Water supply device and purified water supply device

Abstract

The utility model discloses a water supply device and a purified water supply device, and relates to the technical field of water supply devices, the water supply device comprises a semiconductor refrigeration unit, the semiconductor refrigeration unit is provided with a cold end used for absorbing heat and a hot end used for releasing heat; the first water storage unit is provided with a first inner cavity, the first inner cavity is used for storing water, and the hot end can dissipate heat through the water in the first inner cavity; the second water storage unit is provided with a second inner cavity, the second inner cavity is used for storing water, and the cold end can absorb heat of the water in the second inner cavity so that the water in the second inner cavity can become cold water. The heat dissipation rate of the hot end of the semiconductor refrigeration unit can be effectively improved, and therefore the refrigeration effect of the cold end of the semiconductor refrigeration unit is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of water supply devices, in particular to a water supply device and a purified water supply device. Background Art

[0002] Semiconductor refrigeration units have the advantages of small size and low price, and are often used in various industries. Semiconductor refrigeration units have a cold end for absorbing heat and a hot end for releasing heat. The heat dissipation of the hot end directly affects the cooling effect of the cold end of the semiconductor refrigeration unit.

[0003] Semiconductor refrigeration units can be used in water supply devices, so that the water supply device can provide cold drinking water for users, and the entire water supply device can be made smaller. Generally speaking, the hot end of the semiconductor refrigeration unit is air-cooled. Even if a fan is added to cool the hot end of the semiconductor refrigeration unit, the heat dissipation rate of the hot end is limited. Especially when the ambient temperature is too high, the cooling effect of the cold end of the semiconductor refrigeration unit is poor, and it is impossible to produce cold water that meets the requirements in a short time. In more serious cases, the temperature of the produced cold water is too high and cannot be further reduced. Utility Model Content

[0004] In order to overcome the above-mentioned defects of the prior art, the technical problem to be solved by the embodiments of the utility model is to provide a water supply device and a purified water supply device, which can solve the problem of low heat dissipation rate of the hot end of the semiconductor refrigeration unit.

[0005] The specific technical solution of the embodiment of the utility model is:

[0006] A water supply device, comprising:

[0007] A semiconductor refrigeration unit having a cold end for absorbing heat and a hot end for releasing heat;

[0008] A first water storage unit having a first inner cavity, wherein the first inner cavity is used to store water, and the hot end can dissipate heat through the water in the first inner cavity;

[0009] A second water storage unit is provided with a second inner cavity, wherein the second inner cavity is used to store water, and the cold end can absorb the heat of the water in the second inner cavity to turn the water in the second inner cavity into cold water.

[0010] Preferably, the hot end achieves heat dissipation through the water in the first inner cavity by means of a first heat exchange element which is at least partially disposed in the first inner cavity and can contact with the water in the first inner cavity.

[0011] Preferably, the first water storage unit has a first shell forming the first inner cavity, the first shell has a minimum liquid level line, and at least part of the first heat exchange element is located below the minimum liquid level line.

[0012] Preferably, the first heat exchange member comprises a first body having a first surface and a second surface corresponding to each other and at least one first heat exchange portion located on the first surface of the first body; at least part of the first heat exchange portion is disposed in the first inner cavity;

[0013] The hot end is in close contact with the second surface of the first body for heat exchange,

[0014] or,

[0015] The hot end is disposed at the second surface of the first body, and a heat conductive material is disposed between the hot end and the second surface of the first body.

[0016] Preferably, the first water storage unit has a first shell forming the first inner cavity, the first shell has a first opening, the first surface of the first body is sealed with the outer wall of the first shell, and part of the first heat exchange element is inserted into the first inner cavity through the first opening.

[0017] Preferably, the first water storage unit has a first shell forming the first inner cavity, the first shell has a first opening, the second surface of the first body is sealed to the inner wall of the first shell; the hot end of the semiconductor refrigeration unit dissipates heat through the first body at the first opening.

[0018] Preferably, a first sealing member is provided between the first surface of the first body and the first shell.

[0019] Preferably, a first fixing member is provided between the first body and the first shell so that the first body and the first shell can press the first sealing member tightly to achieve sealing.

[0020] Preferably, the cold end can contact the water in the second inner cavity through a second heat exchange element at least partially disposed in the second inner cavity to absorb heat from the water in the second inner cavity;

[0021] The first heat exchange member comprises a first body having a first surface and a second surface corresponding to each other and at least one first heat exchange portion located on the first surface of the first body; at least part of the first heat exchange portion is arranged in the first inner cavity; the hot end is arranged on the second surface of the first body;

[0022] The second heat exchange member comprises a second body having corresponding third and fourth surfaces and at least one second heat exchange portion located on the third surface of the second body; at least part of the second heat exchange portion is arranged in the second inner cavity; the cold end is arranged on the fourth surface of the second body;

[0023] The first body and the second body are located between the first shell of the first water storage unit and the second shell of the second water storage unit, and a third fixing member is provided between the first shell of the first water storage unit and the second shell of the second water storage unit to lock the first shell and the second shell, so that the first body and the first shell are kept sealed, and the second body and the second shell are kept sealed;

[0024] or,

[0025] The first shell of the first water storage unit and the second shell of the second water storage unit are located between the first body and the second body, and a third fixing member is provided between the first body and the second body to lock the first body and the second body, so that the first body and the first shell are kept sealed, and the second body and the second shell are kept sealed.

