 required to implement basic functions; the expansion pad 52 is a pad area reserved for expansion functions, used to connect the pins of additional control modules 4 when expansion functions are required.

[0062] As an example, in the first configuration, the control module 4 includes a first control chip U5. In this case, only the base pad 51 is used, and the pins of the first control chip U5 are connected to the base pad 51. The expansion pad 52 is left unused and no components are mounted. In the second configuration, the control module 4 includes a first control chip U5 and a second control chip U6. In this case, the base pad 51 is connected to the pins of the first control chip U5, and the expansion pad 52 is connected to the pins of the second control chip U6.

[0063] It is important to note that the first control chip U5 and the second control chip U6 have two physical implementations. The first is that the first control chip U5 and the second control chip U6 are two independent chips. The first control chip U5 is a basic control chip, mounted on the basic pad 51, responsible for basic functions; the second control chip U6 is an expansion control chip, mounted on the expansion pad 52, responsible for expansion functions. They interact with each other through a communication interface (such as a Serial Peripheral Interface (SPI, a synchronous serial communication protocol)). The second is that the first control chip U5 and the second control chip U6 are a single integrated high-performance controller. This controller is logically divided into first control functions and second control functions. Its basic function pins are connected to the basic pad 51, and its expansion function pins are connected to the expansion pad 52.

[0064] The first control chip, U5, is a mandatory control chip for fulfilling the basic functions of the power domain control, responsible for the control and management of these basic functions. For example, these basic functions may include generator motor drive, drive motor drive, boost DC-DC converter drive, and vehicle controller load drive. The generator motor drive function controls the operation of the generator motor to achieve regenerative braking and power generation; the drive motor drive function controls the operation of the drive motor to achieve vehicle traction and propulsion; the boost DC-DC converter drive function controls the operation of the boost DC-DC converter to achieve low-voltage to high-voltage DC-DC conversion; and the vehicle controller load drive function controls the drive of various loads (such as relays and indicator lights) of the vehicle controller. The second control chip, U6, is an optional expansion control chip that can be configured according to the vehicle model, adding new functions on top of the basic functions. For example, expansion functions may include adding load drive to the vehicle controller, a Battery Management System (BMS) responsible for battery status monitoring, an On-Board Charger (OBC), and a Direct Current to Direct Current (DCDC) converter. The optional second control chip U6 allows the same hardware platform to adapt to the functional requirements of different vehicle models by either mounting or not mounting the second control chip U6.

[0065] Reference Figure 4As an example, when control module 4 includes a first control chip U5 and a second control chip U6, drive module 1 also includes two sets: a basic drive module and an extended drive module. The load module also includes two sets: a basic load module and an extended load module, corresponding to the loads for basic and extended functions, respectively. The basic drive module is connected to the first control chip U5 and is used to drive the basic load, which may include a first communication circuit and a first signal sampling circuit. The extended drive module is connected to the second control chip U6 and is used to drive the extended load, which may include a second communication circuit, a second signal sampling circuit, and differentiated circuits. Correspondingly, the first power chip U4 includes a basic power module and an extended power module, supplying power to the basic drive module and the extended drive module, respectively.

[0066] In some embodiments, a base pad 51 is located in a first region A of the printed circuit board 5; an extension pad 52 is located in a second region B of the printed circuit board 5; the extension pad 52 is disposed around the base pad 51; the first region A includes a first base region a1, a second base region a2, and a third base region a3; the second region B includes a first extension region b1 adjacent to the first base region a1, a second extension region b2 adjacent to the second base region a2, and a third extension region b3 adjacent to the third base region a3; the base pad 51 includes a first sub-pad located in the first base region a1. 511, a second sub-pad 512 located in the second base region a2 and a third sub-pad 513 located in the third base region a3; the extended pad 52 includes a fourth sub-pad 521 located in the first extended region b1, a fifth sub-pad 522 located in the second extended region b2 and a sixth sub-pad 523 located in the third extended region b3; wherein, the first sub-pad 511 and the fourth sub-pad 521 are used to provide sampling connection points, the second sub-pad 512 and the fifth sub-pad 522 are used to provide signal transmission connection points, and the third sub-pad 513 and the sixth sub-pad 523 are used to provide communication connection points.

[0067] As an example, the base pad 51 is located in the first region A of the printed circuit board 5, and the extension pad 52 is located in the second region B of the printed circuit board 5. The extension pad 52 is arranged around the base pad 51, so that the base pad 51 is located in the central region of the printed circuit board 5, which facilitates connection with functional circuits in all directions. The extension pad 52 surrounds the periphery of the base pad 51. When the control module 4 uses an integrated high-performance controller, its pins are continuously distributed from the inner circle to the outer circle, corresponding to the pad layout.

