PCB (Printed Circuit Board) withstand voltage test module

Abstract

The utility model discloses a withstand voltage test module for a PCB (Printed Circuit Board). The withstand voltage test module comprises the PCB, the PCB comprises two external layers and a plurality of internal board layers; each built-in board layer is provided with a withstand voltage test bonding pad and a lead. The lead wire of each built-in board layer is connected with the withstand voltage test bonding pad of the built-in board layer; the leads of any two adjacent built-in board layers are staggered in the horizontal direction; a plurality of copper cylinders are arranged on the PCB; the plurality of copper cylinders are in one-to-one correspondence with the plurality of built-in plate layers; a plurality of external bonding pads are arranged on one external layer; and the plurality of external bonding pads are respectively in one-to-one correspondence with the plurality of copper cylinders. According to the utility model, the manufacturing cost can be reduced, the withstand voltage data of the corresponding layer can be detected only by connecting the withstand voltage instrument with the external bonding pad of the corresponding layer, and the test operation is facilitated; and meanwhile, the voltage resistance of the PCB can be tested, and the product is not damaged.

Description

Technical Field

[0001] The utility model relates to the field of PCB board withstand voltage test, in particular to a PCB board withstand voltage test module. Background Art

[0002] As customers' requirements for PCB board product performance continue to increase, especially for power products, PCB board products often need to undergo voltage withstand tests. Through voltage withstand tests, the electrical safety performance parameters such as the withstand voltage of various objects under test can be tested intuitively, accurately, quickly and reliably to ensure their electrical safety performance.

[0003] However, since the performance of some products is affected after the voltage resistance test, the finished PCB cannot be directly used to test whether the voltage resistance meets customer requirements. The industry often uses PCB board voltage resistance test modules to test the voltage resistance, but it is prone to high production costs and inconvenient test operations, thus failing to meet industry requirements. Utility Model Content

[0004] In order to overcome the deficiencies of the prior art, the purpose of the utility model is to provide a PCB board withstand voltage test module, which can reduce the production cost and facilitate the test operation.

[0005] The purpose of the utility model is achieved by the following technical solutions:

[0006] A PCB board withstand voltage test module comprises a PCB board; the PCB board comprises two external layers and a plurality of internal board layers; the plurality of internal board layers are arranged in sequence from top to bottom between the two external layers; each internal board layer is provided with a withstand voltage test pad and a lead; the lead of each internal board layer is connected to the withstand voltage test pad of the internal board layer; the leads of any two adjacent internal board layers are staggered in the horizontal direction; a plurality of copper cylinders are provided on the PCB board; the plurality of copper cylinders correspond to the plurality of internal board layers one by one; one of the external layers is provided with a plurality of external pads; the plurality of external pads correspond to the plurality of copper cylinders one by one, one end of the copper cylinder is connected to the corresponding external pad, and the other end of the copper cylinder is connected to an end of the lead on the corresponding internal board layer away from the withstand voltage test pad of the internal board layer.

[0007] The lengths of the copper pillars on the PCB are different.

[0008] The PCB board is provided with a plurality of via holes, the plurality of via holes correspond to the plurality of copper pillars one by one, and the copper pillars are respectively arranged in the corresponding via holes.

[0009] Each of the vias extends along the height direction of the PCB board.

[0010] One end of the via hole is formed as a first end, and the other end is formed as a second end; the first end of the via hole passes through an end of a lead on the corresponding built-in board layer away from a voltage resistance test pad of the built-in board layer, and the second end of the via hole passes through the corresponding external pad.

[0011] A connecting pad is provided at one end of the lead wire on each built-in board layer away from the withstand voltage test pad of the built-in board layer.

[0012] The first end of the through hole passes through the connection pad of the lead on the corresponding built-in board layer.

[0013] The projections of the withstand voltage test pads on each built-in board layer on the external layer overlap.

[0014] The withstand voltage test pad is a copper body arranged on the corresponding built-in board layer; the copper body is circular, and the diameter of the copper body is 8-12 mm.

[0015] The withstand voltage test pad and the lead are arranged on the built-in circuit pattern layer of the built-in board layer.