[0026] Preferably, the cold end absorbs heat from the water in the second inner cavity through a second heat exchange element which is at least partially disposed in the second inner cavity and can contact the water in the second inner cavity, so as to convert the water in the second inner cavity into cold water.

[0027] Preferably, the second water storage unit has a second shell forming the second inner cavity, the second shell has a minimum liquid level line, and at least part of the second heat exchange element is located below the minimum liquid level line.

[0028] Preferably, the second heat exchange member comprises a second body having corresponding third and fourth surfaces and at least one second heat exchange portion located on the third surface of the second body; at least part of the second heat exchange portion is disposed in the second inner cavity;

[0029] The cold end is in close contact with the fourth surface of the second body for heat exchange,

[0030] or,

[0031] The cold end is arranged at the fourth surface of the second body, and a heat conductive material is arranged between the cold end and the fourth surface of the second body.

[0032] Preferably, the second water storage unit has a second shell forming the second inner cavity, the second shell has a second opening, the third surface of the second body is sealed with the outer wall of the second shell, and part of the second heat exchange element is inserted into the second inner cavity through the second opening.

[0033] Preferably, the second water storage unit has a second shell forming the second inner cavity, the second shell has a second opening, the fourth surface of the second body is sealed to the inner wall of the second shell; the cold end of the semiconductor refrigeration unit absorbs heat from the second body at the second opening.

[0034] Preferably, a second sealing member is provided between the third surface of the second body and the outer wall of the second shell.

[0035] Preferably, a second fixing member is provided between the second body and the second shell so that the second body and the second shell can press the second sealing member tightly to achieve sealing.

[0036] Preferably, one side of the first shell of the first water storage unit is arranged against one side of the second shell of the second water storage unit, and the semiconductor refrigeration unit is arranged between one side of the first shell of the first water storage unit and one side of the second shell of the second water storage unit.

[0037] Preferably, the side wall of the first shell is disposed against the side wall of the second shell.

[0038] Preferably, the first heat exchange part comprises fins, a plurality of the fins are arranged at intervals in a horizontal direction, and the fins extend in a vertical direction.

[0039] Preferably, the second heat exchange part comprises fins, a plurality of the fins are arranged at intervals in a horizontal direction, and the fins extend in a vertical direction.

[0040] A clean water supply device, comprising:

[0041] A water supply device as described in any one of the above;

[0042] A booster unit and a filter unit connected between the first water storage unit and the second water storage unit, wherein the booster unit can filter the water in the first water storage unit and transfer the filtered clean water to the second water storage unit;

[0043] A first water outlet end, wherein the first water outlet end can be communicated with the second water storage unit.

[0044] Preferably, the clean water supply device further comprises:

[0045] A second water outlet end, wherein the second water outlet end can be communicated with the clean water outlet of the filter unit.

[0046] A clean water supply device, comprising:

[0047] Water inlet end;

[0048] A water supply device as described in any one of the above;

[0049] A filter unit connected between the second water storage unit and the water inlet; the first water storage unit can be communicated with the second water storage unit; or the second water storage unit can be communicated with the clean water outlet of the filter unit;

[0050] A first water outlet end, wherein the first water outlet end can be communicated with the second water storage unit.

[0051] Preferably, the clean water supply device further comprises:

[0052] A second water outlet end, wherein the second water outlet end can be communicated with the clean water outlet of the first water storage unit or the filter unit.

[0053] A clean water supply device, comprising:

[0054] Water inlet end;

[0055] A water supply device as described in any one of the above;

[0056] A filter unit connected between the first water storage unit and the water inlet end, wherein the wastewater end of the filter unit can be communicated with the first water storage unit;

[0057] A first water outlet is connected to the second water storage unit.

[0058] Preferably, the clean water supply device further comprises:

[0059] The second water outlet is communicated with the purified water outlet of the filter unit.

[0060] The technical solution of the utility model has the following significant beneficial effects:

[0061] The hot end of the semiconductor refrigeration unit in the present application can dissipate heat through the water in the first inner cavity of the first water storage unit, which can effectively increase the heat dissipation rate of the hot end of the semiconductor refrigeration unit, thereby improving the refrigeration effect of the cold end of the semiconductor refrigeration unit, so that the water in the second water storage unit can be cooled faster and reach a lower temperature after cooling, thereby enabling the second water storage unit to supply users with cold water that meets their requirements more quickly, thereby improving the user experience.

[0062] With reference to the following description and drawings, specific embodiments of the present invention are disclosed in detail, indicating the manner in which the principles of the present invention can be adopted. It should be understood that the embodiments of the present invention are not limited in scope. Features described and / or shown for one embodiment can be used in one or more other embodiments in the same or similar manner, combined with features in other embodiments, or replace features in other embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0063] The drawings described herein are only for explanation purposes and are not intended to limit the scope of the present invention in any way. In addition, the shapes and proportional dimensions of the components in the drawings are only for illustration purposes to help understand the present invention, and are not intended to specifically limit the shapes and proportional dimensions of the components of the present invention. Under the guidance of the present invention, those skilled in the art can select various possible shapes and proportional dimensions to implement the present invention according to specific circumstances.

