Ultrasonic transducer
By arranging array elements in the vertical direction on the circuit board of the ultrasonic transducer and electrically connecting the wires to form a mirror symmetric layout, the problems of high cost and large volume of wire production in the prior art are solved, and time saving and The effect of space.
Patent Information
- Application Number
- CN202420734821.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-10
- Publication Date
- 2024-12-27
- Estimated Expiration
- 2034-04-10
AI Technical Summary
Existing ultrasonic transducers need to rely on complex semiconductor processes or three-dimensional wire frames when making signal wires, resulting in high costs and large volumes, making it difficult to meet the needs of small-pitch two-dimensional array elements.
Design an ultrasonic transducer, whose wires do not need to be formed by complex semiconductor processes, nor do they need to be designed as a three-dimensional wire frame, by arranging multiple array elements in a vertical direction on the circuit board and electrically connecting multiple array elements. The conductor, the extension direction of the conductor is at least partially parallel to a certain direction of the circuit board, and overlaps on a plurality of array elements in the third direction, forming a mirror symmetrical layout.
Save production costs and time, while reducing the volume of ultrasonic transducers, achieving efficient signal conductor layout.
Smart Images
Figure CN222241171U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to an ultrasonic transducer, in particular to an ultrasonic transducer comprising a transducer layer. Background Art
[0002] Ultrasonic transducers are currently very important medical examination tools. Among them, ultrasonic transducers include multiple array elements for receiving signals and signal wires electrically connected to the array elements. Since the array elements are usually cut by a cutting machine, the array elements are usually straight in shape, so there are restrictions on special arrangements. In addition, as the demand for small-pitch two-dimensional array elements gradually increases, the production of signal wires faces challenges. According to traditional production methods, signal wires can be formed by stacking semiconductor process films (for example, including thin film yellow light lithography processes); according to another traditional production method, a three-dimensional wire frame can be designed to lead out signal wires. However, these two traditional methods of making signal wires currently require very high costs.
[0003] Therefore, it is necessary to design a novel ultrasonic transducer to overcome the above-mentioned defects. Utility Model Content
[0004] The utility model aims to provide an ultrasonic transducer, which can save time and manufacturing cost, and can save volume because the lead wires of the ultrasonic transducer do not need to be formed by complex semiconductor processes and do not need to be designed as a three-dimensional lead frame.
[0005] To achieve the above-mentioned purpose, the utility model provides an ultrasonic transducer, comprising: a transducer layer for transmitting and receiving ultrasonic waves; a conductive layer, arranged on the upper surface of the transducer layer or on a side of the transducer layer adjacent to the object to be measured; a conductive layer and a circuit board (120), arranged in sequence on the conductive layer; wherein the circuit board comprises: a plurality of array elements, arranged in an array along a first direction and a second direction; and a plurality of wires, respectively electrically connected to corresponding array elements among the plurality of array elements, wherein the plurality of wires comprises a first wire, the extension direction of the first wire is at least partially parallel to the first direction, and the first wire overlaps with at least one corresponding array element among the plurality of array elements in a third direction, wherein the first direction, the second direction and the third direction are perpendicular to each other.
[0006] Preferably, the first conductive line includes a first portion and a second portion, the first portion is connected to the array element, the second portion is connected to the first portion, wherein an extending direction of the first portion is parallel to the third direction, and an extending direction of the second portion is parallel to the first direction.
[0007] Preferably, the first conductive line includes a first part, a second part (2241b) and a third part, the first part is connected to the array element, the second part is connected to the first part, and the third part is connected to the second part, wherein the extension direction of the first part is parallel to the first direction, the extension direction of the second part is parallel to the third direction, and the extension direction of the third part is parallel to the first direction.
[0008] Preferably, the plurality of wires further include a second wire, the second wire is adjacent to the first wire, an extension direction of the second wire is at least partially parallel to the first direction, and an offset distance exists between the first wire and the second wire in the second direction.
[0009] Preferably, the first conductive line is in electrical contact with an upper surface or a side surface of the array element, a normal direction of the upper surface is parallel to the third direction, and the side surface is connected to the upper surface.
