Probe equipment, host and probe system

Abstract

The utility model relates to the technical field of medical instruments, and particularly discloses probe equipment which comprises a probe operation part, a cable, a plug and a cooling loop. Wherein the cooling loop comprises a cooling module, a heat exchanger, a cold loop channel, a hot loop channel and a pump body, and the cooling module is arranged in the probe operation part and used for absorbing heat of the heating device; the heat exchanger is arranged in the plug and is used for exchanging heat with a heat dissipation device in the host; one end of the cold loop channel communicates with the inlet of the cooling module, the other end communicates with the outlet of the heat exchanger, one end of the hot loop channel communicates with the outlet of the cooling module, and the other end communicates with the inlet of the heat exchanger; and the pump body is arranged in the cold loop channel or the hot loop channel. According to the probe equipment, the daily maintenance mode is simplified, and abnormal risks such as possible pipeline contamination and blockage faults are eliminated. The utility model also discloses a host and a probe system, which also have the above technical effects.

Description

Technical Field

[0001] The utility model relates to the technical field of medical equipment, and more specifically, to a probe device, a host and a probe system. Background Art

[0002] In the existing medical equipment system, probe type devices (ultrasound probe, endoscopic camera, electronic endoscope, etc.) are often used. Taking the endoscopic camera as an example, the endoscopic camera is a very important component of endoscopic surgical equipment. It is mainly responsible for collecting the optical signal of the surgical field and converting it into an electrical signal and sending it to the image processor. The image processor processes the relevant signal and then sends it to the display for display, so as to provide the user with a real-time surgical field image.

[0003] The front end of the endoscope camera is generally connected to a dedicated endoscope optical lens, and the back end is connected to the image processing device host. The overall structure of the endoscope camera includes a handheld operating unit, a camera harness for transmitting video signals and communicating, and a connector plug for connecting and communicating with the host. Among them, the handheld operating unit is equipped with an image acquisition module for photoelectric conversion, a signal driving circuit and other related functional modules.

[0004] The image acquisition module and the signal drive circuit will inevitably generate heat during normal operation. To dissipate heat, a cooling circulation pipeline can be provided in the camera operating part to serve as a hot end and an additional cold end device to form a complete heat transfer medium circulation loop, and the two are connected through a medium exchange interface.

[0005] However, the above structure is provided with an open medium exchange interface. The open medium exchange interface destroys the integrity of the camera's external structure, complicating the disinfection scene. It is necessary to consider the disinfection of the slender cavity and the prevention of contamination during use. It is easy to cause unacceptable biological hazards. In addition, the open interface of the slender cavity is prone to the risk of foreign body blockage during long-term use, which reduces the circulation efficiency or even loses the ability to play a normal heat dissipation role. In the process of plugging and unplugging the camera, in addition to ensuring the reliable docking of the medium exchange interface, it is also necessary to consider the addition and maintenance of the liquid medium, which increases the complexity of the preparation work for the camera. When the medium exchange interface is not docked properly, there is a risk of leakage of the liquid medium, which may affect the normal operation of other components or cause the spread of biological contamination on the surface of itself or other objects due to the flow dependence of the liquid. Due to the limited camera volume, the exchange area for air-cooled exchange is not high, and the overall exchange capacity is limited.

[0006] In summary, how to effectively solve the problem that the heat dissipation structure of probe-type equipment affects equipment disinfection is a problem that technical personnel in this field need to solve. Utility Model Content

[0007] In view of this, the purpose of the present utility model is to provide a probe device, a host and a probe system, the structural design of which can effectively solve the problem that the heat dissipation structure of probe-type equipment affects the disinfection of the equipment.

