Equipment with dustproof structure

Abstract

The utility model relates to equipment with a dustproof structure. Comprising a shell, a mainboard assembly, an interface device and foam. The shell is provided with an interface device opening; the mainboard assembly is arranged in the shell; the interface device is arranged on the mainboard assembly and is connected with external equipment through the interface device opening; the interface device is provided with an interface device opening, the foam is arranged between the interface device and the interface device opening and is provided with a foam opening, and the foam opening is pressed into the interface device opening or an extrusion surface between the interface device and the shell is coated through extrusion between the interface device and the shell. The structure is compact, and the dustproof effect can be achieved as long as the foam is designed into a specific structure to be in contact with the interface device and the opening of the interface device.

Description

Technical Field

[0001] The utility model relates to the technical field of dustproof equipment, and more specifically, to equipment with a dustproof structure. Background Art

[0002] When electronic devices are working, they will generate static electricity and are more likely to absorb dust. Especially when RFID fixed readers are working, the internal components will have a certain attraction to the dust in the surrounding environment. If the outer shell is not tightly protected, the dust from the outside will enter the device. This dust will bring uncertainty to the stable operation of the design, and may shorten the life of the device, damage it, and other problems.

[0003] Most RFID readers are used in simple environments, but as their applications become more and more widespread, RFID technology has been widely used in logistics, manufacturing, asset management, and other fields in recent years, especially in industrial environments. This means that the requirements for waterproof and dustproof RFID readers are getting higher and higher. Once the protection fails to meet the requirements, the RFID readers will fail, be damaged, or even suffer more serious economic losses.

[0004] The source of IP rating is the International Electrotechnical Commission standard IEC 60529. The IP rating can be used to know the protection level of the electrical equipment housing against foreign objects. In the interface design of existing RFID fixed readers, there will be obvious gaps between the interface and the housing assembly. The gap is generally less than 1mm. According to the classification of IP ratings, this can meet IP4X, but cannot meet higher requirements.

[0005] In the prior art, there are many design schemes for dust prevention of RFID readers. For example, in the utility model patent with application number CN202120534439, a rotatable dust cover is designed on the outside of the device interface. After the dust cover is selected into place, a eaves structure is formed, which plays a certain role in dust prevention of the interface. However, this dust prevention method can only prevent a certain amount of dust influence. Utility Model Content

[0006] To this end, the technical problem to be solved by the utility model is that the dustproof effect of the above-mentioned existing RFID readers is difficult to meet higher requirements, and a device with a dustproof structure is provided. The dustproof effect should be able to reach a protection level of IP5X or above, which can prevent most dust from entering, allow a very small amount of dust to enter, and will not affect the normal operation of the equipment.

[0007] In order to solve the above technical problems, the technical solution adopted by the utility model is:

[0008] A device with a dustproof structure, comprising: a housing, a mainboard assembly, an interface device, and foam;

[0009] The housing is provided with the interface device opening;

[0010] The mainboard assembly is arranged inside the housing;

[0011] The interface device is arranged on the mainboard assembly and is connected to an external device through an opening of the interface device;

[0012] The foam is arranged between the interface device and the interface device opening, and a foam opening is arranged, and the interface device passes through the foam opening.

[0013] Furthermore, the size of the foam opening is smaller than the size of the interface device opening and is provided with a cutout; the foam opening is pressed into the interface device opening by extrusion between the interface device and the shell.

[0014] Furthermore, the size of the foam opening is set according to the size of the interface device, so as to cover the extrusion surface between the interface device and the shell.

[0015] Furthermore, the interface device includes: an input / output interface, a serial interface, a universal serial bus and a local area network interface.

[0016] Furthermore, the foam is adhered to the inner wall of the shell, or the extrusion surface of the interface device.

[0017] Furthermore, the foam is waterproof foam. Furthermore, the waterproof foam is polyethylene foam, EVA ethylene-vinyl acetate copolymer foam and EPDM ethylene propylene diene monomer rubber foam.

[0018] Furthermore, the shell includes an upper shell and a lower shell, and the upper shell and the lower shell are detachably connected.