[0010] Preferably, the plurality of wires further include a second wire, the second wire is adjacent to the first wire, an extension direction of the second wire is at least partially parallel to the first direction, and the first wire and the second wire overlap each other in the first direction and are separated from each other in the third direction.
[0011] Preferably, the region formed by the plurality of arrays has a center point and a symmetry axis passing through the center point, the extension direction of the symmetry axis is parallel to the second direction, and the layout patterns of the plurality of conductive lines are mirror-symmetrical about the symmetry axis.
[0012] Preferably, the plurality of wires further include a second wire, a third wire and a fourth wire, the second wire is adjacent to the first wire, and the third wire is adjacent to the fourth wire;
[0013] The plurality of array elements connected to the first conductive line and the second conductive line are further away from the symmetry axis than the plurality of array elements connected to the third conductive line and the fourth conductive line.
[0014] Preferably, an extension direction of the second conductive line is at least partially parallel to the first direction, and an extension direction of the third conductive line and an extension direction of the fourth conductive line are at least partially parallel to the second direction.
[0015] Preferably, the third conductive line and the fourth conductive line overlap each other in the third direction.
[0016] Preferably, it further includes a plurality of dummy conductive wires, wherein the plurality of dummy conductive wires are connected to the corresponding plurality of array elements, wherein the plurality of array elements include a first array element and a second array element that are adjacent to each other, the first array element having a first overlapping area with the plurality of conductive wires and the plurality of dummy conductive wires in the third direction, the second array element having a second overlapping area with the plurality of conductive wires and the plurality of dummy conductive wires in the third direction, and the first overlapping area is equivalent to the second overlapping area.
[0017] Compared with the prior art, the ultrasonic transducer provided by the embodiment of the utility model comprises a transducer layer, a conductive layer, a conducting layer and a circuit board, wherein the transducer layer is used for transmitting and receiving ultrasonic waves; the conductive layer is arranged on the upper surface of the overlapping transducer layer or on the side of the overlapping transducer layer adjacent to the object to be measured; the conducting layer and the circuit board are arranged on the overlapping conductive layer in sequence; wherein the overlapping circuit board comprises a plurality of array elements and a plurality of wires, wherein the plurality of array elements are arranged in an array along a first direction and a second direction; the plurality of wires are respectively electrically connected to the corresponding array elements in the overlapping plurality of array elements, wherein the overlapping plurality of wires comprises a first wire, wherein the extending direction of the overlapping first wire is at least partially parallel to the overlapping first direction, and the overlapping first wire overlaps at least one of the corresponding array elements in the overlapping plurality of array elements in a third direction, wherein the overlapping first direction, the overlapping second direction and the overlapping third direction are perpendicular to each other, thus, since the wires of the ultrasonic transducer do not need to be formed by a complex semiconductor process, and do not need to be designed as a three-dimensional wire frame, time and manufacturing cost can be saved, and volume can be saved. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] Figure 1 A partial cross-sectional view of an ultrasonic transducer according to an embodiment of the present invention is shown;
[0019] Figure 2A Draw Figure 1 A top view of an ultrasonic transducer;
[0020] Figure 2B Draw along Figure 2A A partial cross-sectional view of a circuit board of an ultrasonic transducer connected by line 2B-2B';
[0021] Figure 2C Draw along Figure 2A A partial cross-sectional view of a circuit board of an ultrasonic transducer with 2C-2C' connection;
[0022] Figure 2D Draw along Figure 2A A partial cross-sectional view of a circuit board 120 of an ultrasonic transducer with 2D-2D' connection;
[0023] Figure 2E A partial cross-sectional view of a circuit board of an ultrasonic transducer according to another embodiment of the present invention is shown;
[0024] Figure 3A A top view of an ultrasonic transducer according to another embodiment of the present invention is shown;
[0025] Figure 3B Draw along Figure 3A A partial cross-sectional view of a circuit board of an ultrasonic transducer connected along line 3B-3B';
[0026] Figure 3C Draw along Figure 3A A partial cross-sectional view of a circuit board of an ultrasonic transducer with 3C-3C' connection;
[0027] Figure 4A A top view of an ultrasonic transducer according to another embodiment of the present invention is shown;
[0028] Figure 4B Draw along Figure 4A A partial cross-sectional view of a circuit board of an ultrasonic transducer connected by line 4B-4B';
[0029] Figure 4C Draw along Figure 4A A partial cross-sectional view of a circuit board of an ultrasonic transducer with 4C-4C' connection;
[0030] Figure 5 A top view of an ultrasonic transducer according to another embodiment of the present invention is shown;
[0031] Fig. 6A A top view of an ultrasonic transducer according to another embodiment of the present invention is shown;
[0032] Figure 6B A top view of an ultrasonic transducer according to another embodiment of the present invention is shown. DETAILED DESCRIPTION
[0033] In order to provide a further understanding of the purpose, structure, features and functions of the present invention, the present invention is described in detail below with reference to the embodiments.
