Wafer lifting assembly and wafer detection device

Abstract

The utility model provides a wafer elevating assembly and a wafer detection device. The wafer elevating assembly comprises a fixed seat, a placing platform, a mobile carrier and a driving part. The placing platform is used for placing a wafer; the placing platform is connected with the mobile carrier; the driving component comprises a screw rod, a first driving sub-component and a second driving sub-component, the first driving sub-component and the second driving sub-component are in transmission connection, the screw rod is mounted on the fixed seat, the moving carrier is mounted on the screw rod in a lifting manner, the second driving sub-component is in transmission connection with the screw rod, and the first driving sub-component can drive the second driving sub-component to rotate; and the second driving sub-component drives the screw rod to rotate, so that the moving carrier ascends or descends along the screw rod. The wafer lifting assembly adopts a multi-stage transmission mode to drive the screw rod to rotate, so that the moving carrier on the screw rod ascends or descends, the whole structure does not occupy space in other directions except for ascending or descending in the vertical direction during use, and the space occupation volume of the whole structure is greatly reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer lifting components, and in particular to a wafer lifting component and a wafer detection device. Background Art

[0002] Testing is an extremely important part of the semiconductor manufacturing process. When wafer manufacturing is completed, wafer inspection is usually required. Wafer inspection refers to the functional and electrical parameter testing of bare chips on wafers through the cooperation of probe stations and test equipment. The probe station transfers wafers to the test position one by one. The detection points of the chips are connected to the test equipment through probes and special connection lines. The test equipment applies input signals to the chips and collects output signals to determine whether the chips meet the design specifications.

[0003] During the testing process, the wafer chip needs to be lifted and contacted with the probe of the tester. In the current existing technology, a motor is used to drive the base to move horizontally. The bottom surface of the base and the storage platform are formed with triangular wedge blocks that are slidably connected to each other. When the base moves horizontally, the triangular wedge blocks squeeze each other, and the storage platform will be squeezed up. This structure will cause the equipment space volume to be too large.

[0004] Therefore, it is necessary to provide a wafer lifting assembly and a wafer detection device to solve the above technical problems. Utility Model Content

[0005] The main purpose of the utility model is to provide a wafer lifting assembly and a wafer detection device, aiming to solve the technical problem in the prior art that the space volume occupied by the wafer lifting mechanism is too large.

[0006] According to one aspect of the utility model, the utility model provides a wafer lifting assembly, comprising:

[0007] Fixed seat;

[0008] A placement platform, wherein the placement platform is used to place a wafer;

[0009] A mobile carrier, the placement platform is connected to the mobile carrier;

[0010] A driving component, the driving component includes a screw rod and a first driving sub-component and a second driving sub-component that are transmission-connected. The screw rod is installed on the fixed seat, and the mobile carrier is lifted and lowered on the screw rod. The second driving sub-component is transmission-connected to the screw rod. The first driving sub-component can drive the second driving sub-component to rotate, so as to drive the screw rod to rotate through the second driving sub-component, so that the mobile carrier rises or falls along the screw rod.

[0011] In one embodiment, the first driving subcomponent includes a driving motor, a driving wheel and a synchronous belt, the second driving subcomponent includes a driven wheel, the mobile carrier is formed with a threaded hole, one end of the screw rod is threadedly connected to the mobile carrier through the threaded hole, the driving wheel is sleeved on the output shaft of the driving motor, the driven wheel is sleeved on the other end of the screw rod, and the driving wheel and the driven wheel are connected through the synchronous belt transmission.

[0012] In one embodiment, the fixed seat includes a first bearing seat, a first fixing member and a shell, the shell is formed with a through hole, the first bearing seat is installed inside the shell, the screw rod passes through the first bearing seat and the through hole in sequence, and is threadedly connected to the movable carrier through the threaded hole, the first fixing member is installed on the screw rod, and the first bearing seat and the first fixing member are respectively arranged on both sides of the driven wheel.

