Display device

Abstract

The present disclosure relates to a display device including: a display panel including a first area, a second area, and a bending area positioned along a first direction, the bending area being between the first area and the second area; a plurality of sensing electrodes on the first region; a data driver on the second region; sensing lines on the first region and connected to the sensing electrodes, and extending in a first direction toward opposite sides of the data driver, the opposite sides being opposite to each other in a second direction crossing the first direction; and a capping layer on the sensing line.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to and the benefit of Korean Patent Application No. 10-2023-0044823 filed in the Korean Intellectual Property Office on April 5, 2023, the entire contents of which are incorporated herein by reference. Technical Field

[0003] Aspects of embodiments of the present disclosure relate to a display device. Background Art

[0004] Electronic devices such as smart phones, digital cameras, notebook computers, navigation systems, and smart TVs that provide images to users include display devices for displaying images. The display device includes a display panel for generating images, and an input device such as an input sensor.

[0005] The input sensor is disposed on the display panel and senses a user's touch. A signal sensed by the input sensor is converted into an input signal. The display panel provides an image to the user in response to the input signal of the input sensor.

[0006] The display panel includes a plurality of pixels, a plurality of panel lines connected to the pixels, and a plurality of panel pads connected to the panel lines. The input sensor includes a plurality of sensing electrodes, a plurality of sensing lines connected to the sensing electrodes, and a plurality of sensing pads connected to the sensing lines.

[0007] The panel pads and the sensing pads are connected to a timing controller configured to control the operation of the display panel and an input sensing controller configured to control the operation of the input sensor. The timing controller and the input sensing controller may be mounted on a printed circuit board and may be connected to the panel pads and the sensing pads.

[0008] The above information disclosed in this Background section is for enhancement of understanding of the background of the present disclosure and therefore it may contain information that does not constitute prior art. Utility Model Content

[0009] One or more embodiments of the present disclosure are directed to a display device capable of preventing or substantially preventing a sensing line from being corroded by moisture.

[0010] According to one or more embodiments of the present disclosure, a display device includes: a display panel including a first area, a second area, and a bending area positioned along a first direction, the bending area being between the first area and the second area; a plurality of sensing electrodes on the first area; a data driver on the second area; sensing lines on the first area and connected to the sensing electrodes and extending toward opposite sides of the data driver in the first direction, the opposite sides being opposite to each other in a second direction intersecting the first direction; and a covering layer on the sensing lines.

[0011] In an embodiment, the cover layer may include a silane compound to absorb moisture.

[0012] In an implementation, the display device may further include a driving cover layer covering the data driver and portions of the sensing lines adjacent to the data driver.

[0013] In an embodiment, a driving cover layer may be located on the second area.

[0014] In an implementation, an opening may be defined in the driving cover layer; and the opening may overlap a portion of the sensing line in a plan view.

[0015] In an embodiment, the opening may pass through the drive cover layer and the cover layer.

[0016] In an embodiment, the opening may be adjacent to opposite sides of the data driver in a plan view.

[0017] In an implementation, the opening may not overlap with the data driver.

[0018] In an implementation, the driving cover layer may include: an insulating layer on the cover layer; and a cover portion including a black material on the insulating layer.

[0019] In an embodiment, a cover layer may be located on the first region, the bent region, and the second region.

[0020] According to one or more embodiments of the present disclosure, a display device includes: a display panel including a first area, a second area, and a bending area positioned along a first direction, the bending area being between the first area and the second area; a plurality of sensing electrodes on the first area; a data driver on the second area; a sensing line on the first area and connected to the sensing electrode, and extending toward opposite sides of the data driver in the first direction, the opposite sides being opposite to each other in a second direction intersecting the first direction; and a driving cover layer covering the data driver and a portion of the sensing line adjacent to the data driver. An opening is defined in the driving cover layer, the opening overlapping a portion of the sensing line in a plan view.

[0021] In an embodiment, a driving cover layer may be located on the second area.

[0022] In an implementation, the opening may be defined to be adjacent to opposite sides of the data driver in a plan view.

[0023] In an embodiment, the opening may not overlap the data driver in a plan view.

[0024] In an implementation, the display device may further include a cover layer between the sensing line and the driving cover layer.

[0025] In an embodiment, the cover layer may include a silane compound to absorb moisture.

[0026] In embodiments, openings may be provided through the cover layer and the drive cover layer.

[0027] In an embodiment, a cover layer may be located on the first region, the bent region, and the second region.

[0028] In an implementation, the driving cover layer may include: an insulating layer on the data driver; and a cover portion including a black material on the insulating layer.

[0029] In an embodiment, when the bending area is bent, a portion of one of the sensing lines located in the bending area may be positioned more inward than other portions of the one sensing line located in the first area and the second area. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] The above and other aspects and features of the present disclosure will be more clearly understood from the following detailed description of exemplary, non-limiting embodiments with reference to the accompanying drawings, in which:

[0031] Figure 1 is a perspective view of a display device according to an embodiment of the present disclosure;

[0032] Figure 2 yes Figure 1 An exploded perspective view of the display device shown in ;

[0033] Figure 3 yes Figure 2 A plan view of the display panel shown in ;

[0034] Figure 4 Shows Figure 3 The equivalent circuit of the pixel shown in;

[0035] Figure 5 is with Figure 4 A cross-sectional view of a portion corresponding to the light emitting element shown in ;

[0036] Figure 6 yes Figure 2A plan view of the input sensor shown in ;

[0037] Figure 7 Shows Figure 6 The configuration of the sensing electrodes shown in ;

[0038] Figure 8 It is along Figure 7 A cross-sectional view taken along line II' shown in FIG.

[0039] Fig. 9A It is along Figure 6 A cross-sectional view taken along line II-II' shown in FIG.

[0040] Fig. 9B Shows Fig. 9A The bending state of the bending region shown in ; and

[0041] Fig.10 It is along Figure 6 A cross-sectional view taken along line III-III' shown in FIG. DETAILED DESCRIPTION

[0042] Hereinafter, embodiments will be described in more detail with reference to the accompanying drawings, in which the same reference numerals represent the same elements throughout the accompanying drawings. However, the present disclosure can be implemented in various different forms and should not be construed as being limited to the embodiments shown herein. On the contrary, these embodiments are provided as examples so that the present disclosure will be thorough and complete, and the aspects and features of the present disclosure are fully conveyed to those skilled in the art. Therefore, processes, elements and techniques that are not necessary for those of ordinary skill in the art to fully understand the aspects and features of the present disclosure may not be described. Unless otherwise stated, in all drawings and written descriptions, the same reference numerals represent the same elements, and therefore, redundant descriptions thereof may not be repeated.