[0019] Furthermore, the device also includes an RFID module and an RFID antenna.

[0020] The RFID antenna passes through the housing and is connected to the RFID module;

[0021] The RFID module is arranged on the inner wall of the upper shell and connected to the mainboard assembly.

[0022] Furthermore, a label is adhered to the surface of the shell where the opening of the interface device is arranged.

[0023] The present invention has the following beneficial effects:

[0024] 1. The utility model proposes a device with a dustproof structure, which has a compact structure. Since the foam itself has a certain dustproof effect, low hardness, and the characteristic of deforming to the surrounding after being squeezed, the foam can help to fully fill the gap between the circuit board interface and the shell opening after being squeezed. The dustproof effect can be achieved by only designing the foam into a specific structure to contact the interface device and the interface device opening. It has passed the IP5X test and has a good dustproof effect.

[0025] 2. The utility model proposes a device with a dustproof structure, in which a corresponding incision is cut on the foam to ensure that when the interface device and the opening of the interface device squeeze the foam, the four sides of the foam can be evenly expanded to fill each gap, achieve a sealing effect, and ensure the dustproof effect at the opening of the interface device of the device;

[0026] 3. The utility model proposes a device with a dustproof structure. Ordinary foam can meet the dustproof requirements. Foam with increased waterproof function can be applied to more usage scenarios.

[0027] 4. The utility model proposes a device with a dustproof structure. A certain gap will appear between the interface device and the opening of the interface device due to the squeezing of foam. A label is pasted on the surface where the opening of the interface device is set through the shell, and only the interface device is exposed, which can improve the neatness of the appearance of the entire interface. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 It is a structural schematic diagram of the utility model.

[0029] Figure 2 It is a schematic diagram of the structural decomposition of the utility model.

[0030] Figure 3 It is a cross-sectional schematic diagram of the utility model.

[0031] Figure 4 It is a partial enlarged view of section A of the present invention.

[0032] Figure 5 It is a schematic diagram of the foam opening and incision of the utility model.

[0033] The accompanying drawings are marked as follows: 10 - shell; 11 - upper shell; 12 - lower shell; 20 - mainboard assembly; 30 - interface device; 31 - input and output interface; 32 - serial interface; 33 - universal serial bus; 34 - local area network interface; 40 - foam; 50 - RFID module; 51 - RFID antenna; 60 - sign. DETAILED DESCRIPTION

[0034] The present invention will be described in detail below with reference to the accompanying drawings and specific embodiments.

[0035] The connection in the present invention can be a detachable connection or an integral connection; a mechanical connection or an electrical connection; a direct connection or an indirect connection through an intermediate medium, the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0036] A device having a dustproof structure, such as Figure 1-4 The RFID reader is shown as an RFID reader, which is only one of the applications of the utility model, and can also be other devices. The RFID reader includes: a housing 10, a mainboard assembly 20, an interface device 30, a foam 40, an RFID module 50 and an RFID antenna 51;

[0037] The housing 10 includes an upper housing 11 and a lower housing 12 , wherein the upper housing 11 and the lower housing 12 are detachably connected, and the interface device opening is provided.

[0038] The mainboard assembly 20 is disposed inside the housing 10 .

[0039] The interface device 30 includes: an input / output interface 31, a serial interface 32, a universal serial bus 33 and a local area network interface 34; it is arranged on the mainboard assembly 20 and connected to an external device through the interface device opening.

[0040] The foam 40 is waterproof polyethylene foam and is disposed between the interface device 30 and the interface device opening, and a foam opening is provided, through which the interface device 30 passes.

[0041] The RFID antenna 51 passes through the housing 10 and is connected to the RFID module 50 .

[0042] The RFID module 50 is disposed on the inner wall of the upper housing 11 and connected to the mainboard assembly 20 .