[0064] Figure 1 It is a cross-sectional view of the water supply device in the embodiment of the utility model;

[0065] Figure 2 An exploded view of a water supply device in an embodiment of the utility model;

[0066] Figure 3 It is a schematic diagram of the structure of the semiconductor refrigeration unit, the first heat exchange element, and the second heat exchange element in the embodiment of the utility model;

[0067] Figure 4 This is a system diagram of the water purification supply device in the first embodiment of the utility model;

[0068] Figure 5 This is a system diagram of the water purification supply device in the second embodiment of the utility model;

[0069] Figure 6 This is a system diagram of the water purification supply device in the third embodiment of the utility model;

[0070] Figure 7 This is a system diagram of the water purification supply device in the fourth embodiment of the utility model.

[0071] Reference numerals in the above drawings:

[0072] 1. Semiconductor refrigeration unit; 11. Cold end; 12. Hot end; 2. First water storage unit; 21. First inner cavity; 22. First shell; 221. First opening; 3. Second water storage unit; 31. Second inner cavity; 32. Second shell; 4. First heat exchanger; 41. First body; 42. First heat exchanger; 5. Second heat exchanger; 51. Second body; 52. Second heat exchanger; 6. First seal; 7. Second seal; 8. Pressurizing unit; 9. Filter unit; 10. First water outlet; 11. Second water outlet; 12. Water inlet; 13. Wastewater channel. DETAILED DESCRIPTION

[0073] In combination with the accompanying drawings and the description of the specific embodiments of the present invention, the details of the present invention can be more clearly understood. However, the specific embodiments of the present invention described herein are only used to explain the purpose of the present invention and cannot be understood as limiting the present invention in any way. Under the guidance of the present invention, technicians can conceive of any possible variations based on the present invention, which should be regarded as belonging to the scope of the present invention. It should be noted that when an element is referred to as "disposed on" another element, it can be directly on the other element or there can also be a central element. When an element is considered to be "connected" to another element, it can be directly connected to the other element or there may be a central element at the same time. The terms "installed", "connected" and "connected" should be understood in a broad sense, for example, it can be a mechanical connection or an electrical connection, or it can be the internal communication of two elements, it can be directly connected, or it can be indirectly connected through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms can be understood according to the specific circumstances. The terms "vertical", "horizontal", "up", "down", "left", "right" and similar expressions used herein are only for illustrative purposes and do not represent the only implementation method.

[0074] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those generally understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0075] In order to solve the problem of low heat dissipation rate at the hot end of the semiconductor refrigeration unit, a water supply device is proposed in this application. Figure 1 This is a cross-sectional view of a water supply device in an embodiment of the utility model. Figure 2 This is an exploded view of the water supply device in the embodiment of the utility model. Figure 3 FIG. 1 is a schematic diagram of the structure of the semiconductor refrigeration unit, the first heat exchange element, and the second heat exchange element in the embodiment of the utility model. Figures 1 to 3 As shown, the water supply device may include: a semiconductor refrigeration unit 1, the semiconductor refrigeration unit 1 has a cold end 11 for absorbing heat and a hot end 12 for releasing heat; a first water storage unit 2 with a first inner cavity 21, the first inner cavity 21 is used to store water, and the hot end 12 can dissipate heat through the water in the first inner cavity 21; a second water storage unit 3 with a second inner cavity 31, the second inner cavity 31 is used to store water, and the cold end 11 can absorb the heat of the water in the second inner cavity 31 to turn the water in the second inner cavity 31 into cold water.

[0076] The hot end 12 of the semiconductor refrigeration unit 1 in the present application can dissipate heat through the water in the first inner cavity 21 of the first water storage unit 2, which can effectively improve the heat dissipation rate of the hot end 12 of the semiconductor refrigeration unit 1, thereby improving the refrigeration effect of the cold end 11 of the semiconductor refrigeration unit 1, so that the water in the second water storage unit 3 can be cooled faster and reach a lower temperature after cooling, thereby enabling the second water storage unit 3 to supply the user with cold water that meets the requirements more quickly, thereby improving the user experience.

[0077] In order to better understand the water supply device in this application, it will be further explained and illustrated below. Figure 1 and Figure 2 As shown, the first inner cavity 21 of the first water storage unit 2 is used to store water, and the hot end 12 of the semiconductor refrigeration unit 1 can dissipate heat through the water in the first inner cavity 21. The hot end 12 can directly exchange heat with the water in the first inner cavity 21 to dissipate heat, or can indirectly exchange heat with the water in the first inner cavity 21 to dissipate heat.