[0016] Compared with the prior art, the beneficial effects of the present invention are:

[0017] The utility model provides a PCB board withstand voltage test module, which is provided with withstand voltage test pads and leads on each built-in board layer, and with a plurality of external pads on the external layer of the PCB board, and connected with the corresponding external pad through one end of a copper cylinder, and connected with the lead on the corresponding built-in board layer through the other end of the copper cylinder, which is away from the end of the withstand voltage test pad of the built-in board layer, so that the withstand voltage test is convenient and the production is convenient, and the production cost can be reduced. During the test, the withstand voltage data of the corresponding layer can be detected by connecting the external pad of the corresponding layer with the help of a withstand voltage instrument, so that the test operation is convenient; at the same time, it can test the withstand voltage capability of the PCB board without damaging the product itself, and can be repeatedly tested and used, which can further save costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the structure of the utility model;

[0019] Figure 2 It is a schematic diagram of the structure of the external layer;

[0020] Figure 3 It is a schematic diagram of the structure of the built-in board layer;

[0021] Among them, 10, PCB board; 11, external layer; 12, internal board layer; 20, voltage resistance test pad; 30, lead; 40, copper column; 50, external pad; 60, via hole; 70, connection pad. DETAILED DESCRIPTION

[0022] The present invention is further described below in conjunction with the accompanying drawings and specific implementation methods. It should be noted that, under the premise of no conflict, the various embodiments or technical features described below can be arbitrarily combined to form a new embodiment.

[0023] like Figure 1-3 As shown, a PCB board withstand voltage test module includes a PCB board 10; the PCB board 10 includes two external layers 11 and a plurality of internal board layers 12; the plurality of internal board layers 12 are arranged in sequence from top to bottom between the two external layers 11; each internal board layer 12 is provided with a withstand voltage test pad 20 and a lead 30; the lead 30 of each internal board layer 12 is connected to the withstand voltage test pad 20 of the internal board layer 12; the leads 30 of any two adjacent internal board layers 12 are staggered in the horizontal direction; The PCB board 10 is provided with a plurality of copper cylinders 40; the plurality of copper cylinders 40 correspond to the plurality of built-in board layers 12 one by one; one of the external layers 11 is provided with a plurality of external pads 50; the plurality of external pads 50 correspond to the plurality of copper cylinders 40 one by one, one end of the copper cylinder 40 is connected to the corresponding external pad 50, and the other end of the copper cylinder 40 is connected to one end of the lead 30 on the corresponding built-in board layer 12 away from the withstand voltage test pad 20 of the built-in board layer 12. Specifically, the withstand voltage test pad 20 and the lead 30 are provided on the built-in circuit pattern layer of the built-in board layer 12.

[0024] During the manufacturing process of the PCB board withstand voltage test module, a withstand voltage test pad 20 is first designed on each built-in board layer 12, and then a lead 30 is designed on each built-in board layer 12. The leads 30 of two adjacent built-in board layers 12 are staggered, and the withstand voltage test pads 20 of the built-in board layer 12 are connected through the leads 30 of the built-in board layer 12. Then, holes are drilled in each built-in board layer 12 and the external layer 11 of the PCB board 10, and each built-in board layer 12 and the external layer 11 are combined to form the PCB board 10. At the same time, by forming a copper column 40 on the PCB board 10, each lead 30 can be connected to the corresponding external pad 50 through the copper column 40 to be conductive to the external pad 50. Therefore, the utility model provides a PCB board withstand voltage test module, which is provided with withstand voltage test pads 20 and leads 30 on each built-in board layer 12, and a plurality of external pads 50 are provided on the external layer 11 of the PCB board 10, and is connected to the corresponding external pad 50 through one end of the copper cylinder 40, and is connected to the end of the lead 30 on the corresponding built-in board layer 12 away from the withstand voltage test pad 20 of the built-in board layer 12 through the other end of the copper cylinder 40, so that it can be used for withstand voltage testing, and has a simple structure, is easy to manufacture, and can reduce the manufacturing cost. During the test, as long as the external solder pad 50 of the corresponding layer is connected with the help of a withstand voltage instrument, the withstand voltage data of the corresponding layer can be detected, which is convenient for the test operation; at the same time, this module is taken out when the product is finished, which can test the withstand voltage capability of the PCB board 10 without damaging the product itself, which is convenient for testing, tracing and preservation, and can be repeatedly tested and used, which can further save costs; in addition, it can not only test whether it meets the customer's withstand voltage requirements, but also test the product's ultimate withstand voltage capability, which not only reduces the scrap cost, but also provides a guarantee for the quality of the product.

[0025] The lengths of the copper pillars 40 on the PCB board 10 are different, that is, the lengths of the copper pillars 40 corresponding to the leads 30 of different built-in board layers 12 are all different.

[0026] The PCB board 10 is provided with a plurality of via holes 60, and the plurality of via holes 60 correspond to the plurality of copper pillars 40 one by one, and the copper pillars 40 are respectively arranged in the corresponding via holes 60. Each via hole 60 extends along the height direction of the PCB board 10. One end of the via hole 60 is formed as a first end, and the other end is formed as a second end; the first end of the via hole 60 penetrates an end of the lead 30 on the corresponding built-in board layer 12 away from the withstand voltage test pad 20 of the built-in board layer 12, and the second end of the via hole 60 penetrates the corresponding external pad 50. By adopting the above-mentioned setting, during the manufacturing process, the copper pillar 40 can be manufactured by filling the copper body in the via hole 60, thereby facilitating the manufacturing and formation of the copper pillar 40.

