Inertial measurement unit testing device and system
By designing an inertial measurement unit test device, using components such as pads and wire harness fixing seats, the problem of external stress influence of the inertial measurement unit in the test environment is solved, ensuring that its spatial position is fixed, free expansion and stable electrical connection is stable, and the accurate performance is achieved Evaluate.
Patent Information
- Application Number
- CN202323474674.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2023-12-19
- Publication Date
- 2024-12-24
- Estimated Expiration
- 2033-12-19
AI Technical Summary
The prior art is difficult to provide an inertial measurement unit with a near-ideal testing environment, resulting in the measurement accuracy being susceptible to external stresses and the inability to accurately evaluate its performance.
A test device for inertial measurement unit is designed, including a base body, multiple pads, wire harness fixing seats and data acquisition circuit boards. The inertial measurement unit is supported by the pads, its spatial position and attitude are fixed, external stress influence is reduced, and the wiring harness is passed The fixing seat and the data acquisition circuit board ensure stable electrical overlap.
The spatial position and attitude of the inertial measurement unit are achieved, allowing it to shrink and expand freely, avoid external stress, and ensure stable electrical overlap, thereby accurately evaluating its performance.
Smart Images
Figure CN222231685U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of electronic equipment, and in particular to an inertial measurement unit testing device and system. Background Art
[0002] An inertial measurement unit (IMU) is a sensor that measures the angular velocity and acceleration of an object. It usually includes a gyroscope and an accelerometer, and uses the sensed angular velocity and acceleration to calculate the spatial position and attitude of the object.
[0003] The measurement accuracy of the inertial measurement unit is easily affected by external stress, such as temperature changes, mechanical shock and vibration. According to the packaging form, the inertial measurement unit can be divided into an independent inertial measurement unit and a surface-mount inertial measurement unit. In order to accurately test the performance of the inertial measurement unit, it is necessary to ensure that the test is close to the following ideal environment: the spatial position and attitude of the inertial measurement unit are fixed, the inertial measurement unit can shrink and expand freely, the inertial measurement unit is not affected by external stress, and the inertial measurement unit has a stable electrical connection with the outside.
[0004] Therefore, how to provide a nearly ideal test environment for the inertial measurement unit so as to accurately evaluate the performance of the inertial measurement unit is a technical problem that needs to be solved urgently by those skilled in the art. Utility Model Content
[0005] The purpose of the present application is to provide an inertial measurement unit testing device to solve the technical problem in the prior art of how to provide a nearly ideal testing environment for an inertial measurement unit, thereby accurately evaluating the performance of the inertial measurement unit.
[0006] Another object of the present application is to provide an inertial measurement unit testing system to solve the technical problem in the prior art of how to provide a nearly ideal testing environment for the inertial measurement unit, thereby accurately evaluating the performance of the inertial measurement unit.
[0007] This application is implemented as follows:
[0008] On the one hand, an embodiment of the present application provides an inertial measurement unit test device, the device comprising: a base, a plurality of pads, a harness fixing seat and a data acquisition circuit board, the base comprising a first step, a second step and a third step arranged in sequence from top to bottom; wherein,
[0009] A mounting groove is provided on the top of the first step, and a plurality of pads are arranged at the edge of the mounting groove to support the component to be tested;
[0010] The wiring harness fixing seat is arranged on the second step and is used for fixing the external wiring harness of the component to be tested;
[0011] The data acquisition circuit board is arranged on the third step, and the data acquisition circuit board is electrically connected to the component to be tested through the external wiring harness.
[0012] Furthermore, the installation groove is rectangular, and the four corners of the installation groove are provided with limiting grooves matching the contour of the cushion block, and the limiting grooves are used to fix the cushion block.
[0013] Furthermore, the cushion block is adhered to the limiting groove by means of high temperature resistant adhesive, and the wiring harness fixing seat and the data acquisition circuit board are adhered to the second step and the third step respectively by means of high temperature resistant adhesive tape.
