Multi-contact-surface elastic sheet

By arranging bending parts and through holes on the clamping plate of the chip connection elastic piece, combined with structures such as guide parts, connecting plates, and clamping plates, the problem of insufficient clamping force and stability in the existing technology is solved, and a higher level is achieved. clamping force and stability.

CN222380881UActive Publication Date: 2025-01-21SHENZHEN AIKESTAR TECH CO LTD
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Patent Information

Application Number
CN202421114367.1
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-05-21
Publication Date
2025-01-21
Estimated Expiration
2034-05-21

AI Technical Summary

Technical Problem

With the fixed contact area of ​​the existing chip connection shrapnel, it is difficult to improve clamping force and stability, especially in complex mechanical structures.

Method used

Design a multi-contact spring piece. By setting bends and through holes on the clamping plate, the bending part is formed to increase the guiding effect, and the clamping force and stability are improved through structures such as the guiding part, connecting plate and clamping plate. sex.

Benefits of technology

By reducing the contact area to increase the contact surface and pressure, improve the clamping force and stability, it is suitable for chip connection within complex mechanical structures.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to the technical field of connectors, in particular to a multi-contact-surface elastic piece which comprises a chip clamping part and an element connecting part, the chip clamping part comprises a flat plate and clamping plates fixedly connected to the two sides, the upper ends of the clamping plates on the two sides are close to each other and incline, and bending parts are arranged at the upper ends of the clamping plates; through holes are formed in the connecting positions of the bending parts and the clamping plates to divide the clamping plates and the bending parts on each side into two parts, when the elastic piece is used for clamping a chip, the clamping plates are aligned to the chip and pushed towards the inner side, and the bending parts on the two sides can form a partial guiding effect, so that the elastic piece is more easily clamped on the chip; due to the fact that the bent parts on the two sides are divided into two pairs through the through holes, compared with the condition of the same pressure, the contact area is reduced, the pressure intensity can be increased, the clamping force is increased, the contact area and the pressure intensity are increased by reducing the contact area, and the stability is improved.
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Description

Technical Field

[0001] The present application relates to the technical field of connectors, and in particular to a multi-contact surface spring. Background Art

[0002] The chip connection spring, also known as the chip sealing and testing spring, is a chip test contact medium, an important component in electronic materials, and a carrier for connecting and conducting electronic components. Its main function is to serve as a medium for data transmission and conductive contact. The conductive transmission function of the spring is used to determine whether the product is in normal contact and whether the operating data is normal. In order to better judge the product, it is usually necessary to increase the contact area of ​​the spring. However, considering that the position of the contact chip is fixed and the area is certain, it is impossible to increase too much contact area. Therefore, the present application is a multi-contact surface spring that can solve the above technical problems. Utility Model Content

[0003] In view of the shortcomings of the prior art, the purpose of this application is to provide a multi-contact surface spring for solving the above technical problems.

[0004] The above-mentioned purpose of the present application is achieved through the following technical scheme: a multi-contact surface spring piece, including a chip clamping part and a component connecting part, the chip clamping part includes a flat plate and a clamping plate fixedly connected on both sides, the upper ends of the clamping plates on both sides are close to and inclined, and a bending part is provided on the upper end of the clamping plate, and the connection between the bending part and the clamping plate is divided into two by opening a through hole at each side of the clamping plate and the bending part.

[0005] By adopting the above technical solution, when the spring sheet is used to clamp the chip, the clamping plate is aligned with the chip and pushed inward, and the bent parts on both sides will form a partial guiding effect, so that it is easier to clamp the spring sheet to the chip. When the clamping plate clamps the chip, the bent parts on both sides will be opened into two pairs by the through holes. Compared with the same pressure, the contact area is reduced, so the pressure will become greater, so that it can increase the clamping force. By reducing the contact area, the contact surface and pressure are increased, thereby improving its stability.

[0006] Furthermore, a guide portion is fixedly provided at one end of the bending portion away from the clamping plate, and the guide portion is parallel to the flat plate.

[0007] By adopting the above technical solution, considering that some chips are in a complex mechanical structure, the setting of the guide part can help the spring or other components to correctly enter or leave a specific position. The specific method requires the cooperation of other tools.

[0008] Furthermore, a connecting plate is fixedly connected to one side of the flat plate, the connecting plate is fixedly connected to a vertical plate, and one end of the vertical plate away from the connecting plate is connected to the element connecting portion.