[0034] Figure 1 A partial cross-sectional view of an ultrasonic transducer 10 according to an embodiment of the present invention is shown, for example, corresponding to Figure 2A 1-1' hatch line. Figure 2A Draw Figure 1 A top view of the ultrasonic transducer 10. Figure 2B Draw along Figure 2A A partial cross-sectional view of the circuit board 120 of the ultrasonic transducer 10 along the line 2B-2B'. Figure 2C Draw along Figure 2A A partial cross-sectional view of the circuit board 120 of the ultrasonic transducer 10 with the 2C-2C' line connected thereto. Figure 2DDraw along Figure 2A FIG. 1 is a partial cross-sectional view of the circuit board 120 of the ultrasonic transducer 10 with 2D-2D′ connection.
[0035] Please also refer to Figure 1 and Figure 2A The ultrasonic transducer 10 includes a transducer layer 114, a conductive layer 116, a conducting layer 118, and a circuit board 120. The transducer layer 114 is used for transmitting and receiving ultrasonic waves. The conductive layer 116 is disposed on the other side of the transducer layer 114 relative to the object under test OB. The conducting layer 118 and the circuit board 120 are sequentially disposed on the conductive layer 116. The circuit board 120 includes a plurality of array elements 122 and a plurality of wires 124. The plurality of array elements 122 are arranged in an array along a first direction D1 and a second direction D2. The plurality of wires 124 are respectively electrically connected to at least one corresponding array element of the plurality of array elements 122. The first direction D1, the second direction D2, and the third direction D3 are perpendicular to each other. Thus, the wires of the ultrasonic transducer 10 of the utility model do not need to be formed by a complex semiconductor process, nor do they need to be designed as a three-dimensional wire frame, so time and manufacturing cost can be saved, and volume can be saved.
[0036] Please also refer to Figure 1 and Figure 2A The ultrasonic transducer 10 includes a transducer layer 114 and a conductive layer 116, a conducting layer 118 and a circuit board 120 sequentially disposed on the transducer layer 114. The conductive layer 116 is disposed on the other side of the transducer layer 114 relative to the object to be measured OB, and the conducting layer 118 and the circuit board 120 are sequentially disposed on the transducer layer 114 and the conductive layer 116. For example, the transducer layer 114 has an upper surface 114a, and the conductive layer 116 is disposed on the upper surface 114a of the transducer layer 114. It should be understood that the present invention is not limited thereto. In other embodiments, the conductive layer 116 may be disposed on the side of the transducer layer 114 adjacent to the object to be measured OB. In addition, the circuit board 120 is disposed on the conducting layer 118. That is, the circuit board 120 is farther away from the conductive layer 116 than the conducting layer 118. The circuit board 120 is, for example, a flexible circuit board, a rigid circuit board or other suitable circuit boards. The circuit board 120 may include a plurality of array elements 122, a plurality of wires 124 electrically connected to the array elements 122, and an insulating material 126 electrically isolating the array elements 122 from each other. Figure 1 In the embodiment, the object to be measured OB is, for example, a human body, a probe or other suitable object to be measured. In addition, the ultrasonic transducer 10 may further include a ground electrode layer 112, which is disposed on a side of the transducer layer 114 opposite to the conductive layer 116, that is, on a side facing the object to be measured OB. The ground electrode layer 112 corresponds to the lowest level (GND) of the system's upper potential and has an anti-interference effect.