[0014] Furthermore, the plurality of cushion blocks are all rectangular as a whole, and a supporting groove is provided at a corner of the top surface of each cushion block facing the center of the installation groove, and the supporting groove is used to support the component to be tested.
[0015] Furthermore, the side surfaces of the four corners of the component to be tested do not contact the side surfaces of the supporting groove.
[0016] Furthermore, the tops of the plurality of pads are flush with the top of the first step.
[0017] Furthermore, the minimum bundle diameter of the wiring harness fixing seat is smaller than the diameter of the external wiring harness.
[0018] Furthermore, the height difference between the second step and the first step ensures that the height of the external wiring harness supported by the wiring harness fixing seat is flush with the height of the wire outlet of the component to be tested.
[0019] Furthermore, the height difference between the second step and the third step ensures a smooth transition and bending of the external wiring harness from the wiring harness fixing seat to the data acquisition circuit board.
[0020] On the other hand, an embodiment of the present application further provides an inertial measurement unit testing system, which includes an inertial measurement unit testing device as described in any of the aforementioned embodiments.
[0021] Compared with the prior art, this application has the following beneficial effects:
[0022] (1) The spatial position and attitude of the inertial measurement unit are fixed. A mounting groove is provided at the top of the first step of the base, and a plurality of pads are arranged at the edge of the mounting groove. The pads support the inertial measurement unit, thereby ensuring that the spatial position and attitude of the inertial measurement unit are fixed.
[0023] (2) The inertial measurement unit can shrink and expand freely. Since only the edge of the inertial measurement unit is in contact with the pad, and the rest of the inertial measurement unit is not in contact with any object, it is ensured that the inertial measurement unit can shrink and expand freely.
[0024] (3) The inertial measurement unit is not affected by external stress. Since the contact area between the inertial measurement unit and the pad is small, and the harness fixing seat can fix the external wiring harness of the inertial measurement unit and adjust the laying path and outlet direction of the external wiring harness, the stress of the external wiring harness on the inertial measurement unit is eliminated, and the external stress is isolated from being transmitted to the inertial measurement unit, ensuring that the inertial measurement unit is not affected by external stress.
[0025] (4) The inertial measurement unit has a stable electrical connection with the outside. The external wiring harness is adjusted by the wiring harness fixing seat and plugged into the data acquisition circuit board. The data acquisition circuit board can power the inertial measurement unit and collect its output data through the external wiring harness, ensuring that the inertial measurement unit has a stable electrical connection with the outside, and can accurately evaluate the performance of the inertial measurement unit. BRIEF DESCRIPTION OF THE DRAWINGS
[0026] In order to make the purpose, technical scheme and advantages of the embodiments of the present application clearer, the technical scheme in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all of the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the application claimed for protection, but merely represents the selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians of the art without making creative work are within the scope of protection of the present application.
[0027] Figure 1 One of the partial structural schematic diagrams of an inertial measurement unit testing device provided in an embodiment of the present application;
[0028] Figure 2 A second partial structural schematic diagram of an inertial measurement unit testing device provided in an embodiment of the present application;
[0029] Figure 3 A schematic diagram of the structure of the connection between the pad block and the mounting groove provided in the embodiment of the present application;
[0030] Figure 4 A schematic diagram of the use of an inertial measurement unit testing device provided in an embodiment of the present application.
[0031] Icons: 100- inertial measurement unit test device; 110- base; 111- first step; 1111- mounting slot; 1112- limit slot; 112- second step; 113- third step; 120- pad; 121- support slot; 1211- side of support slot; 130- harness fixing seat; 131- tie strip; 140- data acquisition circuit board; 150- surface mount inertial measurement unit; 151- wire outlet; 152- external wiring harness. DETAILED DESCRIPTION
[0032] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all of the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the application claimed for protection, but merely represents the selected embodiments of the present application. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without making creative work belong to the scope of protection of the present application.
[0033] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.
