Detector card and detector system

Abstract

The utility model discloses a detector card and a detector system, the detector card comprises a chip carrier plate and a photosensitive chip group, the photosensitive chip group comprises a plurality of photosensitive chips which are arranged in multiple rows, each photosensitive chip comprises a lattice area and an edge dead area, the longitudinal sizes of the photosensitive chips belonging to the same row are the same, and the lower edges of the photosensitive chips are located on the same transverse straight line, for any two photosensitive chips which are adjacent in the longitudinal direction and are located in the two rows respectively, the left edge of the lattice area of one photosensitive chip and the right edge of the lattice area of the other photosensitive chip are arranged on the same longitudinal straight line in a staggered mode; the influence of edge dead zones and mounting gaps in the transverse direction between the photosensitive chips in the detector card is removed through chip arrangement, the detection dead zones are eliminated, the risks of defects and foreign matter missing detection are avoided, the quality of a detector detection image is improved, it is guaranteed that lattice zones are in seamless butt joint in the transverse direction when the photosensitive chips are mounted, and the production efficiency is improved. The requirement for chip mounting positioning precision is lowered, and the mounting efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the field of chip mounting and splicing inside a detector, and more specifically, to a detector card and a detector system. Background Art

[0002] Pixel is the smallest unit of digital image. The size of pixel can be used to intuitively represent the spatial resolution of image detector. Smaller pixel usually means higher spatial resolution, which enables the image to more clearly distinguish small objects or details. A detector system includes multiple detector cards, each of which includes multiple detector chips. In the existing detector chip manufacturing process, there will inevitably be edge dead zones around a single detector chip. The width of the edge dead zone is usually more than 50 microns. In the process of splicing multiple detector chips, there will inevitably be mounting gaps, and seamless splicing cannot be achieved. The width of the mounting gap depends on the mounting positioning accuracy of the chip. The width of the mounting gap is usually more than 50 microns. The dead zone width between two adjacent detector chips reaches 2*50+50=150 microns. Figure 1 As shown, for a large pixel image detector, that is, a low-resolution image detector, the dead zone width can be compensated by an image processing algorithm, but for a small pixel image detector, that is, a high-resolution image detector, as shown in Figure 1 The chip mounting method shown cannot be compensated by the image processing algorithm, and the influence of the dead zone width cannot be eliminated, which will cause the omission of small-sized objects or details, bringing great hidden dangers. Moreover, when mounting chips, in order to minimize the mounting gap between chips, the chip mounting positioning accuracy is required to be high, and the mounting process is complicated and inefficient. Utility Model Content

[0003] The present invention provides a detector card, comprising: a chip carrier and a photosensitive chip group, wherein the chip carrier is used to mount the photosensitive chip group, and the photosensitive chip group comprises a plurality of photosensitive chips; the photosensitive chip comprises a lattice region and an edge dead zone surrounding the periphery of the lattice region, and the peripheral edge of the edge dead zone constitutes the edge of the photosensitive chip;

[0004] The photosensitive chip components are arranged in multiple rows, and the photosensitive chips in the same row have the same longitudinal dimensions and their lower edges are all on a straight line in the horizontal direction;

[0005] For any two photosensitive chips adjacent to each other in two rows in the longitudinal direction, the left edge of the lattice region of one photosensitive chip and the right edge of the lattice region of the other photosensitive chip are alternately arranged on a straight line in the longitudinal direction.

[0006] Optionally, in any two adjacent rows of photosensitive chips, the upper row has M photosensitive chips and the lower row has N photosensitive chips, and the M photosensitive chips in the upper row and the N photosensitive chips in the lower row satisfy the following relationship: M=N, or M=N+1, or N=M+1.

[0007] Optionally, the chip carrier board has an irregular shape, and the irregular shape includes a T shape or a Z shape.

[0008] Optionally, the chip carrier is in the T-shape, and the photosensitive chips in the photosensitive chipset are arranged in two rows;

[0009] The number of photosensitive chips in the first row is one more than the number of photosensitive chips in the second row, or the number of photosensitive chips in the second row is one more than the number of photosensitive chips in the first row.

