Electronic device

Abstract

The utility model provides electronic equipment, and belongs to the technical field of electronic equipment, and the electronic equipment comprises a frame assembly which is provided with a containing cavity; the circuit board assembly is arranged in the accommodating cavity, and a through hole is formed in the circuit board assembly; the first connecting piece penetrates through the through hole and is connected with the frame body assembly, so that the circuit board assembly is electrically conducted with the frame body assembly; at least one of the frame assembly and the circuit board assembly is provided with a heat insulation structure at the position where the first connecting piece is located.

Description

Technical Field

[0001] The present application belongs to the technical field of electronic equipment, and specifically relates to an electronic equipment. Background Art

[0002] At present, with the increasing demand for communication functions such as mobile phones, the demand for satellite communications has led to an increase in mobile phone antennas, and the metallization of mobile phone casings is also a consumer demand, resulting in conflicts between the thermal design of mobile phones and the antenna performance design. Specifically, the antenna circuit board needs to be grounded by connecting to the frame, and the connection between the circuit board and the frame will cause the heat of the circuit board to be quickly transferred to the frame, thereby affecting the frame temperature of the electronic device. Utility Model Content

[0003] The present application aims to provide an electronic device that can solve the technical problem that the circuit board of the electronic device is easily heat-conducted to the frame.

[0004] In order to solve the above technical problems, this application is implemented as follows:

[0005] The present application provides an electronic device, including:

[0006] A frame assembly, the frame assembly having a receiving cavity;

[0007] A circuit board assembly is disposed in the accommodating cavity, and the circuit board assembly is provided with a through hole; a first connector is passed through the through hole and connected to the frame assembly so that the circuit board assembly and the frame assembly are electrically connected;

[0008] Wherein, at the position where the first connecting member is located, at least one of the frame assembly and the circuit board assembly has a heat insulation structure.

[0009] In an embodiment of the present application, the electronic device includes a circuit board assembly, a frame assembly and a first connector, the frame assembly has a accommodating cavity, the circuit board assembly is arranged in the accommodating cavity, the circuit board assembly has a through hole, the first connector passes through the through hole and is connected to the frame assembly, so that the circuit board assembly and the frame assembly are relatively fixed, and, in the case of such a fixed connection, electrical conduction between the circuit board assembly and the frame assembly can be achieved, and the circuit board assembly can be grounded.

[0010] Furthermore, at the position where the first connecting member is located, at least one of the frame assembly and the circuit board assembly has a thermal insulation structure, that is, the connection position between the frame assembly and the circuit board assembly has a thermal insulation structure. The thermal insulation structure can reduce the heat conduction effect of the circuit board assembly to the frame assembly and reduce the temperature of the frame assembly.

[0011] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0013] Figure 1 A cross-sectional view of an electronic device provided by one embodiment of the present application is shown;

[0014] Figure 2 A cross-sectional view of an electronic device provided by one embodiment of the present application is shown;

[0015] Figure 3 A cross-sectional view of an electronic device provided by one embodiment of the present application is shown;

[0016] Figure 4 A cross-sectional view of an electronic device provided by one embodiment of the present application is shown;

[0017] Figures 1 to 4 Reference numerals:

[0018] 100 electronic device, 110 frame assembly, 112 accommodating cavity, 114 bottom wall, 116 frame, 118 first conductive frame, 120 second conductive frame, 122 third thermal insulation member, 124 conductive plate, 126 boss, 128 first thermal insulation member, 130 second thermal insulation member, 132 second connecting member, 140 circuit board assembly, 142 through hole, 144 insulating substrate, 146 conductive layer, 150 first connecting member, 160 gasket, 170 grounding member, 180 screen assembly, 190 thermal conductive member. DETAILED DESCRIPTION

[0019] The embodiments of the present application will be described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and should not be construed as limitations on the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without making creative work are within the scope of protection of the present application.

