Rapid heat dissipation device for high-frequency processor for computer software research and development

Abstract

The utility model discloses a high-frequency processor rapid heat dissipation device for computer software research and development, which comprises a heat dissipation fin, connecting frames are fixed on two sides of the heat dissipation fin, and a fixing hole is formed in the surface of one side of each connecting frame; according to the rapid heat dissipation device for the high-frequency processor for computer software research and development, through cooperative use of the connecting frame, the fixing holes, the fixing bolts, the mounting plate, the protection frame and the heat dissipation fan, the mounting plate is attached to the connecting frame in the mounting process, and the fixing bolts are screwed into the fixing holes, so that the heat dissipation fan can be rapidly mounted; according to the installation mode, hands do not need to touch the heat dissipation fins, the hands of a user are prevented from being scratched by the heat dissipation fins in the installation process, safety is guaranteed, the stability of the installation structure is high, long-time stable operation of the device can be guaranteed, two sets of heat dissipation fans can be installed at the same time by arranging the connecting frames on the two sides of the heat dissipation fins, and the heat dissipation efficiency is improved. Therefore, the installation number of the heat dissipation fans can be selected according to heat dissipation requirements.

Description

Technical Field

[0001] The utility model relates to the technical field related to computer software development, in particular to a high-frequency processor rapid heat dissipation device for computer software development. Background Art

[0002] Computer, commonly known as computer, is a modern electronic computing machine used for high-speed computing. It can perform numerical calculations, logical calculations, and has storage and memory functions. It is a modern intelligent electronic device that can run according to programs and automatically and quickly process massive amounts of data. It is composed of hardware systems and software systems. A computer without any software installed is called a bare metal computer. It can be divided into five categories: supercomputers, industrial control computers, network computers, personal computers, and embedded computers. More advanced computers include biological computers, photonic computers, quantum computers, etc. High-frequency processors are important components in computer software research and development. When using high-frequency processors, heat dissipation devices are required for heat dissipation.

[0003] However, the fan of the existing processor cooling device is fastened to the side of the cooling fin by a clip. The cooling fin is relatively sharp and the user may be easily scratched during the installation process, which is unsafe. Therefore, the present application provides a high-frequency processor fast cooling device for computer software development to meet the needs. Utility Model Content

[0004] The utility model aims to provide a high-frequency processor rapid heat dissipation device for computer software development to solve the problems raised in the above-mentioned background technology.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a high-frequency processor rapid heat dissipation device for computer software development, comprising heat dissipation fins, connecting frames are fixed on both sides of the heat dissipation fins, a fixing hole is opened on the surface of one side of the connecting frame, a fixing bolt passes through the inside of the fixing hole, a mounting plate is movably connected to one side of the fixing bolt, a protective frame is fixed to one side of the mounting plate, a heat dissipation fan is installed inside the protective frame, a heat pipe is installed inside the heat dissipation fin, a limiting block is fixed above the heat pipe, and a heat conductive sheet is installed below the heat pipe.

[0006] Preferably, the heat dissipation fins are arranged at equal intervals on one side of the connecting frame, and the surfaces of the heat dissipation fins are arranged in an open-hole manner.

[0007] Preferably, the connecting frame is symmetrically arranged with respect to the central axis of the heat dissipation fins, and the connecting frame is connected to the heat dissipation fins by welding.

[0008] Preferably, the mounting plate is threadedly connected to the connecting frame via fixing bolts, and the fixing bolts are arranged corresponding to the fixing holes.

[0009] Preferably, the heat conducting pipe is symmetrically arranged with respect to the central axis of the heat conducting plate, and the heat conducting pipe is used in conjunction with the heat conducting plate.

[0010] Preferably, fixing blocks are fixed on both sides of the heat conducting plate, a limiting bolt passes through the top of the fixing block, one side of the limiting bolt is movably connected to a base frame, and spring bolts are installed on both sides of the top of the base frame.

[0011] Preferably, the base frame is threadedly connected to the fixing block via limiting bolts, and the base frame is arranged in a "C"-shaped structure.

