Stress deformation module and shell thereof

Abstract

The utility model relates to the technical field of stress sensing modules, and discloses a stress deformation module and a shell thereof, and the stress deformation module comprises a main control board, a firmware unit and a communication unit, the firmware unit comprises a gas detector and a PT100 temperature sensor, and is used for acquiring data of external gas concentration and battery temperature and sending the data to the main control board through a CAN bus of the communication unit; and the main control board comprises an MCU and a measuring unit, and is used for receiving the data of the battery temperature and the external gas concentration sent by the firmware unit, communicating with a computer through a communication circuit in the communication unit to display related parameters, and giving an alarm when a preset threshold value is reached. According to the utility model, the gas can detect the smell at the initial stage of thermal runaway of the battery and give an alarm; in addition, the device can detect the deformation of the battery and give an alarm once the battery is deformed, so that the problem that the working personnel can be informed through the sound of the buzzer and the flickering of the alarm indicator lamp at the beginning of the thermal runaway of the battery, and the uncontrollable condition is avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of stress sensing modules, in particular to a stress deformation module and a shell thereof. Background Art

[0002] With the development of the domestic new energy industry, the demand for new energy storage and operation safety is growing. The safety detection and early warning of thermal runaway of new energy batteries has become a major demand. The research and development of thermal runaway monitoring modules is carried out using the principle of stress-strain sensing. The research on stress sensing modules can realize real-time monitoring of thermal runaway deformation of battery packs. Therefore, it is necessary to develop a stress-deformation module that meets actual use needs. Utility Model Content

[0003] In view of the above-mentioned technical deficiencies, the technical problem to be solved by the present invention is to provide a stress deformation module and its housing, aiming to solve the problem that the existing stress deformation module may have a certain delay in real-time monitoring, that is, when a thermal runaway event occurs, it is impossible to obtain deformation information in time and to carry out timely warning and processing.

[0004] In order to solve the above technical problems, the utility model adopts the following technical solutions: the utility model provides a stress deformation module, including: a main control board, a firmware unit and a communication unit; the firmware unit includes a gas detector and a PT100 temperature sensor, which are used to obtain data on external gas concentration and battery temperature and send them to the main control board via the CAN bus of the communication unit; the main control board includes an MCU and a measuring unit, which are used to receive the data on battery temperature and external gas concentration sent by the firmware unit and communicate with a computer via the communication circuit in the communication unit to display relevant parameters, and alarm when a preset threshold is reached.

[0005] Furthermore, the measuring unit includes a stress deformation voltage follower, a PT100 temperature measurement circuit and a gas sensor circuit;

[0006] The stress deformation voltage follower, the gas sensor circuit and the PT100 temperature measurement circuit respectively send the data of the deformation of the strain gauge, the external gas concentration and the battery temperature to the computer.

[0007] Furthermore, the stress deformation voltage follower includes at least one operational amplifier.

[0008] Furthermore, the electrical signal output by the stress sensor is connected to the non-inverting input terminal of the operational amplifier via the first resistor, and the electrical signal output by the stress sensor is also connected to the ground via the second resistor;

[0009] The negative power supply of the operational amplifier is grounded, the inverting input terminal and the output terminal of the operational amplifier are connected in parallel to the first end of the third resistor, the second end of the third resistor is connected to the first analog-to-digital converter YLXB2_ADC, the second end of the third resistor is also connected to the first end of the first capacitor, and the second end of the first capacitor is grounded; the positive power supply of the operational amplifier is connected to the first end of the second capacitor, and the second end of the second capacitor is grounded.

