Board grinding device for manufacturing fine circuit on inner layer of circuit board

Abstract

The utility model discloses a board grinding device for manufacturing a fine circuit on the inner layer of a circuit board, and relates to the technical field of circuit board grinding. According to the circuit board polishing machine, the air pump is turned on, dust removal and scrap removal operation is carried out on the upper surface of the box body and the interior of the adsorption groove through the hose, and the situation that dust or scraps or other impurities exist between the circuit board and the box body and then influence the levelness of the circuit board in the polishing process is avoided; the position of the fixing block is adjusted according to the shape and size of a circuit board needing to be polished, then the adsorption range of the adsorption groove is adjusted, the circuit board is adsorbed and fixed to the box body through the adsorption groove, the folding problem is not prone to occurring, and dust and waste chip removal operation is conducted on the upper surface of the box body and the interior of the adsorption groove through the hose. The problems that when a clamping device of an existing grinding device for circuit board machining is used, the circuit board is possibly damaged in a folded mode, and the grinding precision of the circuit board is affected are solved.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit board grinding, in particular to a grinding device for producing fine circuits in the inner layer of a circuit board. Background Art

[0002] The production of fine inner circuits of circuit boards is an important part of the electronic manufacturing field. It involves high-precision process technology to meet the growing demand for miniaturization and high density of electronic products. For the production and processing of circuit boards, it is necessary not only to grind the board, that is, to grind its surface to achieve the effect of flattening the board surface, but also to carry out certain edge planing operations in the early stage to prevent burrs on the board edges. In this process, the grinding device plays a key role.

[0003] The Chinese patent with patent number CN218450748U discloses a grinding device for PCB circuit board processing, including a base, the internal rotation connection of the base is connected with a rotating shaft, and the rotating shaft runs through the inside of two gears, the two gears are meshed with the tooth grooves of the tooth plate, and the top of the tooth plate is fixedly connected with a positioning plate, the top of the positioning plate is fixedly connected with a clamping device, the top of the base is fixedly connected with a fixing column, and one side of the fixing column is fixedly connected with a fixing rod. The improved grinding device for PCB circuit board processing is beneficial to the grinding device for PCB circuit board processing. After clamping the PCB circuit board, it is aligned with the center line of the grinding wheel for subsequent grinding operations; by controlling the rotation of the adjusting rod, the height of the grinding wheel is adjusted according to the length or width of the PCB circuit board, and the fixed seat is pulled to change the grinding direction, and the grinding work can be carried out on the edge or surface of the PCB circuit board, with high flexibility.

[0004] However, in the implementation of relevant technologies, it was found that the grinding device for PCB circuit board processing of the above-mentioned design has the following problems: when the clamping device fixedly connected to the top of the positioning plate is in use, if the clamping is loose, it will cause the circuit board to fall off during the grinding process; if the clamping is too tight, the circuit board may be damaged after being folded in half. In addition, since it is clamped on both sides of the flat circuit board, the clamping area is small during the process, and there is a high probability that there will be a problem of large clamping force. Therefore, the problem of the circuit board being folded in half due to the large clamping pressure is more likely to occur, which greatly increases the scrap rate. At the same time, waste chips will be generated during the grinding of the circuit board. The waste chips are easy to block the line of sight of relevant staff during the grinding of the circuit board, and thus there is a problem of affecting the grinding accuracy. In view of this, a grinding plate device for the production of fine circuits in the inner layer of a circuit board is provided to overcome the above-mentioned defects. Utility Model Content

[0005] The purpose of the utility model is to provide a grinding device for producing fine circuits on the inner layer of a circuit board, so as to solve the problems raised in the above-mentioned background technology.

[0006] In order to solve the above technical problems, the utility model provides a grinding plate device for making fine circuits on the inner layer of a circuit board, comprising a motor and a grinding wheel, wherein an adsorption groove assembly for fixing the circuit board is arranged below the grinding wheel, and the adsorption groove assembly comprises a box body located below the grinding wheel, an air pump is installed inside the box body, a hose is installed at the air outlet end of the air pump, a cross-shaped adsorption groove is provided on the top of the box body, the air inlet end of the air pump is connected to the center of the adsorption groove, and the inner wall of the adsorption groove is slidably connected to a fixed block which is on the same horizontal plane as the upper surface of the box body.