[0010] Optionally, the chip carrier is in the Z shape, and the photosensitive chips in the photosensitive chipset are arranged in two rows;

[0011] The number of photosensitive chips in the first row is equal to the number of photosensitive chips in the second row.

[0012] Optionally, the detector card further comprises a readout chip;

[0013] The readout chip is mounted on the chip carrier and is used to read out the image signal detected by the photosensitive chip in the detector card according to the control of an external control circuit board.

[0014] Optionally, the detector card is interconnected with a first carrier board on which a readout chip and a control chip are mounted, or the detector card is interconnected with a second carrier board on which a readout chip is mounted and a third carrier board on which a control chip is mounted, and the readout chip is used to read out the image signal detected by the photosensitive chip in the detector card according to the control of the control chip.

[0015] The present invention also provides a detector system, comprising a plurality of detector cards as described in the above embodiment; the plurality of detector cards are arranged on the same plane.

[0016] Assemble in sequence along the horizontal direction;

[0017] The positional relationship between any two adjacent detector cards in the transverse direction includes: the right edge of the rightmost lattice area in the left detector card and the left edge of the leftmost lattice area in the right detector card are alternately arranged on a straight line in the longitudinal direction.

[0018] Optionally, the chip carriers in the plurality of detector cards are all T-shaped, the photosensitive chips in the photosensitive chip group are arranged in two rows, the number of photosensitive chips in the first row is one more than the number of photosensitive chips in the second row, or the number of photosensitive chips in the second row is one more than the number of photosensitive chips in the first row;

[0019] The positional relationship between any two detector cards adjacent to each other in the transverse direction also includes: the placement angles thereof differ by 180° on the same plane.

[0020] Optionally, the chip carriers in the plurality of detector cards are all Z-shaped, and the photosensitive chips in the photosensitive chip group are arranged in two rows; the number of photosensitive chips in the first row is equal to the number of photosensitive chips in the second row;

[0021] The positional relationship between any two detector cards adjacent to each other in the transverse direction also includes: the placement angles are the same or differ by 180° on the same plane.

[0022] Compared with the related art, the detector card and detector system provided by the embodiments of the utility model eliminate the influence of the lateral edge dead zone and mounting gap between the photosensitive chips inside the detector card through the arrangement of the photosensitive chips, eliminate the detection dead zone, avoid the risk of missing defects and foreign objects, and improve the quality of the detector detection image; when mounting the photosensitive chips inside the detector card, it is only necessary to ensure that the lattice area is seamlessly connected in the lateral direction, which reduces the requirements for the chip mounting positioning accuracy and improves the mounting efficiency.

[0023] Other features and advantages of the utility model will be described in the following description, and partly become apparent from the description, or understood by implementing the utility model. The purpose and other advantages of the utility model can be realized and obtained through the structures particularly pointed out in the description and the drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] The accompanying drawings are used to provide a further understanding of the technical solution of the utility model and constitute a part of the specification. Together with the embodiments of the present application, they are used to explain the technical solution of the utility model and do not constitute a limitation on the technical solution of the utility model.

[0025] Figure 1 It is a schematic diagram of mounting multiple chips in a detector card in the prior art;

[0026] Figure 2a This is a first mounting schematic diagram of multiple photosensitive chips in a detector card according to an embodiment of the utility model;

[0027] Figure 2b This is a second mounting schematic diagram of multiple photosensitive chips in the detector card of an embodiment of the utility model;

[0028] Figure 3 This is a schematic diagram of the spacing dimensions between the photosensitive chips of the detector card according to an embodiment of the utility model;

[0029] Figure 4 This is a schematic diagram of a first T-shaped detector card according to an embodiment of the utility model;

[0030] Figure 5 This is a schematic diagram of a second T-shaped detector card according to an embodiment of the present utility model;

[0031] Figure 6 This is a schematic diagram of a first Z-shaped detector card according to an embodiment of the present utility model;

[0032] Figure 7 This is a schematic diagram of a second Z-shaped detector card according to an embodiment of the present utility model;

[0033] Figure 8a This is a schematic diagram of a first splicing combination of two T-shaped detector cards according to an embodiment of the utility model, where the placement angles of the two detector cards differ by 180°;