[0037] According to some embodiments, the transducer layer 114 can be used to transmit and receive ultrasonic waves and convert between "electrical energy" and "acoustic energy". In some embodiments, the transducer layer 114 may include a piezoelectric material. The piezoelectric material includes, for example, lead zirconate titanate (PZT), single crystal material (PMNPT, LiNBO3), quartz, polyvinylidene fluoride (PVDF), aluminum nitride (AlN) and / or zinc oxide, but the present invention is not limited thereto. Figure 1 In the embodiment, the transducer layer 114 includes a plurality of transceiver parts 1141, and the transceiver parts 1141 are completely separated by the insulating material 1142 and do not electrically contact each other. For example, the transceiver parts 1141 are divided into a grid shape by the insulating material 1142, such as squares of the same size, but the present invention is not limited thereto. In other embodiments, the transceiver parts 1141 are not squares, but may be diamonds, circles, triangles or other geometric shapes. In other embodiments, the sizes of the transceiver parts 1141 may not be exactly the same. In other embodiments, some of the transceiver parts 1141 may be connected to each other without being separated by the insulating material 1142. In other embodiments, all the transceiver parts 1141 are connected to each other without being separated by the insulating material 1142.
[0038] like Figure 1 As shown, the conductive layer 116 includes a plurality of conductive portions 1161, and the conductive portions 1161 are separated from each other by an isolation material 1162. Since the conductive portion 1161 and the transceiver portion 1141 can define the appearance at the same time when the cutting machine is cutting, the conductive portion 1161 and the transceiver portion 1141 can have corresponding shapes. Similarly, the conductive portion 1161 is divided into a grid shape by the isolation material 1162, for example, squares of the same size, but the utility model is not limited to this. In other embodiments, the conductive portion 1161 is not a square, but can be a rhombus, a circle, a triangle or other geometric shapes. In other embodiments, the size of the conductive portion 1161 may not be exactly the same.
[0039] According to some embodiments, the material of the conductive layer 118 may include anisotropic conductive adhesive (ACA); anisotropic conductive paste (ACP); anisotropic conductive film (ACF), for example including a plurality of conductive particles 118P.
[0040] Please refer to Figure 2A, the array elements 122 are arranged in a 6×6 array along the first direction D1 and the second direction D2, but the present invention is not limited thereto, and the array elements 122 may be arranged in an array of 8×8, 10×10, or other suitable numbers. The wires 124 are electrically connected to the corresponding array elements 122 in the array elements 122, respectively. In the present embodiment, the array elements 122 are arranged in a symmetrical array, and the area formed by the array 122 has a center point CP and a symmetry axis CL passing through the center point CP, and the extension direction of the symmetry axis CL is parallel to the second direction D2, and the layout pattern of the wires 124 is mirror-symmetrical about the symmetry axis CL, but the present invention is not limited thereto, and in other embodiments, the array elements 122 may be arranged in an asymmetrical array (such as a sparse matrix), and the layout pattern of the wires does not present mirror-symmetry (not shown). As Figure 2A As shown, the wire 124 includes a first wire 1241, a second wire 1242, and an outer wire 1243, and the extension directions of the first wire 1241, the second wire 1242, and the outer wire 1243 are at least partially parallel to the first direction D1. That is, the extension directions of the first wire 1241, the second wire 1242, and the outer wire 1243 can be parallel to each other (the present invention is not limited thereto). The second wire 1242 is adjacent to the first wire 1241, and the outer wire 1243 is adjacent to the second wire 1242. That is, the second wire 1242 is disposed between the first wire 1241 and the outer wire 1243.
[0041] According to some embodiments, there is an offset distance S1 between the first wire 1241 and the second wire 1242 in the second direction D2, and there is an offset distance S2 between the second wire 1242 and the outer wire 1243 in the second direction D2. In this embodiment, the offset distance S1 is equal to the offset distance S2, but the utility model is not limited thereto. In other embodiments, the offset distance S1 is not equal to the offset distance S2, or the first wire 1241, the second wire 1242 and the outer wire 1243 are interlaced with each other without an offset distance.
