Sensor shell

Abstract

The sensor shell comprises an outer frame, a flow guide plate, an insulation mylar film and a rear cover, first heat dissipation grids are arranged on the periphery of the outer frame, an opening penetrating front and back is formed in the outer frame, a panel is installed on the front face of the outer frame, and a flow guide channel and a plurality of function holes are formed in the bottom of the outer frame. The back surface of the outer frame is provided with a plurality of mainboard mounting holes and a back plate buckle, the flow guide plate is mounted on the mainboard, the flow guide plate is provided with a plurality of flow guide openings, the flow guide openings can be aligned and communicated with the flow guide channels, the rear cover is provided with terminal grooves and a plurality of power panel mounting holes, the two sides and the top of the rear cover are provided with second heat dissipation grids, and the outer frame is detachably connected with the rear cover; the sensor shell has excellent assembly reliability, repeated disassembly and better adaptability, can meet the installation of various mainboards with different structures, has better heat dissipation characteristic and smooth appearance modeling, is a standard 86 type control box in appearance, can be matched with a standard 86 back plate, and meets the standard indoor installation requirement.

Description

Technical Field

[0001] The utility model relates to the technical field of sensors, and more specifically to a sensor housing. Background Art

[0002] The sensor housing is a device used to protect and fix the sensor, usually made of metal or plastic. It can provide protection for the sensor to prevent it from being disturbed or damaged by the external environment. It can also fix and support the sensor so that the sensor can work more stably.

[0003] Existing sensor housings usually take protection and sealing into consideration. After the sensor has been working for a long time, a certain amount of heat will be generated. However, the heat dissipation of the sensor housing is poor, which can easily affect the functional modules inside it and affect its detection function or life. Therefore, a sensor housing with good heat dissipation performance that will not affect the detection of the functional modules is designed and developed. Utility Model Content

[0004] In view of the shortcomings of the prior art, the utility model provides a sensor housing, which has excellent assembly reliability and repeated disassembly, better adaptability, can meet the installation of a variety of motherboards with different structures, and has better heat dissipation characteristics, smooth appearance, and the appearance of a standard 86-style control box. It can be matched with a standard 86 back panel to meet the standardized indoor installation requirements.

[0005] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0006] A sensor housing comprises an outer frame, a guide plate, an insulating Mylar sheet and a back cover, wherein a first heat dissipation grille is arranged around the outer frame, an opening penetrating from front to back is arranged on the outer frame, a panel is installed on the front of the outer frame, a guide channel and a plurality of functional holes are arranged on the bottom of the outer frame, a plurality of mainboard mounting holes and a back plate buckle are arranged on the back of the outer frame, the guide plate is installed on the mainboard, a plurality of guide ports are arranged on the guide plate, and the guide ports can be aligned and communicated with the guide channel, a terminal slot and a plurality of power board mounting holes are arranged on the back cover, and a second heat dissipation grille is arranged on both sides and the top of the back cover, and the outer frame and the back cover are detachably connected.

[0007] Furthermore, a plurality of first assembly holes are provided on the back of the outer frame, and a plurality of second assembly holes are provided on the back cover. The first assembly holes are threaded holes, and the second assembly holes are through holes. Connecting screws are provided in the second assembly holes. The connecting screws pass through the second assembly holes and extend into the first assembly holes and form an interference fit with the first assembly holes to realize the assembly of the outer frame and the back cover.

[0008] Furthermore, a plurality of connecting columns are provided on the back of the outer frame, and the connecting columns include an installation section and a limiting section. The diameter of the limiting section is larger than the diameter of the installation section, and the limiting section is fixedly connected to the outer frame. The installation section faces the back of the outer frame, and the mainboard mounting hole is located on the installation section.

[0009] Furthermore, the guide plate is provided with an assembly buckle and a limiting bracket, the guide plate is connected to the mainboard buckle via the assembly buckle, and the limiting bracket is in contact with the mainboard for limiting and fixing.

[0010] Furthermore, a mounting groove is provided on the front side of the outer frame, and the panel is installed in the mounting groove.

[0011] Furthermore, a plurality of anti-mistake limit columns for mounting the mainboard are arranged on the front side of the rear cover.

[0012] Furthermore, a plurality of buckle avoidance grooves are arranged on the outer side of the rear cover, and the buckle avoidance grooves are used to avoid the back panel buckles to pass through.

[0013] Further, the panel includes a functional module or a non-functional module.

[0014] Furthermore, the first heat dissipation grille is a curved heat dissipation grille.

[0015] Furthermore, the structural shape of the outer frame is a square of 86cmx86cm, and all four corners are rounded.

