Laser processing equipment

Abstract

The utility model relates to the technical field of laser processing, in particular to laser processing equipment, a to-be-processed material is conveyed along a processing path of the laser processing equipment, and the laser processing equipment is provided with a processing assembly, a laser emitting device, a laser processing assembly and a laser processing assembly on the processing path, the processing assembly comprises a processing table and a laser emitting device, and the processing table is provided with a feeding end and a discharging end; a first scanning area is arranged on the part, close to the discharging end, of the machining path. The light source assembly is arranged above and / or below the first scanning area; the scanning assembly is arranged above the first scanning area; the scanning assembly comprises a line scanning visual module and a visual analysis module, and the line scanning visual module is in signal connection with the visual analysis module. According to the laser processing equipment, through cooperation of the light source assembly, the line scanning vision module and the vision analysis module, online monitoring of the processing effect is achieved, the situation that after a semi-finished product or a finished product is formed through pressing and other rear-section procedures, an electric testing machine and the like are used for processing quality testing is not needed, the production time is saved, and the production cost is reduced.

Description

[Technical field]

[0001] The present application relates to the field of laser processing technology, and in particular to a laser processing device. [Background technology]

[0002] Laser processing equipment can use laser as energy to process thin film materials such as polymer films, metal films or composite films. By controlling parameters such as the intensity, frequency, and pulse width of the laser beam, the laser energy is focused, so that the thin film material is heated and evaporated, melted or ablated in a very short time, thereby achieving drilling processing of the thin film material.

[0003] However, the number of holes processed in existing thin film materials is generally around 100,000 to 300,000 holes. If quality problems such as missed holes, multiple holes or unqualified hole parameters occur during the processing, manual visual inspection is impossible. The product needs to go through subsequent post-processing such as pressing to form a semi-finished product or finished product before an electrical measuring machine can be used to test the above quality problems. The scrapping cost of thin film materials is high. In addition, if the processed thin film material is rolled up, a set of automated equipment is required to unroll the roll for AOI optical visual monitoring, and then rewind it after the monitoring is completed. The monitoring process is complicated and time-consuming. [Utility Model Content]

[0004] In view of this, the present application provides a laser processing device, which realizes online monitoring of the processing effect of the material to be processed through the cooperation of a light source component, a line scanning vision module and a vision analysis module.

[0005] The present application provides a laser processing device for use in a processing process of a material to be processed, wherein the material to be processed is transported along a processing path of the laser processing device, and the laser processing device is provided on the processing path:

[0006] The processing assembly includes a processing table and a laser emitting device, wherein the processing table is provided with a feeding end and a discharging end; a portion of the processing path close to the discharging end is provided with a first scanning area;

[0007] A light source assembly is arranged above and / or below the first scanning area;

[0008] The scanning component is arranged above the first scanning area; the scanning component includes a line scanning vision module and a vision analysis module, and the line scanning vision module and the vision analysis module are signal connected.

[0009] In some feasible embodiments, the light source assembly includes a first light source and a second light source, the first light source is arranged above the first scanning area, and is used to provide a light source with linear distribution, uniform and adjustable light; the second light source is arranged below the first scanning area, and is used to provide a light source with good directionality and no shadow.

[0010] In some feasible embodiments, the first light source includes at least one of a point light source, a surface light source, a line light source, a strip light source, and a ring light source, and the second light source is at least one of a collimated light source and a parallel light source.

[0011] In some feasible implementations, the material to be processed is a coil to be processed, and the laser processing equipment includes a coil loading mechanism, and the coil loading mechanism is arranged on the processing path close to the feeding end;

[0012] The coil material feeding mechanism is provided with a first shaft structure, and the coil material to be processed is installed on the first shaft structure.

[0013] In some feasible implementations, the first shaft structure is provided with a damper for reducing a feeding speed of the first shaft structure.

[0014] In some feasible implementations, the laser processing equipment includes a first material receiving mechanism, and the first material receiving mechanism is arranged on the processing path close to the material discharge end;

[0015] The first material receiving mechanism is provided with a second shaft structure for collecting the processed coiled material to be processed.

[0016] In some feasible implementations, the laser processing equipment includes a second material receiving mechanism, and the second material receiving mechanism is arranged on the processing path close to the material discharging end;

[0017] The second material receiving mechanism includes a pressure roller assembly and a cutting assembly. The pressure roller assembly is arranged closer to the discharge end on the processing path than the cutting assembly. The pressure roller assembly is used to flatten the processed coil material to be processed, and the cutting assembly is used to cut the processed coil material after flattening into shape.