[0013] In one embodiment, the wafer lifting assembly also includes a second fixing member and a second bearing seat, and the driving component also includes a shielding frame, the shielding frame is connected to the cylinder body of the driving motor, the shielding frame is formed with a mounting hole, the second bearing seat is installed in the mounting hole, the output shaft of the driving motor passes through the second bearing seat, the driving wheel is installed on the output shaft of the driving motor and extends out of one end of the second bearing seat, the driving wheel is abutted against the second bearing seat, and the second fixing member is installed on the output shaft of the driving motor and abuts against the driving wheel.

[0014] In one embodiment, the wafer lifting assembly also includes a first slider, a base and a side plate, the fixed seat is installed on the base, the side plate is installed on the base, a guide rail is formed on the side plate, the guide rail is arranged along the length direction of the side plate, the first slider is slidably installed on the guide rail, and the first slider is connected to the movable carrier.

[0015] In one embodiment, there are multiple guide rails, and the multiple guide rails are arranged at intervals along the width direction of the side panel. The number of the first sliders is equal to the number of the guide rails. The multiple first sliders are arranged in a one-to-one correspondence with the multiple guide rails, and the multiple first sliders are all connected to the mobile carrier.

[0016] In one embodiment, the wafer lifting assembly further includes a second slider, the second slider is slidably mounted on the guide rail, and the first slider is located on top of the second slider.

[0017] In one embodiment, the wafer lifting assembly further includes a control assembly and a limit sensor, wherein the limit sensor is used to sense whether the first slider is in place, and both the limit sensor and the drive motor are connected to the control assembly signal.

[0018] In one embodiment, there are at least two limit sensors, the side panel includes a first limit position and a second limit position, the two limit sensors are respectively installed at the first limit position and the second limit position, both of the two limit sensors are connected to the control component signal, and the two limit sensors are respectively used to sense whether the first slider moves to the first limit position and the second limit position.

[0019] According to another aspect of the present invention, the present invention further provides a wafer detection device, comprising a probe assembly and the wafer lifting assembly described above, wherein the probe assembly is used to abut against the wafer.

[0020] In the above scheme, the wafer lifting assembly includes a fixed seat, a placement platform, a mobile carrier and a driving component; the placement platform is used to place the wafer; the placement platform is connected to the mobile carrier; the driving component includes a screw and a first driving sub-component and a second driving sub-component that are connected in a transmission manner, the screw is installed on the fixed seat, the mobile carrier is lifted and installed on the screw, the second driving sub-component is connected in a transmission manner with the screw, the first driving sub-component can drive the second driving sub-component to rotate, so as to drive the screw to rotate through the second driving sub-component, so that the mobile carrier rises or falls along the screw. Specifically, the operator places the wafer on the placement platform, and then starts the first driving sub-component, the first driving sub-component and the second driving sub-component are connected in a transmission manner, so that the first driving sub-component can drive the second driving sub-component to rotate, the second driving sub-component is connected in a transmission manner with the screw, and the screw will also rotate with the second driving sub-component, because the screw is installed on the fixed seat, when the screw rotates, it will not move, so the mobile carrier that is slidably installed on the screw will rise or fall on the screw, the mobile carrier and the placement platform are connected to each other, so that the placement platform will also rise or fall, thereby causing the wafer to rise or fall. In the prior art, a motor is used to drive the base to move horizontally, and the bottom surfaces of the base and the storage platform are formed with triangular wedge blocks that are slidably connected to each other. When the base moves horizontally, the triangular wedge blocks squeeze each other, and the storage platform will be squeezed up. In this way, when in use, the entire structure will not only rise or fall in the vertical direction, but also increase the occupied space in the horizontal direction. In the utility model, a multi-stage transmission method is used to drive the screw to rotate, so that the mobile carrier on the screw rises or falls. In this way, when in use, the entire structure will not occupy space in other directions except for the rise or fall in the vertical direction, which greatly reduces the space occupied by the entire structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the implementation methods of the utility model or the technical solutions in the prior art, the drawings required for use in the implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some implementation methods of the utility model. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0022] Figure 1 This is a structural schematic diagram of a wafer lifting assembly according to an embodiment of the utility model;

[0023] Figure 2 It is a cross-sectional view of a wafer lifting assembly according to an embodiment of the present invention.

