Appearance structure of photoelectric component analysis equipment

Abstract

The utility model relates to the technical field of optical communication, in particular to an appearance structure of photoelectric component analysis equipment, which comprises a front panel and an upper cover, one side of the front panel is connected with an installation frame body, one side of the installation frame body is connected with a rear frame, one side of the rear frame is connected with a rear panel, and the upper cover is connected with the front panel. Side lower connecting plates and side upper connecting plates are arranged on the two sides of the front panel, one end of each side lower connecting plate and one end of each side upper connecting plate are connected with the rear frame, a first clamping groove used for clamping the bottom plate is formed in the bottom of the front panel, the rear end of the bottom plate is clamped in a second clamping groove, and the second clamping groove is formed in one side of the bottom of the rear frame; the upper cover and the side edge of the front panel are clamped in a third clamping groove, the other end of the upper cover is clamped with a fourth clamping groove, and the fourth clamping groove is formed in the surface of one side of the rear frame. According to the utility model, overall rapid splicing can be carried out, the overall structure is compact after splicing installation, the structure is firm and light, and carrying and use are convenient.

Description

Technical Field

[0001] The utility model relates to the technical field of optical communication, in particular to an appearance structure of photoelectric component analysis equipment. Background Art

[0002] The basic principle of photoelectric detection technology is to utilize the interaction between photons and matter, and to obtain relevant information of the object being measured by measuring the intensity, wavelength, phase and other physical properties of light signals. The basic principle of photoelectric detection technology is to utilize the interaction between photons and matter, and to obtain relevant information of the object being measured by measuring the intensity, wavelength, phase and other physical properties of light signals.

[0003] The structure of the existing optoelectronic component analyzer is made of pure sheet metal, which has a bulky structure, large overall assembly gaps, an unstable frame that is not easy to carry, and does not take into account anti-static and anti-shielding capabilities. Utility Model Content

[0004] The utility model aims to propose an appearance structure of an optoelectronic component analysis device in view of the problems that the existing optoelectronic component analyzer structure in the background technology is made of pure sheet metal, has a bulky structure, has a large overall assembly gap, an unstable frame and is not easy to carry, and does not consider the anti-static and anti-shielding capabilities.

[0005] The technical solution of the utility model: an appearance structure of an optoelectronic component analysis device, comprising a front panel and an upper cover, one side of the front panel is connected to a mounting frame, one side of the mounting frame is connected to a rear frame, one side of the rear frame is connected to the rear panel, lower side connecting plates and upper side connecting plates are arranged on both sides of the front panel, one end of the lower side connecting plate and the upper side connecting plate are connected to the rear frame, a card slot 1 for carding a bottom plate is arranged at the bottom of the front panel, the rear end of the bottom plate is carded in a card slot 2, and the card slot 2 is arranged at one side of the bottom of the rear frame;

[0006] The upper cover and the side of the front panel are snap-fitted in the third snap-fitting slot, and the other end of the upper cover is snap-fitted with the fourth snap-fitting slot, which is arranged on a side surface of the rear frame.

[0007] Preferably, the installation frame is provided with installation holes corresponding to the front panel, and the installation frame is connected to the front panel via the installation holes, so that the installation frame and the front panel can be easily positioned and installed quickly.

[0008] Preferably, the rear frame is provided with connection holes corresponding to the installation frame, and the rear frame is tightly connected to the installation frame through the connection holes, so that the rear frame and the installation frame can be quickly positioned and installed.

[0009] Preferably, a side baffle is provided on one side of the front panel, and the other end of the side baffle is connected to the rear frame, so that the front panel, the side baffle and the rear frame can be connected as a whole.

[0010] Preferably, a plurality of heat dissipation holes are equidistantly arranged on a surface of one side of the side baffle, and a handle is arranged at one end of the side baffle, so as to facilitate heat dissipation of the device and to facilitate carrying.

[0011] Preferably, a rear foot mounting block is provided at the corner of the rear panel to improve the shock absorbing effect of the device.

[0012] Preferably, a hole is provided on one side surface of the bottom plate, and a shock-absorbing pad is provided in the hole, thereby improving the shock-absorbing effect of the bottom plate.

[0013] Preferably, the side baffles, front panel, bottom plate, upper cover, rear frame and mounting frame are all made of aluminum alloy, and the surfaces are subjected to frosted conductive oxidation and plastic spraying treatment to enhance conductivity and achieve insulation and anti-static effects.

