Dispensing and packaging mechanism for far infrared semiconductor heating plate

Abstract

The utility model discloses a dispensing and packaging mechanism for a far infrared semiconductor heating plate, relates to the field of production of semiconductor heating plates, and solves the problem that an existing device is difficult to synchronously carry out efficient dispensing and packaging on four corners of a rectangular heating plate according to requirements. According to the scheme, the device comprises a driving assembly, an adjusting assembly and a glue dispenser on the bottom side of the adjusting assembly; a main body of the driving assembly is a main hydraulic cylinder set, the bottom end of the main hydraulic cylinder set is fixedly connected with a support base, and a bearing column is hinged to the support base. According to the dispensing and packaging mechanism for the far infrared semiconductor heating plate, through the arrangement of the driving assembly and the adjusting assembly on the bottom side of the driving assembly, a main hydraulic cylinder set can be used for driving four sets of bearing columns to incline, and all sets of dispensing devices at the outer ends of the bearing columns synchronously move inwards, so that the specific positions of the four sets of dispensing devices are synchronously adjusted; and the glue dispensing positions of the four groups of glue dispensers are adjusted through stretching and retracting of the two groups of auxiliary hydraulic cylinder groups, so that the outer ends of the rectangular heating plates with different specifications are subjected to glue dispensing and packaging according to requirements.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor heating board production, in particular to a glue dispensing packaging mechanism for a far-infrared semiconductor heating board. Background Art

[0002] In the production process of existing heating panels, semiconductor mechanisms are generally provided. Semiconductors refer to materials whose electrical conductivity is between that of conductors and insulators at room temperature, and dispensing machines are often required for dispensing and packaging in semiconductor processing.

[0003] According to the search, in the application with patent number CN202221764274.4, a semiconductor packaging dispensing machine is disclosed, which includes a vacuum dispensing machine box and a workbench. The workbench is arranged at the left end of the vacuum dispensing machine box, a vacuum glue barrel is fixed at the upper end of the workbench, a motor is fixed at the upper end of the vacuum glue barrel, a return frame is connected to the power end of the motor, a battery is connected to the return frame, a temperature display screen is embedded at the front end of the workbench, a stirring component and a temperature control component are arranged in the vacuum glue barrel, a delivery pump is connected to the right end of the vacuum glue barrel, and an insulation pipe is connected between the delivery pump and the vacuum dispensing machine box;

[0004] The above application document avoids glue solidification by setting up a stirring mechanism. However, in the specific packaging process, since the general heating plate is rectangular, it is necessary to use a position adjustment component to adjust the position of the glue dispenser and perform glue dispensing and packaging on the four corners of the rectangular plate, while the general driving mechanism can only adjust a single position, affecting the efficiency of the glue dispensing process.

[0005] Therefore, we proposed a dispensing packaging mechanism for a far-infrared semiconductor heating panel. Utility Model Content

[0006] In view of the deficiencies in the prior art, the utility model provides a glue dispensing and packaging mechanism for a far-infrared semiconductor heating panel, which solves the problem that the prior device is difficult to synchronously and efficiently perform glue dispensing and packaging on the four corners of a rectangular heating panel according to demand.

[0007] To achieve the above objectives, the utility model is implemented through the following technical solutions: a glue dispensing and packaging mechanism for a far-infrared semiconductor heating panel, comprising a driving component, an adjusting component and a glue dispenser on the bottom side thereof;

[0008] The main body of the driving assembly is a main hydraulic cylinder group, the bottom end of the main hydraulic cylinder group is fixedly connected to a bracket seat, and a receiving column is hinged on the bracket seat;

[0009] The adjustment assembly is formed by two sets of rotating frames and the rotating column therebetween being hinged from the middle side, and a sliding groove is provided on the outer wall of the rotating frame;

[0010] A slide seat which is slidably mounted on the slide groove is fixedly mounted on the top of the glue dispenser, and a lower frame end which is mounted on the bottom end of the receiving column is fixedly mounted on the top of the slide seat.

[0011] Preferably, the receiving column is welded by the inner and outer plates and the sleeve columns at their ends, and the bracket seat is provided with four sets of upper frame ends which are opposite to each other and hinged to the sleeve columns;

[0012] Among them, the length of the receiving column is limited, so that the specific positions of the four groups of glue dispensers are synchronously adjusted when the main hydraulic cylinder group is extended and retracted, thereby achieving the effect of efficient glue dispensing and packaging of the four corners of rectangular heating panels of different specifications.

[0013] Preferably, the inner wall of the slide groove is smooth, and the slide seat is an I-shaped seat adapted to its specifications;

[0014] The arrangement of the slide seat facilitates sliding in the slide groove when the slide seat is adjusted, thereby ensuring the effect of position adjustment.

[0015] Preferably, a rotating disc with a thickness half that of the rotating rack is fixedly mounted on the middle side of the rotating rack, and the rotating discs in the upper and lower rotating racks are hingedly connected by rotating columns;

[0016] Among them, the setting of the rotating column makes it easy for the auxiliary hydraulic cylinder group to drive the glue dispenser at its end to move outward, thereby ensuring the glue dispensing packaging effect.