[0024] Description of Figure Numbers:

[0025] Label name Label name 100 Wafer lifting assembly 1 Fixed seat 2 Placement Platform 3 Mobile carrier 4 Drive components 41 Screw 42 First drive subassembly 43 Second drive subassembly 421 Drive motor 422 Driving wheel 423 Timing belt 431 Driven wheel 31 Threaded Hole 11 First bearing seat 12 First fixing piece 13 case 5 Second fixing member 6 Second bearing seat 44 Occlusion frame 7 First Slider 8 Base 9 Side panels 91 guide 101 Second slider 102 Limit sensor

[0026] The realization of the purpose, functional features and advantages of the utility model will be further explained in conjunction with the implementation methods and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0027] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0028] It should be noted that all directional indications in the embodiments of the present invention (such as up, down, left, right, front, back...) are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0029] In addition, in the present invention, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of the present invention, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0030] In the present invention, unless otherwise clearly specified and limited, the terms "connection", "fixation", etc. should be understood in a broad sense. For example, "fixation" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0031] In addition, the technical solutions between the various embodiments of the present invention can be combined with each other, but it must be based on the fact that ordinary technicians in the field can implement it. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0032] According to one aspect of the present invention, see Figure 1 , Figure 1 In order to make the main structure clearer, some connection structures are not shown. The utility model provides a wafer lifting assembly 100, including:

[0033] Fixed seat 1;

[0034] Placing platform 2, the placing platform 2 is used to place the wafer;

[0035] The mobile carrier 3 is placed on the platform 2 and is connected to the mobile carrier 3;

[0036] The driving component 4 includes a screw rod 41 and a first driving sub-component 42 and a second driving sub-component 43 which are transmission-connected. The screw rod 41 is installed on the fixed seat 1, and the mobile carrier 3 is lifted and lowered on the screw rod 41. The second driving sub-component 43 is transmission-connected with the screw rod 41. The first driving sub-component 42 can drive the second driving sub-component 43 to rotate, so as to drive the screw rod 41 to rotate through the second driving sub-component 43, so that the mobile carrier 3 rises or falls along the screw rod 41. Specifically, the operator places the wafer on the placement platform 2, and then starts the first drive sub-component 42. The first drive sub-component 42 is connected to the second drive sub-component 43 by transmission, so that the first drive sub-component 42 can drive the second drive sub-component 43 to rotate, and the second drive sub-component 43 is connected to the screw 41 by transmission, and the screw 41 will also rotate with the second drive sub-component 43. Since the screw 41 is installed on the fixed seat 1, when the screw 41 rotates, it will not move, so the mobile carrier 3 slidably installed on the screw 41 will rise or fall on the screw 41, and the mobile carrier 3 and the placement platform 2 are connected to each other, so that the placement platform 2 will also rise or fall, thereby causing the wafer to rise or fall. In the prior art, a motor is used to drive the base 8 to move horizontally, and the bottom surface of the base 8 and the storage platform is formed with triangular wedge blocks that are slidably connected to each other. When the base 8 moves horizontally, the triangular wedge blocks squeeze each other, and the storage platform will be squeezed up, so that when the entire structure is used, it will not only rise or fall in the vertical direction, but also increase the occupied space in the horizontal direction. In this embodiment, a multi-stage transmission method is adopted to drive the screw 41 to rotate, so that the movable carrier 3 on the screw 41 rises or falls. In this way, when in use, the entire structure will not occupy space in other directions except for rising or falling in the vertical direction, which greatly reduces the space occupied by the entire wafer lifting assembly 100.