[0034] Figure 8b This is a schematic diagram of a second splicing combination of two T-shaped detector cards according to an embodiment of the utility model, where the placement angles of the two detector cards differ by 180°;

[0035] Figure 8c This is a schematic diagram of a third splicing combination of two T-shaped detector cards according to an embodiment of the utility model, where the placement angles of the two detector cards differ by 180°;

[0036] Figure 8d This is a schematic diagram of a fourth splicing combination of two T-shaped detector cards according to an embodiment of the utility model, where the placement angles of the two detector cards differ by 180°;

[0037] Figure 9a This is a schematic diagram of a first splicing combination of two Z-shaped detector cards according to an embodiment of the utility model, where the placement angles of the two detector cards differ by 180°;

[0038] Figure 9b This is a schematic diagram of a second splicing combination of two Z-shaped detector cards according to an embodiment of the utility model, where the placement angles of the two detector cards differ by 180°;

[0039] Fig.10a This is a schematic diagram of a third splicing combination of two Z-shaped detector cards according to an embodiment of the utility model, where the two detector cards are placed at the same angle;

[0040] Fig.10b This is a schematic diagram of a fourth splicing combination of two Z-shaped detector cards according to an embodiment of the utility model, where the two detector cards are placed at the same angle;

[0041] Among them, the oblique line area in all the drawings represents the chip carrier, the blank area represents the lattice area of ​​the photosensitive chip, the dense dot area represents the edge dead area of ​​the photosensitive chip, the horizontal line area represents the readout chip, and the dotted line represents the straight line that seamlessly connects the lattice area of ​​the photosensitive chip in the horizontal direction. DETAILED DESCRIPTION

[0042] In order to make the purpose, technical solution and advantages of the utility model more clear, the embodiments of the utility model will be described in detail with reference to the accompanying drawings. It should be noted that the embodiments and features in the embodiments of the present application can be combined with each other arbitrarily without conflict.

[0043] The present application embodiment provides a detector card, such as Figure 2a and Figure 2b As shown, it includes: a chip carrier and a photosensitive chip group, the chip carrier is used to mount the photosensitive chip group, the photosensitive chip group includes a plurality of photosensitive chips; the photosensitive chip includes a lattice area, and an edge dead area surrounding the periphery of the lattice area, and the outer edge of the edge dead area constitutes the edge of the photosensitive chip;

[0044] The photosensitive chip components are arranged in multiple rows, and the photosensitive chips in the same row have the same longitudinal dimensions and their lower edges are all on a straight line in the horizontal direction;

[0045] For any two photosensitive chips adjacent to each other in two rows in the longitudinal direction, the left edge of the lattice region of one photosensitive chip and the right edge of the lattice region of the other photosensitive chip are alternately arranged on a straight line in the longitudinal direction.

[0046] In this embodiment, the chip carrier can be selected from but not limited to a printed circuit board, a ceramic substrate or an aluminum substrate. Figure 2a or Figure 2b As shown, the horizontal direction is the same as the row direction of the photosensitive chips, and the vertical direction is perpendicular to the horizontal direction. When the detector card is used for detection, the relative movement direction between the detector card and the detected object is the same as the vertical direction.

[0047] In this embodiment, Figure 2a and Figure 2b The slashed area in the figure represents the chip carrier, which is used to mount the photosensitive chipset and other electronic components. Figure 2a and Figure 2b The blank area in represents the lattice area of ​​the photosensitive chip, which is the photosensitive area of ​​the detector card and is used to obtain image signals; Figure 2a and Figure 2b The densely packed area in the graph represents the edge dead zone of the photosensitive chip, which is a processing protection zone reserved around the edge of the chip. It belongs to the photosensitive dead zone, and the width of the edge dead zone is usually more than 50 microns.

[0048] In one implementation of this embodiment, Figure 2a As shown, in any two adjacent rows of photosensitive chips, the lower edge of the photosensitive chip in the upper row and the upper edge of the photosensitive chip in the lower row are respectively on two horizontal straight lines, that is, the photosensitive chips in the upper row and the photosensitive chips in the lower row may be spaced apart in the vertical direction.