[0007] Furthermore, the grinding wheel is connected to the driving end of the motor, a first electric telescopic rod is installed on one side of the motor, a second electric telescopic rod is installed on the end of the first electric telescopic rod away from the motor, an anti-falling disc is connected to the top of the second electric telescopic rod, a second fixed plate is connected to the top of the box body, the top of the second fixed plate is connected to the first fixed plate, a rectangular groove is opened on the top of the first fixed plate, and two sliders are horizontally slidably connected to the inner wall of the rectangular groove, and the opposite sides of the two sliders are connected to the outer wall of the second electric telescopic rod.

[0008] Furthermore, the fixed block is provided with a fixed block assembly for positioning it, and the fixed block assembly includes a first cylinder plugged into the top of the fixed block, the bottom of the first cylinder abuts against two triangular blocks, and two second cylinders respectively plugged into the two sides of the fixed block close to the adsorption groove are installed on the opposite sides of the two triangular blocks, two springs are installed between a side of the triangular block perpendicular to the ground and the inner wall of the fixed block, the inner wall of the adsorption groove is provided with a plurality of equally spaced slots for inserting the second cylinder, and the spring in the initial state keeps the second cylinder away from the adsorption groove.

[0009] Furthermore, two symmetrical rectangular blocks are installed on the outer wall of the first cylinder, and a through hole is opened on the top of the fixed block for the first cylinder to slide up and down. The rectangular block is located below the through hole, and the distance between the opposite sides of the two rectangular blocks is greater than the diameter of the through hole.

[0010] Furthermore, heat dissipation holes are provided on both sides of the box, and ventilation nets are installed on the inner walls of the heat dissipation holes. A plurality of switch buttons for controlling the electric device are installed on the front of the box at equal intervals, and the plurality of switch buttons are electrically connected to the motor, the air pump, the first electric telescopic rod and the second electric telescopic rod respectively.

[0011] Furthermore, a dustproof plate and a hinge are provided on the back of the box, one side of the dustproof plate is connected to a limiting block, one side of the limiting block is provided with an elliptical groove, the inner wall of the elliptical groove is slidably connected to a limiting rod, the end of the limiting rod away from the limiting block is clamped with an L-shaped rod, and the L-shaped rod is connected to the back of the box.

[0012] Compared with the prior art, the beneficial effects of the utility model are:

[0013] 1. In the utility model, the air pump is turned on, and the upper surface of the box and the inside of the adsorption groove are dusted and scraps are removed by using a hose, so that impurities such as dust or debris are prevented from existing between the circuit board and the box and affecting the horizontality of the circuit board during the grinding process, thereby improving the grinding accuracy of the circuit board, ensuring the product quality of the circuit board after production, and reducing the scrap rate. After the dust removal is completed, the position of the fixing block is adjusted according to the shape and size of the circuit board to be polished, and then the adsorption range of the adsorption groove is adjusted, and the air pump is turned on, and the circuit board is adsorbed and fixed on the box through the adsorption groove, which improves the stability of the circuit board when the grinding wheel is grinding the circuit board. The design of the cross-shaped groove makes the circuit board more evenly stressed and less prone to folding. After the grinding is completed, the air pump is turned on again, and the upper surface of the box and the inside of the adsorption groove are dusted and scraps are removed by using a hose, so that the grinding device is neater and cleaner, and the cleaning time before the next use of the grinding device is reduced, which solves the problem that the clamping device of the existing circuit board processing grinding device may cause damage to the circuit board during use and affect the accuracy of the circuit board.