[0027] A connection pad 70 is provided at one end of the lead 30 on each built-in board layer 12 away from the withstand voltage test pad 20 of the built-in board layer 12. The first end of the via 60 passes through the connection pad 70 of the lead 30 on the corresponding built-in board layer 12. In this embodiment, the connection pad 70 is rectangular, and the length and width of the connection pad 70 are both 2 mm.

[0028] Of course, in addition to this, the structure of the connecting pad 70 can also be set according to usage requirements, but setting the connecting pad 70 to a rectangular shape and setting the length and width of the connecting pad 70 to 2 mm is the optimal implementation method of the utility model, which is convenient for production and further reduces production costs.

[0029] The projections of the withstand voltage test pads 20 on each built-in board layer 12 on the external layer 11 overlap. By adopting the above arrangement, the performance can be ensured.

[0030] The withstand voltage test pad 20 is a copper body arranged on the corresponding built-in board layer 12. The copper body is round, and the diameter of the copper body is 8-12 mm. As the most preferred embodiment of the utility model, the diameter of the copper body is 10 mm.

[0031] Of course, in addition to this, the withstand voltage test pad 20 may also adopt other structures, but setting the withstand voltage test pad 20 as a circular copper body is the best implementation of the utility model, which is convenient for production and further reduces production costs.

[0032] In order to further improve the convenience of use, corresponding layer etching characters may be added next to each external solder pad 50 for marking, so as to facilitate the test and distinguish the layers.

[0033] The above-mentioned implementation modes are only preferred implementation modes of the present invention, and cannot be used to limit the protection scope of the present invention. Any non-substantial changes and substitutions made by technicians in this field on the basis of the present invention shall fall within the scope of protection required by the present invention.

Claims

1. A PCB board withstand voltage test module, characterized in that: It comprises a PCB board; the PCB board comprises two external layers and a plurality of internal board layers; the plurality of internal board layers are arranged in sequence from top to bottom between the two external layers; each internal board layer is provided with a withstand voltage test pad and a lead; the lead of each internal board layer is connected to the withstand voltage test pad of the internal board layer; the leads of any two adjacent internal board layers are staggered in the horizontal direction; a plurality of copper cylinders are provided on the PCB board; the plurality of copper cylinders correspond to the plurality of internal board layers one by one; one of the external layers is provided with a plurality of external pads; the plurality of external pads correspond to the plurality of copper cylinders one by one, one end of the copper cylinder is connected to the corresponding external pad, and the other end of the copper cylinder is connected to an end of the lead on the corresponding internal board layer away from the withstand voltage test pad of the internal board layer.

2. The PCB withstand voltage test module according to claim 1, characterized in that: The lengths of the copper pillars on the PCB are different.

3. The PCB withstand voltage test module according to claim 1 or 2, characterized in that: The PCB board is provided with a plurality of via holes, the plurality of via holes correspond to the plurality of copper pillars one by one, and the copper pillars are respectively arranged in the corresponding via holes.

4. The PCB withstand voltage test module according to claim 3, characterized in that: Each of the vias extends along the height direction of the PCB board.

5. The PCB withstand voltage test module according to claim 4, characterized in that: One end of the via hole is formed as a first end, and the other end is formed as a second end; the first end of the via hole passes through an end of a lead on the corresponding built-in board layer away from a voltage resistance test pad of the built-in board layer, and the second end of the via hole passes through the corresponding external pad.

6. The PCB withstand voltage test module according to claim 5, characterized in that: One end of the lead wire on each built-in board layer away from the withstand voltage test pad of the built-in board layer is provided with a connecting pad.

7. The PCB withstand voltage test module according to claim 6, characterized in that: The first end of the via hole passes through the connection pad of the lead on the corresponding built-in board layer.

8. The PCB withstand voltage test module according to claim 1, characterized in that: The projections of the withstand voltage test pads on each built-in board layer on the external layer overlap.

9. The PCB board withstand voltage test module according to claim 8, characterized in that: The withstand voltage test pad is a copper body arranged on the corresponding built-in board layer; the copper body is circular, and the diameter of the copper body is 8-12 mm.

10. The PCB withstand voltage test module according to claim 1, characterized in that: The withstand voltage test pad and the lead are arranged on the built-in circuit pattern layer of the built-in board layer.

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