Roller deformation monitoring device and method, etching apparatus
By installing optical sensors and control units inside the rollers of the etching equipment, the roller deformation is monitored in real time and graded alarms are issued, which solves the problem of unmonitored roller deformation, improves the sensitivity and accuracy of detection, reduces the risk of product scrap and equipment downtime, and improves the yield and efficiency of the semiconductor manufacturing process.
Patent Information
- Application Number
- CN202611144187.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2026-07-30
- Publication Date
- 2026-11-03
AI Technical Summary
In existing etching equipment, the condition of the roller assembly is not monitored, which leads to the inability to detect deformation in a timely manner, resulting in problems such as production capacity loss, product scrapping, and equipment contamination.
An axially penetrating hollow cavity is designed inside the roller, and an optical sensor is installed inside the hollow cavity to form a through-beam optical path. The deformation of the roller is monitored by the optical sensor, and a graded alarm is generated in conjunction with the control unit.
It achieves high sensitivity and high accuracy in monitoring roller deformation, avoiding product scrap and large-scale equipment downtime, and improving the yield and efficiency of the semiconductor manufacturing process.
Smart Images
Figure CN123028526A_ABST
Abstract
Description
Technical Field
[0001] This disclosure relates to the field of semiconductor processing technology, and in particular to a roller deformation monitoring device and method, and etching equipment. Background Technology
[0002] Wet etching is a key process step in semiconductor silicon wafer manufacturing. It involves a chemical reaction between a liquid etchant and the material surface to generate soluble products, thereby achieving selective removal and morphology control of the silicon wafer surface. In the semiconductor manufacturing field, wet etching is widely used in silicon wafer thinning, surface roughening, and impurity removal.
[0003] Taking silicon wafer thinning as an example, during the etching process, by controlling the etching process parameters, the silicon wafer can achieve the target thickness to meet the requirements of subsequent packaging and device performance. Semiconductor silicon wafer wet etching equipment typically consists of a chemical bath, a transfer arm, roller assemblies, and a control system. The silicon wafer is etched on the roller assembly. During the etching process, the rollers need to rotate continuously to prevent localized over-etching at the contact points between the silicon wafer and the rollers due to prolonged stillness, thus ensuring the uniformity of silicon wafer thinning. Furthermore, the roller assemblies form a continuous support surface, ensuring the smooth transfer of the silicon wafer between multiple chemical baths. Therefore, the state of the roller assembly plays a crucial role in ensuring that the entire etching process is unaffected by environmental factors.
[0004] However, in existing etching equipment, the condition of the roller assembly is not monitored, and the current degree of deformation or operating status of the roller assembly cannot be obtained. Problems can only be detected when the roller deforms and causes abnormal changes such as fragmentation of the silicon wafer above it. This leads to problems such as production capacity loss, product scrap, equipment contamination and increased maintenance costs. Summary of the Invention
[0005] In order to solve at least one of the technical problems in the prior art, the present disclosure provides a roller deformation monitoring device and method, and an etching equipment.
[0006] To solve the above-mentioned technical problems, this disclosure is implemented as follows:
[0007] In a first aspect, embodiments of this disclosure provide a roller deformation monitoring device for monitoring roller deformation in an etching apparatus, wherein the roller has an axially penetrating hollow cavity; the roller deformation monitoring device includes:
[0008] At least two sets of optical sensors are arranged radially from the periphery to the center of the roller at different radial positions. Each optical sensor includes a corresponding transmitter and receiver, which are located at opposite ends of the hollow cavity to form a through-beam optical path. The transmitter is used to emit an optical signal propagating along the axial direction of the hollow cavity, and the receiver is used to generate a corresponding sensing signal based on the state of the received optical signal.
[0009] A control unit, connected to the at least two sets of optical sensors, is used for:
[0010] The current deformation level of the roller is determined based on the sensing signals from each group of optical sensors.
[0011] Based on the preset hierarchical alarm strategy, generate the alarm command corresponding to the current deformation level.
[0012] For example, at least a number of optical sensors in one group of optical sensors are arranged sequentially at intervals along the circumference of the roller.
[0013] For example, in at least two adjacent sets of optical sensors, the optical sensors of one are spaced apart to correspond to the optical sensors of the other.
[0014] For example, in each group of optical sensors, the optical sensors are symmetrically distributed about the axis of the roller.
[0015] For example, the at least two sets of optical sensors include a first set of optical sensors, a second set of optical sensors, and a third set of optical sensors arranged sequentially from the periphery to the center along the radial direction of the roller; wherein,
[0016] The first set of optical sensors includes n1 optical sensors, and the n1 optical sensors are evenly distributed around the outermost circumference of the roller with a circumferential spacing of a first central angle, for monitoring the minute deformation of the roller;
[0017] The second set of optical sensors includes n2 optical sensors, and the n2 optical sensors are evenly distributed around the middle circumference of the roller with a circumferential spacing of the second central angle, for monitoring the moderate deformation of the roller;
[0018] The third set of optical sensors includes one optical sensor, which is located at the center of the roller and is used to monitor severe deformation of the roller.
[0019] n1 and n2 are both positive integers greater than or equal to 2.
[0020] For example, n1 is 8 and the first central angle is 45°; n2 is 4 and the second central angle is 90°.
