Backlight module and liquid crystal display device

Abstract

The utility model provides a backlight module and a liquid crystal display device, and belongs to the technical field of display. The backlight module comprises a back plate, the back plate comprises a bottom plate and a side plate connected to the edge of the bottom plate, and the side plate and the bottom plate form a containing space; the light guide plate is arranged on the bottom plate and is positioned in the accommodating space; the light bar is located in the containing space and located on the side, close to the side plate, of the light guide plate. The heat insulation assembly is arranged on the side, away from the bottom plate, of the light bar, and the orthographic projection of the heat insulation assembly on the bottom plate completely covers the orthographic projection of the light bar on the bottom plate.

Description

Technical Field

[0001] The present disclosure belongs to the field of display technology, and in particular relates to a backlight module and a liquid crystal display device. Background Art

[0002] With the rapid development of display technology, high-brightness, high-color gamut liquid crystal display products (Liquid Crystal Display, LCD) are continuously promoted. For example, the product brightness is increased by 75% (from 400nit to 700nit) to enable users to use it normally when they are outdoors under strong light; the product color gamut is improved, thereby improving the screen color quality.

[0003] On the one hand, the solution to improve the brightness of LCD products can be to increase the number of light-emitting diodes (LEDs) in the backlight source (i.e., the light bar in the backlight module), and / or increase the current of a single LED. Since there will be energy loss in the process of LED light emission, about 40% of the energy is converted into heat energy, so the increase in the number of LEDs and current will cause the temperature at the location of the light bar to increase. On the other hand, the solution to improve the color gamut can be to adjust the phosphor silicate in the LED to red and green phosphor (Red Green Phosphor, referred to as RG powder). Since the thermal efficiency of RG powder is greater, more energy is converted into heat energy. In summary, high-brightness, high-color gamut LCD products are often accompanied by an increase in their use temperature. For example, the front temperature of ordinary LCD products is 40°C, and the front temperature of high-brightness, high-color gamut LCD products is 50°C. In summary, high-brightness, high-color gamut LCD products are often accompanied by an increase in their use temperature. The increase in product temperature not only affects the display effect, but also makes consumers feel hot when touching, affecting the consumer's use experience. Utility Model Content

[0004] The present disclosure aims to solve at least one of the technical problems existing in the prior art and provides a backlight module and a liquid crystal display device.

[0005] In a first aspect, the technical solution adopted to solve the technical problem of the present disclosure is a backlight module, comprising a back plate, wherein the back plate comprises a bottom plate and a side plate connected to the edge of the bottom plate, wherein the side plate and the bottom plate form a containing space;

[0006] A light guide plate, disposed on the bottom plate and located in the accommodating space;

[0007] A light bar, located in the accommodating space and on a side of the light guide plate close to the side plate;

[0008] The heat insulation component is arranged on a side of the light bar away from the bottom plate, and its orthographic projection on the bottom plate completely covers the orthographic projection of the light bar on the bottom plate.

[0009] In some embodiments, the backlight module further includes a first circuit board for providing a light emitting signal to the light emitting elements in the light bar; the first circuit board is disposed on a side of the heat insulation assembly close to the light bar.

[0010] In some embodiments, a surface of the heat insulation component close to the light bar is in direct contact with a surface of the first circuit board facing away from the light bar.

[0011] In some embodiments, the first circuit board includes a main body and a connecting portion; the orthographic projection of the thermal insulation assembly on the base plate covers the orthographic projection of the main body on the base plate.

[0012] In some embodiments, the material of the thermal insulation component is one of nano-tungsten oxide, ceramic, aerogel, and a composite material of nano-tungsten oxide and ceramic.

[0013] In some embodiments, the backlight module further includes a light shielding layer; the light shielding layer is disposed on a side of the thermal insulation component close to the first circuit board.

[0014] In some embodiments, the thermal insulation assembly includes a substrate layer and a thermal insulation sublayer which are stacked; the thermal insulation sublayer is arranged on a side of the substrate layer which is away from the light-shielding layer.

[0015] In some embodiments, the material of the thermal insulation sublayer is one of nano-tungsten oxide, ceramics, aerogel, and a composite material of nano-tungsten oxide and ceramics.

[0016] In some embodiments, the insulation assembly includes a first insulation layer and a second insulation layer;

[0017] The surface of the first heat insulation layer close to the light bar is in direct contact with the surface of the first circuit board facing away from the light bar;

[0018] The second heat insulation layer is arranged on a side of the first heat insulation layer facing away from the first circuit board.

[0019] In some embodiments, the backlight module further includes a light shielding layer disposed between the first heat insulation layer and the second heat insulation layer.

[0020] In some embodiments, the second heat-insulating layer includes a substrate layer and a heat-insulating sublayer which are stacked; the heat-insulating sublayer is arranged on a side of the substrate layer away from the light-shielding layer.

[0021] In some embodiments, the material of the first thermal insulation layer and the material of the thermal insulation sub-layer are one of nano-tungsten oxide, ceramic, aerogel, and a composite material of nano-tungsten oxide and ceramic.