[0018] In some feasible implementations, the material to be processed is a sheet to be processed, and the laser processing equipment includes a sheet feeding mechanism, and the sheet feeding mechanism is arranged on the processing path close to the feeding end;

[0019] The sheet material feeding structure includes a third axis structure and a sticky coil. The sheet material to be processed is attached to the sticky coil on the processing path so that the sticky coil delivers the sheet material to be processed to the processing table.

[0020] In some feasible implementations, the laser processing equipment further includes a viscous coil material receiving mechanism, and the viscous coil material receiving mechanism is arranged on the processing path close to the discharge end;

[0021] The viscous coil material receiving mechanism comprises a fourth axis structure for collecting the viscous coil material after feeding.

[0022] In some feasible implementations, a second scanning area is provided on a portion of the processing path close to the feed end, and the second scanning area is provided with a scanning component and a light source component.

[0023] After adopting the above technical solution, at least the following beneficial effects are achieved:

[0024] The laser processing equipment provided by the present application can process the material to be processed through the laser emitting device of the processing component when the material to be processed is transported on the processing path. At the same time, the processed material is detected for processing effect on the processing part through the cooperation of the light source component in the first scanning area and the line scanning visual module, and then the visual analysis module confirms the processing effect. That is, the laser processing equipment of the present application integrates the processing and detection process of the product, realizes the online monitoring of the processing quality of the material to be processed, and does not need to use an electric measuring machine to perform processing quality testing after forming a semi-finished product or a finished product through a later process such as pressing, and there is no need to use steps such as coil unfolding when monitoring the processed coil, which saves monitoring time, ensures product quality, and reduces production costs.

Brief Description of the Drawings

[0025] Figure 1 A schematic diagram of the structure of a laser processing device provided in this application;

[0026] Figure 2 A schematic diagram of the structure of another laser processing device provided in this application;

[0027] Figure 3 A schematic structural diagram of another laser processing equipment provided in this application.

[0028] Figure ID:

[0029] 10. Material to be processed; 1. Processing table; 11. Feed end; 12. Discharge end; 13. Laser emitting device; 21. First light source; 22. Second light source; 3. Scanning assembly; 4. Coil loading mechanism; 5. First receiving mechanism; 61. Pressing roller assembly; 62. Cutting assembly; 71. Third axis structure; 72. Viscous coil; 8. Viscous coil receiving mechanism. [Specific implementation method]

[0030] In order to better understand the technical solution of the present application, the embodiments of the present application are described in detail below with reference to the accompanying drawings.

[0031] It should be clear that the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present application.

[0032] The terms used in the embodiments of the present application are only for the purpose of describing specific embodiments, and are not intended to limit the present application. The singular forms "a", "said" and "the" used in the embodiments of the present application and the appended claims are also intended to include plural forms, unless the context clearly indicates other meanings.

[0033] It should be understood that the term "and / or" used in this article is only a description of the association relationship of associated objects, indicating that there can be three relationships. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this article generally indicates that the associated objects before and after are in an "or" relationship.

[0034] It should be noted that the directional words such as "upper", "lower", "left", and "right" described in the embodiments of the present application are described at the angles shown in the accompanying drawings and should not be understood as limiting the embodiments of the present application. In addition, in the context, it is also necessary to understand that when it is mentioned that an element is connected to another element "upper" or "lower", it can not only be directly connected to another element "upper" or "lower", but also indirectly connected to another element "upper" or "lower" through an intermediate element.

[0035] Laser processing equipment can use laser as energy to process thin film materials such as polymer films, metal films or composite films. By controlling parameters such as the intensity, frequency, and pulse width of the laser beam, the laser energy is focused, so that the thin film material is heated and evaporated, melted or ablated in a very short time, thereby achieving drilling processing of the thin film material.

[0036] However, the number of holes processed in existing thin film materials is generally around 100,000 to 300,000 holes. If quality problems such as missed holes, multiple holes or unqualified hole parameters occur during the processing, manual visual inspection is impossible. The product needs to go through subsequent post-processing such as pressing to form a semi-finished product or finished product before an electrical measuring machine can be used to test the above quality problems. The scrapping cost of thin film materials is high. In addition, if the processed thin film material is rolled up, a set of automated equipment is required to unroll the roll for AOI optical visual monitoring, and then rewind it after the monitoring is completed. The monitoring process is complicated and time-consuming.