[0042] In this embodiment, a design is adopted in which three wires (a first wire 1241, a second wire 1242 and an outer wire 1243) are formed as a group, and a total of 12 groups of wires are formed on 36 array elements 122, but the utility model is not limited thereto. The first wire 1241 overlaps with a plurality of corresponding array elements 122 (for example, 3) in the array element 122 in the third direction D3, the second wire 1242 overlaps with a plurality of corresponding array elements 122 (for example, 2) in the array element 122 in the third direction D3, and the outer wire 1243 overlaps with a corresponding array element 122 in the array element 122 in the third direction D3. The first direction D1, the second direction D2 and the third direction D3 may be perpendicular to each other. The length of the first wire 1241 in the first direction D1 is greater than the length of the second wire 1242 in the first direction D1, and the length of the second wire 1242 in the first direction D1 is greater than the length of the outer wire 1243 in the first direction D1.
[0043] Please also refer to Figures 2A to 2D The first conductive wire 1241 includes a first portion 1241a and a second portion 1241b, wherein the first portion 1241a is connected to the array element 122, and the second portion 1241b is connected to the first portion 1241a, wherein the extension direction of the first portion 1241a is parallel to the third direction D3, and the extension direction of the second portion 1241b is parallel to the first direction D1. In this embodiment, the conductive wires 124 are respectively electrically in contact with the upper surface 122a of the array element 122, but the present invention is not limited thereto. Figure 2A As shown, the contact position between the first wire 1241 and the corresponding upper surface 122a is closer to the symmetry axis CL than the contact position between the second wire 1242 and the corresponding upper surface 122a. The contact position between the second wire 1242 and the corresponding upper surface 122a is closer to the symmetry axis CL than the contact position between the outer wire 1243 and the corresponding upper surface 122a. Figure 2D As shown, the maximum height H1 of the first conductor 1241 in the third direction D3 (i.e., the distance between the first conductor 1241 and the bottom surface 120m of the circuit board 120 in the third direction D3) is equal to the maximum height H2 of the second conductor 1242 in the third direction D3 (i.e., the distance between the second conductor 1242 and the bottom surface 120m of the circuit board 120 in the third direction D3), but the utility model is not limited to this. In other embodiments, the heights of the first conductor 1241 and the second conductor 1242 in the third direction D3 may be different from each other.
[0044] According to the present embodiment, since the wire 124 of the ultrasonic transducer 10 is formed in the circuit board 120, it does not need to be formed by a complicated semiconductor process, and the wire 124 includes a horizontal extension direction (i.e., the extension direction of the first direction D1), and does not need to be designed as a three-dimensional wire frame that continuously extends vertically (i.e., the extension direction of the third direction D3), so time and manufacturing costs can be saved, and the volume of the ultrasonic transducer 10 can be saved.
[0045] Figure 2E A partial cross-sectional view of a circuit board 120 of an ultrasonic transducer 20 according to another embodiment of the present invention is shown (corresponding to a cross-sectional view along Figure 2A The circuit board 220 of the ultrasonic transducer 20 is different from the circuit board 120 of the ultrasonic transducer 10 in that the extension direction of the wire 224 is different, and other similar or identical features will not be described again.
[0046] Please refer to Figure 2E The first conductive line 2241 includes a first portion 2241a, a second portion 2241b, and a third portion 2241c. The first portion 2241a is connected to the array element 122, the second portion 2241b is connected to the first portion 2241a, and the third portion 2241c is connected to the second portion 2241b. The first portion 2241a extends in a direction parallel to the first direction D1, the second portion 2241b extends in a direction parallel to the third direction D3, and the third portion 2241c extends in a direction parallel to the first direction D1. The first portion 2241a (eg Figure 2E The contact area between the first portion 1241a (as shown) and the corresponding array element 122 may be larger than that between the first portion 1241a (as shown Figure 2B The contact area between the array element 122 and the corresponding array element 122 is shown.
[0047] Figure 3A A top view of an ultrasonic transducer 30 according to another embodiment of the present invention is shown. Figure 3B Draw along Figure 3A A partial cross-sectional view of the circuit board 320 of the ultrasonic transducer 30 along the line 3B-3B'. Figure 3C Draw along Figure 3A The circuit board 320 of the ultrasonic transducer 30 is a partial cross-sectional view of the 3C-3C' line. The circuit board 320 of the ultrasonic transducer 30 is different from the circuit board 120 of the ultrasonic transducer 10 in that the contact position between the wire 324 and the array element 122 is different. Other similar or similar points will not be described again.