[0010] Further, the PT100 temperature measurement circuit includes a voltage reference chip, a power instrument amplifier and a plug-in terminal;

[0011] The input end of the voltage reference chip is connected to the second end of the third capacitor, and the first end of the third capacitor is grounded; the output end of the voltage reference chip is respectively connected to the first ends of the fourth resistor and the fifth resistor, the second end of the fourth resistor is connected to the first end of the plug-in terminal, the second end of the fifth resistor is connected to the first end of the sixth resistor, and the second end of the sixth resistor is connected to the second end of the plug-in terminal, the second end of the fourth resistor is also connected to the in-phase input end of the power instrument amplifier, the second end of the fifth resistor and the first end of the sixth resistor are also connected to the reverse input end of the power instrument amplifier, the negative input end of the reference end of the power instrument amplifier is connected to the first end of the seventh resistor, the second end of the seventh resistor is connected to the positive input end of the reference end of the power instrument amplifier, the reference voltage end of the power instrument amplifier is grounded, the output end of the power instrument amplifier is connected to the first end of the eighth resistor via the second analog-to-digital converter PT100_ADC, and the second end of the eighth resistor is grounded.

[0012] Furthermore, the sixth resistor adjusts the minimum temperature.

[0013] Furthermore, the communication circuit includes an RS232 conversion chip;

[0014] When the MCU sends data to an external device, the MCU sends the data to the transmit data terminal MCU_USART3_TXD of USART3. After the data is connected to the receiving input terminal DIN2 of the RS232 conversion chip through the ninth resistor, it is converted into an RS232 level signal RS232_DIN by the RS232 conversion chip and then connected to the external device through the resistor.

[0015] Furthermore, when the MCU receives data from an external device, the external device connects the data sent to the receiving output terminal ROUT2 of the RS232 conversion chip through a resistor, and the RS232 conversion chip converts the data into a TTL level signal RS232_DOUT, which is then connected to the receiving data terminal MCU_USART3_RXD of USART3 of the MCU through the tenth resistor.

[0016] A shell of a stress deformation module, comprising: a plurality of shell fixing holes for fixing, a gas sensor vent hole for detecting external air with a gas detector, and a warning light flashing if the external odor exceeds a threshold;

[0017] The housing comprises an upper housing and a lower housing, and a sealing ring is arranged between the upper housing and the lower housing;

[0018] The upper shell is provided with a clearance groove for giving way to the stress deformation module interface, and a baffle is also slidably arranged at the clearance groove;

[0019] The interiors of the upper shell and the lower shell are respectively connected with elastic members, and the two elastic members are both corrugated and mutually clamped.

[0020] The beneficial effects of the utility model are:

[0021] 1. The utility model is designed with a gas sensor vent hole, which can detect the smell of gas in the early stage of battery thermal runaway and alarm.

[0022] 2. Once the battery is deformed, it will be detected and an alarm will be issued. This solves the problem that as soon as the battery thermal runaway begins, the sound of the buzzer and the flashing of the alarm indicator light will notify the staff and they can extinguish the fire in time, thus avoiding uncontrollable situations.

[0023] 3. The shell of the stress deformation module adopts elastic pressure-resistant structural parts to buffer the pressure and improve the service life. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0025] Figure 1 A schematic diagram of a stress deformation voltage follower of a stress deformation module provided in Embodiment 1 of the present utility model.

[0026] Figure 2 This is the PT100 temperature measurement circuit diagram.

[0027] Figure 3 It is the communication circuit diagram.

[0028] Figure 4 This is a shell diagram of a stress deformation module provided in Example 2 of the utility model.

[0029] Figure 5This is a diagram of the outer shell of the stress deformation module of the third embodiment of the present utility model.

[0030] Figure 6 This is a schematic diagram of the internal structure of the stress deformation module shell of the third embodiment of the present utility model.

[0031] Figure 7 for Figure 6 A partial enlarged view of point A.

[0032] Figure 8 This is a schematic diagram of the baffle structure of the stress deformation module housing of the third embodiment of the present utility model.