[0049] In another implementation of this embodiment, if Figure 2b As shown, in any two adjacent rows of photosensitive chips, the lower edge of the photosensitive chip in the upper row and the upper edge of the photosensitive chip in the lower row are on the same horizontal straight line, that is, the photosensitive chips in the upper row and the photosensitive chips in the lower row are not spaced apart in the vertical direction. This implementation manner can be used as a preferred implementation manner of this embodiment, which can reduce the size of the detector card and avoid waste of the chip carrier.

[0050] In this embodiment, for the photosensitive chips in the same row, their sizes in the horizontal direction may be different, but they must be the same in the vertical direction. Therefore, when mounting the photosensitive chips, it can be ensured that the lower edges of the photosensitive chips in the same row are all on the same horizontal straight line, and the upper edges of the photosensitive chips in the same row are also on another horizontal straight line.

[0051] In this embodiment, Figure 2a and Figure 2b The dotted line in the figure represents the straight line that ensures seamless horizontal connection between two adjacent photosensitive chips located in two rows. The arrangement of the photosensitive chips removes the influence of the edge dead zone and mounting gap between the chips inside the detector card in the horizontal direction, and eliminates the horizontal detection dead zone; the edge dead zone and mounting gap between adjacent chips in the vertical direction can be compensated by the existing computer software algorithm, which will not bring any negative impact on the quality of the detection image.

[0052] The detector card provided by the embodiment of the utility model eliminates the influence of the edge dead zone and mounting gap between the chips inside the detector card in the horizontal direction through the arrangement of photosensitive chips, and is combined with the existing method of using computer software algorithm to compensate for the edge dead zone and mounting gap between adjacent chips in the vertical direction, thereby eliminating the detection dead zone of the detector card, avoiding the risk of missing defects and foreign objects, and improving the quality of the detector detection image; when mounting the chips inside the detector card, it is only necessary to ensure that the lattice area is seamlessly connected in the horizontal direction, thereby reducing the requirements for the chip mounting positioning accuracy and improving the mounting efficiency.

[0053] In an exemplary embodiment, in any two adjacent rows of photosensitive chips, the upper row has M photosensitive chips and the lower row has N photosensitive chips, and the M photosensitive chips in the upper row and the N photosensitive chips in the lower row satisfy the following relationship: M=N, or M=N+1, or N=M+1.

[0054] In one implementation of this embodiment, the detector card is mounted with two rows of photosensitive chips, such as Figure 3As shown, there are three photosensitive chips chip1, chip2 and chip3 in the first row, and two photosensitive chips chip4 and chip5 in the second row. The lattice area of ​​chip4 has a horizontal dimension of m, the width of the dead zone at the right edge of chip1 is a, and the width of the dead zone at the left edge of chip2 is b. Then, the horizontal interval between chip1 and chip2 is mab; the first dimension of chip1, chip2 and chip3 in the vertical direction is the same, and the second dimension of chip4 and chip5 in the vertical direction is the same, and the first dimension and the second dimension may be different.

[0055] In an exemplary embodiment, the chip carrier board has a special shape, and the special shape may include a T shape or a Z shape.

[0056] In this embodiment, there is a retracted dead zone at the edge of the chip carrier, which is also a photosensitive dead zone. When mounting the chip, in order to prevent the chip from being damaged by external force, the chip located at the edge is usually mounted on the chip carrier, resulting in a retracted dead zone at the edge of the chip carrier. The width of the retracted dead zone is usually more than 50 microns.

[0057] In this embodiment, the special-shaped arrangement is to facilitate the splicing and combination of multiple detector cards, and can eliminate the indentation dead zone, the edge dead zone and the splicing gap between the detector cards.

[0058] In this embodiment, the special shape is not limited to T-shape or Z-shape, and any other special shape that can realize the splicing combination of multiple detector cards and can eliminate the retracted dead zone, the edge dead zone and the splicing gap between the detector cards can be used.

[0059] In an exemplary embodiment, the chip carrier may be T-shaped, and the photosensitive chips in the photosensitive chips group may be arranged in two rows; the number of photosensitive chips in the first row may be one more than the number of photosensitive chips in the second row, or the number of photosensitive chips in the second row may be one more than the number of photosensitive chips in the first row.