[0078] Considering that the area of ​​the hot end 12 of the semiconductor refrigeration unit 1 is limited, in order to further improve the heat exchange rate between the hot end 12 of the semiconductor refrigeration unit 1 and water, it is feasible to Figure 1 and Figure 2 As shown, the hot end 12 dissipates heat through the water in the first inner cavity 21 through a first heat exchange element 4 that is at least partially disposed in the first inner cavity 21 and can contact the water in the first inner cavity 21 .

[0079] In some embodiments, in order to ensure that the first heat exchange element 4 can contact the water in the first inner cavity 21 when the first inner cavity 21 is loaded with water to achieve heat dissipation through the water in the first inner cavity 21, the first water storage unit 2 has a first shell 22 forming the first inner cavity 21, and the first shell 22 has a minimum liquid level line, and at least part of the first heat exchange element 4 is located below the minimum liquid level line.

[0080] In some embodiments, Figures 1 to 3As shown, the first heat exchanger 4 may include a first body 41 having a corresponding first surface and a second surface and at least one first heat exchange portion 42 located on the first surface of the first body 41. At least part of the first heat exchange portion 42 is disposed in the first inner cavity 21, and at least part of the first heat exchange portion 42 can contact the water in the first inner cavity 21. As feasible, at least part of the first heat exchange portion 42 can be located below the lowest liquid level line. As feasible, at least part of the first body 41 can be located below the lowest liquid level line. In one embodiment, the hot end 12 can be closely attached to the second surface of the first body 41 for heat exchange to achieve a higher heat exchange rate. In another embodiment, in order to avoid a gap between the hot end 12 and the second surface of the first body 41 to reduce the heat exchange rate, the hot end 12 is disposed at the second surface of the first body 41, and a heat conductive material is disposed between the hot end 12 and the second surface of the first body 41 to achieve a higher heat exchange rate. For example, the heat conductive material can be a material with a high consistency and high thermal conductivity, such as thermal conductive silicone grease.

[0081] Further, such as Figure 1 and Figure 2 As shown, the first shell 22 has a first opening 221. In one embodiment, the first surface of the first body 41 is sealed with the outer wall of the first shell 22, and part of the first heat exchange member 4 is inserted into the first inner cavity 21 through the first opening 221. For example, the first heat exchange part 42 can be inserted into the first inner cavity 21 through the first opening 221 to achieve heat dissipation through the water in the first inner cavity 21. The hot end 12 of the semiconductor refrigeration unit 1 exchanges heat with the second surface of the first body 41. In the above manner, not only the first opening 221 is sealed by the first body 41 to prevent the water in the first inner cavity 21 from leaking out, but also part of the first heat exchange member 4 is inserted into the first inner cavity 21 through the first opening 221 to exchange heat with the water in the first inner cavity 21, thereby releasing the heat of the hot end 12 of the semiconductor refrigeration unit 1 into the water in the first inner cavity 21. In this embodiment, a first sealing member 6 , such as a sealing ring, may be provided between the first surface of the first body 41 and the outer wall of the first shell 22 to ensure sealing between the first surface of the first body 41 and the outer wall of the first shell 22 .

[0082] In another embodiment, the second surface of the first body 41 is sealed with the inner wall of the first shell 22. The hot end 12 of the semiconductor refrigeration unit 1 dissipates heat through the first body 41 at the first opening 221. Specifically, the hot end 12 of the semiconductor refrigeration unit 1 dissipates heat with the second surface of the first body 41 at the first opening 221. In the above manner, not only the first opening 221 is sealed by the first body 41 to prevent the water in the first inner cavity 21 from leaking out, but also the hot end 12 of the semiconductor refrigeration unit 1 dissipates heat through the first body 41 at the first opening 221, thereby releasing the heat of the hot end 12 of the semiconductor refrigeration unit 1 into the water in the first inner cavity 21. In this embodiment, a first sealing member 6, such as a sealing ring, may be provided between the first surface of the first body 41 and the inner wall of the first shell 22 to ensure the sealing between the first surface of the first body 41 and the inner wall of the first shell 22.

[0083] In the above two embodiments, the first body 41 and the first shell 22 may be provided with a first fixing member so that the first body 41 and the first shell 22 press the first sealing member 6 to achieve sealing. For example, the first fixing member may be a screw, a matching bolt, a nut, or the like, which is not limited in the present application.

[0084] like Figures 1 to 3 As shown, the second inner cavity 31 of the second water storage unit 3 is used to store water, and the cold end 11 of the semiconductor refrigeration unit 1 can absorb the heat of the water in the second inner cavity 31 to turn the water in the second cavity 31 into cold water. The cold end 11 can directly exchange heat with the water in the second inner cavity 31 to absorb heat, or can indirectly exchange heat with the water in the second inner cavity 31 to absorb heat. As feasible, the second water storage unit 3 can deliver cold water to the outside.

[0085] Considering that the area of ​​the cold end 11 of the semiconductor refrigeration unit 1 is limited, in order to further improve the heat exchange rate between the cold end 11 of the semiconductor refrigeration unit 1 and water, it is feasible to Figure 1 and Figure 2 As shown, the cold end 11 absorbs the heat of the water in the second inner cavity 31 through the second heat exchange element 5 which is at least partially disposed in the second inner cavity 31 and can contact the water in the second inner cavity 31, so that the water in the second cavity 31 becomes cold water.