[0043] When a certain embodiment can be implemented differently, the specific process order may be different from the described order. For example, two processes described in succession may be performed simultaneously or substantially simultaneously, or may be performed in the reverse order of the described order.

[0044] In the accompanying drawings, for the sake of clarity, the relative size, thickness and ratio of elements, layers and regions can be exaggerated and / or simplified. For ease of explanation, spatial relative terms such as "below", "below", "lower", "below", "above", "upper" etc. can be used herein to describe the relationship between an element or feature and another (multiple) element or feature as shown in the drawings. It will be understood that, in addition to the orientation depicted in the drawings, spatial relative terms are intended to also include different orientations of the device in use or in operation. For example, if the device in the drawings is flipped, the element described as "below" or "below" or "below" of other elements or features will be oriented to other elements or features "above" therewith. Therefore, the exemplary terms "below" and "below" can include both the orientation of the top and the bottom. The device can be oriented in other ways (for example, rotated 90 degrees or in other orientations), and the spatial relative descriptors used in this article should be interpreted accordingly.

[0045] In the drawings, the DR1, DR2 and DR3 axes are not limited to the three axes of the rectangular coordinate system and can be interpreted in a broader sense. For example, the DR1, DR2 and DR3 axes can be perpendicular or substantially perpendicular to each other, or can represent different directions that are not perpendicular to each other.

[0046] It will be understood that, although the terms "first", "second", "third", etc., may be used herein to describe various elements, components, regions, layers and / or parts, these elements, components, regions, layers and / or parts should not be limited by these terms. These terms are used to distinguish one element, component, region, layer or part from another element, component, region, layer or part. Therefore, the first element, first component, first region, first layer or first part described below may be referred to as the second element, second component, second region, second layer or second part without departing from the spirit and scope of the present disclosure.

[0047] It will be understood that when an element or layer is referred to as being "on," "connected to," or "coupled to" another element or layer, it may be directly on, directly connected to, or directly coupled to the other element or layer, or there may be one or more intervening elements or layers. Similarly, when a layer, region, or element is referred to as being "electrically connected" to another layer, region, or element, it may be directly electrically connected to the other layer, region, or element, and / or may be indirectly electrically connected to the other layer, region, or element with one or more intervening layers, regions, or elements therebetween. Furthermore, it will be understood that when an element or layer is referred to as being "between" two elements or layers, it may be the only element or layer between the two elements or layers, or there may also be one or more intervening elements or layers.

[0048] The terms used herein are for the purpose of describing a particular embodiment, and are not intended to limit the present disclosure. As used herein, the singular forms "one" and "a kind of" are intended to also include plural forms, unless the context clearly indicates otherwise. It will also be understood that when used in this specification, the terms "include", "include", "include", "include", "have", "have" and "have" specify the presence of the features, integral bodies, steps, operations, elements and / or components, but do not exclude the presence or addition of one or more other features, integral bodies, steps, operations, elements, components and / or their groups. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items. For example, the statement "A and / or B" means A, B, or A and B. When a statement such as "at least one of..." is after a list of elements, the list of the entire element is modified, rather than the individual elements in the list. For example, the expressions "at least one of a, b, and c" and "at least one selected from the group consisting of a, b, and c" mean only a, only b, only c, both a and b, both a and c, both b and c, all of a, b, and c, or variations thereof.

[0049] As used herein, the terms "substantially," "about," and similar terms are used as terms of approximation rather than as terms of degree, and are intended to account for the inherent deviations in measurements or calculations that one of ordinary skill in the art would recognize. In addition, when describing embodiments of the present disclosure, the use of "may" refers to "one or more embodiments of the present disclosure." As used herein, the terms "use," "being used," and "used" may be considered synonymous with the terms "utilize," "utilizing," and "utilized," respectively.

[0050] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by those of ordinary skill in the art to which the present disclosure belongs. It will also be understood that terms (such as those defined in commonly used dictionaries) should be interpreted as having a meaning consistent with their meaning in the context of the relevant technology and / or this specification, and should not be interpreted in an idealized or overly formal sense, unless explicitly defined as such in this article.

[0051] Figure 1 is a perspective view of a display device according to an embodiment of the present disclosure.

[0052] refer to Figure 1, the display device DD according to an embodiment of the present disclosure may have a rectangular shape having long sides extending in a first direction DR1 and short sides extending in a second direction DR2 crossing the first direction DR1. However, the present disclosure is not limited thereto, and the display device DD may have various suitable shapes, such as a circular shape or other polygonal shapes.

[0053] Hereinafter, a direction perpendicular or substantially perpendicular to a plane defined by the first direction DR1 and the second direction DR2 is defined as a third direction DR3. In addition, as used herein, the expressions "when viewed on a plane" and "in a plan view" may refer to a state viewed in the third direction DR3.

[0054] An upper surface of the display device DD may be defined as a display surface DS, and may have a plane defined by the first direction DR1 and the second direction DR2. An image IM generated by the display device DD may be provided to a user through the display surface DS.

[0055] The display surface DS may include a display area DA, and a non-display area NDA around (e.g., adjacent to) the display area DA. The display area DA may display an image, while the non-display area NDA may not display an image. The non-display area NDA may surround the display area DA (e.g., around its periphery), and may define an edge of the display device DD, which may be printed in a suitable color (e.g., a predetermined color).

[0056] The display device DD may be used for large electronic devices such as televisions, monitors, or external billboards. In addition, the display device DD may be used for small and medium-sized electronic devices such as personal computers, notebook computers, personal digital terminals, car navigation systems, game consoles, smart phones, tablet computers, or cameras. However, the present disclosure is not limited thereto, and the display device DD may be used for any other suitable electronic device that displays images to a user.

[0057] Figure 2 yes Figure 1 An exploded perspective view of the display device shown in FIG.

[0058] refer to Figure 2 , the display device DD may include a display panel DP, an input sensor ISP disposed on the display panel DP, and a window WIN disposed on the input sensor ISP.