[0022] In a second aspect, an embodiment of the present disclosure further provides a liquid crystal display device, comprising a backlight module as described in any one of the first aspects. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 is a partial structural schematic diagram of a related edge-type liquid crystal display device;

[0024] Figure 2 Heat dissipation diagram for the relevant light bar and driver chip;

[0025] Figure 3a is a schematic diagram of thermal efficiency of a related LED using phosphor silicate;

[0026] Figure 3b It is a schematic diagram of thermal efficiency of LED using RG powder;

[0027] Figure 4a is a schematic diagram of test points of a related liquid crystal display device;

[0028] Figure 4b In accordance with Figure 4a Schematic diagram of the change data of brightness and chromaticity of a liquid crystal display device in point test;

[0029] Figure 5 A schematic diagram of a backlight module provided in an embodiment of the present disclosure;

[0030] Figure 6 A plan view of a heat insulation assembly and a first circuit board provided in an embodiment of the present disclosure;

[0031] Figure 7 A stacking diagram of a heat insulation assembly and a first circuit board provided in an embodiment of the present disclosure;

[0032] Figure 8 A schematic diagram of another backlight module provided by an embodiment of the present disclosure;

[0033] Fig. 9 for Figure 8 Plan view of the insulation assembly and the sunshade;

[0034] Fig.10 A schematic diagram of another backlight module provided by an embodiment of the present disclosure;

[0035] Fig.11 A schematic diagram of another backlight module provided by an embodiment of the present disclosure;

[0036] Figure 12a to Figure 12bA preparation flow chart for forming a first thermal insulation layer provided in an embodiment of the present disclosure;

[0037] Figure 13a to Figure 13d A preparation flow chart for forming a second thermal insulation layer provided in an embodiment of the present disclosure;

[0038] Fig.14 A partial structural schematic diagram of a liquid crystal display device provided in an embodiment of the present disclosure. DETAILED DESCRIPTION

[0039] In order to make the purpose, technical scheme and advantages of the embodiments of the present disclosure clearer, the technical scheme in the embodiments of the present disclosure will be clearly and completely described below in conjunction with the drawings in the embodiments of the present disclosure. Obviously, the described embodiments are only part of the embodiments of the present disclosure, rather than all of the embodiments. The components of the embodiments of the present disclosure generally described and shown in the drawings here can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present disclosure provided in the drawings is not intended to limit the scope of the present disclosure for protection, but merely represents the selected embodiments of the present disclosure. Based on the embodiments of the present disclosure, all other embodiments obtained by those skilled in the art without making creative work belong to the scope of protection of the present disclosure.

[0040] Unless otherwise defined, the technical terms or scientific terms used in the present disclosure should be understood by people with ordinary skills in the field to which the present disclosure belongs. The "first", "second" and similar words used in the present disclosure do not indicate any order, quantity or importance, but are only used to distinguish different components. Similarly, similar words such as "one", "one" or "the" do not indicate quantity restrictions, but indicate that there is at least one. Similar words such as "include" or "comprise" mean that the elements or objects appearing before the word cover the elements or objects listed after the word and their equivalents, without excluding other elements or objects. Similar words such as "connect" or "connected" are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0041] The "multiple or several" mentioned in this disclosure refers to two or more. "And / or" describes the association relationship of the associated objects, indicating that three relationships may exist. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. The character " / " generally indicates that the associated objects before and after are in an "or" relationship.

[0042] In the related art, Figure 1is a partial structural schematic diagram of a related edge-type liquid crystal display device, such as Figure 1 As shown, it includes a backlight module 01 and a liquid crystal display module 02. The backlight module 01 at least includes a back plate 011, a side-entry light bar 012, a light guide plate 013, a glue frame 014, a glue layer 015, an LED circuit board 016, an optical component 017, and a light-shielding glue 018. The liquid crystal display module 02 includes a liquid crystal display substrate 021, a color film substrate 022 and a driver chip 023. Figure 2 The heat dissipation diagram of the relevant light bar and driver chip is as follows: Figure 2 As shown, during normal use of the liquid crystal display device, the light bar 012 and the driver chip 023 are two main heat sources, wherein the heat of the light bar 012 is directly or indirectly transferred to the outer shell of the liquid crystal display device and the liquid crystal display substrate 021 by radiation and air conduction; the heat of the driver chip 023 is also transferred to the cover plate (not shown in the figure) by radiation and air conduction. Due to the difference in power consumption of the light bar 012 and the driver chip 023, the heat generation capacity of the two is different. For example, the power consumption of the driver chip in a conventional mobile phone is about 100mW, and the power consumption of the LED light of a conventional mobile phone is about 1000mW. It can be seen that the heat generated by the LED light is greater than that of the driver chip 023. Therefore, the LED light dominates the module temperature rise. The heat generation mechanism of the LED light and the driver chip 023 is as follows.

[0043] The heating mechanism of LED lamp is: mainly through the blue light chip to stimulate the yellow light phosphor to emit white light, the electrical energy is converted into light energy and there will be a certain absorption loss, the phosphor absorption loss is released in the form of heat energy; it is reflected in the objective data as LED thermal efficiency; the thermal efficiency data of different phosphors are different; taking the conventional current 20ma / LED as an example, the thermal efficiency of silicate is 44.26%, such as Figure 3a As shown; RG powder thermal efficiency is 48.67%, such as Figure 3b As shown; the thermal efficiency of high color gamut modules will be higher; the risk of heat generation will be greater; in addition, the number and current of LEDs in high-brightness LCD devices increase, and the thermal efficiency of LEDs increases.