[0037] In view of this, the present application provides a laser processing device for processing a material 10 to be processed. The material 10 to be processed is transported along a processing path of the laser processing device. Figure 1 to Figure 3 , the laser processing equipment is equipped with:

[0038] The processing assembly includes a processing table 1 and a laser emitting device 13. The processing table 1 is provided with a feeding end 11 and a discharging end 12. The portion of the processing path close to the discharging end 12 is a first scanning area.

[0039] A light source assembly is disposed above and / or below the first scanning area;

[0040] The scanning component 3 is arranged above the first scanning area; the scanning component 3 includes a line scanning vision module and a vision analysis module, and the line scanning vision module and the vision analysis module are signal connected.

[0041] In the above scheme, the laser processing equipment provided by the present application can process the material 10 to be processed through the laser emitting device 13 of the processing component when the material 10 to be processed is transported on the processing path. At the same time, the processed material is detected for processing effect on the processing part by the cooperation of the light source component in the first scanning area and the line scanning visual module, and then the visual analysis module confirms the processing effect. That is, the laser processing equipment of the present application integrates the processing and detection process of the product, realizes the online monitoring of the processing quality of the material 10 to be processed, and does not need to be subjected to the back-end process such as pressing to form a semi-finished product or finished product and then use an electric measuring machine to perform processing quality testing, and when monitoring the processing coil, there is no need for steps such as coil unfolding, which saves monitoring time, ensures product quality, and reduces production costs.

[0042] In some embodiments, the processing path of the laser processing equipment of the present application refers to the conveying path of the material to be processed 10, that is, the conveying of the material to be processed 10 along the processing process of loading-laser processing-quality detection-quality analysis-unloading of the material to be processed 10 after the detection is completed. The distance, height and position relationship of the conveying path are not limited in the present application. The processing path can be adjusted according to the processing difficulty, the spatial distribution of the plant, etc., and the conveying speed of the material to be processed 10 on the processing path is not limited. It can be uniform or variable speed conveying, which can be selected according to actual needs. Preferably, the material to be processed 10 is conveyed at a uniform speed on the processing path, which is beneficial to the imaging process of the scanning component 3.

[0043] In some embodiments, the material to be processed 10 used in the present application may be a polymer film, a metal film or a composite material film, etc., wherein the polymer film may be a polyimide film, etc., the metal film may be a copper foil, etc., the composite material film may be a composite layer of copper foil-polyimide film-copper foil or a bonding resin-carbon fiber woven prepreg, etc., and the type of the material to be processed 10 may be selected according to actual needs, and is not limited here. In addition, the material to be processed 10 used in the present application may be a coiled material to be processed or a sheet material to be processed, etc. The coiled material to be processed refers to a raw material in a wound form, and such materials can save space by winding during transportation and storage; the sheet material to be processed refers to a raw material that has been cut into sheets, and such materials do not need to be pre-processed in subsequent processing, such as unfolding and laying, and the form of the material to be processed 10 may be selected according to actual needs, and is not limited here.

[0044] In some embodiments, the material to be processed 10 is processed at a processing component, which includes a processing table 1 and a laser emitting device 13. Along the conveying direction of the material to be processed 10, the processing table 1 is provided with a feed end 11 and a discharge end 12. The material to be processed 10 is conveyed from the feed end 11 to the processing table 1, and after being drilled or other operations by the laser emitting device 13, it is conveyed to the outside of the processing table 1 by the discharge end 12.

[0045] In the above processing, the specific steps of the laser emitting device 13 for drilling and other operations are as follows: First, according to the type and thickness of the material 10 to be processed, adjust the laser power, pulse frequency, scanning speed, focus position and other parameters of the laser emitting device 13 to ensure that the energy of the laser beam can perform normal processing operations. Secondly, use the positioning tool to locate the processing area on the processing table 1 to ensure that the laser beam emitted by the laser emitting device 13 is focused on the correct processing starting point, and at the same time, plan the movement trajectory and direction of the laser beam. Finally, when the material 10 to be processed is transported to the processing area of ​​the processing table 1, the laser focus point falls on the processing area to perform processing operations such as drilling.

[0046] As an optional technical solution for this application, please refer to Figure 1 and Figure 2 The material 10 to be processed is a coiled material to be processed.

