Circuit board transfer frame

Abstract

The utility model relates to the field of circuit board manufacturing, in particular to a circuit board transfer frame. The device comprises a bottom plate, two parallel baffles are fixedly connected to the bottom plate, the baffles are perpendicular to the bottom plate, the two baffles are located on the two sides of the bottom plate respectively, a first corrugated plate and a second corrugated plate are arranged between the two baffles, and the first corrugated plate and the second corrugated plate are perpendicular to the bottom plate and the baffles. The first corrugated plate is fixedly connected with the baffle, the second corrugated plate is slidably connected with the baffle in the direction parallel to the bottom plate, a circuit board is placed between the first corrugated plate and the second corrugated plate, the baffle is parallel to the circuit board, and the circuit board transfer frame further comprises a shielding mechanism. According to the circuit board baking device, the baked circuit board can be quickly transferred, and the production efficiency is improved.

Description

Technical Field

[0001] The present application relates to the field of circuit board manufacturing, and in particular to a circuit board transfer rack. Background Art

[0002] Printed circuit boards are one of the important components of the electronics industry. They are not only the support of electronic components, but also the carrier of electrical connections of electronic components. The production process of circuit boards is complicated, and printing solder mask ink on circuit boards is one of the important processes in making circuit boards. Printing solder mask ink on circuit boards to form a solder mask layer can provide long-term insulation environment and chemical resistance protection for the circuit boards.

[0003] After printing solder mask ink, pre-baking, exposure, development and post-baking operations are required. During the transportation to the next process, large particles of dust and impurities on the floor of the workshop are easy to come into contact with the surface of the circuit board. Since the temperature of the baked circuit board is high, the impurities are easy to adhere to the circuit board after contacting the circuit board. The impurities on the surface of the circuit board will affect the quality of the circuit board in the subsequent process. At present, in order to reduce the adverse effects of impurities on the circuit board, after the solder mask ink is baked, it is usually left to stand in a clean area and transported after the circuit board cools down, which is inefficient. Utility Model Content

[0004] In order to transfer the baked circuit board more quickly, the present application provides a circuit board transfer rack.

[0005] The present application provides a circuit board transfer rack, which adopts the following technical solution:

[0006] A circuit board transfer rack comprises a base plate, to which two parallel baffles are fixedly connected, the baffles are perpendicular to the base plate, the two baffles are respectively located on both sides of the base plate, a first corrugated plate and a second corrugated plate are arranged between the two baffles, the first corrugated plate and the second corrugated plate are perpendicular to the base plate and the baffles, the first corrugated plate is fixedly connected to the baffle, the second corrugated plate is slidably connected to the baffle in a direction parallel to the base plate, the circuit board is placed between the first corrugated plate and the second corrugated plate, the baffles are parallel to the circuit board, and the circuit board transfer rack also comprises a shielding mechanism.

[0007] In the prior art, the circuit board transfer rack is usually a frame welded by multiple support rods. By adopting the above technical solution, the bottom of the circuit board transfer rack is a base plate, so that the circuit board placed in the circuit board transfer rack is separated from the workshop floor, and large dust particles on the workshop floor are not easy to contact the circuit board. The baked circuit board is placed between the first corrugated plate and the second corrugated plate. The base plate protects the circuit board from the bottom to reduce the contact between the ground impurities and the circuit board. The baffle is parallel to the circuit board and shields the surface of the circuit board to reduce the contact between impurities in the air and the surface of the circuit board. The shielding mechanism can shield and protect the circuit board from the top. In the process of transporting the circuit board, air can flow from both sides where the baffle is not set to cool the circuit board. The circuit board can be directly transported after baking, which improves work efficiency.

[0008] Optionally, two groups of dustproof ventilation components are arranged between the two baffles, and the two groups of dustproof ventilation components are respectively located on both sides of the base plate, and the dustproof ventilation components include a first dustproof plate and a second dustproof plate, and the first dustproof plate and the second dustproof plate are perpendicular to the base plate and the baffle; the first dustproof plate and the second dustproof plate are both provided with multiple ventilation grooves, and the ventilation grooves on the first dustproof plate and the ventilation grooves on the second dustproof plate are staggered.

[0009] By adopting the above technical solution, the first dustproof plate and the second dustproof plate can reduce the contact between impurities in the air and the surface of the circuit board, and by providing ventilation slots, air can cool the circuit boards in the circuit board transfer rack. The ventilation slots on the first dustproof plate and the ventilation slots on the second dustproof plate are arranged alternately, which can reduce dust impurities from entering through the ventilation slots and adhering to the surface of the circuit board.