[0044] The heating mechanism of the driver chip 023 is as follows: the driver chip consumes electrical energy when working, and part of the electrical energy will be converted into heat energy by the driver chip, thereby causing the driver chip to heat up.

[0045] The heating of the driver chip and the LED light bar causes the temperature of the LCD display module facing the light bar to rise too much. However, excessive temperature rise often brings the following problems: 1. According to the LCD liquid crystal characteristic table, the higher the temperature, the smaller the optical path difference Δn of the liquid crystal panel; according to the formula T = 1 / 2×sin 2 φsin 2(π×Δn×d / λ) shows that Δn×d is positively correlated with T, that is, the smaller Δn is, the smaller the transmittance T is. Among them, Δn is the optical path difference of the liquid crystal panel; φ represents the azimuth between the absorption axis of the polarizer of the liquid crystal panel and the long axis of the liquid crystal molecule; d is the thickness of the liquid crystal box; λ is the emission wavelength. The excessive temperature at the position of the light bar causes the brightness and chromaticity of the liquid crystal display module facing the light bar to decrease (brightness decreases by 100nit, chromaticity y decreases by 0.015), such as Figure 4a and Figure 4b As shown in the figure, the subjective visual effect is that the area where the light bar is located is darker and bluer than other locations, resulting in an uneven display effect, giving consumers a poor visual experience. 2. The area where the light bar is located is hot, and consumers feel hot when touching it, which reduces the consumer experience.

[0046] In view of this, an embodiment of the present disclosure provides a backlight module applied to a liquid crystal display device; the backlight module substantially reduces the front temperature of the liquid crystal display device corresponding to the area where the light bar is located, thereby improving the user experience.

[0047] Figure 5 A schematic diagram of a backlight module provided in an embodiment of the present disclosure is shown in FIG. Figure 5 As shown, the backlight module 1 includes a back plate 11, a light guide plate 12, a light bar 13 and a heat insulation assembly 14. The back plate 11 includes a bottom plate 111 and a side plate 112 connected to the edge of the bottom plate 111. The side plate 112 and the bottom plate 111 form a containing space for accommodating a part of the film structure of the backlight module 1.

[0048] The light guide plate 12 is disposed on the bottom plate 111 and is located in the accommodation space. The light bar 13 is located in the accommodation space and is located on the side of the light guide plate 12 close to the side plate 112. The light bar 13 provided in the present disclosure is a side-entry light bar 13, on which a plurality of light emitting elements (LEDs) are disposed, and the light emitted by the light emitting elements (LEDs) is irradiated onto the light guide plate 12, and the light guide plate 12 is used to convert the point light source of the LED into a surface light source to provide to the liquid crystal display module.

[0049] The heat insulation component 14 is disposed on a side of the light bar 13 facing away from the bottom plate 111 , and its orthographic projection on the bottom plate 111 completely covers the orthographic projection of the light bar 13 on the bottom plate 111 .

[0050] It should be noted that when the backlight module 1 is applied to a liquid crystal display device, the backlight module 1 is located on the backlight surface of the liquid crystal display module in the liquid crystal display device, and the heat insulation component 14 is located between the liquid crystal display module and the light bar 13. The heat insulation component 14 is mainly used to block the heat on the light bar 13 from being conducted to the front in the first direction Z, that is, to block the heat on the light bar 13 from being conducted to the liquid crystal display module in the first direction Z, thereby reducing the temperature of the front (screen light emitting surface) of the liquid crystal display device corresponding to the area where the light bar 13 is located, thereby eliminating the effect of dim brightness and bluish color in the area where the light bar 13 is located, improving the display effect, and improving the user experience.

[0051] In some embodiments, Figure 5 As shown, the backlight module 1 further includes a first circuit board 15 for providing a light emitting signal to the light emitting element (LED) in the light bar 13 ; the first circuit board 15 is arranged on a side of the heat insulation component 14 close to the light bar 13 .

[0052] Exemplarily, the first circuit board 15 is, for example, a flexible printed circuit (FPC).

[0053] For example, Figure 5 As shown, the backlight module 1 further includes a plastic frame 16 and an adhesive layer 17 located in the accommodating space; the plastic frame 16 is arranged on the side of the light bar 13 close to the side plate 112, and the plastic frame 16 and the side plate 112 are against each other; the adhesive layer 17 includes a first adhesive portion 171 and a second adhesive portion 172, the first adhesive portion 171 is arranged on the side of the plastic frame 16 away from the bottom plate 111, and the second adhesive portion 172 is arranged on the side of the light guide plate 12 away from the bottom plate 111, and the first circuit board 15 is fixed to the plastic frame 16 and the surface of the light guide plate 12 away from the bottom plate 111 through the first adhesive portion 171 and the second adhesive portion 172. The light emitting element (LED) on the light bar 13 is electrically connected to the first circuit board 15 through the opening between the first adhesive portion 171 and the second adhesive portion 172.

