Optical module assembly and communication device

Abstract

The utility model provides an optical module assembly and a communication device, and belongs to the technical field of communication. The optical module assembly comprises an optical module, an optical cage, a radiator and a printed circuit board. The optical module is electrically connected to the printed circuit board and comprises an optical module shell, and electric devices and optical devices which are distributed in the optical module shell at intervals; the optical cage is fixedly connected to the printed circuit board and accommodates the optical module, and at least one wall of the optical cage is provided with an opening; the radiator comprises a boss part, a substrate part and a fin part which are connected in sequence, and the boss part penetrates through the opening of the optical cage and is attached to the optical module shell of the optical module; at least one of the boss part, the substrate part and the optical module shell is provided with a thermal interruption structure, and the projection of the thermal interruption structure on the optical module is located between the electric device and the optical device. Thermal interruption is provided between the electric device and the optical device through the thermal interruption structure, so that thermal crosstalk of the electric device to the optical device is reduced or even avoided, and the heat dissipation efficiency of the optical device is improved.

Description

Technical Field

[0001] The embodiments of the present disclosure relate to the field of communication technology, and in particular to an optical module assembly and a communication device. Background Art

[0002] An optical module is an electronic device used for photoelectric conversion. As the transmission rate of the optical module continues to increase, its power consumption continues to increase. Therefore, it is necessary to dissipate heat for the optical module.

[0003] In the related art, the optical module assembly includes: an optical module, an optical cage, a heat sink and a printed circuit board. The optical module includes electrical components and optical components. The optical module is electrically connected to the printed circuit board. The optical cage is fixed on the printed circuit board to accommodate the optical module. The boss portion of the heat sink passes through the optical cage and makes its surface fit with the optical module housing to dissipate the heat of the optical module.

[0004] There are optical devices and electrical devices in the optical module housing. However, the temperature specification of the optical device is usually lower than that of the electrical device, which will cause excess heat from the electrical device to be transferred to the optical device, causing thermal crosstalk between the electrical device and the optical device, thereby affecting the heat transfer efficiency of the optical device and worsening the heat dissipation of the optical device. Utility Model Content

[0005] The embodiments of the present disclosure provide an optical module assembly and a communication device, which can solve the technical problems existing in the related technologies.

[0006] In one aspect, an optical module assembly is provided, the optical module assembly comprising: an optical module, an optical cage, a heat sink and a printed circuit board;

[0007] The optical module is electrically connected to the printed circuit board, and the optical module includes an optical module housing, and electrical components and optical components spaced apart and distributed inside the optical module housing;

[0008] The optical cage is fixedly connected to the printed circuit board and accommodates the optical module, and at least one wall of the optical cage has an opening;

[0009] The heat sink comprises: a boss portion, a base portion and a fin portion connected in sequence, wherein the boss portion passes through the opening of the optical cage and fits with the optical module housing of the optical module;

[0010] At least one of the boss portion, the base plate portion, and the optical module housing has a heat interruption structure, and a projection of the heat interruption structure on the optical module is located between the electric device and the optical device.

[0011] The optical module assembly provided by the embodiment of the present disclosure provides thermal interruption between the electrical device and the optical device by disposing a thermal interruption structure on at least one of the boss portion, the substrate portion and the optical module housing, and positioning the thermal interruption structure between the electrical device and the optical device, thereby reducing or even avoiding thermal crosstalk caused by the electrical device to the optical device and improving the heat dissipation efficiency of the optical device.

[0012] In some possible implementations, both the boss portion and the base portion have the thermal interruption structure.

[0013] In some possible implementations, the thermal interruption structure on the boss portion is connected to the thermal interruption structure on the substrate portion.

[0014] In some possible implementations, the boss portion, the substrate portion, and the optical module housing all have the thermal interruption structure.

[0015] In some possible implementations, along a distribution direction between the electrical device and the optical device, the thermal interruption structures are arranged as a group or a plurality of groups distributed at intervals.

[0016] In some possible implementations, the thermal interruption structure includes at least one of a groove structure and a through-hole structure.

[0017] In some possible implementations, the thermal interrupt structure includes a first thermal interrupt structure and a second thermal interrupt structure;

[0018] The first heat interruption structure comprises a groove structure, and the groove structure is located on the surface of the boss portion facing the optical module;

[0019] The second heat interruption structure includes a plurality of through-hole structures distributed at intervals, and the through-hole structures penetrate the substrate portion and the surface of the boss portion facing the substrate portion;

[0020] The second thermal interrupt structure is in communication with the first thermal interrupt structure.

[0021] In some possible implementations, the thermal interrupt structure includes a first thermal interrupt structure and a second thermal interrupt structure;

[0022] The first heat interruption structure comprises a plurality of through-hole structures distributed at intervals, and the through-hole structures penetrate the boss portion;

[0023] The second heat interruption structure includes a plurality of through-hole structures distributed at intervals, and the through-hole structures penetrate the substrate portion;

[0024] The plurality of through-hole structures in the second thermal interruption structure are connected to the plurality of through-hole structures in the first thermal interruption structure in a one-to-one correspondence.

[0025] In some possible implementations, the thermal interrupt structure includes a first thermal interrupt structure and a second thermal interrupt structure;

[0026] The first thermal interruption structure includes a single through-hole structure and passes through the boss portion to separate the boss portion into at least two bosses;

[0027] The second heat interruption structure includes a plurality of through-hole structures distributed at intervals, and the through-hole structures penetrate the substrate portion;

[0028] The second thermal interrupt structure is in communication with the first thermal interrupt structure.