[0086] In some embodiments, in order to ensure that the second heat exchange element 5 can contact the water in the second inner cavity 31 to absorb the heat of the water in the second inner cavity 31 when the second inner cavity 31 is loaded with water, the second water storage unit 3 has a second shell 32 forming the second inner cavity 31, and the second shell 32 has a minimum liquid level line, and at least part of the second heat exchange element 5 is located below the minimum liquid level line.

[0087] In some embodiments, Figures 1 to 3 As shown, the second heat exchanger 5 includes a second body 51 having corresponding third and fourth faces and at least one second heat exchange portion 52 located on the third face of the second body 51. At least part of the second heat exchange portion 52 is arranged in the second inner cavity 31; at least part of the second heat exchange portion 52 can contact the water in the second inner cavity 31. As feasible, at least part of the second body 51 can contact the water in the second inner cavity 31. As feasible, at least part of the second heat exchange portion 52 can be located below the lowest liquid level line. In one embodiment, the cold end 11 is in close contact with the fourth face of the second body 51 for heat exchange to achieve a higher heat exchange rate. In another embodiment, in order to avoid a gap between the cold end 11 and the fourth face of the second body 51 to reduce the heat exchange rate, the cold end 11 is arranged at the fourth face of the second body 51, and a heat conductive material is arranged between the cold end 11 and the fourth face of the second body 51 to achieve a higher heat exchange rate.

[0088] Further, such as Figure 1 and Figure 2 As shown, the second shell 32 has a second opening. In one embodiment, the third surface of the second body 51 is sealed with the outer wall of the second shell 32, and part of the second heat exchanger 5 is inserted into the second inner cavity 31 through the second opening. For example, the second heat exchange part 52 can be inserted into the second inner cavity 31 through the second opening to absorb the heat of the water in the second inner cavity 31. The cold end 11 of the semiconductor refrigeration unit 1 exchanges heat with the fourth surface of the second body 51. In the above manner, not only the second opening is sealed by the second body 51 to prevent the water in the second inner cavity 31 from leaking out, but also part of the second heat exchanger 5 is inserted into the second inner cavity 31 through the second opening to exchange heat with the water in the second inner cavity 31, thereby releasing the coldness of the cold end 11 of the semiconductor refrigeration unit 1 into the water in the second inner cavity 31. In this embodiment, a second sealing member 7, such as a sealing ring, can be provided between the third surface of the second body 51 and the outer wall of the second shell 32 to ensure the sealing between the third surface of the second body 51 and the outer wall of the second shell 32.

[0089] In another embodiment, the fourth surface of the second body 51 is sealed with the inner wall of the second shell 32; the cold end 11 of the semiconductor refrigeration unit 1 absorbs the heat of the second body 51 at the second opening. Specifically, the cold end 11 of the semiconductor refrigeration unit 1 exchanges heat with the fourth surface of the second body 51 at the second opening. In the above manner, not only the second opening is sealed by the second body 51 to prevent the water in the second inner cavity 31 from leaking out, but also the cold end 11 of the semiconductor refrigeration unit 1 absorbs the heat of the second body 51 at the second opening, thereby releasing the coldness of the cold end 11 of the semiconductor refrigeration unit 1 into the water in the second inner cavity 31. In this embodiment, a second sealing member 7, such as a sealing ring, may be provided between the third surface of the second body 51 and the inner wall of the second shell 32 to ensure the sealing between the third surface of the second body 51 and the inner wall of the second shell 32.

[0090] Similarly, in the above two embodiments, the second body 51 and the second shell 32 are provided with a second fixing member so that the second body 51 and the second shell 32 press the second sealing member 7 to achieve sealing. For example, the second fixing member can be a screw, a matching bolt and a nut, etc., which is not limited in this application.

[0091] In some embodiments, Figure 1 and Figure 2 As shown, one side of the first shell 22 of the first water storage unit 2 is disposed against one side of the second shell 32 of the second water storage unit 3, and the semiconductor refrigeration unit 1 is disposed between one side of the first shell 22 of the first water storage unit 2 and one side of the second shell 32 of the second water storage unit 3. The water supply device can be made more compact in the above manner. Furthermore, the side wall of the first shell 22 is disposed against the side wall of the second shell 32. In this way, even if the water in the first water storage unit 2 and the second water storage unit 3 is less, the hot end 12 of the semiconductor refrigeration unit 1 can dissipate heat through the water in the first inner cavity 21 as much as possible, and the cold end 11 of the semiconductor refrigeration unit 1 can absorb the heat of the water in the second inner cavity 31, so that the water in the second inner cavity 31 becomes cold water.

[0092] In some embodiments, Figure 3 As shown, the first heat exchange part 42 may include fins, a plurality of fins are arranged at intervals in the horizontal direction, and the fins extend in the vertical direction. Similarly, the second heat exchange part 52 may also include fins, a plurality of fins are arranged at intervals in the horizontal direction, and the fins extend in the vertical direction. In this way, even if there is less water in the first water storage unit 2 and the second water storage unit 3, the heat or cold transferred by the body to each fin can be heated or absorbed by the water through its lower end, thereby improving the heat exchange rate between the entire heat exchange component and the water.