[0010] Optionally, a sliding rod is fixedly connected to the baffle plate, a sliding sleeve is fixedly connected to the second corrugated plate, the sliding rod is arranged parallel to the bottom plate, the sliding sleeve is arranged on the sliding rod, and the sliding sleeve is fixedly connected to the sliding rod by bolts.

[0011] By adopting the above technical solution, the circuit board transfer rack can transfer circuit boards of different sizes. By sliding the second corrugated plate and adjusting the distance between the first corrugated plate and the second corrugated plate, circuit boards of different sizes can be placed in the circuit transfer rack.

[0012] Optionally, the shielding mechanism includes a supporting assembly and a flexible cloth, wherein the supporting assembly is disposed on the baffle plate for supporting the flexible cloth, and the flexible cloth is used to shield the circuit board placed between the first corrugated plate and the second corrugated plate.

[0013] By adopting the above technical solution, after the circuit board is placed in the circuit board transfer rack, the whole is covered with flexible cloth to block impurities. The support frame props up the flexible cloth so that there is a certain gap between the circuit board and the flexible cloth, thereby ensuring the ventilation effect in the circuit board transfer rack.

[0014] Optionally, the support assembly includes a first support rod and a second support rod, the first support rod is rotatably connected to the baffle, the second support rod is rotatably connected to the first support rod, and the first support rod, the second support rod and the side of the baffle form a triangular support structure.

[0015] By adopting the above technical solution, the first support rod, the second support rod and the side of the baffle form a triangular support structure, so that the support assembly can stably support the flexible cloth during transportation.

[0016] Optionally, the support assembly further includes an auxiliary support rod, the auxiliary support rod is rotatably connected to the baffle, and the auxiliary support rod is used to support the flexible cloth so that the flexible cloth does not contact the circuit board.

[0017] By adopting the above technical solution and providing auxiliary supports, the flexible cloth can be better supported and the flexible cloth is not easy to contact with the circuit board.

[0018] Optionally, the shielding mechanism further includes a storage shaft, the storage shaft is rotatably connected to the baffle, one end of the flexible cloth is fixedly connected to the storage shaft, and the flexible cloth is wound around the storage shaft.

[0019] By adopting the above technical solution, the flexible cloth can be wound and stored by rotating the storage shaft. In a workshop with less dust and impurities, the flexible cloth can be stored to make the air more circulated, thereby accelerating the cooling of the circuit board.

[0020] Optionally, a forklift slot is provided on the bottom plate.

[0021] By adopting the above technical solution, a forklift groove is opened on the bottom plate, which is convenient for forklifts to transport the circuit board transfer rack.

[0022] In summary, the present application includes at least one of the following beneficial technical effects:

[0023] 1. The bottom plate protects the circuit board from the bottom to reduce the contact between the ground impurities and the circuit board. The baffle is parallel to the circuit board and shields the surface of the circuit board to reduce the contact between impurities in the air and the circuit board surface. The shielding mechanism can shield and protect the circuit board from the top. During the transportation of the circuit board, air can flow from both sides where the baffle is not set to cool the circuit board. The circuit board can be directly transported after baking, which improves work efficiency.

[0024] 2. The first dustproof plate and the second dustproof plate can reduce the contact between impurities in the air and the surface of the circuit board. By opening ventilation slots, air can cool the circuit boards in the circuit board transfer rack. The ventilation slots on the first dustproof plate and the ventilation slots on the second dustproof plate are arranged alternately, which can reduce dust impurities from entering through the ventilation slots and sticking to the surface of the circuit board.

[0025] 3. The circuit board transfer rack can transfer circuit boards of different sizes.

[0026] 4. In a workshop with less dust and impurities, put up flexible cloth to allow more air circulation and accelerate the cooling of the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 It is a schematic diagram of the overall structure of the circuit board transfer rack.

[0028] Figure 2 This is an exploded view of the partial structure of the circuit board transfer rack.

[0029] Figure 3 yes Figure 1 A magnified view of the structure of part A.

[0030] Explanation of the reference numerals: 110, bottom plate; 111, forklift slot; 120, baffle; 121, avoidance slot; 130, dustproof ventilation assembly; 131, first dustproof plate; 132, second dustproof plate; 133, ventilation slot; 141, first corrugated plate; 142, second corrugated plate; 210, sliding rod; 220, sliding sleeve; 300, shielding mechanism; 310, support assembly; 311, first support rod; 312, second support rod; 313, auxiliary support rod; 320, storage shaft; 330, flexible cloth. DETAILED DESCRIPTION

[0031] The following is combined with Figure 1-3 , further details of this application are given.

[0032] An embodiment of the present application discloses a circuit board transfer rack.

[0033] Reference Figure 1 The circuit board transfer rack includes a bottom plate 110 , a baffle 120 , a dustproof ventilation assembly 130 , a first corrugated plate 141 , a second corrugated plate 142 and a shielding mechanism 300 .