[0029] In some possible implementations, the thermal interrupt structure includes a first thermal interrupt structure and a second thermal interrupt structure;

[0030] The first thermal interruption structure includes a single through-hole structure and passes through the boss portion to separate the boss portion into at least two bosses;

[0031] The second thermal interruption structure includes a single through-hole structure and penetrates the substrate portion to separate the substrate portion into at least two substrates;

[0032] The second heat interruption structure is connected to the first heat interruption structure, and the at least two bosses correspond to the at least two substrates one by one. The corresponding bosses and substrates, as well as the corresponding parts of the fin parts cooperate to form an independent sub-heat sink.

[0033] In some possible implementations, the heat interruption structure includes a groove structure, and the groove structure is located on a surface of the optical module housing facing the boss portion.

[0034] In some possible implementations, the thermal interruption structure includes a through-hole structure, and the through-hole structure passes through a wall of the optical module housing facing the boss portion. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] Figure 1 It is a structural schematic diagram of an optical module assembly in the related art;

[0036] Figure 2 A schematic diagram of the structure of an exemplary optical module assembly provided in an embodiment of the present disclosure;

[0037] Figure 3 A schematic diagram of an exemplary arrangement of a heat dissipation unit of an optical module provided in an embodiment of the present disclosure;

[0038] Figure 4 A schematic diagram of the structure of an exemplary optical module assembly in implementation scheme (1) provided in an embodiment of the present disclosure;

[0039] Figure 5 A top view of the heat sink in the implementation scheme (1) provided in the embodiment of the present disclosure;

[0040] Figure 6 A bottom view of the heat sink in the implementation scheme (1) provided in the embodiment of the present disclosure;

[0041] Figure 7 A side view of the boss portion in the embodiment (1) provided for the embodiment of the present disclosure;

[0042] Figure 8 A schematic diagram of the structure of an exemplary optical module assembly in implementation scheme (2) provided in an embodiment of the present disclosure;

[0043] Fig. 9 A top view of the radiator in implementation scheme (2) provided in the embodiment of the present disclosure;

[0044] Fig.10 A bottom view of the heat sink in implementation scheme (2) provided in the embodiment of the present disclosure;

[0045] Fig.11 A side view of the boss portion in implementation scheme (2) provided for an embodiment of the present disclosure;

[0046] Fig.12 A schematic diagram of the structure of an exemplary optical module assembly in implementation scheme (3) provided in an embodiment of the present disclosure;

[0047] Fig.13 A top view of the heat sink in implementation scheme (3) provided in the embodiment of the present disclosure;

[0048] Fig.14 A bottom view of the heat sink in implementation scheme (3) provided in the embodiment of the present disclosure;

[0049] Fig.15 A schematic diagram of the structure of an exemplary optical module assembly in implementation scheme (4) provided in an embodiment of the present disclosure;

[0050] Fig.16 A schematic diagram of the structure of an exemplary optical module in implementation scheme (5) provided in an embodiment of the present disclosure;

[0051] Fig.17 A schematic diagram of the structure of another exemplary optical module in implementation scheme (5) provided in an embodiment of the present disclosure;

[0052] Fig.18 A schematic diagram of the structure of an exemplary optical module assembly in implementation scheme (5) provided in an embodiment of the present disclosure.

[0053] The reference numerals represent:

[0054] 1. Optical module; 10. Optical module housing; 11. Electrical components; 12. Optical components;

[0055] 2. Light cage; 21. Opening;

[0056] 3. Radiator;

[0057] 31. Boss part; 310. Boss part; 32. Base plate part; 320. Base plate; 33. Fin part;

[0058] 4. Printed circuit board;

[0059] 5. Thermal interruption structure; 51. First thermal interruption structure; 52. Second thermal interruption structure; 53. Third thermal interruption structure;

[0060] 001. Optical module heat dissipation unit. DETAILED DESCRIPTION

[0061] In the description of the embodiments of the present disclosure, it should be understood that the terms "up", "down", "top", "bottom", "vertical", "horizontal", "depth", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the embodiments of the present disclosure and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the embodiments of the present disclosure.

[0062] For example, the directional terms "top", "bottom", etc. are generally based on the relative relationship of the device or component currently in the drawing. When the product is placed in different postures, the orientation may change.

[0063] In the related technology, such as Figure 1 As shown, the optical module assembly includes: an optical module 1, an optical cage 2, a heat sink 3 and a printed circuit board 4. The optical module 1 includes an electrical device 11 and an optical device 12. The optical module 1 is electrically connected to the printed circuit board 4. The optical cage 2 is fixed on the printed circuit board 4 to accommodate the optical module 1. The boss portion 31 of the heat sink 3 passes through the opening 21 on the optical cage 2, and the surface of the boss portion 31 is fitted with the optical module housing 10 of the optical module 1 to dissipate the heat of the optical module 1.

[0064] The optical module housing 10 contains an electrical device 11 and an optical device 12. However, the temperature specification of the optical device 12 is usually lower than that of the electrical device 11, which causes excess heat of the electrical device 11 to be transferred to the optical device 12, causing thermal crosstalk between the electrical device 11 and the optical device 12 (see Figure 1 The horizontal rightward dashed arrow in the figure) affects the heat transfer efficiency of the optical device 12 and worsens the heat dissipation of the optical device 12.

[0065] Specifically, the heat of the optical device 12 and the electrical device 11 is Figure 1 The vertically upward dashed arrow in the figure is conducted to the optical module housing 10 and the heat sink 3. Since the heat sink 3 and the optical module housing 10 are generally made of isotropic high thermal conductivity materials, in addition to conducting the heat of the optical device 12 and the electrical device 11 vertically upward, Figure 1 In the direction indicated by the horizontal rightward dotted arrow, since the temperature of the electrical device 11 is high and the temperature of the optical device 12 is low, there will inevitably be horizontal heat transfer from the electrical device 11 to the optical device 12 between the optical module housing 10 and the heat sink 3, which causes thermal crosstalk between the electrical device 11 and the optical device 12, resulting in deteriorated heat dissipation of the optical device 12 and becoming a heat dissipation bottleneck.