[0021] For example, determining the current deformation level of the roller based on the sensing signals from each of the groups of optical sensors includes:
[0022] When the receiving end of less than m optical sensors in the first group of optical sensors feeds back a first sensing signal that no light signal has been received, and the duration is greater than a preset time, it is determined that the roller is currently in a dirty state, where m is greater than or equal to 2;
[0023] When the receiving end of m optical sensors in the first group of optical sensors returns a first sensing signal that no light signal has been received, and the duration is greater than a preset duration, it is determined that the current deformation level of the roller is a micro deformation, where m is greater than or equal to 2.
[0024] When the receiver of any one of the optical sensors in the second group of optical sensors sends back a first sensing signal that no light signal has been received, and the duration is longer than a preset duration, it is determined that the current deformation level of the roller is moderate deformation.
[0025] When the receiving end of the optical sensor in the third group of optical sensors sends back a first sensing signal indicating that no light signal has been received, and the duration is longer than a preset duration, the current deformation level of the roller is determined to be severe deformation.
[0026] For example, generating an alarm command corresponding to the current deformation level according to a preset hierarchical alarm strategy includes:
[0027] When the condition is determined to be dirty, a foreign object alert command is generated;
[0028] When a minor deformation is detected, a first-level alert instruction is generated, instructing the equipment to continue operating.
[0029] When the deformation is determined to be moderate, a second-level warning instruction is generated, indicating that the marked roller needs to be replaced;
[0030] When a severe deformation is detected, a Level 3 shutdown command is generated, instructing the equipment to immediately stop for maintenance.
[0031] Secondly, this disclosure also provides a roller deformation monitoring method, which monitors roller deformation based on the roller deformation monitoring device described above, the method comprising:
[0032] During the silicon wafer etching process, the emitting end of each set of optical sensors is controlled to continuously emit light signals, and the receiving end of each set of optical sensors generates corresponding sensing signals in response to the received light signals.
[0033] The current deformation level of the roller is determined based on the sensing signals from each group of optical sensors.
[0034] Based on the preset hierarchical alarm strategy, generate the alarm command corresponding to the current deformation level.
[0035] For example, when the at least two sets of optical sensors include a first set of optical sensors, a second set of optical sensors, and a third set of optical sensors arranged sequentially from the periphery to the center along the radial direction of the roller, determining the current deformation level of the roller based on the sensing signals from each set of optical sensors includes:
[0036] When the receiving end of less than m optical sensors in the first group of optical sensors feeds back a first sensing signal that no light signal has been received, and the duration is greater than a preset time, it is determined that the roller has not deformed at present, where m is greater than or equal to 2;
[0037] When the receiving end of m optical sensors in the first group of optical sensors reports a first sensing signal that no light signal has been received, and the duration is greater than a preset duration, it is determined that the current deformation level of the roller is a micro deformation.
[0038] When the receiver of any one of the optical sensors in the second group of optical sensors sends back a first sensing signal that no light signal has been received, and the duration is longer than a preset duration, it is determined that the current deformation level of the roller is moderate deformation.
[0039] When the receiving end of the optical sensor in the third group of optical sensors returns a first sensing signal that no light signal has been received, and the duration is longer than a preset duration, the current deformation level of the roller is determined to be severe deformation.
[0040] The step of generating an alarm command corresponding to the current deformation level according to a preset hierarchical alarm strategy includes:
[0041] When the condition is determined to be dirty, a foreign object alert command is generated;
[0042] When a minor deformation is detected, a first-level alert instruction is generated, instructing the equipment to continue operating.
[0043] When the deformation is determined to be moderate, a second-level warning instruction is generated, indicating that the marked roller needs to be replaced;
[0044] When a severe deformation is detected, a Level 3 shutdown command is generated, instructing the equipment to immediately stop for maintenance.
[0045] Thirdly, embodiments of this disclosure also provide an etching apparatus, comprising:
[0046] Medicine tank;
[0047] Rollers disposed within the medicine tank; and
[0048] The roller deformation monitoring device described above.
[0049] The embodiments disclosed herein have at least the following beneficial effects:
[0050] In the above scheme, an axially penetrating hollow cavity is designed inside the roller of the etching equipment, and an optical sensor is placed inside this hollow cavity to form a through-beam optical path. In this way, the optical signal propagating along the roller's axial direction serves as the detection carrier, and the through-beam optical path directly penetrates the roller's axis. When the roller undergoes any degree of bending or deformation, the through-beam optical path will be blocked. This non-contact detection method inside the roller avoids interference from the roller's surface condition on the detection results, directly reflecting the roller's deformation status, and possesses extremely high detection sensitivity and accuracy.
[0051] Furthermore, by utilizing the axially penetrating hollow cavity inside the roller as an optical path channel, the optical sensor is arranged inside the roller. This embedded design isolates the sensor from the external etching environment, avoiding corrosion and contamination of the sensor by external etching solutions and reducing the impact of high-temperature environments. This improves the lifespan of the monitoring device and the accuracy of the measurement data.
[0052] Furthermore, by setting at least two sets of optical sensors along the radial direction of the roller, different radial positions of the roller can be monitored simultaneously. This not only enables deformation sensing at a single point but also allows for the determination of the overall deformation level of the roller. Through real-time monitoring and graded alarm strategies, early warnings can be issued before severe deformation of the roller leads to silicon wafer breakage or equipment contamination. This effectively avoids the risk of product scrap and large-scale equipment downtime losses, and greatly improves the yield and efficiency of the semiconductor manufacturing process. Attached Figure Description
[0053] Figure 1 This is a schematic diagram of the roller structure in an embodiment of this disclosure;
[0054] Figure 2 This is one of the schematic diagrams showing the distribution of the roller deformation monitoring device on the circumferential surface of the roller in the embodiments of this disclosure;
[0055] Figure 3 This is the second schematic diagram showing the distribution of the roller deformation monitoring device on the circumferential surface of the roller in the embodiments of this disclosure. Detailed Implementation
[0056] To make the objectives, technical solutions, and advantages of the embodiments of this disclosure clearer, the technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this disclosure. All other embodiments obtained by those skilled in the art based on the described embodiments of this disclosure without creative effort are within the scope of protection of this disclosure.