[0093] In some embodiments, the first body 41 and the second body 51 are located between the first shell 22 of the first water storage unit 2 and the second shell 32 of the second water storage unit 3, and the first shell 22 of the first water storage unit 2 and the second shell 32 of the second water storage unit 3 are penetrated by a third fixing member to lock the first shell 22 and the second shell 32, so that the first body 41 and the first shell 22 are kept sealed, and the second body 51 and the second shell 32 are kept sealed.

[0094] In some embodiments, the first shell 22 of the first water storage unit 2 and the second shell 32 of the second water storage unit 3 are located between the first body 41 and the second body 51, and a third fixing member is provided between the first body 41 and the second body 51 to lock the first body 41 and the second body 51, so that the first body 41 and the first shell 22 are kept sealed, and the second body 51 and the second shell 32 are kept sealed.

[0095] In some embodiments, Figures 1 to 3 As shown, there can be multiple semiconductor refrigeration units 1, and there can be multiple second heat exchangers 5, corresponding to the number of semiconductor refrigeration units 1. A second heat exchanger 5 can be provided at the cold end 11 of each semiconductor refrigeration unit 1. Multiple semiconductor refrigeration units 1 can be provided on a first heat exchanger 4 with a larger volume, thereby improving the heat dissipation effect.

[0096] A water purification device is also proposed in the present application. Figure 4 This is a system diagram of the water purification supply device in the first embodiment of the utility model, as shown in FIG. Figure 4 As shown, the clean water supply device may include: any of the water supply devices described above; a booster unit 8 and a filter unit 9 connected between the first water storage unit 2 and the second water storage unit 3, under the action of the booster unit 8, the water in the first water storage unit 2 can be filtered and the filtered clean water can be transported to the second water storage unit 3; a first water outlet 10, and the first water outlet 10 can be connected to the second water storage unit 3. The filter unit 9 can be any type of filter unit that can filter water. For example, the filter unit 9 can include at least one of a reverse osmosis filter unit, a nanofiltration membrane filter unit, an ultrafiltration membrane filter unit, a fiber membrane filter unit, and the like. As feasible, the filter unit 9 can include a pre-filter unit. As feasible, the filter unit 9 can include a post-filter unit.

[0097] Furthermore, the clean water supply device may further include: a second water outlet 11 , and the second water outlet 11 can be communicated with the clean water outlet of the filter unit 9 .

[0098] The first water storage unit 2 can be used to store raw water, and the raw water can be input into the second water storage unit 3 for storage after being filtered by the filter unit 9. The purified water stored in the second water storage unit 3 can be cooled to cold water by the semiconductor refrigeration unit 1, and the heat generated by the hot end 12 of the semiconductor refrigeration unit 1 can be efficiently released into the raw water of the first water storage unit 2, and the first water outlet 10 can supply the cold purified water stored in the second water storage unit 3 to the user. The second water outlet 11 can supply the purified water at room temperature or slightly higher than room temperature directly output after being filtered by the filter unit 9 to the user, so as to meet the user's demand for purified water at different temperatures.

[0099] A water purification device is also proposed in the present application. Figure 5 This is a system diagram of the water purification supply device in the second embodiment of the utility model. Figure 6 : is a system diagram of the water purification supply device in the third embodiment of the utility model, as shown in FIG. Figure 5 and Figure 6 As shown, the purified water supply device may include: a water inlet 12; any of the above-mentioned water supply devices; a filter unit 9 connected between the second water storage unit 3 and the water inlet 12; the first water storage unit 2 can be communicated with the second water storage unit 3; or, the second water storage unit 3 can be communicated with the purified water outlet of the filter unit 9; a first water outlet 10, and the first water outlet 10 can be communicated with the second water storage unit 3. The specific selection of the filter unit 9 can be the same as above, and will not be repeated here.

[0100] Furthermore, the clean water supply device may include: a second water outlet 11 , and the second water outlet 11 can be communicated with the clean water outlet of the first water storage unit 2 or the filter unit 9 .

[0101] Further, the clean water supply device may include: a boosting unit 8, and the raw water flowing into the water inlet end 12 can be accelerated by the boosting unit 8 to pass through the filter unit 9 to produce clean water, thereby increasing the water production rate. Generally speaking, the boosting unit 8 can be connected between the inlet of the filter unit 9 and the water inlet end 12. In other feasible ways, when the first water storage unit 2 can be connected to the second water storage unit 3, the boosting unit 8 can also be connected between the outlet of the filter unit 9 and the first water storage unit 2, or, when the second water storage unit 3 can be connected to the clean water outlet of the filter unit 9, the boosting unit 8 can also be connected between the outlet of the filter unit 9 and the second water storage unit 3.