[0047] In some embodiments, the loading process of the coil to be processed is realized by the coil loading mechanism 4, and the coil loading mechanism 4 is arranged on the processing path close to the feeding end 11 of the processing table 1. The coil loading mechanism 4 used in the present application is provided with a first shaft structure, and the coil to be processed is mounted on the first shaft structure, so that the coil to be processed can rotate around the first shaft structure, or the first shaft structure drives the coil to be processed to rotate, thereby realizing the traction and transportation of the coil to be processed.

[0048] It should be noted that the coil to be processed needs to be tightened during the processing to ensure that the surface to be processed is completely exposed to the laser to prevent inaccurate processing position due to wrinkles or folds. Therefore, in order to improve the processing quality, the coil feeding mechanism 4 also includes a damper (not shown in the figure). It can be understood that after the damper is set, the damper can apply a force opposite to the conveying direction to the coil to be processed or the first axis structure, so that the coil to be processed is tightened during the traction process, reducing wrinkles and deformation during the processing process, ensuring the accuracy of the processing position, and improving the processing effect. The damper used in this application can be a torque motor, etc., or the coil feeding mechanism 4 adopts a hydraulic damping shaft, a mechanical damping shaft or an electromagnetic damping shaft, etc. The type of damper or coil feeding mechanism 4 can be selected according to actual needs, and is not limited here.

[0049] In some embodiments, the processed coiled material to be processed can be transported from the discharge end 12 to the first scanning area outside the processing table 1. The first scanning area is arranged near the discharge end 12 for detecting the processing quality of the mechanism. Specifically, the first scanning area is provided with a scanning component 3, and the scanning component 3 includes a line scanning vision module and a vision analysis module.

[0050] The line scan vision module includes devices such as line scan cameras, encoders and image acquisition cards. Among them, the line scan camera has only one row of pixels. Unlike the two-dimensional matrix structure of the area array camera, it captures image information line by line by quickly and continuously scanning the object. In the case of relative motion between the semi-finished product and the line scan camera, the line scan camera continuously exposes and reads data, and finally combines into a complete image through the relative motion between the object and the line scan camera. The encoder is used to accurately track the speed and position of the semi-finished product to ensure that the timing of the line scan camera to capture the image is synchronized with the position of the semi-finished product. The image acquisition card can receive and process the large amount of data streams generated by the line scan camera in real time and transmit it to the visual analysis module.

[0051] The visual analysis module includes image processing software for stitching, correcting, analyzing and judging the received line scan images, and extracting useful information, such as detecting surface defects such as scratches on semi-finished products, measuring dimensions, identifying color changes, etc. It can be understood that the online inspection process of semi-finished products can be realized through the cooperation of the line scan vision module and the visual analysis module.

[0052] It should be noted that the line scan vision module needs to be equipped with a professional light source to ensure uniform and stable lighting conditions during the movement of the semi-finished product, so as to facilitate the line scan camera to capture clear line images. Therefore, the first scanning area is also provided with a light source component, which is arranged above and / or below the first scanning area, that is, the light source component can be arranged only above the first scanning area, or only below the first scanning area, or can be arranged both above and below the first scanning area.

[0053] Preferably, in the technical solution of the present application, a light source assembly is provided above and below the first scanning area, and the light source assembly includes a first light source 21 and a second light source 22. The first light source 21 is provided above the first scanning area, and is used to provide a light source with linear distribution, uniformity and adjustability; the second light source 22 is provided below the first scanning area, and is used to provide a light source with good light directionality and no shadow. The first light source 21 used in the present application includes at least one of a point light source, a surface light source, a line light source, a strip light source and a ring light source, and the second light source 22 is at least one of a collimated light source and a parallel light source. The types of the first light source 21 and the second light source 22 can be selected according to actual needs, and are not limited here.

[0054] Preferably, the first light source 21 is a strip light source, and the second light source 22 is a parallel light source. The strip light source is composed of a series of LEDs or other light sources, and the LEDs or other light sources are arranged in a strip structure to provide a linear lighting effect, so that the semi-finished product can be illuminated from multiple angles, thereby obtaining a more comprehensive image information of the semi-finished product, highlighting the features on a larger plane or linear structure, and then detecting whether the semi-finished product after laser processing has defects such as scratches, bumps or gloss differences. In this application, the strip light source can adjust the irradiation angle and distance as needed to achieve the best lighting effect, which is not limited here. Under ideal conditions, the light emitted by the parallel light source is strictly parallel to each other. Since the parallel light does not produce obvious shadows, it is conducive to achieving a highly consistent and projection-free lighting effect, so it is possible to observe whether there are defects such as missed processing on the semi-finished product after laser processing.

