Display device

Abstract

The display device provided by the utility model comprises a circuit substrate which comprises a plurality of circuit bonding pads; a display panel including a plurality of pad regions and a plurality of non-pad regions alternately arranged along a first direction with the plurality of pad regions; and a conductive adhesive member electrically connecting the circuit board and the display panel. The display panel includes: a base layer including a plurality of openings overlapping each of a plurality of non-pad regions; a light-transmitting layer disposed in the plurality of openings and having a higher light transmittance than the base; and a plurality of display pads corresponding to each of the plurality of circuit pads and arranged along the first direction so as to overlap each of the plurality of pad regions on a plane.

Description

Technical Field

[0001] The utility model relates to a display device, and more particularly to a display device capable of improving the bonding reliability between a display panel and a circuit substrate. Background Art

[0002] Display devices such as televisions, monitors, smartphones, and tablets that provide images to users include display panels that display images. Various display panels are being developed as display panels, such as liquid crystal display panels, organic light emitting display panels, electrowetting display panels, and electrophoretic display panels.

[0003] Recently, a display device including a flexible display panel is being developed along with the development of display device technology. The display panel includes a plurality of pixels for displaying an image and a driving circuit for driving the pixels. In order to reduce the thickness of the display device, the pixels can be arranged in the display area of ​​the display panel, and the circuit substrate on which the driving circuit is mounted is connected to the non-display area of ​​the display panel. Utility Model Content

[0004] The purpose of the utility model is to provide a display device with improved bonding reliability.

[0005] A display device according to an embodiment of the present invention includes: a circuit substrate including a plurality of circuit pads; a display panel including a plurality of pad regions and a plurality of non-pad regions alternately arranged with the plurality of pad regions along a first direction; and a conductive adhesive component electrically connecting the circuit substrate and the display panel. The display panel includes: a base layer including a plurality of openings overlapping each of the plurality of non-pad regions; a light transmission layer arranged in the plurality of openings and having a higher light transmittance than the base layer; and a plurality of display pads corresponding to each of the plurality of circuit pads and arranged along the first direction to overlap each of the plurality of pad regions on a plane.

[0006] The openings may be arranged along the first direction and not overlap with the plurality of pad regions.

[0007] The light-transmitting layer is in direct contact with an opening surface of the base layer that defines the opening.

[0008] The light-transmitting layer may be configured to fill the opening.

[0009] The base layer may include a first barrier layer disposed below the display pad and a first sub-base layer disposed below the first barrier layer. The first barrier layer is configured to overlap the plurality of pad regions and the plurality of non-pad regions on a plane, and the first sub-base layer includes a first opening portion arranged to overlap each of the plurality of non-pad regions on a plane.

[0010] The light-transmitting layer may be configured to fill the first opening.

[0011] The base layer may further include a second barrier layer disposed below the first sub-base layer and a second sub-base layer disposed below the second barrier layer. The second barrier layer is configured to overlap the plurality of pad regions and the plurality of non-pad regions, and the second sub-base layer includes a second opening corresponding to the first opening.

[0012] The light-transmitting layer may be configured to fill the second opening.

[0013] Each of the first sub-base layer and the second sub-base layer may be formed of polyimide (PI).

[0014] The light-transmitting layer may be formed of a polymer substance that transmits the supplied ultraviolet rays.

[0015] The light transmittance of the light transmitting layer may be 80% or more and 95% or less.

[0016] It may be that a pitch between each of the plurality of display pads in the first direction is the same as a pitch between each of the plurality of circuit pads in the first direction.

[0017] A width of each of the plurality of display pads in the first direction is smaller than a width of each of the plurality of circuit pads in the first direction.

[0018] The conductive adhesive member may be formed of a photoinitiator.

[0019] A display device according to an embodiment of the present invention includes: a circuit substrate including a plurality of circuit pads; a display panel including a plurality of pad regions arranged along a first direction and extending in a second direction intersecting the first direction and a non-pad region adjacent to the plurality of pad regions; and a conductive adhesive component electrically connecting the circuit substrate and the display panel. The display panel includes: a base layer including a plurality of layers and including an opening formed by at least one of the plurality of layers; a light transmission layer disposed in the opening and having a higher light transmittance than the base layer; and a plurality of display pads corresponding to each of the plurality of circuit pads and arranged along the first direction to overlap each of the plurality of pad regions on a plane.

[0020] It may be that the non-pad region is provided in plurality, and the plurality of non-pad regions and the plurality of pad regions are alternately arranged along the first direction.

[0021] The plurality of layers may include a first barrier layer disposed below the display pad and a first sub-base layer disposed below the first barrier layer. The first barrier layer is configured to overlap the plurality of pad regions and the plurality of non-pad regions in a plane, and the first sub-base layer includes a first opening portion arranged to overlap each of the plurality of non-pad regions in a plane.

[0022] The light-transmitting layer may be configured to fill the first opening.

[0023] The base layer may further include a second barrier layer disposed below the first sub-base layer and a second sub-base layer disposed below the second barrier layer. The second barrier layer is configured to overlap the plurality of pad regions and the plurality of non-pad regions, and the second sub-base layer includes a second opening corresponding to the first opening.

[0024] The light-transmitting layer may be configured to fill the second opening.

[0025] The display device of the utility model can improve the reliability of the light curing degree of the light curing adhesive component arranged between the display panel and the circuit substrate by configuring a light transmission layer with high light transmittance in the opening portion formed in the base layer.

[0026] Furthermore, by providing a light-transmitting layer in each of the openings formed in the base layer including a plurality of layers, it is possible to prevent the barrier layer included in the base layer from being isolated, thereby providing a reliable display device. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 It is a three-dimensional diagram of a display device according to an embodiment of the utility model.

[0028] Figure 2a It is an exploded perspective view of a display device according to an embodiment of the utility model.

[0029] Figure 2b It is an exploded perspective view of a display device according to an embodiment of the utility model.

[0030] Figure 3 It is a cross-sectional view of a display module according to an embodiment of the present invention.

[0031] Figure 4 It is a plan view of a part of the structure of a display module according to an embodiment of the present utility model.

[0032] Figure 5 is a cross-sectional view of a display panel according to an embodiment of the present utility model.

[0033] Figure 6 It is an exploded perspective view showing a part of a display device according to an embodiment of the present invention.

[0034] Figure 7a is a perspective view showing a portion of a display panel according to an embodiment of the present invention.

[0035] Figure 7b It is along Figure 7a A cross-sectional view taken along line II' is shown.

[0036] Figure 7c It is along Figure 7a A cross-sectional view taken along line II-II' is shown.

[0037] Figure 8a is a perspective view showing a portion of a display panel according to an embodiment of the present invention.

[0038] Figure 8b It is along Figure 8a A cross-sectional view taken along line III-III' is shown.

[0039] Figure 9a is a perspective view showing a portion of a display panel according to an embodiment of the present invention.

[0040] Figure 9b It is along Figure 9a A cross-sectional view taken along line IV-IV' is shown.