[0102] The raw water flowing into the water inlet 12 can be filtered by the filter unit 9 to obtain clean water, and the clean water obtained after filtration can be input into the first water storage unit 2. In one way, the second water storage unit 3 can be connected with the first water storage unit 2 to transfer the clean water in the first water storage unit 2 to the second water storage unit 3. In another way, the second water storage unit 3 can directly receive the clean water obtained after filtration by the filter unit 9. The clean water stored in the second water storage unit 3 can be cooled to cold water by the semiconductor refrigeration unit 1, and the heat generated by the hot end 12 of the semiconductor refrigeration unit 1 can be efficiently released into the clean water in the first water storage unit 2, and the first water outlet 10 can supply the cold clean water stored in the second water storage unit 3 to the user. In one way, the second water outlet 11 can supply the clean water at room temperature directly output after filtration by the filter unit 9 to the user. In another way, the second water outlet 11 can supply the clean water in the first water storage unit 2 to the user, and the clean water may be at room temperature or slightly higher than room temperature. The above method can meet the user's demand for purified water at different temperatures.

[0103] A water purification device is also proposed in the present application. Figure 7 : is a system diagram of the water purification supply device in the fourth embodiment of the utility model, as shown in FIG. Figure 7 As shown, the clean water supply device may include: a water inlet end 12; a water supply device such as any of the above-mentioned ones; a filter unit 9 connected between the first water storage unit 2 and the water inlet end 12, and the wastewater end of the filter unit 9 can be connected to the first water storage unit 2; a first water outlet end 10, and the first water outlet end 10 is connected to the second water storage unit 3.

[0104] In this embodiment, the filter unit 9 can be any type of filter unit that can filter water and needs to discharge wastewater during filtration. For example, the filter unit 9 can include at least one of a reverse osmosis filter unit, a nanofiltration membrane filter unit, an ultrafiltration membrane filter unit, a fiber membrane filter unit, and the like.

[0105] Furthermore, the clean water supply device may include: a second water outlet 11 , and the second water outlet 11 is connected to the clean water outlet of the filter unit 9 .

[0106] Further, the clean water supply device may include: a booster unit 8, and the raw water flowing into the water inlet end 12 can be accelerated by the booster unit 8 to pass through the filter unit 9 to produce clean water, thereby increasing the water production rate. Generally speaking, the booster unit 8 can be connected between the inlet of the filter unit 9 and the water inlet end 12. In other feasible ways, the booster unit 8 can also be connected between the outlet of the filter unit 9 and the second water storage unit 3. The second water outlet 11 can be connected to the outlet of the booster unit 8.

[0107] Furthermore, the first water storage unit 2 has an outlet. When the wastewater in the first water storage unit 2 reaches a certain amount, the excess wastewater needs to be discharged from the outlet.

[0108] The raw water flowing into the water inlet 12 can be filtered through the filter unit 9 to obtain clean water. The clean water obtained after filtration can be input into the second water storage unit 3 for storage, and the waste water discharged during filtration is input into the first water storage unit 2 for storage. The clean water stored in the second water storage unit 3 can be cooled to cold water by the semiconductor refrigeration unit 1, and the heat generated by the hot end 12 of the semiconductor refrigeration unit 1 can be efficiently released into the waste water of the first water storage unit 2. The first water outlet 10 can supply the cold clean water stored in the second water storage unit 3 to the user. The second water outlet 11 can supply the clean water at room temperature directly output after filtration by the filter unit 9 to the user. The above method can meet the user's demand for clean water at different temperatures.

[0109] In all the above embodiments, when the filter unit 9 needs to discharge the wastewater generated during filtration, as feasible, the clean water supply device may include: a wastewater waterway 13 connected to the wastewater outlet of the filter unit 9, and a wastewater ratio unit is provided on the wastewater waterway 13.

[0110] All articles and references disclosed, including patent applications and publications, are incorporated herein by reference for all purposes. The term "consisting essentially of..." to describe a combination should include the identified elements, ingredients, parts or steps and other elements, ingredients, parts or steps that do not substantially affect the basic novel characteristics of the combination. The use of the terms "comprising" or "including" to describe a combination of elements, ingredients, parts or steps herein also contemplates embodiments that consist essentially of these elements, ingredients, parts or steps. By using the term "may", it is intended to indicate that any attribute described that "may" include is optional.

[0111] Multiple elements, ingredients, parts or steps can be provided by a single integrated element, ingredient, part or step. Alternatively, a single integrated element, ingredient, part or step can be divided into separate multiple elements, ingredients, parts or steps. The disclosure "one" or "an" used to describe an element, ingredient, part or step is not intended to exclude other elements, ingredients, parts or steps.

[0112] The above are only a few embodiments of the present invention. Although the embodiments disclosed by the present invention are as above, the contents are only embodiments adopted for facilitating the understanding of the present invention and are not used to limit the present invention. Any technician in the technical field to which the present invention belongs can make any modification and change in the form and details of the implementation without departing from the spirit and scope disclosed by the present invention, but the scope of patent protection of the present invention shall still be subject to the scope defined by the attached claims.