[0055] In some embodiments, the semi-finished product that has been inspected may be subjected to a material collection process, and the material collection process of the processed coil material may be a winding collection process or a cutting collection process.

[0056] Optionally, the material collection process of the processed coil is winding material collection. For details, please refer to Figure 1 The laser processing equipment includes a first material receiving mechanism 5, which is arranged near the discharge end 12 on the processing path. The first material receiving mechanism 5 is provided with a second axis structure. The processed coil material is wound on the second axis structure. As the second axis structure rotates, the material receiving process of the processed coil material can be continuously carried out.

[0057] It should be noted that during the winding process of the first material receiving mechanism 5, due to the damping effect of the damper of the coil feeding mechanism 4, the layers of the wound semi-finished product can be tightly fitted to each other, and the winding quality is high.

[0058] Optionally, the material collection process of the processed coil material is sheet material collection. For details, please refer to Figure 2The laser processing equipment includes a second material receiving mechanism, which is arranged near the discharge end 12 on the processing path. The second material receiving mechanism includes a pressure roller assembly 61 and a cutting assembly 62. The pressure roller assembly 61 is arranged closer to the discharge end 12 than the cutting assembly 62 on the processing path. The pressure roller assembly 61 is used to flatten the processed coil material, that is, the semi-finished product processed by laser enters the pressure rollers arranged relatively along the height direction, and the friction force generated by the rotation of the pressure rollers drives the semi-finished product processed by laser to move, and the driving process of the processed material is completed while flattening; the cutting assembly 62 is used to cut and shape the processed material after flattening to obtain the semi-finished product sheet of the required size. The cutting mechanism used in this application can be a laser cutting machine, a CNC punching machine, a water jet cutting machine, or a covering film laser cutting machine, which can be selected according to actual needs and is not limited here.

[0059] As an optional technical solution for this application, please refer to Figure 3 , the material 10 to be processed is a sheet to be processed.

[0060] Different from the coiled material to be processed, the sheet material to be processed is fed by a sheet material feeding mechanism, and unloaded by a viscous coiled material receiving mechanism 8 for driving.

[0061] In some embodiments, the laser processing equipment includes a sheet loading mechanism, which is arranged on the processing path near the feed end 11. The sheet loading structure includes a third axis structure 71 and a viscous roll 72. The viscous roll 72 is installed on the third axis structure 71, so that the viscous roll 72 can rotate around the third axis structure 71, or the third axis structure 71 drives the viscous roll 72 to rotate, thereby realizing the traction and transportation of the viscous roll 72. At this time, the sheet to be processed is attached to the viscous roll 72 on the processing path, so that the viscous roll 72 delivers the sheet to be processed into the processing table 1.

[0062] It should be noted that when the third axis structure 71 feeds the viscous coil 72, the viscous coil 72 serves to drive the transmission of the sheet to be processed, and thus no damping structure is provided on the third axis structure 71. At the same time, since the viscous coil 72 and the processed sheet are both located above and between the second light sources 22 during the monitoring process of the scanning assembly 3, in order to ensure the accuracy of the inspection result, a viscous coil 72 with high transparency can be used so that the light of the second light source 22 can pass through the viscous coil 72 and irradiate the back of the processed sheet.

[0063] In some embodiments, the laser processing equipment also includes a viscous coil material receiving mechanism 8, which is arranged on the processing path near the discharge end 12. The viscous coil material receiving mechanism 8 includes a fourth axis structure. The viscous coil material 72 that has completed the conveying is on the fourth axis structure. As the fourth axis structure rotates, the receiving process of the viscous coil material 72 can be continuously carried out, and the viscous coil material 72 is separated from the sheet material to be processed during the receiving process, completing the unloading process of the sheet material to be processed.

[0064] In some embodiments, the mechanism processing equipment of the present application also includes a driving mechanism, which is used to drive the rotation process of the first axis structure, the second axis structure, the third axis structure 71 and the fourth axis structure. The driving mechanism used in the present application can be a driving motor, etc., which can be selected according to actual needs and is not limited here.

[0065] In actual application, the material to be processed 10 is loaded onto the processing table 1. The laser emitting device 13 on the processing table 1 can use laser to process the material to be processed 10. The quality inspection data of the semi-finished product is collected in the first scanning area through the line scanning vision module, and the inspection results are analyzed by the visual analysis module. The semi-finished product that has been inspected can be collected.

[0066] The laser processing equipment provided in this application can be directly connected to factory information systems such as MES. The quality inspection information of each roll or each piece of processed semi-finished products can be uploaded to achieve closed-loop monitoring of production information. The quality can be tracked and traced back to reduce the scrap cost in the production process.