[0020] The term "first" or "second" in the specification and claims of this application may include one or more of the features explicitly or implicitly. In the description of this application, unless otherwise specified, "plurality" means two or more. In addition, "and / or" in the specification and claims means at least one of the connected objects, and the character " / " generally means that the objects connected before and after are in an "or" relationship.

[0021] In the description of the present application, it should be understood that the terms "upper", "inner", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.

[0022] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0023] Combine the following Figures 1 to 4 An electronic device 100 according to an embodiment of the present application.

[0024] like Figures 1 to 4 As shown, the present application provides an electronic device 100, including: a frame assembly 110, the frame assembly 110 has a receiving cavity 112; a circuit board assembly 140, the circuit board assembly 140 is arranged in the receiving cavity 112, and the circuit board assembly 140 is provided with a through hole 142; a first connector 150, which is passed through the through hole 142 and connected to the frame assembly 110, so that the circuit board assembly 140 is electrically conductive with the frame assembly 110; wherein, at the position where the first connector 150 is located, at least one of the frame assembly 110 and the circuit board assembly 140 has a heat insulation structure.

[0025] In an embodiment of the present application, the electronic device 100 includes a circuit board assembly 140, a frame assembly 110 and a first connector 150. The frame assembly 110 has a accommodating cavity 112. The circuit board assembly 140 is arranged in the accommodating cavity 112. The circuit board assembly 140 has a through hole 142. The first connector 150 passes through the through hole 142 and is connected to the frame assembly 110, so that the circuit board assembly 140 and the frame assembly 110 are relatively fixed. In addition, in the case of such a fixed connection, electrical conduction between the circuit board assembly 140 and the frame assembly 110 can be achieved, and the circuit board assembly 140 can be grounded.

[0026] Furthermore, at the position where the first connecting member 150 is located, at least one of the frame assembly 110 and the circuit board assembly 140 has a heat insulation structure, that is, the connection position between the frame assembly 110 and the circuit board assembly 140 has a heat insulation structure. The heat insulation structure can reduce the heat conduction effect of the circuit board assembly 140 to the frame assembly 110, thereby reducing the temperature of the frame assembly 110.

[0027] At the position where the first connecting member 150 is located, the frame assembly 110 has a heat insulation structure, the circuit board assembly 140 has a heat insulation structure, or both the frame assembly 110 and the circuit board assembly 140 have a heat insulation structure.

[0028] like Figure 1 and Figure 4 As shown, as a possible implementation, the circuit board assembly 140 includes: an insulating substrate 144; a conductive layer 146 disposed on the surface of the insulating substrate 144, and the conductive layer 146 and the frame assembly 110 are electrically connected.

[0029] Specifically, the circuit board assembly 140 may have a heat-insulating structure, the circuit board assembly 140 includes an insulating substrate 144 and a conductive layer 146, the conductive layer 146 is arranged on the surface of the insulating substrate 144, the conductive layer 146 and the frame assembly 110 are electrically connected, the insulating substrate 144, the conductive layer 146 and the frame assembly 110 are stacked in sequence, the circuit board assembly 140 can be electrically connected with the conductive layer 146 and the frame assembly 110, thereby achieving grounding of the circuit board assembly 140, and by arranging the conductive layer 146 on the insulating substrate 144, the circuit board assembly 140 transfers heat to the frame assembly 110 only through the conductive layer 146, thereby reducing the heat transfer efficiency and reducing the temperature rise of the frame assembly 110. Among them, the insulating substrate 144 and the conductive layer 146 form a heat-insulating structure.

[0030] The insulating substrate 144 and the conductive layer 146 both have through holes 142, so that the first connector 150 can pass through the insulating substrate 144 and the conductive layer 146 and connect to the frame assembly 110, thereby ensuring the connection strength between the circuit board assembly 140 and the frame assembly 110. The insulating substrate 144 can be made of materials such as polypropylene.