[0066] In view of the technical problems existing in the related art, the present disclosure provides an optical module assembly, as shown in the attached Figure 2 As shown, the optical module assembly includes: an optical module 1, an optical cage 2, a heat sink 3 and a printed circuit board 4. Among them, the optical module 1 is electrically connected to the printed circuit board 4, and the optical module 1 includes an optical module housing 10, and electrical components 11 and optical components 12 that are spaced and distributed inside the optical module housing 10; the optical cage 2 is fixedly connected to the printed circuit board 4 and accommodates the optical module 1, and at least one wall of the optical cage 2 has an opening 21; the heat sink 3 includes a boss portion 31, a base plate portion 32 and a fin portion 33 that are connected in sequence, and the boss portion 31 passes through the opening 21 of the optical cage 2 and fits with the optical module housing 10 of the optical module 1; at least one of the boss portion 31, the base plate portion 32 and the optical module housing 10 has a thermal interruption structure 5 ( Figure 2 It is only exemplified that the boss portion 31 has the heat interruption structure 5 , and the projection of the heat interruption structure 5 on the optical module 1 is located between the electric device 11 and the optical device 12 .

[0067] It should be noted that the above-mentioned “projection of the thermal interruption structure 5 on the optical module 1 is located between the electrical device 11 and the optical device 12 ” means that the projection position of the thermal interruption structure 5 in the area where the entire optical module 1 is located is located in the area between the electrical device 11 and the optical device 12 .

[0068] The optical module assembly provided by the embodiment of the present disclosure provides a thermal interruption structure 5 on at least one of the boss portion 31, the substrate portion 32 and the optical module housing 10, and positions the thermal interruption structure 5 between the electrical device 11 and the optical device 12 to provide a thermal interruption between the electrical device 11 and the optical device 12, thereby reducing or even avoiding the thermal crosstalk generated by the electrical device 11 on the optical device 12, and improving the heat dissipation efficiency of the optical device 12.

[0069] It should be noted that, as Figure 2 As shown, the light cage 2 has at least one wall with an opening 21 to accommodate the boss portion 31 of the heat sink 3, for example, Figure 2The example shows that the top wall of the light cage 2 has an opening 21 to accommodate the boss portion 31 of the heat sink 3, that is, the heat sink 3 is arranged above the light cage 2, and accordingly, the boss portion 31 of the heat sink 3 contacts the top wall of the light module housing 10. Of course, the bottom wall of the light cage 2 can also have an opening 21, and accordingly, the heat sink 3 is arranged below the light cage 2 (not shown in the figure), and accordingly, the boss portion 31 of the heat sink 3 contacts the bottom wall of the light module housing 10. Alternatively, the top wall and the bottom wall of the light cage 2 both have openings 21, and accordingly, at least two groups of heat sinks 3 are respectively arranged above and below the light cage 2 (not shown in the figure).

[0070] In some implementations, such as the attached Figure 2 As shown, the boss portion 31 of the heat sink 3 has a thermal interruption structure 5 , thereby reducing heat transfer from the electrical device 11 to the optical device 12 through the boss portion 31 , and optimizing the heat dissipation efficiency of the optical device 12 .

[0071] In some other implementations, such as the attached Figure 4 As shown, both the boss portion 31 and the base plate portion 32 of the heat sink 3 have a thermal interruption structure 5. The boss portion 31 and the base plate portion 32 of the heat sink 3 constitute the main heat transfer medium for transferring heat from the electrical device 11 to the optical device 12. By simultaneously arranging the thermal interruption structure 5 on the boss portion 31 and the base plate portion 32, compared with arranging the thermal interruption structure 5 on the boss portion 31 alone, the heat transfer from the electrical device 11 to the optical device 12 through the heat sink 3 can be further isolated, and the thermal crosstalk of the electrical device 11 to the optical device 12 can be more efficiently curbed.

[0072] In some examples, such as the attached Figure 4 As shown, the thermal interruption structure 5 on the boss portion 31 is connected to the thermal interruption structure 5 on the base plate portion 32 , so that the two cooperate to form an integral thermal interruption structure 5 , thereby further improving the thermal isolation effect.

[0073] In some other implementations, such as the attached Fig.18 As shown, the boss portion 31 , the substrate portion 32 and the optical module housing 10 all have a thermal interruption structure 5 . By further adding the thermal interruption structure 5 to the optical module housing 10 , the thermal crosstalk of the electrical device 11 to the optical device 12 can be further curbed, thereby improving the heat dissipation efficiency of the optical device 12 .

[0074] In some examples, such as the attached Fig.18 As shown, the heat interruption structure 5 on the boss portion 31 , the heat interruption structure 5 on the base portion 32 , and the heat interruption structure 5 on the optical module housing 10 are positioned relative to and connected to each other to enhance the heat isolation effect.

[0075] Of course, an implementation scheme that is not excluded is that, in the optical module assembly, the thermal interruption structure 5 is only provided on the optical module housing 10 .

[0076] In some implementations, the thermal interruption structure 5 provided in the embodiment of the present disclosure includes at least one of a groove structure and a through-hole structure, wherein the groove structure is a hole structure with one end open and the other end closed, and the through-hole structure is a hole structure with both opposite ends open and connected, and air is contained in the groove structure and the through-hole structure, and a thermal interruption is formed based on the low thermal conductivity of air.

