Active cooling mechanism

Abstract

The utility model relates to an active heat dissipation mechanism, comprising: a heat conducting plate main body having a refrigerant flow space filled with refrigerant inside, wherein the heat conducting plate main body comprises: a heat conducting plate on one side, forming a side surface of the refrigerant flow space in the thickness direction; and a heat conducting plate on the other side, forming the other side surface of the refrigerant flow space in the thickness direction, wherein at least one of the heat conducting plate on one side and the heat conducting plate on the other side is formed with a strength reinforcement portion protruding toward the refrigerant flow space.

Description

Technical Field

[0001] The utility model relates to an active heat dissipation mechanism, and more particularly, to an active heat dissipation mechanism capable of improving heat dissipation performance by actively transferring heat generated from a heat generating device (e.g., an electronic device) through a phase change of a refrigerant that is more effective than its own thermal conductive material properties. Background Art

[0002] Wireless communication technology (for example, Multiple Input Multiple Output (MIMO) technology) is a technology that greatly increases data transmission capacity by using multiple antennas, and is a spatial multiplexing technology that transmits different data from each other through separate transmitting antennas in a transmitter and distinguishes the transmitted data through appropriate signal processing in a receiver.

[0003] Therefore, as the number of transmitting and receiving antennas increases at the same time, the channel capacity increases, making it possible to send more data. For example, if the number of antennas is increased to 10, the same frequency band is used to ensure about 10 times the channel capacity compared to the existing single antenna system. In the case of a transceiver device that applies the MIMO technology as described above, as the number of antennas increases, the number of transmitters and filters also increases.

[0004] As described above, as the number of transmitters and filters increases, there is a problem that the number of heat generating elements also increases. In order to prevent the performance of the antenna device from being degraded, research on a heat dissipation mechanism that effectively dissipates the heat generated by multiple heat generating elements has been carried out first in MIMO technology.

[0005] Figure 1 is an exploded perspective view showing an example of an antenna device according to the related art.

[0006] like Figure 1 As shown, the heat generating device (eg, electronic device) may be implemented as an antenna device.

[0007] like Figure 1 As shown, the existing antenna device includes: an antenna shell body 10, which is configured as a rectangular box body with an opening at the front and a relatively thin thickness from front to back, and a plurality of heat dissipation fins 11 are integrally formed on the rear surface; a main board (not shown), stacked on the rear surface inside the antenna shell body 10; and an antenna board 15, stacked on the front surface inside the antenna shell body 10.

[0008] A plurality of power supply related components and elements for calibrating power supply control are mounted on the main board, and the heat generated by the components during the power supply process is dissipated to the outside through a plurality of heat dissipation fins 11 at the rear of the antenna housing body 10 .

[0009] Furthermore, a PSU board 40 on which a power supply unit (PSU) component is installed is stacked on the lower side of the main board or arranged at the same height, and is designed to dissipate heat generated from the PSU component to the outside through multiple heat dissipation fins 11 at the rear of the antenna housing body 10.

[0010] A plurality of RF filters (not shown) are arranged on the front surface of the main board, and the rear surface of the antenna board 15 is arranged to be stacked on the front surfaces of the plurality of RF filters.

[0011] A plurality of patch-type or dipole-type radiating elements 17 may be installed on the front surface of the antenna plate 15, and a radome panel 50 may be provided on the front surface of the antenna shell body 10 to protect the internal components from external influences while allowing the plurality of radiating elements 17 to radiate smoothly.

[0012] However, the existing antenna device has a design in which a radome panel 50 is provided at the front, and the system heat generated inside needs to be concentratedly dissipated to the rear of the antenna housing body 10, so the heat dissipation performance of the plurality of heat dissipation fins 11 needs to be improved.

[0013] Here, as a solution for improving the heat dissipation performance of the plurality of heat dissipation fins 11, the following manufacturing method can be considered: using a material with better thermal conductivity to form an integral body with the antenna housing body 10, and separating the outermost front end thereof as far as possible from the heat generating element as a heat source to the external space.

[0014] However, there are not only limitations in improving thermal conductivity using only the material of the plurality of heat dissipation fins 11 themselves, but also the following problem: even when the outermost front ends of the plurality of heat dissipation fins 11 are kept away from the heat-generating element, it is impossible to eliminate the heat concentration phenomenon in the area adjacent to the heat-generating element into which the heat flows, and this becomes a factor that increases the size of the product in the thickness direction and hinders the ultra-thinness of the product.

[0015] In addition, in the related field of heat dissipation technology, a thermally conductive material (metal) generally used as a material of the plurality of heat dissipation fins 11 may be an aluminum (Al) alloy material.

[0016] Among metal materials, examples of metals with higher thermal conductivity (unit: W / mK) than aluminum (Al) include silver (Au, 418.6), copper (Cu, 372.1) and gold (Ag, 295.3). However, these metals are relatively expensive compared to aluminum. Therefore, from an economic (cost) perspective, they cannot be widely used in methods that cover a wide range of heat dissipation areas.

[0017] However, since pure aluminum (Al) alone cannot meet the strength and ductility requirements, it is usually processed and manufactured in the form of an aluminum alloy roughly mixed with silicon and magnesium. In this case, due to its low castability, its applicability is extremely limited to the manufacture of small or simple-shaped parts, etc. Although its cost is lower than that of the above-mentioned silver, copper and gold, it still has the disadvantage of high manufacturing cost.

[0018] In addition, it is difficult for the heat dissipation fins 11 made of aluminum alloy to overcome the above-mentioned material limitations. Recently, a refrigerant-type heat dissipation system has attracted much attention. The system uses a phase change material as a refrigerant in a closed interior and dissipates heat through the temperature difference between latent heat and sensible heat used when the refrigerant changes its phase.

[0019] In this refrigerant type heat dissipation system, the core element to maximize the heat dissipation performance is the phase-changing refrigerant. The aluminum alloy heat dissipation fins 11 can only form a closed refrigerant flow space for the refrigerant to flow due to phase change, while transferring the heat generated by the heating element as the heat generating object to the refrigerant as much as possible according to its own thermal conductivity.

[0020] Therefore, the heat sink 11 that forms a refrigerant flow space filled with refrigerant as a phase change substance should be processed and designed in a way to minimize the physical distance between the heating element and the refrigerant. This is the most preferred design point in terms of improving heat dissipation performance. The heat sink 11 studied and developed so far still prefers high-priced aluminum alloy materials because the existing aluminum alloy material is the most widely used material.

[0021] However, in the case of pure aluminum, due to the good elongation related to the processability of the metal, the heat sink fin 11 can be manufactured with minimized thickness. However, in order to enhance strength and flexibility, the elongation of the heat sink fin 11 made of aluminum alloy is reduced, and there are limitations in minimizing its thickness.

[0022] Furthermore, when the metal material constituting the heat dissipation fins 11 is aluminum and water is selected as the refrigerant, when filling the refrigerant, the aluminum material and water undergo an oxidation reaction in the initial stage to generate aluminum oxide. During this process, a part of it is replaced by hydrogen, causing the internal pressure to increase. Usually, in a heat dissipation mechanism made of aluminum material, it is necessary to select a special refrigerant such as Honeywell refrigerant or CFC (Freon gas) to prevent this chemical reaction. Therefore, the disadvantage of reducing the range of refrigerant selection is pointed out.

[0023] Phase change refers to the phenomenon that the inherent state of liquid / gas / solid changes when a large amount of energy is stored or stored heat is released.

[0024] Phase change refers to a change in the physical arrangement of molecules rather than a chemical reaction such as chemical bonding or formation. The heat used when a substance is subjected to energy but does not undergo a phase change is called sensible heat, and the heat used when a phase change occurs is called latent heat.

[0025] However, since the relationship between temperature and pressure is proportional, there is a problem that the pressure increases when the temperature of the heat dissipation mechanism increases. In a sealed heat dissipation mechanism, if the pressure increases due to the high temperature conducted from the heating element, the heat dissipation mechanism itself may rupture. In order to solve the above problem, it is necessary to prevent the pressure from increasing, and in the heat dissipation mechanism, a sufficient internal volume is required to achieve pressure balance during the process of realizing the phase change cycle of the substance.

[0026] Furthermore, the refrigerant filled in the heat dissipation mechanism also needs to be of a type that does not cause a chemical reaction with the metal material of the heat dissipation mechanism in order to prevent an increase in the internal pressure of the heat dissipation mechanism.

[0027] For example, when the metal material constituting the heat dissipation mechanism is aluminum (Al) and the refrigerant is water, when the refrigerant is filled, the aluminum material and water undergo an oxidation reaction to generate aluminum oxide in the initial stage. During this process, a part of it is replaced by hydrogen, resulting in a problem of increased internal pressure. Usually, special refrigerants such as Honeywell refrigerant or CFC (Freon gas) are selected in the heat dissipation mechanism made of aluminum to prevent this chemical reaction.

[0028] However, in recent years, many countries have tended to restrict the use of special refrigerants other than water, such as Honeywell refrigerant or CFC (Freon gas). As mentioned above, when the heat dissipation mechanism is damaged due to increased internal pressure or damaged during transportation, transfer or installation of the product, there is a concern that such special refrigerant may leak to the outside, and in this case, there is a problem of possible contamination of the atmosphere and the external environment.

[0029] However, if special refrigerants are excluded as usable refrigerants, the thermal conductivity is higher than that of other metal materials, so the use of heat dissipation mechanisms commonly made of aluminum materials will be limited. Therefore, in the manufacturing industry of related heat dissipation mechanisms, research related to replacement of metal materials constituting the heat dissipation mechanisms and heat dissipation design has been actively carried out recently.

[0030] In addition, as research materials related to the above-mentioned shortcomings, as a paper by co-author Liqiang Deng in the International Journal of Thermal Sciences (published on August 15, 2022, hereinafter referred to as the "existing paper"), the following briefly introduces "Thermal study of the natural air cooling using roll bond flat heatpipe as plate fin under multi-heat source condition".

[0031] Figure 2 Schematic diagram showing the manufacturing process of a roll bond flat heat pipe (hereinafter referred to as "RBFHP") described in a prior art paper (refer to FIG. 4 of the prior art paper). Figure 3 yes Figure 2 Schematic diagram of the experimental device of RBFHP (existing papers Figure 6 ).

[0032] like Figure 2 As shown, the RBFHP of the existing paper utilizes a pre-designed mold to print non-bonding graphite on a first aluminum sheet and then stack it on a second aluminum sheet. The two aluminum sheets are then rolled and joined in the order of hot rolling-cold rolling-annealing, a feed pipe is welded, and high-pressure gas is injected into the interior of the plate from the inlet to expand the unbonded portion, thereby forming a self-connected chamber.

[0033] The existing paper proposes the following conclusions: The RBFHP formed as described above is Figure 3 The result values ​​under the test conditions shown (four evenly distributed heat sources test) are better than those of ordinary aluminum plates (fins).

[0034] However, since the RBFHP of the prior art is manufactured by the roller bonding method as described above, there is a problem that the refrigerant (especially liquid-phase refrigerant) is difficult to arrange close to the bonding end (ie, edge end) closest to the heat source position.

[0035] That is, in the roller bonding method, the edge ends must be joined, and at least the overlapping and joined portion needs to be separated from the heat source (heat generating element), so heat conduction resistance is generated depending on the material of the element itself.

[0036] The manufacturing method of RBFHP in the existing paper is limited to the roller bonding method or the reason why this method is adopted is that the best method for internally forming two aluminum plates is considered to be an inevitable method because it is realistically impossible to bend the aluminum plates themselves.

[0037] In addition, in the existing RBFHP, when the vaporized refrigerant moves near the heat source and moves to the condensation area for condensation, in order to maximize its area, although it has a honeycomb structure (Honey Comb structure), the flow range where the gas-phase refrigerant quickly moves to the upper end farthest from the heat source becomes longer, and since the return path of the liquid-phase refrigerant condensed in the condensation area and the flow range of the gas-phase refrigerant overlap with each other, it can be expected that a problem of large flow resistance will occur. Utility Model Content

[0038] Technical issues

[0039] In order to solve the above technical problems, an object of the present invention is to provide an active heat dissipation mechanism and a manufacturing method thereof that can improve the heat dissipation performance of a heat generating device (electronic device).

[0040] Furthermore, another object of the present invention is to provide an active heat dissipation mechanism and a method for manufacturing the same, which can maximize the heat transfer capability of the refrigerant filled inside.

[0041] Furthermore, another object of the present invention is to provide an active heat dissipation mechanism with excellent manufacturability and a manufacturing method thereof.

[0042] Furthermore, the utility model expands the use scope of water as a refrigerant, and replaces aluminum (Al) material with higher thermal conductivity with metal material with lower thermal conductivity among common metal materials, thereby enabling the production of low-cost products. Another object of the utility model is to provide an active heat dissipation mechanism and a manufacturing method thereof that can exhibit the same or higher heat dissipation performance as existing ones.

[0043] Furthermore, another object of the present invention is to provide an active heat dissipation mechanism and a method for manufacturing the same that can adopt and apply water as a refrigerant that can undergo a phase change, thereby being able to fully meet the predetermined requirements of various countries.

[0044] The technical problems that the present invention is intended to solve are not limited to the technical problems mentioned above, and those skilled in the art can clearly understand other technical problems not mentioned through the following description.

[0045] Technical Solution

[0046] According to the utility model, the active heat dissipation mechanism includes: a heat conductive plate main body, having a refrigerant flow space filled with refrigerant inside, wherein the heat conductive plate main body includes: a heat conductive plate on one side, forming a side surface of the refrigerant flow space in the thickness direction; and a heat conductive plate on the other side, forming the other side surface of the refrigerant flow space in the thickness direction, wherein at least one of the heat conductive plate on one side and the heat conductive plate on the other side is formed with a strength reinforcement portion protruding toward the refrigerant flow space.

[0047] Furthermore, the metal plate member constituting the heat conducting plate body may be made of stainless steel (SUS).

[0048] Furthermore, the refrigerant flow space may include: a first refrigerant flow path, which obtains heat from a heat-generating body serving as a heat dissipation object through the heat conduction plate body; and a plurality of second refrigerant flow paths, which are connected to the first refrigerant flow path, and uniformly supply the liquid phase refrigerant in the refrigerant that is condensed from gas to liquid to one side of the first refrigerant flow path.

[0049] Also, the second refrigerant flow path may be formed along the gravity direction or may be formed inclined with respect to the gravity direction.

[0050] Also, the second refrigerant flow path may be defined between a plurality of inclined guides symmetrically protruding from opposing surfaces of the heat conduction plate body toward the inside of the refrigerant flow space.

[0051] Also, at least one of one end and the other end of the second refrigerant flow path or the plurality of inclined guides may be connected to the first refrigerant flow path, and the one end and the other end may be connected in a straight line.

[0052] Furthermore, the one side heat transfer plate and the other side heat transfer plate may be formed by a single metal plate member, and the refrigerant flow space may be formed by bending the single metal plate member.

[0053] Furthermore, the one-side heat conduction plate and the other-side heat conduction plate may be formed by two separate metal plate members, and the refrigerant flow space may be formed by joining the two metal plate members.

[0054] Technical Effects

[0055] According to an embodiment of the active heat dissipation mechanism and the manufacturing method thereof of the present utility model, the following multiple effects can be achieved.

[0056] First, the heat concentration phenomenon caused by the rising airflow of heat can be minimized on the back surface of the heat dissipation housing body, and active heat transfer generated by the phase change of the refrigerant can be achieved, thereby greatly improving the overall heat dissipation performance.

[0057] Secondly, by shortening the gas-liquid cycle of the refrigerant filled inside, the heat transfer capacity is maximized, thereby achieving the effect of improving the heat dissipation performance.

[0058] Third, the material of the heat transfer plate body constituting the refrigerant flow space where the refrigerant flows due to phase change is replaced with SUS material which is a metal material lower than aluminum material, wherein a higher heat dissipation performance effect can be achieved compared with the material composed of the existing aluminum material.

[0059] Fourth, the refrigerant can be limited to water for selection and use, and in particular, the effect of ensuring the design diversity of product use and manufacturing can be achieved in countries that restrict the use of refrigerants.

[0060] Fifth, compared with metal materials with relatively excellent thermal conductivity, a heat dissipation mechanism with the same or better heat dissipation performance can be manufactured by using metal materials with relatively low thermal conductivity, thereby achieving the effect of saving manufacturing costs and simplifying the manufacturing process. BRIEF DESCRIPTION OF THE DRAWINGS

[0061] Figure 1 is an exploded perspective view showing an example of an antenna device according to the related art.

[0062] Figure 2 This is a schematic diagram showing a manufacturing process of a roll bond flat heat pipe (hereinafter, abbreviated as “RBFHP”) described in a conventional paper (see FIG. 4 of the conventional paper).

[0063] Figure 3 yes Figure 1 Schematic diagram of the experimental device of RBFHP (existing papers Figure 6 ).

[0064] Figure 4a and Figure 4b It is a three-dimensional diagram showing two configuration implementation examples of the back side of the antenna device of the active heat dissipation mechanism according to one embodiment of the utility model.

[0065] Figure 5a and Figure 5b are shown separately Figure 4a and Figure 4b An exploded perspective view of the back side of the antenna device.

[0066] Figure 6It is shown that the Figure 5a An exploded perspective view of the setting state of the active heat dissipation mechanism according to an embodiment of the present invention is shown in FIG.

[0067] Figure 7 It shows that Figure 6 A cross-sectional view and a partial enlarged view of the setting state of the active heat dissipation mechanism according to an embodiment of the utility model are shown.

[0068] Figure 8 It shows that Figure 6 A cutaway stereoscopic view and a partial enlarged view thereof are shown of the setting state of the active heat dissipation mechanism according to an embodiment of the utility model.

[0069] Fig. 9 It is shown Figure 8 A cutaway stereogram of the internal structure of a single active heat dissipation mechanism in a structure.

[0070] Fig.10 is shown for illustration Figure 4a and Figure 5a A back side cross-sectional view of the internal structure of the groove structure.

[0071] Fig.11 It shows that Figure 4a and Figure 5a A partial three-dimensional view of the setting state of the active heat dissipation mechanism according to an embodiment of the present invention, showing the press-in portion in the structure.

[0072] Fig.12 It is a three-dimensional diagram showing the manufacturing process of the active heat dissipation mechanism according to an embodiment of the utility model.

[0073] Fig.13 It is shown Fig.12 The figure shows a plan view of a heat conducting plate body before bending in the structure of an active heat dissipation mechanism according to an embodiment of the present invention.

[0074] Fig.14 It is an enlarged stereoscopic view and an enlarged plan view showing an active heat dissipation mechanism according to an embodiment of the present utility model and a press-in end portion in its structure and a modified example thereof.

[0075] Fig.15 It is shown in Fig.14 Cross-sectional views showing the structures of (d) and (e) with the absorber removed.

[0076] Fig.16 and Fig.17 It is a three-dimensional diagram and a partial enlarged diagram of an active heat dissipation mechanism before and after bending according to an embodiment of the utility model.

[0077] Fig.18 It is a plan view of a bent active heat dissipation mechanism according to an embodiment of the utility model.

[0078] Fig.19 is along Fig.18 Cross-sectional view taken along line CC.

[0079] Fig. 20 and Fig.21 The present invention is a perspective view showing an example of an absorber in the structure of an active heat dissipation mechanism according to an embodiment of the present invention.

[0080] Figures 22a to 22d It is a pre-bending unfolded view of the heat conducting plate body according to the first modification example (200T-1) to the fourth modification example (200T-4) of the partial structure in one embodiment of the present utility model.

[0081] Fig.23 It shows that the composite is applicable Figures 22a to 22d An expanded view of the heat conducting plate body of the fifth modified example (200T-5) of the multiple modified examples.

[0082] Fig.24 1 is a development view showing a heat transfer plate body according to a sixth modification.

[0083] Fig.25 It is a cross-sectional view showing the setting state of the press-fitting portion of the comparative example (200D, (a)) and the active heat dissipation mechanism (200, (b)) according to an embodiment of the present invention.

[0084] Fig.26 is along Figure 4b The cross-sectional view taken along line AA and its partial enlarged view.

[0085] Fig. 27 is along Figure 4b The sectional stereogram and its partial enlarged diagram taken along the AA line.

[0086] Fig.28 is along Figure 4b The sectional stereogram and its partial enlarged diagram taken along the BB line.

[0087] Fig.29 It is a three-dimensional diagram showing an active heat dissipation mechanism according to another embodiment of the utility model.

[0088] Fig.30 yes Fig.29 Exploded three-dimensional diagram.

[0089] Fig.31 yes Fig.29 A cut-away stereoscopic view (a), a partial enlarged view (b) and a cross-sectional view (c) of the portion.

[0090] Fig.32 It is a cross-sectional view showing a connection state of an active heat dissipation mechanism with respect to a press-fit portion according to another embodiment of the present invention.

[0091] Fig.33 is to show that the comparison is based on Fig.25 Graph (a) and comparison graph (b) of the temperature of the heating element 140 of the active heat dissipation mechanism 200D of the comparative example and the active heat dissipation mechanism 200 according to an embodiment of the present invention.

[0092] Fig.34 The table shows the results of measuring the time it takes for the comparative example 200D composed of the heat conducting plate bodies 200D-1 and 200D-2 made of aluminum and the active heat dissipation mechanism 200 according to an embodiment of the present invention made of SUS to reach 50 da, 60 da and 70 da respectively.

[0093] Fig.35 It is a graph comparing the temperature of the heat sink AL6063_REF made of ordinary aluminum material without using refrigerant, which is estimated to be two specifications of RBFHP products in the existing paper (roller-bonded fins (292*115 and 310*90)) and an active heat dissipation mechanism (PTX (310*90)) according to an embodiment of the present invention according to the position of each heat source (heating element).

[0094] Fig.36 The flowchart shows a method for manufacturing an active heat dissipation mechanism according to an embodiment of the present invention.

[0095] Fig.37 is a flow chart showing a method for manufacturing an active heat dissipation mechanism according to another embodiment of the present invention.

[0096] Description of Reference Numerals

[0097] 100: Antenna device 110: Heat dissipation housing body

[0098] 200: Active heat dissipation mechanism 201-1: Heat conduction plate on one side

[0099] 200-2: Heat conducting plate on the other side 201: Press into the end

[0100] 203: heat dissipation plate 205: refrigerant flow space

[0101] 210: First refrigerant flow path 215: Inclined guide

[0102] 220: Second refrigerant flow path 230: Third refrigerant flow path

[0103] 240: Multiple strength reinforcement parts 241: Line reinforcement part

[0104] 242: Point reinforcement 250: Absorber fixing guide

[0105] 300: absorber 301: auxiliary absorber

[0106] 301-1: Upper auxiliary absorber 301-2: Lower auxiliary absorber

[0107] 1200: Active heat dissipation mechanism 1261, 1262: Auxiliary absorber installation part

[0108] 1263: Multiple fixed ribs T: Arbitrary baseline DETAILED DESCRIPTION

[0109] Hereinafter, embodiments of the active heat dissipation mechanism and the manufacturing method thereof of the present invention will be described in detail with reference to the accompanying drawings.