[0009] By adopting the above technical solution, the chip clamping part and the component connecting part are connected together through the connecting plate and the flat plate, while maintaining a certain distance, so that the performance of the chip or product can be judged more clearly.

[0010] Furthermore, the element connecting portion includes a contact plate and a clamping plate, the contact plate is provided with a rectangular groove, the side wall of the rectangular groove is connected to the clamping plate, and the clamping plate is provided with a bending portion to fold the clamping plate in half.

[0011] By adopting the above technical solution, since the test performance not only needs to fix the chip but also needs to fix the component part, the one-piece clamping part can better clamp the test component by folding the clamping plate.

[0012] Furthermore, a guide sliding surface is provided at the end of the clamping plate.

[0013] By adopting the above technical solution, the role of providing the guide sliding surface is to play the role of clamping and guiding.

[0014] Furthermore, one end of the contact plate away from the rectangular groove is chamfered.

[0015] By adopting the above technical solution, in order to better insert the clamping plate, the chamfer will cooperate with the guide slide to play a guiding role.

[0016] Furthermore, a tightening block fixedly connected to the clamping plate is provided on one side of the guide sliding surface.

[0017] By adopting the above technical solution, in order to increase the clamping degree, a clamping block is provided on the clamping plate, so that it can be clamped better.

[0018] Furthermore, a through hole is provided at the end of the clamping plate to divide one end of the clamping plate into two.

[0019] By adopting the above technical solution, after the clamping plate is divided into two parts through the penetration hole, the contact area is increased, thereby achieving better fixation.

[0020] In summary, the present application includes at least one of the following beneficial technical effects:

[0021] 1. Align the clamping plate with the chip and push it inward. The bent parts on both sides will form a partial guide, making it easier to clamp the spring onto the chip. When the clamping plate clamps the chip, the bent parts on both sides will be opened into two pairs by the through holes. Compared with the same pressure, the contact area is reduced, so the pressure will become greater, so that it can increase the clamping force. By reducing the contact area, the contact surface and pressure are increased, thereby improving its stability.

[0022] 2. Connect the chip clamping part and the component connecting part together through the connecting plate and the flat plate, while keeping a certain distance, so that the performance of the chip or product can be judged more clearly. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is a schematic diagram of the overall structure in the embodiment;

[0024] Figure 2 yes Figure 1 Schematic diagram of the structure from another perspective.

[0025] Figure numerals: 1. chip clamping part; 11. flat plate; 12. clamping plate; 13. bending part; 14. guide part; 2. element connecting part; 21. contact plate; 22. clamping plate; 23. rectangular groove; 24. bending part; 25. guide sliding surface; 26. chamfer; 27. through hole; 28. clamping block; 3. connecting plate; 31. vertical plate. DETAILED DESCRIPTION

[0026] The present application is further described in detail below in conjunction with the accompanying drawings.

[0027] Example, see Figure 1 as well as Figure 2 , a multi-contact surface spring piece, including a chip clamping part 1 and a component connecting part 2, the chip clamping part 1 includes a flat plate 11 and a clamping plate 12 fixedly connected on both sides, the upper ends of the clamping plates 12 on both sides are close to and inclined, and a bending part 13 is opened on the upper end of the clamping plate 12, and the connection between the bending part 13 and the clamping plate 12 is divided into two parts by opening a through hole at the connection between the clamping plate 12 and each side of the clamping plate 12. When the spring piece clamps the chip, the clamping plate 12 is aligned with the chip and pushed inward. The bending parts 24 on both sides will form a partial guiding effect, thereby making it easier to clamp the spring piece to the chip. After the clamping plate 12 clamps the chip, the bending parts 24 on both sides will be divided into two pairs by the through holes. Compared with the case of equal pressure, the contact area is reduced, so that the pressure will become larger, so that it can increase the clamping force. By reducing the contact area, the contact surface and pressure are increased, thereby improving its stability.

[0028] In this embodiment, a guide portion 14 is fixedly provided at one end of the bending portion 13 away from the clamping plate 12. The guide portion 14 is parallel to the flat plate 11. Considering that some chips are in a complex mechanical structure, the setting of the guide portion 14 is designed to help the spring clip or other components to correctly enter or leave a specific position. The specific method requires the cooperation of other tools.

[0029] In this embodiment, a connecting plate 3 is fixedly connected to one side of the flat plate 11, and a vertical plate 31 is fixedly connected to the connecting plate 3. The end of the vertical plate 31 away from the connecting plate 3 is connected to the component connecting part 2. The chip clamping part 1 and the component connecting part 2 are connected together through the connecting plate 3 and the flat plate 11 while maintaining a certain distance, so that the performance of the chip or product can be judged more clearly.