[0059] The display panel DP according to an embodiment of the present disclosure may be a light-emitting display panel, but is not particularly limited thereto. For example, the display panel DP may be an organic light-emitting display panel or a quantum dot light-emitting display panel. The light-emitting layer of the organic light-emitting display panel may include an organic light-emitting material. The light-emitting layer of the quantum dot light-emitting display panel may include quantum dots, quantum rods, etc. Hereinafter, for convenience, the display panel DP will be described in more detail in the case of an organic light-emitting display panel, but the present disclosure is not limited thereto.

[0060] The window WIN can protect the display panel DP and the input sensor ISP from external scratches and impacts. The window WIN can be attached to the input sensor ISP by an adhesive. The adhesive can include various suitable adhesives such as optically transparent adhesives or pressure-sensitive adhesives. The image generated by the display panel DP can be transmitted through the window WIN and provided to the user.

[0061] When manufacturing a display module (eg, a touch display), the input sensor ISP may be directly manufactured on the display panel DP. However, the present disclosure is not limited thereto, and the input sensor ISP may be manufactured as an input sensing panel separated from the display panel DP and attached to the display panel DP by an adhesive.

[0062] Figure 3 yes Figure 2 A plan view of the display panel shown in FIG.

[0063] refer to Figure 3 , the display device DD may include a display panel DP, a scan driver SDV, a data driver DDV, a light emitting driver EDV, a printed circuit board PCB, a timing controller T-CON, a driving cover layer DCL and an input sensing controller IS-IC.

[0064] The display panel DP may be a flexible display panel. For example, the display panel DP may include a plurality of electronic components disposed on a flexible substrate. The display panel DP may have a rectangular shape having long sides extending in a first direction DR1 and short sides extending in a second direction DR2.

[0065] The display panel DP may include a first area A1, a second area A2, and a bending area BA therebetween. The first area A1, the bending area BA, and the second area A2 may be arranged along a first direction DR1, and the bending area BA may extend in a second direction DR2.

[0066] The first area A1 may include a display area DA and a non-display area NDA around (e.g., adjacent to) the display area DA. The non-display area NDA may surround the display area DA (e.g., around its periphery). The display area DA may display an image, while the non-display area NDA may not display an image. The area where the image is not displayed may be defined as a border area. When the bending area BA is bent, the second area A2 may be disposed below (e.g., below) the first area A1.

[0067] The display panel DP may include a plurality of pixels PX, a plurality of scan lines SL, a plurality of data lines DL, a plurality of light emitting lines EL, a first control line CSL1 and a second control line CSL2, a plurality of initialization lines IL, a plurality of first power lines PL1, a second power line PL2, a plurality of first connection lines CNL1, a plurality of second connection lines CNL2, and a plurality of pads PD1, PD2, and PD3.

[0068] The pixels PX may be disposed in the display area DA. The scanning driver SDV, the data driver DDV, and the light emitting driver EDV may be disposed in the non-display area NDA. The scanning driver SDV and the light emitting driver EDV may be disposed adjacent to long sides of the display panel DP in the non-display area NDA, respectively.

[0069] The data driver DDV may be manufactured in the form of an integrated circuit chip and may be disposed on the second area A2. However, the present disclosure is not limited thereto, and the data driver DDV may be mounted on a flexible circuit board connected to the display panel DP and may be connected to the display panel DP through the flexible circuit board. The data driver DDV may be defined as a driving chip.

[0070] The scan lines SL may extend in the second direction DR2 to be connected to the pixels PX and the scan driver SDV. The data lines DL may extend in the first direction DR1 to be connected to the pixels PX and the data driver DDV. The emission lines EL may extend in the second direction DR2 to be connected to the pixels PX and the emission driver EDV.

[0071] The first power line PL1 may extend in the first direction DR1 and may be disposed in the non-display area NDA. The first power line PL1 may receive a first voltage. The first connection line CNL1 may extend in the second direction DR2 to be connected to the first power line PL1 and the pixel PX. The first voltage may be applied to the pixel PX through the first power line PL1 and the first connection line CNL1 connected to each other.

[0072] The initialization line IL may extend in the first direction DR1 and may be disposed in the non-display area NDA. The initialization line IL may receive an initialization voltage. The second connection line CNL2 may extend in the second direction DR2 to be connected to the initialization line IL and the pixel PX. The initialization voltage may be applied to the pixel PX through the initialization line IL and the second connection line CNL2 connected to each other. The pixel PX may be initialized by the initialization voltage.

[0073] The second power line PL2 may extend along an edge of the first area A1. The second power line PL2 may receive a second voltage. The second voltage may have a level lower than that of the first voltage. The second voltage may be provided to the pixel PX through the second power line PL2.

[0074] The first control line CSL1 may be connected to the scan driver SDV. The second control line CSL2 may be connected to the light emitting driver EDV.

[0075] The pads PD1, PD2, and PD3 may be disposed on one side of the display panel DP. The pads PD1, PD2, and PD3 may be disposed in the second area A2. The pads PD1, PD2, and PD3 may include a plurality of first pads PD1, a plurality of second pads PD2, and a plurality of third pads PD3. The first pad PD1 may be disposed between the second pad PD2 and the third pad PD3.

[0076] The data line DL, the first and second control lines CSL1 and CSL2, the initialization line IL, the first and second power lines PL1 and PL2 may be defined as a panel line DP-LI. The panel line DP-LI may be connected to the first pad PD1. In more detail, the data line DL, the first and second control lines CSL1 and CSL2, the initialization line IL, the first and second power lines PL1 and PL2 may be connected to the first pad PD1 in the second area A2 via the bending area BA.

[0077] The data line DL may be connected to a corresponding first pad PD1 among the first pads PD1 through a data driver DDV. For example, the data line DL may be connected to the data driver DDV, and the data driver DDV may be connected to the corresponding first pad PD1 corresponding to the data line DL. The data line DL may be connected or substantially connected to the pixel PX and the data driver DDV, and the data line DL may also be connected to the data driver DDV and the first pad PD1.

[0078] The second pad PD2 and the third pad PD3 may be connected to an input sensor ISP (eg, see Figure 2 )'s sensing line, which will be described in more detail below.

[0079] The timing controller T-CON and the input sense controller IS-IC may be disposed on a printed circuit board PCB. Each of the timing controller T-CON and the input sense controller IS-IC may be manufactured as an integrated circuit chip and mounted on the printed circuit board PCB.