[0110] It should be noted that when assigning reference numerals to the constituent elements of each drawing, the same reference numerals are assigned to the same constituent elements as much as possible even if they are marked on different drawings. In addition, in the process of describing the embodiments of the utility model, if it is determined that the specific description of the relevant known structure or function hinders the understanding of the embodiments of the utility model, its detailed description is omitted.

[0111] When describing the constituent elements of the embodiments of the utility model, terms such as first, second, A, B, (a), (b) and the like may be used. These terms are only used to distinguish one constituent element from other constituent elements, and the nature, order or sequence of the corresponding constituent elements are not limited by these terms. In addition, unless otherwise defined, all terms used herein, including technical terms or scientific terms, have the same meaning as commonly understood by people with conventional knowledge in the technical field to which the utility model belongs. Terms that are the same as those defined in commonly used dictionaries should be interpreted as having the same meaning as in the context of the relevant technology, and should not be interpreted as ideal or overly formal unless clearly defined in this application.

[0112] 1. Setting of heat dissipation mechanism Solar-antenna device

[0113] Figure 4a and Figure 4b 2 is a perspective view showing two configuration implementation examples of the back side of the antenna device of the active heat dissipation mechanism according to an embodiment of the utility model. Figure 5a and Figure 5b It is shown separately Figure 4a and Figure 4b An exploded perspective view of the back side of the antenna device.

[0114] Typically, heat generating devices (electronic devices) are manufactured in various forms throughout the industry, but the applicant of the present utility model is a company engaged in other wireless communication equipment manufacturing industries. A representative heat generating device (electronic device) in wireless communication equipment is an antenna device. The antenna device will be described below as a specific example.

[0115] However, the active heat dissipation mechanism according to the embodiments of the present invention described below is not necessarily to be limited to the application in antenna devices.

[0116] like Figure 4a and Figure 4b As shown, the antenna device 100 using the active heat dissipation mechanism 200, 1200 of the embodiment of the utility model includes: a heat dissipation housing body 110, which forms a receiving space with an opening to the front, and is formed in a rectangular parallelepiped shape that is approximately long in the up-down direction and has a thin front-to-back receiving width.

[0117] The heat dissipation housing body 110 can be made of a thermally conductive material (especially a metal material) so as to be compatible with the heating element described later (for example, see FIG. 22 and FIG. 23 ). Fig.23 ' 140 ') for surface thermal contact to effectively transfer heat.

[0118] Although not shown in the figure, the inner side of the receiving space of the heat dissipation housing body 110 is provided with a clamshell (see Figure 7 The reference numeral "125" is a medium that can be stacked and arranged with a motherboard (refer to Figure 7 The main board is designated as “120” in the figure and is used as a substrate for a power amplifier (PAU: Power Amplifier Unit) and a digital transceiver unit (DTU: Digital Transceiving Unit). The main board can have a plurality of micro bellows filter (MBF: Micro Bellows Filter) elements installed on the front surface and a heating element 140 installed on the back surface.

[0119] Here, the mainboard 120 may be defined as a heating element 140 that generates a lot of heat when driven, such as a radio frequency integrated circuit (RFIC) element or a power amplifier (PA). However, it should be noted that in the embodiment of the present utility model, only the electronic device is used as an antenna device for explanation, and the heating element 140 is not limited to the above-mentioned configuration. For example, a semiconductor or a CPU of a PC, which is a representative heating element, may also be used as the heating element 140.

[0120] A radome panel 50 may be provided on the front surface of the receiving space of the heat dissipation housing body 110 , so as to protect the radiation element implemented as the antenna element from external influences while allowing the radiation element to radiate smoothly.

[0121] However, as described below, for an antenna device in an electronic device that has a greater need for heat dissipation, an antenna cover panel 50 that is not suitable for heat dissipation is provided on the front surface of the heat dissipation housing body 110. Due to the above factors, it is more necessary to concentrate the heat dissipation through the remaining parts other than the front surface of the heat dissipation housing body 110, and an effective heat dissipation design is required through a limited heat dissipation area.

[0122] In addition, an active heat dissipation mechanism 200 , 1200 according to an embodiment of the present invention may be disposed on the back side of the heat dissipation housing body 110 .

[0123] According to the embodiments of the utility model, the active heat dissipation mechanism 200, 1200 is configured in the form of heat dissipation fins. Strictly speaking, it is different from the fixed heat dissipation fins 200F-1, 200F-2 described later, and is characterized in that it is configured as a vapor chamber type with a thin thickness and a refrigerant filled inside, which is a substance that can change phase by heat supplied from the outside.

[0124] Here, the active heat dissipation mechanism 200 according to the embodiment of the present invention may include an absorber 300 that absorbs liquid refrigerant in the refrigerant and keeps it close to the heating element 140, and promotes evaporation of the liquid refrigerant into gaseous refrigerant.

[0125] However, the concept of retaining liquid refrigerant by the absorber 300 is not limited to simply absorbing and storing the liquid refrigerant, but should be understood as at least causing the liquid refrigerant to flow in the opposite direction (upper side) relative to the direction of gravity to a position higher than the water surface through absorption force (or capillary force).

[0126] Generally, a wick component is provided inside the widely known (already known) vapor chamber, and the wick component has a wick structure with a plurality of pores. The wick component here can be manufactured by sintering a metal powder to form a plurality of pores that allow the liquid refrigerant filled in the panel component of the heat-conductive material to move to the side equipped with the heating element by capillary force, while allowing the gaseous refrigerant to flow freely to the outside.

[0127] However, the wick component is not limited to the wick component made of the metal material formed by sintering, and in particular, in the range of being able to absorb and disperse the liquid-phase refrigerant or promote gasification, it can be defined as a concept including all possible materials such as fiber materials, although it has any name such as the absorbent body 300. This will be described in more detail below.

[0128] 2-1. First setting implementation example (one embodiment of the present invention) and setting of the press-in portion

[0129] Figure 6 It is shown that the Figure 5a An exploded perspective view of the setting state of the active heat dissipation mechanism according to an embodiment of the present invention at the press-fit portion of the back side of the antenna device, Figure 7 It shows that Figure 6 A cross-sectional view of the press-in portion of the active heat dissipation mechanism according to an embodiment of the present invention and a partial enlarged view thereof, Figure 8 It shows that Figure 6 A cutaway stereoscopic view and a partial enlarged view of the setting state of the active heat dissipation mechanism according to an embodiment of the utility model of the press-in portion, Fig. 9 It is shown Figure 8 A cutaway perspective view of the internal structure of a single active heat dissipation mechanism in the structure, Fig.10 is shown for illustration Figure 4a and Figure 5a The back side cross-sectional view of the internal structure of the groove structure, Fig.11 It shows that Figure 4a and Figure 5a A partial three-dimensional diagram of the setting state of the active heat dissipation mechanism according to an embodiment of the present utility model, in which the pressing portion in the structure is Fig.12 It is a three-dimensional diagram showing the manufacturing process of the active heat dissipation mechanism according to an embodiment of the utility model.

[0130] like Figure 4a and Figure 5a As shown, the back side of the heat dissipation housing body 110 implemented by the first setting implementation example may be provided with a trench structure 170 in which the middle part between the left end and the right end is divided vertically and is empty.

[0131] Here, on the back side of the heat dissipation housing body 110 corresponding to the left and right side parts of the groove structure 170, a plurality of press-in parts 150 may be provided in a manner that a plurality of active heat dissipation mechanisms 200 according to an embodiment of the present invention are arranged upwardly tilted toward the left end and the right end, respectively. That is, the press-in parts 150 are respectively provided in the upper left direction and the upper right direction with the groove structure 170 as the center, and a pair of active heat dissipation mechanisms 200 fixed to the press-in parts 150 may be formed in a "V" shape while a plurality of them are arranged in a pattern in the upper and lower directions.

[0132] In addition, the active heat dissipation mechanism 200 according to an embodiment of the present invention may be provided in plurality, and all of them are formed into rectangular shapes having the same specifications and being formed in the same length direction, such as Figure 4a As shown, when an active heat dissipation mechanism 200 having the same specification is installed on a plurality of press-in portions 150, one inverted triangle-shaped position on the upper portion of the back side of the heat dissipation housing body 110 and two right-angled triangle-shaped positions on the left and right sides of the lower portion of the back side of the heat dissipation housing body 110 may not be occupied by the active heat dissipation mechanism 200, and fixed heat dissipation fins 200F-1 and 200F-2 may be arranged therein.

[0133] Here, if Figure 4a As shown, the fixed heat dissipation fins 200F-1 and 200F-2 include: an upper fixed heat dissipation fin 200F-1, arranged on the upper side of the back side of the heat dissipation housing body 110 not occupied by the active heat dissipation mechanism 200 according to an embodiment of the present invention; and a lower fixed heat dissipation fin 200F-2, arranged on the left and right lower sides of the back side of the heat dissipation housing body 110 not occupied by the active heat dissipation mechanism 200 according to an embodiment of the present invention.

[0134] This fixed heat dissipation fin 200F-1, 200F-2 can be configured as an ordinary heat dissipation fin form that does not contain refrigerant inside, which is different from the active heat dissipation mechanism 200, 1200 according to the embodiment of the utility model, and can be processed using aluminum or aluminum alloy materials with excellent thermal conductivity among metal materials.

[0135] That is, it is previously indicated that, unlike the active heat dissipation mechanism 200 according to an embodiment of the present invention, the upper fixed heat dissipation fins 200F-1 and the lower fixed heat dissipation fins 200F-2 are not filled with refrigerant and transfer heat based on the thermal conductivity of the metal material itself.

[0136] However, if Figure 4a and Figure 5a As shown, the fixed heat dissipation fins 200F-1 and 200F-2 do not need to be provided separately at the top and the bottom. Figure 4b and Figure 5b As shown in the active heat dissipation mechanism 1200 according to another embodiment of the present invention, fixed heat dissipation fins 200F may be provided only on the lower portion not occupied by the active heat dissipation mechanism 1200.

[0137] The area provided with the groove structure 170 formed on the back side of the heat dissipation housing body 110 implemented using the first setting implementation example and the area (inverted triangle area) 130 provided with the upper fixed heat dissipation fin 200F-1 among the fixed heat dissipation fins 200F-1 and 200F-2 can be provided with a heat transfer medium 135 formed in a common vapor chamber type.

[0138] The heat transfer medium 135 provided in the vapor chamber type may be filled with a predetermined refrigerant. That is, the heat transfer medium 135 of the vapor chamber type may be embedded in the back of the heat dissipation housing body 110 so as to be filled with the refrigerant.

[0139] At the same time, similar to the heat transfer medium 135 provided in the above-mentioned inverted triangle area 130 , a predetermined refrigerant may also be filled in the area corresponding to the groove structure 170 .

[0140] However, if Figure 5a As shown, the groove structure 170 is formed long along the up and down direction (gravity direction) from the lower vertex of the inverted triangle area 130 provided on the back side of the heat dissipation shell body 110, and the liquid refrigerant filled in the groove structure 170 needs to be evenly dispersed and maintained in the up and down length direction.

[0141] To this end, inside the groove structure 170, not only can the refrigerant be easily and evenly vaporized over the entire upper and lower length by means of heat transferred from the heating element 140 or the inside of the heat dissipation shell body 110, but also, regardless of the upper and lower positions, in order to maintain a uniform liquid phase refrigerant, a main body absorber 350 may be further included.

[0142] The main absorbent body 350 can be configured as one of the non-woven fabric itself or the non-woven fabric combined with the inside of the metal braided body and the metal sintered body formed by sintering the powder of the metal material. When a fiber material such as a non-woven fabric absorbs a liquid such as a liquid refrigerant, it is difficult to maintain it for a long time in the vertical direction (gravity direction) due to the load of the liquid. Therefore, its shape can be maintained by the above-mentioned copper wire braided body. Within the limit of being able to maintain the shape of the main absorbent body 350, the non-woven fabric can be combined with the inside of the copper wire braided body, or it can be configured in a spiral shape around the copper wire braided body on the outer peripheral surface of the non-woven fabric.

[0143] However, the main body absorber 350 arranged in the groove structure 170 can be interpreted as being the same as the absorber 300 of the active heat dissipation mechanism 200, 1200 according to the embodiments of the present invention described later in terms of its function. In particular, in terms of enabling the liquid refrigerant filled in each interior to flow upward more than the water surface of the naturally formed liquid refrigerant, it can be regarded as a structure that performs the same function.

[0144] Here, the heat transfer medium 135 and the groove structure 170 may be independently provided without being communicated with each other.

[0145] In particular, the liquid refrigerant inside the groove structure 170 filled in the back side of the heat dissipation housing body 110 undergoes a phase change from vaporization to gas in an evaporation zone (vaporization zone) located relatively lower and defined by the groove structure 170, due to the temperature change according to the heat transferred from the heating element 140, thereby being able to perform partial heat dissipation.

[0146] Furthermore, in the inverted triangle region 130 having the upper fixed heat dissipation fin 200F-1 as a condensation zone located relatively at the upper part, partial heat dissipation can also be performed by causing a phase change from liquid to gas by the main body absorber 350 mentioned above.

[0147] In the groove structure 170 and the inverted triangle area 130 , the vaporized gas phase refrigerant repeatedly performs a gas-liquid cycle causing a phase change from liquefied to liquid through heat exchange with the external air, thereby performing a partial heat dissipation function on the back side of the heat dissipation housing body 110 .

[0148] For reference, the refrigerant filled in the refrigerant flow space inside the active heat dissipation mechanism 200 according to the embodiment of the present invention described later and the refrigerant filled in the above-mentioned inverted triangle area 130 and the groove structure 170 are independent, so that the same specification of refrigerant can be filled, or different specifications of refrigerant can be filled according to the heat generation and installation position of the heating element 140.

[0149] In addition, if Figure 4a and Figure 5a As shown, the back side of the heat dissipation housing body 110 implemented by the first setting implementation example may include a press-in portion 150. In order to press-in the active heat dissipation mechanism 200 according to an embodiment of the utility model, the press-in portion 150 may be a pair of groove ribs 150a, 150b (refer to the following description) Fig.32 ) in the form of equipment.

[0150] As described above, in the active heat dissipation mechanism 200 according to an embodiment of the present invention implemented using the first setting implementation example, the groove structure 170 is centered and arranged upwardly inclined toward the left end and the right end. The press-in portion 150 can also be equipped with multiple ones, which can be arranged in a "V" shape based on the groove structure 170.

[0151] That is, Figure 4a , Figure 5a and Figures 6 to 11 As shown, the active heat dissipation mechanism 200 according to an embodiment of the present invention can be pressed into combination with a plurality of press-in portions 150 formed on the back side of the heat dissipation housing body 110 by a press-in insertion method.

[0152] At this time, although not shown in the figure, it is preferred that the press-fit portion 150 is press-fitted after being treated with thermal epoxy to improve heat transfer efficiency.

[0153] Here, if Fig.10 As shown, the press-in portion 150 is recessed from the front to the rear so as to accommodate the heating surface of the heating element 140 on the inner side surface corresponding to the back side of the heat dissipation housing body 110, or can be arranged to form at least one of the heating coupling surfaces 145 that protrude from the rear to the front through the heating surface toward the heating element 140.

[0154] And, if Fig.11 As shown, the press-in portion 150 can be formed to be inclined so that the refrigerant (especially, liquid-phase refrigerant) filled in the interior of the active heat dissipation mechanism 200 according to an embodiment of the present invention can be easily captured by gravity toward the lower side in the gravity direction, so that the rear end of the heat dissipation plate portion 203 described later is located on the upper side compared to the press-in end portion 201 described later.

[0155] For more details, refer to Fig.11 As described above, the press-in portion 150 is formed to be inclined upward on the left and right sides with the groove structure 170 as a reference, and can be formed on the back side of the heat dissipation housing body 110 in a manner that is inclined at a predetermined angle (refer to arrow "a") with the coordinate Y represented along the left and right horizontal directions as a reference.

[0156] And, refer to Fig.11 , the pressing portion 150 may be formed so that the rear end portion of the active heat dissipation mechanism 200 according to an embodiment of the present invention pressed into the pressing portion 150 is tilted upward at a predetermined angle (see arrow "b") based on the coordinate X.

[0157] Therefore, when the refrigerant filled in the refrigerant flow space of the active heat dissipation mechanism 200 according to an embodiment of the present invention is a liquid refrigerant (liquid-phase refrigerant), the refrigerant naturally flows toward the side of the pressure-injection end 201 located in the direction of gravity, and the gaseous refrigerant (gas-phase refrigerant) can naturally diffuse and flow from the pressure-injection end 201 to the side of the heat dissipation plate 203.

[0158] However, as long as the condensed liquid-phase refrigerant is arranged in a manner that the flow thereof is uniformly guided by the plurality of second refrigerant flow paths 220 or the plurality of inclined guide members 215 described later, as described above, the press-in portion 150 does not need to be at a predetermined angle (see FIG. Fig.11 It is formed obliquely in the manner of arrows "a" and "b").

[0159] 2-2. Second setting implementation example

[0160] Reference Figure 4b and Figure 5b On the back side of the heat dissipation housing body 110 implemented by the second configuration implementation example, an active heat dissipation mechanism 1200 according to another embodiment of the present utility model may be arranged long along the vertical straight direction.

[0161] Therefore, on the back side of the heat dissipation housing body 110 implemented using the second setting implementation example, the press-in portion 150 equipped for combination with the active heat dissipation mechanism 1200 according to another embodiment of the utility model is also arranged longer along the vertical straight direction, and each press-in portion 150 can be formed in parallel along the left-right direction and spaced a predetermined distance apart.

[0162] Here, if Figure 4a and Figure 5a As shown, the back structure of the heat dissipation housing body 110 implemented by the first setting implementation example is based on the middle part of the left and right width directions. In order to achieve the effect of evenly dissipating the heat generated by the heating elements 140 respectively arranged on the left and right sides to the left and right sides, the active heat dissipation mechanism 200 according to an embodiment of the utility model has a plurality of structures arranged in a "V" shape with the groove structure 170 as the reference. On the contrary, as Figure 4b and Figure 5b As shown, on the back side of the heat dissipation housing body 110 implemented using the second setting implementation example, an active heat dissipation mechanism 1200 according to another embodiment of the utility model is arranged in a long vertical direction, so as to prevent the rising airflow of hot air generated by heat dissipation from being subjected to flow resistance directly upward.

[0163] Hereinafter, for the sake of convenience of explanation, the active heat dissipation mechanism 200 disposed on the back side of the heat dissipation housing body 110 implemented using the first setting implementation example is defined as "an active heat dissipation mechanism 200 according to one embodiment of the present invention", and the active heat dissipation mechanism 1200 disposed on the back side of the heat dissipation housing body 110 implemented using the second setting implementation example is defined as "an active heat dissipation mechanism 1200 according to another embodiment of the present invention" for distinguishing explanations, but each embodiment only differs in its appearance and setting shape, and therefore, the settings can be mixed regardless of the above-mentioned setting implementation examples.

[0164] 3. First refrigerant flow path (overall flow path) and second refrigerant flow path (liquid-phase refrigerant guide flow path)

[0165] Fig.12 It is a three-dimensional diagram showing the manufacturing process of the active heat dissipation mechanism according to an embodiment of the utility model. Fig.13 It is shown Fig.12 The figure shows a plan view of a heat conducting plate body before bending in the structure of an active heat dissipation mechanism according to an embodiment of the present invention. Fig.14 It is an enlarged stereoscopic view and an enlarged plan view showing an active heat dissipation mechanism according to an embodiment of the present utility model and a press-in end portion in its structure and a modified example thereof. Fig.15 It is shown in Fig.14 Cross-sectional views showing the structures of (d) and (e) with the absorber removed.

[0166] Reference Figures 12 to 15 According to an embodiment of the present invention, the active heat dissipation mechanism 200 as a single metal plate component may include a bending process (S20) and a bonding process (S40) (refer to the following description) Fig.33 ) The heat transfer plate bodies 200-1 and 200-2 have refrigerant flow spaces filled with refrigerant and through which the refrigerant flows.

[0167] That is, the active heat dissipation mechanism 200 according to an embodiment of the present invention is to use the heat conducting plate bodies 200-1 and 200-2 as a single metal plate component. Fig.10 After bending (bending step (S20)) based on a predetermined arbitrary reference line T, bonding (bonding step (S40)) is performed, thereby forming a sealed refrigerant flow space 205 inside.

[0168] That is, the heat conducting plate bodies 200-1 and 200-2 as a single metal plate component can be molded in a predetermined manner to form a refrigerant flow space 205. In particular, the active heat dissipation mechanism 200 according to an embodiment of the utility model can directly form at least the first refrigerant flow path 210 described later in the refrigerant flow space 205 in which the refrigerant is filled and flows by bending in a predetermined manner (including the bending process (S20) and the joining process (S40) described later).

[0169] Here, the refrigerant flow space 205 may include: a first refrigerant flow path 210, which is arranged in a position relatively located at the lower side based on the relative gravity direction, so as to facilitate the capture (retention) or water storage of the liquid-phase refrigerant, and form an evaporation area for changing the phase of the liquid refrigerant (liquid-phase refrigerant) into a gaseous refrigerant (gas-phase refrigerant); and a second refrigerant flow path 220, which is arranged in a condensation area at a position other than the first refrigerant flow path 210, and guides the flow of the liquid-phase refrigerant that has changed phase from the gaseous refrigerant (gas-phase refrigerant) to the above-mentioned evaporation area.

[0170] That is, as a portion equipped with the first refrigerant flow path 210, the portion formed by the bending (bending process (S20)) is defined as an evaporation area where the liquid refrigerant in the refrigerant evaporates, and the remaining portion outside the evaporation area is defined as a condensation area, and the second refrigerant flow path 220 can be equipped in the condensation area.

[0171] In particular, the first refrigerant flow path 210 is a portion that is deformed in shape by bending in the predetermined manner of a single metal plate component. For the heating element 140 or the press-fit portion 150 equipped with the heating element 140, it is formed to be separated by only a spacing distance according to the material thickness of the metal plate component, so that the liquid refrigerant in the refrigerant is filled.