[0041] Fig.10a It is a cross-sectional view of a portion of a display device according to an embodiment of the present invention.

[0042] Fig.10b It is a cross-sectional view of a portion of a display device according to an embodiment of the present invention.

[0043] (Explanation of Reference Numerals)

[0044] DD: Display device DP: Display panel

[0045] CB: Circuit board PA: Pad area

[0046] NPA: Non-Pad Area ACF: Conductive Bonding Part

[0047] OP: Opening BL: Base layer

[0048] LTL: Light Transmitting Layer LD: Circuit Pad

[0049] SD: Display pad DETAILED DESCRIPTION

[0050] The present invention may be implemented in various changes and may have various forms, and specific embodiments will be illustrated in the drawings and described in detail herein. However, it should be understood that these do not limit the present invention to a specific disclosed form, but include all changes, equivalents and even substitutes included in the concept and technical scope of the present invention.

[0051] In this specification, when any constituent element (or region, layer, part, etc.) is mentioned as being "on" other constituent elements, "connected" or "combined with" other constituent elements, it means that it can be directly configured / connected / combined with other constituent elements or a third constituent element can be configured between them.

[0052] The same reference numerals refer to the same components. In addition, in the drawings, the thickness, proportion and size of the components are exaggerated for the effective description of the technical content.

[0053] "And / or" includes all combinations of more than one that can be defined for the associated structures.

[0054] The terms first, second, etc. may be used to describe various constituent elements, but the above constituent elements cannot be limited by the above terms. The above terms are used only for the purpose of distinguishing one constituent element from other constituent elements. For example, without departing from the scope of the invention, the first constituent element may be named as the second constituent element, and similarly, the second constituent element may be named as the first constituent element. Unless the context clearly indicates otherwise, the expression in the singular includes the expression in the plural.

[0055] In addition, terms such as “below”, “lower side”, “above”, and “upper side” are used to explain the relationship between the structures shown in the drawings. The above terms are relative concepts and are explained based on the directions shown in the drawings.

[0056] Unless defined differently, all terms (including technical terms and scientific terms) used in this specification have the same meaning as those generally understood by technicians in the technical field to which the utility model belongs. In addition, it may be that the same terms as those defined in commonly used dictionaries should be interpreted as having the same meaning as that in the context of the related technology, and should not be interpreted as too idealized or too formalized as long as they are not clearly defined here.

[0057] Terms such as "including" or "having" should be understood as specifying the presence of features, numbers, steps, tasks, constituent elements, accessories or combinations thereof recorded in the specification, and do not preclude the existence or additional possibility of one or more other features or numbers, steps, tasks, constituent elements, accessories or combinations thereof.

[0058] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.

[0059] Figure 1 It is a three-dimensional diagram of a display device according to an embodiment of the utility model. Figure 2a as well as Figure 2b It is an exploded perspective view of a display device according to an embodiment of the utility model. Figure 2b The display panel DP in the display device DD is shown to be bent. In this specification, the display device DD of a portable phone terminal is shown as an example. The display device DD according to the utility model can be applied to large electronic devices such as televisions and monitors, and can also be applied to small and medium-sized electronic devices such as tablets, car navigation systems, game consoles, and smart watches.

[0060] Reference Figure 1 The display device DD can display an image IM through the display surface DD-IS. An icon image is shown as an example of the image IM. The display surface DD-IS is parallel to the plane defined by the first direction DR1 and the second direction DR2. The normal direction of the display surface DD-IS, that is, the thickness direction of the display device DD indicates a third direction DR3.

[0061] The display surface DD-IS includes a display area DD-DA for displaying an image IM and a non-display area DD-NDA adjacent to the display area DD-DA. The non-display area DD-NDA is an area where no image is displayed. However, the non-display area DD-NDA may be adjacent to any side of the display area DD-DA or omitted.

[0062] In this specification, the meaning of "when viewed on a plane or on a plane" may refer to the case of viewing in the third direction DR3. The front (or top) and back (or bottom) of each layer or unit described below can be distinguished by the third direction DR3. However, the combination of the first to third directions DR1, DR2, and DR3 can be changed to other combinations.

[0063] Reference Figure 2a as well as Figure 2b The display device DD may include a window WM, a display module DM and a storage component BC.

[0064] The window WM is disposed above the display module DM and can transmit the image provided by the display module DM to the outside. The window WM includes a transmission area TA and a non-transmission area NTA. The transmission area TA can overlap the Figure 1 The display area DD-DA shown is shown, and has a shape corresponding to the display area DD-DA. The window WM may include a base layer and a functional layer configured on the base layer. The functional layer may include a protective layer, an anti-fingerprint layer, etc. The base layer of the window WM may be composed of glass, sapphire or plastic, etc. The base layer of the window WM may include an optically transparent insulating material. For example, the base layer of the window WM may include glass or plastic. The base layer of the window WM may have a multi-layer structure or a single-layer structure. For example, the base layer of the window WM may include a plurality of plastic films bonded by an adhesive, or include a glass substrate and a plastic film bonded by an adhesive.

[0065] The non-transmission area NTA may overlap the non-display area DD-NDA and have a shape corresponding to the non-display area DD-NDA. The non-transmission area NTA may be an area with a relatively low light transmittance compared to the transmission area TA. The non-transmission area NTA may be defined by configuring a frame pattern in a part of the base layer of the window WM, and the area not configured with the frame pattern may be defined as the transmission area TA. However, the technical concept of the present utility model is not limited thereto, and the non-transmission area NTA may also be omitted.

[0066] Although not shown, an anti-reflection layer may be disposed between the window WM and the display module DM. The anti-reflection layer may reduce the reflectivity of external light incident from the outside of the display device DD. The anti-reflection layer may include a color filter. The color filter may have a predetermined arrangement. For example, the color filter may be arranged in consideration of the luminous color of the pixels included in the display panel DP described later. In addition, the anti-reflection layer may also include a black matrix adjacent to the color filter.

[0067] According to an embodiment of the present invention, the display module DM may include a display panel DP and an input sensor ISU.

[0068] The display panel DP may be any one of a liquid crystal display panel, an electrophoretic display panel, a MEMS display panel, an electrowetting display panel, an organic light emitting display panel, an inorganic light emitting display panel, and a quantum dot light emitting display panel. However, it is not particularly limited thereto. Hereinafter, the display panel DP is described as an organic light emitting display panel.

[0069] The input sensor ISU may include any one of a capacitive sensor, an optical sensor, an ultrasonic sensor, and an electromagnetic induction sensor. The input sensor ISU may be formed on the display panel DP through a continuous process, or may be manufactured separately and then attached to the upper side of the display panel DP through an adhesive layer, and is not limited to any one embodiment.

[0070] The display module DM may include a circuit substrate CB. The circuit substrate CB may include a driving chip DC and a printed circuit substrate CF. Figure 2a 2 shows an embodiment in which the driving chip DC is mounted on the display panel DP, but is not limited thereto. The driving chip DC may generate a driving signal required for the operation of the display panel DP based on a control signal transmitted from the printed circuit board CF.