[0060] In an exemplary embodiment, the chip carrier may be in the Z shape, and the photosensitive chips in the photosensitive chipset are arranged in two rows; the number of photosensitive chips in the first row is equal to the number of photosensitive chips in the second row.

[0061] In an exemplary embodiment, the readout chip may be mounted on the chip carrier board, and is used to read out the image signal detected by the photosensitive chip in the detector card according to the control of an external control circuit board.

[0062] In this embodiment, the external control circuit board is located outside the detector card, and the interconnection method between the detector card can be selected from but not limited to chip connectors, flip-chip welding or wire-binding semiconductor interconnection processes, and the read image signal is uploaded to a computer capable of performing image processing. The computer performing image processing stores computer software algorithms for compensating for edge dead zones and mounting gaps between adjacent chips in the longitudinal direction and other image processing algorithms related to the detector card.

[0063] In one implementation of this embodiment, a T-shaped chip carrier is selected, the first row may have two photosensitive chips, the second row may have one photosensitive chip, the readout chip may be located under the one photosensitive chip in the second row, and the sizes of the three photosensitive chips may be exactly the same, such as Figure 4 As shown, the horizontal line area represents the readout chip.

[0064] In another implementation of this embodiment, a T-shaped chip carrier is selected, the first row can have 2 photosensitive chips, the second row can have 1 photosensitive chip, the readout chip can be located between the 2 photosensitive chips in the first row, and the sizes of the 3 photosensitive chips can be exactly the same, such as Figure 5 As shown, the horizontal line area represents the readout chip.

[0065] In another implementation of this embodiment, a Z-shaped chip carrier is selected, the first row can have one photosensitive chip, the second row can have one photosensitive chip, the readout chip can be located under the photosensitive chip in the second row, and the sizes of the two photosensitive chips can be exactly the same, such as Figure 6 As shown, the horizontal line area represents the readout chip.

[0066] In another implementation of this embodiment, a Z-shaped chip carrier is selected, the first row can have 1 photosensitive chip, the second row can have 1 photosensitive chip, the readout chip can be located on the left side of the photosensitive chip in the second row, and the sizes of the two photosensitive chips can be exactly the same, such as Figure 7 As shown, the horizontal line area represents the readout chip.

[0067] In an exemplary embodiment, the detector card is interconnected with a first carrier board on which a readout chip and a control chip are mounted, or the detector card is interconnected with a second carrier board on which a readout chip is mounted and a third carrier board on which a control chip is mounted. The readout chip is used to read out the image signal detected by the photosensitive chip in the detector card according to the control of the control chip.

[0068] In this embodiment, based on the needs of cost saving and heat dissipation, the photosensitive chip group can be separately mounted on the chip carrier to form a detector card. When it is necessary to read the image signal detected by the photosensitive chip, the corresponding readout chip is selected to be interconnected with the detector card.

[0069] In one implementation of this embodiment, the first carrier is located outside the detector card, and the first carrier is mounted with a readout chip and a control chip at the same time. The interconnection method between the detector card and the first carrier can be selected from but not limited to chip connectors, flip-chip welding or wire-binding semiconductor interconnection processes. In another implementation of this embodiment, the second carrier and the third carrier are both located outside the detector card, and the interconnection method between the detector card, the first carrier and the second carrier can be selected from but not limited to chip connectors, flip-chip welding or wire-binding semiconductor interconnection processes. This application embodiment also provides a detector system, such as Figure 8a , Figure 8b , Figure 8c and Figure 8d As shown, it includes a plurality of detector cards as described in the above embodiments;

[0070] A plurality of the detector cards are assembled in sequence in the horizontal direction on the same plane;

[0071] The positional relationship between any two adjacent detector cards in the transverse direction includes: the right edge of the rightmost lattice area in the left detector card and the left edge of the leftmost lattice area in the right detector card are alternately arranged on a straight line in the longitudinal direction.

[0072] In this embodiment, Figure 8a , Figure 8b , Figure 8c and Figure 8d The third dotted line from left to right in the figure represents a straight line that ensures seamless connection between any two laterally adjacent detector cards when they are spliced ​​and combined. This splicing and combination method eliminates the influence of the laterally retracted dead zone, edge dead zone and splicing gap between the detector cards; and the retracted dead zone, edge dead zone and splicing gap between the longitudinally adjacent detector cards can be compensated by the existing computer software algorithm. The computer software algorithm in this embodiment is exactly the same as the computer software algorithm for eliminating the edge dead zone and mounting gap between the longitudinally adjacent chips inside the detector.

