Multi-evaporation-source turnover type evaporation equipment
By designing multi-evaporation source turnover evaporation equipment, using four independent evaporation chambers and symmetrical evaporation sources and evaporation hole structures, the problems of material ratio differences and evaporation crosstalk in existing equipment are solved, and the substrate surface is realized Uniform mixing of multiple materials and uniform coating thickness.
Patent Information
- Application Number
- CN202420142089.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-01-19
- Publication Date
- 2025-01-21
- Estimated Expiration
- 2034-01-19
AI Technical Summary
In the field of large-size evaporation deposition, the fixed position of the evaporation source causes large differences in the proportion of materials in different evaporation areas, making it difficult to achieve uniform mixing of film layer materials, and evaporation crosstalk problems are prone to occur, resulting in uniform proportions. Sexuality is uncontrollable.
Design a multi-evaporation source turnover evaporation equipment. Four independent evaporation chambers and four evaporation sources are set up in the evaporation box. Each evaporation source is located in the angle bisector of the evaporation chamber. The evaporation sources and evaporation sources The structure of the plating hole is symmetrical. The outline of the evaporation hole is a fan-like structure with a concave waist. The substrate rotates at a constant speed around the central axis of the evaporation box in a horizontal state. The material is deposited on the lower surface of the substrate through the evaporation hole.
It achieves uniform mixed evaporation of multiple materials on the surface of the substrate, avoids crystal crosstalk problems, and ensures the uniformity of the proportion of coating materials and the uniformity of coating thickness.
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Figure CN222374753U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of evaporation, in particular to a multi-evaporation source rotary evaporation device. Background Art
[0002] Vacuum evaporation, referred to as evaporation, refers to the evaporation or sublimation of traditional deposition materials to form gaseous particles under vacuum conditions by means of electric current heating, electron beam bombardment or laser heating. The gaseous particles are deposited on the substrate through basically collisionless linear motion under high vacuum conditions. When the number of aggregated particles exceeds a certain critical value, they become stable nuclei, and then continue to adsorb and diffuse particles and gradually grow. Finally, through the contact and merging of adjacent stable nuclei, a continuous film is formed. Existing evaporation equipment is mainly divided into two types in structure: cluster type and linear type evaporation equipment. The evaporation chambers in the cluster type are distributed around the robot arm chamber, and the linear type evaporation chambers are distributed in a linear form.
[0003] Cluster-type evaporation equipment is widely used in the field of OLED (organic light-emitting display), but due to its complex alignment and transmission structure, it has a large cost disadvantage in the field of large-size evaporation, which makes it difficult to be widely used in the highly cost-sensitive photovoltaic field. Linear evaporation equipment has great advantages in the field of large-size evaporation due to its simple structure and wide applicability, but due to the fixed position of the evaporation source, the material ratio in different evaporation areas is different, and the ratio of co-evaporated materials in the early and late stages of evaporation is quite different, which is not conducive to the uniform mixing of film materials.
[0004] Chinese patent CN215050643U discloses a vapor deposition device, where a circular substrate rotates around a central axis at the top, and a plurality of stations are evenly distributed around the central axis in a vacuum chamber at the bottom, and each station is provided with a plurality of evaporation sources, which rotate around an axis deviating from the central axis in their respective stations, so that a variety of materials are mixed and vapor deposited on the lower surface of the substrate. However, if some vapor deposition materials are dispersed in the same vapor deposition space, vapor deposition crosstalk problems will occur, resulting in the inability to control the uniformity of the vapor deposition ratio.
[0005] Therefore, it is necessary to develop a new evaporation equipment to solve the above problems. Utility Model Content
[0006] The main purpose of the utility model is to provide a multi-evaporation source rotary evaporation device, which can evenly coat the surface of a substrate with a coating composed of multiple materials.