[0034] In the description of this application, it should be noted that relational terms such as first and second, etc. are merely used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations.
[0035] The measurement accuracy of the inertial measurement unit is easily affected by external stress. In order to accurately test the performance of the inertial measurement unit, it is necessary to ensure that the test is close to the following ideal environment:
[0036] (1) The spatial position and attitude of the inertial measurement unit are fixed;
[0037] (2) The inertial measurement unit can shrink and expand freely;
[0038] (3) The inertial measurement unit is not affected by external stress;
[0039] (4) The inertial measurement unit has a stable electrical connection with the outside.
[0040] Therefore, how to provide a nearly ideal test environment for the inertial measurement unit so as to accurately evaluate the performance of the inertial measurement unit is a technical problem that needs to be solved urgently by those skilled in the art.
[0041] In conjunction with the accompanying drawings, some embodiments of the present application are described in detail below. In the absence of conflict, the following embodiments and features in the embodiments can be combined with each other.
[0042] See also Figure 1 , Figure 1 This is a schematic structural diagram of an inertial measurement unit testing device 100 provided in an embodiment of the present application. The device includes: a base 110, a plurality of pads 120, a harness fixing seat 130 and a data acquisition circuit board 140.
[0043] like Figure 2 As shown, the base 110 includes a first step 111, a second step 112 and a third step 113 arranged in sequence from top to bottom. In the embodiment of the present application, the base 110 is preferably a three-step type. Among them, the top of the first step 111 is provided with a mounting groove 1111, and a plurality of pads 120 are arranged at the edge position of the mounting groove 1111 to support the component to be tested, ensuring that the spatial position and posture of the component to be tested are fixed.
[0044] It should be noted that the component to be tested can be either a SMD inertial measurement unit or a PCBA of an independent inertial measurement unit. Since the SMD inertial measurement unit is more susceptible to external stress, the SMD inertial measurement unit is used as an example in the embodiments of the present application.
[0045] Since only the edge of the SMD IMU 150 contacts the pad 120 and the rest of the SMD IMU 150 does not contact any object, the SMD IMU 150 can shrink and expand freely and the transmission of external stress to the SMD IMU 150 is isolated.
[0046] The wiring harness fixing seat 130 is arranged on the second step 112, and is used to fix the external wiring harness 152 of the SMD inertial measurement unit 150, and adjust the laying path and the outlet direction of the external wiring harness 152, thereby eliminating the stress of the external wiring harness 152 on the SMD inertial measurement unit 150, further isolating the external stress from being transmitted to the SMD inertial measurement unit 150, and ensuring that the SMD inertial measurement unit 150 is not affected by the external stress.
[0047] The data acquisition circuit board 140 is disposed on the third step 113, and the external wiring harness 152 is adjusted by the wiring harness fixing seat 130 and plugged into the data acquisition circuit board 140. The data acquisition circuit board 140 is used to supply power to the SMD inertial measurement unit 150 through the external wiring harness 152 and collect its output data, ensuring that the SMD inertial measurement unit 150 has a stable electrical connection with the outside, and can accurately evaluate the performance of the SMD inertial measurement unit 150.
[0048] It should be noted that the substrate 110 is made of a metal material with high rigidity and low thermal expansion coefficient, such as aluminum alloy, tungsten alloy, molybdenum alloy, etc. Moreover, the substrate 110 is made by integrated processing without sub-component assembly.
[0049] Based on the above design, it is ensured that the substrate 110 will not be deformed due to external stress or temperature change during the performance test of the SMD IMU 150, further providing a nearly ideal testing environment for the SMD IMU 150.
[0050] In order to stably set the multiple pads 120 in the installation groove 1111, as an optional embodiment, the installation groove 1111 can be set to a rectangle, and accordingly, four pads 120 are respectively set at the four corners of the installation groove 1111 to support the patch-type inertial measurement unit 150.
