Stirring device for wafer electroplating equipment

Abstract

The utility model discloses a stirring device for wafer electroplating equipment. The stirring device comprises a wafer electroplating bath, a lifting translation device, a stirring mechanism and a dismounting mechanism, the lifting translation device comprises a bottom plate fixedly connected to the wafer electroplating bath, a connecting seat is movably connected to the bottom plate, and a screw rod is rotationally connected to the top of the connecting seat; the stirring mechanism comprises a support which is arranged on the lead screw in a threaded and sleeving mode, a first motor is fixedly installed at the top of the support, an output shaft of the first motor is fixedly connected with a driving wheel, and the outer side of the driving wheel is rotationally connected with a driven wheel through a belt; according to the stirring device for the wafer electroplating equipment, the dismounting and mounting mechanism is arranged on the stirring mechanism, so that the main shaft can be moved out of the slot of the PE plate stirring blade after the nut is unscrewed from the threaded rod, and therefore, the PE plate stirring blade is convenient to dismount and mount; meanwhile, due to the characteristics of corrosion resistance and low manufacturing cost of the PE plate stirring blades, the replacement cost of the stirring blades can be effectively reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of electroplating, in particular to a stirring device for wafer electroplating equipment. Background Art

[0002] As we all know, wafer electroplating is to ensure the consistency of the thickness of the electroplated surface to prevent large deviations in the thickness of the electroplated layer, thereby avoiding problems such as circuit etching short circuits and open circuits.

[0003] The stability of the plating solution in the plating tank is an important factor in ensuring uniform thickness of the wafer plating surface. The prior art usually uses a stirring device to evenly stir the plating solution. However, since the plating solution itself is corrosive, the stirring blades need to be replaced after a period of use. However, the prior art does not have a functional setting for convenient disassembly and assembly of the stirring blades, and also lacks measures to reduce the cost of replacing the stirring blades. For this reason, we propose a stirring device for wafer electroplating equipment. Utility Model Content

[0004] The purpose of the utility model is to provide a stirring device for wafer electroplating equipment to solve the problems raised in the above background technology.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a stirring device for wafer electroplating equipment, comprising a wafer electroplating tank, a lifting and translation device, a stirring mechanism and a disassembly and assembly mechanism;

[0006] The lifting and translation device comprises a bottom plate fixedly connected to the wafer electroplating tank, a connecting seat movably connected to the bottom plate, and a lead screw rotatably connected to the top of the connecting seat;

[0007] The stirring mechanism comprises a bracket threadedly mounted on a screw rod, a first motor is fixedly mounted on the top of the bracket, a driving wheel is fixedly connected to the output shaft of the first motor, a driven wheel is rotatably connected to the outer side of the driving wheel through a belt, the top of the driven wheel is rotatably connected to the bracket through a rotating shaft, the bottoms of the driving wheel and the driven wheel are fixedly connected to a main shaft, and a PE plate stirring blade is arranged on the main shaft;

[0008] The disassembly and assembly mechanism includes a slot opened inside the PE plate stirring blade and a block fixedly connected to the outer wall of the main shaft, the block is provided with a through hole inside, a threaded rod passes through the through hole, the bottom end of the threaded rod is fixedly connected to the PE plate stirring blade through a connecting block, and a nut for tightening the block is threadedly sleeved on the threaded rod.

[0009] By adopting the above technical scheme, the lifting mechanism translation device can drive the stirring mechanism to move by moving the connecting seat and rotating the screw rod; in addition, after the first motor is started, it can drive the driving wheel to rotate, so that the driven wheel can rotate under the action of the driving wheel through the belt, and then the main shaft can drive the PE plate stirring blades to evenly stir the electroplating liquid in the wafer electroplating tank; when the PE plate stirring blades need to be replaced, the PE plate stirring blades can lose the fixing force by unscrewing the nuts from the threaded rods, so that the main shaft can be pulled out of the slots, thereby facilitating the replacement of the PE plate stirring blades, and because the PE stirring blades have good corrosion resistance and low manufacturing cost, the replacement cost of the stirring blades can be effectively reduced.