[0068] As an example, the first region A is further divided into a first basic region a1, a second basic region a2, and a third basic region a3, corresponding to pins of different functional types. The second region B is further divided into a first extended region b1, a second extended region b2, and a third extended region b3, which are adjacent to the first basic region a1, the second basic region a2, and the third basic region a3, respectively. This ensures that the basic pad 51 and the extended pad 52 for each functional type are physically adjacent, with the basic pad 51 in the inner circle and the extended pad 52 adjacent to it in the outer circle. By partitioning by functional type and arranging the basic and extended pads adjacently, the crosstalk and aggregation between different types of signals can be reduced, thus lowering crosstalk and interference between signals.

[0069] The first sub-pad 511 and the fourth sub-pad 521 are used to provide sampling connection points for connecting various analog signal sampling circuits, such as voltage sampling, current sampling, and temperature sampling. The first sub-pad 511 is the basic sampling connection point for sampling analog signals required for basic functions; the fourth sub-pad 521 is the extended sampling connection point for sampling additional analog signals required for extended functions. Concentrating the sampling pins in the same area facilitates analog signal routing and shielding, reducing interference from digital signals to analog signals. The second sub-pad 512 and the fifth sub-pad 522 are used to provide signal transmission connection points for connecting various interactive control signals, input signals, and other timing signals. Concentrating these signal pins in the same area facilitates routing and reduces signal delay and distortion. The third sub-pad 513 and the sixth sub-pad 523 are used to provide communication connection points for connecting communication interfaces such as Controller Area Network (CAN), Local Interconnect Network (LIN), and SPI. The third sub-pad 513 is the basic communication connection point, used for the communication interface required for basic functions; the sixth sub-pad 523 is the extended communication connection point, used for additional communication interfaces required for extended functions. By concentrating the communication pins in the same area, it is easier to arrange the communication transceiver and match the impedance of the communication line.

[0070] Furthermore, in addition to the aforementioned functional areas, the main control chip pads also include Interrupt Request (IRQ) and General Purpose Input / Output (GPIO) resource areas. IRQ pins are used to connect external interrupt signals, such as fault alarms and overcurrent protection signals that require real-time response; GPIO pins are used to connect general-purpose digital input / output signals, such as switch detection, status indication, and relay control.

[0071] In the above embodiments, the platform-based configuration of the control module 4 can be achieved through the partitioned design of the basic pad 51 and the expansion pad 52 of the main control chip pads. The basic pad 51 corresponds to the mandatory first control chip U5 and basic functions, while the expansion pad 52 corresponds to the optional second control chip U6 and expansion functions. Different vehicle models only need to select whether to install the second control chip U6 and expansion devices, without redesigning the printed circuit board 5, which can reduce R&D costs and shorten the development cycle. The basic pad 51 and the expansion pad 52 are divided into sampling connection points, signal transmission connection points, and communication connection points according to functional types, and the basic area and the expansion area are adjacent, which can reduce the intersection and aggregation of different types of signals and reduce signal crosstalk and electromagnetic interference.

[0072] Reference Figure 7 In some embodiments, the domain controller driver further includes a second power chip U7 for supplying power to the control module 4; if the control module 4 includes a first control chip U5 and a second control chip U6, the domain controller driver further includes a current amplification circuit 6 disposed between the second power chip U7 and the control module 4 to increase the current supplied by the second power chip U7 to the control module 4.

[0073] The second power supply chip U7 is a power management device used to supply power to the control module 4. It can be a power management integrated circuit (PMIC) or a system base chip (SBC). The second power supply chip U7 converts the second power supply voltage into various power supply voltages required by the control module 4, including the control chip core voltage, digital port power supply voltage (Voltage Drain-to-Drain, VDD), analog port power supply voltage (Voltage Common Collector, VCC), and external sensor module power supply voltages.

[0074] With the basic configuration of the control module 4 including only the first control chip U5, the power supply current requirement of the first control chip U5 is relatively small. The voltage regulator integrated inside the second power chip U7 can directly provide sufficient current, and no additional current amplification circuit 6 is needed. At this time, the components corresponding to the current amplification circuit 6 are not soldered.

[0075] With the expanded configuration of control module 4 including the first control chip U5 and the second control chip U6, the two control chips operate simultaneously, significantly increasing the power supply current demand. The voltage regulator integrated within the second power chip U7 may not be able to provide sufficient current. In this case, a current amplification circuit 6 needs to be set up between the second power chip U7 and control module 4 to enhance the current supply capability of the second power chip U7 to control module 4 through an external power device.