[0073] In this embodiment, the interconnection method between the plurality of detector cards may be selected from but not limited to chip connectors, flip-chip bonding or wire-binding semiconductor interconnection processes.

[0074] In one implementation of this embodiment, the plurality of detector cards may not contact each other, as long as the right edge of the rightmost lattice area in the detector card on the left and the left edge of the leftmost lattice area in the detector card on the right are staggered on a straight line in the longitudinal direction, such as Figure 8c and Figure 8d shown.

[0075] In another implementation of this embodiment, the plurality of detector cards may have edges that contact each other, such as Figure 8a and Figure 8b As shown, this embodiment can be used as a preferred embodiment of this example. Compared with the above-mentioned embodiments, this embodiment can reduce the size of the detector system and is easy to carry.

[0076] The detector system provided in this embodiment eliminates the influence of the horizontal photosensitive dead zone between the detector cards by splicing and combining the detector cards, and is combined with the existing method of eliminating the vertical photosensitive dead zone between the detector cards using computer software algorithms, so that the detector system has no dead zone, improves the image detection quality of the detector system, and improves the overall performance of the detector system.

[0077] In an exemplary embodiment, the chip carriers in the plurality of detector cards are all T-shaped, the photosensitive chips in the photosensitive chip group are arranged in two rows, the number of photosensitive chips in the first row is one more than the number of photosensitive chips in the second row, or the number of photosensitive chips in the second row is one more than the number of photosensitive chips in the first row;

[0078] The positional relationship between any two detector cards adjacent to each other in the transverse direction also includes: the placement angles thereof differ by 180° on the same plane.

[0079] In this embodiment, there may be two T-shaped detector cards with chip carriers, and the two T-shaped detector cards are placed at angles 180° apart. Figure 8a and Figure 8b As shown, Figure 8a Contains two Figure 4 The detector card shown, Figure 8b Contains two Figure 5 Detector card shown.

[0080] In an exemplary embodiment, the chip carriers in the plurality of detector cards are all Z-shaped, and the photosensitive chips in the photosensitive chip group are arranged in two rows; the number of photosensitive chips in the first row is equal to the number of photosensitive chips in the second row;

[0081] The positional relationship between any two detector cards adjacent to each other in the transverse direction also includes: the placement angles are the same or differ by 180° on the same plane.

[0082] In this embodiment, there may be two Z-shaped detector cards with chip carriers, and the two Z-shaped detector cards are placed at angles 180° apart. Figure 9a and Figure 9b As shown, Figure 9a Contains two Figure 6 The detector card shown, Figure 9b Contains two Figure 7 The detector card shown, Figure 9a and Figure 9b The second dotted line from left to right in the figure represents the straight line that ensures seamless lateral connection of the two detector cards when they are spliced ​​together.

[0083] In this embodiment, there may be two Z-shaped detector cards with chip carriers, and the two Z-shaped detector cards are placed at the same angle, such as Fig.10a and Fig.10b As shown, Fig.10a Contains two Figure 6 The detector card shown, Fig.10b Contains two Figure 7 The detector card shown, Fig.10a and Fig.10b The second dotted line from left to right in the figure represents the straight line that ensures seamless lateral connection of the two detector cards when they are spliced ​​together.

[0084] In this embodiment, if the edge dead zone width is 50 microns, the retracted dead zone width is 50 microns, and the splicing gap between the detector cards is 100 microns, then the splicing combination method in this embodiment can eliminate the lateral photosensitive dead zone of 50*2+50*2+100=300 microns.