[0057] Unless otherwise defined, the technical or scientific terms used in this disclosure shall have the ordinary meaning understood by one of ordinary skill in the art to which this disclosure pertains. The terms “first,” “second,” and similar terms used in this disclosure do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Similarly, the terms “an,” “a,” or “the,” and similar terms do not indicate a quantity limitation, but rather indicate the presence of at least one. The terms “including,” “comprising,” or “containing,” and similar terms mean that the element or object preceding the word encompasses the elements or objects listed following the word and their equivalents, without excluding other elements or objects. The terms “connected,” “linked,” or similar terms are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. The terms “upper,” “lower,” “left,” and “right,” etc., are used only to indicate relative positional relationships, and these relative positional relationships may change accordingly when the absolute position of the described objects changes.
[0058] The present disclosure will now be described in more detail with reference to the accompanying drawings. In the various drawings, the same elements are indicated by similar reference numerals. For clarity, the various parts in the drawings are not drawn to scale. Furthermore, some well-known parts may not be shown in the drawings.
[0059] Many specific details of this disclosure, such as the structure, materials, dimensions, processing methods, and techniques of the components, are described below to provide a clearer understanding of the disclosure. However, as those skilled in the art will understand, this disclosure may be implemented without following these specific details.
[0060] The roller deformation monitoring device provided in this disclosure can be applied to etching equipment, which includes rollers. This roller deformation monitoring device can be used to monitor the deformation of the rollers in the etching equipment. Figure 1 As shown, the roller 10 has an axially penetrating hollow cavity 11 inside.
[0061] like Figure 2 As shown, the deformation monitoring device for roller 10 includes:
[0062] At least two sets of optical sensors 100 are arranged radially from the periphery to the center of the roller 10 at different radial positions. Each optical sensor 100 includes a corresponding transmitter 110 and receiver 120, which are located at opposite ends of the hollow cavity 11 along its axial direction to form a through-beam optical path. The transmitter 110 is used to emit an optical signal propagating along the axial direction of the hollow cavity 11, and the receiver 120 is used to generate a corresponding sensing signal based on the state of the received optical signal.
[0063] Control unit 200, connected to at least two sets of optical sensors 100, is used for:
[0064] The current deformation level of the roller 10 is determined based on the sensing signals from each group of optical sensors 100.
[0065] Based on the preset hierarchical alarm strategy, generate the alarm command corresponding to the current deformation level.
[0066] In the above scheme, an axially penetrating hollow cavity 11 is designed inside the roller 10 of the etching equipment, and the optical sensor 100 is placed inside the hollow cavity 11 to form a through-beam optical path. Thus, using the light signal propagating along the axial direction of the roller 10 as the detection carrier, the through-beam optical path directly penetrates the axis of the roller 10. When the roller 10 undergoes any degree of bending or deformation, the through-beam optical path will be blocked. This non-contact detection method inside the roller 10 avoids interference from the surface condition of the roller 10 on the detection results, directly reflects the deformation status of the roller 10, and has extremely high detection sensitivity and accuracy.
[0067] Furthermore, by utilizing the axially penetrating hollow cavity 11 inside the roller 10 as an optical path channel, the optical sensor 100 is arranged inside the roller 10. This embedded design allows the sensor to be isolated from the external etching environment, avoiding corrosion and contamination of the sensor by external etching solutions, reducing the impact of high-temperature environments, thereby improving the service life of the monitoring device and the accuracy of the measurement data.
[0068] Furthermore, by setting at least two sets of optical sensors 100 along the radial direction of the roller 10, different positions of the roller 10 can be monitored synchronously, and the overall deformation level of the roller 10 can be determined. Through real-time monitoring and graded alarm strategies, an early warning can be issued before the roller 10 undergoes severe deformation, leading to silicon wafer breakage or equipment contamination. This effectively avoids the risk of product scrap and large-scale equipment downtime losses, and greatly improves the yield and efficiency of the semiconductor manufacturing process.
[0069] In some exemplary embodiments, such as Figure 2 As shown, at least a group of optical sensors 100 are arranged sequentially at intervals along the circumference of the roller 10.
[0070] Using the above scheme, at least one set of optical sensors 100 does not consist of a single optical sensor 100, but rather comprises multiple optical sensors 100 arranged sequentially and at intervals along the circumference of the roller 10. The transmitting end 110 and receiving end 120 of each optical sensor 100 are located at opposite axial ends of the cavity 11 in the roller 10, and the light path propagates along the axial direction of the roller 10. Although multiple optical sensors 100 within the same set share the same radial position, due to differences in their circumferential positions, the propagation paths of their respective light paths within the roller 10 point in different circumferential directions.