[0076] As an example, the current amplification circuit 6 can use the output of the internal regulator of the second power chip U7 as a reference and control signal to drive the external power switch or regulator chip U8. The external device will bear most of the load current, thereby expanding the output current capability, so as to maintain the voltage accuracy and regulation characteristics of the internal regulator of the second power chip U7, while improving the current output capability.

[0077] It should be noted that the control module 4 requires multiple power supplies (such as VDD, VCC, core voltage, etc.), and each power supply can be equipped with a separate current amplification circuit 6 according to its current requirements. Therefore, in practical applications, multiple current amplification circuits 6 can be set up to amplify the current of different output channels, such as the digital port power supply VDD and the analog port power supply VCC. For example, when the second control chip U6 has a large number of digital I / O ports and the current requirement of the digital port power supply VDD is large, a current amplification circuit 6 is set up for the channel corresponding to the digital port power supply VDD; when the second control chip U6 has a large number of analog channels and the current requirement corresponding to the analog port power supply VCC is large, a current amplification circuit 6 is set up for the analog port power supply VCC channel.

[0078] The second power supply chip U7 has different topologies, corresponding to different current amplification methods. The disclosure document provides two typical power supply topologies for the second power supply chip U7: one based on a buck converter, and the other based on a buck-boost converter. In the buck converter-based topology, the second power supply chip U7 integrates a buck controller, which, together with external inductors, diodes, and capacitors, forms a buck circuit to generate an intermediate supply voltage (e.g., 5V), serving as the input to the subsequent low-dropout regulator (LDO). The subsequent LDO generates the supply voltages required by control modules 4, such as VDD and VCC. When the output current of a certain LDO is insufficient, an external power transistor forms a current amplification circuit 6.

[0079] In some embodiments, the current amplification circuit 6 includes a sixth resistor R6, a first switching transistor Q1, and a first capacitor C1; the first switching transistor Q1 includes a control electrode connected to the signal output pin of the second power chip U7, a first electrode connected to the first output pin of the second power chip U7, and a second electrode connected to the second output pin of the second power chip U7 and the control module 4; the sixth resistor R6 is connected between the signal output pin and the second output pin of the second power chip U7; the first capacitor C1 is connected between the first output pin of the second power chip U7 and ground; The control electrode of the first switching transistor Q1 is connected to the signal output pin of the second power chip U7, receiving the control signal output from the internal regulator of the second power chip U7. The first electrode of the first switching transistor Q1 is connected to the first output pin of the second power chip U7, which is the voltage input or intermediate voltage output of the internal regulator, providing input voltage to the first switching transistor Q1. The second electrode of the first switching transistor Q1 is connected to the second output pin of the second power chip U7 and the control module 4. The second output pin of the second power chip U7 is the feedback or output of the internal regulator, outputting the amplified supply voltage to the control module 4. The sixth resistor R6 is connected between the signal output pin and the second output pin of the second power chip U7, used to set the bias and current limiting of the control electrode of the first switching transistor Q1. The sixth resistor R6 provides a DC bias path for the control electrode of the first switching transistor Q1, ensuring a defined potential for the control electrode while limiting the current to prevent overcurrent damage. The first capacitor C1 is connected between the first output pin of the second power chip U7 and ground, used for input filtering and energy storage. The first capacitor C1 can filter out high-frequency noise on the first output pin and provide energy storage during load transient changes to maintain the stability of the input voltage.

[0080] As an example, the voltage regulator inside the second power chip U7 outputs a control signal through its signal output pin to drive the control electrode of the first switching transistor Q1. When the control signal turns on the first switching transistor Q1, current flows from the first electrode to the second electrode, supplying power to the control module 4. The second output pin of the second power chip U7 serves as a feedback terminal, detecting the output voltage and feeding it back to the internal voltage regulator. The internal voltage regulator adjusts the control signal based on the feedback voltage, thereby stabilizing the output voltage. The first switching transistor Q1, as an external power device, can withstand a larger current than the internal voltage regulator of the second power chip U7, thus improving the overall output current capability.

[0081] It should be noted that the above-mentioned current amplification circuit 6 is applicable to a specific type of second power chip U7, that is, the second power chip U7 needs to provide a dedicated signal output pin for driving the external current amplification tube.

[0082] Reference Figure 8 In some embodiments, the current amplification circuit 6 includes a voltage regulator chip U8 and a second capacitor C2; the voltage regulator chip U8 includes a first end connected to the first output pin of the second power chip U7 and a second end connected to the control module 4; the second capacitor C2 is connected between the second end of the voltage regulator chip U8 and ground.