[0014] 2. In the utility model, when the circuit board is placed on the first cylinder, the first cylinder slides downward under pressure, and the bottom of the first cylinder applies pressure to the two triangular blocks, so that the two triangular blocks move away from each other, causing the springs on the triangular blocks to be squeezed and compressed and deformed, and the second cylinders on the two triangular blocks approach the adsorption groove and snap into the slots of the adsorption groove, so that the fixed block can be fixed on the adsorption groove, thereby achieving the effect of adjusting the adsorption area of ​​the adsorption groove. When the circuit board is taken away, the elastic reset principle of the spring is used to move the second cylinder away from the adsorption groove, and the second cylinder cannot be inserted into the slot of the adsorption groove, so that the fixed block can slide on the adsorption groove and change its position. Therefore, the user can adjust the position of the fixed block in the adsorption groove according to the size of the circuit board, so as to facilitate the adsorption of circuit boards of different sizes.

[0015] 3. In the utility model, the motor is started during grinding to make the grinding wheel rotate rapidly, and friction is generated when it contacts the circuit board, thereby achieving a grinding effect. The first electric telescopic rod and the second electric telescopic rod are used, and the slider is made to slide left and right in the rectangular groove to achieve the effect of grinding the circuit board at different positions and angles by the grinding wheel, thereby facilitating the grinding of the entire upper surface of the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a schematic diagram of the overall structure of the grinding plate device used for manufacturing fine circuits on the inner layer of a circuit board according to the utility model;

[0017] Figure 2 This is a schematic diagram of the rear side structure of the grinding plate device used for manufacturing fine circuits on the inner layer of a circuit board according to the utility model;

[0018] Figure 3 This is a schematic diagram of the cross groove base structure of the grinding plate device used for manufacturing fine circuits on the inner layer of a circuit board according to the utility model;

[0019] Figure 4 This is a schematic diagram of the internal structure of the fixed block of the grinding device used for making fine circuits on the inner layer of a circuit board according to the utility model;

[0020] Figure 5 for Figure 1 A magnified view of the structure at center A;

[0021] Figure 6 for Figure 1 A magnified view of the structure at point B.

[0022] In the figure: 1. motor; 2. grinding wheel; 3. adsorption tank assembly; 301. box; 302. air pump; 303. adsorption tank; 304. fixed block; 305. hose; 4. fixed block assembly; 401. first cylinder; 402. rectangular block; 403. spring; 404. second cylinder; 405. triangular block; 5. handle; 6. first electric telescopic rod; 7. second electric telescopic rod; 8. slider; 9. anti-falling disc; 10. rectangular groove; 11. first fixed plate; 12. second fixed plate; 13. ventilation net; 14. switch button; 15. dustproof plate; 16. hinge; 17. limit block; 18. L-shaped rod; 19. limit rod. DETAILED DESCRIPTION

[0023] In order to make the purpose, technical solutions and advantages of the embodiments of the utility model clearer, the technical solutions in the embodiments will be clearly and completely described below in conjunction with the drawings in the embodiments of the utility model. The following embodiments are used to illustrate the utility model but are not used to limit the scope of the utility model. Embodiment 1

[0024] Depend on Figure 1-Figure 6 The utility model provides a grinding device for producing fine circuits on the inner layer of a circuit board.

[0025] Specifically, by Figure 1 , Figure 2 , Figure 3 , Figure 6The invention provides a method for fixing a circuit board by using a motor 1 and a grinding wheel 2. The grinding wheel 2 is provided with an adsorption slot assembly 3 for fixing a circuit board. The adsorption slot assembly 3 includes a box body 301 located below the grinding wheel 2. An air pump 302 is installed inside the box body 301. A hose 305 is installed at the air outlet of the air pump 302. A cross-shaped adsorption slot 303 is provided on the top of the box body 301. The air inlet of the air pump 302 is connected to the center of the adsorption slot 303. A fixing block 304 which is in the same horizontal plane as the upper surface of the box body 301 is slidably connected to the inner wall of the adsorption slot 303.