[0034] Reference Figure 1The bottom plate 110 can be placed on the ground, the bottom plate 110 is set horizontally, and two forklift slots 111 are provided on the side of the bottom plate 110 close to the ground. The fork legs of the forklift can be inserted into the forklift slots to lift the circuit board transfer rack for easy transportation. There are usually a lot of dust and impurities on the ground inside the workshop. The bottom of the road board transfer rack is the bottom plate 110, which separates the circuit boards placed in the circuit board transfer rack from the workshop floor, and large dust particles on the workshop surface are not easy to contact the circuit boards.

[0035] Reference Figure 1 , two baffles 120 are provided, the baffles 120 are vertically arranged and fixedly connected to the bottom plate 110. The two baffles 120 are respectively arranged on two parallel sides of the bottom plate 110, and the two baffles 120 are arranged in parallel. The baffles 120 are parallel to the circuit boards placed in the circuit board transfer rack. The baffles 120 can protect the surface of the circuit board and reduce dust impurities from adhering to the surface of the circuit board.

[0036] Reference Figure 1 and Figure 2 , a dustproof ventilation assembly 130 is provided on the two sides of the bottom plate 110 where the baffle 120 is not provided. The dustproof ventilation assembly 130 includes a first dustproof plate 131 and a second dustproof plate 132 which are vertically provided. The first dustproof plate 131 and the second dustproof plate 132 are arranged in parallel and are both fixedly connected to the bottom plate 110. The first dustproof plate 131 and the second dustproof plate 132 are arranged vertically and perpendicular to the baffle 120. A plurality of parallel ventilation slots 133 are provided on the first dustproof plate 131 and the second dustproof plate 132. In this embodiment, the ventilation slots 133 are provided vertically, and in other embodiments, the ventilation slots 133 can also be provided horizontally. The ventilation slots 133 on the first dustproof plate 131 and the ventilation slots 133 on the second dustproof plate 132 are arranged alternately. The first dustproof plate 131 and the second dustproof plate 132 can reduce the contact between impurities in the air and the surface of the circuit board, and reduce the possibility of impurities entering and contacting the circuit board from the two sides where the baffle 120 is not provided. By providing the staggered ventilation slots 133, air can circulate to cool the circuit boards in the circuit board transfer rack.

[0037] Reference Figure 1 and Figure 2, the first corrugated plate 141 is vertically arranged and parallel to the first dustproof plate 131, and the first corrugated plate 141 is fixedly connected between the two baffles 120. The side of the first corrugated plate 141 facing the inside of the circuit board transfer rack is a wavy curved surface. The area of ​​the first corrugated plate 141 is smaller than the area of ​​the first dustproof plate 131. The side of the second corrugated plate 142 facing the first corrugated plate 141 is a wavy curved surface. The second corrugated plate 142 can slide in a direction parallel to the baffle 120. A horizontally arranged sliding rod 210 is fixedly connected to the baffle 120, and sliding sleeves 220 are fixedly connected on both sides of the second corrugated plate 142, and the sliding sleeves 220 are arranged on the corresponding sliding rods 210. The sliding sleeves 220 and the sliding rods 210 can be fixedly connected by bolts, so that the position of the second corrugated plate 142 is fixed. By sliding the second corrugated plate 142, the distance between the first corrugated plate 141 and the second corrugated plate 142 is adjusted, so that circuit boards of different sizes can be placed in the circuit transfer rack. In order to facilitate the adjustment of the staff, the sliding sleeve 220 is set on the outside of the baffle 120, so the baffle 120 is horizontally provided with an avoidance groove 121. The circuit board can be placed between the first corrugated plate 141 and the second corrugated plate 142, and the circuit board is parallel to the baffle 120.

[0038] Reference Figure 1 and Figure 3 , the shielding mechanism 300 includes a support assembly 310, a storage shaft 320 and a flexible cloth 330. The support assembly 310 includes a first support rod 311, a second support rod 312 and an auxiliary support rod 313. One end of the first support rod 311 is rotatably connected to the upper vertex of the baffle 120; the other end is rotatably connected to the second support rod 312. The end of the second support rod 312 away from the first support rod 311 can abut against the side of the baffle 120. In this embodiment, the second support rod 312 can be rotated to a vertical state, so that the first support rod 311, the second support rod 312 and the side of the baffle 120 form a triangular support structure. The auxiliary support rod 313 is rotatably connected to the baffle 120, and multiple auxiliary support rods 313 can be provided.

[0039] Reference Figure 1 and Figure 3 The storage shaft 320 is horizontally arranged and perpendicular to the baffle 120 . The storage shaft 320 is rotatably connected to the baffle 120 , and one end of the flexible cloth 330 is fixedly connected to the storage shaft 320 , and the flexible cloth 330 can be wound around the storage shaft 320 .