[0010] Preferably, the lifting and translation device further comprises a cylinder fixedly mounted on the top of the base plate, and a piston rod of the cylinder is fixedly connected to the connecting seat.

[0011] By adopting the above technical solution, the cylinder can drive the connecting seat to move on the bottom plate after being started.

[0012] Preferably, a slide groove is provided on the top of the bottom plate, and the inner side wall of the slide groove is slidably connected to the connecting seat.

[0013] By adopting the above technical solution, the bottom plate can be kept stable when moving.

[0014] Preferably, a rod body is fixedly connected to the top of the connecting seat, and the inside of the bracket is slidably connected to the rod body.

[0015] By adopting the above technical solution, the bracket can be raised and lowered on the rod body after the screw rod is rotated clockwise or counterclockwise.

[0016] Preferably, the top end of the rod body is fixedly connected with a top plate, and the bottom of the top plate is rotatably connected to the screw rod via a bearing.

[0017] By adopting the above technical solution, the rotation load of the screw rod can be reduced and the movement of the bracket can be limited.

[0018] Preferably, a second motor is fixedly mounted on the top of the connecting seat, an output shaft of the second motor is fixedly connected to a driving bevel gear, an outer side of the driving bevel gear is meshingly connected to a driven bevel gear, and the driven bevel gear is fixedly sleeved on the screw rod.

[0019] By adopting the above technical solution, after the second motor is started, the driven bevel gear can be driven to rotate through the active bevel gear, so that the screw rod can rotate clockwise or counterclockwise under the action of the second motor.

[0020] Preferably, the second motor is a forward and reverse motor.

[0021] By adopting the above technical solution, the screw rod can be easily rotated clockwise and counterclockwise, thereby facilitating the lifting and lowering of the bracket.

[0022] In summary, the present application includes at least one of the following beneficial technical effects:

[0023] The stirring device for wafer electroplating equipment is provided with a disassembly and assembly mechanism on the stirring mechanism, so that after the nut is unscrewed from the threaded rod, the main shaft can be removed from the slot of the PE plate stirring blade, thereby facilitating the disassembly and installation of the PE plate stirring blade. At the same time, the corrosion resistance and low manufacturing cost of the PE plate stirring blade can effectively reduce the replacement cost of the stirring blade. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a structural schematic diagram of a stirring device for wafer electroplating equipment of the utility model;

[0025] Figure 2 It is an enlarged schematic diagram of area A of the structural schematic diagram of the stirring device for wafer electroplating equipment of the utility model;

[0026] Figure 3 It is a structural schematic diagram of the lifting and translation device in the stirring device for wafer electroplating equipment of the utility model;

[0027] Figure 4 It is a structural schematic diagram of the slot and PE plate stirring blades in the stirring device for wafer electroplating equipment of the utility model.

[0028] In the figure: 1. wafer plating tank; 2. lifting and translation device; 20. bottom plate; 21. connecting seat; 22. second motor; 23. cylinder; 24. driving bevel gear; 25. driven bevel gear; 26. rod body; 27. screw rod; 28. top plate; 29. ​​slide; 3. stirring mechanism; 30. bracket; 31. first motor; 32. driving wheel; 33. belt; 34. driven wheel; 35. rotating shaft; 36. main shaft; 37. PE plate stirring blade; 4. disassembly and assembly mechanism; 40. connecting block; 41. block body; 42. through hole; 43. threaded rod; 44. nut; 45. slot. DETAILED DESCRIPTION

[0029] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0030] See also Figure 1-Figure 4, the utility model provides a technical solution: a stirring device for wafer electroplating equipment, comprising a wafer electroplating tank 1, a lifting and translation device 2, a stirring mechanism 3 and a disassembly and assembly mechanism 4;