[0172] In this case, the first refrigerant flow path 210, as a part for storing and retaining the liquid phase refrigerant in the refrigerant filled in the refrigerant flow space 205, can be arranged vertically up and down in the gravity direction or arranged with at least the upper end and the lower end inclined relative to the gravity direction. Therefore, the water surface of the liquid phase refrigerant stored in the first refrigerant flow path 210 is at least located at the part close to the lower end of the upper end and the lower end of the above-mentioned inclined arrangement. This is the same principle that is also applicable to the active heat dissipation mechanism 1200 of another embodiment of the utility model described later.

[0173] In more detail, the active heat dissipation mechanism 200 according to an embodiment of the present invention can be realized by placing the single heat conducting plate bodies 200-1 and 200-2 along any predetermined reference line T (see Fig.12) is bent (bending step (S20)) and joined (joining step (S40)) as a reference to form a sealed refrigerant flow space 205 inside.

[0174] Therefore, the first refrigerant flow path 210, as a portion whose shape is deformed by the bending (bending process (S20)), can be defined as a refrigerant filling and flow space in which the refrigerant is filled with liquid-phase refrigerant, with a spacing distance only separated according to the material thickness of the metal plate part, for the heating element 140 or the press-fit portion 150 equipped with the heating element 140.

[0175] Specifically, the "separation distance based on the material thickness" refers to the distance between the first refrigerant flow path 210 and the heating element 140 or the press-fit portion 150 equipped with the heating element 140. However, the first refrigerant flow path 210 is not simply defined as a space that captures only liquid-phase refrigerant, so the evaporation area at one end in the width direction that receives heat from the heating element 140 as the heat dissipation target to the heat transfer plate main body 200-1, 200-2 is more significant.

[0176] Furthermore, the definition of the first refrigerant flow path 210 in the active heat dissipation mechanism 200 according to one embodiment of the utility model is different from the definition of the first refrigerant flow path 1210 of the active heat dissipation mechanism 1200 according to another embodiment of the utility model described later. Here, the common technical structure of the first refrigerant flow path 210 being directly inserted into the evaporation area or the press-in portion 150 at one end in the width direction of the heat supply from the heating element 140 as the heat dissipation object through the heat conduction plate main body 200-1, 200-2 is of great significance.

[0177] For example, the active heat dissipation mechanism according to the present invention is not necessarily limited to the bending manufacturing method of the above-mentioned embodiment 200 .

[0178] That is, Figure 4b and Figure 5b and the following Figure 23 to Figure 29 As shown, by joining two separate metal plate members in a joining manner (joining step ( S40 )), an active heat dissipation mechanism 1200 according to another embodiment of the present invention in which a sealed refrigerant flow space 205 is formed can also be manufactured.

[0179] As described above, the manufacturing method of the first refrigerant flow path 1210 in the active heat dissipation mechanism 1200 according to another embodiment of the present invention is a bonding method, which is different from the active heat dissipation mechanism 1200 according to one embodiment of the present invention, because the position or arrangement characteristics based on the spacing distance according to the material thickness cannot be directly applied to the active heat dissipation mechanism 1200 according to another embodiment of the present invention. Below, the specific features of the active heat dissipation mechanism 1200 according to another embodiment of the present invention will be described in more detail.

[0180] In addition, a plurality of second refrigerant flow paths 220 are formed in the condensation area except for the first refrigerant flow path 210, which serve as flow paths from the other end of the width direction of the heat transfer plate body 200-1, 200-2 to the liquid phase refrigerant in the refrigerant, through which the liquid phase refrigerant condenses from gas to liquid in the refrigerant to the side of the first refrigerant flow path 210 by surface tension or gravity.

[0181] In more detail, if the gaseous refrigerant (gas-phase refrigerant) is condensed into a liquid refrigerant (liquid-phase refrigerant) through a heat exchange process with the external air in the condensation area, the original position volume of the second refrigerant flow path 220 in the refrigerant flow space 205 where condensation is taking place gradually increases, and when flowing in the direction of gravity, a flow path is provided in such a manner that it flows toward the first refrigerant flow path 210 and supplies a uniform amount of liquid-phase refrigerant.

[0182] In particular, as described below, the second refrigerant flow path 220 can be positioned between a plurality of inclined guides 215, and when the liquid-phase refrigerant condensed in the condensation area flows toward the first refrigerant flow path 210 side, the dispersed flow toward the second refrigerant flow path 220 side adjacent to the second refrigerant flow path 220 serving as a magnetic flow path can be suppressed by surface tension.

[0183] That is, since the flow space of the plurality of inclined guides 215 is smaller than the flow space of the second refrigerant flow path 220 , surface tension is applied, thereby suppressing the flow toward the adjacent second refrigerant flow path 220 side.

[0184] As described above, if the dispersed flow of the condensed liquid-phase refrigerant is suppressed by multiple inclined guides 215 and the second refrigerant flow path 220, the phenomenon of the liquid-phase refrigerant falling directly below the direction of gravity can be minimized. By connecting each lower end to the first refrigerant flow path 210 at uniform intervals, the liquid-phase refrigerant condensed in the condensation area will not be heavier and can be supplied to the first refrigerant flow path 210 side in a uniform amount.

[0185] Meanwhile, the plurality of second refrigerant flow paths 220 may be defined between the plurality of inclined guides 215 protruding from the opposing surfaces of the heat conducting plate bodies 200 - 1 and 20 - 2 toward the inside of the refrigerant flow space 205 .

[0186] Reference Fig.12 (a), according to an embodiment of the present invention, the active heat dissipation mechanism 200 can form the above-mentioned first refrigerant flow path 210 and the second refrigerant flow path 220 and the multiple inclined guide members 215 described later for realizing these by a stamping process (S10) using a heat conducting plate body 200-1, 200-2 made of a single component of a predetermined thermally conductive material before a bending process (S20) described later.

[0187] At this time, the heat conduction plate bodies 200-1 and 200-2 in the flat stretched state before the bending step (S20) are formed to have a width in the left-right direction smaller than Fig.12 In the case of a rectangular shape having a length in the vertical direction of the figure, an arbitrary reference line T is arranged to cross the center of the left end and the right end in the vertical direction, and can be a bending step (S20) described later (refer to Fig.12 (b) and (c)) of the benchmark.

[0188] At this time, the center portion between the left and right ends of the heat conducting plate bodies 200-1 and 200-2 is the middle portion, which can be understood as the boundary portion between the heat conducting plate 200-1 on one side and the heat conducting plate 200-2 on the other side.

[0189] Reference Fig.12 (b) and (c) can be bent by a bending jig (not shown) so that the heat conductive plate 200-1 on the left side and the heat conductive plate 200-2 on the right side contact each other based on an arbitrary reference line T.

[0190] At this time, in addition to the first refrigerant flow path 210 and the second refrigerant flow path 220, a third refrigerant flow path 230 may be formed additionally according to the embodiment, and the joining step (S40) described later (see Fig.12 The plurality of strength reinforcing parts 240 required for (d)) may be formed so as to face each other and be in surface contact with each other.

[0191] Reference Fig.12 (d) If the heat conducting plate 200-1 on one side and the heat conducting plate 200-2 on the other side of the heat conducting plate body 200-1, 200-2 are in surface contact with each other, then while being joined to each other along their edge ends using a predetermined joining method, each of the multiple strength reinforcement parts 240 in surface contact with each other can be joined to each other using a predetermined joining method.

[0192] At this time, for the refrigerant filling process and caulking process described later, one end and the other end of the first refrigerant flow path 210 formed by the bending process (S20) can connect the refrigerant flow space 205 with the outside, and the remaining parts (heat dissipation plate part 203) can be sealed and combined to completely block the refrigerant flow space 205 from the outside.

[0193] In more detail, Fig.12 As shown, the active heat dissipation mechanism 200 according to an embodiment of the present invention is based on an arbitrary reference line T defined as a straight line along the up-down direction, and the heat conducting plate bodies 200-1 and 200-2 may include: a heat conducting plate 200-1 on one side, forming the left end before the bending process (S20); and a heat conducting plate 200-2 on the other side, forming the right end before the bending process (S20). Here, the heat conducting plate 200-1 on one side and the heat conducting plate 200-2 on the other side can be understood as defining the heat conducting plate bodies 200-1 and 200-2 before the bending process (S20).

[0194] However, the heat conduction plate bodies 200 - 1 and 200 - 2 may be redefined as a structure after the bending step ( S20 ) described later.

[0195] For example, the heat conducting plate main body 200-1, 200-2, as a part formed by the bending process (S20) and the joining process (S40) described later, may include: a pressed-in end portion 201, which is pressed and combined with the pressed-in portion 150 which is inclined upward to the left and right sides respectively with the groove structure 170 formed on the back side of the heat dissipation shell main body 110 as the heat dissipation object as the center; a heat dissipation plate portion 203, which is a portion defined by the edge ends of the heat conducting plate main body 200-1, 200-2 except the pressed-in end portion 201, and performs heat dissipation according to the phase change of the refrigerant and the heat exchange with the external air (external air).

[0196] However, the heat sink portion 203 is preferably defined as all areas that perform heat dissipation after the refrigerant (especially, gas-phase refrigerant) filled inside and the outside air (external air) exchange heat as a portion other than the above-mentioned press-in end portion 201. The heat exchange between the gas-phase refrigerant in the heat sink portion 203 and the outside air means that the gas-phase refrigerant condenses and changes phase into the liquid-phase refrigerant.

[0197] In addition, the heat dissipation plate portion 203 may be formed with a plurality of strength reinforcement portions 240 protruding from the inner surface of the one side heat conduction plate 200 - 1 and the inner surface of the other side heat conduction plate 200 - 2 separated in the thickness direction toward the refrigerant flow space 205 .

[0198] At the same time, as described below, a plurality of strength reinforcement portions 240 are formed simultaneously together with the second refrigerant flow path 220, the third refrigerant flow path 230 and a plurality of inclined guide members 215 through a stamping process (S10), and after the bending process (S20) and the joining process (S40), when observed from the outside, it can be understood that they are formed by being recessed from the outside to the inside of the heat dissipation plate portion 203.

[0199] If the first refrigerant flow path 210 is located at the lower side based on the gravity direction, and the refrigerant that mainly changes phase to liquid refrigerant (liquid-phase refrigerant) in the refrigerant flow space 205 flows to the lower side along the gravity direction, it can be defined as a flow path that performs the function of uniformly moving and dispersing the liquid-phase refrigerant in the entire evaporation area that is converted into a gas phase by heat transferred from the plurality of heating elements 140 of the heat dissipation housing body 110 while capturing the liquid refrigerant on the same inclined guide 215. At this time, the uniform movement and dispersion of the liquid-phase refrigerant in the function of the first refrigerant flow path 210 can refer to the concept of transferring the liquid-phase refrigerant at least in a direction different from the gravity direction through the absorber 300 described later.

[0200] Furthermore, in the function of the first refrigerant flow path 210, the uniform movement and dispersion of the liquid-phase refrigerant can be understood as a concept that the liquid-phase refrigerant is uniformly supplied and transferred through the plurality of second refrigerant flow paths 220 or the plurality of inclined guides 215 formed obliquely with respect to the single first refrigerant flow path 210. This will be described in more detail in the description of the absorber 300.

[0201] By inserting and disposing the absorber 300 described later in the first refrigerant flow path 210 , it is possible to promote the collection and dispersion of the liquid-phase refrigerant and the transfer of the liquid-phase refrigerant in a direction different from the gravity direction.

[0202] Here, if Fig.13 As shown, after the above-mentioned bending process (S20), the first refrigerant flow path 210 can be formed symmetrically with each other along the thickness direction of the refrigerant flow space 205 based on an arbitrary reference line T. Therefore, the first refrigerant flow path 210 can be newly defined as a flow path including the arbitrary reference line T as a reference of the bending process (S20).

[0203] 4. The first refrigerant flow path and the press-in end portion and the second refrigerant flow path and the heat dissipation plate portion

[0204] As mentioned above, Figures 14 to 16As shown, the heat transfer plate bodies 200-1 and 200-2 can be bent with one side heat transfer plate 200-1 and the other side heat transfer plate 200-2 based on an arbitrary reference line T, and a first refrigerant flow path 210 can be formed internally, and a pressed-in end portion 201 can be formed externally to be combined with a pressed-in portion 150 formed on the back side of the heat dissipation shell body 110 that serves as a heat dissipation object.

[0205] Furthermore, as described above, the heat conducting plate bodies 200 - 1 and 200 - 2 may further include a heat dissipating plate portion 203 , which is defined as a remaining portion except the press-fit end portion 201 .

[0206] After the bending step ( S20 ), the heat dissipation plate portion 203 has its edges of the one side heat conduction plate 200 - 1 and the other side heat conduction plate 200 - 2 joined to each other in a predetermined manner, thereby sealing the refrigerant flow space 205 .

[0207] Here, the predetermined joining method may be one of a welding joining method and a joining joining method. Preferably, laser welding may be used in the welding joining method. However, laser welding is not necessarily required, and any joining method may be used as long as it has a sealing force sufficient to prevent leakage of the refrigerant filled inside.

[0208] In addition, if Fig.14 and Fig.15 As shown, the end of the press-in end portion 201 inserted into the press-in portion 150 may include a circular cross section (see Fig.14 (b) and (d) Fig.15 (a)) or plane section (refer to Fig.14 (c) and (e) of Fig.15 (b)) is formed by bending in one of the ways.

[0209] In more detail, Fig.14 (b) and (d) and Fig.15 As shown in (a), the press-in end portion 201 can be formed into a semicircular arc-shaped cross section having a radius of R1, such as Fig.14 (c) and (e) and Fig.15 As shown in (b), the edge end portion may be formed to have a rounded surface with a radius R2 smaller than R1, and the remaining portion may be formed to have a planar end portion.

[0210] In the case of the press-fit end portion 201 implemented in a manner having an R1 value (see Fig.15 (a)) has an advantage in terms of process because it can be formed through a single bending process (S20). On the contrary, it has a disadvantage that the volume occupied by the first refrigerant flow path 210 is relatively small relative to the pressing portion 150.

[0211] On the contrary, in the case of the press-fit end portion 201 implemented in a manner having an R2 value (see Fig.15 (b) of the embodiment of the present invention) has a disadvantage in terms of the process of forming the first refrigerant flow path 210 by two bending steps (S20). In addition, the first refrigerant flow path 210 has an advantage that the volume occupied by the first refrigerant flow path 210 relative to the press-fit portion 150 is relatively large.

[0212] In this case, the outer side surface of the press-in end portion 201 may be inserted and installed in a press-in manner after the press-in portion 150 formed on the back surface of the heat dissipation case body 110 is subjected to a thermal epoxy treatment.

[0213] Furthermore, when the press-in end portion 201 is inserted into the press-in portion 150, at least a portion of the first refrigerant flow path 210 can flow into the inner side of the front end of the press-in portion 150. The installation structure of the active heat dissipation mechanism 200 according to one embodiment of the present invention and the active heat dissipation mechanism 1200 according to another embodiment of the present disclosure relative to the press-in portion 150 will be described in more detail below.

[0214] In addition, if Figures 12 to 15 As shown, the multiple second refrigerant flow paths 220 can play the following role: the refrigerant that changes phase into gas-phase refrigerant (gas-phase refrigerant) and flows toward the heat dissipation plate portion 203 side and condenses into liquid-phase refrigerant (liquid-phase refrigerant) again after heat exchange with the external air naturally flows to the first refrigerant flow path 210 side.

[0215] In more detail, Figures 12 to 15 As shown, the second refrigerant flow path 220 is provided in a condensation area formed at a location other than the first refrigerant flow path 210, and can be defined as a space between a plurality of inclined guides 215 that guide the flow of liquid refrigerant that changes from gas phase to liquid phase to the evaporation area.

[0216] Here, if Fig.13 As shown, the plurality of inclined guides 215 defining the second refrigerant flow path 220 may be configured to protrude from the inner side surfaces of the one side heat transfer plate 200-1 and the other side heat transfer plate 200-2 toward the refrigerant flow space 205 after the bending step (S20) described later.

[0217] The plurality of inclined guides 215 may be provided in a straight line form that is inclined downward in the gravity direction toward the first refrigerant flow path 210. Therefore, the liquid phase refrigerant condensed on the heat dissipation plate portion 203 side may naturally condense and flow toward the first refrigerant flow path 210 side along the plurality of inclined guides 215 that are inclined downward, and may perform the function of increasing the circulation speed of the liquid phase refrigerant.

[0218] Here, the plurality of second refrigerant flow paths 220 or the plurality of inclined guides 215 may allow adjacent second refrigerant flow paths 220 or inclined guides 215 to be arranged in parallel with each other. The second refrigerant flow paths 220 in which the liquid-phase refrigerant condensed in a wider condensation region having an area larger than that of the evaporation region roughly defined as the first refrigerant flow path 210 is closely and evenly arranged in parallel, or the flow of the liquid-phase refrigerant may be dispersed by the inclined guides 215, thereby providing an advantage of heat dissipation through the entire condensation region with uniform heat dissipation performance.

[0219] Furthermore, a plurality of inclined guides 215 are respectively formed on one side heat transfer plate 200 - 1 and the other side heat transfer plate 200 - 2 , and the front ends of the guides 215 protruding toward the refrigerant flow space 205 may be formed to be separated from each other without being joined in the refrigerant flow space 205 .

[0220] As described above, since the second refrigerant flow path 220 performs the function of guiding the flow of the liquid-phase refrigerant in the gravity direction, preferably, the second refrigerant flow path 220 has a size in the thickness direction that can naturally form a flow in the gravity direction without stopping the flow due to the surface tension that is an inherent characteristic of the liquid. In addition, the second refrigerant flow path 220 can be formed to suppress the dispersed flow toward the adjacent second refrigerant flow path 220 side due to surface tension or gravity after the liquid-phase refrigerant condenses to a predetermined size or more.

[0221] At the same time, at least one of one end and the other end of the multiple second refrigerant flow paths 220 or the multiple inclined guide members 215 is connected to the evaporation region or the first refrigerant flow path 210 formed in the evaporation region, and the end connected to the side of the first refrigerant flow path 210 formed in the evaporation region or the evaporation region (i.e., one of the one end and the other end) is located on the lower side in the direction of gravity relative to the other end of the one end and the other end.

[0222] Therefore, when at least one of one end and the other end of the multiple second refrigerant flow paths 220 is defined as "one end", the one end has the same meaning as the "lower end" located on the lower side based on the gravity direction, conversely, when another of one end and the other end of the multiple second refrigerant flow paths 220 is defined as "the other end", the other end can have the same meaning as the "upper end" located on the upper side based on the gravity direction.

[0223] Further, as described above, the plurality of second refrigerant flow paths 220 or the plurality of inclined guides 215 may be formed such that at least one of one end and the other end is connected to the first refrigerant flow path 210 and one end and the other end are connected in a straight line.

[0224] According to the straight shape of the multiple second refrigerant flow paths 220 as described above, the distance between one end of the first refrigerant flow path 210 side which is closest to the heating element 140 and receives heat and the other end on the outermost end side of the condensation area which actively condenses through heat exchange with the outside air is minimized, and the straight shape of the second refrigerant flow path 220 itself is an optimal shape that can minimize the overlapping length (flow resistance length) between the liquid-phase refrigerant flow path and the gas-phase refrigerant flow path.

[0225] For example, although not shown in the figure, the difference between the straight-line-shaped second refrigerant flow path 220 and the case where the second refrigerant flow path 220 is formed into a honeycomb structure (honeycomb structure) only considering ensuring the heat dissipation area of ​​the condensation area corresponding to the heat dissipation plate portion 203 will be briefly described as follows.

[0226] That is, in the case where the second refrigerant flow path 220 is formed into a honeycomb structure, when the liquid-phase refrigerant receives heat in the evaporation area corresponding to the injection end 201 and changes phase into the gas-phase refrigerant and then diffuses and flows to the outer end side, the liquid-phase refrigerant acts as a flow resistance to prevent the liquid-phase refrigerant from flowing in a straight line to the other end side of the heat dissipation plate portion 203 corresponding to the minimum distance, and therefore it is difficult to expect active gas-liquid circulation.

[0227] In contrast, in the case of an active heat dissipation mechanism 200 according to an embodiment of the utility model, the difference lies in that the gas-liquid circulation from the first refrigerant flow path 210 (i.e., one end in the width direction) to the outer end portion serving as the end of the condensation area (i.e., the other end in the width direction) adopts a straight structure that proceeds smoothly without any particular flow resistance and a gas-liquid flow separation structure described later.

[0228] That is, in an active heat dissipation mechanism 200 according to an embodiment of the present invention, unlike the case of a honeycomb structure, in order to guide the liquid phase flow of the liquid refrigerant after the phase change in the gas-phase refrigerant in the refrigerant flow space 205, a plurality of refrigerant flow paths 210 are formed to branch from one end in the width direction of the first refrigerant flow path 210 located on the lower side in the gravity direction without branching from the other end in the width direction.

[0229] This can be confirmed to be a heat dissipation mechanism that is completely different from the honeycomb structure (honeycomb structure) provided in the form of a refrigerant flow path in the RBFHP of the "conventional paper" introduced in the "background art" section.

[0230] That is, in the RBFHP of the existing paper, the edge ends of two material sheets are joined by roller joining. Even if the refrigerant is at least filled inside, in order to make the liquid-phase refrigerant initially receive the heat actually transferred from the heat generating element, there is a concern that the thermal fluidity will decrease due to the thermal resistance of the material itself according to the length of the edge end serving as the joining portion. After the liquid-phase refrigerant receives the heat and is converted into a gas-phase refrigerant, as the flow path toward the outer end side becomes longer due to the honeycomb structure, resistance to the flow in the opposite direction to the condensed liquid-phase refrigerant is generated, making it difficult to expect an active gas-liquid circulation.

[0231] In contrast, in the case of an active heat dissipation mechanism 200 according to an embodiment of the present invention, the heat conducting plate main body 200-1, 200-2 is separated from the heat generating element 140 or the press-fit portion 150 equipped with the heat generating element 140 by a thickness equivalent to the thickness of the single metal plate component through the bending process (S20) of the metal plate component, and is close to the first refrigerant flow path 210 for the entry of liquid-phase refrigerant. A straight structure and a gas-liquid flow separation structure are used in which the gas-liquid circulation from the first refrigerant flow path 210 (i.e., one end in the width direction) to the outer end portion of the end portion of the condensation area (i.e., the other end in the width direction) can be smoothly carried out without special flow resistance, thereby realizing a completely different heat dissipation mechanism.