[0054] The first circuit board 15 is arranged on one side of the heat insulation component 14 close to the light bar 13. In one case, Figure 5 As shown, there is no other film structure between the heat insulation component 14 and the first circuit board 15 , that is, the surface of the heat insulation component 14 close to the light bar 13 is in direct contact with the surface of the first circuit board 15 away from the light bar 13 .

[0055] The first circuit board 15 is disposed on one side of the heat insulation component 14 close to the light bar 13. In another case, see the following Figure 8 As shown, there is another film structure between the heat insulation component 14 and the first circuit board 15 , the heat insulation component 14 is located on the side of the first circuit board 15 away from the light bar 13 , and the heat insulation component 14 is not in direct contact with the first circuit board 15 .

[0056] In some embodiments, Figure 6 A plan view of a heat insulation assembly and a first circuit board provided in an embodiment of the present disclosure, such as Figure 6 As shown, when the surface of the thermal insulation component 14 close to the light bar 13 is in direct contact with the surface of the first circuit board 15 away from the light bar 13, the first circuit board 15 includes a main body 151 and a connecting part 152; the orthographic projection of the thermal insulation component 14 on the base plate 111 covers the orthographic projection of the main body 151 on the base plate 111.

[0057] The main body 151 is the area where the first circuit board 15 contains all the electronic components, and the connecting part 152 is a plug protruding from the main body 151 and connected to the second circuit board in the liquid crystal display module. The second circuit board in the liquid crystal display module is the FPC of the liquid crystal display substrate.

[0058] The orthographic projection of the main body on the bottom plate 111 covers the orthographic projection of the light bar 13 on the bottom plate 111. The orthographic projection of the connecting portion on the bottom plate 111 does not overlap with the orthographic projection of the light bar 13 on the bottom plate 111.

[0059] In some embodiments, Figure 5 As shown, the material of the thermal insulation component 14 is one of nano-tungsten oxide, ceramic, aerogel, and a composite material of nano-tungsten oxide and ceramic.

[0060] Optionally, the material of the heat insulation component 14 is a composite material of nano-tungsten oxide and ceramics. Among them, since the chemical properties of nano-tungsten oxide are stable and the physical changes caused by external environment such as heat and temperature are small, it is a semiconductor material that can maintain permanent. It can effectively block infrared radiation and ultraviolet radiation, and the effect of blocking infrared radiation is 95%, and the effect of blocking ultraviolet radiation is 99%. In addition, the composite material of nano-tungsten oxide and ceramics also has good spreading and leveling properties. It is formed by coating on the surface of the first circuit board 15 away from the light bar 13 using a coating process. The composite material of nano-tungsten oxide and ceramics has good compatibility with the first circuit board 15, strong adhesion, and is durable and does not fall off.

[0061] Figure 7 A stacking diagram of a heat insulation assembly and a first circuit board provided in an embodiment of the present disclosure, such as Figure 7As shown, the first circuit board 15 includes a base film 1501, a first copper layer 1502a and a second copper layer 1502b arranged on opposite sides of the base film 1501 along a first direction Z, a first adhesive layer 1503a arranged on a side of the first copper layer 1502a away from the base film 1501, a second adhesive layer 1503b arranged on a side of the second copper layer 1502b away from the base film 1501, a first covering film 1504a arranged on a side of the first adhesive layer 1503a away from the first copper layer 1502a, a second covering film 1504b arranged on a side of the second adhesive layer 1503b away from the second copper layer 1502b, and a thermal insulation component 14 arranged on a side of the first covering film 1504a away from the first adhesive layer 1503a. Here, the material of the thermal insulation component 14 is a composite material of nano-tungsten oxide and ceramics. The thermal insulation component 14 can completely cover the main body 151 of the first circuit board 15, and can also completely cover the surface of the light bar 13 away from the bottom plate 111, and can completely block the heat on the light bar 13 from being conducted to the front in the first direction Z, thereby reducing the front (screen light-emitting surface) temperature of the liquid crystal display device corresponding to the area where the light bar 13 is located, thereby improving the display effect and the user experience.

[0062] It should be noted that the thickness of the heat insulation component 14 formed by the composite material of nano-tungsten oxide and ceramic can be adjusted based on the actual business insulation requirements. The greater the thickness, the better the insulation effect. In the present disclosure, the thickness of the heat insulation component 14 formed by the composite material of nano-tungsten oxide and ceramic is between 20um and 50um.

[0063] Exemplarily, the thickness of the base film 1501 is 20um; the thickness of the first copper layer 1502a and the second copper layer 1502b are both 20um; the thickness of the first adhesive layer 1503a and the second adhesive layer 1503b are both 15um; the thickness of the first covering film 1504a and the second covering film 1501b are both 10um; the thickness of the thermal insulation component 14 is 20um, which not only ensures the thermal insulation effect, but also prevents structural interference when the backlight module 1 and the liquid crystal display module are bonded.

[0064] Optionally, the material of the heat insulation component 14 is nano tungsten oxide, and its effect is referred to the heat insulation effect of the above-mentioned nano tungsten oxide, and the repeated parts are not repeated.