[0026] It should be noted that the adsorption groove 303 can also be in the shape of a cross, and each branch in the cross structure is connected to the center point to form a stable network. This structure can ensure uniform support in all directions, reducing the possibility of deformation or damage caused by uneven force. In addition, the cross structure can better resist torsion and bending forces because it provides more paths to disperse these forces, so that the circuit board is more evenly stressed and less likely to be folded;

[0027] Both sides of the box body 301 are provided with heat dissipation openings, and the inner wall of the heat dissipation openings is installed with ventilation nets 13. A plurality of switch buttons 14 for controlling the electric device arranged at equal intervals are installed on the front of the box body 301, and the plurality of switch buttons 14 are electrically connected to the motor 1, the air pump 302, the first electric telescopic rod 6 and the second electric telescopic rod 7 respectively; the ventilation net 13 is a mesh ventilation structure, so the internal air of the box body 301 is circulated with the internal air, so that the heat generated by the air pump 302 when starting can flow to the outside of the box body 301, which is beneficial to better heat dissipation of the air pump 302 when starting, and ensures the normal use of the air pump 302. The plurality of switch buttons 14 are electrically connected to the motor 1, the air pump 302, the first electric telescopic rod 6 and the second electric telescopic rod 7 respectively; the ventilation net 13 is a mesh ventilation structure, so the internal air of the box body 301 is circulated with the internal air, so that the heat generated by the air pump 302 when starting can flow to the outside of the box body 301, which is beneficial to better heat dissipation of the air pump 302 when starting, and ensures the normal use of the air pump 302. 1. The air pump 302, the first electric telescopic rod 6 and the second electric telescopic rod 7 are electrically connected, which is convenient for better controlling different electrical devices respectively; a dustproof plate 15 and a hinge 16 are arranged on the back of the box 301, one side of the dustproof plate 15 is connected to a limit block 17, one side of the limit block 17 is provided with an elliptical groove, the inner wall of the elliptical groove is slidably connected to a limit rod 19, and the end of the limit rod 19 away from the limit block 17 is clamped with an L-shaped rod 18, and the L-shaped rod 18 is connected to the back of the box 301; the two hinges 16 enable the dustproof plate 15 to be opened and closed freely, which is convenient for the installation and replacement of the air pump 302, and extends the service life of the grinding device. The elliptical groove design can not only make the limit rod 19 clamped in the limit block 17 and the L-shaped rod 18 to fix the dustproof plate 15 and make the polishing device more beautiful, but also make it convenient for people to use the groove to pull the dustproof plate 15, which is more time-saving and labor-saving; before polishing the circuit board, the user turns on the air pump 302 and uses the hose 305 to remove dust and waste chips from the upper surface of the box 301 and the inside of the adsorption groove 303 to avoid impurities such as dust or debris existing between the circuit board and the box 301 and affecting the horizontality of the circuit board during the polishing process, thereby improving the polishing accuracy of the circuit board, ensuring the product quality of the circuit board after production, and reducing the scrap rate. After the dust is removed, adjust the position of the fixing block 304 according to the shape and size of the circuit board to be polished, and then adjust the adsorption range of the adsorption slot 303, turn on the air pump 302, and fix the circuit board on the box 301 through the adsorption slot 303, which improves the stability of the circuit board when the grinding wheel 2 polishes the circuit board. The cross-shaped groove design makes the circuit board more evenly stressed and less prone to folding. After the polishing is completed, turn on the air pump 302 again, and use the hose 305 to remove dust and waste chips from the upper surface of the box 301 and the inside of the adsorption slot 303, so that the polishing device is neater and cleaner, and the cleaning time before the next use of the polishing device is reduced. Embodiment 2

[0028] On the basis of the first embodiment, further, as a specific implementation mode of the present invention, the present invention provides a grinding device for manufacturing fine circuits in the inner layer of a circuit board.

[0029] Specifically, by Figure 3 , Figure 4 It is shown that a fixed block assembly 4 for positioning the fixed block 304 is provided on the fixed block 304, and the fixed block assembly 4 includes a first cylinder 401 plugged into the top of the fixed block 304, and two triangular blocks 405 are abutted against the bottom of the first cylinder 401, and two second cylinders 404 respectively plugged into the two sides of the fixed block 304 close to the adsorption groove 303 are installed on the two opposite sides of the two triangular blocks 405, and two springs 403 are installed between a side of the triangular block 405 perpendicular to the ground and the inner wall of the fixed block 304, and a plurality of slots with equal spacing for the second cylinder 404 to be inserted into the inner wall of the adsorption groove 303 are provided, and the springs 403 in the initial state keep the second cylinder 404 away from the adsorption groove 303;