[0077] One example is that the thermal interruption structure 5 is a groove structure; another example is that the thermal interruption structure 5 is a through-hole structure; and yet another example is that the thermal interruption structure 5 includes both the groove structure and the through-hole structure.

[0078] It can be seen that the embodiment of the present disclosure provides a thermal interruption structure 5 on the boss portion 31 and the base plate portion 32 of the heat sink 3, and on the wall of the optical cage 2 connected to the heat sink 3. The thermal interruption structure 5 is a groove structure and / or a through-hole structure, and utilizes the low thermal conductivity of air to form a thermal interruption, thereby physically reducing the heat transfer from the electrical device 11 to the optical device 12 through at least one of the boss portion 31 and the base plate portion 32 of the heat sink 3 and the optical module housing 10, thereby preventing the electrical device 11 from generating thermal crosstalk to the optical device 12.

[0079] In some other implementations, at least one of the groove structure and the through-hole structure mentioned above may be filled with a thermal insulation material, such as silicon dioxide, to achieve an excellent thermal barrier effect.

[0080] In the embodiment of the present disclosure, along the distribution direction of the electrical devices 11 and the optical devices 12, the thermal interruption structures 5 are arranged as a group or multiple groups distributed at intervals. Figure 5 The heat interruption structure 5 is provided as a group. When the temperature specification difference between the electrical device 11 and the optical device 12 is large, or the space between the electrical device 11 and the optical device 12 is large, the heat interruption structure 5 can also be provided as multiple groups distributed at intervals to improve the heat isolation efficiency.

[0081] The distribution direction of the electrical device 11 and the optical device 12 refers to the direction of the line between the position of the electrical device 11 and the position of the optical device 12. Figure 2 In the figure, the distribution direction of the electrical devices 11 and the optical devices 12 is horizontal.

[0082] Regarding the assembly method of each component in the optical module assembly, one example is that the bottom surface of the optical cage 2 is fitted with the printed circuit board 4, and after the boss portion 31 of the heat sink 3 passes through the opening 21 of the optical cage 2, the first surface of the boss portion 31 is fitted with the optical module housing 10 of the optical module 1, and the second surface of the boss portion 31 is fitted with the first surface of the substrate portion 32, and the second surface of the substrate portion 32 has a fin portion 33. The heat of the optical module 1 is sequentially conducted to the fin portion 33 through the boss portion 31 and the substrate portion 32, and the wind blows through the fin portion 33 to dissipate the heat.

[0083] In some examples, in order to support repeated plugging and unplugging of the optical module 1, the heat sink 3 is connected to the optical cage 2 through an elastic structure. For example, the elastic structure can be arranged on the surface of the substrate portion 32 of the heat sink 3 facing the optical module 1, or the elastic structure can also be arranged on the surface of the optical module 1 away from the heat sink 3.

[0084] Before the optical module 1 is inserted into the optical cage 2 , the elastic structure is in a relaxed state. After the optical module 1 is inserted into the optical cage 2 , the elastic structure switches to a deformed state and provides elastic force to make the boss portion 31 of the heat sink 3 and the optical module 1 in close contact.

[0085] In addition, according to actual application requirements, in the optical module assembly package, the number of optical modules 1, optical cages 2 and heat sinks 3 can be set to one group or multiple groups. For example, the optical module 1, optical cages 2 and heat sinks 3 are collectively referred to as optical module heat sink units 001. Then, a group of optical module heat sink units 001 can be set on the printed circuit board 4, or as shown in the attached figure Figure 3 As shown, multiple groups of optical module heat dissipation units 001 are arranged on the printed circuit board 4. In addition, Figure 3 It is also illustrated that a plurality of groups of optical module heat dissipation units 001 are arranged side by side and spaced apart in sequence.

[0086] With respect to the various arrangements of the thermal interruption structure 5 involved above, the arrangements of the thermal interruption structure 5 are further described in detail below in combination with different embodiments.

[0087] In some embodiments (1), there is provided an optical module assembly, as shown in the attached Figure 4 -Attached Figure 7 As shown, the optical module assembly includes: an optical module 1, an optical cage 2, a heat sink 3 and a printed circuit board 4. The optical module 1 is electrically connected to the printed circuit board 4, and the optical module 1 includes an electrical device 11 and an optical device 12 that are spaced apart. The optical cage 2 is fixedly connected to the printed circuit board 4 and accommodates the optical module 1, and at least one wall of the optical cage 2 has an opening 21. The heat sink 3 includes a boss portion 31, a base portion 32 and a fin portion 33 that are connected in sequence, and the boss portion 31 passes through the opening 21 of the optical cage 2 and fits with the optical module housing 10 of the optical module 1.

[0088] The optical module assembly also includes a thermal interruption structure 5, the projection of which on the optical module 1 is located between the electrical device 11 and the optical device 12. Figure 4 As shown, the thermal interruption structure 5 includes: a first thermal interruption structure 51 and a second thermal interruption structure 52; Figure 5 and Figure 6 It can be seen that the first thermal interruption structure 51 includes a groove structure, and the groove structure is located on the surface of the boss portion 31 facing the optical module 1; the second thermal interruption structure 52 includes a plurality of spaced through-hole structures, and the through-hole structure at least penetrates the substrate portion 32 and the surface of the boss portion 31 facing the substrate portion 32; the second thermal interruption structure 52 is connected to the first thermal interruption structure 51.

[0089] For the first heat interruption structure 51 in the form of a groove structure, in combination with the attached Figure 7 As shown, the opening end of the groove structure penetrates to the surface of the boss portion 31 facing the optical module 1 , and the bottom end of the groove structure is located inside the boss portion 31 and does not extend to the surface of the boss portion 31 facing the substrate portion 32 .