[0014] Compared with the prior art, the above technical solution of the utility model has the following beneficial technical effects:

[0015] In the present application, the shock-absorbing pad and the rear foot mounting block are made of ABS material, which has a shock-absorbing effect; at the same time, the rear foot mounting block is designed with the rear foot and the bottom foot connected as one, which is easy to install; in terms of structure, the second and fourth card slots are designed to make the bottom plate and the front panel mutually clamped to achieve a fastening effect; when the present application is used in stacking, the upper and lower present applications can be both beautiful and can achieve an overall fixing effect.

[0016] The front panel of the present invention is designed with a first card slot and a third card slot on the upper and lower sides, so that the upper cover and the bottom plate can be inserted therein, reducing the number of screws used and also ensuring the strength and stability of the overall structure; grooves are also designed on both sides of the front panel, and when the lower connecting plate and the upper connecting plate are assembled, the structure is just embedded therein, so that the entire side remains flat, which is more convenient for overall assembly. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the exploded structure of the optoelectronic component analysis device of the first embodiment from a first viewing angle;

[0018] Figure 2 A schematic diagram of the exploded structure from the second perspective of the appearance structure of the optoelectronic component analysis equipment;

[0019] Figure 3 A schematic diagram of the assembly structure of the upper cover and the front panel in the appearance structure of the optoelectronic component analysis equipment;

[0020] Figure 4 This is a schematic diagram of the overall structure of the side baffle in the appearance structure of the optoelectronic component analysis equipment;

[0021] Figure 5This is a schematic diagram of the location structure of the second card slot in the appearance structure of the optoelectronic component analysis equipment.

[0022] Figure numerals: 1. front panel; 2. lower side connecting plate; 3. upper side connecting plate; 4. side baffle; 5. handle; 6. rear foot mounting block; 7. upper cover; 8. rear panel; 9. rear frame; 10. mounting frame; 11. bottom plate; 12. shock-absorbing pad; 13. slot one; 14. slot two; 15. slot three; 16. slot four. DETAILED DESCRIPTION

[0023] Embodiment 1

[0024] like Figure 1-5 As shown, the appearance structure of an optoelectronic component analysis device proposed by the utility model includes a front panel 1 and an upper cover 7, one side of the front panel 1 is connected to a mounting frame 10, one side of the mounting frame 10 is connected to a rear frame 9, one side of the rear frame 9 is connected to a rear panel 8, both sides of the front panel 1 are provided with a side lower connecting plate 2 and a side upper connecting plate 3, one end of the side lower connecting plate 2 and the side upper connecting plate 3 is connected to the rear frame 9, a card slot 13 for carding a bottom plate 11 is provided at the bottom of the front panel 1, the rear end of the bottom plate 11 is carded in a card slot 2 14, and the card slot 2 14 is provided at one side of the bottom of the rear frame 9;

[0025] The upper cover 7 and the side of the front panel 1 are snap-fitted into the snap-fitting slot 3 15 , and the other end of the upper cover 7 is snap-fitted into the snap-fitting slot 4 16 , which is arranged on one side surface of the rear frame 9 .

[0026] The mounting frame 10 is provided with mounting holes corresponding to the front panel 1 , and the mounting frame 10 is connected to the front panel 1 via the mounting holes, so that the mounting frame 10 and the front panel 1 can be quickly positioned and installed.

[0027] The rear frame 9 is provided with connection holes corresponding to the installation frame 10 , and the rear frame 9 is tightly connected to the installation frame 10 through the connection holes, so that the rear frame 9 and the installation frame 10 can be quickly positioned and installed.

[0028] A side guard plate 4 is disposed on one side of the front panel 1 , and the other end of the side guard plate 4 is connected to the rear frame 9 , so that the front panel 1 , the side guard plate 4 and the rear frame 9 can be integrally connected.

[0029] A plurality of heat dissipation holes are evenly spaced on one side surface of the side baffle plate 4, and a handle 5 is provided at one end of the side baffle plate 4 to facilitate heat dissipation of the device and to facilitate carrying.

[0030] In this embodiment, the front panel 1 is first connected to the corresponding mounting holes of the mounting frame 10, the rear frame 9 is tightly installed at the corresponding connecting holes of the mounting frame 10, and then the rear panel 8 is installed correspondingly to the connecting holes of the rear frame 9, and the left and right side lower connecting plates and the side upper connecting plates 3 are connected to the side connecting holes of the front panel 1, and then installed and connected to the side connecting holes of the rear frame 9. At this time, the front part of the bottom plate 1111 is installed at the bottom slot 13 of the front panel 11, and the rear part is installed at the bottom slot 2 of the rear frame 9 14; the upper cover 7 is mutually locked with the side slot 3 of the front panel 1 15, and the upper cover 7 is mutually locked with the side slot 4 of the rear frame 9 16; the side baffle 4 is installed at the side mounting hole of the front panel 1, and is installed at the rear frame 9 at the same time. At the side mounting holes; at this time, the handles 5 are installed on both sides of the front panel 1, the rear foot mounting blocks 6 are installed on the corner mounting holes of the rear panel 8, and finally the shock-absorbing pads 12 are installed on the front mounting holes of the bottom plate 11. In summary, the above structural aspects are designed with card slots 2 14 and card slots 4 16, so that the bottom plate 11 and the front panel 1 are mutually clamped to achieve a fastening effect. Card slots 1 13 and card slots 3 15 are designed on the upper and lower parts of the front panel 1, so that the upper cover 7 and the bottom plate 11 can be inserted therein, reducing the number of screws used, and at the same time ensuring the strength and stability of the overall structure; grooves are also designed on both sides of the front panel 1, and when the side lower connecting plate 2 and the side upper connecting plate 3 are assembled, the structure is just embedded therein, so that the entire side remains flat, which is more convenient for overall assembly.