Claims

1. A water supply device, characterized in that: The water supply device comprises: A semiconductor refrigeration unit having a cold end for absorbing heat and a hot end for releasing heat; A first water storage unit having a first inner cavity, wherein the first inner cavity is used to store water, and the hot end can dissipate heat through the water in the first inner cavity; A second water storage unit is provided with a second inner cavity, wherein the second inner cavity is used to store water, and the cold end can absorb the heat of the water in the second inner cavity to turn the water in the second inner cavity into cold water.

2. The water supply device according to claim 1, characterized in that: The hot end achieves heat dissipation through the water in the first inner cavity by means of a first heat exchange element which is at least partially disposed in the first inner cavity and can contact with the water in the first inner cavity.

3. The water supply device according to claim 2, characterized in that: The first water storage unit has a first shell forming the first inner cavity, the first shell has a minimum liquid level line, and at least part of the first heat exchange element is located below the minimum liquid level line.

4. The water supply device according to claim 2, characterized in that: The first heat exchange member comprises a first body having a first surface and a second surface corresponding to each other and at least one first heat exchange portion located on the first surface of the first body; at least part of the first heat exchange portion is disposed in the first inner cavity; The hot end is in close contact with the second surface of the first body for heat exchange, or, The hot end is disposed at the second surface of the first body, and a heat conductive material is disposed between the hot end and the second surface of the first body.

5. The water supply device according to claim 4, characterized in that: The first water storage unit has a first shell forming the first inner cavity, the first shell has a first opening, the first surface of the first body is sealed with the outer wall of the first shell, and part of the first heat exchange element is inserted into the first inner cavity through the first opening.

6. The water supply device according to claim 4, characterized in that The first water storage unit has a first shell forming the first inner cavity, the first shell has a first opening, and the second surface of the first body is sealed with the inner wall of the first shell; the hot end of the semiconductor refrigeration unit dissipates heat through the first body at the first opening.

7. The water supply device according to claim 1, characterized in that The cold end absorbs heat from the water in the second inner cavity through a second heat exchange element at least partially disposed in the second inner cavity and capable of contacting the water in the second inner cavity, so as to convert the water in the second inner cavity into cold water.

8. The water supply device according to claim 7, characterized in that: The second water storage unit has a second shell forming the second inner cavity, the second shell has a minimum liquid level line, and at least a portion of the second heat exchange element is located below the minimum liquid level line.

9. The water supply device according to claim 7, characterized in that: The second heat exchange member comprises a second body having corresponding third and fourth surfaces and at least one second heat exchange portion located on the third surface of the second body; at least a portion of the second heat exchange portion is disposed in the second inner cavity; The cold end is in close contact with the fourth surface of the second body for heat exchange, or, The cold end is arranged at the fourth surface of the second body, and a heat conductive material is arranged between the cold end and the fourth surface of the second body.

10. The water supply device according to claim 9, characterized in that The second water storage unit has a second shell forming the second inner cavity, the second shell has a second opening, the third surface of the second body is sealed with the outer wall of the second shell, and part of the second heat exchange element is inserted into the second inner cavity through the second opening.

11. The water supply device according to claim 9, characterized in that The second water storage unit has a second shell forming the second inner cavity, the second shell has a second opening, the fourth surface of the second body is sealed with the inner wall of the second shell; the cold end of the semiconductor refrigeration unit absorbs heat from the second body at the second opening.

12. The water supply device according to claim 1, characterized in that One side of the first shell of the first water storage unit is arranged against one side of the second shell of the second water storage unit, and the semiconductor refrigeration unit is arranged between one side of the first shell of the first water storage unit and one side of the second shell of the second water storage unit; the side wall of the first shell is arranged against the side wall of the second shell.

13. A water purification device, characterized in that: The clean water supply device comprises: A water supply device as claimed in any one of claims 1 to 12; A booster unit and a filter unit connected between the first water storage unit and the second water storage unit, wherein the booster unit can filter the water in the first water storage unit and transfer the filtered clean water to the second water storage unit; A first water outlet end, wherein the first water outlet end can be communicated with the second water storage unit.

14. The purified water supply device according to claim 13, characterized in that: The clean water supply device also includes: A second water outlet end, wherein the second water outlet end can be communicated with the clean water outlet of the filter unit.

15. A water purification device, characterized in that: The clean water supply device comprises: Water inlet end; A water supply device as claimed in any one of claims 1 to 12; A filter unit connected between the second water storage unit and the water inlet; the first water storage unit can be communicated with the second water storage unit; or the second water storage unit can be communicated with the clean water outlet of the filter unit; A first water outlet end, wherein the first water outlet end can be communicated with the second water storage unit.

16. The purified water supply device according to claim 15, characterized in that: The clean water supply device also includes: A second water outlet end, wherein the second water outlet end can be communicated with the clean water outlet of the first water storage unit or the filter unit.

17. A water purification device, characterized in that: The clean water supply device comprises: Water inlet end; A water supply device as claimed in any one of claims 1 to 12; A filter unit connected between the first water storage unit and the water inlet end, wherein the wastewater end of the filter unit can be communicated with the first water storage unit; A first water outlet is connected to the second water storage unit.

18. The purified water supply device according to claim 17, characterized in that: The clean water supply device also includes: The second water outlet is communicated with the purified water outlet of the filter unit.

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