Fixing device with adjusting function
The fixing device with an adjustment function addresses excessive suction and scratching issues by using a base, fixing component, and electrostatic chuck to stabilize and center semiconductor wafers, enhancing fixation stability and reducing damage.
Patent Information
- Application Number
- CN202420794065.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-17
- Publication Date
- 2024-12-24
- Estimated Expiration
- 2034-04-17
AI Technical Summary
Existing wafer fixing devices for semiconductor testing often cause excessive suction leading to wafer breakage and surface scratching, increasing scrap rates and potential damage.
A fixing device with an adjustment function, featuring a base, fixing component, driving component, and electrostatic chuck, which includes sliding bars and gears to stabilize and center the wafer during fixation.
The device provides stable fixation and centering of semiconductor wafers, reducing breakage and surface damage by allowing precise alignment and controlled suction.
Smart Images

Figure CN222222346U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of semiconductor wafer testing, in particular to a fixing device with an adjustment function. Background Art
[0002] Semiconductors are used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, high-power power conversion and other fields. Wafers are silicon chips used to make silicon semiconductor circuits. When testing wafers, they need to be fixed by suction cups. When the suction cups adsorb the wafers, it is very easy to have excessive suction due to improper operation by the operator, which will cause the wafers to break and greatly increase the scrap rate of the wafers. Therefore, it is necessary to design a wafer fixing device for semiconductor testing to solve the above problems.
[0003] After searching, the Chinese patent with publication number: CN217881449U discloses a wafer fixing device for semiconductor testing, including a disc, the outer surface of the disc is evenly installed with a clamping mechanism in an annular shape, the clamping mechanism includes a fixed block and a connecting rod, and the inner surface of the fixed block is fixedly connected with a connecting rod. The utility model is provided with a movable screw and a sliding disc, and the movable screw sleeve can be moved on its surface by rotating the movable screw sleeve. When the movable screw sleeve is moving, the sliding disc can be moved inside the fixed sleeve, so that the adsorption disc generates suction, so that the wafer can be adsorbed by the suction of the adsorption disc, and the adsorption disc can generate a smaller suction, so that the wafer can be prevented from being subjected to a larger suction. The device is provided with a torsion spring and a rotating clamping rod, and through the elastic force of the torsion spring itself, a plurality of groups of rotating clamping rods are in conflict with the surface of the wafer, thereby preventing the wafer from shaking and deviating during the detection process, resulting in inaccurate detection.
[0004] However, there is a problem in this device. The fixed part of the device is easy to scratch the surface of the wafer during the fixing process. In serious cases, the wafer may be damaged. Utility Model Content
[0005] 1. Technical issues to be resolved
[0006] In view of the deficiencies in the prior art, the utility model provides a fixing device with an adjustment function.
[0007] (II) Technical solution
[0008] To achieve the above purpose, the utility model provides the following technical solution: a fixing device with an adjustment function, comprising a base, a fixing component is arranged on the top of the base, a driving component is arranged on the top of the base, a connecting shaft is fixedly connected to the top of the base, and a fixing platform is rotatably connected to the top of the connecting shaft. By setting the base, the fixing of the device can be made more stable.
[0009] Preferably, a frame is fixedly mounted on the outer wall of the fixing platform, a sliding groove is provided on the fixing platform, and a sliding bar is slidably connected to the inner wall of the sliding groove.
[0010] Preferably, the bottom of the sliding bar is fixedly connected with a sliding column, the number of the sliding columns is six, the number of the sliding bars is six, and the end of the sliding bar away from the connecting shaft is fixedly connected with a fixing block. By providing the fixing block, the semiconductor wafer can be fixed.
[0011] Preferably, a hole is provided on the base, a motor box is provided in the hole, a motor is fixedly installed in the motor box, an output end of the motor is fixedly connected to a rotating shaft via a coupling, and an end of the rotating shaft away from the motor is fixedly connected to a driving gear. By providing a driving gear, the motor can allow the driving gear to drive the driven gear to operate.
[0012] Preferably, the driving gear is meshed with a driven gear, the middle of the driven gear is rotatably connected to the connecting shaft, an arc groove is provided on the driven gear, and the inner wall of the arc groove is slidably connected to the sliding column. By providing the arc groove, the sliding column can drive the sliding bar to move.