[0080] A plurality of pads PCB-PD may be provided on one side of the printed circuit board PCB. The pads PCB-PD may be connected to the first pad PD1, the second pad PD2, and the third pad PD3. In some embodiments, a flexible circuit board may be connected to the printed circuit board PCB and the display panel DP, and the pads PCB-PD of the printed circuit board PCB may be connected to the first pad PD1, the second pad PD2, and the third pad PD3 of the display panel DP through the flexible circuit board.

[0081] The timing controller T-CON may control operations of the scan driver SDV, the data driver DDV, and the light emitting driver EDV. The timing controller T-CON may generate a scan control signal, a data control signal, and a light emitting control signal in response to a control signal received from the outside.

[0082] The scan control signal may be provided to the scan driver SDV through the first control line CSL1. The light emission control signal may be provided to the light emission driver EDV through the second control line CSL2. The data control signal may be provided to the data driver DDV. The timing controller T-CON may receive an image signal from the outside, convert the data format of the image signal to meet the interface specification of the data driver DDV, and provide the converted image signal to the data driver DDV.

[0083] The scan driver SDV may generate a plurality of scan signals in response to the scan control signal. The scan signals may be applied to the pixels PX through the scan lines SL. The scan signals may be sequentially applied to the pixels PX.

[0084] The data driver DDV may generate a plurality of data voltages corresponding to the image signal in response to the data control signal. The data voltages may be applied to the pixel PX through the data line DL. The light emitting driver EDV may generate a plurality of light emitting signals in response to the light emitting control signal. The light emitting signal may be applied to the pixel PX through the light emitting line EL.

[0085] The pixel PX may receive a data voltage in response to the scan signal. The pixel PX may display an image by emitting light having a desired brightness corresponding to the data voltage in response to the light emission signal. The light emission time of the pixel PX may be controlled by the light emission signal.

[0086] The driving cover layer DCL may be disposed on the second area A2. The driving cover layer DCL may be disposed on the data driver DDV. The driving cover layer DCL may be disposed on portions of the data line DL, the first and second control lines CSL1 and CSL2, the initialization line IL, and the first and second power lines PL1 and PL2.

[0087] When viewed on a plane (e.g., in a plan view), the driving cover layer DCL may extend in the second direction DR2. When viewed on a plane (e.g., in a plan view), the width of the driving cover layer DCL in the second direction DR2 may be greater than the width of the data driver DDV in the second direction DR2. When viewed on a plane (e.g., in a plan view), the width of the driving cover layer DCL in the first direction DR1 may be greater than the width of the data driver DDV in the first direction DR1. Therefore, the driving cover layer DCL may cover the data driver DDV.

[0088] A plurality of openings WEH may be defined in the driving cover layer DCL (e.g., the plurality of openings WEH may penetrate the driving cover layer DCL). When viewed on a plane (e.g., in a plan view), the openings WEH may be defined to be adjacent to opposite sides of the data driver DDV, the opposite sides being opposite to each other in the second direction DR2. The openings WEH may not overlap with the data driver DDV.

[0089] When moisture enters from the outside and is introduced between the display panel DP and the driving cover layer DCL, the moisture may be evaporated to the outside through the opening WEH. Fig.10 Describe this in more detail.

[0090] Figure 4 Shows Figure 3 Equivalent circuit of the pixel shown in . Figure 4 The pixel PX may correspond to Figure 3 In other words, Figure 3 Each of the pixels PX in may have Figure 4 The equivalent circuit of the pixel PX shown in FIG. 1 is the same as or substantially the same as the equivalent circuit of the pixel PX shown in FIG.

[0091] refer to Figure 4 , the pixel PX may include a light emitting element OLED and a pixel circuit CC. The pixel circuit CC may include a plurality of transistors T1 to T7 and a capacitor CP. The pixel circuit CC may control the amount of current flowing through the light emitting element OLED in response to a data voltage.

[0092] The light emitting element OLED may emit light having a desired brightness (eg, a predetermined brightness) corresponding to the amount of current supplied from the pixel circuit CC. In this way, the level of the first voltage ELVDD may be set to be higher than that of the second voltage ELVSS.

[0093] Each of the transistors T1 to T7 may include an input electrode (e.g., a source electrode), an output electrode (e.g., a drain electrode), and a control electrode (e.g., a gate electrode). Hereinafter, for convenience, any one of the input electrode and the output electrode may be referred to as a first electrode, and the other may be referred to as a second electrode.

[0094] The first electrode of the first transistor T1 may receive the first voltage ELVDD via the fifth transistor T5, and the second electrode thereof may be connected to the anode electrode of the light emitting element OLED via the sixth transistor T6. The first transistor T1 may be defined as a driving transistor. The first transistor T1 may control the amount of current flowing through the light emitting element OLED according to the voltage applied to the control electrode of the first transistor T1.

[0095] The second transistor T2 may be connected between the data line DL and the first electrode of the first transistor T1, and the control electrode of the second transistor T2 may be connected to the i-th scan line SLi. The second transistor T2 may be turned on by receiving the i-th scan signal through the i-th scan line SLi, and electrically connect the data line DL and the first electrode of the first transistor T1 to each other.

[0096] The third transistor T3 may be connected between the second electrode of the first transistor T1 and the control electrode of the first transistor T1. The control electrode of the third transistor T3 may be connected to the i-th scan line SLi. The third transistor T3 may be turned on by receiving the i-th scan signal via the i-th scan line SLi, and electrically connects the second electrode and the control electrode of the first transistor T1 to each other. When the third transistor T3 is turned on, the first transistor T1 may be connected in a diode form (e.g., may be diode-connected).

[0097] The fourth transistor T4 may be connected between the node ND and the second connection line CNL2 connected to the initialization line IL. The control electrode of the fourth transistor T4 may be connected to the (i-1)th scan line SLi-1. The fourth transistor T4 may be turned on by receiving the (i-1)th scan signal via the (i-1)th scan line SLi-1, and provide the initialization voltage Vint to the node ND. The initialization voltage Vint may be provided to the fourth transistor T4 through the initialization line IL and the second connection line CNL2.

[0098] The fifth transistor T5 may be connected between the first connection line CNL1 connected to the first power line PL1 and the first electrode of the first transistor T1. A control electrode of the fifth transistor T5 may be connected to the i-th light emitting line ELi.

