Edge covering structure of panel

Abstract

The utility model discloses an edge covering structure of a panel, and relates to the field of membrane switches, the edge covering structure comprises a panel layer, a surface glue layer, a circuit layer and a back glue layer, the panel layer is bonded on the circuit layer through the surface glue layer, the circuit layer is bonded on a product shell and a display panel through the back glue layer, the inner circumferential side of the panel layer extends inwards and is bonded on the back glue layer, and the inner circumferential side of the panel layer is bonded on the back glue layer. The panel layer wraps the inner peripheral side of the circuit layer, a first guide inclined wall is formed on the top wall of the inner peripheral side of the panel layer, and the height of the first guide inclined wall is gradually increased in the direction from the display panel to the product shell. The first guide inclined wall is formed on the top wall of the inner peripheral side of the panel layer, so that the height of the inner peripheral side of the edge covering structure is smaller than that of the outer peripheral side, at the moment, the height of the top wall of the inner peripheral side of the edge covering structure is close to the display panel, and a dirt hiding area is not prone to being formed at the included angle between the inner peripheral side wall of the edge covering structure and the display panel; therefore, the situation of glue failure at the bonding position of the edge covering structure and the display panel can be reduced, and the stability of the edge covering structure is greatly improved.

Description

Technical Field

[0001] The present application relates to the field of membrane switches, and in particular to an edge binding structure of a panel. Background Art

[0002] An edge wrapping structure is pasted and installed on the display panel of some electronic products, and the edge wrapping structure covers the gap between the panel and the product casing.

[0003] Currently, refer to Figure 1 and 2 In medical device products, the edge structure 8 is mostly rectangular frame-shaped and is a membrane switch. The inner peripheral side of the edge structure 8 is bonded and fixed to the display panel 9, and the outer peripheral side of the edge structure 8 is bonded and fixed to the product housing 10. The edge structure 8 is composed of a multi-layer structure such as a panel layer, a circuit layer, and an adhesive layer and has a certain thickness. The inner peripheral side wall of the edge structure 8 forms a 90° angle with the display panel 9, and a dirt storage area 11 is formed at the angle.

[0004] When the staff uses a rag to wipe the display panel of the product, the dust, foreign matter on the display panel and the dirty water in the rag can easily enter the dirt hiding area. Over time, this will cause the bonding between the edging structure and the display panel to debond, thereby greatly reducing the stability of the edging structure. Utility Model Content

[0005] In order to reduce the possibility of debonding at the bonding point between the edge binding structure and the display panel, the present application provides an edge binding structure for a panel.

[0006] The panel edge binding structure provided in this application adopts the following technical solution:

[0007] A panel edging structure includes a panel layer, a surface adhesive layer, a circuit layer and a back adhesive layer, wherein the panel layer is bonded to the circuit layer via the surface adhesive layer, and the circuit layer is bonded to a product casing and a display panel via the back adhesive layer, the inner circumference of the panel layer extends inward and is bonded to the back adhesive layer, the panel layer is coated on the inner circumference of the circuit layer, a first guide inclined wall is formed on the top wall of the inner circumference of the panel layer, and the height of the first guide inclined wall gradually increases from the display panel toward the product casing.

[0008] By adopting the above technical solution, the first guiding inclined wall is formed on the top wall on the inner side of the panel layer, so that the height of the inner side of the edging structure is smaller than the height of the outer side. At this time, the height of the top wall on the inner side of the edging structure is close to the display panel, and it is not easy to form a dirt hiding area at the angle between the inner side wall of the edging structure and the display panel, thereby reducing the debonding at the bonding point between the edging structure and the display panel, and greatly improving the stability of the edging structure.

[0009] Preferably, the circuit layer includes an upper circuit board layer, an interlayer layer and a lower circuit board layer, the upper circuit board layer is bonded and fixed to the panel layer through a surface adhesive layer, the lower circuit board layer is bonded and fixed to the upper circuit board layer through an interlayer layer, the lower circuit board is bonded and fixed to the product casing and the display panel through a back adhesive layer, and the inner circumferences of the upper circuit board layer and the lower circuit board layer both extend inward.