[0048] Please also refer to Figures 3A to 3CThe conductive wire 324 includes a first conductive wire 3241 , a second conductive wire 3242 , and an outer conductive wire 3243 . The first conductive wire 3241 , the second conductive wire 3242 , and the outer conductive wire 3243 are respectively electrically in contact with the side surface 122 s of the corresponding array element 122 .
[0049] Figure 4A A top view of an ultrasonic transducer 40 according to another embodiment of the present invention is shown. Figure 4B Draw along Figure 4A A partial cross-sectional view of the circuit board 420 of the ultrasonic transducer 40 along the line 4B-4B'. Figure 4C Draw along Figure 4A The circuit board 420 of the ultrasonic transducer 40 is a partial cross-sectional view of the 4C-4C' line. The circuit board 420 of the ultrasonic transducer 40 is different from the circuit board 120 of the ultrasonic transducer 10 in that the design of the wire 424 is different. Other similar or identical features will not be described again.
[0050] Please also refer to Figures 4A to 4C The wire 424 includes a first wire 4241, a second wire 4242 and an outer wire 4243. The first wire 4241, the second wire 4242 and the outer wire 4243 are respectively in electrical contact with the upper surface 122a of the corresponding array element 122. Figure 4A As shown, the first wire 4241, the second wire 4242 and the outer wire 4243 are designed to extend coaxially, and can overlap with each other in the first direction D1 (for example, the areas projected on the side (not shown) of the circuit board 420 along the first direction D1 can overlap with each other), and can overlap with each other in the vertical projections in the third direction D3 (for example, the areas projected on the bottom surface 420m of the circuit board 420 along the third direction D3), and can be separated from each other in the third direction D3, and have different heights. Figure 4B As shown, the maximum height H3 of the first conductor 4241 in the third direction D3 (i.e., the distance between the first conductor 4241 and the bottom surface 420m of the circuit board 420 in the third direction D3) may be greater than the maximum height H4 of the second conductor 4242 in the third direction D3 (i.e., the distance between the second conductor 4242 and the bottom surface 420m of the circuit board 420 in the third direction D3).
[0051] Figure 5 A top view of an ultrasonic transducer 50 according to another embodiment of the present invention is shown. The same or similar components in the circuit board 520 of the ultrasonic transducer 50 and the circuit board 120 of the ultrasonic transducer 10 are marked with the same or similar component symbols, have the same or similar materials and functions, and other same or similar aspects will not be described repeatedly.
[0052] Please refer to Figure 5, the array elements 122 are arranged in an 8×8 array along the first direction D1 and the second direction D2. The wires 524 are electrically connected to the corresponding array elements 122 in the array elements 122, respectively. The wires 524 include a first wire 5241, a second wire 5242, a third wire 5243 and a fourth wire 5244. The second wire 5242 is adjacent to the first wire 5241, and the fourth wire 5244 is adjacent to the third wire 5243. In the present embodiment, the extension directions of the first wire 5241 and the second wire 5242 are at least partially parallel to the first direction D1, the extension directions of the third wire 5243 and the fourth wire 5244 are at least partially parallel to the second direction D2, and there is an offset distance S3 between the first wire 5241 and the second wire 5242 in the second direction D2, and there is an offset distance S4 between the third wire 5243 and the fourth wire 5244 in the first direction D1. As Figure 5 As shown, the third wire 5243 includes a first portion 5243a and a second portion 5243b, the first portion 5243a is connected to the corresponding array element 122, the second portion 5243b is connected to the first portion 5243a, the extension direction of the first portion 5243a is parallel to the second direction D2, and the extension direction of the second portion 5243b is parallel to the first direction D1. However, the utility model is not limited thereto, in other embodiments, the extension directions of the first wire 5241 and the second wire 5242 may not be parallel to the first direction D1, the extension directions of the third wire 5243 and the fourth wire 5244 may not be parallel to the second direction D2, the first wire 5241 and the second wire 5242 do not have an offset distance in the second direction D2, and the third wire 5243 and the fourth wire 5244 do not have an offset distance in the first direction D1. In other words, the plurality of wires 524 (including the first wire 5241 to the fourth wire 5243) may be staggered or overlapped at different layers. For example, the first conductive line 5241 and the second conductive line 5242 may overlap each other in the third direction D3 (not shown), and the third conductive line 5243 and the fourth conductive line 5244 may overlap each other in the third direction D3 (not shown).