[0008] In order to achieve the above object, the utility model provides the following technical solutions:

[0009] A probe device comprises a probe operating part, a cable and a plug, wherein two ends of the cable are respectively connected to the probe operating part and the plug, the probe operating part has a heating device, and the plug is used to connect to a host of the probe device; and further comprises a cooling circuit, wherein a coolant is sealed in the cooling circuit, and the cooling circuit comprises:

[0010] A cooling module, disposed in the probe operating portion, for absorbing heat from the heating element;

[0011] A heat exchanger, disposed in the plug, for exchanging heat with a heat dissipation device in the host;

[0012] A cold circuit channel and a hot circuit channel, wherein one end of the cold circuit channel is connected to the inlet of the cooling module and the other end is connected to the outlet of the heat exchanger, and one end of the hot circuit channel is connected to the outlet of the cooling module and the other end is connected to the inlet of the heat exchanger;

[0013] A pump body is arranged in the cold circuit channel or the hot circuit channel to drive the coolant in the cooling circuit to flow.

[0014] Optionally, in the above probe device, the cooling module includes:

[0015] a cold exchanger, wherein the inlet of the cold exchanger is in communication with the cold circuit channel, and the outlet of the cold exchanger is in communication with the hot circuit channel;

[0016] The first heat-conducting structure is arranged in contact with the heating device and the cold exchanger respectively.

[0017] Optionally, in the above-mentioned probe device, the first heat-conducting structure includes a vapor chamber and a first heat-conducting pad, and the first heat-conducting pad is arranged between the heat-generating device and the vapor chamber, and / or between the vapor chamber and the cold exchanger.

[0018] Optionally, in the above-mentioned probe device, the probe operating part includes a shell heat-conducting part, and the shell heat-conducting part is arranged in contact with the heating device, or a second heat-conducting structure is provided between the shell heat-conducting part and the heating device.

[0019] Optionally, in the above-mentioned probe device, at least part of the cold circuit channel and the hot circuit channel are arranged in the cable.

[0020] Optionally, in the above-mentioned probe device, a heat insulation layer is provided outside the cold circuit channel.

[0021] Optionally, in the above-mentioned probe device, the pump body is arranged in the hot circuit channel.

[0022] Optionally, in the above-mentioned probe device, a ventilation hole is provided on the outer shell of the plug at a position corresponding to the heat exchanger so as to be connected to a heat dissipation duct in the host.

[0023] Optionally, in the above-mentioned probe device, the outer shell of the plug is at least located on a side of the ventilation hole close to the cable and is sealed and connected to the heat exchanger.

[0024] Optionally, in the above-mentioned probe device, the heat exchanger includes a liquid-cooled heat exchange part and an air-cooled heat exchange part, the air-cooled heat exchange part is arranged opposite to the ventilation hole, and the connection between the liquid-cooled heat exchange part and the air-cooled heat exchange part is sealed with the outer shell of the plug.

[0025] Optionally, in the above-mentioned probe device, the liquid-cooled heat exchange part and the air-cooled heat exchange part are an integrated structure.

[0026] The probe device provided by the utility model includes a probe operating part, a cable, a plug and a cooling circuit. The two ends of the cable are respectively connected to the probe operating part and the plug, the probe operating part has a heating device, and the plug is used to connect to the main unit of the probe device. The cooling circuit is sealed with a coolant, including a cooling module, a heat exchanger, a cold circuit channel, a hot circuit channel and a pump body. The cooling module is arranged in the probe operating part to absorb the heat of the heating device; the heat exchanger is arranged in the plug to exchange heat with the heat dissipation device in the main unit; one end of the cold circuit channel is connected to the inlet of the cooling module, and the other end is connected to the outlet of the heat exchanger; one end of the hot circuit channel is connected to the outlet of the cooling module, and the other end is connected to the inlet of the heat exchanger; the pump body is arranged in the cold circuit channel or the hot circuit channel to drive the coolant in the cooling circuit to flow.