[0071] If each group uses only a single sensor, deformation can only be monitored in that specific direction. When the roller 10 deforms, if the deformation direction is not exactly in the direction of the sensor's optical path, the optical path may not be affected, leading to deformation detection failure and creating a monitoring blind spot. In this embodiment, multiple optical sensors 100 are arranged circumferentially at intervals, so that at least one group of optical sensors 100 can cover the entire 360° circumference of the roller 10. Regardless of which direction the roller 10 bends or shifts, the optical path in at least one direction will be blocked by the deformed portion, thereby triggering the corresponding sensing signal. This omnidirectional coverage design fundamentally eliminates the monitoring blind spot and ensures the reliability of deformation detection.
[0072] Furthermore, in semiconductor manufacturing environments, sensors may experience occasional malfunctions or performance degradation due to long-term operation. If only a single sensor is used in each group, the monitoring function of the entire group will be completely lost once that sensor fails. In this embodiment, each group contains multiple optical sensors 100 arranged at intervals. Even if individual sensors fail to function properly due to malfunction or occasional interference, the remaining sensors can continue to perform monitoring without causing the entire group of optical sensors 100 to fail.
[0073] Furthermore, the multiple circumferentially distributed optical sensors 100 not only provide information on whether deformation has occurred, but also, through the combination patterns of the signals from each optical sensor 100, can provide information on the direction of deformation. For example, when the optical sensors 100 at the 0° and 180° positions simultaneously alarm, while the optical sensors 100 at the 90° and 270° positions are functioning normally, the control unit 200 can infer that the deformation direction of the roller 10 is approximately along the line connecting 0° and 180°. This makes fault diagnosis more accurate, allowing maintenance personnel to quickly locate the problem and shorten downtime for repairs.
[0074] Therefore, at least one set of optical sensors 100, comprising multiple optical sensors 100 arranged circumferentially, combined with multiple sets of optical sensors 100 arranged radially in layers, enables the device to achieve monitoring in both radial and circumferential dimensions. The radial dimension ensures the classification and monitoring of deformations of different degrees (e.g., minor deformation, moderate deformation, severe deformation), while the circumferential dimension ensures no blind spots in monitoring across the entire circumference.
[0075] In some exemplary embodiments, such as Figure 2 As shown, in at least two sets of adjacent optical sensors 100, the optical sensor 100 of one set is positioned with a gap corresponding to the optical sensor 100 of the other set.
[0076] Using the above scheme, if two adjacent groups of sensors are perfectly aligned circumferentially, the two groups of sensors will form optical paths at the same circumferential position, resulting in redundancy in the monitoring information in these circumferential directions, while monitoring gaps will exist in other directions. This embodiment, by staggering the adjacent groups of optical sensors 100, makes the optical path distribution more uniform throughout the circumference of the roller 10. That is, the optical paths of two adjacent groups of optical sensors 100 are complementary in the circumferential direction, ensuring that as many circumferential positions as possible have corresponding optical paths for monitoring, avoiding the risk of missed detections.
[0077] It is understood, of course, that the above are merely examples, and in other embodiments, such as Figure 3 As shown, two adjacent sets of optical sensors can also be arranged with at least some of the optical sensors aligned.
[0078] Furthermore, in some exemplary embodiments, such as Figure 2 As shown, in each group of optical sensors 100, each optical sensor 100 is symmetrically distributed about the axis of the roller 10.
[0079] During processing, the roller 10 may be subjected to uneven mechanical stress, thermal stress, or external impact, causing it to bend or shift in any direction. If the sensors are not symmetrically distributed, the deformation cannot be effectively captured. In this embodiment, by symmetrically distributing the optical sensors 100 around their axes, the monitoring signal covers a 360° circumference around the roller 10, ensuring omnidirectional monitoring without blind spots. Furthermore, since the sensors are symmetrical about their axes and equally spaced, the deformation of the roller 10 in all directions has a uniform impact on the optical path. Therefore, the control unit 200 does not need to set differentiated compensation coefficients for different directions, simplifying the data processing logic.
[0080] Furthermore, in some exemplary embodiments, such as Figure 2As shown, at least two sets of optical sensors 100 include a first set of optical sensors 100A, a second set of optical sensors 100B, and a third set of optical sensors 100C arranged radially from the periphery to the center of the roller 10; wherein,
[0081] The first set of optical sensors 100A includes n1 optical sensors 100, and the n1 optical sensors 100 are evenly distributed on the outermost circumference of the roller 10 with a circumferential spacing of the first central angle, for monitoring the minute deformation of the roller 10.
[0082] The second set of optical sensors 100B includes n2 optical sensors 100, and the n2 optical sensors 100 are evenly distributed around the middle circumference of the roller 10 with a circumferential spacing of the second central angle, for monitoring the moderate deformation of the roller 10.
[0083] The third set of optical sensors 100C includes one optical sensor 100, and the optical sensor 100 is located at the center of the roller 10 for monitoring severe deformation of the roller 10;
[0084] n1 and n2 are both positive integers greater than or equal to 2.
[0085] In the above scheme, the cross section of the hollow cavity 11 inside the roller 10 is divided into three concentric circular regions, and the optical sensor 100 is arranged in layers according to the radial gradient from the outside to the inside.
[0086] The first set of optical sensors 100A is the outermost layer, located on the outermost circumference near the inner wall of the roller 10. Since this layer is furthest from the rotation center of the roller 10, it is most sensitive to the deflection of the roller 10's angle and is used to monitor minute deformations within a certain threshold. By setting n1 ≥ 2 optical sensors 100 (e.g., 8), the first set of sensors covers as much of the outermost circumference as possible.