[0031] First, in order to enable the lifting and translation device of the lifting mechanism to drive the stirring mechanism 3 to move by moving the connecting seat 21 and rotating the screw rod 27; the lifting and translation device 2 includes a bottom plate 20 fixedly connected to the wafer electroplating tank 1, a connecting seat 21 is movably connected to the bottom plate 20, and the top of the connecting seat 21 is rotatably connected to the screw rod 27; in order to enable the connecting seat 21 to move on the bottom plate 20 after the cylinder 23 is started, the lifting and translation device 2 also includes a cylinder 23 fixedly installed on the top of the bottom plate 20, and the piston rod of the cylinder 23 is fixedly connected to the connecting seat 21; in order to enable the bottom plate 20 to remain stable when moving, a slide groove 29 is opened on the top of the bottom plate 20, and the inner side wall of the slide groove 29 is slidably connected to the connecting seat 21; in order for the screw rod 27 to rotate clockwise or counterclockwise so that the bracket 30 can be lifted and moved on the rod body 26, the top of the connecting seat 21 is fixedly connected to the rod body 26, and the bracket The interior of 30 is slidably connected with the rod body 26; in order to reduce the rotation load of the screw rod 27 and to limit the movement of the bracket 30, the top of the rod body 26 is fixedly connected with a top plate 28, and the bottom of the top plate 28 is rotatably connected with the screw rod 27 through a bearing; in order to drive the driven bevel gear 25 to rotate through the active bevel gear 24 after the second motor 22 is started, so that the screw rod 27 can rotate clockwise or counterclockwise under the action of the second motor 22, the second motor 22 is fixedly installed on the top of the connecting seat 21, and the output shaft of the second motor 22 is fixedly connected with the active bevel gear 24, and the outer side of the active bevel gear 24 is meshedly connected with the driven bevel gear 25, and the driven bevel gear 25 is fixedly sleeved on the screw rod 27; in order to facilitate the screw rod 27 to rotate clockwise and counterclockwise, thereby facilitating the lifting and lowering of the bracket 30, the second motor 22 is a forward and reverse motor;

[0032] Secondly, in order to enable the first motor 31 to drive the driving wheel 32 to rotate after starting, so that the driven wheel 34 can rotate under the action of the driving wheel 32 through the belt 33, and then the main shaft 36 can drive the PE plate stirring blade 37 to evenly stir the electroplating liquid in the wafer electroplating tank 1, the stirring mechanism 3 includes a bracket 30 threadedly mounted on the screw rod 27, the top of the bracket 30 is fixedly installed with the first motor 31, the output shaft of the first motor 31 is fixedly connected to the driving wheel 32, the outer side of the driving wheel 32 is rotatably connected to the driven wheel 34 through the belt 33, the top of the driven wheel 34 is rotatably connected to the bracket 30 through the rotating shaft 35, the bottom of the driving wheel 32 and the driven wheel 34 are fixedly connected to the main shaft 36, and the main shaft 36 is provided with PE plate stirring blades 37;

[0033] Again, in order to replace the PE plate stirring blade 37 when it is necessary, the PE plate stirring blade 37 can lose its fixing force by unscrewing the nut 44 from the threaded rod 43, so that the main shaft 36 can be pulled out from the slot 45, which is convenient for replacing the PE plate stirring blade 37. Moreover, since the PE stirring blade has good corrosion resistance and low manufacturing cost, the replacement cost of the stirring blade can be effectively reduced. The disassembly and assembly mechanism 4 includes a slot 45 opened in the interior of the PE plate stirring blade 37 and a block 41 fixedly connected to the outer wall of the main shaft 36, a through hole 42 is opened in the interior of the block 41, a threaded rod 43 passes through the interior of the through hole 42, and the bottom end of the threaded rod 43 is fixedly connected to the PE plate stirring blade 37 through the connecting block 40, and a nut 44 for tightening the block 41 is threadedly sleeved on the threaded rod 43.