[0030] Two symmetrical rectangular blocks 402 are installed on the outer wall of the first cylinder 401. A through hole is opened on the top of the fixed block 304 for the first cylinder 401 to slide up and down. The rectangular block 402 is located below the through hole, and the distance between the two opposite sides of the two rectangular blocks 402 is greater than the diameter of the through hole; the two rectangular blocks 402 are located below the through hole and the distance between the two opposite sides of the two rectangular blocks 402 is greater than the diameter of the through hole, so that when the first cylinder 401 slides upward, the rectangular blocks 402 on the outer wall cannot slide out of the fixed block 304, so that the first cylinder 401 cannot be separated from the fixed block 304, achieving an anti-falling effect; when the circuit board is placed on the first cylinder 401, the first cylinder 401 slides downward under pressure, and the bottom of the first cylinder 401 applies pressure to the two triangular blocks 405 , so that the two triangular blocks 405 move away from each other, causing the spring 403 on the triangular block 405 to be squeezed and compressed and deformed, and the second cylinders 404 on the two triangular blocks 405 approach the adsorption groove 303 and snap into the slot of the adsorption groove 303, so that the fixed block 304 can be fixed on the adsorption groove 303, thereby achieving the effect of adjusting the adsorption area of ​​the adsorption groove 303. When the circuit board is taken away, the elastic reset principle of the spring 403 is utilized to make the second cylinder 404 move away from the adsorption groove 303, and the second cylinder 404 cannot be inserted into the slot of the adsorption groove 303, so that the fixed block 304 can slide on the adsorption groove 303 and change its position. Therefore, the user can adjust the position of the fixed block 304 in the adsorption groove 303 according to the size of the circuit board, so as to facilitate the adsorption of circuit boards of different sizes. Embodiment 3

[0031] On the basis of the first embodiment, further, as a specific implementation mode of the present invention, the present invention provides a grinding device for manufacturing fine circuits in the inner layer of a circuit board.

[0032] Specifically, by Figure 1 , Figure 2 , Figure 3 , Figure 5The grinding wheel 2 is connected to the driving end of the motor 1, a first electric telescopic rod 6 is installed on one side of the motor 1, a second electric telescopic rod 7 is installed on the end of the first electric telescopic rod 6 away from the motor 1, an anti-falling disc 9 is connected to the top of the second electric telescopic rod 7, a second fixing plate 12 is connected to the top of the box body 301, a first fixing plate 11 is connected to the top of the second fixing plate 12, a rectangular groove 10 is opened on the top of the first fixing plate 11, two sliders 8 are horizontally slidably connected to the inner wall of the rectangular groove 10, and the opposite sides of the two sliders 8 are connected to the outer wall of the second electric telescopic rod 7;

[0033] A handle 5 is installed on the top of the motor 1, and a rubber sleeve is installed on the outer wall of the handle 5. The outer surface of the rubber sleeve is integrally formed with anti-skid particles; the handle 5 is located above the motor 1 to avoid the risk of accidentally touching the grinding wheel 2 when the motor 1 is moved by hand during use, thereby improving the safety of the grinding device. During the process, the handle 5 is grasped so that the hand can better apply force, thereby facilitating better adjustment of the position of the grinding wheel 2. The outer wall of the handle 5 is installed with a rubber sleeve to avoid hard contact between the hand and the handle 5, thereby improving the comfort of the hand in the process of grasping the handle 5. The anti-skid particles increase the friction between the hand and the rubber sleeve, thereby avoiding the phenomenon of slipping off the hand; when grinding, the motor 1 is started to make the grinding wheel 2 rotate rapidly, generating friction when it contacts the circuit board Thereby, a grinding effect is achieved. The telescopic movement of the first electric telescopic rod 6 is convenient for adjusting the front and rear positions of the grinding wheel 2, and the telescopic movement of the second electric telescopic rod 7 is convenient for adjusting the height of the grinding wheel 2. The slider 8 slides left and right in the rectangular groove 10 to facilitate adjusting the left and right positions of the grinding wheel 2, thereby achieving the effect of the grinding wheel 2 grinding different positions and angles of the circuit board, thereby facilitating the grinding of the entire upper surface of the circuit board. The anti-falling disc 9 is located above the first fixed plate 11. Because the diameter of the anti-falling disc 9 is greater than the width of the rectangular groove 10, the anti-falling disc 9 cannot slide out of a horizontal position below the first fixed plate 11, thereby avoiding the hidden danger of the second electric telescopic rod 7 falling off during use, and increasing the safety of the grinding device.