[0087] The second set of optical sensors 100B is located in the middle layer, specifically at the center of the cross-section of the roller 10. This set of sensors is positioned between the outer layer and the very center, and is used to monitor larger deformations that exceed the minor deformation threshold but have not yet reached a severe level. By setting n² ≥ 2 optical sensors 100 (e.g., 4), moderate deformation conditions in the middle layer can be determined.
[0088] The third set of optical sensors 100C is located at the very center, that is, at the geometric center of the roller 10, and is used to monitor the severe deformation of the roller 10 when it is subjected to force.
[0089] When roller 10 undergoes a very slight bend (e.g., a displacement of 0.1 mm), the outermost first group of sensors is most likely to trigger an alarm first, thus achieving sensitive detection of minute deformations. Conversely, the central third group of sensors will only have its central optical path blocked when roller 10 undergoes a severe, large-scale overall bend (e.g., a severe displacement of several millimeters). Therefore, the triggering of the third group of sensors can reflect severe deformations.
[0090] In some embodiments, n1 is 8 and the first central angle is 45°; n2 is 4 and the second central angle is 90°. It is understood that the above are merely examples, and the number of optical sensors in each group is not limited to these.
[0091] Furthermore, in some exemplary embodiments, the current deformation level of the roller 10 is determined based on the sensing signals from each group of optical sensors 100; including:
[0092] When the receiving end 120 of less than m optical sensors 100 in the first group of optical sensors 100A feeds back a first sensing signal that no light signal has been received, and the duration is greater than a preset duration T (e.g., 5s), it is determined that the roller 10 is currently in a dirty state, where m is greater than or equal to 2.
[0093] When the receiving end 120 of m optical sensors 100 in the first group of optical sensors 100A feeds back a first sensing signal that no light signal has been received, and the duration is greater than the preset duration T (e.g., 5s), it is determined that the current deformation level of the roller 10 is a micro deformation, where m is greater than or equal to 2.
[0094] When the receiver 120 of any one of the optical sensors 100 in the second group of optical sensors 100B sends back a first sensing signal that no light signal has been received, and the duration is greater than the preset duration T (e.g., 5s), it is determined that the current deformation level of the roller 10 is moderate deformation.
[0095] When the receiver 120 of the optical sensor 100 in the third group of optical sensors 100C sends back a first sensing signal that no light signal has been received, and the duration is greater than the preset duration T (e.g., 5s), it is determined that the current deformation level of the roller 10 is severe deformation.
[0096] For example, based on a preset hierarchical alarm strategy, an alarm command corresponding to the current deformation level is generated, including:
[0097] When the condition is determined to be dirty, a foreign object alert command is generated;
[0098] When a minor deformation is detected, a first-level alert instruction is generated, instructing the equipment to continue operating.
[0099] When the deformation is determined to be moderate, a second-level warning instruction is generated, indicating that the marked roller 10 needs to be replaced;
[0100] When a severe deformation is detected, a Level 3 shutdown command is generated, instructing the equipment to immediately stop for maintenance.
[0101] In the above scheme, the control unit 200 can preset a threshold value of m for the number of optical sensors 100 in the first group of sensors and a threshold value of T for the duration. The optical path occlusion status of each group of sensors is analyzed as follows:
[0102] Suppose that among the n1 optical sensors 100 in the outermost first group of sensors, only the sensor located at a certain directional position (e.g., 120° position) has its light path blocked by etching droplets or dust accumulation, and this blocking state lasts for more than 5 seconds. At this time, the control unit 200 counts the number of sensors in the first group that did not receive a light signal as 1. Since this number is 1 < 2 (i.e., less than m), the system determines that no physical structural deformation has occurred, but rather that the device is in a state of contamination. The control unit 200 only outputs a foreign object warning signal to the user interface, without triggering any form of deformation alarm, and the device can continue to operate.
[0103] Suppose that roller 10 experiences a slight bend due to installation stress, temperature changes, or minor force. This physical displacement causes the optical paths of two adjacent photosensors located at "0°" and "45°" in the first group to be simultaneously blocked, and this state lasts for more than 5 seconds. At this time, the control unit 200 counts the number of unreceived signals as 2. This number is greater than or equal to m, and the duration requirement is met. The system determines that roller 10 has undergone a minor deformation. Although the deformation has not yet reached the level of damaging the silicon wafer, the device begins to record deformation data and sends a minor deformation alert to the maintenance system, indicating that roller 10 needs attention.
[0104] If the first set of sensors remains normal, but the optical path of any one of the sensors in the second set located in the middle layer is blocked for more than 5 seconds, it indicates that the internal structure of the roller 10 has undergone significant structural displacement, and the system directly determines it as moderate deformation.
[0105] If the optical path of the third set of sensors located in the center is interrupted, it indicates that the roller 10 has broken or is extremely bent, which may cause the silicon wafer to shatter. This is directly judged as severe deformation, and the system triggers an emergency stop command.
[0106] The above-described judgment strategy avoids frequent false alarms caused by optical path interruptions due to chemical droplet splashes or dust adhesion (dirt). This embodiment uses a dirt judgment logic that requires fewer than m sensors to alarm. Deformation is only determined when ≥2 sensors alarm simultaneously, effectively filtering out false shutdowns caused by chemical splashes or dust accumulation. If deformation is judged solely based on the state of a single sensor, failure due to circuit aging or occasional malfunction can lead to serious misjudgments. Furthermore, this embodiment requires ≥m sensors in the first or second group to respond simultaneously to confirm a deformation event, greatly improving the reliability of the detection results and ensuring alarm accuracy.