[0013] Preferably, a shell is provided on the top of the fixing platform, and an electrostatic chuck is fixedly installed on the top of the shell. By providing the electrostatic chuck, the device can absorb the semiconductor wafer.
[0014] (III) Beneficial effects
[0015] Compared with the prior art, the utility model provides a fixing device with an adjustment function, which has the following beneficial effects:
[0016] 1. This fixing device with an adjustment function can fix the semiconductor wafer that needs to be tested by setting a fixing component, and can firmly fix the semiconductor wafer by setting a fixing component. By setting a frame, a preliminary limit can be made on the semiconductor wafer. By setting a fixing table, a fixed carrier can be provided for the semiconductor wafer. By opening six sliding grooves on the fixing table, the sliding bar can be limited so that the sliding bar can only move along a straight line trajectory. By setting a sliding bar, the sliding bar can drive the fixed block to fix the semiconductor wafer when it moves. By setting a fixed block, the semiconductor wafer can be fixed.
[0017] 2. This fixing device with an adjustment function can provide a power source for the operation of the fixing component by setting a driving component, can provide a motor by setting a motor, can provide a power source for the operation of the driving component by setting a driving gear, can drive the operation of the driving component through the driving gear by setting a driven gear, and can drive the driven gear to rotate while the driven gear drives the sliding column and then drives the movement of the sliding bar and the fixed block by setting a driven gear and providing six arc grooves and six sliding columns on the driven gear. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:
[0019] Figure 1 This is a main stereoscopic view of the utility model;
[0020] Figure 2 This is the internal structure diagram of the utility model;
[0021] Figure 3 This is the bottom structure diagram of the utility model.
[0022] In the figure: 1. base; 2. fixing assembly; 20. arc groove; 21. sliding column; 22. sliding bar; 23. slide groove; 24. fixing table; 25. fixing block; 26. frame; 3. driving assembly; 30. motor box; 31. driving gear; 32. driven gear; 33. connecting shaft; 4. electrostatic suction cup. DETAILED DESCRIPTION
[0023] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments.
[0024] Example 1
[0025] like Figure 1-3 As shown, the utility model provides a fixing device with an adjustment function, including a base 1, a fixing assembly 2 is arranged on the top of the base 1, a driving assembly 3 is arranged on the top of the base 1, a connecting shaft 33 is fixedly connected to the top of the base 1, and a fixing platform 24 is rotatably connected to the top of the connecting shaft 33. By setting the base 1, the fixing of the device can be made more stable.
[0026] A frame 26 is fixedly mounted on the outer wall of the fixing platform 24 . A sliding groove 23 is provided on the fixing platform 24 . A sliding bar 22 is slidably connected to the inner wall of the sliding groove 23 .
[0027] The bottom of the sliding bar 22 is fixedly connected with a sliding column 21, the number of the sliding column 21 is six, the number of the sliding bar 22 is six, and the end of the sliding bar 22 away from the connecting shaft 33 is fixedly connected with a fixing block 25. By setting the fixing block 25, the semiconductor wafer can be fixed.
[0028] In this embodiment, by setting up the fixing component 2, the device can be able to fix the semiconductor wafer that needs to be inspected, by setting up the fixing component 2, the semiconductor wafer can be firmly fixed, by setting up the frame 26, the semiconductor wafer can be preliminarily limited, by setting up the fixing table 24, a fixed carrier can be provided for the semiconductor wafer, and by providing six sliding grooves 23 on the fixing table 24, the sliding bar 22 can be limited so that the sliding bar 22 can only move along a straight line trajectory, by setting up the sliding bar 22, the sliding bar 22 can drive the fixed block 25 to fix the semiconductor wafer when it moves, and by setting up the fixed block 25, the semiconductor wafer can be fixed.
[0029] Example 2
[0030] like Figure 1-3 As shown, based on Example 1, the utility model provides a technical solution: preferably, a hole is opened on the base 1, a motor box 30 is arranged in the hole, a motor is fixedly installed in the motor box 30, the output end of the motor is fixedly connected to a rotating shaft through a coupling, and the end of the rotating shaft away from the motor is fixedly connected to a driving gear 31. By setting the driving gear 31, the motor can make the driving gear 31 drive the driven gear 32 to operate.