[0016] Compared with the prior art, the beneficial effects of the utility model are:

[0017] (1) Better assembly reliability and repeated disassembly;

[0018] (2) Better adaptability, able to meet the installation requirements of motherboards with different structures;

[0019] (3) Better heat dissipation characteristics;

[0020] (4) Smooth appearance;

[0021] (5) The appearance is a standard 86-type control box, which can be matched with a standard 86 back panel to meet the requirements of standardized indoor installation. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative work, among which:

[0023] Figure 1 A schematic diagram of the structure of a sensor Figure 1 ;

[0024] Figure 2 An exploded view of a sensor;

[0025] Figure 3 The structure of the outer frame Figure 1 ;

[0026] Figure 4 The structure of the outer frame Figure 2 ;

[0027] Figure 5 It is a structural diagram of the main board (embodiment 1);

[0028] Figure 6 is a schematic diagram of the structure of the guide plate;

[0029] Figure 7 A schematic diagram of the structure of a sensor Figure 2 ;

[0030] Figure 8 for Figure 7 Sectional view of AA in the middle;

[0031] Fig. 9 for Figure 7 Cross-sectional view of the middle BB;

[0032] Fig.10 is a schematic diagram of the structure of the back cover;

[0033] Fig.11 It is a schematic diagram of the installation of the outer frame and the main board (Example 2);

[0034] Fig.12 for Fig.11 Cross-sectional view of CC;

[0035] Fig.13 for Fig.12 Enlarged view of point D in the middle.

[0036] The markings in the figure are: 1. outer frame; 101. mounting groove; 102. opening; 103. first heat dissipation grille; 104. guide channel; 105. reset button hole; 106. LED light transmission hole; 107. back panel buckle; 108. first assembly hole; 109. mainboard mounting hole; 110. limit section; 111. mounting section; 2. panel; 3. back cover; 301. second heat dissipation grille; 302. second assembly hole; 303. mainboard mounting limit boss; 304. terminal slot; 305. buckle avoidance slot; 306. power board mounting hole; 307. mainboard mounting anti-fool limit column; 4. guide plate; 401. guide port; 402. assembly buckle; 403. limit bracket; 5. mainboard; 501. functional module; 6. insulating mylar sheet; 7. power board; 8. 86 box standard back panel; 9. connecting screws. DETAILED DESCRIPTION

[0037] In the description of the present invention, it should be noted that directional words, such as the terms "center", "lateral (X)", "longitudinal (Y)", "vertical (Z)", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", etc., indicating directions and positional relationships are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of narrating the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and cannot be understood as limiting the specific protection scope of the present invention.

[0038] In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features. Therefore, the definition of "first" and "second" features can explicitly or implicitly include one or more of the features. In the description of the utility model, the meaning of "several" and "a number" is two or more, unless otherwise clearly and specifically defined.

[0039] Embodiment 1:

[0040] A sensor, comprising a sensor housing, a main board 5 and a power board 7, wherein the sensor housing comprises an outer frame 1, a guide plate 4, an insulating Mylar sheet 6 and a back cover 3, wherein the outer frame 1 is provided with a first heat dissipation grille 103 around the outer frame 1, the outer frame 1 is provided with an opening 102 that penetrates from front to back, a panel 2 is installed on the front of the outer frame 1, a guide channel 104 and a plurality of functional holes are provided on the bottom of the outer frame 1, a plurality of main board mounting holes 109 and a backboard buckle 107 are provided on the back of the outer frame 1, the guide plate 4 is installed on the main board 5, and the guide plate 4 is provided with A plurality of air guide ports 401 are provided, the bottom of the air guide ports 401 is aligned and connected with the air guide channel 104, and the top is connected with the air inlet and the air outlet of the functional module on the main board 5. The back cover 3 is provided with a terminal slot 304 and a plurality of power board mounting holes 306, and the two sides and the top of the back cover 3 are provided with a second heat dissipation grille 301. The power board 7 is installed on the back cover 3 by screws and the power board mounting holes 306. The main board 5 is installed on the outer frame 1. The insulating Mylar sheet 6 is assembled between the power board 7 and the main board 5. The outer frame 1 and the back cover 3 cover each other and are detachably connected.

[0041] Preferably, in this embodiment, the back of the outer frame 1 is provided with a plurality of first assembly holes 108, and the back cover 3 is provided with a plurality of second assembly holes 302, wherein the first assembly holes 108 are threaded holes, and the second assembly holes 302 are through holes, and connecting screws 9 are provided in the second assembly holes 302, and the connecting screws 9 pass through the second assembly holes 302 and extend into the first assembly holes 108 and form an interference fit with the first assembly holes 108, so as to realize the assembly of the outer frame and the back cover 3;

[0042] Specifically, during installation, after the outer frame 1, the mainboard 5 and the back cover 3 are assembled, the connection screws 9 are passed through the second assembly holes 302 and extended into the first assembly holes 108 to finally achieve connection and fixation.

