Multi-layer impedance plate convenient for heat dissipation
By designing the combination of installation boxes, fans, heat dissipation channels and air outlets on the multi-layer impedance plate, active heat dissipation is achieved, solving the problem of poor heat dissipation effect in the prior art, and significantly improving the heat dissipation effect and the practicality of the device.
Patent Information
- Application Number
- CN202420824088.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-19
- Publication Date
- 2024-12-24
- Estimated Expiration
- 2034-04-19
AI Technical Summary
The existing multi-layer impedance plates have poor heat dissipation effect, which leads to overheating of the surface temperature and affects the normal use of the equipment.
A multi-layer impedance plate including mounting box, fan, heat dissipation channel and air outlet tank is designed to drive air flow through the fan to take away heat, adjust the size of the heat dissipation channel with the adjustment block and spring to optimize the heat dissipation effect, and pass through the filter plate Filter dust from the air.
Active heat dissipation is achieved, which significantly improves the heat dissipation effect of the multi-layer impedance plate, improves the practicality and heat dissipation quality of the device, and avoids dust pollution.
Smart Images

Figure CN222235387U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of PCB boards, in particular to a multi-layer impedance board which is convenient for heat dissipation. Background Art
[0002] Multilayer impedance board is a kind of printed circuit board (PCB) widely used in electronic components. It has multiple metal conductor layers and insulation layers. By setting different impedances between different layers, impedance matching can be achieved during signal transmission, improving signal stability and reliability.
[0003] Common multi-layer impedance boards usually use the thermal conductivity of the board itself to help dissipate heat. The method of using the thermal conductivity of the board itself to dissipate heat is relatively passive, and the heat dissipation effect is not good. In addition, the surface temperature of the multi-layer impedance board is prone to overheating, affecting the normal use of the multi-layer impedance board. Utility Model Content
[0004] In view of the problems existing in the prior art, the purpose of the utility model is to provide a multi-layer impedance board that is easy to dissipate heat, so as to solve the background technical problems.
[0005] In order to achieve the above purpose, the utility model adopts the following technical solutions:
[0006] A multilayer impedance plate for facilitating heat dissipation comprises a main body, a mounting box is arranged below the main body, the inner side of the mounting box is fixedly connected to the main body, a square cavity is provided inside the mounting box, two fans are embedded in the inner wall of the square cavity, the bottoms of the two fans both penetrate and extend to the bottom of the mounting box, two groups of heat dissipation channels arranged at equal distances are provided on the inner wall of the square cavity, and air outlet grooves are provided on the left and right sides of the mounting box.
[0007] As a further description of the above technical solution:
[0008] The inner wall of the air outlet groove is slidably connected with adjustment blocks arranged at equal distances. The inner wall of the air outlet groove is provided with two sliding grooves. A locking plate is arranged between the two sliding grooves. The front and back sides of the locking plate are respectively slidably connected with the inner walls of the two sliding grooves. The inner walls of the two sliding grooves are fixedly connected with springs, and the other ends of the two springs are fixedly connected with the locking plate.
[0009] As a further description of the above technical solution:
[0010] A pull block is fixedly connected to one side of the locking plate away from the body, and a surface of the pull block is provided with anti-slip grooves.
[0011] As a further description of the above technical solution:
[0012] The left side of the adjusting block is fixedly connected with an adjusting plate, and the bottom of the adjusting plate is slidably connected with the inner wall of the air outlet groove.
[0013] As a further description of the above technical solution:
[0014] A filter plate is fixedly connected to the bottom of the installation box, and the top of the filter plate is in contact with two fans respectively.
[0015] Compared with the prior art, the advantages of the present invention are:
[0016] This solution adopts an active heat dissipation method, using a fan to quickly dissipate the heat of the main body, effectively improving the heat dissipation effect of the main body, and can distribute the heat dissipation effect, improve the quality of the heat dissipation of the main body, and improve the practicality of the device. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] Figure 1 It is a schematic diagram of the structure of the utility model;
[0018] Figure 2 It is a cross-sectional view of the utility model;
[0019] Figure 3 For this utility model Figure 2 Enlarged view of part A in the middle;
[0020] Figure 4 It is a three-dimensional diagram of the utility model.
[0021] Description of the numbers in the figure:
[0022] 1. Main body; 2. Installation box; 3. Square cavity; 4. Fan; 5. Heat dissipation channel; 6. Air outlet slot; 7. Adjustment block; 8. Slide slot; 9. Locking plate; 10. Spring; 11. Pull block; 12. Adjustment plate; 13. Filter plate. DETAILED DESCRIPTION
[0023] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the accompanying drawings in the embodiments of the present invention.
[0024] See also Figures 1 to 4 In the utility model: a multi-layer impedance board that is easy to dissipate heat, includes a main body 1, a mounting box 2 is arranged below the main body 1, the inner side of the mounting box 2 is fixedly connected to the main body 1, a square cavity 3 is opened inside the mounting box 2, two fans 4 are embedded in the inner wall of the square cavity 3, the bottoms of the two fans 4 both penetrate and extend to the bottom of the mounting box 2, two groups of heat dissipation channels 5 arranged at equal distances are opened on the inner wall of the square cavity 3, and air outlet grooves 6 are opened on the left and right sides of the mounting box 2.