[0031] The driving gear 31 is meshedly connected with a driven gear 32, the middle of the driven gear 32 is rotatably connected with the connecting shaft 33, and an arc groove 20 is provided on the driven gear 32, and the inner wall of the arc groove 20 is slidably connected with the sliding column 21. By providing the arc groove 20, the sliding column 21 can drive the sliding bar 22 to move.
[0032] A housing is provided on the top of the fixing platform 24, and an electrostatic chuck 4 is fixedly installed on the top of the housing. By providing the electrostatic chuck 4, the device can be able to hold the semiconductor wafer.
[0033] In this embodiment, by setting up the driving component 3, a power source can be provided for the operation of the fixing component 2. By setting up a motor, the motor can provide a power source for the operation of the driving component 3. By setting up a driving gear 31, the motor can drive the operation of the driving component 3 through the driving gear 31. By setting up a driven gear 32, and by providing six arc grooves 20 and six sliding columns 21 on the driven gear 32, the driving gear 31 can drive the driven gear 32 to rotate while the driven gear 32 can drive the sliding column 21 and then drive the movement of the sliding bar 22 and the fixed block 25.
[0034] The working principle of this fixing device with adjustment function will be described in detail below.
[0035] like Figure 1-3 As shown, when in use, the semiconductor wafer to be fixed is placed on the upper surface of the electrostatic suction cup 4, and the electrostatic suction cup 4 is started. At this time, the electrostatic suction cup 4 will absorb the semiconductor wafer, and then the motor in the motor box 30 at the hole of the base 1 is started, and the motor will drive the driving gear 31 to rotate through the rotating shaft. After the driving gear 31 rotates, it will drive the driven gear 32 to rotate. The rotation of the driven gear 32 will drive the arc groove 20 thereon to rotate together. At this time, the arc groove 20 will drive the sliding column 21 to move toward the middle of the fixed platform 24, and then the sliding column 21 will drive the sliding bar 22 to move toward the middle along the trajectory of the sliding groove 23, and then the sliding bar 22 will drive the fixed block 25 to move toward the middle to fix the semiconductor wafer. If the previously placed semiconductor wafer is not placed in the center, the fixed block 25 will push the semiconductor wafer to the center.
Claims
1. A fixing device with an adjustment function, comprising a base (1), characterized in that: A fixing component (2) is arranged on the top of the base (1), a driving component (3) is arranged on the top of the base (1), a connecting shaft (33) is fixedly connected to the top of the base (1), and a fixing platform (24) is rotatably connected to the top of the connecting shaft (33).
2. A fixing device with an adjustment function according to claim 1, characterized in that: A frame (26) is fixedly mounted on the outer wall of the fixed platform (24), a sliding groove (23) is provided on the fixed platform (24), and a sliding bar (22) is slidably connected to the inner wall of the sliding groove (23).
3. A fixing device with an adjustment function according to claim 2, characterized in that: The bottom of the sliding bar (22) is fixedly connected to a sliding column (21), the number of the sliding columns (21) is six, the number of the sliding bars (22) is six, and the end of the sliding bar (22) away from the connecting shaft (33) is fixedly connected to a fixed block (25).
4. A fixing device with an adjustment function according to claim 1, characterized in that: The base (1) is provided with a hole, a motor box (30) is arranged in the hole, a motor is fixedly installed in the motor box (30), an output end of the motor is fixedly connected to a rotating shaft via a coupling, and an end of the rotating shaft away from the motor is fixedly connected to a driving gear (31).
5. A fixing device with an adjustment function according to claim 4, characterized in that: The driving gear (31) is meshedly connected with a driven gear (32), the middle of the driven gear (32) is rotatably connected to a connecting shaft (33), an arc groove (20) is provided on the driven gear (32), and the inner wall of the arc groove (20) is slidably connected to a sliding column (21).
6. A fixing device with an adjustment function according to claim 1, characterized in that: A shell is provided on the top of the fixing platform (24), and an electrostatic suction cup (4) is fixedly mounted on the top of the shell.