[0043] Preferably in this embodiment, the guide plate 4 is provided with an assembly buckle 402 and a limiting bracket 403, the guide plate 4 is buckled and connected to the main board 5 via the assembly buckle 402, and the limiting bracket 403 is in contact with the main board 5 for limiting and fixing.

[0044] Preferably, in this embodiment, a mounting recess 101 is provided on the front side of the outer frame 1, the panel 2 is installed in the mounting recess 101, and the panel 2 is fixed to the outer frame 1 by adhesive.

[0045] In this embodiment, preferably, a plurality of mainboard installation anti-mistake limit columns 307 are provided on the front of the back cover 3. When the mainboard 5 is assembled on the back cover 3, the plurality of mainboard installation anti-mistake limit columns 307 will cooperate with the limit grooves reserved on the mainboard 5 to achieve the purpose of anti-mistake and limit when the mainboard 5 is installed.

[0046] In this embodiment, preferably, a mainboard mounting limit boss 303 is provided on the front of the back cover 3. The mainboard mounting limit boss 303 has a certain height, which can prevent the mainboard 5 from directly contacting the back cover 3 after installation, thereby improving the heat dissipation requirements of the mainboard 5 and reserving space for components or their bases that may exist on the mainboard 5.

[0047] Preferably in this embodiment, a plurality of snap avoidance grooves 305 are provided on the outer side of the back cover 3, and the snap avoidance grooves 305 are used to avoid the back panel snaps 107 so that they can pass through, thereby enabling the back panel snaps 107 to be connected with the 86 box standard back panel 8 snaps 107.

[0048] In this embodiment, preferably, the panel 2 includes a functional module or a non-functional module. The functional module may be a display screen or other functional modules, and the non-functional module may be a cover plate, so that different panels 2 can be installed according to different functional requirements.

[0049] Preferably, in this embodiment, the first heat dissipation grille 103 is a curved heat dissipation grille.

[0050] In this embodiment, the functional hole is preferably a reset button hole 105, a sensor probe assembly hole or an LED light-transmitting hole 106, so that a reset button or a sensor probe can be installed in the reset button hole 105 or the sensor probe assembly hole, and the LED light-transmitting hole 106 can display the working status of the internal main board 5, so that the user can check whether the main board 5 is working normally, not powered or faulty, etc.

[0051] Preferably, in this embodiment, the first heat dissipation grilles 103 on the top of the outer frame 1 are positioned opposite to each other, and the first heat dissipation grilles 103 on both sides are symmetrical along the middle surface.

[0052] Preferably, in this embodiment, the outer frame 1 has a structural shape of a square of 86 cm x 86 cm, and all four corners are rounded.

[0053] This ensures beauty.

[0054] Embodiment 2:

[0055] A sensor, the rest of the features are the same as those of the first embodiment, except that: a plurality of connecting columns are provided on the back of the outer frame 1, the connecting columns include a mounting section 111 and a limiting section 110, the diameter of the limiting section 110 is larger than the diameter of the mounting section 111, and the limiting section 110 is fixedly connected to the outer frame 1, the mounting section 111 faces the back of the outer frame 1, and the mainboard mounting hole 109 is located on the mounting section 111;

[0056] Specifically, when installing the mainboard 5, the installation section 111 will extend into the hole on the mainboard 5, the limiting section 110 will contact the mainboard 5 for limiting, and then the screws will be screwed into the mainboard installation hole 109 to fix it, so that the mainboard 5 is installed and fixed on the outer frame 1.

[0057] Preferably, in this embodiment, the plurality of connection columns are irregularly distributed, so as to realize a fool-proof function when the mainboard 5 is installed.

[0058] Advantages of this utility model:

[0059] The utility model arranges a first heat dissipation grille 103 for ventilation around the outer frame 1, so that the heat inside the sensor housing can be effectively and quickly dissipated, and the air outside the sensor housing can be convected to the inside of the housing, so that the functional module 501 (TVOC, PM2.5 two-in-one sensor) can detect the external air quality.

[0060] The first heat dissipation grille 103 of the outer frame 1 is curved, with visual beauty in appearance and good flow-guiding effect in structure. At the same time, the first heat dissipation grilles 103 at the top and bottom are relatively located, which can make the air flow smoothly. The first heat dissipation grilles 103 at the side are symmetrical along the middle surface, which can also make the air flow smoothly. For the sensor, full convection is achieved inside the upper and lower sides and the left and right sides, so that the internal environment of the sensor housing is basically consistent with the outside world, which effectively improves the detection accuracy of the sensor.