[0034] Working principle:

[0035] Before the user polishes the circuit board, the air pump 302 is turned on, and the upper surface of the box 301 and the interior of the adsorption tank 303 are dusted and scraps are removed by using the hose 305 to prevent dust or scraps and other impurities from being present between the circuit board and the box 301 and affecting the levelness of the circuit board during the polishing process, thereby improving the polishing accuracy of the circuit board, ensuring the product quality of the circuit board after production, and reducing the scrap rate. After the dust removal is completed, the position of the fixing block 304 is adjusted according to the shape and size of the circuit board to be polished, and then the suction is adjusted. Within the adsorption range of the attachment groove 303, the air pump 302 is turned on, and the circuit board is adsorbed and fixed on the box body 301 through the adsorption groove 303, which improves the stability of the circuit board when the grinding wheel 2 grinds the circuit board. The design of the cross-shaped groove makes the circuit board more evenly stressed and less prone to folding. After grinding, the air pump 302 is turned on again, and the hose 305 is used to remove dust and waste chips from the upper surface of the box body 301 and the interior of the adsorption groove 303, making the grinding device tidier and cleaner, and reducing the cleaning time before the next use of the grinding device.

[0036] When the circuit board is placed on the first cylinder 401, the first cylinder 401 slides downward under pressure, and the bottom of the first cylinder 401 applies pressure to the two triangular blocks 405, so that the two triangular blocks 405 move away from each other, causing the springs 403 on the triangular blocks 405 to be squeezed and compressed and deformed, and the second cylinders 404 on the two triangular blocks 405 approach the adsorption groove 303 and snap into the slot of the adsorption groove 303, so that the fixed block 304 can be fixed on the adsorption groove 303, thereby achieving the effect of adjusting the adsorption area of ​​the adsorption groove 303. When the circuit board is removed, the elastic reset principle of the spring 403 is used to make the second cylinder 404 move away from the adsorption groove 303, and the second cylinder 404 cannot be inserted into the slot of the adsorption groove 303, so that the fixed block 304 can slide on the adsorption groove 303 to change its position. Therefore, the user can adjust the position of the fixed block 304 in the adsorption groove 303 according to the size of the circuit board, so as to facilitate the adsorption of circuit boards of different sizes.

[0037] When grinding, the motor 1 is started to make the grinding wheel 2 rotate rapidly, and friction is generated when it contacts the circuit board, thereby achieving a grinding effect. The telescopic movement of the first electric telescopic rod 6 is convenient for adjusting the front and rear position of the grinding wheel 2, and the telescopic movement of the second electric telescopic rod 7 is convenient for adjusting the height of the grinding wheel 2. The slider 8 slides left and right in the rectangular groove 10 to facilitate adjusting the left and right position of the grinding wheel 2, thereby achieving the effect of the grinding wheel 2 grinding different positions and angles of the circuit board, thereby facilitating the grinding of the entire upper surface of the circuit board. The anti-falling disc 9 is located above the first fixed plate 11. Because the diameter of the anti-falling disc 9 is larger than the width of the rectangular groove 10, the anti-falling disc 9 cannot slide out of a horizontal position below the first fixed plate 11, thereby avoiding the hidden danger of the second electric telescopic rod 7 falling off during use, thereby increasing the safety of the grinding device.