[0007] The utility model achieves the above-mentioned purpose through the following technical solutions: a multi-evaporation source turnover type evaporation equipment, including an evaporation box, a turnover component, a baffle and four evaporation sources;
[0008] The evaporation box has a central axis along the vertical direction, and the inner cavity of the evaporation box is divided into four independent evaporation chambers by two partitions perpendicularly intersecting the central axis;
[0009] The turnover assembly is located at the upper part of the inner cavity and rotates around the central axis. The turnover assembly includes a plurality of rotating platforms evenly distributed around the central axis, and the rotating platforms position the substrate;
[0010] The four evaporation sources are arranged at the same height and at the same distance from the central axis;
[0011] The baffle is arranged horizontally and connects the upper parts of all the partitions. Four evaporation holes are arranged on the baffle in a 90° rotational symmetric manner. The evaporation holes are arranged at the top of each evaporation cavity.
[0012] Specifically, the four evaporation sources are respectively located in the angular bisectors of the four evaporation chambers, and the structures of the evaporation holes of the evaporation sources are symmetrical with the angular bisectors of the evaporation chambers where they are located.
[0013] Furthermore, the contour of the evaporation hole is a fan-shaped structure with a concave waist, and the area of the evaporation hole is divided into a number of arcs centered on the center of the circle. All evaporation holes have an outer arc and an inner arc. All outer arcs share a circle A, and all inner arcs share a circle B. The centers of the circles A and B are both located on the central axis. The center angle of the arc first decreases monotonically and then increases monotonically from the inner arc to the outer arc. The center angle of the inner arc is α, and the center angle of the arc passing through the lower projection position of the evaporation hole is the minimum value β. The center angle of the outer arc is γ, β<α=γ<90°.
[0014] Specifically, a gate valve is provided on each side of the evaporation box, and outside the two gate valves are a feed line and a discharge line respectively.
[0015] Furthermore, each rotating platform is provided with a conveying mechanism, and the conveying mechanism includes a plurality of magnetic fluid rollers for moving the substrate along the radial direction of the turnover assembly.
[0016] Specifically, each evaporation chamber is provided with a crystal oscillator probe for measuring the evaporation rate.
[0017] The beneficial effects of the technical solution of the utility model are:
[0018] The device isolates the evaporation space of each material, allowing the substrate to move horizontally around the central axis of the evaporation box at a uniform speed. The material evaporated by the evaporation source passes through the evaporation holes and is deposited on the lower surface of the substrate. Therefore, the substrate circulates through each evaporation area to allow multiple materials to be mixed and evaporated on the lower surface of the substrate, avoiding the problem of crystal oscillator crosstalk. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] Figure 1It is a layout diagram of a multi-evaporation source rotary evaporation deposition equipment according to an embodiment;
[0020] Figure 2 is a positional relationship diagram between the evaporation box and the evaporation source;
[0021] Figure 3 is the position relationship diagram of the turnover mechanism and the evaporation source;
[0022] Figure 4 Schematic diagram of the evaporation pore structure.
[0023] The numbers in the figure represent:
[0024] 1-Multi-evaporation source rotary evaporation equipment,
[0025] 11-evaporation box, 111-partition, 112-evaporation chamber, 113-gate valve, 114-crystal oscillator probe;
[0026] 12-revolving assembly, 121-rotating platform, 122-magnetic fluid roller,
[0027] 13- baffle, 131- evaporation hole, 1311- inner arc, 1312- outer arc,
[0028] 14- Evaporation source,
[0029] 15a-feeding line, 15b-discharging line;
[0030] 2-Substrate. DETAILED DESCRIPTION
[0031] The utility model is further described in detail below in conjunction with specific embodiments.
[0032] Example:
[0033] like Figure 1 As shown, the multi-evaporation source turnover evaporation equipment 1 of the utility model comprises an evaporation box 11, a turnover assembly 12, a baffle 13 and four evaporation sources 14; the evaporation box 11 has a central axis along the vertical direction, and the inner cavity of the evaporation box 11 is divided into four independent evaporation chambers 112 by two partitions 111 perpendicularly intersecting the central axis; the turnover assembly 12 is located at the upper part of the inner cavity and rotates around the central axis, the turnover assembly 12 comprises a plurality of rotating platforms 121 evenly distributed around the central axis, and the rotating platforms 121 position the substrate 2; the four evaporation sources 14 are arranged at the same height and at the same distance from the central axis; the baffle 13 is arranged horizontally and connects the upper parts of all the partitions 111, and four evaporation holes 131 are arranged on the baffle 13 in 90° rotational symmetry, and the evaporation holes 131 are arranged at the top of each evaporation chamber 112.