[0025] In the utility model, when in use, the user turns on the fan 4, the fan 4 will draw air into the square cavity 3, and the air will then be discharged from the two groups of heat dissipation channels 5 to the air outlet grooves 6 and discharged from the air outlet grooves 6. During the process, the heat of the main body 1 will be transferred to the installation box 2, and the air flowing in the heat dissipation channels 5 will take away the heat transferred from the main body 1 to the installation box 2, thereby achieving the effect of heat dissipation for the main body 1.
[0026] See also Figure 2 , wherein: the inner wall of the air outlet groove 6 is slidably connected with an adjusting block 7 arranged at an equal distance, the inner wall of the air outlet groove 6 is provided with two slide grooves 8, a locking plate 9 is arranged between the two slide grooves 8, the front and back sides of the locking plate 9 are slidably connected with the inner walls of the two slide grooves 8 respectively, the inner walls of the two slide grooves 8 are fixedly connected with springs 10, and the other ends of the two springs 10 are fixedly connected with the locking plate 9.
[0027] In the utility model, during use, the heat dissipation channel 5 can be closed or the size of the exhaust port of the heat dissipation channel 5 can be reduced by sliding the adjustment block 7. After the exhaust port of the heat dissipation channel 5 is reduced, the air discharged from the heat dissipation channel 5 will become less, and the air flow in other heat dissipation channels 5 whose exhaust port sizes have not been changed will increase. Through this feature, the user can appropriately reduce the size of the exhaust port of the heat dissipation channel 5 where the heat generation area is smaller, thereby increasing the air flow in the heat dissipation channel 5 where the other heat generation area is larger, thereby achieving the purpose of improving the heat dissipation effect of the larger heat dissipation area, reasonably dissipating the heat dissipation effect, and improving the quality of heat dissipation of the main body 1.
[0028] See also Figures 2 to 4 , wherein: a pull block 11 is fixedly connected to one side of the locking plate 9 away from the body 1 , and a surface of the pull block 11 is provided with anti-slip grooves.
[0029] In the utility model, the elastic force of the spring 10 pushes the locking plate 9 to lock the position of the adjustment block 7. The user can pull the locking plate 9 through the pull block 11 to facilitate the user to adjust the position of the adjustment block 7, thereby improving the practicality of the device.
[0030] See also Figure 2 and 4 , wherein: an adjusting plate 12 is fixedly connected to the left side of the adjusting block 7 , and the bottom of the adjusting plate 12 is slidably connected to the inner wall of the air outlet groove 6 .
[0031] In the present invention, the setting of the adjustment plate 12 can facilitate the user to adjust the position of the adjustment block 7, thereby improving the practicability of the device.
[0032] See also Figure 2 , wherein: a filter plate 13 is fixedly connected to the bottom of the installation box 2, and the top of the filter plate 13 is in contact with the two fans 4 respectively.
[0033] In the present invention, the filter plate 13 can filter the dust in the air, thereby preventing the dust from entering the interior of the device and causing pollution, thereby improving the practicability of the device.
[0034] The above are only preferred specific implementations of the utility model; however, the protection scope of the utility model is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical solution and improved ideas of the utility model within the technical scope disclosed by the utility model, which should be included in the protection scope of the utility model.
Claims
1. A multilayer impedance board for facilitating heat dissipation, comprising a body (1), characterized in that: A mounting box (2) is arranged below the body (1), the inner side of the mounting box (2) is fixedly connected to the body (1), a square cavity (3) is provided inside the mounting box (2), two fans (4) are embedded in the inner wall of the square cavity (3), the bottoms of the two fans (4) both penetrate and extend to the bottom of the mounting box (2), the inner wall of the square cavity (3) is provided with two groups of heat dissipation channels (5) arranged at equal distances, and air outlet grooves (6) are provided on both left and right sides of the mounting box (2).
2. A multi-layer impedance board for facilitating heat dissipation according to claim 1, characterized in that: The inner wall of the air outlet groove (6) is slidably connected to an adjusting block (7) arranged at equal distances, and the inner wall of the air outlet groove (6) is provided with two slide grooves (8), a locking plate (9) is arranged between the two slide grooves (8), and the front and back sides of the locking plate (9) are respectively slidably connected to the inner walls of the two slide grooves (8), and the inner walls of the two slide grooves (8) are fixedly connected to springs (10), and the other ends of the two springs (10) are fixedly connected to the locking plate (9).
3. A multi-layer impedance board for facilitating heat dissipation according to claim 2, characterized in that: A pull block (11) is fixedly connected to the side of the locking plate (9) away from the body (1), and a surface of the pull block (11) is provided with anti-slip grooves.
4. A multi-layer impedance board for heat dissipation according to claim 2, characterized in that: An adjustment plate (12) is fixedly connected to the left side of the adjustment block (7), and the bottom of the adjustment plate (12) is slidably connected to the inner wall of the air outlet groove (6).
5. The multi-layer impedance board for facilitating heat dissipation according to claim 1, characterized in that: A filter plate (13) is fixedly connected to the bottom of the installation box (2), and the top of the filter plate (13) is in contact with two fans (4) respectively.