[0232] That is, in order to guide the liquid phase flow of the liquid phase refrigerant transformed from the gas phase refrigerant in the refrigerant flow space, multiple second refrigerant flow paths 220 are formed to branch from one end in the width direction of the first refrigerant flow path 210 located on the lower side in the gravity direction without branching from the other end in the width direction.

[0233] In addition, as described above, the plurality of inclined guide members 215 not only define the second refrigerant flow path 220 between the respective inclined guide members 215 as a flow path for guiding the flow of liquid-phase refrigerant in the gravity direction, but can also perform the function of defining the third refrigerant flow path 230 described later corresponding to the separation portion in the thickness direction.

[0234] In this case, when the plurality of inclined guide members 215 are based on the premise that the first refrigerant flow path 210 is relatively located at the lower part in the gravity direction due to the tilt adjustment of the entire heat dissipation shell body 110, it is preferred that a pattern is formed in a manner inclined relative to the first refrigerant flow path 210 to form a flow path for the liquid phase refrigerant (liquid phase refrigerant) to flow.

[0235] Here, the second refrigerant flow path 220 defined as the adjacent gap space of the plurality of inclined guides 215 may be a refrigerant flow path extending obliquely upward toward the width direction end sides of the heat transfer plate bodies 200-1 and 200-2 from the first refrigerant flow path 210 corresponding to the arbitrary reference line T. This is to allow the liquid-phase refrigerant liquefied on the heat dissipation plate portion 203 side to easily move to the first refrigerant flow path 210 having the absorber 300 due to its own weight.

[0236] 5. The third refrigerant flow path

[0237] Fig.16 and Fig.17 It is a three-dimensional diagram and a partial enlarged diagram of an active heat dissipation mechanism before and after bending according to an embodiment of the utility model. Fig.18 It is a plan view of a bent active heat dissipation mechanism according to an embodiment of the utility model. Fig.19 is along Fig.18 Cross-sectional view taken along line CC.

[0238] refer to Figures 16 to 19 According to an embodiment of the present invention, the active heat dissipation mechanism 200 may further include a third refrigerant flow path 230 .

[0239] Here, after the heat conduction plate bodies 200-1 and 200-2 complete the bending process (S20) and the joining process (S40), one surface of the heat conduction plate 200-1 on one side and a portion of one surface of the heat conduction plate 200-2 on the other side are joined to each other with an arbitrary reference line T as a reference to form a refrigerant flow space 205, and the refrigerant flow space 205 can form the first refrigerant flow path 210 and the second refrigerant flow path 220 together with the joining process (S40) as well as the third refrigerant flow path 230 added according to the embodiment.

[0240] Reference Edge Fig.17 In the cross-sectional view cut along the EE line of the second refrigerant flow path 220, the second refrigerant flow path 220 is formed on the heat conducting plate 200-1 on one side and the heat conducting plate 200-2 on the other side, respectively, and in contrast to being defined as being formed between each adjacent plurality of inclined guide members 215 except for the thickness direction (Thickness direction) of the refrigerant flow space 205, the third refrigerant flow path 230 can be defined as the space between the inclined guide member 215 formed on the heat conducting plate 200-1 on one side and the inclined guide member 215 formed on the heat conducting plate 200-2 on the other side in the thickness direction of the refrigerant flow space 205. However, it should be noted that when defining the second refrigerant flow path 220, the meaning of excluding the thickness direction means that the defined reference direction is not the thickness direction, and should not be interpreted as excluding the volume occupied by the thickness direction as the corresponding volume and space.

[0241] In more detail, the third refrigerant flow path 230 is a region where the thickness length of the refrigerant flow space 205 can be set to be smaller than the second refrigerant flow path 220 when the inclined guide 215 is formed to protrude further toward the refrigerant flow space 205 than the second refrigerant flow path 220. That is, the third refrigerant flow path 230 can be defined by a plurality of inclined guides 215 as a region having a thickness smaller than that of the second refrigerant flow path 220.

[0242] At the same time, the third refrigerant flow path 230 is a portion where a plurality of inclined guide members 215 are formed on the facing surfaces of one side heat conduction plate 200-1 and the other side heat conduction plate 200-2 in the heat conduction plate body 200-1, 200-2, and can be defined as a portion that is not connected but separated from each other in the refrigerant flow space 205.

[0243] The third refrigerant flow path 230 can play the role of providing a gas flow path, so that the refrigerant filled in the refrigerant flow space 205 can be easily diffused and flowed to the entire heat sink portion 203 after being phase-changed into a gas-phase refrigerant in the evaporation region as the first refrigerant flow path 210. The gas-phase refrigerant evaporated in the first refrigerant flow path 210 as the evaporation region moves toward the heat sink portion 203 side, and is smoothly and evenly dispersed through the third refrigerant flow path 230, thereby performing heat dissipation and condensation.

[0244] For example, while the liquid-phase refrigerant naturally flows through the space between the inclined guides 215 adjacent to the second refrigerant flow path 220 , the gas-phase refrigerant actively flows through the third refrigerant flow path 230 which is a space not occupied by the liquid-phase refrigerant.

[0245] However, this does not mean that the liquid-phase refrigerant is completely separated from the gas-phase refrigerant through the third refrigerant flow path 230 and is not occupied. Preferably, it should be understood that the gas-phase refrigerant flows more actively through the third refrigerant flow path 230 .

[0246] That is, the phase change of the refrigerant is not formed by a complete division between the liquid-phase refrigerant and the gas-phase refrigerant, so it is difficult to accurately distinguish and define, but generally speaking, the second refrigerant flow path 220 is relatively large in size in the thickness direction, so it becomes the main flow path of the liquid-phase refrigerant, and the third refrigerant flow path 230 can be the main flow path of the gas-phase refrigerant.

[0247] In more detail, since the gas-phase refrigerant has greater activity than the liquid-phase refrigerant, the third refrigerant flow path 230 having a relatively small size in the thickness direction may be the main flow path, and considering the surface tension of the liquid refrigerant itself, the second refrigerant flow path 220 having a larger size in the thickness direction than the third refrigerant flow path 230 may be the main flow path of the liquid refrigerant.

[0248] In addition, the third refrigerant flow path 230 may also be defined as a refrigerant flow path that connects spaces between the second refrigerant flow paths 220 that are spaced apart in parallel.

[0249] For example, the second refrigerant flow path 220 can be processed to protrude to the part forming the refrigerant flow space on one side and the other side of the heat conducting plate body 200-1, 200-2 by the stamping process (S10) before bending, with an arbitrary reference line T of the middle part equipped with the first refrigerant flow path 210 as the reference, so that the heat conducting plate 200-1 on one side and the heat conducting plate 200-2 on the other side are formed after bending to form the third refrigerant flow path 230, so that they can form a certain pattern shape, thereby being divided by the third refrigerant flow path 230. Of course, it should be noted that the "division" here does not refer to a complete physical and spatial division, but refers to the shape and position that distinguishes the second refrigerant flow path 220 and the third refrigerant flow path 230.

[0250] In addition, if Fig.16 As shown, the heat transfer plate bodies 200-1 and 200-2 can be bent at one heat transfer plate 200-1 and the other heat transfer plate 200-2 corresponding to both ends in the width direction with reference to an arbitrary reference line T and joined to each other in surface contact.

[0251] At this time, as described above, the first refrigerant flow path 210, the second refrigerant flow path 220 and the third refrigerant flow path 230 are formed symmetrically on the one side heat conduction plate 200-1 and the other side heat conduction plate 200-2 with an arbitrary reference line T as the center, and each thickness direction size has an internal size that is twice the depth of the recess formed on the one side heat conduction plate 200-1 and the other side heat conduction plate 200-2 by the stamping process (S10) described later.

[0252] In more detail, Fig.19 As shown, the first refrigerant flow path 210 is a portion formed by a bending process (S20) described later, and is a portion where a press-in end portion 201 is formed by directly contacting the press-in portion 150 of the heat dissipation shell body 110 with the heating surface of the plurality of heating elements 140. The size of the outer side surface of the portion forming the press-in end portion 201 can be approximately greater than or equal to the thickness 220L of the second refrigerant flow path 220.

[0253] At the same time, if Fig.19 As shown, the maximum dimension 220L of the second refrigerant flow path 220 in the thickness direction may be greater than the maximum dimension 230L of the third refrigerant flow path 230 in the thickness direction.

[0254] This is because, during the stamping process (S10) performed before the bending process (S20) of the heat conduction plate main body 200-1, 200-2, the second refrigerant flow path 220 is not crimped, and only the edge end of the heat dissipation plate portion 203, a plurality of inclined guides 215, the third refrigerant flow path 230 and a plurality of strength reinforcement portions 240 described later are crimped into shape.

[0255] 6. Multiple strength reinforcement parts

[0256] In addition, if Figures 16 to 19 As shown, the active heat dissipation mechanism 200 of an embodiment of the utility model may also include: a plurality of strength reinforcement parts 240, which are formed on at least one of the heat conducting plate 200-1 on one side and the heat conducting plate 200-2 on the other side, and protrude a predetermined length from the inner surface of the heat conducting plate 200-1 on one side and the heat conducting plate 200-2 on the other side toward the refrigerant flow space 205 and are formed in a manner opposite to each other.

[0257] In more detail, when the refrigerant flow space 205 is formed by bending and joining a single metal plate part, the heat transfer plate 200-1 on one side before bending forms the edge ends in the width and length directions on one side with an arbitrary reference line T as a reference, and the heat transfer plate 200-2 on the other side before bending forms the edge ends in the width and length directions on the other side with an arbitrary reference line T as a reference.

[0258] Similarly, in the case where the refrigerant flow space 205 is formed by joining two metal plate parts, before joining, the heat transfer plate 200-1 on one side forms the edge ends in the width direction and the length direction on one side based on the edge end portion forming the above-mentioned first refrigerant flow path 210, and before joining, the heat transfer plate 200-2 on the other side can form the edge ends in the width direction and the length direction on the other side based on the edge end portion forming the above-mentioned first refrigerant flow path 210.

[0259] Here, the plurality of strength reinforcement parts 240 are portions other than the reference line T or the evaporation region forming the first refrigerant flow path 210, and may be formed on at least one of the one side heat conduction plate 200-1 and the other side heat conduction plate 200-2 constituting the condensation region.

[0260] A plurality of strength reinforcement parts 240 are usually formed on at least one of the planar heat conduction plates 200-1 and the other heat conduction plates 200-2, which can play a role in strengthening the strength to prevent sagging or pressing caused by the internal pressure (internal pressure) caused by the external pressure or the phase change of the refrigerant.

[0261] Here, the front end surfaces of the plurality of strength reinforcement parts 240 are formed to protrude more than the front end surfaces of the plurality of inclined guides 215 toward the refrigerant flow space 205 side corresponding to the thickness direction of the heat transfer plate bodies 200 - 1 and 200 - 2 at least after bending.

[0262] At this time, the front end faces of the multiple strength reinforcement parts 240 protrude toward the refrigerant flow space 205 side, preferably, at least during the joining process (S40) after the bending process (S20) described later, the mutually facing parts of the heat transfer plate 200-1 on one side and the heat transfer plate 200-2 on the other side protrude to the extent of surface contact in a manner that allows them to be joined to each other by a predetermined joining method.

[0263] However, the plurality of strength reinforcing parts 240 do not necessarily need to be in surface contact with each other after being bent, and may be separated from each other in the refrigerant flow space 205 as shown in the above-mentioned inclined guide 215 .

[0264] However, when the plurality of strength reinforcing parts 240 are limited to a configuration in which they are joined to each other by welding or the like in the joining step (S40) described later, it is preferred that the plurality of strength reinforcing parts 240 are formed to protrude in contact with each other on the refrigerant flow space 205. This is because the strength of the heat conducting plate 200-1 on one side and the heat conducting plate 1200-2 on the other side can be reinforced only by forming the plurality of strength reinforcing parts 240.

[0265] In this case, the plurality of strength reinforcing parts 240 may be sheet-metal-processed during the punching process ( S10 ) so as to be smaller than the minimum thickness in the refrigerant flow space 205 formed by at least the plurality of second refrigerant flow paths 220 .

[0266] Here, refer to Fig.17 The minimum thickness within the refrigerant flow space 205 formed by the second refrigerant flow path 220 is defined as the space between two adjacent inclined guide members 215 among the multiple inclined guide members 215 except for the thickness direction, and the thickness direction size of the third refrigerant flow path 230 can be interpreted as the same meaning as the thickness direction size of the third refrigerant flow path 230.

[0267] As described above, in the active heat dissipation mechanism 200 according to the embodiment of the utility model, the plurality of strength reinforcement portions 240 are processed to be at least smaller than the thickness of the third refrigerant flow path 230 (or the minimum thickness of the second refrigerant flow path 220), thereby further increasing the contact surface area with the gas-phase refrigerant freely flowing through the third refrigerant flow path 230, thereby being able to achieve the effect of refrigerant condensation in a shorter time.

[0268] And, if Fig.13As shown, the plurality of strength reinforcement parts 240 are symmetrically formed on the one side heat conducting plate 200 - 1 and the other side heat conducting plate 200 - 2 with reference to an arbitrary reference line T, and may be formed only on the plurality of inclined guide members 215 .

[0269] Here, the plurality of inclined guide members 215 are also processed into the planar shape of the heat conducting plate 200-1 on one side and the heat conducting plate 200-2 on the other side through the stamping process (S10), so as to perform the first strength reinforcement function, and the plurality of strength reinforcement parts 240 are processed again on the plurality of inclined guide members 215 that have been processed for the first time, so as to be able to perform the second strength reinforcement function.

[0270] However, according to an embodiment, as another embodiment described later (refer to Fig.22a 200T-1, Figure 22b The 200T-2) may also be formed at a location other than the inclined guide member 215 (ie, a location not related to the inclined guide member 215). This will be described in more detail in the following description of the corresponding embodiment.

[0271] Here, a plurality of strength reinforcement parts 240 are formed on the surfaces of the heat conducting plate 200-1 on one side and the heat conducting plate 200-2 on the other side facing each other, and their front end surfaces can be arranged facing each other in the refrigerant flow space 205 or inside the first refrigerant flow path 210 to the third refrigerant flow path 230. Further, the facing and contact surfaces of the plurality of strength reinforcement parts 240 arranged facing each other can be combined by laser welding.

[0272] In particular, it is preferred that a plurality of strength reinforcement portions 240 are formed on the third refrigerant flow path 230 that mainly functions as a flow path for gas-phase refrigerant to increase the condensation surface area where the gas-phase refrigerant that has changed phase into a gas state in the refrigerant contacts and condenses during the flow process. However, as described above, the third refrigerant flow path 230 may be defined as a space between the plurality of inclined guide members 215 in the thickness direction, so in this limit, it may be the same concept as the concept defined as a plurality of strength reinforcement portions 240 being formed on the plurality of inclined guide members 215.

[0273] Here, the plurality of strength reinforcing parts 240 may be formed in any shape as long as they can strengthen the strength of the heat conducting plate 200-1 on one side and the heat conducting plate 200-2 on the other side. Fig.16 and Fig.17 As shown, a dot reinforcement part 242 having a circular cross-sectional shape and a line reinforcement part 241 having only a lengthwise end formed in a semicircular cross-sectional shape and formed in a straight line in the lengthwise direction may be included.

[0274] In more detail, multiple wire reinforcement parts 241 are formed long along the width direction of the heat conducting plate bodies 200-1 and 200-2, and are formed on multiple inclined guide members 215. When one side heat conducting plate 200-1 and the other side heat conducting plate 200-2 are bent and joined, they can be arranged opposite to each other.

[0275] Similarly, a plurality of point reinforcements 242 are formed between each of the plurality of line reinforcements 241 and on the plurality of inclined guides 215, and can be arranged opposite to each other when the heat conducting plate 200-1 on one side and the heat conducting plate 200-2 on the other side are bent and joined.

[0276] Here, a plurality of line reinforcement parts 241 and a plurality of point reinforcement parts 242 may be alternately arranged one by one on one inclined guide 215 .

[0277] However, the plurality of strength reinforcement parts 240 do not necessarily need to be divided into a plurality of line reinforcement parts 241 and a plurality of point reinforcement parts 242. Fig.22a As shown, of course, the dot reinforcement portions 242 may be arranged in an elliptical shape similar to the dot reinforcement portions 242 at uniform intervals with respect to the entire heat dissipation plate portion 203 .

[0278] 7. Absorber

[0279] Fig. 20 and Fig.21 The present invention is a perspective view showing an example of an absorber in the structure of an active heat dissipation mechanism according to an embodiment of the present invention.

[0280] like Fig.11 and Fig.14 and Fig. 20 and Fig.21 As shown, the active heat dissipation mechanism 200 according to an embodiment of the utility model may further include: an absorber 300, which absorbs the liquid-phase refrigerant in the state of the refrigerant guided through the second refrigerant flow path 220 and then evenly disperses the liquid-phase refrigerant in the first refrigerant flow path 210 which is arranged relative to the gravity direction or inclined relative to the gravity direction.

[0281] In more detail, the absorber 300 is close to the press-in portion 150 provided on the back side of the heat dissipation shell body 110 which is the heat dissipation object, and is arranged in the first refrigerant flow path 210 which forms an evaporation area for changing the refrigerant from the liquid phase to the gas phase. By means of capillary force or absorption force, the liquid phase refrigerant in the refrigerant can be made to rise to the upper side at least more than its absorption point.

[0282] To this end, the absorber 300 may include a plurality of holes (reference numerals not shown) to absorb and hold the liquid refrigerant and to disperse the liquid refrigerant in the gravity direction or at least in a direction opposite to the gravity direction (ie, downward direction).

[0283] The absorber 300 as described above can prevent shape deformation due to sagging in the direction of gravity by a supporting structure (eg, the frame holding portion 320) described later while maintaining the absorption rate of the liquid-phase refrigerant by the plurality of holes.

[0284] Here, the absorber 300 is a metal sintered body formed by sintering powder of a metal material, and is a concept including a wick component having a wick structure provided inside a common vapor chamber, but is not limited to this. In the first refrigerant flow path 210 arranged obliquely relative to the direction of gravity, the liquid-phase refrigerant is captured and transferred as a whole in the upper and lower parts, thereby improving the limitations of the thermal conductivity materials of the existing general heat dissipation fins and maximizing the heat dissipation performance. This may be a concept including all of these.

[0285] In addition, in the absorber 300, the closer to the side of the pressing end 201, the easier it is for the heat transferred by the heating element 140 to make the phase change from liquid-phase refrigerant to gas-phase refrigerant more active. Preferably, it is arranged as close as possible to the side of the pressing end 201 where the width in the width direction of the refrigerant flow space 205 is relatively narrow.

[0286] However, the absorber 300 does not necessarily have to be installed only near the press-in end 201 side, and can of course be evenly distributed throughout the heat sink portion 203 except for the press-in end 201, which corresponds to the evaporation area where the refrigerant can evaporate.

[0287] However, in the case of an active heat dissipation mechanism 200 according to an embodiment of the present invention, after the heat conduction plate main bodies 200-1 and 200-2 equipped with a single component are bent, the portions corresponding to the edge ends of the heat dissipation plate portion 203 are joined to each other, and the absorber 300 is installed in the openings at both ends of the first refrigerant flow path 210 side. Due to the manufacturing method, the evaporation area of ​​the refrigerant can be limited to the first refrigerant flow path 210.

[0288] Here, the absorbent body 300 may include one of a non-woven fabric having a plurality of pores (a liquid wick structure), a non-woven fabric supported by a metal wire or a metal braid, and a metal sintered body formed by sintering a metal powder. Here, similarly to the main absorbent body 350, the metal material includes a copper material having excellent thermal conductivity, and the non-woven fabric may be supported by a thin copper wire or a copper wire braided body braiding the metal wire.

[0289] That is, the absorber 300 may be a nonwoven fabric made of a fiber material. In this case, the nonwoven fabric material itself is a very soft material, and when the liquid refrigerant is absorbed, it may be difficult to maintain a vertical shape due to the weight of the absorbed liquid refrigerant, so the nonwoven fabric may be supported by a braided body made of copper wire or copper wire material braided by copper wire.

[0290] Here, the non-woven fabric is inserted into a woven body of copper wire material and maintains its shape, so that the non-woven fabric provided as the absorber 300 can be stably fixed without flowing in the direction of gravity (i.e., the up and down direction) or in the first refrigerant flow path 210 arranged obliquely relative to the direction of gravity.

[0291] However, the nonwoven fabric need not be supported so as to be inserted into the braided body made of copper wires, and a single copper wire may penetrate the nonwoven fabric in the vertical direction or spirally surround the nonwoven fabric.

[0292] Here, within the limit that the absorber 300 can maintain its shape even under the load of the liquid refrigerant it retains, the non-woven fabric can be combined with the interior of a braided body of copper wire material, or it can be arranged in a spiral form around the copper wire itself or the braided body of copper wire material on the outer peripheral surface of the non-woven fabric.

[0293] In more detail, Fig. 20 and Fig.21 As shown, the absorber 300 includes: an absorption body portion 310, which has a predetermined absorption rate for liquid refrigerant and is deformed in shape by an external force including a predetermined gravity or above; and a skeleton retaining portion 320, which is connected to the absorption body portion 310 to prevent the absorption body portion 310 from being deformed in shape by an external force.

[0294] Here, the main absorbent body 310 can be formed by a non-woven fabric, cotton, or sponge that forms the above-mentioned plurality of pores (a liquid-absorbing core structure). The main absorbent body 310 formed by the non-woven fabric, cotton, or sponge can be arranged long along the vertical gravity direction due to the characteristics of its material, but when the plurality of pores contain liquid, its outer shape (shape) may be deformed such as drooping in the gravity direction due to the weight of the liquid.

[0295] As described above, if the absorption body 310 sags due to the presence of liquid and the uppermost position is changed to the lower part on the first refrigerant flow path 210 , the evaporation area may be reduced by the degree of the change.

[0296] The frame holding part 320 prevents the shape deformation such as sagging of the absorbent body 310. To this end, the frame holding part 320 may be made of a tube having a hollow part (not shown) inside which the absorbent body 310 is located.

[0297] Preferably, since the skeleton holding part 320 also has a structure for transferring the heat transferred from the external heating element 140 to the absorbing body part 310, the skeleton holding part 320 is preferably made of a metal material having a predetermined thermal conductivity or higher. For example, the metal material constituting the skeleton holding part 320 may be copper (copper) material.

[0298] And, if Fig. 20 As shown, the skeleton holding part 320 is woven into a tube shape (refer to the reference numeral "321") using metal wires made of metal materials, or as Fig.21 As shown, a metal wire made of a single metal material may be wound around the outer peripheral surface of the absorbent body 310 in a spiral shape (see reference numeral 322 ).