[0071] The display panel DP may include a bending area BA, and a first non-bending area NBA1 and a second non-bending area NBA2 that are spaced apart in a second direction DR2 across the bending area BA.

[0072] The bending area BA may be defined as an area where the display panel DP is bent along a virtual bending axis BX extending in the first direction DR1. It may be defined that the first non-bending area NBA1 is an area overlapping the transmissive area TA, and the second non-bending area NBA2 is an area connected to the printed circuit substrate CF. When the bending area BA is bent with the bending axis BX as a reference, the printed circuit substrate CF and the driving chip DC may be bent in a direction toward the back of the display panel DP and configured under the back of the display panel DP. Although not shown, an additional structure may be configured to compensate for the step between the circuit substrate CB and the back of the display panel DP generated toward the bending area BA.

[0073] According to an embodiment, the width of the first non-bending area NBA1 in the second direction DR2 may be greater than the widths of the bending area BA and the second non-bending area NBA2. However, the width of the bending area BA in the second direction DR2 may be provided in a shape that becomes narrower from the first non-bending area NBA1 toward the second non-bending area NBA2, and is not limited to any one embodiment.

[0074] like Figure 2b As shown, as a portion of the display panel DP is bent, the printed circuit substrate CF electrically bonded to the display panel DP may be disposed on the back side of the display panel DP.

[0075] The storage component BC can accommodate the display module DM and is combined with the window WM. The printed circuit substrate CF is configured at one end of the display panel DP and is electrically connected to the circuit element layer DP-CL. Although not shown, the display device DD may also include a main board, an electronic module mounted on the main board, a camera module, a power module, etc.

[0076] In the above, an example of the display device DD is described as a portable phone terminal, but in this specification, the display device DD may include more than two electrically bonded electronic components. The display panel DP and the driver chip DC mounted on the display panel DP are equivalent to different electronic components, and the display device DD can be constructed only by these, without being limited to any one embodiment.

[0077] In one embodiment, the display device DD may be formed only by a display panel DP and a printed circuit board CF connected to the display panel DP, or may be formed only by a mainboard and an electronic module mounted on the mainboard. The display device DD according to the present invention will be described below with the bonding structure of the display panel DP and the driver chip DC mounted on the display panel DP as the center.

[0078] Figure 3 It is a cross-sectional view of a display module according to an embodiment of the present invention. Figure 4 It is a plan view of a part of the structure of a display module according to an embodiment of the present utility model.

[0079] Reference Figure 3 The display panel DP includes a base layer BL, a circuit element layer DP-CL disposed on the base layer BL, a display element layer DP-OLED, and an upper insulating layer TFL. The input sensor ISU may be disposed on the upper insulating layer TFL.

[0080] The display panel DP includes a display area DP-DA and a non-display area DP-NDA. The display area DP-DA of the display panel DP corresponds to Figure 2aThe display area DD-DA shown or in Figure 2a The transmissive area TA shown in FIG. 1 and the non-display area DP-NDA correspond to the transmissive area TA shown in FIG. Figure 1 The non-display area DD-NDA shown in Figure 2a A non-transmissive area NTA is shown.

[0081] The base layer BL may include at least one plastic film. As a flexible substrate, the base layer BL may include a plastic substrate, a glass substrate, a metal substrate, or an organic / inorganic composite material substrate.

[0082] The circuit element layer DP-CL includes at least one intermediate insulating layer and circuit elements. The intermediate insulating layer includes at least one intermediate inorganic layer and at least one intermediate organic layer. The circuit elements include signal lines, pixel driving circuits, etc.

[0083] The display element layer DP-OLED includes a plurality of organic light emitting diodes and may further include an organic layer such as a pixel definition film.

[0084] The upper insulating layer TFL seals the display element layer DP-OLED. The upper insulating layer TFL may be disposed on the display element layer DP-OLED. The upper insulating layer TFL may overlap the display area DP-DA and the non-display area DP-NDA. The upper insulating layer TFL may overlap at least a portion of the non-display area DP-NDA. As an example, the upper insulating layer TFL may include a thin film encapsulation layer. The thin film encapsulation layer may include a stacked structure of an inorganic layer / organic layer / inorganic layer. The upper insulating layer TFL may protect the display element layer DP-OLED from foreign matter such as moisture, oxygen, and dust particles. However, it is not limited thereto, and the upper insulating layer TFL may also include an additional insulating layer other than the thin film encapsulation layer. For example, an optical insulating layer for controlling the refractive index may also be included.

[0085] In one embodiment of the present invention, a packaging substrate may be provided instead of the upper insulating layer TFL. In this case, the packaging substrate may be opposite to the base layer BL, and a circuit element layer DP-CL and a display element layer DP-OLED may be arranged between the packaging substrate and the base layer.

[0086] The input sensor ISU may be directly disposed on the display panel DP. In the present specification, "the A structure is directly disposed on the B structure" means that no separate layer is disposed between the A structure and the B structure. In the present embodiment, the input sensor ISU may be manufactured with the display panel DP through a continuous process. However, the technical concept of the present utility model is not limited thereto, and the input sensor ISU is provided as a separate panel and is combined with the display panel DP through an adhesive layer. As an example, the input sensor ISU may be omitted.

[0087] Reference Figure 4 The display panel DP may include a plurality of pixels PX, a gate driving circuit GDC, a plurality of signal lines SGL, and a plurality of display pads DP-PD, DP-CPD.

[0088] The pixels PX are arranged in the display area DP-DA. Each of the pixels PX includes an organic light emitting diode and a pixel driving circuit connected thereto. The gate driving circuit GDC and the signal line SGL may be included in Figure 3 Circuit element layers DP-CL are shown.

[0089] The gate driving circuit GDC sequentially outputs gate signals to the plurality of gate lines GL. The gate driving circuit GDC may include a plurality of thin film transistors formed by the same process as the driving circuit of the pixel PX, for example, the LTPS (Low Temperature Polycrystalline Silicon) process or the LTPO (Low Temperature Polycrystalline Oxide) process. The display panel DP may also include another driving circuit that provides a light emitting control signal to the pixel PX.

[0090] The signal lines SGL include gate lines GL, data lines DL, power lines PL, and control signal lines CSL. The gate lines GL are connected to corresponding pixels PX in the pixels PX, and the data lines DL are connected to corresponding pixels PX in the pixels PX. The power lines PL are connected to the pixels PX. The control signal lines CSL can provide control signals to the scan driving circuit.

[0091] The signal line SGL overlaps the display area DP-DA and the non-display area DP-NDA. Each of the signal lines SGL may include a pad portion and a line portion. The line portion overlaps the display area DP-DA and the non-display area DP-NDA. The pad portion is connected to the end of the line portion. The pad portion may overlap the pad area described later.