[0034] This device isolates the evaporation space of each material, allowing the substrate 2 to move in a horizontal state around the central axis of the evaporation box 11 at a uniform speed. The material evaporated by the evaporation source 14 passes through the evaporation holes 131 and is deposited on the lower surface of the substrate 2. Therefore, the substrate 2 circulates through each evaporation hole 131 to allow up to four materials to be mixed and evaporated on the lower surface, avoiding the problem of crystal oscillator crosstalk. Because the evaporation working conditions are consistent regardless of how many substrates 2 are evaporated at the same time, the number of rotating platforms 121 and the number of evaporation chambers 112 may not be the same. The ratio of each material is independently controlled by its own evaporation efficiency to ensure that the material is deposited on the lower surface of the substrate 2 in a stable ratio.
[0035] like Figures 1 to 3 As shown, the four evaporation sources 14 are respectively located in the angular bisectors of the four evaporation chambers 112 , and the structures of the evaporation holes 131 are symmetrical with respect to the angular bisectors of the evaporation chambers 112 where they are located.
[0036] Such a design enables the evaporation source 14 to be located below the symmetry axis of each evaporation hole 131 , and the average distance from the evaporation source 14 to each location of the evaporation hole 131 is shorter, so the average evaporation speed is faster.
[0037] like Figure 4 The outline of the evaporation hole 131 is a fan-shaped structure with a concave waist. All the evaporation holes 131 have an inner arc 1311 and an outer arc 1312. All the inner arcs 1311 share a circle A, and all the outer arcs 1312 share a circle B. The centers of circle A and circle B are both located on the central axis. The area of the evaporation hole 131 is divided into a number of arcs centered on the center of the circle. The central angle of the arc decreases monotonically from the inner arc to the outer arc and then increases monotonically. The central angle of the inner arc 1311 is α, and the central angle of the arc passing through the lower projection position of the evaporation hole 131 is the minimum value β. The central angle of the outer arc is γ, β<α=γ<90°.
[0038] For the deposition of each material, the thickness on the entire coating surface needs to be uniform, which depends on the evaporation time and the evaporation speed. The evaporation time of each position on the substrate 2 is the time exposed in the evaporation hole 131. Because the angular velocity of any point on the substrate 2 in circular motion is constant, the evaporation time depends on the center angle of the arc. However, the evaporation rate is not a constant value, because the distance from all points to the evaporation source 14 changes during the movement, and the closer the arc is to the evaporation source 14, the higher the average evaporation rate is. Therefore, if the evaporation hole 131 is set as a simple fan-shaped structure, the thickness of the coating will be thick in the middle and thin on both sides. In order to avoid this situation, the center angle of each arc of the evaporation hole 131 will first decrease and then increase, and the minimum value of the center angle β will appear at the arc where the projection under the evaporation source 14 is located.
[0039] like Figure 1As shown, a gate valve 113 is provided on each side of the evaporation box 11, and a feed line 15a and a discharge line 15b are provided outside the two gate valves 113 respectively. A conveying mechanism is provided on each rotating platform 121, and the conveying mechanism includes a plurality of magnetic fluid rollers 122 that move the substrate 2 radially along the turnover component.
[0040] The feed line 15a can realize the automatic loading of the substrate 2, and the discharge line 15b can realize the automatic unloading of the substrate 2. The gate valve 113 is used to isolate the evaporation chamber 112 from the outside during evaporation. The magnetic fluid roller 122 can support both sides of the substrate 2 and then move it to realize the automatic transportation of the substrate 2 before and after evaporation.