[0090] If the distribution direction between the electrical device 11 and the optical device 12 is defined as the first direction, then the first thermal interruption structure 51 extends along the second direction (i.e., the central axis direction of the first thermal interruption structure 51 is the same as the second direction), wherein the second direction and the first direction have an angle, which can be, for example, 20° to 90°, and further can be 60° to 90°. For example, Figure 4 The central axis direction of the first heat interruption structure 51 is illustrated, that is, the angle between the second direction and the first direction is 90°, that is, the two are perpendicular to each other.

[0091] As attached Figure 5 and Figure 6 As shown, the first thermal interruption structure 51 may be a single groove structure, and both ends of the single groove structure respectively penetrate to the corresponding side walls of the boss portion 31 . This structural arrangement is conducive to simplifying the molding preparation of the first thermal interruption structure 51 .

[0092] Alternatively, the first heat interruption structure 51 may also include a plurality of groove structures, and the plurality of groove structures may be sequentially spaced and distributed along the second direction (not shown in the figure).

[0093] The shape of the groove structure corresponding to the first thermal interruption structure 51 may be a common geometric shape, for example, it may be a regular geometric shape (rectangular groove, arc groove, trapezoidal groove, etc.), or it may also be an irregular geometric shape.

[0094] For example, the projection shape of the groove structure corresponding to the first thermal interruption structure 51 on the plane perpendicular to the groove depth direction includes but is not limited to: rectangle, square, ellipse, arc (such as "C" shape), etc., and the cross-sectional shape of the groove structure corresponding to the first thermal interruption structure 51 in the groove depth direction includes but is not limited to rectangle, square, V-shape, arc (such as semicircle, etc.). Among them, the groove depth direction is the direction perpendicular to the plane where the boss portion 31 or the substrate portion 32 is located. The above-mentioned type of first thermal interruption structure 51 has the advantages of simple and convenient molding and preparation, and more controllable size.

[0095] As attached Figure 5 and Figure 6 As shown, the second thermal interruption structure 52 includes a plurality of through-hole structures, which can be sequentially spaced and distributed along the second direction. Each through-hole structure corresponding to the second thermal interruption structure 52 is respectively connected to a corresponding position in the groove structure corresponding to the first thermal interruption structure 51, thereby fully achieving thermal isolation between the electrical device 11 and the optical device 12.

[0096] The shape of the through hole structure corresponding to the second thermal interruption structure 52 can be a common geometric shape, for example, it can be a regular geometric shape (circular hole, elliptical hole, arc hole, rectangular hole, square hole, trapezoidal hole, etc.), or it can also be an irregular geometric shape.

[0097] For example, the projection shape of the through hole structure corresponding to the second thermal interruption structure 52 on a plane perpendicular to the groove depth direction includes but is not limited to: circle, ellipse, rectangle, square, etc. The above-mentioned second thermal interruption structure 52 has the advantages of simple and convenient molding and preparation, and more controllable size.

[0098] The shapes and sizes of the plurality of through-hole structures corresponding to the second thermal interruption structure 52 may be the same as each other, may be partially the same as each other, or may be different from each other. For example, Figure 6 It is illustrated that the shapes and sizes of the plurality of through-hole structures corresponding to the second heat interruption structure 52 are the same as each other to simplify the manufacturing process.

[0099] In implementation scheme (1), when heat from the electrical device 11 is transferred from the boss portion 31 and the substrate portion 32 of the heat sink 3 to the optical device 12 in the horizontal direction, the connected first thermal interruption structure 51 and the second thermal interruption structure 52 realize thermal interruption in the horizontal direction, thereby reducing the transfer of heat energy from the area where the electrical device 11 is located to the area where the optical device 12 is located, and effectively avoiding thermal crosstalk from the electrical device 11 to the optical device 12.

[0100] It is not excluded that in other embodiments, the thermal interruption structure 5 includes a first thermal interruption structure 51 and a second thermal interruption structure 52, wherein the first thermal interruption structure 51 can refer to the first thermal interruption structure 51 described in the above embodiment (1). The difference between the second thermal interruption structure 52 and the above embodiment (1) is that the second thermal interruption structure 52 can include a plurality of spaced groove structures, and the groove structure is either only located in the substrate portion 32, or penetrates the substrate portion 32 and partially extends to the surface of the boss portion 31 facing the substrate portion 32, and the second thermal interruption structure 52 is not connected to the first thermal interruption structure 51.

[0101] In some embodiments (2), an optical module assembly is provided, as shown in the attached Figure 8 -Attached Fig.11 As shown, the optical module assembly includes: an optical module 1, an optical cage 2, a heat sink 3 and a printed circuit board 4. The optical module 1 is electrically connected to the printed circuit board 4, and the optical module 1 includes an electrical device 11 and an optical device 12 that are spaced apart. The optical cage 2 is fixedly connected to the printed circuit board 4 and accommodates the optical module 1, and at least one wall of the optical cage 2 has an opening 21. The heat sink 3 includes a boss portion 31, a base portion 32 and a fin portion 33 that are connected in sequence, and the boss portion 31 passes through the opening 21 of the optical cage 2 and fits with the optical module housing 10 of the optical module 1.

[0102] The optical module assembly also includes a thermal interruption structure 5, the projection of which on the optical module 1 is located between the electrical device 11 and the optical device 12. Fig.12 As shown, the thermal interruption structure 5 includes a first thermal interruption structure 51 and a second thermal interruption structure 52; Fig. 9 and Fig.10 It can be seen that the first thermal interruption structure 51 includes a plurality of through-hole structures distributed at intervals, and the through-hole structures pass through the boss portion 31; the second thermal interruption structure 52 includes a plurality of through-hole structures distributed at intervals, and the through-hole structures pass through the substrate portion 32; the plurality of through-hole structures in the second thermal interruption structure 52 are connected one-to-one with the plurality of through-hole structures in the first thermal interruption structure 51.