[0053] Fig. 6A A top view of an ultrasonic transducer 60A according to another embodiment of the present invention is shown. The circuit board 620A of the ultrasonic transducer 60A is different from the circuit board 520 of the ultrasonic transducer 50 in that the circuit board 620A further includes a plurality of dummy wires 128. Other similar or identical features will not be described again.
[0054] Please refer to Fig. 6AThe dummy wire 128 is connected to the corresponding array element 122, wherein the array element 122 includes a first array element 1221 and a second array element 1222 adjacent to each other. The first array element 1221 has a first overlapping area A1 with the wire 524 and the dummy wire 128 in the third direction D3, and the second array element 1222 has a second overlapping area A2 with the wire 524 and the dummy wire 128 in the third direction D3. The first overlapping area A1 is the same as or similar to the second overlapping area A2, for example, A1=A2 or A1 corresponds to A2.
[0055] According to this embodiment, the circuit board 620A of the ultrasonic transducer 60A is added with a dummy wire 128 for counterweight. The dummy wire 128 can be used to balance the acoustic load. In this way, the problem derived from the inconsistent path lengths from each array element 122 to the peripheral power connection (pad) can be overcome, and the acoustic characteristics from the piezoelectric element can be kept comparable.
[0056] Figure 6B A top view of an ultrasonic transducer 60B according to another embodiment of the present invention is shown. The circuit board 620B of the ultrasonic transducer 60B is different from the circuit board 620A of the ultrasonic transducer 60A in that the shape of the array element 122' of the circuit board 620B is different. Other similarities will not be described again.
[0057] Please refer to Figure 6B , the array element 122' is rectangular in the top view. It should be understood that the shape of the array element of the present invention is not limited to a circle (such as Figures 2A to 6A as shown) and rectangle (as Figure 6B ), but may be other suitable shapes.
[0058] like Figure 6B As shown, the dummy conductive line 128' is connected to the corresponding array element 122', wherein the array element 122' includes a first array element 1221' and a second array element 1222' adjacent to each other. The first array element 1221' has a first overlapping area A3 with the conductive line 524' and the dummy conductive line 128' in the third direction D3, and the second array element 1222' has a second overlapping area A4 with the conductive line 524' and the dummy conductive line 128' in the third direction D3. The first overlapping area A3 is the same as or similar to the second overlapping area A4, for example, A3=A4 or A3 and A4 correspond to each other.
[0059] In summary, the utility model provides an ultrasonic transducer. The ultrasonic transducer includes a transducer layer, a conductive layer, a conduction layer and a circuit board. The transducer layer is used to transmit and receive ultrasonic waves. The conductive layer is arranged on the upper surface of the transducer layer or on a side of the transducer layer adjacent to the object to be measured. The conduction layer and the circuit board are arranged on the conductive layer in sequence. The circuit board includes a plurality of array elements and a plurality of wires. The array elements are arranged in an array along a first direction and a second direction. And the wires are electrically connected to corresponding array elements in the array elements, respectively, wherein the wires include a first wire, the extension direction of the first wire is at least partially parallel to the first direction, and the first wire overlaps at least one of the corresponding array elements in the array elements in the third direction, wherein the first direction, the second direction and the third direction are perpendicular to each other. Since the conductors of the ultrasonic transducer of the present invention are formed in the circuit board, they do not need to be formed by complex semiconductor processes, and the conductors include a horizontal extension direction (i.e., the extension direction of the first direction D1), and do not need to be designed as a three-dimensional conductor frame that continues to extend vertically (i.e., the extension direction of the third direction D3), which can save time and production costs, and can also save the volume of the ultrasonic transducer.
[0060] Although the utility model is described in conjunction with the accompanying drawings, the embodiments disclosed in the accompanying drawings are intended to exemplify the preferred embodiments of the utility model and should not be construed as limiting the utility model. In order to clearly describe the required components, the proportions in the schematic drawings do not represent the proportional relationship of the actual components.