[0031] Optionally, the first connector 150 may be a screw or a rivet, etc. The first connector 150 passes through the insulating substrate 144 and the conductive layer 146 and is connected to the frame assembly 110. The connection between the first connector 150 and the frame assembly 110 may be a detachable connection or a non-detachable connection.

[0032] like Figure 1 and Figure 4 As shown, as a possible implementation, the insulating substrate 144 is obtained by etching the circuit board assembly 140 .

[0033] Specifically, the insulating substrate 144 is obtained by etching away the middle copper layer of the circuit board assembly 140, that is, the circuit board assembly 140 is a multi-layer structure, and the surface layer of the circuit board assembly 140 has a conductive layer 146 to achieve grounding of the circuit board assembly 140. The circuit board assembly 140 removes the middle copper layer of the multi-layer structure by etching, and only retains the substrate, thereby forming the insulating substrate 144. Since the middle copper layer is removed, the heat conduction performance is reduced, thereby reducing the heat transferred from the circuit board assembly 140 to the frame assembly 110.

[0034] That is, part of the copper layer of the circuit board assembly 140 is etched away to leave only the laminated material of the insulating substrate 144 and the conductive layer 146 on the surface. The conductive layer 146 can be a copper layer, so that the grounding of the circuit board assembly 140 and the frame assembly 110 meets the antenna requirements. The material of the insulating substrate 144 is not heat-conductive and the conductive layer 146 is thin, and the heat transfer effect is poor. This reduces the direct heat transfer between the frame assembly 110 and the circuit board assembly 140, and the heat source will not be directly transferred to the frame assembly 110 through the contact of the various copper layers of the circuit board assembly 140.

[0035] like Figure 1 , Figure 2 and Figure 3 As shown, as a possible implementation, a gasket 160 is provided between the frame assembly 110 and the circuit board assembly 140 at the location of the first connector 150 , and the gasket 160 is an alumina ceramic gasket, a polystyrene gasket or a manganese oxide gasket.

[0036] Specifically, at the position where the first connector 150 is located, a gasket 160 is provided between the frame assembly 110 and the circuit board assembly 140 , so that direct contact between the frame assembly 110 and the circuit board assembly 140 is avoided through the gasket 160 , thereby reducing the possibility of damage to the circuit board assembly 140 due to excessive force.

[0037] That is, the gasket 160 is conductive, and the gasket 160 can be made of metal, conductive rubber or conductive ceramic, etc. The insulating substrate 144, the conductive layer 146, the gasket 160 and the frame assembly 110 are stacked in sequence, and the connection of the conductive layer 146, the gasket 160 and the frame assembly 110 can realize the grounding of the circuit board assembly 140. In addition, by providing the conductive layer 146 on the insulating substrate 144, the circuit board assembly 140 transfers heat to the gasket 160 and the frame assembly 110 only through the conductive layer 146, thereby reducing the heat transfer efficiency and reducing the temperature rise of the frame assembly 110.

[0038] The insulating substrate 144 , the conductive layer 146 and the gasket 160 all have through holes 142 , so that the first connector 150 can pass through the insulating substrate 144 , the conductive layer 146 and the gasket 160 and connect to the second connector 132 , thereby ensuring the connection strength between the circuit board assembly 140 and the frame assembly 110 .

[0039] Furthermore, the gasket 160 is an alumina ceramic gasket, a polystyrene gasket or a manganese oxide gasket. The alumina ceramic gasket, the polystyrene gasket and the manganese oxide gasket have good electrical conductivity and low thermal conductivity, thereby further reducing the heat transfer from the circuit board assembly 140 to the frame assembly 110 while maintaining the grounding effect of the circuit board assembly 140. That is, by providing the gasket 160, the heat transferred from the circuit board assembly 140 to the frame assembly 110 can be further reduced while ensuring electrical conductivity between the circuit board assembly 140 and the frame assembly 110.