[0083] In this embodiment, the second power chip U7 can be based on a Buck-Boost converter topology. The second power chip U7 integrates a buck-boost controller, which, together with external switches, inductors, and diodes, forms a Buck-Boost circuit to generate a pre-regulated voltage (VPRE). The Buck-Boost topology can maintain a stable output when the input voltage is higher or lower than the output voltage.

[0084] As an example, the voltage regulator chip U8 can be a low-dropout linear regulator (LDO) or a DC-DC converter. The first output pin of the second power supply chip U7 provides a pre-regulated voltage (such as VPRE generated by a Buck-Boost topology) as the input to the voltage regulator chip U8. The voltage regulator chip U8 converts the pre-regulated voltage to the precise supply voltage (such as VDD or VCC) required by the control module 4 and provides a larger output current. The second capacitor C2 is connected between the second terminal of the voltage regulator chip U8 and ground for output filtering and energy storage. The second capacitor C2 can filter out high-frequency noise and ripple on the output voltage, while providing energy storage during load transients to maintain output voltage stability.

[0085] As an example, the enable pin of the voltage regulator chip U8 can be connected to the enable signal of the second power supply chip U7 or the control signal of the control module 4 to control the on and off of the voltage regulator chip U8. When the control module 4 includes the first control chip U5, the voltage regulator chip U8 can be unmounted or disabled, and directly powered by the LDO inside the second power supply chip U7; when the control module 4 includes the first control chip U5 and the second control chip U6, the voltage regulator chip U8 is mounted and enabled to provide a larger output current.

[0086] It should be noted that the two different current amplification implementation methods mentioned above correspond to different types of second power chip U7 topologies, and can be selected according to the model and internal architecture of the second power chip U7.

[0087] In the above embodiments, the second power chip U7 converts the second power supply voltage into multiple power supply voltages required by the control module 4. In the basic configuration, it can be directly powered by the internal voltage regulator. In the extended configuration, the output current capability can be increased by optionally mounting the current amplification circuit 6 without changing the model of the second power chip U7. The current amplification circuit 6 amplifies the current for a single output and can be set according to the current requirements of different channels such as digital and analog, adapting to the power supply requirements of different control chips.

[0088] As a scenario example, this domain controller driver can be applied to the configuration of a smart cockpit, with the extended load module used to adapt to the peripheral loads related to the vehicle's smart cockpit. Peripherals involved in the smart cockpit, such as cockpit display units, ambient lighting, seat drive components, in-vehicle multimedia peripherals, and cockpit gateway interface devices, can all be connected to this device as extended load modules. When smart cockpit-related functions are required, a second control chip can be selected using the extended pads on the printed circuit board, and corresponding components of the extended drive module can be mounted. The second control chip completes signal acquisition, logic operations, and drive control of the smart cockpit peripheral loads. Furthermore, software and hardware undervoltage protection also apply to the extended load modules corresponding to the smart cockpit. When the vehicle's power supply is abnormal, the protection module can simultaneously perform power-off protection for the smart cockpit extended loads. This allows the same hardware platform to implement basic power domain drive functions and flexibly expand smart cockpit-related functions according to vehicle model configurations without requiring redesigning the printed circuit board.

[0089] Secondly, this application provides a vehicle including the aforementioned domain controller drive unit.

[0090] According to a second aspect of this disclosure, a vehicle is provided that includes the aforementioned domain controller drive unit. This vehicle possesses all the beneficial effects of the aforementioned domain controller drive unit, which will not be elaborated further herein.

[0091] The vehicle may be a gasoline-powered vehicle, a plug-in hybrid vehicle, or a vehicle, etc., and this disclosure does not specifically limit it.

[0092] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more features. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0093] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0094] The embodiments, implementation methods, and related technical features of this application can be combined and substituted for each other without conflict.

[0095] The above are merely preferred embodiments of this application and are not intended to limit this application in any way. Any simple modifications, equivalent changes, and alterations made to the above embodiments based on the technical essence of this application without departing from the scope of the technical solution of this application shall still fall within the scope of the technical solution of this application.

Claims

1. A domain controller driver device, characterized in that, include: The first power interface is used to connect to the first power supply voltage; The second power interface is connected to the first power interface through a voltage drop module, and is used to receive the second power voltage output by the voltage drop module after the first power voltage is stepped down. The driver module is used to drive the load module; The compensation module is connected to the first power interface and the second power interface respectively, and is used to obtain the dynamic loss voltage of the voltage drop module according to the first power voltage and the second power voltage, and determine the first measurement voltage based on the dynamic loss voltage. A protection module, connected to the compensation module and the drive module, is used to trigger the drive module to power off based on the first measured voltage, so that the drive module stops driving the load module.