[0085] In the description of the present invention, it should be noted that the terms "upper", "lower", "one side", "the other side", "one end", "the other end", "side", "relative", "four corners", "periphery", "'mouth'-shaped structure" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the structure referred to has a specific orientation, is constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0086] In the description of the embodiments of the present utility model, unless otherwise clearly specified and limited, the terms "connection", "direct connection", "indirect connection", "fixed connection", "installation", and "assembly" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; the terms "installation", "connection", and "fixed connection" can be a direct connection, or an indirect connection through an intermediate medium, or the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0087] Although the implementation methods disclosed in the utility model are as above, the above contents are only implementation methods adopted to facilitate the understanding of the utility model, and are not used to limit the utility model. Any technician in the field to which the utility model belongs can make any modifications and changes in the form and details of implementation without departing from the spirit and scope disclosed in the utility model, but the scope of patent protection of the utility model shall still be defined by the attached claims.

Claims

1. A detector card, comprising: A chip carrier and a photosensitive chipset, wherein the chip carrier is used to mount the photosensitive chipset, and the photosensitive chipset includes a plurality of photosensitive chips; the photosensitive chips include a lattice region and an edge dead zone surrounding the lattice region, and the outer edge of the edge dead zone constitutes the edge of the photosensitive chip; characterized in that: The photosensitive chip components are arranged in multiple rows, and the photosensitive chips in the same row have the same longitudinal dimensions and their lower edges are all on a straight line in the horizontal direction; For any two photosensitive chips adjacent to each other in two rows in the longitudinal direction, the left edge of the lattice region of one photosensitive chip and the right edge of the lattice region of the other photosensitive chip are alternately arranged on a straight line in the longitudinal direction.

2. The detector card according to claim 1, characterized in that: In any two adjacent rows of photosensitive chips, the upper row has M photosensitive chips and the lower row has N photosensitive chips, and the M photosensitive chips in the upper row and the N photosensitive chips in the lower row satisfy the following relationship: M=N, or M=N+1, or N=M+1.

3. The detector card according to claim 2, characterized in that: The chip carrier board has a special shape, which includes a T shape or a Z shape.

4. The detector card according to claim 3, characterized in that: The chip carrier is in the T-shape, and the photosensitive chips in the photosensitive chipset are arranged in two rows; The number of photosensitive chips in the first row is one more than the number of photosensitive chips in the second row, or the number of photosensitive chips in the second row is one more than the number of photosensitive chips in the first row.

5. The detector card according to claim 3, characterized in that: The chip carrier is in the Z shape, and the photosensitive chips in the photosensitive chipset are arranged in two rows; The number of photosensitive chips in the first row is equal to the number of photosensitive chips in the second row.

6. The detector card according to claim 4 or 5, characterized in that: Also included is a readout chip; The readout chip is mounted on the chip carrier and is used to read out the image signal detected by the photosensitive chip in the detector card according to the control of an external control circuit board.

7. The detector card according to claim 4 or 5, characterized in that: The detector card is interconnected with a first carrier board on which a readout chip and a control chip are mounted, or the detector card is interconnected with a second carrier board on which a readout chip is mounted and a third carrier board on which a control chip is mounted. The readout chip is used to read out the image signal detected by the photosensitive chip in the detector card according to the control of the control chip.

8. A detector system, characterized in that: comprising a plurality of detector cards as claimed in any one of claims 1 to 7; A plurality of the detector cards are assembled in sequence in the horizontal direction on the same plane; The positional relationship between any two adjacent detector cards in the transverse direction includes: the right edge of the rightmost lattice area in the left detector card and the left edge of the leftmost lattice area in the right detector card are alternately arranged on a straight line in the longitudinal direction.

9. The detector system according to claim 8, characterized in that: The chip carriers in the plurality of detector cards are all T-shaped, the photosensitive chips in the photosensitive chip group are arranged in two rows, the number of photosensitive chips in the first row is one more than the number of photosensitive chips in the second row, or the number of photosensitive chips in the second row is one more than the number of photosensitive chips in the first row; The positional relationship between any two detector cards adjacent to each other in the transverse direction also includes: the placement angles thereof differ by 180° on the same plane.

10. The detector system according to claim 8, characterized in that: The chip carriers in the plurality of detector cards are all Z-shaped, and the photosensitive chips in the photosensitive chip group are arranged in two rows; the number of photosensitive chips in the first row is equal to the number of photosensitive chips in the second row; The positional relationship between any two detector cards adjacent to each other in the transverse direction also includes: the placement angles on the same plane are the same or differ by 180°.

Images