[0092] The display panel DP may include a plurality of display pads SD. Each of the plurality of display pads SD may be spaced apart and configured at a predetermined interval. According to an embodiment, the plurality of display pads SD may be configured to overlap the second non-bending area NBA2. The plurality of display pads SD may be configured in a connection area CA in the second non-bending area NBA2. It may be defined that the connection area CA is an area in the second non-bending area NBA2 where the display pads SD are configured and the driver chip DC is attached (refer to Figure 2a ) and the area of ​​the printed circuit board CF.

[0093] The display pad SD may include a first pad DP-PD and a second pad DP-CPD. The first pad DP-PD may be configured to overlap the connection area CA. A driving chip DC may be mounted on the second non-bending area NBA2 (refer to Figure 2a The first pad DP-PD may be electrically connected to the driving chip DC and transmit an electrical signal received from the driving chip DC to the signal line SGL.

[0094] The first pads DP-PD may be arranged along the first direction DR1 and the second direction DR2. The first pads DP-PD may include a first row of pads DP-PD1 and a second row of pads DP-PD2 spaced apart from the first row of pads DP-PD1 in the second direction DR2 and arranged along the first direction DR1. The second row of pads DP-PD2 may be an input pad that receives a signal from the driving chip DC, and the first row of pads DP-PD1 may be an output pad that transmits a signal to the signal line SGL.

[0095] But not limited thereto, the first pads DP-PD may be arranged in a row, or in more than three rows along the second direction DR2.

[0096] The second pads DP-CPD may be configured to overlap the turn-on area CA. The second pads DP-CPD may be arranged along the first direction DR1. The first pads DP-PD and the second pads DP-CPD may be connected to each other through a bridge signal line S-CL.

[0097] The second pads DP-CPD may also include row pads arranged along the first direction DR1 like the first pads DP-PD. One row pad may include the second pads DP-CPD arranged at intervals in the first direction DR1.

[0098] The printed circuit substrate CF may include substrate pads CF-PD electrically connected to the display panel DP. The substrate pads CF-PD may be arranged along the first direction DR1. In addition, when the second pads DP-CPD are provided in the form of row pads arranged in the first direction DR1, the substrate pads CF-PD included in the printed circuit substrate CF may also have an arrangement form corresponding to the second pads DP-CPD in 1:1, without being limited to any one embodiment.

[0099] The second pad DP-CPD is electrically connected to the substrate pad CF-PD included in the printed circuit substrate CF to transmit the electrical signal received from the printed circuit substrate CF to the first pad DP-PD. The printed circuit substrate CF may be rigid or flexible. For example, when the printed circuit substrate CF is flexible, it may be provided as a flexible printed circuit board.

[0100] The printed circuit substrate CF may include a timing control circuit for controlling the operation of the display panel DP. The timing control circuit may be mounted on the printed circuit substrate CF in the form of an integrated chip. In addition, although not shown, the printed circuit substrate CF may include an input sensing circuit for controlling the input sensor ISU.

[0101] On the other hand, the display panel DP of the present invention includes a display panel DP for mounting on Figure 2a The configuration of the first pad DP-PD of the driving chip DC is shown for explanation, but is not limited thereto. The driving chip DC may be mounted on a printed circuit board CF, in which case the first pad DP-PD may be omitted.

[0102] Figure 5 is a cross-sectional view of a display panel according to an embodiment of the present utility model.

[0103] Reference Figure 5 , the display area DP-DA may include a light emitting area PXA and a non-light emitting area NPXA. Each of the pixels PX includes an organic light emitting diode OLED and a pixel driving circuit connected thereto. Specifically, the pixel PX may include a first transistor TR1, a second transistor TR2, and an organic light emitting diode OLED. Two transistors TR1 and TR2 in the pixel driving circuit are shown.

[0104] The display panel DP may include a plurality of insulating layers and semiconductor patterns, conductive patterns, signal lines, etc. The insulating layers, semiconductor layers, and conductive layers are formed by coating, evaporation, etc. Thereafter, the insulating layers, semiconductor layers, and conductive layers may be selectively patterned by photolithography. In this manner, semiconductor patterns, conductive patterns, signal lines, etc. included in the circuit element layer DP-CL and the display element layer DP-OLED are formed.

[0105] The base layer BL may include a synthetic resin film. The base layer BL may have a multi-layer structure. For example, the base layer BL may also have a three-layer structure of a synthetic resin layer, an inorganic layer, and a synthetic resin layer. In particular, the synthetic resin layer may be a polyimide resin layer, and its material is not particularly limited. In addition, the base layer BL may include a glass substrate, a metal substrate, or an organic / inorganic composite material substrate, etc.

[0106] At least one inorganic layer is disposed on the base layer BL. The inorganic layer may be formed into multiple layers. The multiple inorganic layers may constitute a barrier layer and / or a buffer layer. In this embodiment, the display panel DP is shown to include a buffer layer BFL.

[0107] A semiconductor pattern is disposed on the buffer layer BFL. The semiconductor pattern may include polysilicon. However, not limited thereto, the semiconductor pattern may also include amorphous silicon or metal oxide.

[0108] Figure 5 Only a portion of the semiconductor pattern is shown, and on a plane, semiconductor patterns may be further configured in other areas of the pixel PX. The semiconductor pattern may be arranged in a specific rule through the pixel. The semiconductor pattern has different electrical properties depending on whether it is doped or not. The semiconductor pattern may include a first region and a second region. The first region may be doped with an N-type dopant or a P-type dopant. The P-type transistor includes a doped region doped with a P-type dopant.

[0109] The first region may be more conductive than the second region, and may substantially function as an electrode or a signal line. The second region may be a low doping concentration or non-doped region, and may substantially be equivalent to an active region (or a channel) of a transistor. In other words, a portion of the semiconductor pattern may be an active region of a transistor, another portion may be a source or drain of the transistor, and yet another portion may be a connecting electrode or a connecting signal line.

[0110] like Figure 5 As shown, the first source S1, the first active electrode A1, and the first drain electrode D1 of the first transistor TR1 may be formed from a semiconductor pattern, and the second source S2, the second active electrode A2, and the second drain electrode D2 of the second transistor TR2 may be formed from a semiconductor pattern.

[0111] exist Figure 5 1 shows a portion of a connection signal line SCL formed from a semiconductor pattern. Although not shown separately, the connection signal line SCL may be electrically connected to the second drain electrode D2 of the second transistor TR2 on a plane. Another transistor may be configured between the connection signal line SCL and the second drain electrode D2 of the second transistor TR2.

[0112] A first insulating layer 10 is disposed on the buffer layer BFL. The first insulating layer 10 overlaps with a plurality of pixels PX and covers the semiconductor pattern. A first and second gates G1 and G2 are disposed on the first insulating layer 10. The first and second gates G1 and G2 may be part of the metal pattern. The first gate G1 overlaps with the first active A1, and the second gate G2 overlaps with the second active A2. In the process of doping the semiconductor pattern, the first and second gates G1 and G2 are the same as the mask.