[0027] By using the probe device provided by the utility model, the coolant in the cooling module absorbs the heat of the heating device in the probe operating part, and the temperature-increased coolant flows into the heat exchanger through the hot circuit channel, is cooled by the heat dissipation device in the host in the heat exchanger, and then the cooled coolant flows back to the cooling module through the cold circuit channel, and circulates in this way. The heat exchanger is arranged at the plug of the probe device, and is connected with the cooling module in the probe operating part through the cold circuit channel and the hot circuit channel. The cooling circuit is arranged in the probe device as a whole, and is an integrally sealed structure. It is not necessary to dock with the heat dissipation device in the host to connect the coolant, so it has no effect on the disinfection form of the probe device, simplifies the daily maintenance method, and eliminates possible abnormal risks such as pipeline contamination and blockage failure. The transfer of heat from the probe operating part to the host does not require the connection of the coolant, thereby reducing the requirements for interface sealing, improving the durability of the relevant structure, and reducing the possibility of corresponding functional performance degradation due to wear and tear of the plug interface. In addition, the heat exchanger is cooled by the heat dissipation device in the host, and there is no need to set a heat dissipation device on the probe device, so the heat exchange area is not limited by the volume of the probe device, which is conducive to improving the heat dissipation efficiency.

[0028] In order to achieve the above object, the utility model provides the following technical solutions:

[0029] A host, comprising:

[0030] shell;

[0031] A socket is provided on the housing, the socket is used to connect with the plug of the probe device, the socket is provided with an air inlet and an air outlet, the air inlet and the air outlet are respectively used to communicate with the ventilation hole of the plug;

[0032] The heat dissipation device is arranged in the shell, and is used to allow air flow to enter through the air inlet and flow through the ventilation hole to exchange heat with the heat exchanger of the cooling circuit in the probe device and then be discharged from the air outlet.

[0033] Optionally, in the above-mentioned host, the shell is provided with an air inlet and an air outlet, and the heat dissipation device includes an air inlet duct, an air outlet duct, a blower and / or an exhaust fan, one end of the air inlet duct is connected to the air inlet, and the other end is connected to the air inlet hole; one end of the air outlet duct is connected to the air outlet, and the other end is connected to the air outlet hole; the blower is arranged in the air inlet duct, and the exhaust fan (4) is arranged in the air outlet duct.

[0034] Optionally, the above-mentioned host further includes a semiconductor refrigeration device, the cold end of the semiconductor refrigeration device is arranged in the air inlet duct, and the hot end is arranged in the air outlet duct, or the cold end and hot end of the semiconductor refrigeration device are respectively provided with heat-conducting components, the heat-conducting component of the cold end is arranged in the air inlet duct, and the heat-conducting component of the hot end is arranged in the air outlet duct.

[0035] Optionally, in the above embodiment, the heat-conducting component includes a heat-exchange fin and a second heat-conducting pad disposed in contact with the heat-exchange fin.

[0036] The host provided by the utility model is used to cooperate with the probe device. By setting the air inlet and air outlet on the socket and cooperating with the ventilation hole of the plug device, the heat exchanger of the cooling circuit of the probe device can be radiated through the heat dissipation device, and the heat of the heat exchanger can be taken away to cool it down, that is, the coolant in the cooling circuit that absorbs the heat of the probe device and the temperature rises can be cooled down, and the coolant with a lowered temperature can further absorb the heat of the probe device, and the cycle continues. With the host, there is no need to dock with the plug of the probe device to connect the coolant. The cooling circuit is arranged on the probe device as a whole, and the host is provided with a heat dissipation device accordingly. Therefore, it has no effect on the disinfection form of the probe device, simplifies the daily maintenance method, and eliminates possible abnormal risks such as pipeline contamination and blockage failure. In addition, the transfer of heat from the probe device to the host does not require the connection of the coolant, thereby reducing the requirements for interface sealing, improving the durability of the relevant structure, and reducing the possibility of corresponding functional performance degradation caused by wear and tear of the interface. Furthermore, the heat exchanger is cooled by the heat dissipation device in the host, and there is no need to set a heat dissipation device on the probe device, so the heat exchange area is not limited by the volume of the probe device, which is conducive to improving the heat dissipation efficiency.