[0033] Description of reference numerals:

[0034] 1-housing fixing hole, 2-gas sensor vent hole, 3-upper housing, 4-lower housing, 5-sealing ring, 6-gap groove, 7-baffle, 8-elastic part, 9-guide sleeve, 11-warning light, 12-power indicator light, 13-status light. DETAILED DESCRIPTION

[0035] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0036] Example 1

[0037] like Figures 1 to 3 As shown, the utility model provides a stress deformation module, including: a main control board, a firmware unit and a communication unit;

[0038] The firmware unit includes a gas detector and a PT100 temperature sensor, which are used to obtain data on external gas concentration and battery temperature and send them to the main control board via the CAN bus of the communication unit;

[0039] The main control board includes an MCU and a measuring unit, which are used to receive the data of battery temperature and external gas concentration sent by the firmware unit and communicate with the computer through the communication circuit in the communication unit to display relevant parameters, and alarm when the preset threshold is reached.

[0040] like Figure 1 As shown, the stress deformation voltage follower includes at least one operational amplifier; wherein, another operational amplifier may be added to have two stress deformation output terminals for comparison, so that the measurement result is more accurate.

[0041] The output electrical signal of the stress sensor is connected to the non-inverting input terminal of the operational amplifier via the first resistor, and the output electrical signal of the stress sensor is also connected to the ground via the second resistor;

[0042] The negative power supply of the operational amplifier is grounded, the inverting input terminal and the output terminal of the operational amplifier are connected in parallel to the first end of the third resistor, the second end of the third resistor is connected to the first analog-to-digital converter YLXB2_ADC, the second end of the third resistor is also connected to the first end of the first capacitor, and the second end of the first capacitor is grounded; the positive power supply of the operational amplifier is connected to the first end of the second capacitor, and the second end of the second capacitor is grounded.

[0043] The LM321 chip, the first resistor, the second resistor, the third resistor, the first capacitor and the second capacitor used in the operational amplifier are respectively Figure 1 U9, R39, R40, R24, C18 and C17.

[0044] like Figure 2 As shown, the measuring unit includes a PT100 temperature measuring circuit and a gas sensor circuit; the gas sensor circuit is used for the gas detector to detect external air; the gas detector mainly measures CO concentration with a measuring range of 0-1000ppm.

[0045] The PT100 temperature measurement circuit includes a voltage reference chip, a power instrument amplifier and plug-in terminals;

[0046] The input end of the voltage reference chip is connected to the second end of the third capacitor, and the first end of the third capacitor is grounded; the output end of the voltage reference chip is respectively connected to the first ends of the fourth resistor and the fifth resistor, and the second end of the fourth resistor is connected to the first end of the plug-in terminal.

[0047] The fifth resistor, i.e., the second end in the figure, is connected to the first end of the sixth resistor, the second end of the sixth resistor is connected to the second end of the plug-in terminal, the second end of the fourth resistor is also connected to the in-phase input end of the power instrumentation amplifier, the second end of the fifth resistor and the first end of the sixth resistor are also connected to the reverse input end of the power instrumentation amplifier, the negative input end of the reference end of the power instrumentation amplifier is connected to the first end of the seventh resistor, the second end of the seventh resistor is connected to the positive input end of the reference end of the power instrumentation amplifier, the reference voltage end of the power instrumentation amplifier is grounded, the output end of the power instrumentation amplifier is connected to the first end of the eighth resistor via the second analog-to-digital converter PT100_ADC, and the second end of the eighth resistor is grounded.

[0048] Preferably, the sixth resistor adjusts the lowest temperature. Figure 2 82R means the lowest temperature is -40°, and the ninth resistor, the tenth resistor and the eleventh resistor are not welded at the same time.

[0049] Among them, the voltage reference chip, the power instrument amplifier, the plug-in terminal, the third capacitor, the fourth resistor, the fifth resistor, the sixth resistor, the seventh resistor, the eighth resistor, the ninth resistor, the tenth resistor and the eleventh resistor are respectively Figure 2 U23, U11, P1, C30, R71, R29, R32, R27, R158, R33, R34 and R31; the voltage reference chip, power supply instrument amplifier and plug-in terminal blocks are REF3030AIDBZR, AD623ARZ-R7 and WJ15EDGRC-3.81-3P respectively.