[0107] Furthermore, during semiconductor manufacturing, momentary vibrations of the roller 10 can occur due to factors such as the impact of water flow. This embodiment employs a logic check with a duration exceeding a preset time T to ensure that only continuous and stable displacements are recorded, thus eliminating momentary interference and improving system stability.
[0108] Furthermore, the above-mentioned solution implements a graded control strategy for different deformation levels, which allows operators to intervene in the early stages of a fault, such as cleaning or replacing roller 10, thus avoiding major accidents caused by the accumulation of small problems and effectively protecting the silicon wafer from breakage and contamination.
[0109] When the deformation level is dirty or slightly deformed, the equipment can continue to operate. At this time, the roller 10 state will not cause significant stress to the silicon wafer yield, allowing the equipment to continue working and avoiding accidental shutdowns caused by factors such as liquid splashing or slight stress, thus significantly improving the overall efficiency of the production line.
[0110] Before the deformation of roller 10 is sufficient to cause the silicon wafer to shatter, i.e., when moderate deformation of roller 10 is determined, the system intervenes in advance, marks the component, and stops feeding new wafers. This prevents the risk from occurring and ensures that the yield of subsequent processing is not affected. When the deformation of roller 10 is sufficient to cause the silicon wafer to shatter, i.e., when severe deformation is determined, the system ensures that the power is forcibly cut off before catastrophic consequences occur.
[0111] Furthermore, this disclosure also provides a method for monitoring the deformation of a roller 10, which monitors the deformation of the roller 10 based on the roller 10 deformation monitoring device provided in this disclosure. The method includes:
[0112] Step S01: During the silicon wafer etching process, the emitting end of each group of optical sensors 100 is controlled to continuously emit light signals, and the receiving end of each group of optical sensors 100 generates a corresponding sensing signal in response to the received light signals.
[0113] Step S02: Generate an alarm command corresponding to the current deformation level according to the preset hierarchical alarm strategy.
[0114] In the above scheme, an axially penetrating hollow cavity 11 is designed inside the roller 10 of the etching equipment, and the optical sensor 100 is placed inside the hollow cavity 11 to form a through-beam optical path. Thus, using the optical signal propagating along the axial direction of the roller 10 as the detection carrier, the through-beam optical path directly penetrates the force-bearing axis of the roller 10. When the roller 10 undergoes any degree of bending or deformation, it will cause a shift in the coaxiality of the transmitting end 110 and the receiving end 120, or even block the optical path. This non-contact detection method inside the roller 10 avoids interference from the surface condition of the roller 10 on the detection results, and can directly reflect the deformation status of the roller 10, exhibiting extremely high detection sensitivity and accuracy.
[0115] Furthermore, by utilizing the axially penetrating hollow cavity 11 inside the roller 10 as an optical path channel, the optical sensor 100 is arranged inside the roller 10. This embedded design allows the sensor to be isolated from the external etching environment, avoiding corrosion and contamination of the sensor by external etching solutions, reducing the impact of high-temperature environments, thereby improving the service life of the monitoring device and the accuracy of the measurement data.
[0116] Furthermore, by setting at least two sets of optical sensors 100 along the radial direction of the roller 10, different positions of the roller 10 can be monitored synchronously, and the overall deformation level of the roller 10 can be determined. Through real-time monitoring and graded alarm strategies, an early warning can be issued before the roller 10 undergoes severe deformation, leading to silicon wafer breakage or equipment contamination. This effectively avoids the risk of product scrap and large-scale equipment downtime losses, and greatly improves the yield and efficiency of the semiconductor manufacturing process.
[0117] For example, when at least two sets of optical sensors 100 include a first set of optical sensors 100A, a second set of optical sensors 100B, and a third set of optical sensors 100C arranged radially from the periphery to the center of the roller 10, the current deformation level of the roller 10 is determined based on the sensing signals from each set of optical sensors 100; including:
[0118] When the receiving end 120 of less than m optical sensors 100 in the first group of optical sensors 100A feeds back a first sensing signal that no light signal has been received, and the duration is greater than a preset time, it is determined that the roller 10 has not deformed at present, where m is greater than or equal to 2.
[0119] When the receiving end 120 of m optical sensors 100 in the first group of optical sensors 100A feeds back a first sensing signal that no light signal has been received, and the duration is longer than a preset time, it is determined that the current deformation level of the roller 10 is a micro deformation.
[0120] When the receiver 120 of any one of the optical sensors 100 in the second group of optical sensors 100B sends back a first sensing signal that no light signal has been received, and the duration is longer than a preset time, it is determined that the current deformation level of the roller 10 is moderate deformation.
[0121] When the receiver 120 of the optical sensor 100 in the third group of optical sensors 100C sends back a first sensing signal that no light signal has been received, and the duration is longer than the preset duration, it is determined that the current deformation level of the roller 10 is severe deformation.
[0122] Based on the preset hierarchical alarm strategy, generate alarm instructions corresponding to the current deformation level, including:
[0123] When the condition is determined to be dirty, a foreign object alert command is generated;
[0124] When a minor deformation is detected, a first-level alert instruction is generated, instructing the equipment to continue operating.
[0125] When the deformation is determined to be moderate, a second-level warning instruction is generated, indicating that the marked roller 10 needs to be replaced;
[0126] When a severe deformation is detected, a Level 3 shutdown command is generated, instructing the equipment to immediately stop for maintenance.