[0010] By adopting the above technical solution, the interlayer layer bonds and fixes the upper circuit board layer and the lower circuit board layer, the surface adhesive layer bonds and fixes the upper circuit board layer and the surface adhesive layer, and the back adhesive layer bonds and fixes the lower circuit board layer, the product casing and the display panel, thereby making the edging structure more firmly bonded to the product.

[0011] Preferably, the inner circumference of the upper circuit board layer extends inward, the inner circumference of the lower circuit board layer extends inward, the extension length of the lower circuit board layer is greater than the extension length of the upper circuit board layer, and the first guide wall is located above the extension of the upper circuit board layer and the lower circuit board layer.

[0012] By adopting the above technical solution, the extension length of the lower circuit board layer is greater than the extension length of the upper circuit board layer, so that the lower circuit board layer and the upper circuit board layer are stepped along the inclination direction of the first guide inclined wall. The stepped lower circuit board layer and the upper circuit board layer support the first guide inclined wall of the panel layer, thereby improving the stability of the panel layer.

[0013] Preferably, the inner circumference of the surface adhesive layer extends inwardly, the bottom wall of the surface adhesive layer extending inwardly is bonded to the upper circuit board layer, the lower circuit board layer and the back adhesive layer, and the bottom wall of the panel layer is bonded and fixed to the top wall of the surface adhesive layer.

[0014] By adopting the above technical solution, the surface adhesive layer is bonded and fixed to the first guide inclined wall of the panel layer and the stepped lower circuit board layer and the upper circuit board layer, thereby further improving the stability of the panel layer.

[0015] Preferably, the inner circumference of the interlayer extends inwardly, and the top wall of the interlayer where the interlayer is extended is bonded and fixed to the bottom wall of the surface rubber layer.

[0016] By adopting the above technical solution, the extended part of the interlayer is bonded and fixed to the surface adhesive layer, thereby further improving the stability of the panel layer at the first guide inclined wall.

[0017] Preferably, the panel layer is located at the inner peripheral side of the first inclined guide wall to form a plane wall, the bottom wall of the panel layer located at the first inclined guide wall is bonded and fixed to the surface adhesive layer, and the bottom wall of the panel layer located at the plane wall is bonded and fixed to the back adhesive layer.

[0018] By adopting the above technical solution, the first guide wall of the panel layer is bonded and fixed to the surface adhesive layer, thereby enhancing the stability of the panel layer at the first guide wall. The plane wall of the panel layer is bonded and fixed to the back adhesive layer, thereby further reducing the height of the inner peripheral side of the edging structure, making it less likely to produce a dirt hiding area between the inner peripheral side of the edging structure and the display panel.

[0019] Preferably, a second inclined guide wall is formed on the inner side of the top wall of the panel layer close to the display panel, and the height of the second inclined guide wall gradually increases from the display panel toward the product casing.

[0020] By adopting the above technical solution, the second guide wall of the panel layer further reduces the height of the end of the panel layer, so that it is not easy to form a dirt hiding area at the angle between the inner peripheral side wall of the edging structure and the display panel.

[0021] In summary, the present application includes at least one of the following beneficial technical effects:

[0022] 1. The first inclined guide wall formed on the top wall of the inner peripheral side of the panel layer is used to make the height of the inner peripheral side of the edge structure smaller than that of the outer peripheral side. At this time, the height of the top wall of the inner peripheral side of the edge structure is close to the display panel, and it is not easy to form a dirt hiding area at the angle between the inner peripheral side wall of the edge structure and the display panel, thereby reducing the occurrence of debonding at the bonding point between the edge structure and the display panel, and greatly improving the stability of the edge structure;