[0012] Compared with the prior art, the beneficial effects of the utility model are:

[0013] 1. A high-frequency processor rapid heat dissipation device for computer software development, through the coordinated use of a connecting frame, fixing holes, fixing bolts, a mounting plate, a protection frame and a cooling fan, during the installation process, the mounting plate is fitted with the connecting frame, and the fixing bolts are screwed into the fixing holes to quickly complete the installation of the cooling fan. This installation method does not require human hands to touch the cooling fins, preventing the user's hands from being scratched by the cooling fins during the installation process, and the safety is guaranteed. The installation structure is relatively stable, and the device can be ensured to run stably for a long time. By arranging connecting frames on both sides of the cooling fins, two sets of cooling fans can be installed at the same time, so that the number of cooling fans to be installed can be selected according to the cooling requirements;

[0014] 2. This is a rapid heat dissipation device for high-frequency processors used in computer software development. Through the setting of a fixing block, a limiting bolt, a base frame and a spring bolt, the setting of the limiting bolt makes it easy to disassemble and assemble the base frame. Users can choose the corresponding base frame according to different installation motherboard sizes, thereby improving the application range of the device. The device can be fixed above the high-frequency processor for heat dissipation through the spring bolt. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0016] Figure 2 This is a schematic diagram of the structure of the heat dissipation fin of the utility model;

[0017] Figure 3 This is a schematic diagram of the structure of the heat dissipation fan of the utility model;

[0018] Figure 4 It is a structural schematic diagram of the heat conducting sheet of the utility model;

[0019] Figure 5 It is a structural schematic diagram of the chassis of the utility model.

[0020] In the figure: 1. heat sink fin; 2. connecting frame; 3. fixing hole; 4. fixing bolt; 5. mounting plate; 6. protection frame; 7. cooling fan; 8. heat pipe; 9. limit block; 10. heat conducting sheet; 11. fixing block; 12. limit bolt; 13. base frame; 14. spring bolt. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0022] See also Figure 1-3 The utility model provides a technical solution: a high-frequency processor fast heat dissipation device for computer software development, including heat dissipation fins 1, the heat dissipation fins 1 are arranged at equal intervals on one side of a connecting frame 2, the surface of the heat dissipation fins 1 is an open-hole arrangement, which is convenient for installing a heat pipe 8 inside the heat dissipation fins 1 to dissipate heat from the heat pipe 8, both sides of the heat dissipation fins 1 are fixed with connecting frames 2, the connecting frames 2 are symmetrically arranged with respect to the central axis of the heat dissipation fins 1, the connecting frames 2 and the heat dissipation fins 1 are welded, and two groups of heat dissipation fans 7 can be installed at the same time by arranging connecting frames 2 on both sides of the heat dissipation fins 1, so that the number of heat dissipation fans 7 to be installed can be selected according to the heat dissipation requirements, and a fixed A fixing hole 3 is provided, and a fixing bolt 4 is passed through the fixing hole 3. A mounting plate 5 is movably connected to one side of the fixing bolt 4. The mounting plate 5 is threadedly connected to the connecting frame 2 through the fixing bolt 4. The fixing bolt 4 is arranged corresponding to the fixing hole 3. During the installation process, the mounting plate 5 is fitted with the connecting frame 2, and the fixing bolt 4 is screwed into the fixing hole 3 to quickly complete the installation of the cooling fan 7. This installation method does not require human hands to touch the cooling fins 1, so as to prevent the user's hands from being scratched by the cooling fins 1 during the installation process, and the safety is guaranteed. In addition, the stability of the installation structure is strong, which can ensure that the device can operate stably for a long time. A protective frame 6 is fixed to one side of the mounting plate 5, and a cooling fan 7 is installed inside the protective frame 6.

