Pin processing device of super-radiation light-emitting diode

Abstract

The utility model provides a pin processing device of a superluminescent diode, which comprises a lower die and an upper die which are mutually buckled, the top surface of the lower die is provided with a lower cavity, the top surface of the upper die is provided with an upper cavity matched with the lower cavity, and the lower cavity and the upper cavity are used for accommodating an SLD (Super Luminescent Diode); the top face of the lower die and the bottom face of the upper die are provided with a convex part and a concave part which abut against each other in a matched mode and used for bending pins on the two sides of the SLD. A cutter is arranged on the top face of the lower die or the bottom face of the upper die and used for cutting off redundant pins on the two sides of the SLD, and the cutter is located on the outer side of the convex portion or the concave portion. The SLD is fixed through the cooperation of the upper cavity and the lower cavity, the pins on the two sides of the SLD are bent through the abutting cooperation of the convex part and the concave part, the redundant pins can be cut off through the cutter on the outer side of the convex part or the concave part, the multiple pins on the two sides of the SLD can be bent and cut off at the same time, operation is easy, and efficiency is high.

Description

Technical Field

[0001] The present application relates to the technical field of superluminescent diode manufacturing, and in particular to a pin processing device for a superluminescent diode. Background Art

[0002] Superluminescent diodes (SLDs) have developed rapidly in recent years. They are semiconductor optoelectronic devices between lasers (LDs) and light-emitting diodes (LEDs). They have the characteristics of high output power and wide spectral width, and are suitable for applications such as optical coherence tomography (OCT) imaging systems and fiber optic gyroscopes (FOGs).

[0003] When in use, a super luminescent diode (SLD) needs to be connected to a driving circuit module. The super luminescent diode (SLD) is generally a butterfly package with relatively long device pins, which need to be bent and sheared during the welding process.

[0004] The traditional SLD pin processing method requires manually bending the pins to the corresponding shape and cutting off the excess pins. Manual pin processing requires the operator to have corresponding operation experience. Improper processing may cause problems such as cold soldering, short circuit, and unsightly appearance in subsequent welding. In addition, SLD is an electrostatically sensitive device, and improper operation may permanently damage the SLD. Summary of the invention

[0005] The present application provides a pin processing device for a superluminescent diode, which solves the problem that the traditional SLD pin processing method requires manually bending the pins to a corresponding shape and cutting off excess pins. Improper operation can easily lead to problems such as cold soldering, short circuits, and unsightly appearance in subsequent welding.

[0006] The present application provides a pin processing device for a superluminescent diode, comprising a lower mold and an upper mold that are interlocked with each other, the top surface of the lower mold is provided with a lower cavity, the top surface of the upper mold is provided with an upper cavity that matches the lower cavity, and the lower cavity and the upper cavity are used to accommodate the SLD; the top surface of the lower mold and the bottom surface of the upper mold are provided with convex parts and concave parts that abut against each other and are used to bend the pins on both sides of the SLD; the top surface of the lower mold or the bottom surface of the upper mold is provided with a cutter for cutting off excess pins on both sides of the SLD, and the cutter is located on the outside of the convex part or the concave part.

[0007] In the technical solution provided in the present application, the SLD is pressed and fixed by the cooperation of the upper cavity and the lower cavity, the pins on both sides of the SLD are bent by the abutment cooperation of the convex part and the concave part, and the redundant pins can be cut off by the cutter on the outside of the convex part or the concave part. Multiple pins on both sides of the SLD can be bent and cut at the same time, which is simple to operate and highly efficient, and can not only ensure the consistency of the bending shape and the retained length of the SLD pins, but also prevent the SLD from being damaged by static electricity due to improper operation.

[0008] In some embodiments, the edges of the protrusion and the recess are chamfered to avoid damage to the pins during the bending process.

[0009] In some embodiments, an elastic pressing piece is provided on the abutting surface of the convex portion and the concave portion, which is used to press the root of the tube pin when bending, so as to avoid damage to the root of the tube pin caused by pulling when bending.

[0010] In some embodiments, the elastic pressure piece includes a spring and a pressure plate, one end of the spring is fixed on the abutment surface of the convex portion or the concave portion, and the pressure plate is fixed on the other end of the spring. When bent, the pressure plate presses on the pins on both sides of the SLD.

[0011] In some embodiments, the top surface of the lower mold or the bottom surface of the upper mold is provided with a cutting groove that cooperates with a cutter, so that the cutter can conveniently cut off excess pins and extend the service life of the cutter.

[0012] In some implementations, the pin processing device is made of a rigid antistatic material, which can prevent electrostatic damage to the SLD when the pins of the SLD are bent or cut.