[0061] The present invention has been described by the above-mentioned relevant embodiments, however, the above-mentioned embodiments are only examples for implementing the present invention. It must be pointed out that the disclosed embodiments do not limit the scope of the present invention. On the contrary, any changes and modifications made without departing from the spirit and scope of the present invention are within the scope of patent protection of the present invention.
Claims
1. An ultrasonic transducer, characterized in that: include: A transducer layer for transmitting and receiving ultrasound waves; A conductive layer is disposed on the upper surface of the transducer layer or on a side of the transducer layer adjacent to the object to be measured; A conductive layer and a circuit board (120) are sequentially arranged on the conductive layer; The circuit board includes: A plurality of array elements are arranged in an array along a first direction and a second direction; as well as A plurality of conductive wires are electrically connected to corresponding array elements among the plurality of array elements, respectively, wherein the plurality of conductive wires include a first conductive wire, the extension direction of the first conductive wire is at least partially parallel to the first direction, and the first conductive wire overlaps at least one corresponding array element among the plurality of array elements in a third direction, wherein the first direction, the second direction and the third direction are perpendicular to each other.
2. The ultrasonic transducer according to claim 1, characterized in that: The first conductive line includes a first portion and a second portion, the first portion is connected to the array element, the second portion is connected to the first portion, wherein an extending direction of the first portion is parallel to the third direction, and an extending direction of the second portion is parallel to the first direction.
3. The ultrasonic transducer according to claim 1, characterized in that: The first conductive line comprises a first part, a second part (2241b) and a third part, wherein the first part is connected to the array element, the second part is connected to the first part, and the third part is connected to the second part, wherein an extension direction of the first part is parallel to the first direction, an extension direction of the second part is parallel to the third direction, and an extension direction of the third part is parallel to the first direction.
4. The ultrasonic transducer according to claim 1, characterized in that: The plurality of wires further include a second wire, the second wire is adjacent to the first wire, an extension direction of the second wire is at least partially parallel to the first direction, and an offset distance exists between the first wire and the second wire in the second direction.
5. The ultrasonic transducer according to claim 1, characterized in that: The first conductive line is in electrical contact with an upper surface or a side surface of the array element. The normal direction of the upper surface is parallel to the third direction. The side surface is connected to the upper surface.
6. The ultrasonic transducer according to claim 5, characterized in that: The plurality of wires also include a second wire adjacent to the first wire. An extension direction of the second wire is at least partially parallel to the first direction. The first wire and the second wire overlap each other in the first direction and are separated from each other in the third direction.
7. The ultrasonic transducer according to claim 1, characterized in that: The area formed by the multiple arrays has a center point and a symmetry axis passing through the center point. The extension direction of the symmetry axis is parallel to the second direction. The layout patterns of the multiple conductive lines are mirror-symmetrical about the symmetry axis.
8. The ultrasonic transducer according to claim 7, characterized in that: The plurality of wires further include a second wire, a third wire and a fourth wire, the second wire is adjacent to the first wire, and the third wire is adjacent to the fourth wire; The plurality of array elements connected to the first conductive line and the second conductive line are further away from the symmetry axis than the plurality of array elements connected to the third conductive line and the fourth conductive line.
9. The ultrasonic transducer according to claim 8, characterized in that: An extension direction of the second conductive line is at least partially parallel to the first direction, and an extension direction of the third conductive line and an extension direction of the fourth conductive line are at least partially parallel to the second direction.
10. The ultrasonic transducer according to claim 8, characterized in that: The third conductive line and the fourth conductive line overlap each other in the third direction.
11. The ultrasonic transducer according to claim 8, characterized in that: The invention also includes a plurality of dummy conductive wires, which are connected to the corresponding plurality of array elements, wherein the plurality of array elements include a first array element and a second array element which are adjacent to each other, the first array element having a first overlapping area with the plurality of conductive wires and the plurality of dummy conductive wires in the third direction, the second array element having a second overlapping area with the plurality of conductive wires and the plurality of dummy conductive wires in the third direction, and the first overlapping area is equivalent to the second overlapping area.