[0065] In some embodiments, Figure 5 As shown, the backlight module 1 further includes a light shielding layer 18, which is disposed on the side of the heat insulation component 14 away from the first circuit board 15. Specifically, a portion of the surface of the light shielding layer 18 close to the first circuit board 15 is in direct contact with a surface of the heat insulation component 14 away from the first circuit board 15. The light shielding layer 18 is a circular structure, and a portion of the surface of the light shielding layer 18 close to the bottom plate 111 is also in direct contact with a surface of the plastic frame 16 away from the bottom plate 111.

[0066] Exemplarily, the light shielding layer 18 is, for example, a circular light shielding adhesive material, which is mainly used to prevent light leakage from the edge, and the middle opening of the light shielding layer 18 is used for light transmission, so that the light emitted by the light bar 13 is provided to the liquid crystal display module through the light guide plate 12. At the same time, the circular light shielding adhesive material is also used for subsequent bonding of the backlight module 1 and the liquid crystal display module.

[0067] In some embodiments, Figure 8 A schematic diagram of another backlight module provided in an embodiment of the present disclosure, such as Figure 8 As shown, the backlight module 1 includes not only a back plate 11 , a light guide plate 12 , a light bar 13 , a first circuit board 15 and a heat insulation component 14 , but also a light shielding layer 18 ; the light shielding layer 18 is arranged on one side of the heat insulation component 14 close to the first circuit board 15 .

[0068] like Figure 8 As shown, Figure 5 The difference is that in this embodiment, the heat insulation component 14 is arranged on the side of the light shielding layer 18 away from the first circuit board 15. Specifically, the surface of the heat insulation component 14 close to the first circuit board 15 is in direct contact with the surface of the light shielding layer 18 away from the first circuit board 15.

[0069] In some embodiments, Figure 8 As shown, the heat insulation assembly 14 includes a laminated substrate layer 1421 and a heat insulation sublayer 1422; the heat insulation sublayer 1422 is arranged on the side of the substrate layer 1421 away from the light shielding layer 18. Specifically, the surface of the substrate layer 1421 close to the heat insulation sublayer 1422 is in direct contact with the surface of the heat insulation sublayer 1422 close to the substrate layer 1421.

[0070] The orthographic projection of the heat insulation sublayer 1422 on the bottom plate 111 completely covers the orthographic projection of the light bar 13 on the bottom plate 111. The orthographic projection of the substrate layer 1421 on the bottom plate 111 completely covers the orthographic projection of the light bar 13 on the bottom plate 111.

[0071] Exemplarily, the dimensions of the thermal insulation sublayer 1422 and the substrate layer 1421 are exactly the same.

[0072] In some embodiments, Figure 8As shown, the material of the heat insulation sublayer 1422 is one of nano-tungsten oxide, ceramics, aerogel, and a composite material of nano-tungsten oxide and ceramics. The material of the substrate layer 1421 can be selected from a flexible and foldable cover material, such as polyethylene terephthalate (PET), a flexible plastic colorless polyimide (CPI), thermoplastic urethane (TUP), or ultra-thin glass (UTG).

[0073] Optionally, the material of the thermal insulation sublayer 1422 is a high temperature resistant and structurally stable ceramic material, which can effectively isolate infrared radiation and ultraviolet radiation, with a blocking rate of about 30% to 95% for infrared rays and about 90% to 100% for ultraviolet rays. The thermal insulation effect is significant and long-lasting, and it is not easy to oxidize.

[0074] Optionally, the material of the substrate layer 1421 is PET material.

[0075] For example, nanotechnology can be used to evenly sputter high-temperature resistant and extremely stable ceramic materials onto a high-tension PET substrate to form the thermal insulation assembly 14 .

[0076] Optionally, the material of the thermal insulation sublayer 1422 is aerogel. Aerogel is a nanoporous solid material, the main component of which is ultrafine particles, and has the characteristics of large surface area, high porosity, and small particle size. Aerogel is a solid with good thermal insulation performance and light weight. The pore size of aerogel is between 20nm and 50nm, which is smaller than the free path of air (70nm). The air molecules in the pores lose the ability to flow freely, thereby achieving ultra-high thermal insulation performance.

[0077] Exemplarily, the thermal conductivity of the aerogel is between 0.018 W / mK and 0.025 W / mK.

[0078] For example, the aerogel uses a PET substrate as a carrier, and the raw materials of the aerogel are subjected to a special process to make the aerogel thin film on the PET substrate to form a heat insulation component 14. The light and thin heat insulation component 14 can solve the problem of heat uniformity in a small space of the liquid crystal display device, provide heat insulation protection for the weak heat-resistant structure (i.e., the liquid crystal display module), and block the heat conduction of the light bar 13 in the first direction Z, thereby improving the performance and service life of the liquid crystal display device.

[0079] In some embodiments, Fig. 9 for Figure 8 Plan view of the insulation assembly and shading layer, such as Fig. 9As shown, the shading layer 18 is a circular structure for preventing light leakage from the edge, and the middle opening of the shading layer 18 is for light transmission. The area where the heat insulation component 14 is located can ensure that it can cover the light bar 13. If the heat insulation component 14 still has space to extend when the backlight module 1 and the liquid crystal display module are in the state of being matched, the heat insulation component 14 can also continue to extend along the current position in the second direction X. The second direction X is the direction from the light bar 13 to the light guide plate 12, or the length direction of the backlight module 1.