[0023] 2. By virtue of the extension length of the lower circuit board layer being greater than the extension length of the upper circuit board layer, the lower circuit board layer and the upper circuit board layer are stepped along the inclination direction of the first guide inclined wall, and the stepped lower circuit board layer and the upper circuit board layer support the first guide inclined wall of the panel layer, thereby improving the stability of the panel layer;

[0024] 3. The height of the end of the panel layer is further reduced by the second inclined guide wall of the panel layer, so that it is not easy to form a dirt hiding area at the angle between the inner peripheral side wall of the edge structure and the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is a schematic diagram of the overall structure of the hemming structure in the background technology of this application;

[0026] Figure 2 A cross-sectional view of the hemming structure in the background technology of this application;

[0027] Figure 3 This is a schematic diagram of the overall structure of the edge structure of the panel of this application;

[0028] Figure 4 This is a cross-sectional view of the edge structure of the panel of this application.

[0029] Figure numerals: 1. panel layer; 2. surface adhesive layer; 3. circuit layer; 31. upper circuit board layer; 32. interlayer layer; 33. lower circuit board layer; 4. back adhesive layer; 5. first guide inclined wall; 6. plane wall; 7. second guide inclined wall; 8. edging structure; 9. display panel; 10. product casing; 11. dirt storage area. DETAILED DESCRIPTION

[0030] The following is combined with Figure 3-4 This application is described in further detail.

[0031] The embodiment of the present application discloses a panel edge binding structure.

[0032] Reference Figure 3 and 4 A panel edge wrapping structure includes a panel layer 1, a surface adhesive layer 2, a circuit layer 3 and a back adhesive layer 4 stacked in sequence from top to bottom, and the circuit layer 3 includes an upper circuit board layer 31, an interlayer 32 and a lower circuit board layer 33 in sequence from top to bottom. The back adhesive layer 4 is bonded to the bottom wall of the lower circuit board layer 33 and the lower circuit board layer 33 is bonded and fixed to the product housing and the display panel, the interlayer 32 is bonded and fixed to the top wall of the lower circuit board layer 33, the upper circuit board is bonded and fixed to the top wall of the interlayer 32, the surface adhesive layer 2 is bonded and fixed to the top wall of the upper circuit board, and the panel layer 1 is bonded and fixed to the top wall of the surface adhesive layer 2.

[0033] The panel layer 1, the surface adhesive layer 2, the upper circuit board layer 31, the interlayer layer 32, the lower circuit board layer 33 and the back adhesive layer 4 are located on the same vertical plane at the ends on the outer peripheral side of the edging structure, the widths of the upper circuit board layer 31, the interlayer layer 32, the lower circuit board layer 33 and the back adhesive layer 4 gradually increase, and the ends of the upper circuit board layer 31, the interlayer layer 32, the lower circuit board layer 33 and the back adhesive layer 4 are located on the inner peripheral side of the edging structure are stepped.

[0034] The width of the surface adhesive layer 2 is greater than the width of the lower circuit board layer 33 and less than the width of the back adhesive layer 4, and the bottom wall of the surface adhesive layer 2 is respectively bonded and fixed to the upper circuit board layer 31, the interlayer 32, the lower circuit board layer 33 and the back adhesive layer 4. The width of the panel layer 1 is equal to the width of the back adhesive layer 4, and the bottom wall of the panel layer 1 is welded and fixed to the surface adhesive layer 2 and the back adhesive layer 4.

[0035] The panel layer 1 is located above the stepped ends of the upper circuit board layer 31, the interlayer layer 32, and the lower circuit board layer 33 to form an inclined first guide wall 5, and the height of the first guide wall 5 gradually decreases from the product casing to the display panel.

[0036] The first inclined guide wall 5 reduces the height of the top wall on the inner peripheral side of the edging structure, making it difficult for a dirt hiding area to form at the angle between the inner peripheral side wall of the edging structure and the display panel, thereby reducing the chance of debonding at the bonding point between the edging structure and the display panel and greatly improving the stability of the edging structure.