[0299] For more details, refer to Fig. 20 The skeleton retaining portion 321 is formed into a tube shape by braiding metal (copper) wires made of metal material, so that the liquid-phase refrigerant flowing through the plurality of second refrigerant flow paths 220 and guided toward the first refrigerant flow path 210 can penetrate into the internal absorption main body 310 .

[0300] At this time, the skeleton holding part 321 of the braided body woven into a tube shape can be woven to have gaps that allow at least the liquid phase refrigerant in the refrigerant to be transferred from the outside to the internal absorption body part 310 by surface tension. In this case, the gas phase refrigerant that changes phase from the liquid phase refrigerant by the absorption body part 310 can be easily dispersed to the outside through the woven gaps.

[0301] And, refer to Fig.21 The skeleton holding portion 322 may be configured such that a single metal (copper) plate (or wire) is spirally wound around the outside of the absorption body portion 310 .

[0302] Here, the metal plate (or metal wire) preferably has a shape-retaining force that is sufficient to prevent the metal plate (or metal wire) from sagging downward due to gravity even when the absorption body 310 contains a sufficient amount of liquid-phase refrigerant.

[0303] In addition, if Fig. 20 As shown, the frame holding portion 321 of the absorbent body 300 may be formed in a cylindrical shape, and the absorbent body portion 310 may be formed in a cylindrical shape so as to be inserted into the frame holding portion 321 formed in a cylindrical shape.

[0304] As described above, in the active heat dissipation mechanism 200 according to an embodiment of the present invention, the absorber 300 is formed by separately manufacturing and combining the absorption main body 310 and the skeleton retaining part 320, but there is no need to additionally include the skeleton retaining part 320. Even if the absorption main body 310 has its own shape retention force, shape deformation such as sagging does not occur when containing liquid refrigerant, and it is sufficient to only have the absorption main body 310 itself.

[0305] According to the above embodiment, the absorber 300 includes an absorber main body 310 formed of a material selected from non-woven fabric, cotton and sponge, and a skeleton retaining part 320 formed of a braided body woven into a tube shape using a metal (copper) wire material or wrapped in a spiral shape, thereby preventing the absorber 300 from sagging downward regardless of the amount of liquid-phase refrigerant contained in the absorber main body 310, thereby enabling a uniform amount of liquid-phase refrigerant to change phase on the first refrigerant flow path 210.

[0306] And, if Fig.14 As shown, the active heat dissipation mechanism 200 according to an embodiment of the present invention may further include a plurality of absorber fixing guides 250 .

[0307] The plurality of absorber fixing guides 250 can play a role in stably fixing the absorber 300 arranged long in the gravity direction (i.e., the up-down direction) in the refrigerant flow space 205 (especially, the first refrigerant flow path 210). In particular, when the absorber 300 is made of only non-woven fabric and is not supported by a woven body of a metal material such as a skeleton holding portion 320, the plurality of absorber fixing guides 250 play a role in preventing sagging in the gravity direction when absorbing liquid refrigerant.

[0308] During the punching process ( S10 ), the plurality of absorber fixing guides 250 may be formed together with the first to third refrigerant flow paths 210 to 230 and the plurality of inclined guides 215 or the plurality of strength reinforcement parts 240 .

[0309] In more detail, if a non-woven fabric absorber 300 is used to absorb liquid refrigerant, there is a concern that multiple absorber fixing guides 250 may droop in the direction of gravity. In order to prevent this, they are formed to protrude toward the refrigerant flow space 205. When the edge ends of the heat transfer plate 200-1 on one side and the heat transfer plate 200-2 on the other side are joined to each other through a joining process (S40), the absorber 300 can be pressed and stably fixed.

[0310] Here, when the nonwoven fabric is located inside the metal braid and supported, the structure where the absorber 300 is actually supported by the plurality of absorber fixing guides 250 may be the outer surface of the braid.

[0311] In addition, multiple absorber fixing guides 250 press the outer side surface of the absorber 300 or the woven fabric whose shape is easily deformed by external force, and can also simultaneously perform the function of ensuring a predetermined space for the gaseous refrigerant (gas-phase refrigerant) that evaporates in the first refrigerant flow path 210 to flow.

[0312] As described above, the absorber 300 is built into the interior of the first refrigerant flow path 210. The liquid-phase refrigerant condensed and liquefied from the heat sink portion 203 side moves to a portion close to the heating element 140 and is retained by the absorption force (or capillary force) of the absorber 300. After the liquid-phase refrigerant is phase-changed into the gas-phase refrigerant by the heat transferred from the heating element 140, the gas-phase refrigerant can diffuse again by the diffusion principle of gas and flow to the entire heat sink portion 203.

[0313] The gas-phase refrigerant moved to the side of the heat dissipation plate portion 203 is smoothly and evenly dispersed to the entire heat dissipation plate portion 203 through the third refrigerant flow path 230, and is condensed while performing heat dissipation through heat exchange with the external air. The condensed liquid-phase refrigerant can easily move toward the direction of gravity, i.e., the first refrigerant flow path 210 side, along the second refrigerant flow path 220 whose dimension in the thickness direction is larger than that of the multiple inclined guides 215.

[0314] The heat generated from the heating element 140 is preferentially transferred to the first refrigerant flow path 210 side where the absorber 300 is provided. Most of the refrigerant stored in the first refrigerant flow path 210 side having the absorber 300 is in a liquid state inside the absorber 300. After changing into a gas state by the heat transferred from the heating element 140, it preferably flows to the heat dissipation plate portion 203 of the heat transfer plate body 200-1, 200-2 as a whole through the third refrigerant flow path 230 to perform heat dissipation.

[0315] Hereinafter, a refrigerant cycle phenomenon is defined as one cycle, in which the liquid-phase refrigerant changes phase into the gas-phase refrigerant at the injection end portion 201, diffuses and flows to the heat sink portion 203, and then the gas-phase refrigerant changes phase into the liquid-phase refrigerant at the heat sink portion 203, and then returns and flows to the injection end portion 201. The time required to form one cycle is defined as "gas-liquid cycle time" for explanation.

[0316] Hereinafter, a cycle phenomenon in which the liquid-phase refrigerant on the side of the injection end portion 201 is transformed into the gas-phase refrigerant and then diffuses to the side of the heat sink portion 203, and then the gas-phase refrigerant on the side of the heat sink portion 203 is transformed into the liquid-phase refrigerant and then returns to the refrigerant pressed into the side of the end portion 201 is defined as one cycle, and the time required to realize one cycle is defined as "gas-liquid cycle time".

[0317] According to the active heat dissipation mechanism 200 of one embodiment of the utility model described above and the multiple modified examples 200T-1, 200T-2, 200T-3, 200T-4, 200T-5 described later and the active heat dissipation mechanism 1200 according to another embodiment of the utility model, the first refrigerant flow path 210, 1210, the second refrigerant flow path 220, 1220 and the third refrigerant flow path 230 and the multiple inclined guide members 215, 1215 and the multiple strength reinforcement parts 240, 1240 included should be understood that the specific shapes and layout designs are designed to minimize the cycle time of the above-mentioned gas-liquid cycle to activate the gas-liquid circulation, thereby maximizing the heat dissipation performance. The ultimate purpose is designed.

[0318] 8. First to Fourth Modifications

[0319] Figures 22a to 22d It is a pre-bending unfolded view of the heat conducting plate body according to the first variant (200T-1) to the fourth variant (200T-4) of the partial structure in one embodiment of the utility model.

[0320] The following will refer to Figures 22a to 22d The first modified example 200T-1 to the fourth modified example 200T-4 are shown to illustrate the differences of an embodiment 200 of the present invention.

[0321] That is, Fig.22a As shown, in the first variant example 200T-1 of the utility model, as shown in the above-mentioned embodiment 200, a plurality of strength reinforced portions 240 may be provided only on a plurality of inclined guide members 215 that divide the second refrigerant flow path 220, and unlike the above-mentioned embodiment 200, a portion 240' of the plurality of strength reinforced portions may be designed to be provided on an outer portion that is not related to the second refrigerant flow path 220 or the third refrigerant flow path 230 and the plurality of inclined guide members 215.

[0322] And, refer to Figure 22b The active heat dissipation mechanism 200T-2 according to the second modified example of the utility model is compared with the reference Figures 9 to 21 Compared with the active heat dissipation mechanism 200 according to an embodiment of the present invention, the following differences can be found.

[0323] That is, Figure 22b As shown, in the second variant of the active heat dissipation mechanism 200T-2 of the present invention, only a plurality of inclined guide members 215 are formed on one of the heat conducting plates 200-1 on one side and the heat conducting plates 200-2 on the other side, and only a plurality of strength reinforcement portions 240 in the form of point reinforcement portions 242 can be formed on the other of the heat conducting plates 200-1 on one side and the heat conducting plates 200-2 on the other side.

[0324] In this case, according to the heat conduction plate body 200-1, 200-2 of the active heat dissipation mechanism 200T-2 of the second variant, after the bending process (S20), in the refrigerant flow space 205, the front end faces of multiple joints and the front end faces of multiple inclined guide members 215 can be arranged opposite to each other or in surface contact to the extent of almost contact.

[0325] In more detail, according to the second variant example, in the active heat dissipation mechanism 200T-2, in one of the heat transfer plates 200-1 on the left and right sides of the first refrigerant flow path 210 that performs the function of a refrigerant general flow path, and the other heat transfer plate 200-2, a plurality of second refrigerant flow paths 220 defined between the aforementioned plurality of inclined guide members 215 are formed inclined toward the ends in the corresponding width direction, and in the other 200-1, a plurality of point reinforcement portions 242 may be provided so that the end surfaces of the plurality of inclined guide members 215 that form the plurality of second refrigerant flow paths 220 are opposite to each other after the bending process (S20) described later.

[0326] In this case, the heat conduction plate 200 - 2 on the other side does not need to be equipped with a separate strength reinforcing part 240 , and it can be understood that the plurality of inclined guides 215 equipped with the second refrigerant flow path 220 also perform the function of the strength reinforcing part 240 themselves.

[0327] That is, in the case of the embodiment 200 of the present invention described above, the plurality of strength reinforcement parts 240 do not distinguish between the heat conducting plate 200-1 on the left side corresponding to the heat conducting plate body 200-1, 200-2 and the heat conducting plate 200-2 on the right side, but are provided in a mixed manner of the plurality of line reinforcement parts 241 and the plurality of point reinforcement parts 242. Figure 22b In the active heat dissipation mechanism 200T-2 of the second modified example of the present invention, different strength reinforcement elements are provided on one heat conducting plate 200-1 corresponding to the left side and the other heat conducting plate 200-2 corresponding to the right side in the heat conducting plate bodies 200-1 and 200-2.

[0328] In this case, the surface portion of the heat conduction plate 200-2 on the other side equipped with multiple inclined guide members 215 is located at the lower part in the gravity direction, which is conducive to the smooth flow guidance of the liquid-phase refrigerant. Preferably, when it is set on the heat dissipation shell body 110, it is located on the lower side relative to the gravity direction. The surface portion of the heat conduction plate 200-1 on one side with multiple point reinforcement parts 242 is conducive to the smooth flow of the gas-phase refrigerant. When it is set on the heat dissipation shell body 110, it is preferably located on the relatively upper side relative to the gravity direction.

[0329] In addition, refer to Fig.22c and Fig.22dAccording to the active heat dissipation mechanism of the third variant 200T-3 and the fourth variant 200T-4, after the bending process (S20) is performed without distinguishing between the heat conducting plate 200-1 on one side and the heat conducting plate 200-2 on the other side of the heat conducting plate body 200-1 and 200-2, a plurality of point reinforcement portions 242 serving as a plurality of strength reinforcement portions 240 for welding together can be formed.

[0330] In this case, multiple point reinforcement portions 242 can be formed to include a first refrigerant flow path 210 like the active heat dissipation mechanism 200 according to an embodiment of the present invention, or can be formed to have a circular horizontal cross-section as shown in the third variant 200T-3, or can be formed to have a hexagonal horizontal cross-section as shown in the fourth variant 200T-4.

[0331] In particular, compared with the active heat dissipation mechanism 200 according to an embodiment of the above-mentioned utility model, the third variant 200T-3 and the fourth variant 200T-4 are designs that only include the third refrigerant flow path 230 but do not include the inclined second refrigerant flow path 220, thereby having the advantage of allowing the liquid-phase refrigerant and the gas-phase refrigerant to flow evenly and easily throughout the entire range.

[0332] Here, the plurality of point reinforcements 242 are joined together by welding (refer to the joining step ( S40 ) described later) as described above, which provides an advantage of increasing the rigidity of the entire heat conducting plate body 200 - 1 , 200 - 2 after the bending step ( S20 ).

[0333] However, as described above, the active heat dissipation mechanism 200 and its modifications 200T-1, 200T-2, 200T-3, and 200T-4 according to an embodiment of the utility model have a core structure filled with refrigerant and a technical structure that improves the heat dissipation performance through the phase change of the refrigerant. The internal structure design of the heat conduction plate body 200-1, 200-2 also needs to be optimally adapted to its setting position or gravity and the phase change of the refrigerant.

[0334] 9. Fifth and Sixth Modifications

[0335] Fig.23 It shows that the composite is applicable Figures 22a to 22d An expanded view of the heat conducting plate body of the fifth modified example (200T-5) of the multiple modified examples. Fig.24 1 is a development view showing a heat transfer plate body according to a sixth modification.

[0336] Reference Fig.23The press-in portion 150 formed on the back side of the heat dissipation housing body 110 is based on the groove structure 170, and forms a "V" shape that is tilted upward as it approaches the outer end (one end) in the left and right width directions. In an embodiment 200 of the utility model and modified examples 200T-1 to 200T-4, when the press-in end 201 is fixed to the press-in portion 150, the "upper side (Upper Part)" and "lower side (Lower Part)" areas can be relatively distinguished.

[0337] This division of the upper and lower regions is also the same when the heat conducting plate bodies 200 - 1 and 200 - 2 are arranged vertically along the gravity direction (ie, the up-down direction).

[0338] The heat generated from the heating element 140 is preferentially transferred to the first refrigerant flow path 210 side where the absorber 300 is provided. Most of the refrigerant stored in the first refrigerant flow path 210 side equipped with the absorber 300 is in a liquid-phase refrigerant state. After being phase-changed into a gas-phase refrigerant by the heat transferred from the heating element 140, it is preferably performed heat dissipation by heat exchange with the external air (outside air) while flowing as a whole to the heat dissipation plate portion 203 side including the third refrigerant flow path 230.

[0339] Here, the volume of the refrigerant flow space 205 occupied when the phase changes to the gas phase refrigerant can only be relatively small compared to the volume of the liquid phase refrigerant, so the water surface of the liquid phase refrigerant is located in the above-mentioned lower area, and on the first refrigerant flow path 210 side corresponding to the upper side of the water surface of the liquid phase refrigerant, the absorber 300 can absorb the liquid phase refrigerant by capillary force and move it upward. Therefore, the water surface of the first refrigerant flow path 210 is formed between its upper end and lower end, and it should be understood that it is located relatively close to the lower side of the gravity direction in the refrigerant flow space 205.

[0340] However, in this case, when the first refrigerant flow path 210 is arranged to be long in the up-down direction (gravity direction), there is also a problem that the upward dispersion by the absorber 300 is also limited.

[0341] In order to overcome the limitations of the above-mentioned absorber 300, the active heat dissipation mechanism 200T-5 according to the fifth variant of the utility model is arranged in a state of a press-in portion 150 formed on the back side of the heat dissipation shell body 110. With the direction of gravity as a reference, the portion located in the relatively upper area can be equipped with a plurality of inclined guide members 215 in a manner to guide the liquid-phase refrigerant to flow relatively downward to the first refrigerant flow path 210 or the upper area of ​​the absorber 300 while minimizing as much as possible the large amount of liquid-phase refrigerant that changes phase according to the heat exchange of the gas-phase refrigerant flowing directly downward.

[0342] Here, each of the plurality of inclined guides 215 may be formed with only a single plurality of wire reinforcing parts 241 among the above-mentioned plurality of strength reinforcing parts 240 .

[0343] Also, preferably, the plurality of wire reinforcing parts 241 are formed to protrude further toward the refrigerant flow space 205 than the plurality of inclined guides 215 so as to be engageable with each other on the refrigerant flow space 205 .

[0344] At this time, if Fig.23 As shown, the multiple line reinforcement portions 241 are formed with almost similar lengths or similar pattern forms with respect to the multiple inclined guide members 215, except for the different protrusion amounts toward the refrigerant flow space 205 side, and can be distinguished and named as multiple line pattern portions 241P, which can be understood as a structure that performs the same function as the above-mentioned multiple inclined guide members 215.

[0345] Therefore, a space between adjacent plurality of linear pattern portions 241P may be understood as the second refrigerant flow path 220 , and a space between the plurality of linear pattern portions 241P in the thickness direction may be understood as the third refrigerant flow path 230 .

[0346] However, the multiple inclined guide members 215 and the multiple linear pattern portions 241P cannot be understood as being completely physically separated from each other, but as shown in the case of the active heat dissipation mechanism 200 according to an embodiment of the present invention, to the extent of providing a main flow path for the liquid-phase refrigerant, the multiple inclined guide members 215 and the multiple linear pattern portions 241P should be understood as the same structure.

[0347] In addition, refer to Fig.23 Preferably, a refrigerant flow path that enables the gas-phase refrigerant that changes phase from liquid-phase refrigerant to flow smoothly is provided at a relatively lower position, and only a plurality of point reinforcement portions 242 among a plurality of strength reinforcement portions 240 may be provided. In this case, as described above, in order to distinguish it from the active heat dissipation mechanism 200 according to an embodiment of the utility model, it may be referred to as a dot pattern portion 242P.

[0348] Therefore, although the names of the plurality of dot pattern portions 242P are different, it should be understood that they are structures that perform the same functions as the plurality of dot reinforcement portions 242 described above.

[0349] However, in the active heat dissipation mechanism 200T-5 according to the fifth modified example of the present invention, in the "lower area" equipped with the plurality of dot pattern portions 242P, there is no configuration that performs the same function as the plurality of inclined guides 215 that guide the flow of the liquid refrigerant. Instead, the plurality of line reinforcement portions 241 or the plurality of line pattern portions 241P may be arranged in parallel with the length direction.

[0350] That is, when multiple wire reinforcement portions 241 or multiple wire pattern portions 241P are concentrated and arranged at a predetermined density or above in the same inclined form as multiple inclined guide members 215 in consideration of the surface tension of the liquid refrigerant, the amount of liquid refrigerant falling directly downward can be minimized.

[0351] As mentioned above, Fig.23 As shown, the active heat dissipation mechanism 200T-5 according to the fifth variant of the utility model can be configured to be more concentratedly arranged with a plurality of linear pattern portions 241P at a position corresponding to the relatively upper area, so that the maximum amount of liquid-phase refrigerant that becomes liquid after condensation according to the heat exchange of the gas-phase refrigerant is guided to the upper area of ​​the first refrigerant flow path 210 or the absorber 300, and a plurality of dot pattern portions 242P can be more concentratedly arranged at a position corresponding to the relatively lower area, for rapid diffusion and dispersed flow of the gas-phase refrigerant that changes phase by evaporation in the first refrigerant flow path 210.

[0352] In addition, in the case of an active heat dissipation mechanism 200 according to an embodiment of the utility model and active heat dissipation mechanisms 200T-1, 200T-2, 200T-3, 200T-4, and 200T-5 according to a modified example of the utility model, an embodiment in which the second refrigerant flow path 220 can be configured in an inclined straight line form, or indirectly formed by a plurality of strength reinforcement parts 240 without directly forming the second refrigerant flow path 220 is described, but in the following active heat dissipation mechanism 200T-6 according to the sixth modified example, a technical feature is proposed in which the second refrigerant flow path 220 and the third refrigerant flow path 230 are formed with each of the strength reinforcement parts 240 configured in the form of a midpoint reinforcement part of a plurality of strength reinforcement parts 240 as the center.

[0353] In more detail, Fig.24 As shown, the active heat dissipation mechanism 200T-6 according to the sixth variant of the utility model may include a plurality of strength reinforcement portions 240 in the form of point reinforcement portions arranged at uniform density in the heat dissipation plate portion 203 in the condensation area except for the pressed-in end portion 201 corresponding to the evaporation area.

[0354] A plurality of strength reinforcement parts 240 may be formed on all of the one side heat conduction plate 200A and the other side heat conduction plate 200B to protrude toward the refrigerant flow space 205 formed in the space in the thickness direction of the one side heat conduction plate 200A and the other side heat conduction plate 200B, respectively.

[0355] Here, multiple strength reinforcement parts 240 are arranged in the form of small circular dots. The strength reinforcement parts 240 formed in the condensation area can be formed relatively densely in the entire heat dissipation plate part 203. On the contrary, the strength reinforcement parts 240 formed in the heat dissipation plate part 203 adjacent to the evaporation area can be separated and set in a relatively low density manner.

[0356] As described above, the reason why the density of the strength reinforcing portion 240 is set differently depending on whether the distance is short or long based on the evaporation region is as follows.

[0357] First, a plurality of strength reinforced portions 240 of the heat sink portion 203 serving as the condensation region, which is formed in a portion slightly separated from the evaporation region, are relatively densely formed over the entire condensation region, and the second refrigerant flow path 220 and the third refrigerant flow path 230 described later are also tightly and densely formed, and can appropriately prevent shaking (flow) between the heat transfer plate 200A on one side and the heat transfer plate 200B on the other side due to changes in internal pressure during gas-liquid circulation of the refrigerant (or during phase change). The plurality of strength reinforced portions 240, the second refrigerant flow path 220, and the third refrigerant flow path 230 formed in the sheet metal process through the stamping process can enhance their own rigidity.

[0358] Secondly, the portion corresponding to the heat sink portion 203 near the evaporation region is mainly a portion for storing liquid-phase refrigerant. When the heat sink portion 203 in the condensation region is tightly joined using a plurality of strength reinforcement portions 240, when the refrigerant freezes, as the volume of the refrigerant increases, there is a concern that the joined portion may be damaged. Therefore, the heat sink portion 203 near the evaporation region (or the press-in end portion 201) is used and joined with line reinforcement portions 241 slightly spaced apart from each other, and the formation density of the strength reinforcement portions 240 in the form of point reinforcement portions arranged therebetween is reduced, so that when the refrigerant freezes, stress is not applied to the greatest extent possible, and the design is to allow volume expansion and contraction to a certain extent.