[0050] like Figure 3 As shown, the communication circuit uses RS232 conversion chip;

[0051] When the MCU sends data to an external device, the MCU sends the data to the transmit data terminal MCU_USART3_TXD of USART3. After the data is connected to the receiving input terminal DIN2 of the RS232 conversion chip through the ninth resistor, it is converted into an RS232 level signal RS232_DIN by the RS232 conversion chip and then connected to the external device through a resistor.

[0052] When the MCU receives data from an external device, the external device connects the data sent by the data to the receiving output terminal ROUT2 of the RS232 conversion chip through a resistor, and the RS232 conversion chip converts the data into a TTL level signal RS232_DOUT, which is then connected to the receiving data terminal MCU_USART3_RXD of USART3 of the MCU through the tenth resistor.

[0053] Example 2

[0054] like Figure 4 As shown, this embodiment provides a shell of a stress deformation module based on Embodiment 1, including: four shell fixing holes 1 for fixing, a gas sensor air hole 2, for the gas detector to detect the external air, if the external odor exceeds the threshold, the alarm light 11 flashes; in addition, a power indicator light 12 and a status light 13 can be set to display the status of the monitoring battery in real time.

[0055] Example 3

[0056] like Figure 5 As shown, this embodiment provides a shell of a stress deformation module based on Embodiment 2, and the shell includes an upper shell 3 and a lower shell 4. To improve the sealing effect, a sealing ring 5 is provided between the upper shell 3 and the lower shell 4;

[0057] In addition, the upper shell 3 has a groove 6 for making way for the stress deformation module interface (stress deformation sheet interface, RS232 interface, PT100 thermistor interface, power interface, CAN interface, etc.). In order to prevent dust, a baffle 7 is slidably provided at the groove 6. Figure 6 As shown, the baffle 7 can slide up and down, so when the upper shell 3 receives an impact force, the upper shell 3 will not directly press on the connector inserted in the stress deformation interface, thereby reducing the adverse effects of collision, extrusion, etc. on signal data transmission errors and power supply stability;

[0058] In addition, in order to further play the role of shock and pressure resistance, an elastic pressure-resistant structural member is arranged between the upper shell 3 and the lower shell 4, which includes two elastic members 8, the elastic members 8 are corrugated, and the two elastic members 8 are staggered and clamped with each other. In addition, the upper shell 3 and the lower shell 4 are also fixedly connected with a guide sleeve 9 arranged outside the elastic member 8. When subjected to pressure, the two elastic members 8 will be squeezed, and even the staggered area will be larger, to buffer the pressure. Due to its corrugated staggered structure, it will not return to the initial state. Compared with the solution using a spring in the prior art, when subjected to great pressure, it can prevent the upper shell 3 from bouncing open under the action of the spring restoring force after the pressure disappears. When subjected to less pressure, it can prevent the upper shell 3 from separating from the lower shell 4, the sealing ring 5 from loosening, and losing the sealing effect.

[0059] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Although the present invention is described in detail with reference to the above embodiments, those skilled in the art can still modify the technical solutions described in the above embodiments or replace some of the technical features therein by equivalents. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A stress deformation module, characterized in that: include: A main control board, a firmware unit and a communication unit; the firmware unit includes a gas detector and a PT100 temperature sensor, which are used to obtain data on external gas concentration and battery temperature and send them to the main control board via the CAN bus of the communication unit; the main control board includes an MCU and a measuring unit, which are used to receive the data on battery temperature and external gas concentration sent by the firmware unit and communicate with a computer via the communication circuit in the communication unit to display relevant parameters, and alarm when a preset threshold is reached.