[0051] As another alternative implementation, see Figure 3 The mounting groove 1111 can be arranged in a cross shape, and accordingly, four pads 120 are respectively arranged at four lateral corners of the mounting groove 1111 to support the patch-type inertial measurement unit 150 .
[0052] It should be noted that the shape of the mounting groove 1111 is determined according to the shape of the component to be tested, that is, the shape of the mounting groove 1111 can be, but is not limited to, a rectangle, a cross, etc.
[0053] See also Figure 4 When performing a performance test on the SMD inertial measurement unit 150 , it is necessary to connect the SMD inertial measurement unit 150 to the data acquisition circuit board 140 through an external wiring harness 152 . Therefore, a wire outlet 151 is also provided on the SMD inertial measurement unit 150 .
[0054] That is to say, the contour of the actual patch-type inertial measurement unit 150 is not regular, and the cross-shaped mounting groove 1111 can better accommodate the patch-type inertial measurement unit 150. Therefore, in the embodiment of the present application, the cross-shaped mounting groove 1111 is preferred.
[0055] Accordingly, in order to make the cushion block 120 more consistent with the contour of the installation groove 1111, in the embodiment of the present application, the plurality of cushion blocks 120 are all rectangular as a whole.
[0056] To explain the specific connection method between the SMD IMU 150, the pad 120 and the mounting groove 1111, please refer to Figure 3The four lateral corners of the installation groove 1111 are all provided with limiting grooves 1112 matching the contour of the cushion block 120, and these limiting grooves 1112 are used to fix the cushion block 120. Specifically, the bottom surface of the cushion block 120 is coated with high temperature resistant glue, and the cushion block 120 is adhered to the limiting groove 1112 by the high temperature resistant glue, thereby completing the connection between the cushion block 120 and the installation groove 1111.
[0057] Based on the above design, since the four pads 120 are respectively arranged at the four corners of the mounting groove 1111, it is ensured that only the four corners of the patch type inertial measurement unit 150 placed on the pad 120 are in contact with the pad 120. While fixing the patch type inertial measurement unit 150, the contact area of the patch type inertial measurement unit 150 with other objects is reduced, thereby ensuring that the patch type inertial measurement unit 150 can shrink and expand freely, isolating the external stress from being transmitted to the patch type inertial measurement unit 150.
[0058] In order to further ensure that the spatial position and posture of the SMD inertial measurement unit 150 are fixed, in the embodiment of the present application, a support groove 121 is provided at a corner of the top surface of the four pads 120 facing the center position of the installation groove 1111, and the four corners of the SMD inertial measurement unit 150 are respectively placed on these four support grooves 121.
[0059] In an embodiment provided in the present application, the side surfaces of the four corners of the patch-type inertial measurement unit 150 are not in contact with the side surfaces 1211 of the support groove. In order to further fix and ensure that the patch-type inertial measurement unit 150 can shrink and expand freely, in the embodiment of the present application, silicone is filled between the side surfaces of the four corners of the patch-type inertial measurement unit 150 and the side surfaces 1211 of the support groove.
[0060] Based on the above design, the thermal expansion and contraction of the SMD inertial measurement unit 150 will not be restricted while the SMD inertial measurement unit 150 is fixed. In addition, the external stress can be buffered by filling silicone between the SMD inertial measurement unit 150 and the side surface 1211 of the support groove, further ensuring that the SMD inertial measurement unit 150 is not affected by the external stress.
[0061] In another embodiment provided in the present application, the plurality of pads 120 can withstand harsh high and low temperature environments and have the characteristics of low hardness and high elongation at break in a wide temperature range. Since the pads 120 are very soft, they will not limit the thermal expansion and contraction of the SMD IMU 150 during the test, further ensuring that the SMD IMU 150 can shrink and expand freely.