[0113] A second insulating layer 20 covering the first and second gates G1 and G2 is disposed on the first insulating layer 10. The second insulating layer 20 overlaps the pixel PX. An upper electrode UE may be disposed on the second insulating layer 20. The upper electrode UE may overlap the second gate G2 of the second transistor TR2. The upper electrode UE may be a part of a metal pattern. A part of the second gate G2 and the upper electrode UE overlapping therewith may define a capacitor.

[0114] The third insulating layer 30 covering the upper electrode UE is disposed on the second insulating layer 20. The first connection electrode CNE1 disposed on the third insulating layer 30 may be connected to the connection signal line SCL through a contact hole CNT-1 penetrating the first to third insulating layers 10 to 30.

[0115] The fourth insulating layer 40 covering the first connection electrode CNE1 is disposed on the third insulating layer 30. The first to fourth insulating layers 10 to 40 may be inorganic layers and / or organic layers, and may have a single-layer or multi-layer structure.

[0116] A fifth insulating layer 50 is disposed on the fourth insulating layer 40. The fifth insulating layer 50 may be an organic layer. A second connection electrode CNE2 may be disposed on the fifth insulating layer 50. The second connection electrode CNE2 may be connected to the first connection electrode CNE1 through a contact hole CNT-2 penetrating the fourth insulating layer 40 and the fifth insulating layer 50.

[0117] A sixth insulating layer 60 covering the second connection electrode CNE2 is disposed on the fifth insulating layer 50. The sixth insulating layer 60 may be an organic layer. The first electrode AE ​​is disposed on the sixth insulating layer 60. The first electrode AE ​​is connected to the second connection electrode CNE2 through a contact hole CNT-3 penetrating the sixth insulating layer 60.

[0118] The pixel opening OPN is defined in the pixel defining film PDL. The pixel opening OPN of the pixel defining film PDL exposes at least a portion of the first electrode AE. In the present embodiment, the light emitting region PXA is defined as a region corresponding to a portion of the first electrode AE ​​exposed by the pixel opening OPN.

[0119] The hole control layer HCL may be configured in the light emitting area PXA and the non-light emitting area NPXA. The hole control layer HCL may include a hole transport layer and a hole injection layer. The light emitting layer EML is configured on the hole control layer HCL. The light emitting layer EML may be configured in an area corresponding to the pixel opening OPN. That is, the light emitting layer EML may be formed separately in each pixel. However, it is not limited thereto, and the light emitting layer EML may also be formed in a plurality of pixels PX using an opening mask.

[0120] An electron control layer ECL is configured on the light emitting layer EML. The electron control layer ECL may include an electron transport layer and an electron injection layer. The hole control layer HCL and the electron control layer ECL may be formed together in a plurality of pixels using an opening mask. A second electrode CE is configured on the electron control layer ECL. The second electrode CE has an integral shape and is configured together in a plurality of pixels PX. An upper insulating layer TFL is configured on the second electrode CE. The upper insulating layer TFL may include a plurality of thin films.

[0121] Figure 6It is an exploded perspective view showing a part of a display device according to an embodiment of the present invention.

[0122] Reference Figure 6 The display device DD includes a circuit substrate CB, a conductive adhesive component ACF, and a display panel DP. Figure 6 , each of the display panel DP, the conductive adhesive component ACF, and the circuit substrate CB is shown as a cross section in which the display panel DP, the conductive adhesive component ACF, and the circuit substrate CB are separated from each other, but the display panel DP, the conductive adhesive component ACF, and the circuit substrate CB may be in a state of being combined with each other. That is, at least a part of the structure of the display panel DP is in contact with the conductive adhesive component ACF, and at least a part of the structure of the circuit substrate CB may be in a state of being in contact with the conductive adhesive component ACF.

[0123] The circuit substrate CB includes a printed circuit substrate CF and a driving chip DC. The circuit substrate CB includes a plurality of circuit pads LD, each of which can be arranged at a predetermined interval. The plurality of circuit pads LD include substrate pads CF-PD mounted on the printed circuit substrate CF and chip pads DC-PD mounted on the driving chip DC.

[0124] The conductive adhesive component ACF may be disposed between the circuit substrate CB and the display panel DP. The conductive adhesive component ACF may electrically connect the circuit pad LD and the display pad SD. According to an embodiment of the utility model, the conductive adhesive component ACF may include a photoinitiator. The conductive adhesive component ACF includes a first conductive adhesive component AF-C disposed between the printed circuit substrate CF and the display panel DP and a second conductive adhesive component AF-D disposed between the driving chip DC and the display panel DP. The connection area CA where the display panel DP and the circuit substrate CB are connected to each other may include a first connection area CA1 where the printed circuit substrate CF and the display panel DP are connected to each other and a second connection area CA2 where the driving chip DC and the display panel DP are connected to each other.

[0125] The printed circuit substrate CF includes an upper surface CF-US and a lower surface CF-DS. The lower surface CF-DS of the printed circuit substrate CF may be a surface facing the display panel DP. The substrate pads CF-PD may be arranged on the lower surface CF-DS of the printed circuit substrate CF and electrically connected to the second pads DP-CPD of the display panel DP. The substrate pads CF-PD and the second pads DP-CPD may be electrically connected to each other through the first conductive adhesive component AF-C.

[0126] The driving chip DC includes an upper surface DC-US and a lower surface DC-DS. The lower surface DC-DS of the driving chip DC may be a surface facing the display panel DP. The driving chip DC includes a chip pad DC-PD electrically connected to the first pad DP-PD configured on the base layer BL. The chip pad DC-PD and the first pad DP-PD may be electrically connected to each other through a second conductive adhesive component AF-D.

[0127] The chip pads DC-PD include a first row of chip pads DC-PD1 arranged along a first direction DR1 and a second row of chip pads DC-PD2 spaced apart from the first row of chip pads DC-PD1 in a second direction DR2 and arranged along the first direction DR1. The first row of chip pads DC-PD1 and the second row of chip pads DC-PD2 may have a shape exposed to the outside from the bottom of the driving chip DC. The first row of chip pads DC-PD1 may be electrically connected to the first row of pads DP-PD1 of the first pads DP-PD to receive a first signal, transmit a second signal generated according to the first signal from the second row of chip pads DC-PD2 to the second row of pads DP-PD2, and provide it to the data line DL (refer to Figure 4 ).exist Figure 6 It is described that the chip pads DC-PD are arranged in two rows, but the chip pads DC-PD may be arranged in a single row or multiple rows based on the configuration of the first pad DP-PD arrangement.

[0128] The display panel DP may further include a light transmission layer LTL disposed between the plurality of display pads SD. The light transmission layer LTL may be disposed to overlap the connection area CA. The light transmission layer LTL may be disposed to overlap the first connection area CA1 and the second connection area CA2. The plurality of display pads SD and the light transmission layer LTL may be alternately arranged along a direction. The light transmission layer LTL may be disposed in an opening OP (refer to Figure 7b ). The details of this will be described later.

[0129] Figure 7a is a perspective view showing a portion of a display panel according to an embodiment of the present invention. Figure 7b It is along Figure 7a A cross-sectional view taken along line II' is shown. Figure 7c It is along Figure 7a The cross-sectional view taken along the line II-II' is shown. Specifically, Figure 7a It is enlarged in Figure 6 An enlarged view of a portion of either the first connection area CA1 or the second connection area CA2 is shown.