[0359] In addition, the refrigerant flow space 205 may include: a second refrigerant flow path 220, which is formed in the form of a point reinforcement portion of the condensation portion and is sheet metal processed in a predetermined pattern around the strength reinforcement portion 240; and a third refrigerant flow path 230, which is formed between the second refrigerant flow path 220 and the strength reinforcement portion 240 and is sheet metal processed in a form that is less recessed relative to the strength reinforcement portion 240.

[0360] Typically, since the thickness of the refrigerant flow space 205 of the second refrigerant flow path 220 is formed to be greater than the thickness in the third refrigerant flow path 230, when the gas-phase refrigerant is condensed into a liquid-phase refrigerant through heat exchange in the heat dissipation plate portion 203 serving as a condensation area, it is used to disperse the liquid-phase refrigerant flowing downward in the direction of gravity due to surface tension or gravity, and guide the flow of the liquid-phase refrigerant, so that the liquid-phase refrigerant is collected on the side of the heat dissipation plate portion 203 close to the evaporation area.

[0361] On the contrary, the thickness of the third coolant flow path 230 is smaller than the thickness of the second coolant flow path 220. If the liquid-phase refrigerant evaporates into the gas-phase refrigerant in the evaporation area, the evaporated gas-phase refrigerant can diffuse and disperse through the third refrigerant flow path 230 having a relatively narrow thickness and flow to the entire heat dissipation plate portion 203 serving as the condensation area, thereby promoting heat exchange.

[0362] The above-mentioned second refrigerant flow path 220 and the third refrigerant flow path 230 are mainly formed into a predetermined pattern shape with the strength reinforcement portion 240 tightly formed on the side of the heat sink portion 203 serving as the condensation area as the center. It should be noted that the heat sink portion 203 side close to the evaporation area mainly involves only the storage and evaporation of liquid-phase refrigerant (phase change to gas-phase refrigerant), and therefore, the second refrigerant flow path 220 and the third refrigerant flow path 230 are not separately distinguished and formed.

[0363] In addition, if Fig.24 As shown, in the case where the pattern shape of the second coolant flow paths 220 is formed into a polygon (eg, a honeycomb hexagon or other pentagon), at least one side of adjacent second coolant flow paths 220 may be connected to be shared with each other.

[0364] 10. Comparison between the comparative example and the present utility model

[0365] Fig.25 It is a cross-sectional view showing the setting state of the press-fitting portion of the comparative example (200D, (a)) and the active heat dissipation mechanism (200, (b)) according to an embodiment of the present invention.

[0366] 10-1. SUS material and bending forming

[0367] In order to smoothly compare the active heat dissipation mechanism 200 according to an embodiment of the present invention with the active heat dissipation mechanism 200D according to a comparative example, Fig.25 The comparative example 200D in the figure shows that it is assumed that the press-in end portion 201 of the active heat dissipation mechanism 200 according to an embodiment of the present invention is inserted into and fixed to the press-in portion 150 having the same specification (ie, shape and size).

[0368] First, in order to refer to Fig.25 (b) The active heat dissipation mechanism 200 according to an embodiment of the present invention is similar to the reference Fig.25 A detailed comparison is made with the comparative example 200D of (a), and the specifications of the active heat dissipation mechanism 200D are described in detail based on the comparative example.

[0369] The active heat dissipation mechanism 200D according to the comparative example is manufactured by bonding two panel members made of aluminum (Al) material having very excellent thermal conductivity through a predetermined bonding process, and assumes a refrigerant flow space 205 in which the refrigerant is filled and flows through a phase change.

[0370] As is known to all, the thermal conductivity of aluminum (Al) is 230 and the specific gravity is 2.7. In the present invention, the thickness of a panel component is 0.5T (hereinafter, "T" represents "mm" in length unit), and the sum of the two panel components is 1T, which means that the thickness of the press-fit portion 150 inserted close to the heating element 140 serving as the heat dissipation object is 1T.

[0371] More specifically, it can be assumed that the one-side heat transfer plate 200D-1 and the other-side heat transfer plate 200D-2 of the comparative example 200D are manufactured under the conditions defined by the limit thickness described later.

[0372] For example, as shown in (a) of Figure 22, the heat conducting plate 200D-1 on one side and the heat conducting plate 200D-2 on the other side of the comparison example 200D can also be manufactured to a maximum thickness of 0.5T that cannot be manufactured thinner, taking into account the aluminum material and based on the strength design requirements and safety design requirements of the product.

[0373] That is, the internal width of a pair of groove ribs 150a, 150b forming the press-in portion 150 is formed to be IT which is twice the sum of the thicknesses of the heat conducting plate 200D-1 on one side and the heat conducting plate 200D-2 on the other side of the comparison example 200D, 0.5T, and the press-in portion 150 having the same shape and size is also applied to the active heat dissipation mechanism 200 according to an embodiment of the present invention.

[0374] Here, as part of the factors that determine the above-mentioned "limit thickness", the strength design and safety design of the product made of aluminum material is required to have the strength to stably maintain the refrigerant filled inside, and the elongation and processability of pure aluminum material itself are relatively better than those of SUS material, but do not meet the above-mentioned strength. Therefore, in order to have sufficient strength, the aluminum metal plate parts need to be subjected to additional processes such as heat treatment, cold working or alloying.

[0375] In particular, as shown in Comparative Example 200D, when aluminum is used as the main constituent material of the heat conductive plate body, although it has the advantage of excellent thermal conductivity, it has the following various disadvantages in addition to the problem of increased costs due to the above-mentioned high cost.

[0376] First, in the case of the comparative example 200D in which the heat conducting plate bodies 200D-1 and 200D-2 are made of aluminum, the choice of refrigerant is very limited. That is, when aluminum comes into contact with water, hydrogen substances are generated and a chemical reaction to aluminum oxide is caused. In particular, as part of the hydrogen is generated, the internal pressure of the refrigerant flow space 205 increases.

[0377] Second, as mentioned above, the increase in the internal pressure of the refrigerant flow space 205 of the comparative example 200D composed of the heat conduction plate main body 200D-1 and 200D-2 made of aluminum material not only increases the worry of damage to the completed active heat dissipation mechanism 200D itself, but also causes warping between the heat conduction plate 200D-1 on one side and the heat conduction plate 200D-2 on the other side, thereby causing shaking during the gas-liquid circulation of the refrigerant, and also causes problems of hindering the smooth gas-liquid circulation. In order to prevent this situation, it is necessary to form the above-mentioned strengthening parts such as the strength reinforcement part 240 according to the multiple embodiments 200 of the utility model during the stamping process (S10).

[0378] Third, due to the first and second problems mentioned above, the refrigerant that can be used in the comparative example 200D made of aluminum is limited to special refrigerants such as Honeywell refrigerant or CFC (Freon gas). Recently, many countries are actively studying the restriction of the use of refrigerants to prevent environmental pollution, so there is a problem of conflict with the trend of preventing international environmental pollution. That is, when a product such as the comparative example 200D made of aluminum is produced, it may happen that the product cannot be marketed and applied in every country with the above-mentioned usage regulations.

[0379] Fourth, as described above, when the aluminum heat conducting plate main body 200D-1, 200D-2 is set with a limit thickness, there are design limitations in terms of positioning the refrigerant close to the heating element. That is, the elongation of pure aluminum is not bad in its characteristics, but as described above, in order to stably maintain the refrigerant without warping inside, according to the strength design requirements and safety design requirements of the product, when the aluminum metal plate component is manufactured by heat treatment, cold working or alloying, its strength increases, but on the contrary, the processability through the stamping process decreases. Therefore, under the premise of forming the refrigerant flow space 205 of the same thickness, the stamping processability of the multiple strength reinforcement parts 240 equipped according to the embodiment 200 of the utility model to prevent the refrigerant from shaking during the gas-liquid circulation cannot be formed.

[0380] Fifth, if the limit thickness is set for the one side heat conducting plate 200D-1 and the other side heat conducting plate 200D-2 as described above, as shown in the active heat dissipation mechanism 200 of one embodiment of the present invention, there is actually the following problem: the closest contact position of the refrigerant flow space 205 corresponding to the first refrigerant flow path 210 that collects the liquid phase refrigerant closest to the heating element 140 is set outside the press-fit portion 150. The above problem causes the distance between the heating element 140 and the liquid phase refrigerant to become longer, thereby diluting the advantage of the aluminum material having excellent thermal conductivity.

[0381] Therefore, in the comparative example 200D, the metal material of the metal plate member constituting the heat conduction plate main bodies 200D-1 and 200D-2 is made of aluminum, and is made of an aluminum alloy having the above-mentioned predetermined tensile strength or higher.

[0382] As described above, aluminum materials including aluminum alloys have a very excellent thermal conductivity of 230 and a small specific gravity, so aluminum material is one of the most commonly used thermal conductive metal materials for heat dissipation elements.

[0383] However, although the aluminum material itself has excellent thermal conductivity and specific gravity, it is relatively expensive in terms of cost and has problems such as limited types of refrigerants that can be filled inside.

[0384] Therefore, the active heat dissipation mechanism 200 of an embodiment of the present invention adopts a material with a lower cost than aluminum, that is, stainless steel (SUS), and changes the design to have a heat dissipation performance similar to that of aluminum as its core structural element.

[0385] In more detail, Fig.25 As shown in (a), the active heat dissipation mechanism 200D according to the comparative example includes two components, forming a refrigerant flow space 205 filled with and flowing refrigerant inside, and can include flat heat conduction plate bodies 200D-1 and 200D-2 made of aluminum material.

[0386] This is different from the active heat dissipation mechanism 200 according to an embodiment of the present invention in that the active heat dissipation mechanism 200 is bent into a single component to form a plurality of refrigerant flow paths 210 , 220 , 230 corresponding to the refrigerant flow space 205 .

[0387] However, even in the case where the heat transfer plate bodies 200D-1 and 200D-2 are formed by joining two parts as shown in the active heat dissipation mechanism 200D according to the comparative example, as shown in the active heat dissipation mechanism 200D according to the comparative example, while forming the first refrigerant flow path 210, the second refrigerant flow path 220 and the third refrigerant flow path 230, within the limit of setting the absorber 300 at the position corresponding to the first refrigerant flow path 210, the operation of welding the two heat transfer plate bodies 200D-1 and 200D-2 to each other is the same.

[0388] That is, in the active heat dissipation mechanism 200D according to the comparative example, the two heat conduction plate bodies 200D-1 and 200D-2 may be joined to face each other, and the refrigerant flow space 205 may be formed therein.

[0389] Here, the active heat dissipation mechanism 200 according to an embodiment of the present invention may be different from the comparative example 200D including two components in that the active heat dissipation mechanism 200 is provided as a single component and is bent to be symmetrical in the left-right direction.

[0390] Here, in the case of the active heat dissipation mechanism 200D according to the comparative example, unlike the active heat dissipation mechanism 200 according to an embodiment of the present invention, the reason why the two separated components (heat conduction plate bodies 200D-1, 200D-2) are joined in a predetermined joining manner to form a refrigerant flow space 205 inside is as follows: This is because in the case of aluminum material, during the metal processing process of being processed into alloy aluminum in order to ensure a predetermined strength, its elongation is reduced, making it difficult to perform precise additional processing.

[0391] For example, as shown in an embodiment 200 of the present invention, when the heat conducting plate bodies 200D-1 and 200D-2 made of aluminum material are bent through a bending process (S20), the curvature radius of the portion where the pressed end portion 201 is formed can only be formed to be relatively large due to its very poor workability.

[0392] The increase in the radius of curvature of the pressed-in end portion 201 requires not only an increase in the groove size (i.e., the size between a pair of groove ribs 150a, 150b) of the pressed-in portion 150 manufactured for setting on the back side of the heat dissipation housing body 110 as the heat dissipation object, but also an increase in the groove size (i.e., the size between a pair of groove ribs 150a, 150b). As a result, it is necessary to increase the size of the heat conduction plate bodies 200D-1 and 200D-2 themselves, resulting in a problem in which the number of settings per unit area on the back side of the heat dissipation housing body 110 is greatly reduced.

[0393] In more detail, generally, the higher the purity, the more elongation of metal plate parts made of aluminum material is 40% or more, which is greater than the elongation of 35% of metal plate parts made of SUS material (refer to JIS standard SUS304, SUS316, SUS321, SUS410), so the expected processability will also be good.

[0394] However, as described above, in accordance with the strength design requirements and safety design requirements of the product, when the metal plate parts made of aluminum are manufactured by heat treatment, cold working or alloying, the elongation is reduced, and therefore the workability is also poor.

[0395] Here, the low processability of the metal plate parts made of aluminum material manufactured by the above-mentioned heat treatment, cold working or alloying means that, due to the above-mentioned limited thickness, there is actually difficulty in reducing the separation distance between the inner side of the pressing part 150 that receives heat from the heating element 140 and the refrigerant flow space 205 for realizing evaporation of the liquid-phase refrigerant (a separate additional processing step is required), and the reinforcing elements such as the heat transfer plate 200D-1 on one side generated during the gas-liquid circulation of the refrigerant and the multiple strength reinforcement parts 240 in an embodiment 200 of the utility model for preventing the shaking phenomenon of the heat transfer plate 200D-2 on the other side are formed by a stamping process (poor processability).

[0396] That is, refer to Fig.25 (a) and observing the comparative example 200D, assuming that it is difficult to perform further additional processing due to the thickness limit caused by the design requirement value, when the length of the width between the pair of groove ribs 150a and 150b constituting the press-in portion 150 is designed to match twice the above-mentioned limit thickness, the heating element 140 and the liquid-phase refrigerant are essentially closest to the refrigerant flow space 205, and there is a distance that is further outward than the outer end of the press-in portion 150 (the outer end of the pair of groove ribs 150a and 150b), so there will be a corresponding difference in heat transfer speed and heat transfer amount.

[0397] For example, Fig.25 As shown in (a), when the material of the metal plate member of the heat transfer plate body 200D-1, 200D-2 constituting the pair of groove ribs 150a and 150b of the press-fit portion 150 formed in the same shape and size is aluminum, when at least a part of the refrigerant flow space 205 corresponding to the first refrigerant flow path is not located inside the groove ribs 150a and 150b of the press-fit portion 150, but is set at 1T which is twice the maximum thickness of 0.5T, as shown in Fig.25As shown in (b) of the active heat dissipation mechanism 200 according to an embodiment of the present invention, the heat conduction plate body 200-1, 200-2 made of SUS material can include a thickness of twice 0.15T in the interior 150c of a pair of groove ribs 150a, 150b of the pressing portion 150, and can be processed into a thickness capable of accommodating a portion of the first refrigerant flow path 210.

[0398] In addition, if Fig.25 As shown in comparison example 200D of (a), if the metal plate components constituting the heat conducting plate main bodies 200D-1 and 200D-2 are manufactured with a limiting thickness according to the design requirement value, the processability decreases as the strength and hardness thereof increase. As a result, it is difficult to process the reinforcing elements corresponding to the plurality of strength reinforcing portions 240 through a stamping process. Therefore, there is a disadvantage in that other processing methods (for example, an etching process or a turning process) of other metal plate components are required to process the internal structure or reinforcing elements of the refrigerant flow space.

[0399] In contrast, Fig.25 In the case of embodiment 200 of the utility model shown in (b), the metal plate component made of SUS material has very good elongation itself and excellent processability. The internal structure of the refrigerant flow space 205 including the first refrigerant flow path 210 to the third refrigerant flow path 230 and a plurality of strength reinforcement parts 240 can be simultaneously formed only by a stamping process as a single process, and the contacting parts of the plurality of strength reinforcement parts 240 are welded together through a joining process, thereby preventing the shaking or expansion and contraction of the heat transfer plate 200-1 on one side and the heat transfer plate 200-2 on the other side during the gas-liquid circulation of the refrigerant, and having the advantage of preventing unnecessary consumption of the energy required for evaporating the liquid-phase refrigerant.

[0400] At the same time, in the case of the active heat dissipation mechanism 200D according to the comparative example, as described above, the press-in end portion 201 is formed to have the material thickness (0.5T*2) of the two heat conducting plate main bodies 200D-1 and 200D-2 themselves. In terms of its poor processability, when it is simply combined with the press-in portion 150 by a press-fit method, the fixing force on the heat dissipation shell main body 110 is inevitably weak. In order to ensure its fixing force, after the press-in end portion 201 is inserted and combined with the press-in portion 150, it is necessary to increase the combining force by welding. Therefore, there is a cumbersome problem in the operation process.

[0401] In addition, when the refrigerant flow space 205 is formed inside the heat conducting plate main body 200D-1, 200D-2 made of aluminum material, as described above, the types of refrigerants filled in the refrigerant flow space 205 may be very limited. For example, when distilled water (water) is used as the refrigerant, it cannot function as a refrigerant due to chemical reaction with aluminum material, so there is a problem that distilled water needs to be excluded from the selectable refrigerants.

[0402] According to an embodiment of the present invention, the active heat dissipation mechanism 200 proposes that the heat conducting plate main body 200-1, 200-2 is made of stainless steel (SUS) material. However, when aluminum material is used, various shape designs and features can be ensured to ensure corresponding heat dissipation performance, so as to solve various problems existing in the heat conducting plate main body 200D-1, 200D-2 of the comparison example 200D using the above-mentioned aluminum material.

[0403] In more detail, Fig.25 As shown in (b), according to an embodiment of the present invention, the active heat dissipation mechanism 200 uses the heat conducting plate main body 200-1, 200-2 made of a single material to bend and press the end portion 201 based on an arbitrary reference line T through a bending process (S20), thereby forming a predetermined curvature (for example, referring to Fig.15 and Fig.16 "R1" or "R2"), and at least a portion of the first refrigerant flow path 210 in the refrigerant flow space 205 can be formed in a manner that flows more inward than the front ends of a pair of groove ribs 150a, 150b constituting the press-in portion 150.

[0404] At this time, the material of the heat conducting plate bodies 200 - 1 and 200 - 2 in an embodiment 200 of the present invention can be limited to a metal material having an elongation that satisfies the following conditions.

[0405] In more detail, as one of the conditions, assuming that the structure of the heat conducting plate body is equivalent to a plate shape of an aluminum material equipped with RBFHP as in the existing paper, when a pair of groove ribs 150a, 150b of a press-fit portion 150 formed on the back side of the heat dissipation shell body 110 as the heat dissipation object are inserted with twice the thickness in a way that there is no space, the metal material of the heat conducting plate bodies 200-1, 200-2 in an embodiment 200 of the utility model can be limited to a metal material having an elongation of less than 1 / 6 of the thickness of the heat conducting plate body of the RBFHP of the above-mentioned existing paper that can be bent into the above-mentioned 2 times thickness.

[0406] For example, the thickness of the aluminum heat conducting plate body 200D-1, 200D-2 of the comparative example 200D or the RBFHP of the prior art paper is as described above. When 0.5T is inserted into the press-in portion 150, twice the thickness (1T) is inserted. According to an embodiment of the present invention, the thickness of the heat conducting plate body 200-1, 200-2 in the active heat dissipation mechanism 200 can be 0.15T, which is less than 1 / 6 of 1T.

[0407] Here, in the case of comparative example 200D, the refrigerant flow space 205 is composed of a heat conductive plate 200D-1 on one side and a heat conductive plate 200D-2 on the other side, and the individual thicknesses of the heat conductive plate 200-1 on one side and the heat conductive plate 200-2 on the other side in the heat conductive plate body 200-1 and 200-2 in the active heat dissipation mechanism 200 according to an embodiment of the present invention can be defined as less than 1 / 3 of 0.5T.

[0408] Furthermore, as described above, preferably, the metal material used for the heat conducting plate bodies 200 - 1 and 200 - 2 in an embodiment 200 of the present invention has a bendable elongation so that at least a portion of the first refrigerant flow path 210 is inserted into the front end inner side of the pressing portion 150 .

[0409] Furthermore, the metal material may be defined as having an elongation rate capable of forming a plurality of strength reinforcement portions 240 on a plurality of inclined guide members 215 during processing through the stamping process ( S10 ).

[0410] Therefore, the elongation at this time is also limited to the case of additional manufacturing (heat treatment, cold working or alloying) so that the metal material of the heat conductive plate bodies 200D-1 and 200D-2 is aluminum and has a predetermined tensile strength or higher, as shown in Comparative Example 200D.

[0411] Meanwhile, the thermal conductivity of the metal material used as the heat conducting plate body 200-1, 200-2 in one embodiment 200 of the present invention can be limited to less than 1 / 10 of the thermal conductivity of the aluminum material (230 W / mK level). In fact, the publicly known information is as follows: the thermal conductivity of the SUS material described later is less than 1 / 10 of the thermal conductivity of aluminum, which is 20 W / mK level.

[0412] 10-2. Advantages of using water as refrigerant

[0413] The material that best meets the limitations of the elongation and thermal conductivity comparison as described above can be exemplified by the SUS material described above. In the active heat dissipation mechanism 200 of an embodiment of the utility model, when the metal material of the heat conducting plate main body 200-1, 200-2 is SUS material, not only can the limitations related to the elongation and thermal conductivity mentioned above be overcome, but also distilled water can be additionally used as an adoptable refrigerant.

[0414] That is, the refrigerant filled in the refrigerant flow space 205 of the heat transfer plate bodies 200-1 and 200-2 made of SUS material can be defined as a refrigerant that does not chemically react with the aluminum plate or a refrigerant that is a metal material having the above-mentioned elongation.

[0415] As a refrigerant that meets this definition, distilled water (water) as described above can be representatively cited. When distilled water is used as a refrigerant, it has advantages in terms of cost, heat of vaporization, and surface tension compared to other refrigerants. In particular, when the refrigerant is distilled water, the characteristics of high latent heat and sensible heat are that even if the position of the press-in end 201 is located at a relatively high position relative to the gravity direction, sufficient heat transfer capacity can be exerted. Regardless of the inclination direction of the second refrigerant flow path 220, the diversity of the fixed design of the press-in end 201 can be ensured.

[0416] In more detail, the refrigerant filled in the refrigerant flow space 205 will not cause any chemical reaction when it comes into contact with the metal heat conduction plate bodies 200-1, 200-2. The heat conduction plate bodies 200-1, 200-2 can be composed of distilled water (water) that is transformed from liquid to gas or from gas to liquid by the thermal conductivity of the heat conduction plate bodies 200-1, 200-2 themselves.

[0417] The “chemical reaction” at this time is a concept that also includes “corrosion” of water used as the refrigerant or additional generation of a substance that changes the internal pressure of the refrigerant flow space 205 .