[0017] Preferably, an auxiliary hydraulic cylinder group is provided on the outer side of the rotating frame and is located between the rotating frame and the adjacent rotating frame, and both ends of the auxiliary hydraulic cylinder group are hinged to the outer side walls of the two rotating frames through hinge seats;

[0018] Among them, the setting of the auxiliary hydraulic cylinder group can adjust the specific positions of the four groups of dispensers through its own extension and contraction.

[0019] Preferably, the top end of the main hydraulic cylinder group is fixedly connected to the top wall inside the dispensing box;

[0020] Among them, the setting of the main hydraulic cylinder group facilitates the lifting of the entire device and ensures stability.

[0021] Preferably, the outer end of the rotating frame is fixedly connected to the inner wall of the dispensing box by an iron chain.

[0022] The utility model provides a glue dispensing packaging mechanism for a far-infrared semiconductor heating panel, which has the following beneficial effects:

[0023] The glue dispensing and packaging mechanism of the far-infrared semiconductor heating panel, through the setting of the driving component and the bottom adjustment component, can use the main hydraulic cylinder group to drive the four groups of receiving columns to tilt, and make the groups of glue dispensers at the outer ends move inward synchronously, so as to synchronously adjust the specific positions of the four groups of glue dispensers, and then adjust the glue dispensing positions of the four groups of glue dispensers by the extension and retraction of the two groups of auxiliary hydraulic cylinder groups, so as to perform glue dispensing and packaging on the outer ends of rectangular heating panels of different specifications according to needs, which solves the problem that it is difficult for existing devices to synchronously perform efficient glue dispensing and packaging on the four corners of the rectangular heating panel according to needs. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a schematic diagram of the structure of the utility model;

[0025] Figure 2 It is a structural schematic diagram of the adjustment component of the utility model;

[0026] Figure 3 This is a structural schematic diagram of the glue dispenser of the utility model;

[0027] Figure 4 It is a structural schematic diagram of the drive assembly of the utility model.

[0028] In the figure: 1. driving assembly; 11. main hydraulic cylinder group; 12. bracket seat; 13. upper shelf end; 14. receiving column; 15. sleeve column; 2. adjustment assembly; 21. rotating frame; 22. rotating column; 23. slide; 24. auxiliary hydraulic cylinder group; 3. glue dispenser; 4. slide seat; 5. lower shelf end. DETAILED DESCRIPTION

[0029] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0030] Embodiment 1:

[0031] A glue dispensing packaging mechanism for a far-infrared semiconductor heating plate comprises a driving component 1, an adjusting component 2 and a glue dispenser 3 on the bottom side thereof; the main body of the driving component 1 is a main hydraulic cylinder group 11, the bottom end of the main hydraulic cylinder group 11 is fixedly connected with a bracket seat 12, and a receiving column 14 is hinged on the bracket seat 12; the adjusting component 2 is formed by two groups of rotating frames 21 and a rotating column 22 therebetween being hinged from the middle side, and a slide groove 23 is provided on the outer wall of the rotating frame 21; a slide seat 4 which is slidably fitted with the slide groove 23 is fixedly installed on the top of the glue dispenser 3, and a lower frame end 5 which is fitted on the bottom end of the receiving column 14 is fixedly installed on the top of the slide seat 4;

[0032] Among them, the glue dispensing and packaging mechanism of the far-infrared semiconductor heating panel, through the setting of the driving component 1 and the bottom adjustment component 2, can use the main hydraulic cylinder group 11 to drive the four groups of receiving columns 14 to tilt, and make the groups of glue dispensers 3 at the outer ends move inward synchronously, so as to synchronously adjust the specific positions of the four groups of glue dispensers 3, and then adjust the glue dispensing positions of the four groups of glue dispensers 3 by the extension and retraction of the two groups of auxiliary hydraulic cylinder groups 24, so as to perform glue dispensing and packaging on the outer ends of rectangular heating panels of different specifications according to needs, thereby solving the problem that it is difficult for existing devices to synchronously perform efficient glue dispensing and packaging on the four corners of the rectangular heating panel according to needs.

[0033] Embodiment 2:

[0034] The receiving column 14 is welded by the inner and outer plates and the sleeve columns 15 at their ends, and the bracket seat 12 is provided with four groups of upper frame ends 13 which are relatively positioned and hinged to the sleeve columns 15; wherein, the length of the receiving column 14 is limited, so that the specific positions of the four groups of glue dispensers 3 are synchronously adjusted when the main hydraulic cylinder group 11 is extended or retracted, thereby achieving the effect of efficient glue dispensing and packaging of the four corners of rectangular heating panels of different specifications.

[0035] The inner wall of the slide groove 23 is smooth, and the slide seat 4 is an I-shaped seat adapted to its specifications; wherein, the arrangement of the slide seat 4 facilitates sliding in the slide groove 23 during adjustment, thereby ensuring the effect of position adjustment.