[0099] The sixth transistor T6 may be connected between the second electrode of the first transistor T1 and the anode electrode of the light emitting element OLED. A control electrode of the sixth transistor T6 may be connected to the i-th light emitting line ELi.

[0100] The seventh transistor T7 may be connected between the second connection line CNL2 and the anode electrode of the light emitting element OLED. The control electrode of the seventh transistor T7 may be connected to the (i+1)th scan line SLi+1. The seventh transistor T7 may be turned on by receiving the (i+1)th scan signal via the (i+1)th scan line SLi+1, and provide the initialization voltage Vint to the anode electrode of the light emitting element OLED.

[0101] The capacitor CP may be disposed between the first connection line CNL1 and the node ND. The capacitor CP may store a data voltage. When the fifth transistor T5 and the sixth transistor T6 are turned on, the amount of current flowing through the first transistor T1 may be determined according to the voltage stored in the capacitor CP.

[0102] exist Figure 4 , the transistors T1 to T7 are illustrated based on PMOS transistors, but the present disclosure is not limited thereto, and in another embodiment, at least some or all of the transistors T1 to T7 may be formed of NMOS transistors.

[0103] Figure 5 is with Figure 4 A cross-sectional view of a portion corresponding to the light emitting element shown in FIG.

[0104] refer to Figure 5 The pixel PX may include a light emitting element OLED and a transistor TR connected to the light emitting element OLED. The light emitting element OLED may include a first electrode E1, a second electrode E2, and an organic light emitting layer OEL disposed between the first electrode E1 and the second electrode E2. The transistor TR may be Figure 4 The sixth transistor T6 is shown in FIG. The light emitting element OLED may be defined as an organic light emitting element.

[0105] The first electrode E1 may be an anode electrode, and the second electrode E2 may be a cathode electrode. The first electrode E1 may be defined as a pixel electrode, and the second electrode E2 may be defined as a common electrode.

[0106] The pixel PX may be divided into a pixel area PA and a non-pixel area NPA around (eg, adjacent to) the pixel area PA. The light emitting element OLED may be disposed in the pixel area PA, and the transistor TR may be disposed in the non-pixel area NPA.

[0107] The transistor TR and the light emitting element OLED may be disposed on the substrate SUB. The buffer layer BFL may be disposed on the substrate SUB, and the buffer layer BFL may include an inorganic material.

[0108] The semiconductor layer SM of the transistor TR may be disposed on the buffer layer BFL. The semiconductor layer SM may include an organic semiconductor or an inorganic semiconductor, such as amorphous silicon or polycrystalline silicon. As another example, the semiconductor layer SM may include an oxide semiconductor. The semiconductor layer SM may include a source region, a drain region, and a channel region between the source region and the drain region.

[0109] The first insulating layer INS1 may be disposed on the buffer layer BFL to cover the semiconductor layer SM. The first insulating layer INS1 may include an inorganic material. The gate electrode GE of the transistor TR overlapping the semiconductor layer SM may be disposed on the first insulating layer INS1. The gate electrode GE may be disposed to overlap the channel region of the semiconductor layer SM.

[0110] The second insulating layer INS2 may be disposed on the first insulating layer INS1 to cover the gate electrode GE. The second insulating layer INS2 may include an organic material and / or an inorganic material.

[0111] The source electrode SE and the drain electrode DE of the transistor TR may be disposed to be spaced apart from each other on the second insulating layer INS2. The source electrode SE may be connected to the source region of the semiconductor layer SM through a first contact hole CH1 defined in the first insulating layer INS1 and the second insulating layer INS2 (e.g., penetrating the first insulating layer INS1 and the second insulating layer INS2). The drain electrode DE may be connected to the drain region of the semiconductor layer SM through a second contact hole CH2 defined in the first insulating layer INS1 and the second insulating layer INS2 (e.g., penetrating the first insulating layer INS1 and the second insulating layer INS2).

[0112] The third insulating layer INS3 may be disposed on the second insulating layer INS2 to cover the source electrode SE and the drain electrode DE of the transistor TR. The third insulating layer INS3 may be defined as a planarization film configured to provide a flat or substantially flat upper surface, and may include an organic material.

[0113] The first electrode E1 may be disposed on the third insulating layer INS3 . The first electrode E1 may be connected to the drain electrode DE of the transistor TR through a third contact hole CH3 defined in (eg, penetrating) the third insulating layer INS3 .

[0114] A pixel defining film PDL exposing a portion of the first electrode E1 may be disposed on the first electrode E1 and the third insulating layer INS3. An opening PX_OP for exposing a portion of the first electrode E1 may be defined in the pixel defining film PDL.

[0115] The organic light emitting layer OEL may be disposed on the first electrode E1 in the opening PX_OP. The organic light emitting layer OEL may generate any appropriate light among red light, green light, and blue light. However, the present disclosure is not limited thereto, and the organic light emitting layer OEL may generate white light by a combination of organic materials that generate red light, green light, and blue light.

[0116] The second electrode E2 may be disposed on the pixel definition layer PDL and the organic light emitting layer OEL. The thin film encapsulation layer TFE may be disposed on the pixel PX to cover the light emitting element OLED. The layer between the substrate SUB and the thin film encapsulation layer TFE may be defined as a pixel layer PXL.

[0117] The thin film encapsulation layer TFE may include a first encapsulation layer EN1 disposed on the light emitting element OLED, a second encapsulation layer EN2 disposed on the first encapsulation layer EN1, and a third encapsulation layer EN3 disposed on the second encapsulation layer EN2. Each of the first encapsulation layer EN1 and the third encapsulation layer EN3 may include an inorganic material, and the second encapsulation layer EN2 may include an organic material. The thickness of the second encapsulation layer EN2 may be greater than the thickness of each of the first encapsulation layer EN1 and the third encapsulation layer EN3.

[0118] The first voltage ELVDD (eg, see Figure 4 ) may be applied to the first electrode E1, and a second voltage ELVSS may be applied to the second electrode E2. Holes and electrons injected into the organic light emitting layer OEL may be combined with each other to form excitons, and when the excitons transition to a ground state, the light emitting element OLED may emit light. The light emitting element OLED may display an image by emitting red light, green light, and / or blue light according to the flow of current.

[0119] Figure 6 yes Figure 2 A plan view of the input sensor shown in FIG.