[0062] See also Figure 4 , Figure 4The schematic diagram of the use of a patch inertial measurement unit test device 100 provided in an embodiment of the present application is shown. When using the patch inertial measurement unit test device 100, the patch inertial measurement unit 150 is installed on the pad 120, the external wiring harness 152 is plugged into the data acquisition circuit board 140, the external wiring harness 152 is locked with the harness fixing seat 130, and the laying path and the outlet direction of the external wiring harness 152 are adjusted. After the installation of the patch inertial measurement unit 150 is completed, the power-on test can be performed.
[0063] In actual testing, the data acquisition circuit board 140 needs to be connected to the SMD inertial measurement unit 150 through the external wiring harness 152, so as to power the SMD inertial measurement unit 150 and collect its output data. Since the external wiring harness 152 is very light and easy to shake, the SMD inertial measurement unit 150 cannot have a stable electrical connection with the outside, and the external stress will be transmitted to the SMD inertial measurement unit 150.
[0064] In order to solve the above problem, in the embodiment of the present application, all external wiring harnesses 152 located at the first step 111 are fixed by the wiring harness fixing seat 130 located at the second step 112 and then plugged into the data acquisition circuit board 140 located at the third step 113. Among them, the minimum bundle diameter of the wiring harness fixing seat 130 is smaller than the diameter of the external wiring harness 152, ensuring that the external wiring harness 152 can be firmly locked and will not shake easily.
[0065] It should be noted that the minimum contraction diameter of the harness fixing base 130 refers to the minimum contraction diameter of the contraction strip 131 in the harness fixing base 130 , and the contraction strip 131 can adjust its contraction diameter according to the diameter of the external harness.
[0066] In order to reduce the stress on the external wiring harness 152 between the first step 111 and the second step 112, in the embodiment of the present application, the height difference between the second step 112 and the first step 111 can ensure that the height of the external wiring harness 152 supported by the wiring harness fixing base 130 is flush with the height of the wire outlet 151 of the patch-type inertial measurement unit 150, thereby ensuring that the external wiring harness 152 between the first step 111 and the second step 112 is parallel to the horizontal plane.
[0067] Since the height of the pad 120 used to support the patch-type inertial measurement unit 150 will also affect the slope of the external wiring harness 152 between the first step 111 and the second step 112, in order to further reduce the stress on the external wiring harness 152 between the first step 111 and the second step 112, in the embodiment of the present application, the top of each pad 120 is flush with the top of the first step 111.
[0068] Based on the above design, it can be ensured that the slope of the external wiring harness 152 between the first step 111 and the second step 112 is zero, that is, the external wiring harness 152 is parallel to the horizontal plane, thereby reducing the external stress on the external wiring harness 152 and ensuring that the chip-type inertial measurement unit 150 is not affected by external stress.
[0069] In order to reduce the stress on the external wiring harness 152 between the second step 112 and the third step 113, in the embodiment of the present application, the height difference between the second step 112 and the third step 113 ensures a smooth transition bend of the external wiring harness 152 from the wiring harness fixing base 130 to the data acquisition circuit board 140, further ensuring that the surface-mount inertial measurement unit 150 is not affected by external stress and has a stable electrical connection with the outside.
[0070] As a preferred implementation, the harness fixing seat 130 and the data acquisition circuit board 140 are respectively adhered to the second step 112 and the third step 113 by high temperature resistant tape.
[0071] Since the entire SMD IMU test device 100 has a simple assembly relationship and is bonded together by tape or glue, the risk of interfering with the SMD IMU 150 even if the SMD IMU test device 100 fails in structure and generates a small impact during the test is very low.
[0072] Optionally, an embodiment of the present application further provides an inertial measurement unit testing system, which includes the inertial measurement unit testing device 100 as described in any of the aforementioned embodiments.
[0073] In summary, the embodiments of the present application provide an inertial measurement unit testing device and system. The inertial measurement unit is raised by pads arranged at the four corners of the installation slot, and only the bottom surfaces of the four corners of the inertial measurement unit are in contact with the bottom surfaces of the support slots in the pads. Silicone is filled between the sides of the four corners of the inertial measurement unit and the sides of the support slots, which not only fixes the spatial position and posture of the inertial measurement unit, but also ensures that the inertial measurement unit can shrink and expand freely without being affected by external stress.