[0040] like Figure 1 , Figure 2 and Figure 4 As shown, as a possible implementation, the frame assembly 110 includes: a frame 116 , the inner side of the frame 116 has a boss 126 , the boss 126 is located at the edge of the bottom wall 114 of the accommodating cavity 112 , and the first connecting member 150 is connected to the boss 126 .

[0041] Specifically, the frame assembly 110 includes a frame 116, and the accommodating cavity 112 is arranged in the frame 116. The memory of the frame 116 has a boss 126, and the boss 126 is located at the edge of the bottom wall 114 of the accommodating cavity 112. In addition, the first connecting member 150 is connected to the boss 126. That is, the position of the circuit board assembly 140 and the frame assembly 110 connected by the first connecting member 150 is close to the edge of the frame assembly 110 and also close to the edge of the circuit board assembly 140, which is more convenient for arranging the circuits on the circuit board assembly 140 and is also more conducive to fixing the circuit board assembly 140.

[0042] like Figure 2 and Figure 4 As shown, as a possible implementation, the frame assembly 110 includes: a frame 116, the frame 116 has a accommodating cavity 112; a first thermal insulation member 128, arranged on the inner surface of the frame 116; wherein the first thermal insulation member 128 and the circuit board assembly 140 are connected, or a gasket 160 is arranged between the first thermal insulation member 128 and the circuit board assembly 140.

[0043] Specifically, the frame assembly 110 has a heat insulation structure, the frame assembly 110 includes a frame 116 and a first heat insulation member 128 disposed on the inner surface of the frame 116, the circuit board assembly 140 is connected to the first heat insulation member 128, and the heat transferred from the circuit board assembly 140 to the frame assembly 110 is reduced by the first heat insulation member 128. The frame 116 has a receiving cavity 112, and the circuit board assembly 140 is disposed in the receiving cavity 112, wherein one side of the frame 116 forming the side wall of the receiving cavity 112 is the inner surface of the frame 116. The first heat insulation member 128 forms a heat insulation structure.

[0044] Optionally, the first connecting member 150 may be a screw or a rivet, etc. The first connecting member 150 passes through the circuit board assembly 140 and the first thermal insulation member 128 and is connected to the frame 116. The connection between the first connecting member 150 and the frame 116 may be a detachable connection or a non-detachable connection.

[0045] The first thermal insulation member 128 may be made of rubber, plastic or ceramic, and the first thermal insulation member 128 and the frame 116 may be manufactured by injection molding, thereby isolating the circuit board assembly 140 and the frame 116 from direct contact for heat transfer through the first thermal insulation member 128.

[0046] Optionally, the first thermal insulation member 128 and the circuit assembly may be directly connected, or a gasket 160 may be disposed between the first thermal insulation member 128 and the circuit board assembly 140 , and the gasket 160 may be an alumina ceramic gasket, a polystyrene gasket, or a manganese oxide gasket.

[0047] Specifically, the gasket 160 is an alumina ceramic gasket, a polystyrene gasket or a manganese oxide gasket. The alumina ceramic gasket, the polystyrene gasket and the manganese oxide gasket have good electrical conductivity and low thermal conductivity, thereby further reducing the heat transfer from the circuit board assembly 140 to the frame assembly 110 while maintaining the grounding effect of the circuit board assembly 140.

[0048] like Figure 3 As shown, as a possible implementation, the frame assembly 110 includes: a frame 116, the frame 116 has a receiving cavity 112; a second heat insulating member 130, which is arranged on the inner surface of the frame 116; a second connecting member 132, which is embedded in the second heat insulating member 130, and a first connecting member 150 and a second connecting member 132 are connected; wherein the second heat insulating member 130 is connected to the circuit board assembly 140, or a gasket 160 is arranged between the second heat insulating member 130 and the circuit board assembly 140. wherein the second heat insulating member 130 and the second connecting member 132 form a heat insulating structure.