[0034] According to the above technical scheme, the working steps of this scheme are summarized and sorted out: when in use, the cylinder 23 drives the connecting seat 21 to move in the direction close to the wafer electroplating tank 1, so that the stirring mechanism 3 is located directly above the wafer electroplating tank 1; the second motor 22 drives the screw 27 to rotate clockwise through the active bevel gear 24 and the driven bevel gear 25, so that the bracket 30 moves downward on the rod body 26, so that the PE plate stirring blade 37 is inserted into the electroplating liquid; after the first motor 31 is started, it can drive the driving wheel 32 to rotate, so that the driven wheel 34 can rotate under the action of the driving wheel 32 through the belt 33, and then the main shaft 36 can drive the PE plate stirring blade 37 to electroplating in the wafer electroplating tank 1. The liquid is stirred evenly; when the PE plate stirring blade 37 needs to be replaced, the PE plate stirring blade 37 can lose its fixing force by unscrewing the nut 44 from the threaded rod 43, so that the main shaft 36 can be pulled out from the slot 45, which makes it easier to replace the PE plate stirring blade 37; when installing the PE plate stirring blade 37, the main shaft 36 can be inserted into the slot 45 first, and when the bottom end of the main shaft 36 presses against the inner wall of the slot 45, the threaded rod 43 can penetrate the through hole 42 of the block 41. At this time, tightening the nut 44 on the threaded rod 43 can fix both sides of the PE plate stirring blade 37, thereby completing the installation of the PE plate stirring blade 37.

[0035] Parts not involved in the present invention are the same as the prior art or can be implemented by the prior art. Although the embodiments of the present invention have been shown and described, it is understood by those skilled in the art that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the attached claims and their equivalents.

Claims

1. A stirring device for wafer electroplating equipment, characterized in that: It comprises a wafer electroplating tank (1), a lifting and translation device (2), a stirring mechanism (3) and a disassembly and assembly mechanism (4); The lifting and translation device (2) comprises a bottom plate (20) fixedly connected to the wafer electroplating tank (1), a connecting seat (21) movably connected to the bottom plate (20), and a screw rod (27) rotatably connected to the top of the connecting seat (21); The stirring mechanism (3) comprises a bracket (30) threadedly mounted on a screw rod (27); a first motor (31) is fixedly mounted on the top of the bracket (30); an output shaft of the first motor (31) is fixedly connected to a driving wheel (32); an outer side of the driving wheel (32) is rotatably connected to a driven wheel (34) via a belt (33); a top of the driven wheel (34) is rotatably connected to the bracket (30) via a rotating shaft (35); a main shaft (36) is fixedly connected to the bottom of each of the driving wheel (32) and the driven wheel (34); and a PE plate stirring blade (37) is provided on each of the main shafts (36); The disassembly and assembly mechanism (4) comprises a slot (45) provided inside the PE plate stirring blade (37) and a block (41) fixedly connected to the outer wall of the main shaft (36); a through hole (42) is provided inside the block (41); a threaded rod (43) passes through the through hole (42); the bottom end of the threaded rod (43) is fixedly connected to the PE plate stirring blade (37) through a connecting block (40); and a nut (44) for tightening the block (41) is threadedly sleeved on the threaded rod (43).

2. The stirring device for wafer electroplating equipment according to claim 1, characterized in that: The lifting and translation device (2) further comprises a cylinder (23) fixedly mounted on the top of the base plate (20), and a piston rod of the cylinder (23) is fixedly connected to the connecting seat (21).

3. The stirring device for wafer electroplating equipment according to claim 1, characterized in that: A sliding groove (29) is provided on the top of the bottom plate (20), and the inner side wall of the sliding groove (29) is slidably connected to the connecting seat (21).

4. The stirring device for wafer electroplating equipment according to claim 1, characterized in that: The top of the connecting seat (21) is fixedly connected to a rod body (26), and the interior of the bracket (30) is slidably connected to the rod body (26).

5. The stirring device for wafer electroplating equipment according to claim 4, characterized in that: The top end of the rod body (26) is fixedly connected to a top plate (28), and the bottom of the top plate (28) is rotatably connected to a screw rod (27) via a bearing.

6. The stirring device for wafer electroplating equipment according to claim 4, characterized in that: A second motor (22) is fixedly mounted on the top of the connecting seat (21); an output shaft of the second motor (22) is fixedly connected to a driving bevel gear (24); an outer side of the driving bevel gear (24) is meshingly connected to a driven bevel gear (25); and the driven bevel gear (25) is fixedly sleeved on a screw rod (27).

7. The stirring device for wafer electroplating equipment according to claim 6, characterized in that: The second motor (22) is a forward and reverse motor.

Images