[0031] Embodiment 2

[0032] like Figure 1-5 As shown, the appearance structure of an optoelectronic component analysis device proposed by the utility model, compared with the first embodiment, the side baffle 4, the front panel 1, the bottom plate 11, the upper cover 7, the rear frame 9 and the installation frame 10 in this embodiment are all made of aluminum alloy, and the surface is frosted conductively oxidized and sprayed to enhance conductivity and achieve the effect of insulation and anti-static.

[0033] Embodiment 3

[0034] like Figure 1 and Figure 2 As shown, the appearance structure of an optoelectronic component analysis device proposed by the utility model, compared with embodiment one or embodiment two, this embodiment also includes a rear ground mounting block 6, and the rear ground mounting block 6 is arranged at the corner of the rear panel 8, which improves the shock absorption effect of the device, and a hole body is arranged on the surface of one side of the bottom plate 11, and a shock absorption pad 12 is arranged in the hole body, which improves the shock absorption effect of the bottom plate 11.

[0035] In this embodiment, the shock-absorbing pad 12 and the rear foot mounting block 6 are made of ABS material, which has a shock-absorbing effect; at the same time, the rear foot mounting block 6 is designed with the rear foot and the bottom foot connected as one, which is easy to install.

[0036] The implementation modes of the present invention are described in detail above in conjunction with the accompanying drawings, but the present invention is not limited thereto, and various changes can be made within the knowledge scope of technicians in the relevant technical field without departing from the purpose of the present invention.

Claims

1. An optical component analysis device with an external structure. It is characterized in that The invention comprises a front panel (1) and an upper cover (7), wherein one side of the front panel (1) is connected to a mounting frame (10), one side of the mounting frame (10) is connected to a rear frame (9), one side of the rear frame (9) is connected to a rear panel (8), lower side connecting plates (2) and upper side connecting plates (3) are arranged on both sides of the front panel (1), one end of the lower side connecting plates (2) and the upper side connecting plates (3) are connected to the rear frame (9), a first card slot (13) for carding a bottom plate (11) is arranged at the bottom of the front panel (1), the rear end of the bottom plate (11) is carded in a second card slot (14), and the second card slot (14) is arranged at one side of the bottom of the rear frame (9); The upper cover (7) and the side of the front panel (1) are snap-fitted into the third snap-fitting slot (15), and the other end of the upper cover (7) is snap-fitted into the fourth snap-fitting slot (16), and the fourth snap-fitting slot (16) is arranged on a side surface of the rear frame (9).

2. The appearance structure of the optoelectronic component analysis device according to claim 1, It is characterized in that The installation frame (10) is provided with installation holes corresponding to the front panel (1), and the installation frame (10) is connected to the front panel (1) via the installation holes.

3. The appearance structure of the optoelectronic component analysis device according to claim 1, It is characterized in that The rear frame (9) is provided with a connection hole corresponding to the installation frame (10), and the rear frame (9) is tightly connected to the installation frame (10) through the connection hole.

4. The appearance structure of the optoelectronic component analysis device according to claim 1, It is characterized in that A side baffle (4) is provided on one side of the front panel (1), and the other end of the side baffle (4) is connected to the rear frame (9).

5. The appearance structure of the optoelectronic component analysis device according to claim 4, It is characterized in that A plurality of groups of heat dissipation holes are arranged at equal intervals on a surface of one side of the side baffle (4), and a handle (5) is arranged at one end of the side baffle (4).

6. The appearance structure of the optoelectronic component analysis device according to claim 1, It is characterized in that A rear foot mounting block (6) is provided at a corner of the rear panel (8).

7. The appearance structure of the optoelectronic component analysis device according to claim 1, It is characterized in that A hole is provided on one side surface of the bottom plate (11), and a shock-absorbing pad (12) is provided in the hole.

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