[0418] However, it is an extremely exceptional case that no chemical reaction occurs at all in contact between substances, especially over a long period of time. Therefore, the concept of "chemical reaction" here is as follows: it is preferably broadly interpreted as a reaction that affects the phase change conditions of water at least by changing the internal pressure of the refrigerant flow space 205.

[0419] Here, the water constituting the refrigerant may include one of natural water, distilled water and ultrapure water. However, when water is used, natural water may contain organic and inorganic substances, so it is preferred to use distilled water purified by water vaporization or ultrapure water from which organic and inorganic substances are removed.

[0420] For reference, distilled water can be divided into single distilled water, double distilled water and triple distilled water according to the distillation process. The number of levels of distilled water is classified according to the purification process and is a different level from the purity of water.

[0421] Single-distilled water refers to water that has only been distilled and is called distilled water (DW). Double-distilled water refers to water obtained by distilling single-distilled water once more. Triple-distilled water refers to water obtained by distilling three times. Deionized water (DI Water) is usually obtained by removing ions from single-distilled water.

[0422] Ultrapure water is pure water that has been treated by advanced water purification methods such as reverse osmosis (RO), ion exchange resins, activated carbon filters, and sterilization to remove electrolytes, microorganisms, organic matter, and dissolved gases in water. It refers to water whose specific resistivity (Specific resistivity) is 18MΩ·cm or more at 25°C to the extent that ions have been removed.

[0423] For reference, water having a specific resistance value in the range of 5 MΩ·cm to less than 18 MΩ·cm at 25° C. can be classified as pure water.

[0424] Here, as the refrigerant, not only ultrapure water but also pure water can be used. However, pure water with a resistivity less than 18MΩ·cm at 25°C, unlike ultrapure water, may contain trace amounts of electrolytes, microorganisms, organic matter and dissolved gases in the water. In a closed space, organic gases may be generated over time. Since the total dissolved solids (TDS: Total Dissolved Solids) is above 0.028ppm, it is preferred to use ultrapure water with a resistivity of 18MΩ·cm or above at 25°C.

[0425] Meanwhile, when water is selected and used as the refrigerant, it can be inferred from the problem of comparative example 200D that the metal material of the heat conducting plate bodies 200 - 1 and 200 - 2 should be limited to a material that does not cause any chemical reaction when in contact with water.

[0426] Therefore, in the active heat dissipation mechanism 200 according to the embodiment of the present invention, the metal material of the heat conducting plate bodies 200-1 and 200-2 is a metal material that does not chemically react with water constituting the refrigerant, and may include a stainless steel (SUS) material. Here, SUS is a standard name for stainless steel included in the JIS standard.

[0427] Here, as the metal that does not react with water used as a refrigerant, platinum, gold, silver, iridium, tungsten, titanium and the like can be considered, but as described above, stainless steel (SUS) or copper, which has excellent processability and is inexpensive, is preferably used.

[0428] Furthermore, since the active heat dissipation mechanism 200 according to an embodiment of the present invention has a greater elongation than the comparative example 200D made of aluminum alloy or the RBFHP of the prior art paper, if the press-in end portion 201 is formed in a manner having an outer shape larger than the groove size of the press-in portion 150 and then inserted and coupled by a press-in insertion method in which the press-in portion 150 is forcibly inserted, it has the advantage of being able to form a sufficient fixing force without the need for additional processes such as a separate welding process.

[0429] The use of the press-fitting method of the press-fit portion 150 of the press-fit end portion 201 has the following advantage: it can prevent the absorbent body 300 made of fiber materials such as non-woven fabric from being damaged by welding heat in the additional welding process.

[0430] As described above, in one embodiment 200 of the present invention, the first refrigerant flow path 210 to the third refrigerant flow path 230 are filled with refrigerant, and phase change actively occurs and heat is dissipated by heat transferred from the heating element 140 provided inside the heat dissipation housing body 110, thereby maximizing the heat dissipation performance.

[0431] In particular, refer to Fig.25 Compared with the comparative example 200D, in the case of an embodiment 200 of the utility model, at least a portion of the first refrigerant flow path 210 flows into the inner side of the groove formed by the pressing portion 150 (i.e., the inner side of the front end of the pressing portion 150). Since the refrigerant absorbed and captured by the absorber 300 of the first refrigerant flow path 210 can receive heat in a state closer to the heating element 140, the phase change in the evaporation area is more active, which has the advantage of being able to ensure heat dissipation performance second only to the case of using aluminum material.

[0432] 10-3. Hydrophobic coating materials

[0433] However, when distilled water is used as the refrigerant filling the refrigerant flow space 205 , the surface tension of water is very high, which may cause a problem that the fluidity is reduced due to the slightly thin inner surface of the refrigerant flow space 205 .

[0434] In order to solve the problem of reduced fluidity of the liquid refrigerant, the active heat dissipation mechanism 200 according to an embodiment of the present invention can solve the problem by coating a hydrophobic coating material on the portion corresponding to the inner side surface of the heat conduction plate body 200-1, 200-2 that forms the refrigerant flow space.

[0435] In the case of the first refrigerant flow path 210, a general flow path is provided regardless of the state of the filled refrigerant, and there is no major problem in that the liquid refrigerant is mainly absorbed by the absorber 300. However, the second refrigerant flow path 220 and the third refrigerant flow path 230 provide a flow path for the liquid refrigerant to flow along the surface, and a coating layer using a hydrophobic coating material is formed on the inner side surface of the heat transfer plate body 200-1, 200-2 forming the refrigerant flow space 205, in order to ensure smoother fluidity of the liquid refrigerant.

[0436] However, the coating layer is not necessarily formed using a hydrophobic coating material, and a hydrophilic coating material may be applied depending on the type of refrigerant or the characteristics of the flow path.

[0437] 11. Another embodiment of the utility model (joining manufacturing) and the main arrangement structure of the heat dissipation housing

[0438] Fig.26 is along Figure 4b The cross-sectional view taken along line AA and its partial enlarged view. Fig. 27 is along Figure 4b The sectional stereogram and its partial enlarged diagram taken along the AA line. Fig.28 is along Figure 4b The sectional stereogram and its partial enlarged diagram taken along the BB line. Fig.29 It is a three-dimensional diagram showing an active heat dissipation mechanism according to another embodiment of the utility model. Fig.30 yes Fig.29 Exploded three-dimensional diagram. Fig.31 yes Fig.29 A cut-away stereoscopic view (a), a partial enlarged view (b) and a cross-sectional view (c) of the portion. Fig.32 It is a cross-sectional view showing a connection state of an active heat dissipation mechanism with respect to a press-fit portion according to another embodiment of the present invention.

[0439] So far, reference Figure 4a and Figure 5a , Figures 7 to 24 The active heat dissipation mechanism 200 and its modifications 200T-1 to 200T-6 of one embodiment of the present invention are described on the premise that the first refrigerant flow path 210 is formed by a manufacturing method of bending a single metal plate member or a bending step ( S20 ).

[0440] However, the manufacturing method of the active heat dissipation mechanism according to the present invention is not limited to the embodiment 200 of the bending step (S20). Figure 4b and Figure 5b and Figure 26 to Figure 32As shown, an active heat dissipation mechanism 1200 according to another embodiment of the present invention is proposed and described, which forms a refrigerant flow space 1205 including a first refrigerant flow path 1210 and a second refrigerant flow path 1220 (including a third refrigerant flow path according to the embodiment) by joining two separate metal plate parts in a joining manner.

[0441] In an active heat dissipation mechanism 1200 according to another embodiment of the present invention, Figure 26 to Figure 32 As shown, the heat conducting plate bodies 1200-1 and 1200-2 can be formed by two separate metal plate parts in a joint manner (same as the joint process (S40) described later) to form the refrigerant flow space 1205. This is different from the manufacturing method of the active heat dissipation mechanism 200 according to an embodiment of the utility model in that the refrigerant flow space 205 is formed by bending a single metal plate part and then joining the single metal plate part.

[0442] The active heat dissipation mechanism 1200 according to another embodiment of the present invention can be used in conjunction with the reference Figure 4a and Figure 5a The first configuration example shown in the figure is realized by combining the back side of the heat dissipation housing body 110, but the premise is as follows Figure 4b and Figure 5b As shown, the heat dissipation case body 110 is combined and provided on the back side of the heat dissipation case body 110 implemented by the second implementation example by a press-in portion 150 having a different shape including a press-in end portion 201 side suitable for the difference in the above-mentioned manufacturing method.

[0443] Reference Figure 26 to Figure 29 On the back side of the heat dissipation housing body 110 implemented using the second setting implementation example, a plurality of press-in portions 150 are arranged long in the up-down direction (i.e., along the vertical direction), and according to another embodiment of the utility model, an active heat dissipation mechanism 1200 can be formed to be separated from each other in the left-right width direction.

[0444] As described above, when the active heat dissipation mechanism 1200 according to another embodiment of the present invention is provided on the back portion of the heat dissipation housing body 110 implemented by utilizing the second setting implementation example, compared with the active heat dissipation mechanism 200 with a "V" shape pattern according to an embodiment of the present invention, the flow resistance of the external air (external air) in the vertical direction up and down is minimized, thereby making the inflow of the external air smooth, and having the advantage that the flow resistance to the rising airflow is also minimized due to the heat released from each active heat dissipation mechanism 1200.

[0445] Furthermore, on the back side of the heat dissipation housing body 110 implemented using the second setting implementation example, a single press-fit portion 150 can be arranged longer in the up-down direction, but considering the limitation of the dispersion force or rising force of the liquid-phase refrigerant in the first refrigerant flow path 1210, in this case, a plurality of fixed heat dissipation fins 200F can be provided in the lower end area which is a portion where less heat dissipation is required.

[0446] The active heat dissipation mechanism 1200 according to another embodiment of the present invention, which is arranged on the back side of the heat dissipation shell body 110 implemented by the second setting implementation example as described above, can include a side heat conduction plate 1200-1 forming one side in the thickness direction of the refrigerant flow space 1205 and another side heat conduction plate 1200-2 forming the other side in the thickness direction of the refrigerant flow space 1205 after bonding after being manufactured by a bonding process (S40).

[0447] Here, the first refrigerant flow path 1210 and the second refrigerant flow path 1220 may be formed symmetrically with respect to the joint surface of the one side heat conduction plate 1200 - 1 and the other side heat conduction plate 1200 - 2 .

[0448] However, it is not limited to that the first refrigerant flow path 1210 and the second refrigerant flow path 1220 provided on one side of the heat conducting plate 1200-1 and the other side of the heat conducting plate 1200-2 are symmetrically formed, and it is not excluded that Figures 22a to 24 The multiple modified examples 200T-1 to 200T-6 of the active heat dissipation mechanism 200 according to an embodiment of the present invention are formed asymmetrically.

[0449] In addition, in an active heat dissipation mechanism 1200 according to another embodiment of the utility model, the first refrigerant flow path 1210 is a portion that stores and retains the liquid-phase refrigerant in the refrigerant filled in the refrigerant flow space 1205, so that it is arranged vertically up and down along the gravity direction, and the liquid-phase refrigerant is located at least close to the lower end of the upper end and the lower end of the above-mentioned first refrigerant flow path 1210.

[0450] The bonding surface of the heat conductive plate 1200-1 on one side and the heat conductive plate 1200-2 on the other side can be defined as an edge end portion including a press-fit end portion 1201 corresponding to an evaporation region and a heat dissipation plate portion 1203 corresponding to a condensation region as a bonding area.

[0451] That is, in the case of an active heat dissipation mechanism 200 according to one embodiment of the utility model, the portion joined by the joining process (S40) described later is the edge end of the heat dissipation plate portion 203 excluding the pressed end 201 side of the portion formed by the bending process (S20). It should be noted that this is different from a part of the joining portion of the active heat dissipation mechanism 1200 according to another embodiment of the utility model in which two separate metal plate parts are combined and sealed.

[0452] In more detail, in the active heat dissipation mechanism 1200 according to another embodiment of the present invention, the heat conducting plate bodies 1200-1 and 1200-2 are connected to the edge ends of the heat conducting plate 1200-1 on one side and the heat conducting plate 1200-2 on the other side, and one of the widthwise end and the other end of the edge ends (with Fig.25 The first refrigerant flow path 1210 is formed inside the edge end (equivalent to one end serving as the left end), and a pressed-in end 1201 combined with a pressed-in portion 150 formed on the back side of the heat dissipation housing body 110 serving as the heat dissipation object can be formed outside one of the width direction ends and the other end (one end).

[0453] Furthermore, the heat conducting plate bodies 1200-1 and 1200-2 are formed by joining the edge ends of the heat conducting plate 1200-1 on one side and the heat conducting plate 1200-2 on the other side, and the other end (with the exception of the press-in end 1201 formed with the first refrigerant flow path 1210) of one end in the width direction of the edge ends and the other end (with the exception of the press-in end 1201 formed with the first refrigerant flow path 1210) of the other end. Fig.26 As a reference, the other end portion as the right end portion is equivalent to the above-mentioned press-in end portion 1201) and the second refrigerant flow path 1220 is formed inside. A heat dissipation plate portion 1203 for heat exchange with the external air can be formed outside one end portion in the width direction of the edge end portion and the other end portion (the other end portion) of the other end portion.

[0454] In addition, if Figure 4b and Figure 5b As shown, the active heat dissipation mechanism 1200 according to another embodiment of the present invention is provided at a press-fit portion 150 of a part of a joint portion of the active heat dissipation mechanism 1200 according to another embodiment of the present invention which is arranged long in a vertical manner in the up-down direction on the back side 54 of the heat dissipation housing body 110 to join two separate metal plate parts and seal. Therefore, the press-fit end portion 1201 corresponding to the front end and the outer end portion of the heat dissipation plate portion 1203 corresponding to the rear end may be parallel to each other.

[0455] Therefore, the technical feature mentioned in the description part of the active heat dissipation mechanism 200 according to one embodiment of the utility model, that "among the multiple inclined guide members 215, the first refrigerant flow path 210 is located at the lower side of the gravity direction than the second refrigerant flow path 220" can be of greater significance in limiting the inclination direction of the second refrigerant flow path 1220 in the active heat dissipation mechanism 1200 according to another embodiment of the utility model.

[0456] That is, the first refrigerant flow path 1210 is located on the lower side of the second refrigerant flow path 1220 along the direction of gravity, which means that the parts corresponding to the outer end side of the heat dissipation plate portion 1203 at one end and the other end of the second refrigerant flow path 1220 are inclined in a manner that they are located at a higher position than the part corresponding to the side of the press-in end 1201 having the first refrigerant flow path 1210 based on the direction of gravity.

[0457] At the same time, if Fig.29 and Fig.30 As shown, the active heat dissipation mechanism 1200 according to another embodiment of the present invention may further include: an auxiliary absorber 301 for improving the absorption rate of the liquid-phase refrigerant of the absorber 300 .

[0458] For example, an antenna device that recently applies the Massive MIMO (Massive Multiple Input Multiple Output) technology is usually manufactured to be longer in the vertical length direction than in the width direction, and in order to effectively dissipate the heat of the plurality of heating elements 140 that are arranged to be separated from each other in the vertical length direction using the minimum number of active heat dissipation mechanisms 1200, the active heat dissipation mechanism 1200 should be manufactured to be as long as possible in the vertical length direction. Figure 4b and Figure 5b As shown in the antenna device 100 using the active heat dissipation mechanism 1200 according to another embodiment of the present invention, a portion of the upper end of the active heat dissipation mechanism 1200 can extend upward longer to cover the upper end of the heat dissipation housing body 110.

[0459] However, in the case where the heat transfer plate bodies 1200-1 and 1200-2 are formed to be longer along one side (for example, in the direction of gravity), the length of the first refrigerant flow path 1210 in the direction of gravity can only be lengthened. It is difficult to draw out and disperse sufficient liquid-phase refrigerant from the lower side to the upper side end portion in the direction of gravity using only the absorption capacity of the absorber 300 itself to absorb the liquid-phase refrigerant. In addition, since the absorption rate of the liquid-phase refrigerant in the direction of gravity is different, the heat dissipation performance may also be uneven depending on the position.

[0460] Here, the auxiliary absorber 301, as shown in the active heat dissipation mechanism 200 according to one embodiment of the present invention described above, in addition to performing the basic function of increasing the absorption rate of the absorber 300 itself, further, as shown in the active heat dissipation mechanism 1200 according to another embodiment of the present invention, when the active heat dissipation mechanism 1200 extends further upward than the upper end of the heat dissipation shell body 110 to cover the upper end portion of the heat dissipation shell body 110, the liquid-phase refrigerant condensed on the heat dissipation plate portion 1203 side corresponding to the upper side of the heat dissipation shell body 110 can be easily captured on the upper end side of the absorber 300 and absorbed.

[0461] That is, the auxiliary absorber 301 performs a function of easily guiding the liquid-phase refrigerant to be captured to the upper end portion side of the absorber 300 located on the upper side in the gravity direction among the absorbers 300 arranged long in the length direction.

[0462] In more detail, preferably, the liquid-phase refrigerant condensed and dropped at the heat sink portion 1203 located on the upper side in the gravity direction is uniformly supplied to the first refrigerant flow path 1210 side along the plurality of second refrigerant flow paths 1220 formed between the plurality of inclined guide members 1215 .

[0463] However, in the heat dissipation plate portion 1203, when a portion of the liquid-phase refrigerant condensed on the upper side in the gravity direction has a very small volume before the surface tension is formed, there is a concern that the liquid-phase refrigerant may fall directly downward through the third refrigerant flow paths 1230 rather than the adjacent second refrigerant flow paths 1220. In this case, there is a problem that the liquid-phase refrigerant cannot be smoothly supplied to the absorber 300 located on the relatively upper side in the gravity direction.

[0464] Here, since the auxiliary absorber 301 can absorb the condensed refrigerant directly falling from its upper portion and supply the liquid-phase refrigerant to each corresponding portion of the absorber 300 , the auxiliary absorber 301 can perform the function of alleviating the uneven supply of the liquid-phase refrigerant to the absorber 300 .

[0465] That is, Fig.29 and Fig.30 As shown, the liquid refrigerant that condenses and falls from the heat sink portion 1203 located on the upper side in the gravity direction is captured and supplied to the upper end side of the absorber 300. By dispersing the liquid refrigerant from the position where the liquid refrigerant is supplied to the upper side in the gravity direction and lifting it upward, it is able to supplement the heat dissipation performance of the existing absorber 300 with a low absorption rate.

[0466] Furthermore, generally, as the high-temperature gas-phase refrigerant evaporated on the lower side in the gravity direction moves concentratedly to the upper side in the refrigerant flow space, it may be difficult to eliminate the heat at the upper end portion in the refrigerant flow space due to the lack of more sufficient condensation space (condensation area), and the auxiliary absorber 301 performs the function of continuously supplying a portion of the liquid-phase refrigerant flowing from the upper side to the lower side of the refrigerant flow space to the first refrigerant flow path 1210 side corresponding to the upper end portion side of the absorber 300, thereby enabling overall uniform heat dissipation.

[0467] To this end, in an active heat dissipation mechanism 1200 according to another embodiment of the present invention, as Fig.29 and Fig.30 As shown, the auxiliary absorbent body 301 may further include two upper auxiliary absorbent bodies 301 - 1 and two lower auxiliary absorbent bodies 301 - 2 at two locations, one at the relatively upper side and the other at the relatively lower side.

[0468] In more detail, the auxiliary absorber 301 may be disposed in the auxiliary absorber installation portions 1261 and 1262 in which a portion of the second refrigerant flow path 1220 is deformed to have a wider width.

[0469] In the case where two auxiliary absorbent bodies 301 (see reference numerals 301-1 and 301-2) are provided, Fig.30 As shown, the auxiliary absorbent body installation parts 1261 and 1262 may be formed at two positions corresponding to the positions of the auxiliary absorbent body 301.

[0470] The auxiliary absorber 301 may include an upper auxiliary absorber 301 - 1 connected to the upper end of the absorber 300 , and a lower auxiliary absorber 301 - 2 connected to the middle of the absorber 300 .

[0471] Furthermore, the upper auxiliary absorber 301-1 and the lower auxiliary absorber 301-2 may be provided with a pair of auxiliary absorbers 301-1A, 301-1B, 301-2A, 301-2B formed of non-woven fabric in the auxiliary absorber setting parts 1261, 1262 respectively formed on one side heat conduction plate 1200-1 and the other side heat conduction plate 1200-2.

[0472] In addition, if Fig.30 As shown, a plurality of fixing ribs 1263 for stably fixing the auxiliary absorber 301 may be provided in the refrigerant flow space 1205 .

[0473] The plurality of fixing ribs 1263 are formed to cross the auxiliary absorber installation parts 1261 and 1262 in the width direction, and both ends are respectively connected to the width direction outer ends of the auxiliary absorber installation parts 1261 and 1262 by welding.

[0474] Here, the auxiliary absorber setting parts 1261, 1262 are processed and formed into a groove shape that further increases the thickness of the refrigerant flow space 1205 from the inner side surfaces of the one side heat conduction plate 1200-1 and the other side heat conduction plate 1200-2 toward the outside, and a gap for inserting and placing the auxiliary absorber 301 can be provided between the auxiliary absorber setting parts 1261, 1262 and the multiple fixing ribs 1263, and the auxiliary absorber 301 can be set through the gap.

[0475] The plurality of fixing ribs 1263 as described above can prevent the auxiliary absorber 301 from being separated in the thickness direction of the refrigerant flow space 1205 .

[0476] In addition, the active heat dissipation mechanism 1200 according to another embodiment of the present invention is made by joining the heat conducting plate 1200-1 on one side and the heat conducting plate 1200-2 on the other side, which are formed by two metal plate parts, in a state where the edge ends including the portion corresponding to the pressed end 1201 are in surface contact with each other, and is made of SUS material with good elongation, such as Fig.32 As shown, the plurality of press-in portions 150 formed on the back side of the heat dissipation housing body 110 may be combined in a press-fit manner.

[0477] At this time, preferably, at least half of the portion including the edge end portion of the docking joint and corresponding to the first refrigerant flow path 1210 (or the absorber 300) is press-fitted in a manner that is located further inward than the outer ends of a pair of groove ribs 150a, 150b forming the press-fit portion 150.

[0478] As described above, the active heat dissipation mechanism 1200 according to another embodiment of the present invention is made of SUS material with good elongation. Even if the absorber 300 made of slightly heat-resistant fiber material such as non-woven fabric is arranged on the first refrigerant flow path 1210 side, it has the advantage of being firmly fixed to the back side of the heat dissipation shell body 110 by a simple press-fit combination method without using a welding process.