[0120] because Figure 6 The data driver DDV and the driving cover layer DCL shown in FIG. Figure 3 The described data driver DDV and driving cover layer DCL are the same or substantially the same, so redundant descriptions thereof may not be repeated or may be simplified.

[0121] refer to Figure 3 and Figure 6The input sensor ISP may include a plurality of sensing electrodes SNE and a plurality of sensing lines SNL. The sensing electrodes SNE and the sensing lines SNL may be disposed on a thin film encapsulation layer TFE (eg, see Figure 5 )superior. Figure 6 The data driver DDV and the first pad PD1, the second pad PD2 and the third pad PD3 shown in FIG. Figure 3 The data driver DDV of the display panel DP and the first, second, and third pads PD1, PD2, and PD3 shown in FIG. 1 are identical or substantially identical.

[0122] Like the display panel DP, the input sensor ISP may include a first area A1, a second area A2, and a bending area BA between the first area A1 and the second area A2. The first area A1 may include an active area AA and a non-active area NAA surrounding the active area AA (e.g., around its periphery). The active area AA may overlap with the display area DA, and the non-active area NAA may overlap with the non-display area NDA.

[0123] The sensing electrode SNE may be disposed in the active area AA. The sensing electrode SNE may be disposed in the first area A1. The sensing line SNL may be connected to the sensing electrode SNE. The sensing line SNL may extend to the second area A2 via the non-active area NAA and the bending area BA. The sensing line SNL may extend in the first direction DR1 by bypassing both sides of the data driver DDV that are opposite to each other in the second direction DR2. The sensing line SNL may be connected to the second pad PD2 and the third pad PD3 disposed in the second area A2.

[0124] The second pad PD2 and the third pad PD3 may be connected to Figure 3 The input sensing controller IS-IC of the printed circuit board PCB shown in FIG. The input sensing controller IS-IC can control the operation of the input sensor ISP.

[0125] The sensing electrodes SNE may have unique coordinate information. For example, the sensing electrodes SNE may be arranged in a matrix form and respectively connected to the sensing lines SNL. However, the arrangement of the sensing electrodes SNE is not particularly limited thereto.

[0126] The input sensor ISP according to an embodiment of the present disclosure can be driven in a self-sensing mode to obtain coordinate information in a self-capacitance method. For example, the input sensing controller IS-IC can operate each of the sensing electrodes SNE as a driving electrode and a sensing electrode. The input sensing controller IS-IC can apply a driving signal to the sensing electrode SNE through the sensing line SNL, and can receive a sensing signal from each of the sensing electrodes SNE.

[0127] However, the present disclosure is not limited to Figure 6 The structure of the input sensor ISP shown in . For example, the input sensor ISP may include a plurality of first sensing electrodes and a plurality of second sensing electrodes to have a structure in which the input sensor ISP is driven in a mutual sensing mode. A capacitor may be formed by the first sensing electrodes and the second sensing electrodes.

[0128] The second sensing electrode may extend to cross and be insulated from the first sensing electrode. In the mutual sensing mode, the first sensing electrode may operate as a driving electrode, and the second sensing electrode may operate as a sensing electrode. The first sensing electrode may be disposed at the same layer as the second sensing electrode (e.g., in or on the same layer as the second sensing electrode), or at a different layer from the second sensing electrode (e.g., in or on a different layer from the second sensing electrode).

[0129] The driving cover layer DCL may be disposed on portions of the sensing line SNL and the data driver DDV. The driving cover layer DCL may cover portions of the sensing line SNL and the data driver DDV.

[0130] When viewed on a plane (eg, in a plan view), the opening WEH defined in the driving cover layer DCL may overlap the sensing line SNL. When moisture entering from the outside is introduced between the sensing line SNL and the driving cover layer DCL, the moisture may be evaporated to the outside through the opening WEH. Fig.10 Describe this in more detail.

[0131] Figure 7 Shows Figure 6 The configuration of the sensing electrodes shown in . Figure 8 It is along Figure 7 A cross-sectional view taken along line II' shown in FIG.

[0132] Figure 7 and Figure 8 The pixel area PA and the non-pixel area NPA are shown together.

[0133] refer to Figure 7 , the sensing electrode SNE may have a mesh shape. For example, the sensing electrode SNE may include a plurality of first branch portions BP1 extending in a first diagonal direction DDR1, and a plurality of second branch portions BP2 extending in a second diagonal direction DDR2.

[0134] The first diagonal direction DDR1 may be defined as a direction crossing the first direction DR1 and the second direction DR2 on a plane defined by the first direction DR1 and the second direction DR2. The second diagonal direction DDR2 may be defined as a direction crossing the first diagonal direction DDR1 on a plane defined by the first direction DR1 and the second direction DR2. For example, the first direction DR1 and the second direction DR2 may be perpendicular to each other or substantially perpendicular to each other, and the first diagonal direction DDR1 and the second diagonal direction DDR2 may be perpendicular to each other or substantially perpendicular to each other.

[0135] The first branch portion BP1 may intersect with the second branch portion BP2 and may be formed integrally with the second branch portion BP2. The sensing opening TOP having a rhombus shape may be defined by the first branch portion BP1 and the second branch portion BP2 intersecting each other. The first branch portion BP1 and the second branch portion BP2 may be defined by grid lines, and the line width of each of the grid lines may be about several microns. The first branch portion BP1 and the second branch portion BP2 may include metal.

[0136] The pixel area PA may have a rhombus shape and may be disposed to overlap the sensing opening TOP. The first and second branch portions BP1 and BP2 may be disposed to overlap the non-pixel area NPA. Figure 5 The pixel area PA shown in FIG. 1 may be Figure 7 Any one of the pixel areas PA shown in .

[0137] The pixel area PA may be defined as a light emitting area, and the non-pixel area NPA may be defined as a non-light emitting area. Since the first branch portion BP1 and the second branch portion BP2 are disposed in the non-pixel area NPA, light generated in the pixel area PA may be normally emitted without being affected by the first branch portion BP1 and the second branch portion BP2.

[0138] refer to Figure 8 , the sensing electrode SNE may be disposed on the thin film encapsulation layer TFE. The sensing electrode SNE may be directly disposed on the thin film encapsulation layer TFE so as to be in contact with the thin film encapsulation layer TFE. The insulating layer TS-IL may be disposed on the thin film encapsulation layer TFE to cover the sensing electrode SNE.