[0038] The above is only a preferred embodiment of the present invention, and does not constitute any form of limitation to the present invention. Although the present invention has been disclosed as a preferred embodiment as above, it is not intended to limit the present invention. Any technician familiar with this patent can make some changes or modifications to equivalent embodiments of equivalent changes using the technical content suggested above without departing from the scope of the technical solution of the present invention. The implementation schemes in the above embodiments can also be further combined or replaced. However, any simple modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention without departing from the content of the technical solution of the present invention are still within the scope of the present invention.

Claims

1. A grinding device for producing fine circuits on the inner layer of a circuit board, comprising a motor (1) and a grinding wheel (2), wherein an adsorption groove assembly (3) for fixing the circuit board is arranged below the grinding wheel (2), and characterized in that: The adsorption tank assembly (3) comprises a box (301) located below the grinding wheel (2), an air pump (302) is installed inside the box (301), a hose (305) is installed at the air outlet of the air pump (302), a cross-shaped adsorption tank (303) is opened on the top of the box (301), an air inlet of the air pump (302) is connected to the center of the adsorption tank (303), and a fixed block (304) is slidably connected to the inner wall of the adsorption tank (303) and is in the same horizontal plane as the upper surface of the box (301).

2. The grinding device for producing fine circuits on the inner layer of a circuit board according to claim 1, characterized in that: The grinding wheel (2) is connected to the driving end of the motor (1); a first electric telescopic rod (6) is installed on one side of the motor (1); a second electric telescopic rod (7) is installed on the end of the first electric telescopic rod (6) away from the motor (1); a top of the second electric telescopic rod (7) is connected to an anti-drop disc (9); a second fixing plate (12) is connected to the top of the box (301); a first fixing plate (11) is connected to the top of the second fixing plate (12); a rectangular groove (10) is formed on the top of the first fixing plate (11); two sliders (8) are horizontally slidably connected to the inner wall of the rectangular groove (10); and opposite sides of the two sliders (8) are connected to the outer wall of the second electric telescopic rod (7).

3. The grinding device for producing fine circuits on the inner layer of a circuit board according to claim 2, characterized in that: The fixed block (304) is provided with a fixed block assembly (4) for positioning the fixed block, the fixed block assembly (4) comprising a first cylinder (401) plugged into the top of the fixed block (304), the bottom of the first cylinder (401) abutting against two triangular blocks (405), two second cylinders (404) respectively plugged into the two sides of the fixed block (304) close to the adsorption groove (303) are installed on the two opposite sides of the two triangular blocks (405), two springs (403) are installed between a side of the triangular block (405) perpendicular to the ground and an inner wall of the fixed block (304), the inner wall of the adsorption groove (303) is provided with a plurality of slots with equal spacing for the second cylinders (404) to be inserted, and the springs (403) in an initial state keep the second cylinder (404) away from the adsorption groove (303).

4. The grinding device for producing fine circuits on the inner layer of a circuit board according to claim 3, characterized in that: Two mutually symmetrical rectangular blocks (402) are mounted on the outer wall of the first cylinder (401); a through hole is provided on the top of the fixed block (304) for the first cylinder (401) to slide up and down; the rectangular block (402) is located below the through hole; and the distance between the two opposite sides of the two rectangular blocks (402) is greater than the diameter of the through hole.

5. The grinding device for producing fine circuits on the inner layer of a circuit board according to claim 4, characterized in that: Both sides of the box body (301) are provided with heat dissipation openings, the inner walls of the heat dissipation openings are provided with ventilation nets (13), and a plurality of switch buttons (14) for controlling the electric device arranged at equal intervals are provided on the front of the box body (301), and the plurality of switch buttons (14) are electrically connected to the motor (1), the air pump (302), the first electric telescopic rod (6), and the second electric telescopic rod (7), respectively.

6. The grinding device for producing fine circuits on the inner layer of a circuit board according to claim 5, characterized in that: The back of the box body (301) is provided with a dustproof plate (15) and a hinge (16); one side of the dustproof plate (15) is connected to a limit block (17); one side of the limit block (17) is provided with an elliptical groove; the inner wall of the elliptical groove is slidably connected to a limit rod (19); an end of the limit rod (19) away from the limit block (17) is clamped with an L-shaped rod (18); and the L-shaped rod (18) is connected to the back of the box body (301).

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