[0080] It should be noted that if Figure 8 The thickness of the heat insulation component 14 shown can be adjusted based on the actual business insulation requirements. The greater the thickness, the better the insulation effect. In this embodiment, the thickness of the heat insulation component 14 is between 1.5 mil and 4 mil, which not only ensures the insulation effect, but also prevents structural interference when the backlight module 1 is attached to the liquid crystal display module.

[0081] Optionally, the thickness of the thermal insulation assembly 14 is 1.5 mil. Optionally, the thickness of the thermal insulation assembly 14 is 2 mil. Optionally, the thickness of the thermal insulation assembly 14 is 2.5 mil. Optionally, the thickness of the thermal insulation assembly 14 is 3 mil. Optionally, the thickness of the thermal insulation assembly 14 is 3.5 mil. Optionally, the thickness of the thermal insulation assembly 14 is 4 mil.

[0082] In some embodiments, Fig.10 A schematic diagram of another backlight module provided in an embodiment of the present disclosure, such as Fig.10 As shown, Figure 5 The difference between the structure shown is that a second heat insulation layer 142 is added; Figure 8 The difference between the shown structure is that a first heat insulation layer 141 is added.

[0083] like Fig.10 As shown, the thermal insulation assembly 14 includes a first thermal insulation layer 141 and a second thermal insulation layer 142; the surface of the first thermal insulation layer 141 close to the light bar 13 is in direct contact with the surface of the first circuit board 15 away from the light bar 13; the second thermal insulation layer 142 is arranged on the side of the first thermal insulation layer 141 away from the first circuit board 15.

[0084] Here, the specific structure and position relationship of the first thermal insulation layer 141 can be seen in Figure 5 The specific structure and positional relationship of the heat insulation assembly 14 shown are the same, and the repeated parts will not be repeated.

[0085] The second heat insulation layer 142 is disposed on a side of the first heat insulation layer 141 away from the first circuit board 15. In one case, Fig.10As shown, there is another film structure between the second thermal insulation layer 142 and the first thermal insulation layer 141. The surface of the second thermal insulation layer 142 close to the first thermal insulation layer 141 is not in contact with the surface of the first thermal insulation layer 141 close to the second thermal insulation layer 142. Fig.10 As shown, the backlight module 1 further includes a light shielding layer 18 disposed between the first heat insulation layer 141 and the second heat insulation layer 142. The surface of the first heat insulation layer 141 close to the light shielding layer 18 is in direct contact with the surface of the light shielding layer 18 close to the first heat insulation layer 141. The surface of the second heat insulation layer 142 close to the light shielding layer 18 is in direct contact with the surface of the light shielding layer 18 close to the second heat insulation layer 142.

[0086] like Fig.10 As shown, the second heat-insulating layer 142 includes a laminated substrate layer 1421 and a heat-insulating sub-layer 1422 ; the heat-insulating sub-layer 1422 is arranged on a side of the substrate layer 1421 away from the light-shielding layer 18 .

[0087] The material of the first thermal insulation layer 141 is one of nano tungsten oxide, ceramic, aerogel, and a composite material of nano tungsten oxide and ceramic. The material of the thermal insulation sublayer 1422 is one of nano tungsten oxide, ceramic, aerogel, and a composite material of nano tungsten oxide and ceramic. The material of the substrate layer 1421 can be one of PET material, CPI material, TUP material, or UTG material.

[0088] In some embodiments, Figure 5 , Figure 8 or Fig.10 As shown, the backlight module 1 further includes a heat dissipation layer 19 ; the heat dissipation layer 19 is arranged on a side of the bottom plate 111 away from the light guide plate 12 , and is mainly used for heat dissipation of the backlight module 1 .

[0089] In some embodiments, Figure 5 , Figure 8 or Fig.10 As shown, the backlight module 1 further includes a reflective sheet 110 , which is disposed on a side of the light guide plate 12 close to the bottom plate 111 and is mainly used to reflect the light transmitted from the light guide plate 12 to improve the brightness of the backlight module 1 .

[0090] In some embodiments, Figure 5 , Figure 8 or Fig.10As shown, the backlight module 1 also includes an optical component 120, which includes a diffuser 1201 arranged on the side of the light guide plate 12 away from the bottom plate 111, a first light-enhancing sheet 1202 arranged on the side of the diffuser 1201 away from the light guide plate 12, and a second light-enhancing sheet 1203 arranged on the side of the first light-enhancing sheet 1202 away from the diffuser 1201. The diffuser 1201 is used to disperse the light transmitted from the light guide plate 12 to display more uniformly. The first light-enhancing sheet 1202 and the second light-enhancing sheet 1203 are used to converge the light and improve the backlight brightness. The light-shielding layer 18 is located on the side of the optical component 120 away from the light guide plate 12. A portion of the surface of the light-shielding layer 18 close to the second light-enhancing sheet 1203 is in direct contact with a surface of the second light-enhancing sheet 1203 close to the light-shielding layer 18, and another portion of the surface of the light-shielding layer 18 close to the second light-enhancing sheet 1203 is in direct contact with a surface of the rubber frame 16 away from the bottom plate 111. There is a certain gap between the orthographic projection of the optical component 120 on the bottom plate 111 and the orthographic projection of the thermal insulation component 14 on the bottom plate 111 .