[0130] Reference Figure 7a as well as Figure 7bThe display panel DP may include a base layer BL having a plurality of openings OP, a light transmission layer LTL disposed at each of the plurality of openings OP, and a display pad SD disposed on the base layer BL. Figure 7a as well as Figure 7b The display pad SD shown may be the first pad DP-PD shown above (refer to Figure 6 ) and the second pad DP-CPD (refer to Figure 6 ). When the display pad SD is the first pad DP-PD and when it is the second pad DP-CPD, the configuration directions of the respective plurality of signal lines SGL may be different. On the other hand, the light transmission layer LTL and the display pad SD may be configured to overlap the connection area CA. Figure 7a The connection area CA is shown in Figure 6 One of the first connection area CA1 and the second connection area CA2 is shown, and for convenience of description, it is described as the connection area CA below.

[0131] The connection area CA may include a plurality of pad areas PA and a plurality of non-pad areas NPA. The plurality of pad areas PA and the plurality of non-pad areas NPA may be areas alternately defined along a direction. Each of the non-pad areas NPA may be an area spaced apart and arranged in the first direction DR1 between each of the pad areas PA.

[0132] Each of the plurality of display pads SD may be arranged on the base layer BL so as to overlap each of the plurality of pad areas PA. Each of the plurality of openings OP may be defined as overlapping each of the plurality of non-pad areas NPA. Each of the plurality of display pads SD may be arranged so as to fully overlap each of the plurality of pad areas PA. Each of the plurality of openings OP may be defined as fully overlapping each of the plurality of non-pad areas NPA. Thus, the base layer BL may include a structure in which the display pads SD and the openings OP are alternately arranged along a direction.

[0133] Each of the plurality of openings OP may be a hole defined in the base layer BL. For example, each of the plurality of openings OP may be a through hole formed by penetrating the base layer BL. The light transmission layer LTL may be disposed at each of the plurality of openings OP. When the light transmission layer LTL is formed, a separate base film may be disposed under the light transmission layer LTL, so that the base film is removed again after the light transmission layer LTL is formed. The light transmission layer LTL may overlap with a plurality of non-pad areas NPA, and may not overlap with a plurality of pad areas PA.

[0134] According to an embodiment of the present invention, the light transmission layer LTL may have a higher light transmittance than the base layer BL. For example, the light transmission layer LTL may have a light transmittance of 60% or more. Specifically, when UV (Ultraviolet) light having a wavelength of 300 nm or more and 400 nm or less is provided, the light transmission layer LTL may transmit 80% or more and 95% or less of the light. The light transmission layer LTL may include a polymer substance that can transmit the provided UV (Ultraviolet) light. For example, the light-transmitting layer LTL may include at least one selected from cycloolefin derivatives, cellulose polymers, vinyl acetate copolymers, polyester polymers, polystyrene polymers, polyamide polymers, polyamideimide polymers, polyetherimide polymers, polypropylene polymers, polyimide polymers, polyethersulfone polymers, polysulfone polymers, polyethylene polymers, polypropylene polymers, polymethylpentene polymers, polyvinyl chloride polymers, polyvinylidene chloride polymers, polyvinyl alcohol polymers, polyvinyl acetal polymers, polyether ketone polymers, polyetheretherketone polymers, polymethyl methacrylate polymers, polyethylene terephthalate polymers, polybutylene terephthalate polymers, polyethylene terephthalate polymers, polycarbonate polymers, polyurethane polymers and epoxy polymers.

[0135] As described above, when UV (Ultraviolet) light with a wavelength of greater than 300nm and less than 400nm is provided, the light-transmitting layer LTL may include at least one of polypropylene-based polymers, polysilicon-based polymers, polyimide-based polymers, polymethyl methacrylate-based polymers, polycarbonate-based polymers, polymethyl methacrylate-based polymers, polystyrene-based polymers, polyethylene terephthalate-based polymers, polypropylene-based polymers, and polyethylene-based polymers that can transmit at least 60% or more of the light.

[0136] The light-transmitting layer LTL may be configured to directly contact the opening surface OP-S defining the opening portion OP. The light-transmitting layer LTL may be configured to fill the opening portion OP as a whole. That is, the light-transmitting layer LTL may have the same shape as the opening portion OP. As shown in the figure, the opening portion OP may be a quadrilateral or a right hexahedron that extends or shortens along the first direction DR1 or the second direction DR2. Thus, the light-transmitting layer LTL may also be a quadrilateral or a right hexahedron that has the same shape as the opening portion OP. However, it is not limited thereto, and the opening portion OP and the light-transmitting layer LTL may have various shapes as needed.

[0137] like Figure 7b As shown, in one embodiment of the present invention, the light transmission layer LTL can be connected to the conductive adhesive component ACF (refer to Figure 6) overlap on a plane. Thus, in a display device DD (refer to Figure 1 ) is manufactured, the light provided to the display device DD can be provided to the conductive adhesive member ACF (refer to Figure 6 ).

[0138] A plurality of display pads SD and a plurality of openings OP may be arranged alternately along the first direction DR1. It may be that each of the plurality of display pads SD is spaced apart at a predetermined interval, and each of the plurality of openings OP is spaced apart at a predetermined interval. The spacing between the display pads SD may be substantially the same as the width of each of the openings OP in the first direction DR1, and the spacing between the openings OP may be substantially the same as the width of each of the display pads SD in the first direction DR1. The width of each of the plurality of display pads SD in the second direction DR2 may be substantially the same as the width of each of the plurality of openings OP in the second direction DR2. On the other hand, in this specification, the situation of "substantially the same" includes not only the situation where the width, thickness, etc. of the structure are physically exactly the same, but also the situation where the design is the same but has a gap equivalent to the error range that occurs in the process.

[0139] Reference Figure 7a as well as Figure 7c , the display panel DP may include a plurality of display pads SD and a plurality of signal lines SGL connected to each of the display pads SD.

[0140] The signal line SGL may be connected to each of the display pads SD to transmit an electrical signal. The signal line SGL may be arranged on the base layer BL so as to overlap the connection area CA. The signal line SGL may be separated from the light transmission layer LTL on a plane. The signal line SGL may be arranged along a first direction DR1, and may be a structure connected along a second direction DR2 intersecting the first direction DR1 with the display pads SD as a reference.

[0141] Figure 8a is a perspective view showing a portion of a display panel according to an embodiment of the present invention. Figure 8b It is along Figure 8a The cross-sectional view taken along line III-III' is shown. The matters overlapping with the above description are omitted below.

[0142] Reference Figure 8a as well as Figure 8bAccording to an embodiment of the present invention, the base layer BLa of the display panel DPa may include multiple layers. For example, the base layer BLa may include a first barrier layer BRL1 disposed under the display pad SD, a first sub-base layer SBL1 disposed under the first barrier layer BRL1, a second barrier layer BRL2 disposed under the first sub-base layer SBL1, and a second sub-base layer SBL2 disposed under the second barrier layer BRL2. Figure 8b The base layer BLa is shown to include four layers, but is not limited thereto. The base layer BLa may be formed to include only two layers or a plurality of layers including four or more layers.