[0049] Specifically, the frame assembly 110 has a heat insulation structure, and the frame assembly 110 includes a frame 116 and a second heat insulation member 130 arranged on the inner surface of the frame 116, and a second connecting member 132 embedded in the frame 116. The circuit board assembly 140 and the second heat insulation member 130 are connected, and the heat transferred from the circuit board assembly 140 to the frame assembly 110 is reduced through the second heat insulation member 130.

[0050] Furthermore, the first connector 150 passes through a portion of the second thermal insulation member 130 and is connected to the second connector 132, so that the second connector 132 is between the first connector 150 and the frame 116, thereby reducing the heat transferred from the first connector 150 to the frame 116 through the connection between the second connector 132 and the first connector 150.

[0051] Optionally, the first connecting member 150 may be a screw or a rivet, etc. The first connecting member 150 passes through a portion of the circuit board assembly 140 and the second heat insulating member 130 and is connected to the second connecting member 132. The connection between the first connecting member 150 and the second connecting member 132 may be detachably connected or non-detachably connected. The second connecting member 132 may be a nut.

[0052] For example, the second heat insulating member 130 has a groove body, and the second connecting member 132 is disposed in the groove body.

[0053] Optionally, the circuit board assembly 140 and the second thermal insulation member 130 may be directly connected, or a gasket 160 may be disposed between the circuit board assembly 140 and the second thermal insulation member 130 , and the gasket 160 may be an alumina ceramic gasket, a polystyrene gasket, or a manganese oxide gasket.

[0054] Specifically, the gasket 160 is an alumina ceramic gasket, a polystyrene gasket or a manganese oxide gasket. The alumina ceramic gasket, the polystyrene gasket and the manganese oxide gasket have good electrical conductivity and low thermal conductivity, thereby further reducing the heat transfer from the circuit board assembly 140 to the frame assembly 110 while maintaining the grounding effect of the circuit board assembly 140.

[0055] Optionally, the second thermal insulation member 130 forms a protrusion in the accommodating cavity 112 , and the protrusion is located at an edge of the bottom wall 114 of the accommodating cavity 112 .

[0056] like Figure 3 As shown, as a possible implementation, the second connecting member 132 is a hot melt connecting member, and the second connecting member 132 and the second thermal insulation member 130 are snap-connected.

[0057] Specifically, the second connecting member 132 is a hot-melt connecting member, and the second connecting member 132 and the second thermal insulation member 130 are snap-connected, that is, one of the second connecting member 132 and the second thermal insulation member 130 has a buckle, and the other has a slot, and the buckle is embedded in the slot, thereby lifting the connecting cavity between the second connecting member 132 and the second thermal insulation member 130.

[0058] Furthermore, the second connection member 132 made of hot-melt material has a certain heat absorption capability, thereby reducing the heat diffusion capability and lowering the temperature outside the frame assembly 110 .

[0059] like Figures 1 to 4 As shown, as a possible implementation, the frame assembly 110 includes a frame 116, and the frame 116 includes: a first conductive frame 118, a first connecting member 150 connected to the first conductive frame 118; a second conductive frame 120, separated from the first conductive frame 118; a third thermal insulation member 122, connecting the first conductive frame 118 and the second conductive frame 120; and a conductive plate 124, the conductive plate 124 is connected to the first conductive frame 118, and the conductive plate 124 is also connected to the second conductive frame 120.

[0060] Specifically, the frame assembly 110 includes a frame 116, and the frame 116 includes a first conductive frame 118, a second conductive frame 120 and a third thermal insulation member 122. The first conductive frame 118 and the second conductive frame 120 are separated and connected by the third thermal insulation member 122, that is, the first conductive frame 118 and the second conductive frame 120 are disconnected, and the third thermal insulation member 122 fills the gap between the first conductive frame 118 and the second conductive frame 120, thereby ensuring the integrity of the frame 116, and The circuit board assembly 140 and the first conductive frame 118 cooperate with each other, that is, the circuit board assembly 140 and the first conductive frame 118 are directly connected, or a gasket 160 is arranged between the circuit board assembly 140 and the first conductive frame 118, and the first connecting member 150 fixes the circuit board assembly 140 on the first conductive frame 118, so that the circuit board assembly 140 transfers heat to the first conductive frame 118, reduces the heat propagation to the second conductive frame 120, and further reduces the heat transfer on the frame assembly 110.