[0103] As attached Fig.10 As shown, the first thermal interruption structure 51 includes a plurality of through-hole structures, which can be sequentially spaced and distributed along the second direction, and as shown in the attached Fig. 9 As shown, the second thermal interruption structure 52 includes a plurality of through-hole structures, which can be sequentially spaced and distributed along the second direction. Each through-hole structure corresponding to the second thermal interruption structure 52 is connected to each through-hole structure corresponding to the first thermal interruption structure 51 in a one-to-one correspondence, thereby fully achieving thermal isolation between the electrical device 11 and the optical device 12.

[0104] The shapes of the through-hole structures corresponding to the first thermal interruption structure 51 and the second thermal interruption structure 52 can be common geometric shapes, for example, they can be regular geometric shapes (circular holes, elliptical holes, arc holes, rectangular holes, square holes, trapezoidal holes, etc.), or they can also be irregular geometric shapes.

[0105] For example, the projection shapes of the through hole structures corresponding to the first thermal interruption structure 51 and the second thermal interruption structure 52 on the plane perpendicular to the groove depth direction include but are not limited to: circle, ellipse, rectangle, square, etc. The above-mentioned through hole structures have the advantages of simple and convenient molding and preparation, and more controllable size.

[0106] The shapes and sizes of the plurality of through-hole structures corresponding to the first thermal interruption structure 51 may be the same, partially the same, or different from each other, and the shapes and sizes of the plurality of through-hole structures corresponding to the second thermal interruption structure 52 may be the same, partially the same, or different from each other. For example, Fig. 9 and Fig.10 It is illustrated that the shapes and sizes of the plurality of through-hole structures corresponding to the first heat interruption structure 51 and the second heat interruption structure 52 are the same as each other to simplify the manufacturing process.

[0107] In implementation scheme (2), the shape and size of the through-hole structure corresponding to the first thermal interrupt structure 51 can be the same as the shape and size of the through-hole structure corresponding to the first thermal interrupt structure 51, and the central axes of the two coincide with each other, which is conducive to preparing an integral through-hole on the boss portion 31 and the substrate portion 32 through a one-time molding process, and serving as the first thermal interrupt structure 51 and the second thermal interrupt structure 52 respectively.

[0108] In some embodiments (3), an optical module assembly is provided, as shown in the attached Fig.12 -Attached Fig.14 As shown, the optical module assembly includes: an optical module 1, an optical cage 2, a heat sink 3 and a printed circuit board 4. The optical module 1 is electrically connected to the printed circuit board 4, and the optical module 1 includes an electrical device 11 and an optical device 12 that are spaced apart. The optical cage 2 is fixedly connected to the printed circuit board 4 and accommodates the optical module 1, and at least one wall of the optical cage 2 has an opening 21. The heat sink 3 includes a boss portion 31, a base portion 32 and a fin portion 33 that are connected in sequence, and the boss portion 31 passes through the opening 21 of the optical cage 2 and fits with the optical module housing 10 of the optical module 1.

[0109] The optical module assembly also includes a thermal interruption structure 5, the projection of which on the optical module 1 is located between the electrical device 11 and the optical device 12, and the thermal interruption structure 5 includes a first thermal interruption structure 51 and a second thermal interruption structure 52; Fig.12 -Attached Fig.14As shown, the first thermal interruption structure 51 includes a single through-hole structure and penetrates the boss portion 31 to separate the boss portion 31 into at least two bosses 310; Fig.12 -Attached Fig.14 As shown, the second thermal interruption structure 52 includes a plurality of through-hole structures that are spaced apart, and the through-hole structures penetrate the substrate portion 32 ; the second thermal interruption structure 52 is connected to the first thermal interruption structure 51 .

[0110] The first thermal interruption structure 51 includes a single through-hole structure, the upper end of which extends to the surface of the boss portion 31 facing the optical module 1, and the lower end of which extends to the surface of the boss portion 31 facing the substrate portion 32, and the two ends of the single through-hole structure along the second direction respectively penetrate the corresponding side walls of the boss portion 31, so that the boss portion 31 is divided into at least two bosses 310. That is, in embodiment (3), the heat sink 3 can include a plurality of bosses 310 distributed at intervals.

[0111] The second thermal interruption structure 52 includes a plurality of through-hole structures, which may be spaced apart in sequence along the second direction. Each through-hole structure corresponding to the second thermal interruption structure 52 is respectively connected to a corresponding position of a through-hole structure corresponding to the first thermal interruption structure 51, thereby fully realizing thermal isolation between the electrical device 11 and the optical device 12.

[0112] The shape of the through hole structure corresponding to the second thermal interruption structure 52 can be a common geometric shape, for example, it can be a regular geometric shape (circular hole, elliptical hole, arc hole, rectangular hole, square hole, trapezoidal hole, etc.), or it can also be an irregular geometric shape.

[0113] For example, the projection shape of the through hole structure corresponding to the second thermal interruption structure 52 on a plane perpendicular to the groove depth direction includes but is not limited to: circle, ellipse, rectangle, square, etc. The above-mentioned through hole structure has the advantages of simple and convenient molding and preparation, and more controllable size.

[0114] The shapes and sizes of the plurality of through-hole structures corresponding to the second thermal interruption structure 52 may be the same as each other, may be partially the same as each other, or may be different from each other. For example, Fig.13 and Fig.14 It is illustrated that the shapes and sizes of the plurality of through-hole structures corresponding to the second heat interruption structure 52 are the same as each other to simplify the manufacturing process.