[0143] Each of the first barrier layer BRL1 and the second barrier layer BRL2 may include an inorganic substance. For example, each of the first barrier layer BRL1 and the second barrier layer BRL2 may include silicon oxide. Each of the first barrier layer BRL1 and the second barrier layer BRL2 may protect the circuit element layer DP-CL and the display element layer DP-OLED disposed on the base layer BLa from foreign matter such as moisture, oxygen, and dust particles.

[0144] Each of the first sub-base layer SBL1 and the second sub-base layer SBL2 may include a synthetic resin. For example, each of the first sub-base layer SBL1 and the second sub-base layer SBL2 may include a polyimide (PI) material. Each of the first sub-base layer SBL1 and the second sub-base layer SBL2 may be a transparent or opaque polyimide film as required.

[0145] It may be that each of the first sub-base layer SBL1 and the second sub-base layer SBL2 is configured to overlap the pad area PA and is configured not to overlap the non-pad area NPA. That is, the non-pad area NPA of each of the first sub-base layer SBL1 and the second sub-base layer SBL2 in the base layer BL may define an opening OPa. Each of the first barrier layer BRL1 and the second barrier layer BRL2 may be configured to overlap the pad area PA and the non-pad area NPA. That is, each of the first barrier layer BRL1 and the second barrier layer BRL2 in the base layer BL does not define any opening.

[0146] The opening portion OPa may include a first opening portion OP1 formed in the first sub-base layer SBL1 and a second opening portion OP2 formed in the second sub-base layer SBL2. A light-transmitting layer LTLa may be configured in the opening portion OPa. Specifically, the light-transmitting layer LTLa may include a first light-transmitting layer LTL1 configured in the first opening portion OP1 and a second light-transmitting layer LTL2 configured in the second opening portion OP2.

[0147] Each of the first openings OP1 may be formed to completely overlap each of the plurality of non-pad areas NPA. Each of the plurality of first openings OP1 may be a hole defined in the first sub-base layer SBL1. The first light transmission layer LTL1 disposed in each of the first openings OP1 may overlap the plurality of non-pad areas NPA and may not overlap the plurality of pad areas PA.

[0148] Each of the second openings OP2 may be formed to completely overlap each of the plurality of non-pad areas NPA. Each of the plurality of second openings OP2 may be a hole defined in the second sub-base layer SBL2. The second light transmission layer LTL2 configured in each of the second openings OP2 may overlap the plurality of non-pad areas NPA and may not overlap the plurality of pad areas PA. The second light transmission layer LTL2 may overlap on a plane corresponding to the first light transmission layer LTL1.

[0149] According to an embodiment of the present invention, each of the first light transmission layer LTL1 and the second light transmission layer LTL2 may have a light transmittance of 60% or more. Specifically, when UV (Ultraviolet) light having a wavelength of 300 nm or more and 400 nm or less is provided, each of the first light transmission layer LTL1 and the second light transmission layer LTL2 may transmit 80% or more and 95% or less of the light. Each of the first light transmission layer LTL1 and the second light transmission layer LTL2 may include a polymer material that can transmit the provided UV (Ultraviolet) light.

[0150] The thickness of the first barrier layer BRL1 and the thickness of the first sub-base layer SBL1 may be different. The thickness of the first sub-base layer SBL1 may be greater than the thickness of the first barrier layer BRL1. For example, the thickness of the first sub-base layer SBL1 may be greater than 5 μm and less than 15 μm, and the thickness of the first barrier layer BRL1 may be greater than 0.3 μm and less than 0.7 μm. The description of the second barrier layer BRL2 and the second sub-base layer SBL2 is the same as the description of the first barrier layer BRL1 and the first sub-base layer SBL1.

[0151] The thickness of the first barrier layer BRL1 and the second barrier layer BRL2 is as thin as 0.3 μm or more and 0.7 μm or less, and therefore may collapse when a space is formed below the first barrier layer BRL1 and below the second barrier layer BRL2. That is, when the first light-transmitting layer LTL1 is not configured in the first opening portion OP1 and the second light-transmitting layer LTL2 is not configured in the second opening portion OP2, each of the first barrier layer BRL1 and the second barrier layer BRL2 may be isolated in the portion overlapping with the first opening portion OP1 and the second opening portion OP2 due to gravity. According to one embodiment of the utility model, by configuring the first light-transmitting layer LTL1 in the first opening portion OP1 and configuring the second light-transmitting layer LTL2 in the second opening portion OP2, the step between the first barrier layer BRL1 and the second barrier layer BRL2 may disappear, thereby preventing the phenomenon of each of the first barrier layer BRL1 and the second barrier layer BRL2 overlapping with the non-pad area NPA being isolated due to the step. Thus, a reliable display device DD (refer to Figure 1 ).

[0152] Figure 9a is a perspective view showing a portion of a display panel according to an embodiment of the present invention. Figure 9b It is along Figure 9a A cross-sectional view taken along line IV-IV' is shown.

[0153] Reference Figure 9a as well as Figure 9b In the base layer BLb of the display panel DPb according to an embodiment of the present invention, a single opening OPb may be formed. Specifically, the opening OPb may overlap with the display pad SD and a portion of the plurality of signal lines SGL in a plane in the connection area CA. The light transmission layer LTLb may be disposed in the opening OPb. That is, the light transmission layer LTLb may overlap with the display pad SD and a portion of the plurality of signal lines SGL in a plane.

[0154] According to an embodiment of the present invention, the light transmission layer LTLb may be configured to surround the entire display pad SD on a plane. According to the light transmission layer LTLb being configured to surround the entire display pad SD on a plane, light transmitted through the light transmission layer LTLb may be provided to the conductive adhesive component ACF (refer to Figure 6 ) for effective light curing.

[0155] Fig.10a It is a cross-sectional view of a portion of a display device according to an embodiment of the present invention. Fig.10b is a cross-sectional view of a portion of a display device according to an embodiment of the present utility model. Specifically, Fig.10a1 is an exploded cross-sectional view of the display device showing a state before the display panel DP and the circuit board CB are attached via the conductive adhesive member ACF. Fig.10b 1 is an exploded cross-sectional view of the display device DD showing a state after the display panel DP and the circuit board CB are attached via the conductive adhesive member ACF.