[0040] When there is a lot of dust in the workshop, the first support rod 311 and the second support rod 312 are rotated to form a triangular support structure, and the flexible cloth 330 is pulled so that the flexible cloth 330 covers the support assembly 310. Through the auxiliary support rod 313, a gap can be created between the flexible cloth 330 and the circuit board, allowing ventilation and cooling. The flexible cloth 330 forms a shield above the circuit board, further reducing the possibility of dust falling into the circuit board transfer rack. When the workshop is relatively tidy, the storage shaft 320 can be rotated to roll and store the flexible cloth 330. The support assembly 310 can also be rotated for storage.

[0041] The implementation principle of a circuit board transfer rack in the embodiment of the present application is as follows: according to the size of the circuit board, the distance between the first corrugated plate 141 and the second corrugated plate 142 is adjusted, the circuit board is placed between the first corrugated plate 141 and the second corrugated plate 142, the circuit board is protected from the bottom by the bottom plate 110, the baffle 120 and the dustproof ventilation assembly 130 protect the circuit board from the side, and the shielding mechanism 300 protects the circuit board from the top. While shielding dust, a ventilation structure can also be formed, so that the circuit board can be cooled faster.

[0042] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A circuit board transfer rack, characterized in that: The invention comprises a bottom plate (110), two baffles (120) arranged in parallel are fixedly connected to the bottom plate (110), the baffles (120) are perpendicular to the bottom plate (110), the two baffles (120) are respectively located on both sides of the bottom plate (110), a first corrugated plate (141) and a second corrugated plate (142) are arranged between the two baffles (120), the first corrugated plate (141) and the second corrugated plate (142) are perpendicular to the bottom plate (110) and the baffles (120), the first corrugated plate (141) is fixedly connected to the baffles (120), the second corrugated plate (142) is slidably connected to the baffles (120) in a direction parallel to the bottom plate (110), a circuit board is placed between the first corrugated plate (141) and the second corrugated plate (142), the baffles (120) are parallel to the circuit board, and the circuit board transfer rack further comprises a shielding mechanism (300).

2. The circuit board transfer rack according to claim 1, characterized in that: Two groups of dustproof ventilation components (130) are also arranged between the two baffles (120). The two groups of dustproof ventilation components (130) are respectively located on both sides of the bottom plate (110). The dustproof ventilation components (130) include a first dustproof plate (131) and a second dustproof plate (132). The first dustproof plate (131) and the second dustproof plate (132) are perpendicular to the bottom plate (110) and the baffles (120). The first dustproof plate (131) and the second dustproof plate (132) are both provided with a plurality of ventilation slots (133). The ventilation slots (133) on the first dustproof plate (131) and the ventilation slots (133) on the second dustproof plate (132) are arranged in an alternating manner.

3. The circuit board transfer rack according to claim 1 or 2, characterized in that: A sliding rod (210) is fixedly connected to the baffle plate (120), a sliding sleeve (220) is fixedly connected to the second corrugated plate (142), the sliding rod (210) is arranged parallel to the bottom plate (110), the sliding sleeve (220) is arranged on the sliding rod (210), and the sliding sleeve (220) and the sliding rod (210) are fixedly connected by bolts.

4. The circuit board transfer rack according to claim 3, characterized in that: The shielding mechanism (300) comprises a support assembly (310) and a flexible cloth (330); the support assembly (310) is arranged on the baffle plate (120) for supporting the flexible cloth (330); the flexible cloth (330) is used to shield a circuit board placed between a first corrugated plate (141) and a second corrugated plate (142).

5. The circuit board transfer rack according to claim 4, characterized in that: The support assembly (310) comprises a first support rod (311) and a second support rod (312); the first support rod (311) is rotatably connected to the baffle (120); the second support rod (312) is rotatably connected to the first support rod (311); the first support rod (311), the second support rod (312) and the side of the baffle (120) form a triangular support structure.

6. The circuit board transfer rack according to claim 5, characterized in that: The support assembly (310) further comprises an auxiliary support rod (313), the auxiliary support rod (313) being rotatably connected to the baffle (120), and the auxiliary support rod (313) being used to support the flexible cloth (330) so that the flexible cloth (330) does not contact the circuit board.

7. The circuit board transfer rack according to claim 4, characterized in that: The shielding mechanism (300) further comprises a storage shaft (320), the storage shaft (320) being rotatably connected to the baffle (120), one end of the flexible cloth (330) being fixedly connected to the storage shaft (320), and the flexible cloth (330) being wound around the storage shaft (320).

8. The circuit board transfer rack according to claim 1, characterized in that: The bottom plate (110) is provided with a forklift slot (111).

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