[0139] An insulating layer may be additionally disposed on the thin film encapsulation layer TFE. The first encapsulation layer EN1, the second encapsulation layer EN2, and the third encapsulation layer EN3 may be insulating layers, and an additional insulating layer may be disposed on the third encapsulation layer EN3. In this case, the sensing electrode SNE may be directly disposed on an insulating layer (e.g., an additional insulating layer) disposed on the uppermost layer among the plurality of insulating layers.

[0140] The cover layer HAL may be disposed over the insulating layer TS-IL. The cover layer HAL may be disposed over the sensing electrode SNE. The cover layer HAL may include a silane compound for absorbing moisture. For example, the cover layer HAL may include silica gel for absorbing moisture. Fig.10 The overlay layer HAL is described in more detail.

[0141] The first adhesive layer PSA1 may be disposed between the insulating layer TS-IL and the cover layer HAL, and the insulating layer TS-IL and the cover layer HAL may be bonded to each other through the first adhesive layer PSA1.

[0142] Fig. 9A It is along Figure 6 A cross-sectional view taken along line II-II' shown in FIG. Fig. 9B Shows Fig. 9A The bending state of the bending area shown in .

[0143] Hereinafter, the layer on the first insulating layer INS1 is defined as the first wiring layer LIL1, and the layer on the second insulating layer INS2 is defined as the second wiring layer LIL2. In addition, the layer on the thin film encapsulation layer TFE may be defined as the third wiring layer LIL3. The second wiring layer LIL2 may be disposed above the first wiring layer LIL1. The third wiring layer LIL3 may be disposed on the second wiring layer LIL2.

[0144] refer to Fig. 9A , the first encapsulation layer EN1 and the third encapsulation layer EN3 may extend from the first area A1 to the second area A2 through the bending area BA. The second encapsulation layer EN2 may be disposed in the first area A1. The second encapsulation layer EN2 may not be disposed in the bending area BA and the second area A2.

[0145] In the first area A1 adjacent to the boundary between the first area A1 and the bending area BA, the second encapsulation layer EN2 may have an inclined surface. The third encapsulation layer EN3 may extend along the inclined surface of the second encapsulation layer EN2. In the first area A1 adjacent to the boundary between the first area A1 and the bending area BA, the third encapsulation layer EN3 may have an inclined surface.

[0146] The data line DL may be disposed in the first wiring layer LIL1. The sensing line SNL may be disposed in the third wiring layer LIL3 in the first area A1, in the second wiring layer LIL2 in the bending area BA, and in the third wiring layer LIL3 in the second area A2.

[0147] The sensing line SNL extending from the first area A1 to the bending area BA may be disposed in the second wiring layer LIL2 in the bending area BA through a fourth contact hole CH4 defined in the first and third encapsulation layers EN1 and EN3 and the third insulating layer INS3 (e.g., penetrating the first and third encapsulation layers EN1 and EN3 and the third insulating layer INS3). For example, the sensing line SNL disposed in the first area A1 may be connected to the first metal electrode MT1 in the second wiring layer LIL2 disposed in the bending area BA.

[0148] The sensing line SNL extending from the bending area BA to the second area A2 may be disposed in the third wiring layer LIL3 through a fifth contact hole CH5 defined in the first and third encapsulation layers EN1 and EN3 and the third insulating layer INS3 (e.g., penetrating the first and third encapsulation layers EN1 and EN3 and the third insulating layer INS3). For example, the sensing line SNL disposed in the bending area BA may be connected to the second metal electrode MT2 in the third wiring layer LIL3 disposed in the second area A2.

[0149] The cover layer HAL may be disposed on the insulating layer TS-IL. The cover layer HAL may be disposed on the first area A1, the bending area BA, and the second area A2. The cover layer HAL may be disposed on the sensing line SNL.

[0150] The cover layer HAL may contain a silane compound for absorbing moisture. For example, the cover layer HAL may contain silica gel. However, the present disclosure is not limited thereto, and the cover layer HAL may contain octadecyl chlorosilane, octachlorosilane, butyl chlorosilane, cyanopropyl chlorosilane and / or phenyl chlorosilane. Therefore, the cover layer HAL can absorb moisture introduced from the outside. Fig.10 The overlay layer HAL is described in more detail.

[0151] The first adhesive layer PSA1 may be disposed between the cover layer HAL and the insulating layer TS-IL, and the insulating layer TS-IL and the cover layer HAL may be bonded to each other through the first adhesive layer PSA1.

[0152] refer to Fig. 9B , the bending area BA may be bent so that the second area A2 is disposed below (e.g., below) the first area A1. Stress may occur in the bending area BA. A greater compressive stress may occur in the first wiring layer LIL1 disposed more inner than other wiring layers. When the wire is disposed in the first wiring layer LIL1 or the third wiring layer LIL3 in the bending area BA, the wire may be damaged due to compressive stress and tensile stress.

[0153] A greater compressive stress may occur in the first wiring layer LIL1 disposed at an inner side than other wiring layers, and a greater tensile stress may occur in the third wiring layer LIL3 disposed at an outer side than other wiring layers. Therefore, when the sensing line SNL is disposed in the third wiring layer LIL3 in the bending area BA, the sensing line SNL may be damaged by the tensile stress.

[0154] However, according to one or more embodiments of the present disclosure, the sensing line SNL may be disposed in the second wiring layer LIL2 in the bending area BA. In this case, relatively smaller compressive stress and tensile stress may occur in the second wiring layer LIL2 than in the first wiring layer LIL1 or the third wiring layer LIL3. Therefore, damage to the line disposed in the second wiring layer LIL2 may be prevented or substantially prevented.

[0155] Fig.10 It is along Figure 6 A cross-sectional view taken along line III-III' shown in FIG.

[0156] Fig.10 The substrate SUB, the buffer layer BFL, the first insulating layer INS1 to the third insulating layer INS3 and the thin film encapsulation layer TFE shown in FIG. Figure 5 The described substrate SUB, buffer layer BFL, first to third insulating layers INS1 to INS3, and thin film encapsulation layer TFE are the same or substantially the same, and therefore, redundant descriptions thereof may not be repeated or may be simplified. Fig.10 The second wiring layer LIL2 and the third wiring layer LIL3, the insulating layer TS-IL, the sensing line SNL, the first adhesive layer PSA1 and the cover layer HAL shown in FIG. Fig. 9A The described second and third wiring layers LIL2 and LIL3 , the insulating layer TS-IL, the sensing line SNL, the first adhesive layer PSA1 , and the cover layer HAL are identical or substantially identical, and thus, redundant descriptions thereof may not be repeated or may be simplified.