[0030] The component connecting part 2 includes a contact plate 21 and a clamping plate 22. The contact plate 21 is provided with a rectangular groove 23. The side wall of the rectangular groove 23 is connected to the clamping plate 22. A bending part 24 is provided in the clamping plate 22 to fold the clamping plate 22 in half. Since the test performance not only needs to fix the chip but also needs to fix the component part, the one-piece clamping part can better clamp the test component by folding the clamping plate 22 in half.

[0031] A guide slide 25 is provided at the end of the clamping plate 22, and a chamfer 26 is provided at one end of the contact plate 21 away from the rectangular groove 23. In order to better insert the clamping plate 22, the chamfer 26 cooperates with the guide slide to play a guiding role.

[0032] In this embodiment, a tightening block 28 fixedly connected to the clamping plate 22 is provided on one side of the guide sliding surface 25. In order to increase the clamping degree, the clamping plate 22 can be clamped better by providing the tightening block 28 on the clamping plate 22.

[0033] In this embodiment, a through hole 27 is provided at the end of the clamping plate 22 to divide one end of the clamping plate 22 into two. By dividing the two sides of the clamping plate 22 into two, the contact area is increased, thereby achieving better fixation.

[0034] Specific implementation process;

[0035] When the spring clip is clamped on the chip, the clamping plate 12 is aligned with the chip and pushed inward, and the bent parts 24 on both sides will form a partial guiding effect, so that the spring clip can be clamped on the chip more easily. After the clamping plate 12 clamps the chip, since the bent parts 24 on both sides are opened into two pairs by the through holes, compared with the case of the same pressure, the contact area is reduced, and the pressure will become larger, so that it can increase the clamping force. By reducing the contact area, the contact surface and pressure are increased, thereby improving its stability. Since the test performance not only needs to fix the chip but also needs to fix the component part, the clamping plate 22 is folded in half, and the one-piece clamping part can better clamp the test component. By dividing the two sides of the clamping plate 22 into two, the contact area will be increased, thereby making it better fixed.

[0036] The embodiments of this specific implementation method are all preferred embodiments of the present application, and are not intended to limit the protection scope of the application. Therefore, all equivalent changes made based on the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A multi-contact surface spring, characterized in that: The invention comprises a chip clamping part (1) and a component connecting part (2), wherein the chip clamping part (1) comprises a flat plate (11) and clamping plates (12) fixedly connected to both sides of the flat plate (11), the upper ends of the clamping plates (12) on both sides are inclined to each other, a bending part (13) is provided at the upper end of the clamping plate (12), and a through hole is provided at the connection between the bending part (13) and the clamping plate (12), so that the clamping plate (12) and the bending part (13) on each side are divided into two.

2. A multi-contact surface spring sheet according to claim 1, characterized in that: A guide portion (14) is fixedly provided at one end of the bent portion (13) away from the clamping plate (12), and the guide portion (14) is parallel to the flat plate (11).

3. The multi-contact surface spring sheet according to claim 1, characterized in that: A connecting plate (3) is fixedly connected to one side of the flat plate (11), and a vertical plate (31) is fixedly connected to the connecting plate (3), and an end of the vertical plate (31) away from the connecting plate (3) is connected to the element connecting portion (2).

4. The multi-contact surface spring sheet according to claim 1, characterized in that: The element connection portion (2) comprises a contact plate (21) and a clamping plate (22); the contact plate (21) is provided with a rectangular groove (23); the side wall of the rectangular groove (23) is connected to the clamping plate (22); and the clamping plate (22) is provided with a bending portion (24) for folding the clamping plate (22) in half.

5. A multi-contact surface spring sheet according to claim 4, characterized in that: The end of the clamping plate (22) is provided with a guide sliding surface (25).

6. A multi-contact surface spring sheet according to claim 4, characterized in that: A chamfer (26) is provided at one end of the contact plate (21) away from the rectangular groove (23).

7. The multi-contact surface spring sheet according to claim 5, characterized in that: A tightening block (28) fixedly connected to the clamping plate (22) is provided on one side of the guide sliding surface (25).

8. The multi-contact surface spring sheet according to claim 4, characterized in that: A through hole (27) is provided at the end of the clamping plate (22) to divide one end of the clamping plate (22) into two.