[0037] See also Figure 1 and Figure 2In one embodiment, the first driving sub-component 42 includes a driving motor 421, a driving wheel 422 and a synchronous belt 423, the second driving sub-component 43 includes a driven wheel 431, the mobile carrier 3 is formed with a threaded hole 31, one end of the screw rod 41 is threadedly connected to the mobile carrier 3 through the threaded hole 31, the driving wheel 422 is sleeved on the output shaft of the driving motor 421, the driven wheel 431 is sleeved on the other end of the screw rod 41, and the driving wheel 422 and the driven wheel 431 are connected through a synchronous belt 423. Specifically, the operator places the wafer on the placement platform 2, and then starts the drive motor 421, the output shaft of the drive motor 421 rotates, and since the driving wheel 422 is sleeved on the output shaft of the drive motor 421, the driving wheel 422 will rotate with the output shaft of the drive motor 421, and the driven wheel 431 and the driving wheel 422 are connected by the synchronous belt 423, so that the driven wheel 431 will also rotate, and the screw rod 41 is sleeved on the driven wheel 431, so that the screw rod 41 will rotate, and the screw rod 41 is installed on the fixed seat 1, that is, the screw rod 41 will not move up and down, and the other end of the screw rod 41 is threadedly connected with the mobile carrier 3 through the threaded hole 31. When the screw rod 41 rotates, the mobile carrier 3 will move on the screw rod 41, thereby making the wafer rise or fall. The synchronous belt 423 is used for transmission, and there will be no slippage during operation, and there is an accurate transmission ratio. Moreover, since the synchronous belt 423 is used for non-slip synchronous transmission, it will have a higher transmission efficiency and a significant energy-saving effect.

[0038] See also Figure 1 and Figure 2 In one embodiment, the fixing seat 1 includes a first bearing seat 11, a first fixing member 12 and a housing 13. The housing 13 is formed with a through hole. The first bearing seat 11 is installed inside the housing 13. The screw rod 41 passes through the first bearing seat 11 and the through hole in sequence, and is threadedly connected with the mobile carrier 3 through the threaded hole 31. The first fixing member 12 is installed on the screw rod 41. The first bearing seat 11 and the first fixing member 12 are respectively arranged on both sides of the driven wheel 431. By such an arrangement, the first fixing member 12 and the first bearing seat 11 are respectively abutted against both sides of the driven wheel 431, so that the driven wheel 431 is prevented from falling off the screw rod 41 due to shaking or shaking during operation, thereby ensuring the long-term operation of the equipment.

[0039] See also Figure 1 and Figure 2In one embodiment, the wafer lifting assembly 100 further includes a second fixing member 5 and a second bearing seat 6, the driving component 4 further includes a shielding frame 44, the shielding frame 44 is connected to the cylinder body of the driving motor 421, the shielding frame 44 is formed with a mounting hole, the second bearing seat 6 is mounted in the mounting hole, the output shaft of the driving motor 421 passes through the second bearing seat 6, the driving wheel 422 is mounted on the output shaft of the driving motor 421 and extends out of one end of the second bearing seat 6, the driving wheel 422 abuts against the second bearing seat 6, and the second fixing member 5 is mounted on the output shaft of the driving motor 421 and abuts against the driving wheel 422. Through such a setting, the second fixing member 5 and the second bearing seat 6 abut against the two sides of the driving wheel 422 respectively, so as to prevent the driving wheel 422 from falling off the output shaft of the driving motor 421 due to shaking or shaking during operation, and further ensure the long-term operation of the equipment.