[0037] A plane wall 6 is formed above the panel layer 1 where it is bonded to the back adhesive layer 4, and a second guide wall 7 is formed at the end of the panel layer 1 located away from the first guide wall 5, and the height of the second guide wall 7 gradually decreases from the product casing to the display panel.

[0038] The second inclined guide wall 7 of the panel layer 1 further reduces the height of the end of the panel layer 1, so that it is not easy to form a dirt hiding area at the angle between the inner peripheral side wall of the edge structure and the display panel.

[0039] The implementation principle of the edging structure of a panel in an embodiment of the present application is as follows: the first guide inclined wall 5 and the second guide inclined wall 7 formed on the inner peripheral top wall of the panel layer 1 make the height of the inner peripheral side of the edging structure smaller than the height of the outer peripheral side. At this time, the height of the inner peripheral top wall of the edging structure is close to the display panel, and a dirt hiding area is not easy to form at the angle between the inner peripheral side wall of the edging structure and the display panel, thereby reducing the debonding at the bonding point between the edging structure and the display panel, and greatly improving the stability of the edging structure.

[0040] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A panel edge wrapping structure, comprising a panel layer (1), a surface adhesive layer (2), a circuit layer (3) and a back adhesive layer (4), wherein the panel layer (1) is bonded to the circuit layer (3) via the surface adhesive layer (2), and the circuit layer (3) is bonded to a product housing and a display panel via the back adhesive layer (4), characterized in that: The inner circumference of the panel layer (1) extends inward and is bonded to the adhesive layer (4); the panel layer (1) is coated on the inner circumference of the circuit layer (3); a first guide wall (5) is formed on the top wall of the inner circumference of the panel layer (1); and the height of the first guide wall (5) gradually increases from the display panel toward the product casing.

2. The panel edge binding structure according to claim 1, characterized in that: The circuit layer (3) comprises an upper circuit board layer (31), an interlayer (32) and a lower circuit board layer (33); the upper circuit board is bonded and fixed to the panel layer (1) via a surface adhesive layer (2); the lower circuit board layer (33) is bonded and fixed to the upper circuit board layer (31) via an interlayer (32); the lower circuit board is bonded and fixed to the product housing and the display panel via a back adhesive layer (4); and the inner circumferences of the upper circuit board layer (31) and the lower circuit board layer (33) both extend inwards.

3. The panel edge binding structure according to claim 2, characterized in that: The inner circumference of the upper circuit board layer (31) extends inwardly, the inner circumference of the lower circuit board layer (33) extends inwardly, the extension length of the lower circuit board layer (33) is greater than the extension length of the upper circuit board layer (31), and the first inclined guide wall (5) is located above the extension of the upper circuit board layer (31) and the lower circuit board layer (33).

4. The panel edge binding structure according to claim 3, characterized in that: The inner circumference of the surface adhesive layer (2) extends inwardly, the bottom wall of the surface adhesive layer (2) extending inwardly is bonded to the upper circuit board layer (31), the lower circuit board layer (33) and the back adhesive layer (4), and the bottom wall of the panel layer (1) is bonded and fixed to the top wall of the surface adhesive layer (2).

5. The panel edge binding structure according to claim 4, characterized in that: The inner circumference of the interlayer (32) extends inwardly, and the top wall of the interlayer (32) at the extension is bonded and fixed to the bottom wall of the surface rubber layer (2).

6. The panel edge binding structure according to claim 4, characterized in that: The panel layer (1) is located on the inner peripheral side of the first inclined guide wall (5) and is formed with a plane wall (6); the bottom wall of the panel layer (1) located at the first inclined guide wall (5) is bonded and fixed to the surface adhesive layer (2); and the bottom wall of the panel layer (1) located at the plane wall (6) is bonded and fixed to the back adhesive layer (4).

7. The panel edge binding structure according to claim 1, characterized in that: A second inclined guide wall (7) is formed on the inner side of the top wall of the panel layer (1) close to the display panel, and the height of the second inclined guide wall (7) gradually increases from the display panel towards the product casing.

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