[0074] Since the pads used have the characteristics of low hardness and high elongation at break in a wide temperature range, they will not limit the thermal expansion and contraction of the inertial measurement unit during the test, further ensuring that the inertial measurement unit can shrink and expand freely.
[0075] In order to ensure that the inertial measurement unit has a stable electrical connection with the outside and eliminate the stress on the external wiring harness, the external wiring harness is fixed by a wiring harness fixing seat and then inserted into the data acquisition circuit board. The height difference between the second step and the first step is set to ensure that the height of the external wiring harness supported by the wiring harness fixing seat is flush with the height of the outlet of the inertial measurement unit. The height difference between the second step and the third step is set to ensure that the external wiring harness from the wiring harness fixing seat to the data acquisition circuit board has a smooth transition and bend, thereby eliminating the stress on the external wiring harness and ensuring that the inertial measurement unit has a stable electrical connection with the outside.
[0076] Finally, by providing a near-ideal test environment for the inertial measurement unit, the performance of the inertial measurement unit can be accurately evaluated.
[0077] The above description is only the preferred embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.
[0078] It will be apparent to those skilled in the art that the present application is not limited to the details of the exemplary embodiments described above, and that the present application can be implemented in other specific forms without departing from the spirit or essential features of the present application. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of the present application is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims be included in the present application. Any reference numeral in a claim should not be considered as limiting the claim to which it relates.
Claims
1. An inertial measurement unit test device, characterized in that: The device comprises: a base, a plurality of pads, a harness fixing seat and a data acquisition circuit board, wherein the base comprises a first step, a second step and a third step arranged in sequence from top to bottom; wherein, A mounting groove is provided on the top of the first step, and a plurality of pads are arranged at the edge of the mounting groove to support the component to be tested; The wiring harness fixing seat is arranged on the second step and is used for fixing the external wiring harness of the component to be tested; The data acquisition circuit board is arranged on the third step, and the data acquisition circuit board is electrically connected to the component to be tested through the external wiring harness.
2. The inertial measurement unit test device according to claim 1, characterized in that: The installation groove is rectangular, and the four corners of the installation groove are provided with limiting grooves matching the contour of the cushion block, and the limiting grooves are used to fix the cushion block.
3. The inertial measurement unit test device according to claim 2, characterized in that: The cushion block is adhered to the limiting groove by means of high temperature resistant adhesive, and the wiring harness fixing seat and the data acquisition circuit board are adhered to the second step and the third step respectively by means of high temperature resistant adhesive tape.
4. The inertial measurement unit test device according to claim 1, characterized in that: The plurality of cushion blocks are all rectangular as a whole, and a supporting groove is provided at a corner of the top surface of each cushion block facing the center of the installation groove, and the supporting groove is used to support the component to be tested.
5. The inertial measurement unit test device according to claim 4, characterized in that: The side surfaces of the four corners of the component to be tested do not contact the side surfaces of the supporting groove.
6. The inertial measurement unit test device according to claim 1, characterized in that: The tops of the plurality of spacers are flush with the top of the first step.
7. The inertial measurement unit test device according to claim 1, characterized in that: The minimum bundle diameter of the wiring harness fixing seat is smaller than the diameter of the external wiring harness.
8. The inertial measurement unit test device according to claim 1, characterized in that: The height difference between the second step and the first step ensures that the height of the external wiring harness supported by the wiring harness fixing seat is flush with the height of the wire outlet of the component to be tested.
9. The inertial measurement unit test device according to claim 1, characterized in that: The height difference between the second step and the third step ensures a smooth transition and bending of the external wiring harness from the wiring harness fixing seat to the data acquisition circuit board.
10. An inertial measurement unit test system, characterized in that: The system comprises the inertial measurement unit test device according to any one of claims 1 to 9.