[0043] like Figure 5 As shown, when the interface device 30 is an input / output interface 31, a universal serial bus 33, and a local area network interface 34, the interface device 30 does not exceed the range of the shell 10, and there is no planar structure on the back, so the size of the foam opening is smaller than the size of the interface device opening, and a cut is provided for the convenience of extrusion. The interface device opening size is designed to be about twice the original size, and space for the foam 40 is reserved. The foam 40 is pasted at a designated position at the opening of the inner wall of the shell 10, and the four corners of the foam opening are cut. The cut of the foam 40 is similar to the outline of the interface device opening, and the size is smaller than the size of the shell opening, and overlaps to form a "U" shape. Through the extrusion between the interface device 30 and the shell 10, the foam opening is pressed into the interface device opening, which is also called interference fit.

[0044] The "U"-shaped structure designed for the opening of the interface device of the foam 40 is connected at the four corners of the inner square and the outer direction, and the corresponding incisions are cut on the foam 40 to ensure that when the interface device 30 and the interface device opening squeeze the foam 40, the four sides of the foam 40 can be evenly expanded to fill each gap.

[0045] When the interface device 30 is a serial interface 32, since the serial interface 32 needs to protrude from the housing 10 and there is no planar structure on the back, the size of the foam opening only needs to be set according to the size of the protruding portion of the serial interface 32, and the extruded plane between the serial interface 32 and the housing 10 is covered. In order to firmly adhere the foam 40 to the extruded surface of the serial interface 32.

[0046] The foam 40 itself has certain dustproof effect, low hardness characteristics, and the characteristic of deforming toward the surrounding after being squeezed. After being squeezed, the foam 40 can help to fully fill the gap between the circuit board interface and the housing opening.

[0047] The foam 40 with waterproof function can be applied to more usage scenarios. The waterproof foam is EVA ethylene-vinyl acetate copolymer foam, EPDM ethylene propylene diene monomer rubber foam or other waterproof or friction-resistant foams.

[0048] Because of the squeezing of the foam 40 , a certain gap will appear between the interface device 30 and the interface device opening. The label 60 is adhered to the surface where the interface device opening is set through the shell 10 , leaving only the interface device 30 exposed, which can improve the appearance of the entire outer surface.

[0049] The above embodiments are only intended to illustrate rather than limit the present invention, so any equivalent changes or modifications made according to the method described in the scope of the present invention patent application are included in the scope of the present invention patent application.

Claims

1. A device with a dustproof structure, characterized in that: include: A housing (10), a mainboard assembly (20), an interface device (30), and foam (40); The housing (10) is provided with the interface device opening; The mainboard assembly (20) is arranged inside the housing (10); The interface device (30) is arranged on the mainboard assembly (20) and is connected to an external device through an opening of the interface device; The foam (40) is arranged between the interface device (30) and the interface device opening, and a foam opening is provided, and the interface device (30) passes through the foam opening.

2. The device with a dustproof structure according to claim 1, characterized in that: The size of the foam opening is smaller than the size of the interface device opening and is provided with a cutout; the foam opening is pressed into the interface device opening by squeezing between the interface device (30) and the shell (10).

3. The device with a dustproof structure according to claim 1, characterized in that: The size of the foam opening is set according to the size of the interface device (30), and covers the extrusion surface between the interface device (30) and the shell (10).

4. A device with a dustproof structure according to any one of claims 1 to 3, characterized in that: The interface device (30) comprises: an input and output interface (31), a serial interface (32), a universal serial bus (33) and a local area network interface (34).

5. The device with a dustproof structure according to any one of claims 1 to 3, characterized in that: The foam (40) is adhered to the inner wall of the shell (10) or the extrusion surface of the interface device (30).

6. The device with dustproof structure according to claim 5, characterized in that: The foam (40) is waterproof foam.

7. The device with a dustproof structure according to claim 1, characterized in that: The housing (10) comprises an upper housing (11) and a lower housing (12), and the upper housing (11) and the lower housing (12) are detachably connected.

8. The device with dustproof structure according to claim 7, characterized in that: comprising an RFID module (50) and an RFID antenna (51), The RFID antenna (51) passes through the housing (10) and is connected to the RFID module (50); The RFID module (50) is arranged on the inner wall of the upper housing (11) and is connected to the mainboard assembly (20).

9. The device with dustproof structure according to claim 8, characterized in that: A label (60) is adhered to the surface of the housing (10) where the opening of the interface device is arranged.

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