[0115] In implementation scheme (3), as shown in the attached Fig.12 As shown, the size of the through-hole structure corresponding to the first thermal interruption structure 51 along the first direction may be greater than or equal to the size of the through-hole structure corresponding to the second thermal interruption structure 52 along the first direction.

[0116] In some embodiments (4), there is provided an optical module assembly, as shown in the attached Fig.15 As shown, the optical module assembly includes: an optical module 1, an optical cage 2, a heat sink 3 and a printed circuit board 4. The optical module 1 is electrically connected to the printed circuit board 4, and the optical module 1 includes an electrical device 11 and an optical device 12 that are spaced apart. The optical cage 2 is fixedly connected to the printed circuit board 4 and accommodates the optical module 1, and at least one wall of the optical cage 2 has an opening 21. The heat sink 3 includes a boss portion 31, a base portion 32 and a fin portion 33 that are connected in sequence, and the boss portion 31 passes through the opening 21 of the optical cage 2 and fits with the optical module housing 10 of the optical module 1.

[0117] The optical module assembly also includes a thermal interruption structure 5, the projection of which on the optical module 1 is located between the electrical device 11 and the optical device 12. Fig.15 As shown, the thermal interruption structure 5 includes a first thermal interruption structure 51 and a second thermal interruption structure 52; the first thermal interruption structure 51 includes a single through-hole structure and passes through the boss portion 31 to separate the boss portion 31 into at least two bosses 310. The second thermal interruption structure 52 includes a single through-hole structure and passes through the substrate portion 32 to separate the substrate portion 32 into at least two substrates 320. The second thermal interruption structure 52 is connected to the first thermal interruption structure 51, and at least two bosses 310 correspond to at least two substrates 320 one by one, and the corresponding bosses and substrates, as well as the corresponding parts of the fin portion 33 cooperate to form an independent sub-heat sink.

[0118] The first thermal interruption structure 51 includes a single through-hole structure, with its upper end extending to the surface of the boss portion 31 facing the optical module 1, and its lower end extending to the surface of the boss portion 31 facing the substrate portion 32, and the two ends of the single through-hole structure along the second direction respectively penetrate the corresponding side walls of the boss portion 31, so that the boss portion 31 is divided into at least two bosses 310.

[0119] The second thermal interruption structure 52 includes a single through-hole structure, whose upper end extends to the surface of the substrate portion 32 facing the fin portion 33, and whose lower end extends to the surface of the substrate portion 32 facing the boss portion 31, and the two ends of the single through-hole structure along the second direction respectively penetrate the corresponding side walls of the substrate portion 32, so that the substrate portion 32 is separated into at least two substrates 320.

[0120] At least two bosses 310 correspond to at least two substrates 320 one by one, and the corresponding bosses 310 and substrates 320, as well as the corresponding parts of the fin portion 33, cooperate to form an independent sub-heat sink, that is, in embodiment (4), the heat sink 3 may include a plurality of sub-heat sinks distributed at intervals. Embodiment (4) uses an independent heat sink 3 for the optical device 12 and the electrical device 11 respectively, and compared with the overall heat dissipation solution, further reduces the heat transfer from the electrical device 11 to the optical device 12, thereby optimizing the heat dissipation efficiency of the optical device 12.

[0121] In implementation (4), the size of the through-hole structure corresponding to the first thermal interruption structure 51 along the first direction may be greater than or equal to the size of the through-hole structure corresponding to the second thermal interruption structure 52 along the first direction.

[0122] In some embodiments (5), an optical module assembly is provided, which includes: an optical module 1, an optical cage 2, a heat sink 3 and a printed circuit board 4. The optical module 1 is electrically connected to the printed circuit board 4, and includes an electrical device 11 and an optical device 12 that are spaced apart. The optical cage 2 is fixedly connected to the printed circuit board 4 and accommodates the optical module 1, and at least one wall of the optical cage 2 has an opening 21. The heat sink 3 includes a boss portion 31, a base portion 32 and a fin portion 33 that are connected in sequence, and the boss portion 31 passes through the opening 21 of the optical cage 2 and fits with the optical module housing 10 of the optical module 1.

[0123] The optical module assembly also includes a thermal interruption structure 5, the projection of which on the optical module 1 is located between the electrical device 11 and the optical device 12. Fig.16 As shown, the heat interruption structure 5 includes a groove structure, and the groove structure is located on the surface of the optical module housing 10 facing the boss portion 31. Fig.17 As shown, the heat interruption structure 5 includes a through hole structure, and the through hole structure penetrates the wall of the optical module housing 10 facing the boss portion 31. Among them, the heat interruption structure 5 with a through hole structure has a more excellent heat blocking effect.

[0124] Through implementation scheme (5), the heat transfer from the electrical device 11 to the optical device 12 through the optical module housing 10 is effectively reduced, thereby optimizing the heat dissipation efficiency of the optical device 12.

[0125] Further integration Fig.18, which illustrates an implementation scheme in implementation scheme (5), the thermal interruption structure 5 includes a first thermal interruption structure 51, a second thermal interruption structure 52 and a third thermal interruption structure 53. The first thermal interruption structure 51 includes a plurality of through-hole structures distributed at intervals, and the through-hole structures penetrate the boss portion 31; the second thermal interruption structure 52 includes a plurality of through-hole structures distributed at intervals, and the through-hole structures penetrate the substrate portion 32; the third thermal interruption structure 53 includes a plurality of through-hole structures distributed at intervals, and the through-hole structures penetrate the wall of the optical module housing 10 facing the boss portion 31.