2. A stress deformation module according to claim 1, characterized in that: The measuring unit includes a stress deformation voltage follower, a PT100 temperature measurement circuit and a gas sensor circuit; The stress deformation voltage follower, the gas sensor circuit and the PT100 temperature measurement circuit respectively send the data of the deformation of the strain gauge, the external gas concentration and the battery temperature to the computer.

3. A stress deformation module according to claim 2, characterized in that: The stress-deformation voltage follower includes at least one operational amplifier.

4. A stress deformation module according to claim 1, characterized in that: The output electrical signal of the stress sensor is connected to the non-inverting input terminal of the operational amplifier via the first resistor, and the output electrical signal of the stress sensor is also connected to the ground via the second resistor; The negative power supply of the operational amplifier is grounded, the inverting input terminal and the output terminal of the operational amplifier are connected in parallel to the first end of the third resistor, the second end of the third resistor is connected to the first analog-to-digital converter YLXB2_ADC, the second end of the third resistor is also connected to the first end of the first capacitor, and the second end of the first capacitor is grounded; the positive power supply of the operational amplifier is connected to the first end of the second capacitor, and the second end of the second capacitor is grounded.

5. A stress deformation module according to claim 2, characterized in that: The PT100 temperature measurement circuit includes a voltage reference chip, a power instrument amplifier and a plug-in terminal; The input end of the voltage reference chip is connected to the second end of the third capacitor, and the first end of the third capacitor is grounded; the output end of the voltage reference chip is respectively connected to the first ends of the fourth resistor and the fifth resistor, the second end of the fourth resistor is connected to the first end of the plug-in terminal, the second end of the fifth resistor is connected to the first end of the sixth resistor, and the second end of the sixth resistor is connected to the second end of the plug-in terminal, the second end of the fourth resistor is also connected to the in-phase input end of the power instrument amplifier, the second end of the fifth resistor and the first end of the sixth resistor are also connected to the reverse input end of the power instrument amplifier, the negative input end of the reference end of the power instrument amplifier is connected to the first end of the seventh resistor, the second end of the seventh resistor is connected to the positive input end of the reference end of the power instrument amplifier, the reference voltage end of the power instrument amplifier is grounded, the output end of the power instrument amplifier is connected to the first end of the eighth resistor via the second analog-to-digital converter PT100_ADC, and the second end of the eighth resistor is grounded.

6. A stress deformation module according to claim 5, characterized in that: The sixth resistor adjusts the lowest temperature.

7. A stress deformation module according to claim 1, characterized in that: The communication circuit includes an RS232 conversion chip; When the MCU sends data to an external device, the MCU sends the data to the transmit data terminal MCU_USART3_TXD of USART3. After the data is connected to the receiving input terminal DIN2 of the RS232 conversion chip through the ninth resistor, it is converted into an RS232 level signal RS232_DIN by the RS232 conversion chip and then connected to the external device through a resistor.

8. A stress deformation module according to claim 7, characterized in that: When the MCU receives data from an external device, the external device connects the data sent by the data to the receiving output terminal ROUT2 of the RS232 conversion chip through a resistor, and the RS232 conversion chip converts the data into a TTL level signal RS232_DOUT, which is then connected to the receiving data terminal MCU_USART3_RXD of USART3 of the MCU through the tenth resistor.

9. A housing of a stress deformation module according to any one of claims 1 to 8, characterized in that: include: A plurality of fixing holes of the housing are used for fixing, and a gas sensor vent hole is used to detect the external air with a gas detector. If the external concentration exceeds a threshold value, an alarm light flashes.

10. A stress deformation module housing as claimed in claim 9, characterized in that: The housing comprises an upper housing and a lower housing, and a sealing ring is arranged between the upper housing and the lower housing; The upper shell is provided with a clearance groove for giving way to the stress deformation module interface, and a baffle is also slidably arranged at the clearance groove; The interiors of the upper shell and the lower shell are respectively connected with elastic members, and the two elastic members are both corrugated and mutually clamped.

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