[0013] The above description is only an overview of the technical solution of the present application. In order to more clearly understand the technical means of the present application, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are listed below. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] The drawings in this application are used to illustrate preferred embodiments, so that those skilled in the art can clearly understand various other advantages and benefits, and should not be considered as limitations of this application. In addition, the same reference numerals are used throughout the drawings to represent the same or similar components.

[0015] Figure 1 This is a front structural schematic diagram of a pin processing device in one embodiment of the present application;

[0016] Figure 2 This is a schematic diagram of a state before a pin processing device in an embodiment of the present application bends a pin;

[0017] Figure 3 A three-dimensional diagram of a pin processing device in an embodiment of the present application;

[0018] Icons: 1. Lower die; 2. Upper die; 3. Lower cavity; 4. Upper cavity; 5. SLD; 6. Protrusion; 7. Concave part; 8. Pin; 9. Cutter; 10. Spring; 11. Pressing sheet; 12. Grooving. DETAILED DESCRIPTION

[0019] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with specific embodiments. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0020] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0021] In the description of the embodiments of the present application, the technical terms "first", "second", etc. are only used to distinguish different objects, and cannot be understood as indicating or implying relative importance or implicitly indicating the number, specific order or primary and secondary relationship of the indicated technical features. In the description of the embodiments of the present application, the meaning of "multiple" is more than two (including two), unless otherwise clearly and specifically defined.

[0022] In the description of the embodiments of the present application, the term "and / or" is only a description of the association relationship of the associated objects, indicating that there may be three relationships. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this article generally indicates that the associated objects before and after are in an "or" relationship.

[0023] In the description of the embodiments of the present application, the technical terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, which are only for the convenience of describing the embodiments of the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the embodiments of the present application.

[0024] In the description of the embodiments of the present application, unless otherwise clearly specified and limited, technical terms such as "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the internal connection of two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present application can be understood according to the specific circumstances.

[0025] See also Figure 1-Figure 3 The embodiment of the present application provides a pin processing device for a superluminescent diode, including a lower mold 1 and an upper mold 2 that are interlocked with each other, the top surface of the lower mold 1 is provided with a lower cavity 3, the top surface of the upper mold 2 is provided with an upper cavity 4 that matches the lower cavity 3, and the lower cavity 3 and the upper cavity 4 are used to accommodate SLD5; the top surface of the lower mold 1 and the bottom surface of the upper mold 2 are provided with a convex portion 6 and a concave portion 7 that abut against each other and are used to bend the pins 8 on both sides of SLD5; the top surface of the lower mold 1 or the bottom surface of the upper mold 2 is provided with a cutter 9 for cutting off the redundant pins 8 on both sides of SLD5, and the cutter 9 is located on the outside of the convex portion 6 or the concave portion 7.

[0026] In the technical solution provided in the present application, SLD5 is pressed and fixed by the cooperation between the upper cavity 4 and the lower cavity 3, and the pins 8 on both sides of SLD5 are bent by the abutment cooperation between the convex portion 6 and the concave portion 7. The redundant pins 8 can be cut off by the cutter 9 on the outside of the convex portion 6 or the concave portion 7. Multiple pins 8 on both sides of SLD5 can be bent and cut at the same time, which is simple to operate and highly efficient. It can not only ensure the consistency of the bending shape and the retained length of the SLD5 pins 8, but also prevent the SLD5 from being damaged by static electricity due to improper operation.

[0027] In this embodiment, the convex portion 6 is arranged on the top surface of the lower mold 1 and is located on both sides of the lower cavity 3, and the concave portion 7 is arranged on the bottom surface of the upper mold 2 and is located on both sides of the upper cavity 4 (in the specific implementation process, the positions of the convex portion 6 and the concave portion 7 can be flexibly adjusted according to actual conditions); the depth of the lower cavity 3 matches the vertical distance from the bottom surface of SLD5 to the pin 8, and the depth of the upper cavity 4 is slightly larger than the vertical distance from the top surface of SLD5 to the pin 8, so as to avoid damage to SLD5 due to excessive pressure when the pin 8 is bent and cut.

[0028] Please continue reading Figures 1 to 3 In some embodiments, the edges of the protrusion 6 and the recess 7 (edges that serve to bend the tube pin 8) are chamfered structures to avoid damaging the tube pin 8 during the bending process (right-angle edges can easily cut the tube pin 8).

[0029] In some embodiments, an elastic pressing piece is provided on the bottom surface of the recess 7 to press the root of the pin 8 when bending, so as to avoid damage caused by pulling the root of the pin 8 when bending.