[0157] refer to Fig.10 , the cover layer HAL may be disposed on the sensing line SNL. The cover layer HAL may include a silane compound for absorbing moisture. For example, the cover layer HAL may include silica gel. However, the present disclosure is not limited thereto, and the cover layer HAL may include octadecyl chlorosilane, octachlorosilane, butyl chlorosilane, cyanopropyl chlorosilane and / or phenyl chlorosilane.

[0158] Moisture introduced from the outside may corrode the sensing line SNL including metal. When the sensing line SNL is corroded, Figure 6 The input sensor ISP shown in FIG. 1 may be damaged, thereby causing a defect in the display device DD.

[0159] However, since the cover layer HAL is disposed on the sensing line SNL, the cover layer HAL can absorb moisture introduced from the outside. Therefore, moisture may not flow into the sensing line SNL. Therefore, the sensing line SNL may be prevented or substantially prevented from being damaged, and defects in the display device DD may be prevented or substantially prevented.

[0160] The driving cover layer DCL may be disposed on the cover layer HAL. The driving cover layer DCL may be disposed on the second area A2. The driving cover layer DCL may be disposed on the sensing line SNL.

[0161] The driving cover layer DCL can cover and protect the data driver DDV (see, for example, Figure 6 ) and the sensing line SNL. In addition, the driving cover layer DCL can protect the data driver DDV from static electricity.

[0162] The driving cover layer DCL may include a fourth insulating layer INS4 and a cover portion CVL. The fourth insulating layer INS4 may be disposed on the cover layer HAL. The fourth insulating layer INS4 may contain phosphorus (P) or fluorine (F). In some embodiments, the fourth insulating layer INS4 may be composed of a plurality of layers.

[0163] The cover portion CVL may be disposed on the fourth insulating layer INS4. Since the cover portion CVL includes a black material, the data driver DDV may be prevented or substantially prevented from being observed from the outside.

[0164] The second adhesive layer PSA2 may be disposed between the cover layer HAL and the fourth insulating layer INS4, and the cover layer HAL and the fourth insulating layer INS4 may be bonded to each other through the second adhesive layer PSA2.

[0165] The third adhesive layer PSA3 may be disposed between the fourth insulating layer INS4 and the cover portion CVL, and the fourth insulating layer INS4 and the cover portion CVL may be bonded to each other by the third adhesive layer PSA3.

[0166] The opening WEH may be defined by the driving cover layer DCL and the cover layer HAL (eg, may penetrate the driving cover layer DCL and the cover layer HAL). The opening WEH may pass through the driving cover layer DCL and the cover layer HAL. The opening WEH may overlap the sensing line SNL.

[0167] When moisture entering from the outside is introduced into the sensing line SNL, the sensing line SNL may be corroded. In addition, when phosphorus (P) or fluorine (F) included in the fourth insulating layer INS4 is ionized by reacting with moisture, the sensing line SNL may be corroded. Therefore, the display device DD (for example, see Figure 1) may become defective.

[0168] According to one or more embodiments of the present disclosure, when the opening WEH is defined by the driving cover layer DCL and the cover layer HAL, moisture introduced from the outside can be evaporated through the opening WEH. Therefore, corrosion of the sensing line SNL can be prevented or substantially prevented. Therefore, the display device DD (for example, see Figure 1 ) is defective.

[0169] According to one or more embodiments of the present disclosure, a plurality of openings may be defined in a portion of the sensing line and a driving cover layer covering a data driver. In addition, a cover layer for absorbing moisture may be provided between the portion of the sensing line and the driving cover layer. Since the openings are defined and the cover layer is provided, even if moisture may be introduced into the sensing line from the outside, the moisture may be evaporated through the openings and / or absorbed by the cover layer, and therefore, corrosion of the sensing line may be prevented or substantially prevented.

[0170] The above is a description of some embodiments of the present disclosure, and should not be interpreted as limiting it. Although some embodiments have been described, it will be readily understood by those skilled in the art that various modifications can be made in the embodiments without departing from the spirit and scope of the present disclosure. It will be understood that, unless otherwise described, the description of the features or aspects within each embodiment should generally be considered to be applicable to other similar features or aspects in other embodiments. Therefore, as will be understood by those of ordinary skill in the art, unless otherwise specifically indicated, the features, characteristics and / or elements described in conjunction with a particular embodiment can be used alone or in combination with the features, characteristics and / or elements described in conjunction with other embodiments. Therefore, it will be understood that the foregoing is an illustration of various exemplary embodiments, and should not be interpreted as being limited to the specific embodiments disclosed herein, and various modifications to the disclosed embodiments and other exemplary embodiments are intended to be included in the spirit and scope of the present disclosure as defined by the appended claims and their equivalents.

Claims

1. A display device, It is characterized in that include: A display panel comprising a first area, a second area and a curved area positioned along a first direction, wherein the curved area is between the first area and the second area; a plurality of sensing electrodes on the first area; a data driver on the second area; a sensing line on the first region and connected to the sensing electrode and extending in the first direction toward opposite sides of the data driver, the opposite sides being opposite to each other in a second direction crossing the first direction; as well as A covering layer is on the sensing line.

2. The display device according to claim 1, It is characterized in that The cover layer includes a silane compound to absorb moisture.

3. The display device according to claim 1, It is characterized in that A driving cover layer is also included, the driving cover layer covering the data driver and a portion of the sensing line adjacent to the data driver.

4. The display device according to claim 3, It is characterized in that The driving cover layer is located on the second area.

5. The display device according to claim 3, Features: An opening is defined in the drive cover layer; and In a plan view, the opening overlaps a portion of the sensing line.

6. The display device according to claim 5, It is characterized in that The opening passes through the drive cover layer and the cover layer.

7. The display device according to claim 5, It is characterized in that The opening is adjacent to the opposite sides of the data driver in a plan view.

8. The display device according to claim 5, It is characterized in that The opening does not overlap the data driver.

9. The display device according to claim 3, It is characterized in that The driving overlay layer comprises: an insulating layer on the cover layer; and The covering portion includes a black material on the insulating layer.

10. The display device according to claim 1, It is characterized in that The cover layer is located on the first region, the bending region, and the second region.

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