[0023] See also Figure 1 , Figure 4 and Figure 5, a heat pipe 8 is installed inside the heat sink 1, and the heat pipe 8 is symmetrically arranged with the central axis of the heat conducting sheet 10. The heat pipe 8 is used in conjunction with the heat conducting sheet 10. The heat generated by the high-frequency processor during operation is conducted to the heat pipe 8 through the heat conducting sheet 10, and then the heat is dissipated by the heat sink 1. A limiting block 9 is fixed above the heat pipe 8, and a heat conducting sheet 10 is installed below the heat pipe 8. Fixed blocks 11 are fixed on both sides of the heat conducting sheet 10, and a limiting bolt 12 passes through the top of the fixing block 11. A base frame 13 is movably connected to one side of the limiting bolt 12. Spring bolts 14 are installed on both sides of the top of the base frame 13. The device can be fixed above the high-frequency processor for heat dissipation through the spring bolts 14. The base frame 13 is threadedly connected to the fixing block 11 through the limiting bolts 12. The base frame 13 is a "C"-shaped structure. The setting of the limiting bolts 12 facilitates the disassembly and assembly of the base frame 13. Users can select the corresponding base frame 13 according to different sizes of installed motherboards, thereby improving the scope of application of the device.

[0024] Working principle: When using the high-frequency processor rapid heat dissipation device for computer software development, first turn on the external power supply, then fit the heat conductive sheet 10 on the top of the high-frequency processor, fix the base frame 13 with the spring bolt 14, and then fit the mounting plate 5 with the connecting frame 2, screw the fixing bolt 4 into the fixing hole 3 to quickly complete the installation of the cooling fan 7. This installation method does not require human hands to touch the cooling fins 1, preventing the user's hands from being scratched by the cooling fins 1 during the installation process. The heat generated during the operation of the high-frequency processor is conducted to the heat pipe 8 through the heat conductive sheet 10, and then the heat is dissipated by the cooling fins 1. Turn on the switch of the cooling fan 7 to speed up the heat dissipation efficiency of the cooling fins 1. Finally, the setting of the limit bolts 12 facilitates the disassembly and assembly of the base frame 13. The corresponding base frame 13 can be selected according to the size of the different installed motherboards. The external power supply of the device is cut off when the device is not in use. The model of the cooling fan 7 is FP-108EX-S1-S, and the use process of the high-frequency processor rapid heat dissipation device for computer software development is completed.

[0025] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A high-frequency processor rapid heat dissipation device for computer software development, comprising a heat dissipation fin (1), Features: A connecting frame (2) is fixed on both sides of the heat dissipation fin (1), a fixing hole (3) is opened on one side surface of the connecting frame (2), a fixing bolt (4) is passed through the fixing hole (3), a mounting plate (5) is movably connected to one side of the fixing bolt (4), a protective frame (6) is fixed to one side of the mounting plate (5), a heat dissipation fan (7) is installed inside the protective frame (6), a heat pipe (8) is installed inside the heat dissipation fin (1), a limiting block (9) is fixed above the heat pipe (8), and a heat conducting plate (10) is installed below the heat pipe (8).

2. A high-frequency processor rapid heat dissipation device for computer software development according to claim 1, It is characterized in that The heat dissipation fins (1) are arranged at equal intervals on one side of the connection frame (2), and the surfaces of the heat dissipation fins (1) are arranged in an open-hole manner.

3. A high-frequency processor rapid heat dissipation device for computer software development according to claim 1, It is characterized in that The connecting frame (2) is symmetrically arranged with respect to the central axis of the heat dissipation fin (1), and the connecting frame (2) and the heat dissipation fin (1) are connected by welding.

4. The high-frequency processor rapid heat dissipation device for computer software development according to claim 1, It is characterized in that The mounting plate (5) is threadedly connected to the connecting frame (2) via fixing bolts (4), and the fixing bolts (4) and the fixing holes (3) are arranged correspondingly.

5. A high-frequency processor rapid heat dissipation device for computer software development according to claim 1, It is characterized in that The heat conducting pipe (8) is symmetrically arranged with respect to the central axis of the heat conducting plate (10), and the heat conducting pipe (8) is used in conjunction with the heat conducting plate (10).

6. A high-frequency processor rapid heat dissipation device for computer software development according to claim 1, It is characterized in that Fixed blocks (11) are fixed on both sides of the heat conducting plate (10), a limiting bolt (12) passes through the top of the fixed block (11), one side of the limiting bolt (12) is movably connected to a base frame (13), and spring bolts (14) are installed on both sides of the top of the base frame (13).

7. A high-frequency processor rapid heat dissipation device for computer software development according to claim 6, It is characterized in that The base frame (13) is threadedly connected to the fixing block (11) via a limiting bolt (12), and the base frame (13) is arranged in a "C"-shaped structure.

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