[0030] Please continue reading Figures 1 to 3 In some embodiments, the elastic pressure piece includes a spring 10 and a pressing plate 11, one end of the spring 10 is fixed on the bottom surface of the recess 7, and the pressing plate 11 is fixed on the other end of the spring 10. When bent, the pressing plate 11 presses on the pins 8 on both sides of SLD5, and the pins 8 on both sides of SLD5 rest on the top surface of the convex portion 6 on both sides of the lower cavity 3.

[0031] In a specific implementation, the elastic pressing piece may also be replaced by a spring sheet, an elastic sheet or other elastic component, as long as the root of the tube pin 8 can be pressed during the bending process.

[0032] Please continue reading Figures 1 to 3 In some embodiments, the top surface of the lower mold 1 or the bottom surface of the upper mold 2 is provided with a cutting groove 12 that cooperates with the cutter 9, which can facilitate the cutter 9 to cut off excess pins 8 and extend the service life of the cutter 9.

[0033] In a specific embodiment, the cutter 9 and the upper mold 2 can be connected in a detachable structure to facilitate replacement of the cutter 9.

[0034] In some embodiments, the pin processing device is made of a rigid antistatic material (such as an antistatic ABS material), which can avoid electrostatic damage to the SLD5 when the pin 8 of the SLD5 is bent or cut; the antistatic ABS material has good impact resistance, high rigidity, good dimensional stability, and stable chemical properties. The surface resistivity is 10 to the 10th power, and the electrical insulation performance is good.

[0035] In a specific embodiment, a handle (not shown in the figure) may be provided on the top surface of the upper mold 2 to facilitate the operation of pressing the upper mold 2 downward to bend and cut the pins 8 on both sides of the SLD5.

[0036] In a specific embodiment, the top surface of the upper mold 2 can also be provided with a joint connected to a press (not shown in the figure), so as to facilitate the upper mold 2 to be driven downward by the press to automatically bend and cut the pins 8 on both sides of the SLD5.

[0037] The method of using the pin processing device of this embodiment is as follows:

[0038] First, place SLD5 into the lower cavity 3 of the lower mold 1, and then buckle the upper mold 2 on the lower mold 1 to ensure that the upper cavity 4 is aligned with the lower cavity 3, so that the pressing sheets 11 on both sides of the upper cavity 4 are pressed on the pins 8 on both sides of SLD5, and then continue to press down the upper mold 2 to make the convex part 6 and the concave part 7 abut against each other, and bend the pins 8 on both sides of SLD5 until the cutters 9 on both sides extend into the corresponding cutting grooves 12 to cut off the excess pins 8, thus completing the bending and cutting process of the SLD5 pins 8.

[0039] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, a person of ordinary skill in the art should understand that the technical solutions described in the aforementioned embodiments can still be modified, or some or all of the technical features therein can be replaced by equivalents; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application, and they should all be included in the scope of the claims and specification of the present application. In particular, as long as there is no contradiction or conflict, the various technical features mentioned in the embodiments can be combined in any way. The present application is not limited to the specific embodiments disclosed herein, but includes all technical solutions that fall within the scope of the claims.

Claims

1. A pin processing device for a superluminescent diode, characterized in that: The invention comprises a lower mould (1) and an upper mould (2) which are interlocked with each other, wherein the top surface of the lower mould (1) is provided with a lower cavity (3), and the top surface of the upper mould (2) is provided with an upper cavity (4) which matches the lower cavity (3), and the lower cavity (3) and the upper cavity (4) are used to accommodate an SLD (5); the top surface of the lower mould (1) and the bottom surface of the upper mould (2) are provided with a convex portion (6) and a concave portion (7) which abut against each other and are used to bend the pins (8) on both sides of the SLD (5); the top surface of the lower mould (1) or the bottom surface of the upper mould (2) is provided with a cutter (9) which is used to cut off the redundant pins (8) on both sides of the SLD (5), and the cutter (9) is located on the outside of the convex portion (6) or the concave portion (7).

2. The pin processing device of a superluminescent diode according to claim 1, characterized in that: The edges of the convex portion (6) and the concave portion (7) are chamfered structures.

3. The pin processing device of a superluminescent diode according to claim 1, characterized in that: An elastic pressing piece is provided on the surface where the convex portion (6) and the concave portion (7) abut against each other.

4. The pin processing device of a superluminescent diode according to claim 3, characterized in that: The elastic pressing piece comprises a spring (10) and a pressing sheet (11), one end of the spring (10) is fixed on the abutment surface of the convex part (6) or the concave part (7), and the pressing sheet (11) is fixed on the other end of the spring (10).

5. The pin processing device of a superluminescent diode according to claim 1, characterized in that: The top surface of the lower die (1) or the bottom surface of the upper die (2) is provided with a cutting groove (12) that cooperates with the cutting knife (9).

6. The pin processing device of a superluminescent diode according to claim 1, characterized in that: The pin processing device is made of rigid antistatic material.

Images