[0127] In the above scheme, the control unit 200 can preset a threshold value of m for the number of optical sensors 100 in the first group of sensors and a threshold value of T for the duration. The optical path occlusion status of each group of sensors is analyzed as follows:
[0128] Suppose that among the n1 optical sensors 100 in the outermost first group of sensors, only the sensor located at a certain directional position (e.g., 120° position) has its light path blocked by etching droplets or dust accumulation, and this blocking state lasts for more than 5 seconds. At this time, the control unit 200 counts the number of sensors in the first group that did not receive a light signal as 1. Since this number is 1 < 2 (i.e., less than m), the system determines that no physical structural deformation has occurred, but rather that the device is in a state of contamination. The control unit 200 only outputs a foreign object warning signal to the user interface, without triggering any form of deformation alarm, and the device can continue to operate.
[0129] Suppose that roller 10 experiences a slight bend due to installation stress, temperature changes, or minor force. This physical displacement causes the optical paths of two adjacent photosensors located at "0°" and "45°" in the first group to be simultaneously blocked, and this state lasts for more than 5 seconds. At this time, the control unit 200 counts the number of unreceived signals as 2. Since the number is 2 >= 2 (i.e., greater than or equal to m), and the duration requirement is met, the system determines that roller 10 has undergone a minor deformation. Although the deformation has not yet reached the point of damaging the silicon wafer, the device begins recording deformation data and sends a minor deformation alert to the maintenance system, indicating that roller 10 needs attention.
[0130] If the first set of sensors remains normal, but the optical path of any one of the sensors in the second set located in the middle layer is blocked for more than 5 seconds, it indicates that the internal structure of the roller 10 has undergone significant structural displacement, and the system directly determines it as moderate deformation.
[0131] If the optical path of the third set of sensors located in the center is interrupted, it indicates that the roller 10 has broken or is extremely bent, which may cause the silicon wafer to shatter. This is directly judged as severe deformation, and the system triggers an emergency stop command.
[0132] The above-described judgment strategy avoids frequent false alarms caused by optical path interruptions due to chemical droplet splashes or dust adhesion (dirt). This embodiment uses a dirt judgment logic that requires fewer than m sensors to alarm. Deformation is only determined when ≥2 sensors alarm simultaneously, effectively filtering out false shutdowns caused by chemical splashes or dust accumulation. If deformation is judged solely based on the state of a single sensor, failure due to circuit aging or occasional malfunction can lead to serious misjudgments. Furthermore, this embodiment requires ≥m sensors in the first or second group to respond simultaneously to confirm a deformation event, greatly improving the reliability of the detection results and ensuring alarm accuracy.
[0133] Furthermore, during semiconductor manufacturing, momentary vibrations of the roller 10 can occur due to factors such as the impact of water flow. This embodiment employs a logic check with a duration exceeding a preset time T to ensure that only continuous and stable displacements are recorded, thus eliminating momentary interference and improving system stability.
[0134] Furthermore, the above-mentioned solution implements a graded control strategy for different deformation levels, which allows operators to intervene in the early stages of a fault, such as cleaning or replacing roller 10, thus avoiding major accidents caused by the accumulation of small problems and effectively protecting the silicon wafer from breakage and contamination.
[0135] When the deformation level is dirty or slightly deformed, the equipment can continue to operate. At this time, the roller 10 state will not cause significant stress to the silicon wafer yield, allowing the equipment to continue working and avoiding accidental shutdowns caused by factors such as liquid splashing or slight stress, thus significantly improving the overall efficiency of the production line.
[0136] Before the deformation of roller 10 is sufficient to cause the silicon wafer to shatter, i.e., when moderate deformation of roller 10 is determined, the system intervenes in advance, marks the component, and stops feeding new wafers. This prevents the risk from occurring and ensures that the yield of subsequent processing is not affected. When the deformation of roller 10 is sufficient to cause the silicon wafer to shatter, i.e., when severe deformation is determined, the system ensures that the power is forcibly cut off before catastrophic consequences occur.
[0137] Furthermore, embodiments of this disclosure also provide an etching apparatus, comprising:
[0138] Medicine tank;
[0139] Roller 10 installed in the medicine tank; and
[0140] The roller deformation monitoring device provided in this embodiment.
[0141] Obviously, the etching apparatus of this disclosure also has the beneficial effects of the roller 10 deformation monitoring device provided in this disclosure, which will not be described in detail here.
[0142] The above are merely specific embodiments of this disclosure, but the scope of protection of this disclosure is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this disclosure should be included within the scope of protection of this disclosure. Therefore, the scope of protection of this disclosure should be determined by the scope of the claims.
[0143] The embodiments of this disclosure have been described above with reference to the accompanying drawings. However, this disclosure is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of this disclosure without departing from the spirit and scope of the claims, and all of these forms are within the protection scope of this disclosure.
Claims
1. A roller deformation monitoring device, characterized in that, It is applied to etching equipment, the etching equipment including a roller, the roller having an axially through hollow cavity inside; The roller deformation monitoring device includes: At least two sets of optical sensors are arranged at different radial positions along the roller from the periphery to the center. Each optical sensor includes a corresponding transmitter and receiver. The transmitter and receiver are located at opposite ends of the hollow cavity to form a through-beam optical path. The transmitter is used to emit an optical signal that propagates along the axial direction of the hollow cavity, and the receiver is used to generate a corresponding sensing signal based on the state of the received optical signal. and A control unit, connected to the at least two sets of optical sensors, is used for: The current deformation level of the roller is determined based on the sensing signals from each group of optical sensors. Based on the preset hierarchical alarm strategy, generate the alarm command corresponding to the current deformation level.