[0061] By setting a guide channel 104 at the bottom of the outer frame 1, setting a guide plate 4, and setting a guide port 401 on the guide plate 4, the guide port 401 cooperates with the guide channel 104 to provide an air flow channel for the air inlet and the air outlet of the functional module 501 (TVOC, PM2.5 two-in-one sensor), thereby providing a good air quality detection environment for the sensor module and effectively improving the detection accuracy of the sensor.

[0062] In addition to the first heat dissipation grille 103, the bottom of the sensor outer frame 1 is also designed with functional holes (reset button hole 105, sensor probe assembly hole or LED light-transmitting hole 106). The reset button and the sensor probe can pass through the functional hole, and can respectively realize the function of manually controlling the reset and detecting the external air quality. In addition, a reset button mark "RESET" can be designed on the edge of the left functional hole to intuitively display the function of the button. In addition, LED light-transmitting holes 106 are reserved on both sides to display the working status of the internal motherboard 5. For example, if the motherboard 5 is lit with a red light and the red light is always on, it means that the motherboard 5 is working normally. If the red light flashes, it means that the motherboard 5 is faulty. If there is no light on, it means that the motherboard 5 is not powered on, which can be observed through the light-transmitting holes. The light-transmitting holes can be designed to be 6 (or other numbers, such as 2, 3, 4, etc., the number is uncertain), and the aperture is ≤5mm, which can effectively reduce the light intensity, play a role in dispersing the light source, and provide users with a good visual experience.

[0063] By providing a back panel buckle 107 on the back side of the outer frame 1, the back panel buckle 107 can be connected with the 86 box standard back panel 8 buckle 107, so that the sensor can be quickly installed and fixed, and the electrical installation requirements during decoration can be met.

[0064] The above is only a preferred embodiment of the present invention. The protection scope of the present invention is not limited to the above embodiments. All technical solutions under the concept of the present invention belong to the protection scope of the present invention. It should be pointed out that for ordinary technicians in this technical field, some improvements and modifications without departing from the principle of the present invention should also be regarded as the protection scope of the present invention.

Claims

1. A sensor housing, characterized in that: It includes an outer frame, a guide plate, an insulating Mylar sheet and a back cover. The outer frame is provided with a first heat dissipation grille around the periphery, the outer frame is provided with a front and rear through opening, the front of the outer frame is installed with a panel, the bottom of the outer frame is provided with a guide channel and a plurality of functional holes, the back of the outer frame is provided with a plurality of mainboard mounting holes and a back panel buckle, the guide plate is installed on the mainboard, the guide plate is provided with a plurality of guide ports, the guide ports can be aligned and connected with the guide channel, the back cover is provided with a terminal slot and a plurality of power board mounting holes, and the two sides and the top of the back cover are provided with a second heat dissipation grille, and the outer frame and the back cover are detachably connected.

2. A sensor housing according to claim 1, characterized in that: A plurality of first assembly holes are arranged on the back of the outer frame, and a plurality of second assembly holes are arranged on the back cover. The first assembly holes are threaded holes, and the second assembly holes are through holes. Connecting screws are arranged in the second assembly holes. The connecting screws pass through the second assembly holes and extend into the first assembly holes and form an interference fit with the first assembly holes to realize the assembly of the outer frame and the back cover.

3. A sensor housing according to claim 1, characterized in that: A plurality of connecting columns are arranged on the back of the outer frame, and the connecting columns include an installation section and a limiting section. The diameter of the limiting section is larger than the diameter of the installation section, and the limiting section is fixedly connected to the outer frame. The installation section faces the back of the outer frame, and the mainboard mounting hole is located on the installation section.

4. A sensor housing according to claim 1, characterized in that: The guide plate is provided with an assembly buckle and a limiting bracket. The guide plate is connected to the mainboard buckle through the assembly buckle, and the limiting bracket is in contact with the mainboard for limiting and fixing.

5. The sensor housing according to claim 1, characterized in that: The front side of the outer frame is provided with an installation recessed groove, and the panel is installed in the installation recessed groove.

6. A sensor housing according to claim 1, characterized in that: The front side of the rear cover is provided with a plurality of anti-mistake limit posts for mounting the mainboard.

7. A sensor housing according to claim 1, characterized in that: A plurality of buckle avoidance grooves are arranged on the outer side of the rear cover, and the buckle avoidance grooves are used to avoid the back panel buckles so that they can pass through.

8. The sensor housing according to claim 1, characterized in that: The panel includes a functional module or a non-functional module.

9. The sensor housing according to claim 1, characterized in that: The first heat dissipation grille is a curved heat dissipation grille.

10. The sensor housing according to claim 1, characterized in that: The structural shape of the outer frame is a square of 86cmx86cm, and all four corners are rounded.

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