[0091] Measured using infrared thermal imaging camera Fig.10 The liquid crystal display device under the structure shown can effectively reduce the front temperature of the liquid crystal display device corresponding to the area where the light bar 13 is located from 51°C to 46°C, and the temperature is reduced to below 47°C, which can significantly improve consumers' visual effects and touch experience.

[0092] The second heat insulation layer 142 is disposed on the side of the first heat insulation layer 141 away from the first circuit board 15. In another case, there is no other film structure between the second heat insulation layer 142 and the first heat insulation layer 141, that is, the surface of the second heat insulation layer 142 close to the first heat insulation layer 141 is in direct contact with the surface of the first heat insulation layer 141 close to the second heat insulation layer 142. In some embodiments, Fig.11 A schematic diagram of another backlight module 1 provided in an embodiment of the present disclosure, Fig.11 The structure shown is Figure 5 The difference between the structure shown is that a second thermal insulation layer 142 is added; Fig.11 The structure shown is Figure 8 The difference between the structure shown is that a first heat insulation layer 141 is added; Fig.11 The structure shown is Fig.10 The difference of the structure shown is that the first heat insulation layer 141 is in direct contact with the second heat insulation layer 142 .

[0093] like Fig.11 As shown, the backlight module 1 further includes a light shielding layer 18 disposed on the side of the second insulation layer 142 away from the first insulation layer 141. A portion of the surface of the light shielding layer 18 close to the second insulation layer 142 is in direct contact with the surface of the second insulation layer 142 close to the light shielding layer 18.

[0094] like Fig.11As shown, the second thermal insulation layer 142 includes a substrate layer 1421 and a thermal insulation sublayer 1422 arranged in a stacked manner; the thermal insulation sublayer 1422 is arranged on the side of the substrate layer 1421 away from the light shielding layer 18. The thermal insulation sublayer 1422 is arranged on the side of the substrate layer 1421 close to the first thermal insulation layer 141. The surface of the thermal insulation sublayer 1422 close to the first thermal insulation layer 141 is in direct contact with the surface of the first thermal insulation layer 141 close to the thermal insulation sublayer 1422. At this time, the material of the second thermal insulation layer 142 can be selected from aerogel. The material of the first thermal insulation layer 141 is one of nano tungsten oxide, ceramic, aerogel, and a composite material of nano tungsten oxide and ceramic. The material of the substrate layer 1421 can be one of PET material, CPI material, TUP material or UTG material.

[0095] In some embodiments, Figure 12a to Figure 12b A preparation flow chart for forming a first thermal insulation layer provided in an embodiment of the present disclosure, for Fig.10 The preparation process of the first heat insulation layer 141 in the structure shown is as follows: Fig.12a As shown, step S11, providing a first circuit board 15 with a second cover film of the original roll out; Figure 12b As shown, S12 , coating the material of the first heat insulation layer 141 on the original roll of the second covering film to form the first heat insulation layer 141 .

[0096] In some embodiments, Figure 13a to Figure 13d A preparation flow chart for forming a second thermal insulation layer provided in an embodiment of the present disclosure, for Fig.10 The preparation process of the second thermal insulation layer 142 in the structure shown is as follows: Fig.13a As shown, S21, providing an original roll of light shielding layer 18 out 200; Fig.13b As shown, S22, attaching the second heat insulation layer 142 to the original roll material 200 of the light shielding layer 18; Fig.13c As shown, S23, the structure obtained in step S22 is cut by die cutting according to the shape of the predetermined light shielding layer 18; S24, as shown Fig.13d As shown, the structure obtained in step S23 is subjected to waste molding according to the predetermined shape of the light-shielding layer 18 to obtain the light-shielding layer 18 attached with the second heat-insulating layer 142 .

[0097] In addition, an embodiment of the present disclosure further provides a liquid crystal display device, which includes the backlight module 1 of any one of the above embodiments.

[0098] The liquid crystal display device may be, for example, a mobile phone, a tablet computer, a television, a monitor, a notebook computer, a digital photo frame, a vehicle-mounted device, or any other product with a display function.

[0099] In some embodiments, Fig.14 A partial structural diagram of a liquid crystal display device provided in an embodiment of the present disclosure is shown in FIG. Fig.14 As shown, the liquid crystal display device includes a liquid crystal display module 2 and a backlight module 1 arranged on the backlight side of the liquid crystal display module 2. The liquid crystal display module 2 includes a liquid crystal display substrate 21, a color filter substrate 22 arranged on the liquid crystal display substrate 21 near the light-emitting side, an upper polarizer 23 arranged on the color filter substrate 22 away from the liquid crystal display substrate 21, a double-sided laminating tape 24 arranged on the side of the upper polarizer 23 away from the color filter substrate 22, a glass cover plate 25 arranged on the side of the double-sided laminating tape 24 away from the upper polarizer 23, a lower polarizer 26 arranged on the side of the liquid crystal display substrate 21 away from the color filter substrate 22, and a driving chip 27 arranged on the liquid crystal display substrate 21 near the light-emitting side, and the orthographic projection of the driving chip 27 on the liquid crystal display substrate 21 and the orthographic projection of the color filter substrate 22 on the liquid crystal display substrate 21 have a certain gap, and the driving chip 27 is closer to the light bar 13 than the color filter substrate 22. The liquid crystal display module 2 further includes a second circuit board 28 , which is disposed on a surface of the liquid crystal display substrate 21 close to the light emitting side, and is located on a side of the driving chip 27 away from the color filter substrate 22 .