[0041] like Figure 1 As shown, each evaporation chamber 112 is provided with a crystal oscillator probe 114 for measuring the evaporation rate.
[0042] The crystal oscillator probe 114 can detect the evaporation rate of the corresponding material in real time, so that each evaporation source 14 can be controlled to evaporate the coating material according to the set evaporation rate ratio, thereby achieving uniformity control of the coating material ratio.
[0043] The working process of the multi-evaporation source rotary evaporation equipment 1 is as follows: the gate valve 113 on one side of the feed line 15a is opened, and the feed line 15a is connected with one of its rotating platforms 121, so that the substrate 2 moves along the radial direction of the rotating component 12 and enters the rotating platform 121, and the substrate 2 is positioned. When there are substrates 2 on all the rotating platforms 121, the gate valve 113 is closed; the four evaporation sources 14 begin to evaporate the material, and the rotating platform 121 rotates around the central axis in the evaporation box 11, so that the material is deposited on the lower surface of the substrate 2, and the crystal oscillator probe 114 monitors the thickness of the coating and the evaporation stops after reaching the designed thickness; the gate valve 113 on one side of the discharge line 15b is opened, and the rotating platform 121 is connected with the discharge line 15b in turn, and the substrate 2 after the coating is completed is moved from the rotating platform 121 to the discharge line 15b.
[0044] The above are only some embodiments of the present invention. For those skilled in the art, several modifications and improvements can be made without departing from the inventive concept of the present invention, which all belong to the protection scope of the present invention.
Claims
1. A multi-evaporation source rotary evaporation equipment, characterized in that: It includes an evaporation box, a turnover assembly, a baffle and four evaporation sources; The evaporation box has a central axis along the vertical direction, and the inner cavity of the evaporation box is divided into four independent evaporation chambers by two partitions perpendicularly intersecting the central axis; The turnover assembly is located at the upper part of the inner cavity and rotates around the central axis. The turnover assembly includes a plurality of rotating platforms evenly distributed around the central axis, and the rotating platforms position the substrate; The four evaporation sources are arranged at the same height and at the same distance from the central axis; The baffle is arranged horizontally and connects the upper parts of all the partitions. Four evaporation holes are arranged on the baffle in a 90° rotational symmetric manner. The evaporation holes are arranged at the top of each evaporation cavity.
2. The multi-evaporation source rotary evaporation deposition equipment according to claim 1, characterized in that: The four evaporation sources are respectively located in the angular bisectors of the four evaporation chambers, and the structures of the evaporation holes of the evaporation sources are symmetrical with the angular bisectors of the evaporation chambers where they are located.
3. The multi-evaporation source rotary evaporation deposition equipment according to claim 2, characterized in that: The contour of the evaporation hole is a fan-shaped structure with a concave waist. The area of the evaporation hole is divided into a number of arcs centered on the same center of a circle. All evaporation holes have an outer arc and an inner arc. All outer arcs share a circle A, and all inner arcs share a circle B. The centers of the circles A and B are both located on the central axis. The center angle of the arc first decreases monotonically and then increases monotonically from the inner arc to the outer arc. The center angle of the inner arc is α, and the center angle of the arc passing through the lower projection position of the evaporation hole is the minimum value β. The center angle of the outer arc is γ, and β<α=γ<90°.
4. The multi-evaporation source rotary evaporation deposition equipment according to claim 1, characterized in that: A gate valve is respectively arranged on both sides of the evaporation box body, and a feed line and a discharge line are respectively arranged outside the two gate valves.
5. The multi-evaporation source rotary evaporation deposition equipment according to claim 4, characterized in that: Each rotating platform is provided with a conveying mechanism, which includes a plurality of magnetic fluid rollers for moving the substrate along the radial direction of the turnover assembly.
6. The multi-evaporation source rotary evaporation deposition equipment according to claim 1, characterized in that: Each evaporation chamber is provided with a crystal oscillator probe for measuring the evaporation rate.
Citation Information
Patent Citations
A vapor deposition apparatus
CN215050643U
Cited By
Multi-source evaporation equipment
CN224243187U