[0126] The multiple through-hole structures in the third thermal interruption structure 53 , the multiple through-hole structures in the second thermal interruption structure 52 , and the multiple through-hole structures in the first thermal interruption structure 51 are connected in a one-to-one correspondence.

[0127] On the other hand, an embodiment of the present disclosure provides a communication device, which includes any of the above-mentioned optical module assemblies. The communication device provided by the embodiment of the present disclosure has all the advantages of the above-mentioned optical module assemblies.

[0128] Exemplarily, the types of communication devices include, but are not limited to: network equipment (eg, routers, transmission network equipment, etc.), wireless base stations, servers, etc.

[0129] In some examples, the communication device may further include an outer shell, a power supply, a fan, etc. The power supply is used to provide a power distribution function for the communication device, and the fan is used to provide the air volume required for cooling.

[0130] The above description is only for the purpose of facilitating those skilled in the art to understand the technical solution of the present disclosure and is not intended to limit the present disclosure. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present disclosure shall be included in the protection scope of the present disclosure.

Claims

1. An optical module assembly, characterized in that: The optical module assembly comprises: an optical module (1), an optical cage (2), a heat sink (3) and a printed circuit board (4); The optical module (1) is electrically connected to the printed circuit board (4), and comprises an optical module housing (10), and electrical components (11) and optical components (12) that are spaced apart and distributed inside the optical module housing (10); The optical cage (2) is fixedly connected to the printed circuit board (4) and accommodates the optical module (1), and at least one wall of the optical cage (2) has an opening (21); The heat sink (3) comprises: a boss portion (31), a base portion (32) and a fin portion (33) connected in sequence, the boss portion (31) passing through the opening (21) of the optical cage (2) and fitting with the optical module housing (10) of the optical module (1); At least one of the boss portion (31), the base plate portion (32) and the optical module housing (10) has a thermal interruption structure (5), and a projection of the thermal interruption structure (5) on the optical module (1) is located between the electrical device (11) and the optical device (12).

2. The optical module assembly according to claim 1, characterized in that: The boss portion (31) and the base portion (32) both have the heat interruption structure (5).

3. The optical module assembly according to claim 2, characterized in that: The thermal interruption structure (5) on the boss portion (31) is connected to the thermal interruption structure (5) on the base plate portion (32).

4. The optical module assembly according to claim 1, characterized in that: The boss portion (31), the base plate portion (32) and the optical module housing (10) all have the thermal interruption structure (5).

5. The optical module assembly according to claim 1, characterized in that: Along the distribution direction between the electrical device (11) and the optical device (12), the thermal interruption structures (5) are arranged as a group or a plurality of groups distributed at intervals.

6. The optical module assembly according to any one of claims 1 to 5, characterized in that: The thermal interruption structure (5) comprises at least one of a groove structure and a through-hole structure.

7. The optical module assembly according to claim 6, characterized in that: The thermal interruption structure (5) comprises a first thermal interruption structure (51) and a second thermal interruption structure (52); The first heat interruption structure (51) comprises a groove structure, and the groove structure is located on a surface of the boss portion (31) facing the optical module (1); The second thermal interruption structure (52) comprises a plurality of through-hole structures distributed at intervals, and the through-hole structures penetrate the substrate portion (32) and the surface of the boss portion (31) facing the substrate portion (32); The second heat interruption structure (52) is connected to the first heat interruption structure (51).

8. The optical module assembly according to claim 6, characterized in that: The thermal interruption structure (5) comprises a first thermal interruption structure (51) and a second thermal interruption structure (52); The first heat interruption structure (51) comprises a plurality of through-hole structures distributed at intervals, and the through-hole structures penetrate the boss portion (31); The second thermal interruption structure (52) comprises a plurality of through-hole structures distributed at intervals, and the through-hole structures penetrate the substrate portion (32); The plurality of through-hole structures in the second thermal interruption structure (52) are connected to the plurality of through-hole structures in the first thermal interruption structure (51) in a one-to-one correspondence.

9. The optical module assembly according to claim 6, characterized in that: The thermal interruption structure (5) comprises a first thermal interruption structure (51) and a second thermal interruption structure (52); The first heat interruption structure (51) comprises a single through-hole structure and penetrates the boss portion (31) so as to separate the boss portion (31) into at least two bosses (310); The second thermal interruption structure (52) comprises a plurality of through-hole structures distributed at intervals, and the through-hole structures penetrate the substrate portion (32); The second heat interruption structure (52) is connected to the first heat interruption structure (51).

10. The optical module assembly according to claim 6, characterized in that: The thermal interruption structure (5) comprises a first thermal interruption structure (51) and a second thermal interruption structure (52); The first heat interruption structure (51) comprises a single through-hole structure and penetrates the boss portion (31) so as to separate the boss portion (31) into at least two bosses (310); The second thermal interruption structure (52) includes a single through-hole structure and penetrates the substrate portion (32) to separate the substrate portion (32) into at least two substrates (320); The second thermal interruption structure (52) is connected to the first thermal interruption structure (51), and the at least two bosses (310) correspond to the at least two substrates (320) one by one, and the corresponding bosses (310) and the substrates (320), as well as the corresponding parts of the fin portion (33), cooperate to form an independent sub-heat sink.

11. The optical module assembly according to claim 6, characterized in that: The heat interruption structure (5) comprises a groove structure, and the groove structure is located on a surface of the optical module housing (10) facing the boss portion (31).

12. The optical module assembly according to claim 6, characterized in that: The heat interruption structure (5) comprises a through hole structure, and the through hole structure passes through a wall of the optical module housing (10) facing the boss portion (31).

13. A communication device, characterized in that: The communication device comprises the optical module assembly according to any one of claims 1-12.

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