[0040] See also Figure 1 In one embodiment, the wafer lifting assembly 100 also includes a first slider 7, a base 8 and a side plate 9. The fixed seat 1 is installed on the base 8, the side plate 9 is installed on the base 8, a guide rail 91 is formed on the side plate 9, and the guide rail 91 is arranged along the length direction of the side plate 9. The first slider 7 is slidably installed on the guide rail 91, and the first slider 7 is connected to the movable carrier 3. Specifically, the operator places the wafer on the placement platform 2, and then starts the first driving sub-component 42. The first driving sub-component 42 and the second driving sub-component 43 are transmission-connected, so that the first driving sub-component 42 can drive the second driving sub-component 43 to rotate, and the second driving sub-component 43 is transmission-connected to the screw 41, and the screw 41 will also rotate with the second driving sub-component 43. Since the screw 41 is installed on the fixed seat 1, when the screw 41 rotates, it will not move, so the mobile carrier 3 slidingly installed on the screw 41 will rise or fall on the screw 41. The mobile carrier 3 and the placement platform 2 are interconnected, so that the placement platform 2 is driven to rise or fall, and then the wafer rises or falls. At the same time, the mobile carrier 3 is connected to the first sliding. When the mobile carrier 3 rises or falls, the first slider 7 will also rise or fall along the guide rail 91. Through such a setting, the rise or fall of the first slider 7 along the guide rail 91 can provide a guiding effect for the mobile carrier 3.

[0041] See also Figure 1 In one embodiment, there are multiple guide rails 91, which are arranged at intervals along the width direction of the side plate 9, the number of first sliders 7 is equal to the number of guide rails 91, the multiple first sliders 7 are arranged in one-to-one correspondence with the multiple guide rails 91, and the multiple first sliders 7 are connected to the mobile carrier 3. The above arrangement can further improve the guiding effect and further prevent the mobile carrier 3 from being offset during movement.

[0042] See also Figure 1In one embodiment, the wafer lifting assembly 100 further includes a second slider 101, which is slidably mounted on the guide rail 91, and the first slider 7 is located on the top of the second slider 101. A double slider structure is adopted, in which one slider is used to support and guide the spindle, and the other slider plays an auxiliary role to alleviate the lateral force. This can provide better support and guidance, and at the same time can alleviate the influence of the lateral force to ensure the accuracy of displacement.

[0043] See also Figure 1 In one embodiment, the wafer lifting assembly 100 further includes a control assembly and a limit sensor 102. The limit sensor 102 is used to sense whether the first slider 7 is in place. The limit sensor 102 and the drive motor 421 are both connected to the control assembly signal. When the first slider 7 moves to the position of the limit sensor 102, the limit sensor 102 sends a signal to the control assembly, and the control assembly controls the drive motor 421 to stop moving, the screw rod 41 stops rotating, and the mobile carrier 3 stops moving. Such a setting can achieve automatic closing and reduce the labor intensity of the operator.

[0044] See also Figure 1 In one embodiment, there are at least two limit sensors 102, and the side plate 9 includes a first limit position and a second limit position. The two limit sensors 102 are respectively installed at the first limit position and the second limit position. The two limit sensors 102 are connected to the control component signal, and the two limit sensors 102 are respectively used to sense whether the first slider 7 moves to the first limit position and the second limit position. When the first slider 7 rises to a certain height and is flush with the first limit position, the limit sensor 102 installed at the first limit position will sense that the first slider 7 has moved to the highest position, and will send a signal to stop the drive motor 421, so that the mobile carrier 3 will stop moving, and then the wafer can be detected; when the first slider 7 drops to a certain position and is flush with the second limit position, the limit sensor 102 installed at the second limit position will sense that the first slider 7 has moved to the lowest position, and will send a signal to stop the drive motor 421, so that the mobile carrier 3 will stop moving. Through such a setting, the first slider 7 is protected from exceeding the first limit position and the second limit position, and the first slider 7 is prevented from detaching from the guide rail 91.

[0045] According to another aspect of the present invention, the present invention further provides a wafer inspection device, including a probe assembly and the above-mentioned wafer lifting assembly 100, wherein the probe assembly is used to abut against the wafer. Since the wafer inspection device includes all implementations of all embodiments of the above-mentioned wafer lifting assembly 100, it has at least all the beneficial effects brought by all the above-mentioned implementations, which will not be described one by one here.