2. The roller deformation monitoring device according to claim 1, characterized in that, At least a group of optical sensors are arranged sequentially at intervals along the circumference of the roller.
3. The roller deformation monitoring device according to claim 2, characterized in that, In at least two adjacent sets of optical sensors, the optical sensors of one are spaced apart from the optical sensors of the other.
4. The roller deformation monitoring device according to claim 2, characterized in that, In each group of optical sensors, the optical sensors are symmetrically distributed about the axis of the roller.
5. The roller deformation monitoring device according to claim 1, characterized in that, The at least two sets of optical sensors include a first set of optical sensors, a second set of optical sensors, and a third set of optical sensors arranged sequentially from the periphery to the center along the radial direction of the roller; wherein... The first set of optical sensors includes n1 optical sensors, and the n1 optical sensors are evenly distributed around the outermost circumference of the roller with a circumferential spacing of a first central angle, for monitoring the minute deformation of the roller; The second set of optical sensors includes n2 optical sensors, and the n2 optical sensors are evenly distributed around the middle circumference of the roller with a circumferential spacing of the second central angle, for monitoring the moderate deformation of the roller; The third set of optical sensors includes one optical sensor, which is located at the center of the roller and is used to monitor severe deformation of the roller. n1 and n2 are both positive integers greater than or equal to 2.
6. The roller deformation monitoring device according to claim 5, characterized in that, n1 is 8, and the first central angle is 45°; n2 is 4, and the second central angle is 90°.
7. The roller deformation monitoring device according to claim 5, characterized in that, The step of determining the current deformation level of the roller based on the sensing signals from each group of optical sensors includes: When the receiving end of less than m optical sensors in the first group of optical sensors feeds back a first sensing signal that no light signal has been received, and the duration is greater than a preset time, it is determined that the roller is currently in a dirty state, where m is greater than or equal to 2; When the receiving end of m optical sensors in the first group of optical sensors returns a first sensing signal that no light signal has been received, and the duration is greater than a preset duration, it is determined that the current deformation level of the roller is a micro deformation, where m is greater than or equal to 2. When the receiver of any one of the optical sensors in the second group of optical sensors sends back a first sensing signal that no light signal has been received, and the duration is longer than a preset duration, it is determined that the current deformation level of the roller is moderate deformation. When the receiving end of the optical sensor in the third group of optical sensors sends back a first sensing signal indicating that no light signal has been received, and the duration is longer than a preset duration, the current deformation level of the roller is determined to be severe deformation.
8. The roller deformation monitoring device according to claim 7, characterized in that, The step of generating an alarm command corresponding to the current deformation level according to a preset hierarchical alarm strategy includes: When the condition is determined to be dirty, a foreign object alert command is generated; When a minor deformation is detected, a first-level alert instruction is generated, instructing the equipment to continue operating. When the deformation is determined to be moderate, a second-level warning instruction is generated, indicating that the marked roller needs to be replaced; When a severe deformation is detected, a Level 3 shutdown command is generated, instructing the equipment to immediately stop for maintenance.
9. A method for monitoring roller deformation, characterized in that, Roller deformation monitoring is performed based on the roller deformation monitoring device as described in any one of claims 1 to 8, and the method includes: During the silicon wafer etching process The transmitter of each group of optical sensors is controlled to continuously emit light signals, and the receiver of each group of optical sensors generates a corresponding sensing signal in response to the received light signals. The current deformation level of the roller is determined based on the sensing signals from each group of optical sensors. Based on the preset hierarchical alarm strategy, generate the alarm command corresponding to the current deformation level.
10. The roller deformation monitoring method according to claim 9, characterized in that, When the at least two sets of optical sensors include a first set of optical sensors, a second set of optical sensors, and a third set of optical sensors arranged sequentially from the periphery to the center along the radial direction of the roller, the step of determining the current deformation level of the roller based on the sensing signals from each set of optical sensors includes: When the receiving end of less than m optical sensors in the first group of optical sensors feeds back a first sensing signal that no light signal has been received, and the duration is greater than a preset time, it is determined that the roller has not deformed at present, where m is greater than or equal to 2; When the receiving end of m optical sensors in the first group of optical sensors reports a first sensing signal that no light signal has been received, and the duration is greater than a preset duration, it is determined that the current deformation level of the roller is a micro deformation. When the receiver of any one of the optical sensors in the second group of optical sensors sends back a first sensing signal that no light signal has been received, and the duration is longer than a preset duration, it is determined that the current deformation level of the roller is moderate deformation. When the receiving end of the optical sensor in the third group of optical sensors returns a first sensing signal that no light signal has been received, and the duration is longer than a preset duration, the current deformation level of the roller is determined to be severe deformation. The step of generating an alarm command corresponding to the current deformation level according to a preset hierarchical alarm strategy includes: When the condition is determined to be dirty, a foreign object alert command is generated; When a minor deformation is detected, a first-level alert instruction is generated, instructing the equipment to continue operating. When the deformation is determined to be moderate, a second-level warning instruction is generated, indicating that the marked roller needs to be replaced; When a severe deformation is detected, a Level 3 shutdown command is generated, instructing the equipment to immediately stop for maintenance.
11. An etching apparatus, characterized in that, include: Medicine tank; Rollers disposed within the medicine tank; and The roller deformation monitoring device as described in any one of claims 1 to 8.