[0100] Among them, the glass cover plate 25 is mainly used to protect the liquid crystal display substrate 21 and the color film substrate 22, reducing the risk of screen damage. The upper polarizer 23 and the lower polarizer 26 mainly play a polarization role and are used to generate usable polarized light. The driving chip 27 is mainly used to control the transmission of photoelectric signals. The second circuit board 28 is mainly used to provide electrical signals to the transistors in the liquid crystal display substrate 21.

[0101] The surface of the light shielding layer 18 in the backlight module 1 that is away from the bottom plate 111 is in direct contact with the surface of the lower polarizer 26 in the liquid crystal display module 2 that is away from the liquid crystal display substrate 21. The light shielding layer 18 is a circular structure, and the surface of the light shielding layer 18 that is close to the bottom plate 111 is also in direct contact with the surface of the plastic frame 16 that is away from the bottom plate 111. The light shielding layer 18 is used to support the upper liquid crystal display module 2. There is a certain gap between the orthographic projection of the lower polarizer 26 on the bottom plate 111 and the orthographic projection of the heat insulation component 14 on the bottom plate 111.

[0102] Other essential components of the liquid crystal display device should be understood by those skilled in the art and will not be described in detail herein and should not be construed as limiting the present disclosure.

[0103] It is to be understood that the above embodiments are merely exemplary embodiments used to illustrate the principles of the present disclosure, but the present disclosure is not limited thereto. For those of ordinary skill in the art, various modifications and improvements can be made without departing from the spirit and substance of the present disclosure, and these modifications and improvements are also considered to be within the scope of protection of the present disclosure.

Claims

1. A backlight module, characterized in that: The back plate includes a bottom plate and a side plate connected to the edge of the bottom plate, wherein the side plate and the bottom plate form a receiving space; A light guide plate, disposed on the bottom plate and located in the accommodating space; A light bar, located in the accommodating space and on a side of the light guide plate close to the side plate; The heat insulation component is arranged on a side of the light bar away from the bottom plate, and its orthographic projection on the bottom plate completely covers the orthographic projection of the light bar on the bottom plate.

2. The backlight module according to claim 1, characterized in that: The backlight module also includes a first circuit board for providing a light-emitting signal to the light-emitting elements in the light bar; the first circuit board is arranged on a side of the heat insulation component close to the light bar.

3. The backlight module according to claim 2, characterized in that: A surface of the heat insulation component close to the light bar is in direct contact with a surface of the first circuit board facing away from the light bar.

4. The backlight module according to claim 3, characterized in that: The first circuit board includes a main body and a connecting part; the orthographic projection of the thermal insulation component on the base plate covers the orthographic projection of the main body on the base plate.

5. The backlight module according to claim 3, characterized in that: The material of the heat insulation component is one of nano tungsten oxide, ceramic, aerogel, and a composite material of nano tungsten oxide and ceramic.

6. The backlight module according to claim 2, characterized in that: The backlight module further comprises a light shielding layer; the light shielding layer is arranged on a side of the heat insulation component close to the first circuit board.

7. The backlight module according to claim 6, characterized in that: The heat insulation component comprises a substrate layer and a heat insulation sublayer which are stacked; the heat insulation sublayer is arranged on a side of the substrate layer away from the light shielding layer.

8. The backlight module according to claim 7, characterized in that: The material of the heat insulation sublayer is one of nano tungsten oxide, ceramics, aerogel, and a composite material of nano tungsten oxide and ceramics.

9. The backlight module according to claim 2, characterized in that: The thermal insulation assembly comprises a first thermal insulation layer and a second thermal insulation layer; The surface of the first heat insulation layer close to the light bar is in direct contact with the surface of the first circuit board facing away from the light bar; The second heat insulation layer is arranged on a side of the first heat insulation layer facing away from the first circuit board.

10. The backlight module according to claim 9, characterized in that: The backlight module further includes a light shielding layer arranged between the first heat insulation layer and the second heat insulation layer.

11. The backlight module according to claim 10, characterized in that: The second heat-insulating layer comprises a substrate layer and a heat-insulating sublayer which are stacked; the heat-insulating sublayer is arranged on a side of the substrate layer away from the light-shielding layer.

12. The backlight module according to claim 11, characterized in that: The material of the first heat-insulating layer and the material of the heat-insulating sub-layer are one of nano-tungsten oxide, ceramic, aerogel, and a composite material of nano-tungsten oxide and ceramic.

13. A liquid crystal display device, characterized in that: It comprises the backlight module as claimed in any one of claims 1 to 12.

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