[0046] The above are only optional embodiments of the present invention, and do not limit the patent scope of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the technical concept of the present invention, or directly / indirectly used in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A wafer lifting assembly, characterized in that: include: Fixed seat; A placement platform, wherein the placement platform is used to place a wafer; A mobile carrier, the placement platform is connected to the mobile carrier; A driving component, the driving component includes a screw rod and a first driving sub-component and a second driving sub-component that are transmission-connected. The screw rod is installed on the fixed seat, and the mobile carrier is lifted and lowered on the screw rod. The second driving sub-component is transmission-connected to the screw rod. The first driving sub-component can drive the second driving sub-component to rotate, so as to drive the screw rod to rotate through the second driving sub-component, so that the mobile carrier rises or falls along the screw rod.

2. The wafer lifting assembly according to claim 1, characterized in that: The first driving subcomponent includes a driving motor, a driving wheel and a synchronous belt, the second driving subcomponent includes a driven wheel, the mobile carrier is formed with a threaded hole, one end of the screw rod is threadedly connected to the mobile carrier through the threaded hole, the driving wheel is sleeved on the output shaft of the driving motor, the driven wheel is sleeved on the other end of the screw rod, and the driving wheel and the driven wheel are connected through the synchronous belt transmission.

3. The wafer lifting assembly according to claim 2, characterized in that: The fixed seat includes a first bearing seat, a first fixing member and a shell, the shell is formed with a through hole, the first bearing seat is installed inside the shell, the screw rod passes through the first bearing seat and the through hole in sequence, and is threadedly connected to the movable carrier through the threaded hole, the first fixing member is installed on the screw rod, and the first bearing seat and the first fixing member are respectively arranged on both sides of the driven wheel.

4. The wafer lifting assembly according to claim 2, characterized in that: The wafer lifting assembly also includes a second fixing member and a second bearing seat, and the driving component also includes a shielding frame, which is connected to the cylinder body of the driving motor, and a mounting hole is formed on the shielding frame, and the second bearing seat is installed in the mounting hole. The output shaft of the driving motor passes through the second bearing seat, and the driving wheel is installed on the end of the output shaft of the driving motor extending out of the second bearing seat, and the driving wheel abuts against the second bearing seat, and the second fixing member is installed on the output shaft of the driving motor and abuts against the driving wheel.

5. The wafer lifting assembly according to claim 2, characterized in that: The wafer lifting assembly also includes a first slider, a base and a side plate. The fixed seat is installed on the base, and the side plate is installed on the base. A guide rail is formed on the side plate, and the guide rail is arranged along the length direction of the side plate. The first slider is slidably installed on the guide rail, and the first slider is connected to the movable carrier.

6. The wafer lifting assembly according to claim 5, characterized in that: There are multiple guide rails, and the multiple guide rails are arranged at intervals along the width direction of the side plate. The number of the first sliders is equal to the number of the guide rails. The multiple first sliders are arranged in a one-to-one correspondence with the multiple guide rails, and the multiple first sliders are all connected to the mobile carrier.

7. The wafer lifting assembly according to claim 5, characterized in that: The wafer lifting assembly also includes a second slider, which is slidably mounted on the guide rail, and the first slider is located on the top of the second slider.

8. The wafer lifting assembly according to any one of claims 5 to 7, characterized in that: The wafer lifting assembly also includes a control assembly and a limit sensor. The limit sensor is used to sense whether the first slider is in place. The limit sensor and the drive motor are both connected to the control assembly signal.

9. The wafer lifting assembly according to claim 8, characterized in that: There are at least two limit sensors, the side panel includes a first limit position and a second limit position, the two limit sensors are respectively installed at the first limit position and the second limit position, the two limit sensors are both connected to the control component signal, and the two limit sensors are respectively used to sense whether the first slider moves to the first limit position and the second limit position.

10. A wafer inspection device, characterized in that: The invention comprises a probe assembly and the wafer lifting assembly according to any one of claims 1 to 9, wherein the probe assembly is used to abut against the wafer.

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