[0156] Reference Fig.10a as well as Fig.10b , the display device DD may include a display panel DP, a conductive adhesive member ACF, and a circuit substrate CB. Fig.10a 1 shows a cross section in which each of the display panel DP, the conductive adhesive component ACF, and the circuit substrate CB is decomposed and separated from each other. Fig.10b , the display panel DP, the conductive adhesive component ACF, and the circuit substrate CB are shown in a state where the display panel DP, the conductive adhesive component ACF, and the circuit substrate CB are combined with each other. That is, the display device DD of one embodiment of the utility model can be a state where at least a part of the structure of the display panel DP is in contact with the conductive adhesive component ACF, and at least a part of the structure of the circuit substrate CB is in contact with the conductive adhesive component ACF. The conductive adhesive component ACF is arranged between the display panel DP and the circuit substrate CB to electrically connect the display panel DP and the circuit substrate CB. The conductive adhesive component ACF can electrically connect the circuit pad LD and the display pad SD.

[0157] The conductive adhesive component ACF may include a plurality of conductive balls CR and an adhesive resin BR in which the plurality of conductive balls CR are dispersed. When the conductive adhesive component ACF is crimped between the circuit substrate CB and the display panel DP, the plurality of conductive balls CR aligned in the first direction DR1 may electrically connect the circuit pad LD of the circuit substrate CB and the display pad SD of the display panel DP. The conductive adhesive component ACF may be an anisotropic conductive film (ACF).

[0158] According to one embodiment of the present invention, the conductive adhesive component ACF may include a photoinitiator. The conductive adhesive component ACF may include a base resin and a photoinitiator. The conductive adhesive component ACF may be a photocurable resin layer. For example, the conductive adhesive component ACF may be composed of a UV (Ultraviolet) curable resin. The conductive adhesive component ACF may be activated by light and cured by light. For example, the conductive adhesive component ACF may be a resin layer cured by ultraviolet light having a wavelength of greater than 300nm and less than 400nm. The conductive adhesive component ACF may be a component that has adhesion as it is cured by light when the display device DD according to one embodiment of the present invention is manufactured.

[0159] When the display device DD is manufactured, the irradiated light can be transmitted through the light transmission layer LTL configured in the opening OP and provided to the conductive adhesive component ACF. The display device DD according to an embodiment of the utility model can be configured with a light transmission layer LTL with high light transmittance in the opening OP, so that a part of the light provided to the display device DD is transmitted through the display panel DP to effectively cure the conductive adhesive component ACF. For example, when the display device DD is irradiated with light for 2 seconds, 97% of the conductive adhesive component ACF can be cured.

[0160] The conductive adhesive component ACF may include a pad bonding portion AF1 configured to overlap the pad area PA and a non-pad bonding portion AF2 configured to overlap the non-pad area NPA. When the display device DD according to an embodiment of the present invention is manufactured and irradiated with light, the pad bonding portion AF1 may be cured by reflected or diffracted light, and the non-pad bonding portion AF2 may be cured by direct light.

[0161] The circuit substrate CB may include a circuit base layer BL-F, a plurality of circuit pads LD disposed on the circuit base layer BL-F, and a non-conductive adhesive member disposed between the circuit pads LD. Fig.10a as well as Fig.10b The circuit board CB shown in the figure may represent the printed circuit board CF described above (see Figure 6 ) and driver chip DC (refer to Figure 6 )

[0162] The circuit substrate layer BL-F may include a flexible material. For example, the circuit substrate layer BL-F may be a polyimide film having a flexible property. The circuit substrate layer BL-F may be a transparent or opaque polyimide film as required.

[0163] The circuit pad LD can be arranged on the circuit base layer BL-F. Fig.10a as well as Fig.10b The circuit pad LD shown in the figure can be mounted on the printed circuit substrate CF (see Figure 6 ) of the substrate pad CF-PD (refer to Figure 6 ) and mounted on the driver chip DC (refer to Figure 6 ) chip pad DC-PD (refer to Figure 6 )

[0164] The plurality of circuit pads LD of the circuit substrate CB corresponds to the plurality of display pads SD of the display panel DP. The spacing between the circuit pads LD adjacent to each other in the first direction DR1 may be the same as the spacing between the display pads SD adjacent to each other in the first direction DR1. The width W1 of each of the plurality of circuit pads LD in the first direction DR1 may be greater than the width W2 of each of the plurality of display pads SD in the first direction DR1. That is, each of the plurality of circuit pads LD may be configured to overlap each of the pad areas PA of the display panel DP only in part. The width W2 of the display pad SD is relatively narrower than the width W1 of the circuit pad LD, so that the width of the pad bonding portion AF1 in the first direction DR1 may be relatively narrower than the width W1 of the circuit pad LD. Thus, when the display device DD is manufactured and light is irradiated, the amount of light reaching the pad bonding portion AF1 may be increased, the light curing degree and the bonding degree of the pad bonding portion AF1 may be increased, and the reliability of the display device DD may be improved.

[0165] The above description is made with reference to the preferred embodiments of the utility model, but it is understandable to those skilled in the art or those with general knowledge in the technical field that various modifications and changes can be made to the utility model without departing from the concept of the utility model and the scope of the technical field as recorded in the attached claims.

[0166] Therefore, the technical scope of the present invention is not limited to the contents described in the detailed description of the specification, but should be determined by the claims.

Claims

1. A display device, characterized in that: include: A circuit substrate, comprising a plurality of circuit pads; The display panel comprises a plurality of pad regions and a plurality of non-pad regions alternately arranged with the plurality of pad regions along a first direction; as well as A conductive adhesive component electrically connects the circuit substrate and the display panel, The display panel comprises: a base layer including a plurality of openings overlapping each of the plurality of non-pad regions; a light-transmitting layer disposed in the plurality of openings and having a higher light transmittance than the base layer; and A plurality of display pads corresponds to each of the plurality of circuit pads and is arranged along the first direction to overlap each of the plurality of pad regions on a plane.

2. The display device according to claim 1, characterized in that The openings are arranged along the first direction and do not overlap with the plurality of pad regions.

3. The display device according to claim 1, characterized in that The light-transmitting layer is in direct contact with an opening surface of the base layer that defines the opening.

4. The display device according to claim 3, characterized in that The light-transmitting layer is configured to fill the opening.

5. The display device according to claim 1, characterized in that The base layer includes a first barrier layer disposed below the display pad and a first sub-base layer disposed below the first barrier layer. The first barrier layer is configured to overlap the plurality of pad regions and the plurality of non-pad regions on a plane. The first sub-base layer includes a first opening portion arranged to overlap each of the plurality of non-pad regions in a plane.

6. The display device according to claim 5, characterized in that: The light-transmitting layer is configured to fill the first opening.

7. The display device according to claim 5, characterized in that: The base layer further includes a second barrier layer disposed below the first sub-base layer and a second sub-base layer disposed below the second barrier layer. The second barrier layer is configured to overlap the plurality of pad regions and the plurality of non-pad regions. The second sub-base layer includes a second opening corresponding to the first opening.

8. The display device according to claim 7, characterized in that: The light-transmitting layer is configured to fill the second opening.

9. The display device according to claim 1, characterized in that: A pitch of each of the plurality of display pads in the first direction is the same as a pitch of each of the plurality of circuit pads in the first direction.

10. The display device according to claim 1, characterized in that A width of each of the plurality of display pads in the first direction is smaller than a width of each of the plurality of circuit pads in the first direction.

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