[0067] As an optional technical solution of the present application, the monitoring process in the laser processing equipment of the present application can be carried out twice. Specifically, a second scanning area is also provided on the part of the processing path close to the feed end 11, and the second scanning area is provided with a scanning component 3 and a light source component, that is, the scanning component 3 and the light source component of the second scanning area are arranged before the processing table 1, and the scanning component 3 and the light source component of the first scanning area are arranged after the processing table 1. At this time, by comparing the test results of the first scanning area with the second scanning area, it is possible to observe whether the material has changed in properties before and after processing, such as observing whether the thermal effect of laser processing will cause color changes in the surrounding area of ​​the processing area, detecting whether metals such as copper are oxidized after processing, and whether laser processing will cause the material to splash and fall to the surface area outside the processing area after hot melting.

[0068] The above describes in detail the structure, features and effects of the present application based on the embodiments shown in the drawings. The above is only a preferred embodiment of the present application, but the present application does not limit the scope of implementation to what is shown in the drawings. Any changes made in accordance with the concept of the present application, or modifications to equivalent embodiments with equivalent changes, which still do not exceed the spirit covered by the description and drawings, should be within the protection scope of the present application.

Claims

1. A laser processing device, used in a process of processing a material to be processed, wherein the material to be processed is transported along a processing path of the laser processing device, characterized in that: The laser processing equipment is provided on the processing path: The processing assembly includes a processing table and a laser emitting device, wherein the processing table is provided with a feeding end and a discharging end; a portion of the processing path close to the discharging end is provided with a first scanning area; A light source assembly is arranged above and / or below the first scanning area; The scanning component is arranged above the first scanning area; the scanning component includes a line scanning vision module and a vision analysis module, and the line scanning vision module and the vision analysis module are signal connected.

2. The laser processing equipment according to claim 1, characterized in that: The light source assembly includes a first light source and a second light source. The first light source is arranged above the first scanning area to provide a light source with linear distribution, uniformity and adjustability; the second light source is arranged below the first scanning area to provide a light source with good directionality and no shadows.

3. The laser processing equipment according to claim 2, characterized in that: The first light source includes at least one of a point light source, a surface light source, a line light source, a strip light source and a ring light source, and the second light source is at least one of a collimated light source and a parallel light source.

4. The laser processing equipment according to claim 1, characterized in that: The material to be processed is a coil to be processed, and the laser processing equipment includes a coil feeding mechanism, which is arranged on the processing path close to the feeding end; The coil material feeding mechanism is provided with a first shaft structure, and the coil material to be processed is installed on the first shaft structure.

5. The laser processing equipment according to claim 4, characterized in that: The first shaft structure is provided with a damper for reducing the feeding speed of the first shaft structure.

6. The laser processing equipment according to claim 4, characterized in that: The laser processing equipment comprises a first material receiving mechanism, which is arranged on the processing path close to the material discharging end; The first material receiving mechanism is provided with a second shaft structure for collecting the processed coiled material to be processed.

7. The laser processing equipment according to claim 4, characterized in that: The laser processing equipment comprises a second material receiving mechanism, which is arranged on the processing path close to the material discharging end; The second material receiving mechanism includes a pressure roller assembly and a cutting assembly. The pressure roller assembly is arranged closer to the discharge end on the processing path than the cutting assembly. The pressure roller assembly is used to flatten the processed coil material to be processed, and the cutting assembly is used to cut the processed coil material after flattening into shape.

8. The laser processing equipment according to claim 1, characterized in that: The material to be processed is a sheet to be processed, and the laser processing equipment includes a sheet feeding mechanism, which is arranged on the processing path close to the feeding end; The sheet material feeding structure includes a third axis structure and a sticky coil. The sheet material to be processed is attached to the sticky coil on the processing path so that the sticky coil delivers the sheet material to be processed to the processing table.

9. The laser processing equipment according to claim 7, characterized in that: The laser processing equipment further comprises a viscous coil material receiving mechanism, and the viscous coil material receiving mechanism is arranged on the processing path close to the material discharge end; The viscous coil material receiving mechanism comprises a fourth axis structure for collecting the viscous coil material after feeding.

10. The laser processing equipment according to any one of claims 1 to 9, characterized in that: A second scanning area is provided on a portion of the processing path close to the feeding end, and a scanning component and a light source component are provided in the second scanning area.

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