2. The domain controller driver device according to claim 1, characterized in that, The compensation module includes: The differential circuit is connected to the first power interface and the second power interface to perform differential processing on the first power supply voltage and the second power supply voltage to obtain the dynamic loss voltage. An adder circuit, connected to the differential circuit and the second power interface, is used to superimpose the dynamic loss voltage and the second power supply voltage to obtain the first measured voltage.

3. The domain controller driver device according to claim 2, characterized in that, The differential circuit includes a first operational amplifier, a first resistor, and a second resistor; The first operational amplifier includes a first input terminal connected to the first power interface, a second input terminal connected to the second power interface, and an output terminal connected to the adder circuit; the first resistor is connected between the first input terminal and the output terminal of the first operational amplifier, and the second resistor is connected between the first input terminal and ground of the first operational amplifier; The adder circuit includes a second operational amplifier, a third resistor, and a fourth resistor; The second operational amplifier includes a first input terminal connected to the third resistor and the fourth resistor, a second input terminal connected to the second power interface, and an output terminal connected to the compensation module; the third resistor is connected between the second input terminal of the second operational amplifier and ground, and the fourth resistor is connected between the second input terminal and the output terminal of the second operational amplifier.

4. The domain controller driver device according to claim 1, characterized in that, The protection module includes a fifth resistor, a hysteresis comparator, and a first power chip. The hysteresis comparator includes a first input terminal for receiving the first measured voltage, a second input terminal for receiving a reference threshold voltage, and an output terminal connected to the first power chip to output an enable signal; the fifth resistor is connected between the first input terminal and the output terminal of the hysteresis comparator. The first power chip is connected to the drive module and is used to stop supplying power to the drive module according to the enable signal, so as to trigger the drive module to power off.

5. The domain controller driver device according to claim 1, characterized in that, It also includes a control module connected to the second power interface and the drive module, used to sample the second power supply voltage to obtain a second measured voltage, and output an undervoltage protection signal to the drive module according to the second measured voltage, so that the drive module stops driving the load module according to the undervoltage protection signal.

6. The domain controller driver according to claim 5, characterized in that, The domain controller driver also includes a printed circuit board with main control chip pads, the main control chip pads including base pads and extended pads; wherein: The control module includes a first control chip, and the base pad is used to connect to the pins of the first control chip; or, The control module includes a first control chip and a second control chip. The base pad is used to connect to the pins of the first control chip, and the extended pad is used to connect to the pins of the second control chip.

7. The domain controller driver according to claim 6, characterized in that, The base pad is located in a first region of the printed circuit board; the extended pad is located in a second region of the printed circuit board; the extended pad is arranged around the base pad; The first region includes a first base region, a second base region, and a third base region; The second region includes a first extended region adjacent to the first basic region, a second extended region adjacent to the second basic region, and a third extended region adjacent to the third basic region; The base pad includes a first sub-pad located in the first base region, a second sub-pad located in the second base region, and a third sub-pad located in the third base region. The extended pads include a fourth sub-pad located in the first extended region, a fifth sub-pad located in the second extended region, and a sixth sub-pad located in the third extended region; The first and fourth sub-pads are used to provide sampling connection points, the second and fifth sub-pads are used to provide signal transmission connection points, and the third and sixth sub-pads are used to provide communication connection points.

8. The domain controller driver according to claim 6, characterized in that, It also includes a second power supply chip for supplying power to the control module; In the case where the control module includes a first control chip and a second control chip, the domain controller driver further includes a current amplification circuit disposed between the second power chip and the control module to increase the current supplied by the second power chip to the control module.

9. The domain controller driver according to claim 8, characterized in that, The current amplification circuit includes a sixth resistor, a first switching transistor, and a first capacitor; The first switching transistor includes a control electrode connected to the signal output pin of the second power chip, a first electrode connected to the first output pin of the second power chip, and a second electrode connected to the second output pin of the second power chip and the control module; the sixth resistor is connected between the signal output pin and the second output pin of the second power chip; the first capacitor is connected between the first output pin of the second power chip and ground. or, The current amplification circuit includes a voltage regulator chip and a second capacitor; the voltage regulator chip includes a first terminal connected to a first output pin of the second power chip and a second terminal connected to the control module; the second capacitor is connected between the second terminal of the voltage regulator chip and ground.

10. A vehicle, characterized in that, Includes the domain controller driver as described in any one of claims 1 to 9.

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