[0479] Furthermore, when the active heat dissipation mechanism 1200 according to another embodiment of the present invention is combined with the active heat dissipation mechanism 1200 manufactured by the same bonding method, Fig.25 When compared with the comparison example 200D shown in (b), even considering the same insertion thickness of the pressing portion 150, the first refrigerant flow path 1210 can be arranged close to the pressing portion 150 while ensuring that the first refrigerant flow path 1210 has a thickness of 0.7T which is at least 1T (0.5T*2) minus 0.3T (0.15T*2). In fact, it can be expected that the heat dissipation performance can be improved by the phase change of the refrigerant according to an embodiment of the utility model.

[0480] 12. Comparison of experimental data between comparative examples and the present invention

[0481] Fig.33 is to show that the comparison is based on Fig.25 Graph (a) and comparison graph (b) of the temperature of the heating element 140 of the active heat dissipation mechanism 200D of the comparative example and the active heat dissipation mechanism 200 according to an embodiment of the present invention.

[0482] In order to confirm the heat dissipation performance of the active heat dissipation mechanism 200 according to an embodiment of the present invention, the applicant of the present invention respectively sets the active heat dissipation mechanism of the comparative example 200D and the active heat dissipation mechanism according to the embodiment 200 of the present invention on the back of the same heat dissipation housing body 110 at the same number or the same shape of the press-in parts 150, and after installing five heating elements 140 with an input power of 25W on the mainboard, it can be as follows Fig.33 The temperature result value of each heating element 140 is obtained as shown.

[0483] Reference Fig.33 The temperature difference between the comparison example 200D and an embodiment 200 of each of the five heating elements 140 is at least 0.2°C (refer to heating element 1) and at most 2.1°C. It is known that the temperature measurement of the heating element of the active heat dissipation mechanism 200 according to an embodiment of the present invention is lower.

[0484] The result that the temperature of the heating element is relatively low indicates that the heat dissipation performance of the active heat dissipation mechanism 200 according to an embodiment of the present invention is better than that of the comparative example 200D.

[0485] Fig.34 The table shows the time taken for two products of RBFHP in the prior art (Roll Bonding Fin (292*115 and 310*90)) and the active heat dissipation mechanism (PTX (310*90)) according to one embodiment of the present invention to reach 50°C, 60°C and 70°C respectively. Fig.35 It is a graph comparing the temperature of the heat sink AL6063_REF made of ordinary aluminum material without using refrigerant, which is estimated to be two specifications of RBFHP products in the existing paper (roller-bonded fins (292*115 and 310*90)) and an active heat dissipation mechanism (PTX (310*90)) according to an embodiment of the present invention according to the position of each heat source (heating element).

[0486] To obtain Fig.34The test results are as follows: After two products of two shapes and specifications in the existing paper and a part of the prototype of the active heat dissipation mechanism 200 according to an embodiment of the utility model are immersed in a water tank corresponding to the same heat source at the same time, the temperature rise time of the part not placed in the water tank is obtained.

[0487] However, in order to confirm that the above result values ​​do not differ due to the shape difference of the product itself, the RBFHP of the existing paper is used as two shapes, and the active heat dissipation mechanism 200 according to an embodiment of the present invention is manufactured in the same shape (size) and measured.

[0488] Reference Fig.34 The time required for two RBFHP products made of the same aluminum material in the existing paper that utilize the phase change of the refrigerant to reach a specific temperature is approximately faster than the product in which the length direction is larger than the width (Roll Bonding Fin, 310*90) than the other product (Roll Bonding Fin, 292*115) (i.e., it takes 1 second faster to reach 50°C, 25 seconds faster to reach 60°C, and 36 seconds faster to reach 70°C).

[0489] This may be due to the active diffusion flow of the gas phase refrigerant when the evaporation region and the condensation region of the refrigerant are separated from each other and the condensation region is further separated from the evaporation region or is separated from each other to some extent. Therefore, the width dimension can be slightly reduced, which can be an important indicator for reducing the front-to-back thickness of the antenna device (or electronic device).

[0490] At the same time, if Fig.32 As shown, by comparing the temperature arrival times of the active heat dissipation mechanism 200 (PTX, 310*90) according to an embodiment of the present invention and the product with the same shape and specification (Roll Bonding Fin, 310*90) in the two RBFHP products in the above-mentioned existing paper, it can be confirmed that the target temperature is reached in a very short time.

[0491] That is, in the case of an active heat dissipation mechanism 200 (PTX, 310*90) according to an embodiment of the utility model, the time to reach the maximum target temperature of 70°C is only 8 seconds, which is nearly 5 times the time to reach the minimum target temperature of 50°C by the product of the RBFHP (Roll Bonding Fin, 310*90) specification of the existing paper, and is nearly 10 times faster than the time to reach the minimum target temperature of 50°C.

[0492] This indicates that compared with the RBFHP roll bonding fin ((Roll Bonding Fin), 310*90) specification product in the existing paper, the active heat dissipation mechanism 200 (PTX, 310*90) according to an embodiment of the utility model performs gas-liquid circulation very actively in the refrigerant flow space.

[0493] That is, compared with the RBFHP product of the existing paper, the active heat dissipation mechanism 200 according to an embodiment of the present invention is estimated to have a spacing distance of the refrigerant flow space 205 (more specifically, the first refrigerant flow path 210) that substantially performs heat dissipation minimized, and compared with the excellent thermal conductivity of the material of the metal plate component itself, the reduction in the spacing distance between the liquid-phase refrigerant in the refrigerant filled in the refrigerant flow space 205 and the heating element 140 is considered to be a good result for more realistically improving the heat dissipation performance.

[0494] As described above, in the case where the time for all condensation areas except the evaporation area to reach the target temperature is minimized, heat dissipation can of course be achieved with faster and higher performance.

[0495] In addition, export Fig.34 The purpose of the test of the result value is to measure the temperature result value at each position of the heat source (heat generating element) of the heat dissipation part which is formed longer in the up and down direction as shown in the antenna device, and to confirm the installation suitability of the antenna device by comparing the heat dissipation fins (AL6063_REF) made of ordinary aluminum material and the roll-bonded fins ((RollBonding Fin) 292*115 and 310*90) of two specifications which are presumed to be RBFHP of the existing paper, when the active heat dissipation mechanism 200 (PTX, 310*90) according to an embodiment of the utility model does not utilize the phase change of the refrigerant.

[0496] In order to derive its accurate result value, such as Fig.35 As shown, heat sources (heat generating elements) with a uniform power input of 25 W were arranged at equal intervals in five locations vertically and horizontally, and then the above four products were replaced as heat dissipating fins and measured.

[0497] The results, such as Fig.35 As shown, in the case of the heat sink fin (AL6063_REF) product made of ordinary aluminum material, compared with the two specifications of the RBFHP product roll bonding fin ((Roll Bonding Fin), 292*115 and 310*90) presumed to be the existing paper, the temperature of the third heat source in the middle from the bottom heat source itself is relatively high, and below, the fourth heat source and the top heat source have relatively low temperatures.

[0498] Although it is difficult to accurately identify the cause of this result, it can be inferred that both RBFHP products in the existing paper are more affected by the rising airflow of the seemingly relatively high temperature outside air at a higher position. Therefore, the RBFHP in the existing paper is not preferably suitable for all heat dissipation parts formed long in the vertical direction as shown in the antenna device in terms of heat dissipation performance, and is preferably designed to be cross-arranged with the above-mentioned ordinary aluminum material heat dissipation fin (AL6063_REF) product to achieve the best performance according to each position.

[0499] In contrast, in the case of an active heat dissipation mechanism 200 (PTX, 310*90) according to one embodiment of the present invention, a good heat source temperature value is presented regardless of the height of the heat source. Therefore, of course, the present invention has the advantage of being able to be evenly applied to all heat dissipation parts that are formed in a long vertical direction as shown in the antenna device.

[0500] As described above, the active heat dissipation mechanism 200 according to an embodiment of the present invention provides the following advantages: it can overcome the restrictions on the use and selection of refrigerants that have recently emerged as restrictions of the international community, and can maximize the heat dissipation performance of the product itself.

[0501] 13. A manufacturing method according to one embodiment and another embodiment of the utility model

[0502] Fig.36 The flowchart shows a method for manufacturing an active heat dissipation mechanism according to an embodiment of the present invention. Fig.37 is a flow chart showing a method for manufacturing an active heat dissipation mechanism according to another embodiment of the present invention.

[0503] like Fig.36 As shown, the manufacturing method of the active heat dissipation mechanism according to the embodiment of the utility model includes: a stamping process (S10), crimping the heat conductive plate bodies 200-1 and 200-2 of the heat conductive material as a single component, thereby processing them at a predetermined depth respectively, so that the first refrigerant flow path 210, the second refrigerant flow path 220 and the third refrigerant flow path 230 are recessed.

[0504] like Fig.12 As shown, the stamping process (S10) can be defined as a process for manufacturing a single heat conduction plate body 200-1, 200-2 having the same specifications and specifications while bending each other with respect to an arbitrary reference line T, so that the above-mentioned first refrigerant flow path 210 to the third refrigerant flow path 230 and multiple strength reinforcement parts 240 are symmetrically formed.

[0505] In addition, according to an embodiment of the utility model, the manufacturing method of the active heat dissipation mechanism may include: a bending process (S20), after the stamping process (S10), folding the one side heat conduction plate 200-1 on one side in the width direction and the other side heat conduction plate 200-2 on the other side in the width direction with an arbitrary reference line T based on the first refrigerant flow path 210 as a reference; a joining process (S40), after the bending process (S20), the edge ends corresponding to the heat dissipation plate parts 203 of the one side heat conduction plate 200-1 and the other side heat conduction plate 200-2 and the second refrigerant flow path 220 and the multiple strength reinforcement parts 240 formed on the third refrigerant flow path 230 are joined to each other.

[0506] Here, the joining process (S40) is performed for the purpose of sealing the refrigerant flow space 205 filled with refrigerant, which is equivalent to the pressed end 201 on the side of the first refrigerant flow path 210, which is a part that has been sealed by the bending process (S20). Therefore, as described above, it can be interpreted as a process of joining along the edge end corresponding to the heat dissipation plate part 203.

[0507] In addition, the manufacturing method of the active heat dissipation mechanism according to the embodiment of the utility model may also include: an absorber setting step (S30), before the joining step (S40), an absorber 300 for absorbing and moving liquid refrigerant by capillary force is set at a position corresponding to the first refrigerant flow path 210 near the pressed end 201.

[0508] At this time, the absorber 300 can be inserted into one of the openings at both ends of the first refrigerant flow path 210 in the longitudinal direction formed by the bending process (S20), and then filled with refrigerant by the refrigerant filling process (S50) described later, and then shielded by filling one of the two ends of the opening to prevent internal refrigerant leakage.

[0509] In more detail, the absorber setting process (S30) is a process performed during the execution of the bending process (S20), and can be defined as a process of inserting and setting the absorber 300 in a portion of the first refrigerant flow path 210 formed before completing the bending process (S20).

[0510] That is, if we refer to Fig.12 In the bending process (S20), as shown in FIG. Fig.12 As shown in (b), after the heat transfer plate 200-1 on one side and the heat transfer plate 200-2 on the other side are bent at a certain angle with respect to an arbitrary reference line T to form a part of the first refrigerant flow path 210, the absorber 300 is arranged in a manner to be disposed at the portion where the first refrigerant flow path 210 is formed, the absorber 300 can be placed as shown in FIG. Fig.12 The additional bending step (S20) shown in (c) is performed as follows Fig.10 The bonding step (S40) shown in (d).

[0511] At this time, if the bending process ( S20 ) is completed, the absorber 300 can be stably fixed at a position corresponding to the first refrigerant flow path 210 by a plurality of absorber fixing guides 250 formed at the first refrigerant flow path 210 .

[0512] Thereafter, when the edge ends of the heat transfer plate 200-1 on one side and the heat transfer plate 200-2 on the other side are joined by the joining process (S40) as described above, the two ends in the length direction of one end and the other end of the press-in end 201 constituting the first refrigerant flow path 210 are in an open state, and one of the two ends of the opening is sealed for the subsequent vacuum process (not shown) to be performed later. After the refrigerant is filled by the refrigerant filling process (S50) to be described later, the caulking finishing process (not shown) to be described later can be performed to cover the other end of the opening that is not sealed by the caulking operation, thereby preventing internal refrigerant leakage.

[0513] At the same time, the manufacturing method of the active heat dissipation mechanism according to the embodiment of the utility model includes: a refrigerant filling process (S50), after the joining process (S40), the refrigerant is filled through one side end or the other side end (that is, one of the two ends of the opening) in the length direction of the first refrigerant flow path 210; and a heat dissipation mechanism fastening process (S60), after the refrigerant filling process (S50), the pressing portion 150 is pressed into the heat dissipation shell body 110 in a press-fit manner.

[0514] The refrigerant filling process (S50) can be implemented by forming one of the openings at one end and the other end (i.e., both ends) of the first refrigerant flow path 210 in the longitudinal direction, and completely sealing after filling the refrigerant, thereby preventing leakage of the refrigerant.

[0515] However, according to the manufacturing method of the active heat dissipation mechanism of the embodiment of the utility model, it can also include: a cleaning process (not shown), before the absorber setting process (S30), one of the openings formed at the two ends of the first refrigerant flow path 210 is sealed and shielded, and the refrigerant flow space is cleaned; and a vacuuming process (not shown), after the cleaning process and before the refrigerant filling process (S50) or after the refrigerant filling process (S50), the refrigerant flow space is vacuumed through one of the unsealed openings formed in the openings at the two ends of the first refrigerant flow path.

[0516] Here, the cleaning process can be achieved by immersing the active heat dissipation mechanism 200 according to an embodiment of the utility model in a sedimentation tank, an ultrasonic tank, a rinse tank, and a vapor degreasing tank in sequence, and finally can be performed by drying to remove moisture. The vacuuming process is usually a process in which the interior of the device operated by vacuum is vacuumed by suction and then filled with refrigerant, and then the refrigerant is heated and evaporated, and then vacuumed again (heating vacuuming process) or after filling with refrigerant, the refrigerant is temporarily frozen (solidified) and then vacuumed (freezing vacuuming method).

[0517] For reference, in the vacuuming process of the former method of filling (injecting) the refrigerant after vacuuming, the vacuum degree changes when the refrigerant is filled (injected). If a high vacuum is first formed and then the refrigerant is filled, it becomes a low vacuum state. From the perspective of a low-cost process method, it is mainly suitable for mass production and the manufacture of low-priced products where price takes precedence over quality.

[0518] At the same time, the latter method includes the filling (injection) of the liquid refrigerant and the vacuum process after the freezing of the liquid refrigerant. Specifically, after the first vacuum is completed, the liquid refrigerant is filled and frozen, and then the second vacuum is performed. Although it goes through a complicated process compared to the former method, it has the advantages of fast response speed, minimizing NCG, and improving Qmax of high vacuum products. In addition, the freezing process of the liquid refrigerant can reduce the capacity of the vacuum equipment and increase the vacuum exhaust speed, which is mainly suitable for small-scale production and the manufacture of high-priced products.

[0519] If the vacuuming process is completed, a caulking finishing process (not shown) may be further included, in which the remaining openings of the remaining first refrigerant flow paths 210 are caulked instead of being caulked for the vacuuming process.

[0520] In particular, Fig.13 As shown, according to an embodiment of the utility model, an active heat dissipation mechanism 200 is formed with a side caulking end 207a which further protrudes outward as a part of the pressed end 201 corresponding to one end and the other end of the first refrigerant flow path 210. During the caulking operation and the caulking finishing operation performed after the above-mentioned joining process (S40), a predetermined caulking component made of elastic material is used to cover the opening portion, and after the protruding portion is crimped by a crimping caulking tool (not shown) to completely seal it, the protruding portion is cut and removed as the portion to be compressed again, so that the caulking operation can be performed.

[0521] At the same time, the manufacturing method of the active heat dissipation mechanism according to an embodiment of the present invention can also include at least one of a leakage test process (not shown) for testing whether the refrigerant is leaking after the caulking finishing process, a performance inspection process (not shown) for finally checking the performance of the active heat dissipation mechanism 200 of the present invention, and a reliability test process for testing the reliability of the active heat dissipation mechanism 200 of the present invention.

[0522] In addition, although not shown in the figure, the manufacturing method of the active heat dissipation mechanism according to an embodiment of the utility model may also include: a coating process (not shown in the figure), forming a hydrophobic coating material on a surface of the heat conduction plate body 200-1, 200-2 in which the refrigerant flow space 205 filled by the refrigerant filling process (S50) is formed before the bending process (S20) (or the absorber setting process (S30)).

[0523] Here, the description is given assuming that water (distilled water) is used as the refrigerant and the hydrophobic coating material is limited to the raw material of the coating layer, but of course a hydrophilic coating material may be used depending on the type of refrigerant used or the refrigerant flow path.

[0524] In addition, refer to Fig.37 The manufacturing method of the active heat dissipation mechanism 1200 according to another embodiment of the present invention may be different from the manufacturing method of the active heat dissipation mechanism 200 including the bending process (S20) according to one embodiment of the present invention as follows.

[0525] That is, according to another embodiment of the utility model, the manufacturing method of the active heat dissipation mechanism 1200 may include: a stamping process (S10), crimping two separate metal plate components respectively, so as to process them into refrigerant flow spaces including a first refrigerant flow path 1210 and a second refrigerant flow path 1220 with a predetermined depth respectively; a joining process (S40), after the stamping process (S10), joining along the edge ends of the heat conduction plate main bodies 1200-1 and 1200-2 equipped with two separate metal plate components, so as to simultaneously form a refrigerant flow space equivalent to the first refrigerant flow path 1210 and the second refrigerant flow path 1220; and a refrigerant filling process (S50), filling the refrigerant into the refrigerant flow space.

[0526] According to a manufacturing method of an active heat dissipation mechanism 200 etc. according to an embodiment of the utility model, a single metal plate component is used to perform a stamping process (S10) to form a refrigerant flow space including a first refrigerant flow path 210 and a second refrigerant flow path 220, and an edge end portion other than the side portion of the pressed-in end portion 201 is formed through a bending process (S20) so as to be manufactured in a state capable of being joined by a joining process (S40) performed thereafter.

[0527] In contrast, according to another embodiment of the present invention, in a method for manufacturing an active heat dissipation mechanism 1200, two separate metal plate components are respectively subjected to a stamping process (S10) to form portions corresponding to the first refrigerant flow path 1210 and the second refrigerant flow path 1220 together with the edge ends thereof as their outer shapes. Then, without the above-mentioned bending process (S20), the edge ends of the two separate metal plate components can be directly joined by a joining process (S40).

[0528] Of course, in the manufacturing method of the active heat dissipation mechanism 1200 according to another embodiment of the present invention, the absorber setting step (S30) of setting the absorber 300 or the auxiliary absorber 301 can also be performed before the bonding step (S40).

[0529] Furthermore, in the case where the active heat dissipation mechanism 1200 according to another embodiment of the present invention includes a plurality of strength reinforcement parts 1240, the joining process (S40) should be interpreted as the following concept: a process comprising joining the edge ends of two separate metal plate parts in a predetermined manner and simultaneously joining the plurality of strength reinforcement parts 1240 to each other.

[0530] However, in a manufacturing method of an active heat dissipation mechanism 1200 according to another embodiment of the present invention, in order to perform a cleaning process and a vacuum process performed after the bonding process (S40), after forming the part in a manner in which one end and the other end side of the part corresponding to the pressed end 1201 side are opened, a subsequent filling finishing process can be performed.

[0531] According to the active heat dissipation mechanism 200, 1200 of the embodiment of the present invention having the above-mentioned structure, heat transfer and heat dissipation are achieved by actively changing the phase of the refrigerant filled inside. Since it can overcome the material limitations of the existing heat dissipation fins themselves and achieve higher heat dissipation performance, it has the advantage of significantly improving the performance of antenna devices or similar electronic devices.

[0532] The heat dissipation mechanism according to one embodiment of the utility model is described in detail above with reference to the accompanying drawings. However, the embodiment of the utility model is not limited to the above-mentioned one embodiment. It is natural that a technician with ordinary knowledge in the technical field to which the utility model belongs can make various modifications and implement them within the equivalent scope. Therefore, the true scope of rights of the utility model should be determined by the claims.

[0533] Industrial Application Possibility

[0534] The utility model provides an active heat dissipation mechanism which can actively transfer heat generated from a heat generating device (for example, an electronic device) through a phase change of a refrigerant which is more effective than the heat conducting material property of the refrigerant itself, thereby improving the heat dissipation performance.

Claims

1. An active heat dissipation mechanism, characterized in that: include: The heat conducting plate body has a refrigerant flow space filled with refrigerant. Wherein, the heat conducting plate body comprises: A heat conducting plate on one side, forming a side surface of the refrigerant flow space in a thickness direction; and The other side heat conduction plate forms the other side of the refrigerant flow space in the thickness direction. At least one of the one-side heat conducting plate and the other-side heat conducting plate is formed with a strength reinforcement portion protruding toward the refrigerant flow space.

2. The active heat dissipation mechanism according to claim 1, characterized in that: The metal plate component constituting the heat conducting plate body is made of stainless steel.

3. The active heat dissipation mechanism according to claim 1, characterized in that: The refrigerant flow space includes: a first refrigerant flow path for acquiring heat from a heat generating body as a heat dissipation target through the heat transfer plate body; and The plurality of second refrigerant flow paths are connected to the first refrigerant flow path, and uniformly supply the liquid phase refrigerant condensed from the gas phase to the liquid phase of the refrigerant to the first refrigerant flow path side.

4. The active heat dissipation mechanism according to claim 3, characterized in that: The second refrigerant flow path is formed along the gravity direction or is formed inclined with respect to the gravity direction.

5. The active heat dissipation mechanism according to claim 3, characterized in that: The second refrigerant flow path is defined between a plurality of inclined guides that are symmetrically protruded from opposing surfaces of the heat transfer plate body toward the inside of the refrigerant flow space.

6. The active heat dissipation mechanism according to claim 5, characterized in that: At least one of one end and the other end of the second refrigerant flow path or the plurality of inclined guides is connected to the first refrigerant flow path, and the one end and the other end are connected in a straight line.

7. The active heat dissipation mechanism according to claim 1, characterized in that: The one side heat conducting plate and the other side heat conducting plate are formed by a single metal plate component. The refrigerant flow space is formed by bending the single metal plate member.

8. The active heat dissipation mechanism according to claim 1, characterized in that: The one side heat conducting plate and the other side heat conducting plate are formed by two separate metal plate parts. The refrigerant flow space is formed by joining the two metal plate members.

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