[0061] Optionally, the circuit board assembly 140 further includes electronic components, and the electronic components are connected to the second conductive frame 120 via the heat conductor 190 to improve the heat dissipation effect of the electronic components, and the electronic components can be heat generating components such as processors. When the circuit board assembly 140 dissipates heat via the second conductive frame 120, the heat on the second conductive frame 120 can also be reduced from being transmitted to the first conductive frame 118.

[0062] In addition, the frame 116 further includes a conductive plate 124 , and the first conductive frame 118 and the second conductive frame 120 are connected via the conductive plate 124 , thereby ensuring the grounding effect of the circuit board assembly 140 .

[0063] Optionally, the first conductive frame 118 and the second conductive frame 120 are both made of metal.

[0064] like Figure 4 As shown, as a possible implementation, it also includes: a grounding member 170, which is disposed on the second conductive frame 120, the grounding member 170 and the second conductive frame 120 are electrically connected, and the grounding member 170 and the circuit board assembly 140 are against each other.

[0065] Specifically, the electronic device 100 also includes a grounding member 170 disposed on the second conductive frame 120, and the circuit board assembly 140 and the grounding member 170 are electrically connected, that is, the circuit board assembly 140 is grounded through the grounding member 170, thereby eliminating the need for conductive design of the circuit board assembly 140 and the frame assembly 110 at the first connecting member 150, thereby further reducing heat transfer from the circuit board assembly 140 to the frame assembly 110.

[0066] The grounding member 170 may be a spring or a spring.

[0067] Optionally, the grounding member 170 is elastic, the circuit board assembly 140 and the grounding member 170 are electrically connected, and the circuit board assembly 140 and the grounding member 170 are offset against each other under the action of the first connecting member 150 .

[0068] Specifically, the grounding member 170 has elasticity, and the grounding member 170 and the circuit board assembly 140 are electrically connected to achieve grounding, and the reliability of the connection between the circuit board assembly 140 and the grounding member 170 is ensured by the elasticity.

[0069] Among them, the grounding member 170 can be connected to the copper layer on the circuit board assembly 140, and can also be connected to the wire on the circuit board assembly 140. The copper layer or wire on the circuit board assembly 140 can extend from any position of the circuit board assembly 140 to the position of the grounding member 170.

[0070] like Figure 4 As shown, as a possible implementation, the circuit board assembly 140 includes an insulating substrate 144 and a conductive layer 146 . The conductive layer 146 is disposed on the surface of the insulating substrate 144 , and the conductive layer 146 is connected to the frame assembly 110 .

[0071] The insulating substrate 144 is obtained by etching away the middle copper layer of the circuit board assembly 140, that is, the circuit board assembly 140 is a multi-layer structure, and the surface layer of the circuit board assembly 140 has a conductive layer 146 to achieve grounding of the circuit board assembly 140. The circuit board is etched to remove the middle copper layer of the multi-layer structure, and only the substrate is retained to form the insulating substrate 144. Since the middle copper layer is removed, the heat conduction performance is reduced, thereby reducing the heat transferred from the circuit board assembly 140 to the frame assembly 110.

[0072] A grounding member 170 is disposed on the second conductive frame 120 . The grounding member 170 is an elastic member. The copper layer or wire on the circuit board assembly 140 extends to the position of the grounding member 170 , thereby meeting the grounding requirement of the circuit board assembly 140 .