[0036] A turntable with half the thickness of the turntable is fixedly installed on the middle side of the turntable 21, and the turntables in the upper and lower groups of turntables 21 are hinged by a turntable 22; wherein, the setting of the turntable 22 facilitates the auxiliary hydraulic cylinder group 24 to drive the glue dispenser 3 at its end to move outward, thereby ensuring the glue dispensing packaging effect.

[0037] An auxiliary hydraulic cylinder group 24 is provided on the outer side of the rotating frame 21 and is located between it and the adjacent rotating frame 21, and both ends of the auxiliary hydraulic cylinder group 24 are hinged on the outer side walls of the two groups of rotating frames 21 through hinge seats; wherein, the setting of the auxiliary hydraulic cylinder group 24 can adjust the specific positions of the four groups of dispensers 3 through its own telescopic movement.

[0038] The top end of the main hydraulic cylinder group 11 is fixedly connected to the top wall inside the dispensing box; wherein, the arrangement of the main hydraulic cylinder group 11 facilitates the hoisting of the entire device and ensures stability.

[0039] The outer end of the rotating frame 21 is fixedly connected to the inner wall of the dispensing box through an iron chain.

[0040] The working principle and use process of the utility model are as follows: when the device is needed to work, it is installed on the inner side of the glue dispensing box. When it is necessary to dispense glue and encapsulate the four corners of the lower heating plate, the main hydraulic cylinder group 11 and the auxiliary hydraulic cylinder group 24 between the two groups of rotating frames 21 are opened synchronously to synchronously adjust the four groups of glue dispensers 3, so as to achieve the effect of efficient glue dispensing and encapsulation of the corners of heating plates of different specifications.

[0041] The above shows and describes the basic principles and main features of the utility model and the advantages of the utility model. For those skilled in the art, it is obvious that the utility model is not limited to the details of the above exemplary embodiments, and can be implemented in other specific forms without departing from the spirit or basic features of the utility model. Therefore, no matter from which point of view, the embodiments should be regarded as exemplary and non-restrictive. The scope of the utility model is defined by the attached claims rather than the above description, and it is intended to include all changes within the meaning and scope of the equivalent elements of the claims. Any figure mark in the claims should not be regarded as limiting the claims involved.

[0042] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A glue dispensing packaging mechanism for a far-infrared semiconductor heating panel, comprising a driving component (1), an adjusting component (2) and a glue dispenser (3) on the bottom side thereof; Features: The main body of the driving assembly (1) is a main hydraulic cylinder group (11), the bottom end of the main hydraulic cylinder group (11) is fixedly connected to a support seat (12), and a receiving column (14) is hinged on the support seat (12); The adjustment assembly (2) is formed by two sets of rotating frames (21) and a rotating column (22) therebetween, which are hinged from the middle side, and a sliding groove (23) is provided on the outer wall of the rotating frame (21); A slide seat (4) slidably mounted on the slide groove (23) is fixedly mounted on the top of the glue dispenser (3), and a lower frame end (5) mounted on the bottom end of the receiving column (14) is fixedly mounted on the top of the slide seat (4).

2. The glue dispensing packaging mechanism of the far-infrared semiconductor heating panel according to claim 1 is characterized in that: The receiving column (14) is welded by inner and outer plates and sleeve columns (15) at their ends, and the bracket seat (12) is provided with four groups of upper frame ends (13) which are opposite to each other and hinged to the sleeve columns (15).

3. The glue dispensing packaging mechanism of the far-infrared semiconductor heating panel according to claim 1 is characterized in that: The inner wall of the slide groove (23) is smooth, and the slide seat (4) is an I-shaped seat matching its specifications.

4. The glue dispensing packaging mechanism of the far-infrared semiconductor heating panel according to claim 1 is characterized in that: A rotating disc having a thickness half that of the rotating rack (21) is fixedly mounted on the middle side of the rotating rack (21), and the rotating discs in the upper and lower rotating racks (21) are hingedly connected via rotating columns (22).

5. The glue dispensing packaging mechanism of the far-infrared semiconductor heating panel according to claim 1 is characterized in that: The outer side of the rotating frame (21) is provided with an auxiliary hydraulic cylinder group (24) located between the rotating frame (21) and the adjacent rotating frame (21), and the two ends of the auxiliary hydraulic cylinder group (24) are hinged on the outer side walls of the two groups of rotating frames (21) through hinge seats.

6. The glue dispensing packaging mechanism of the far-infrared semiconductor heating panel according to claim 1 is characterized in that: The top end of the main hydraulic cylinder group (11) is fixedly connected to the top wall inside the glue dispensing box.

7. The glue dispensing packaging mechanism for a far-infrared semiconductor heating panel according to claim 1 is characterized in that: The outer end of the rotating frame (21) is fixedly connected to the inner wall of the glue dispensing box through an iron chain.

Images