[0073] The frame assembly 110 includes a frame 116 and a first heat insulating member 128, the first heat insulating member 128 is disposed on the frame 116, and the first heat insulating member 128 is connected to the circuit board assembly 140. Alternatively, the frame assembly 110 includes the frame 116, a second heat insulating member 130, and a second connecting member 132, the second heat insulating member 130 is connected to the circuit board assembly 140, the second connecting member 132 is embedded in the frame assembly 110, and the first connecting member 150 is connected to the second connecting member 132.

[0074] As described above, through the above configuration, the grounding requirement of the antenna on the circuit board assembly 140 can be met, and the heating problem of the side of the frame assembly 110 can be solved.

[0075] The screen assembly 180 of the electronic device 100 is disposed on the frame assembly 110 .

[0076] The electronic device 100 includes a mobile phone, a tablet computer, a laptop computer, an e-book, a wearable device, etc.

[0077] In the description of this specification, the description with reference to the terms "one embodiment" or "specific embodiment" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0078] Although the embodiments of the present application have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present application, and that the scope of the present application is defined by the claims and their equivalents.

Claims

1. An electronic device, characterized in that: include: A frame assembly, wherein the frame assembly has a receiving cavity; A circuit board assembly, the circuit board assembly is arranged in the accommodating cavity, and the circuit board assembly is provided with a through hole; A first connector, which is inserted into the through hole and connected to the frame assembly so as to electrically connect the circuit board assembly with the frame assembly; Wherein, at the position where the first connecting member is located, at least one of the frame assembly and the circuit board assembly has a heat insulation structure.

2. The electronic device according to claim 1, characterized in that: The circuit board assembly comprises: Insulating substrate; The conductive layer is arranged on the surface of the insulating substrate, and the conductive layer and the frame assembly are electrically connected.

3. The electronic device according to claim 2, characterized in that: The insulating substrate is obtained by etching the circuit board assembly.

4. The electronic device according to any one of claims 1 to 3, characterized in that: At the position where the first connecting member is located, a gasket is arranged between the frame assembly and the circuit board assembly, and the gasket is an alumina ceramic gasket, a polystyrene gasket or a manganese oxide gasket.

5. The electronic device according to any one of claims 1 to 3, characterized in that: The frame assembly comprises: A frame body has a boss on the inner side of the frame body, the boss is located at the edge of the bottom wall of the accommodating cavity, and the first connecting member is connected to the boss.

6. The electronic device according to any one of claims 1 to 3, characterized in that: The frame assembly comprises: A frame, wherein the frame has the accommodating cavity; A first heat insulating member, disposed on the inner surface of the frame; Wherein, the first thermal insulation member is connected to the circuit board assembly, or a gasket is arranged between the first thermal insulation member and the circuit board assembly.

7. The electronic device according to any one of claims 1 to 3, characterized in that: The frame assembly comprises: A frame, wherein the frame has the accommodating cavity; A second heat insulating member is arranged on the inner surface of the frame; A second connecting member, embedded in the second heat insulating member, the first connecting member and the second connecting member are connected; Wherein, the second thermal insulation member is connected to the circuit board assembly, or a gasket is arranged between the second thermal insulation member and the circuit board assembly.

8. The electronic device according to claim 7, characterized in that: The second connecting piece is a hot-melt connecting piece, and the second connecting piece is snap-connected with the second heat insulating piece.

9. The electronic device according to any one of claims 1 to 3, characterized in that: The frame assembly comprises a frame, and the frame comprises: a first conductive frame, the first connecting member being connected to the first conductive frame; a second conductive frame, separated from the first conductive frame; a third heat insulating member, connecting the first conductive frame and the second conductive frame; A conductive plate connected to the first conductive frame, and further connected to the second conductive frame.

10. The electronic device according to claim 9, characterized in that: Also includes: A grounding member is provided on the second conductive frame, the grounding member and the second conductive frame are electrically connected, and the grounding member and the circuit board assembly are against each other.

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