[0037] In order to achieve the above object, the utility model also provides a probe system, which includes a probe device and a main body, and the probe device is any of the above probe devices, and / or the host is any of the above hosts. Since the above probe device and host have the above technical effects, the probe system having the probe device or host should also have corresponding technical effects. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0039] Figure 1 This is a schematic diagram of the structure of a probe system according to a specific embodiment of the utility model;

[0040] Figure 2 This is a schematic diagram of the structure of a probe device according to a specific embodiment of the utility model;

[0041] Figure 3 for Figure 1 Schematic diagram of heat transfer;

[0042] Figure 4 for Figure 1 Schematic diagram of signal transmission.

[0043] The following are marked in the accompanying drawings:

[0044] Probe device 1, host 2;

[0045] Cooling circuit 10, probe operating unit 20, cable 30, plug 40;

[0046] Cooling module 110, cold exchanger 111, first heat conducting structure 112, heat spreader 1121, first heat conducting pad 1122, auxiliary heat conducting pad 113, heat exchanger 120, liquid cooling heat exchanging part 121, air cooling heat exchanging part 122, cold circuit channel 130, hot circuit channel 140, pump body 150;

[0047] Heat generating device 210, housing heat conducting portion 220;

[0048] Ventilation holes 410;

[0049] Heat dissipation device 21, socket 22, semiconductor refrigeration device 23, heat conduction component 24, air inlet 201, air outlet 202, air inlet duct 211, air outlet duct 212, air supply fan 213, exhaust fan 214, air inlet hole 221, air outlet hole 222, heat exchange fin 241, second heat conduction pad 242;

[0050] A first temperature detection device 60, a second temperature detection device 70, a third temperature detection device 80, and a control circuit 90;

[0051] Figure 4 The dashed arrow in the middle indicates the temperature acquisition signal, and the solid arrow indicates the control drive signal. DETAILED DESCRIPTION

[0052] The utility model embodiment discloses a probe device, a host and a probe system, which can achieve efficient and reliable heat dissipation without affecting the disinfection of the probe device.

[0053] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0054] The probe device provided in this application includes but is not limited to medical device probes with heating properties and disinfection requirements such as ultrasound probes, endoscope cameras, and electronic endoscopes. The probe device includes a probe operating part, a cable, and a plug. The two ends of the cable are respectively connected to the probe operating part and the plug, and the probe operating part has a heating device, and the plug is used to connect to the host of the probe device. The front end of the probe operating part can be connected to the corresponding component. Taking the endoscope camera as an example, the probe operating part, that is, the front end of the camera operating part, is connected to the lens. The plug is used to connect to the host of the probe system to realize the transmission of electrical signals. It should be noted that the heating device refers to a device that can generate heat in the probe operating part, which can be either a single heating element or an integration of multiple heating elements. In this application, on the basis of the above-mentioned probe device structure, an active cooling structure is set, that is, the heat generated by the probe heating part is transferred by the circulation of a heat-conducting medium (air or available liquid substance) to prevent it from accumulating. The probe heating part is the hot end of the circulation loop, and the corresponding end of heat release is the cold end of the circulation loop. Specifically, a cooling circuit is added to expand the limitation that the conventional plug can only transmit electrical signals, so as to achieve efficient and reliable conduction of heat from the probe operating part to the plug and then to the host. The following embodiments mainly illustrate the structure of the cooling circuit.

[0055] See also Figure 1 and Figure 2 In some embodiments, the probe device 1 provided by the utility model includes a probe operating part 20, a cable 30, a plug 40 and a cooling circuit 10. Among them, a coolant is sealed in the cooling circuit 10, that is, the cooling circuit 10 is sealed as a whole, and the coolant can circulate in the cooling circuit 10. The cooling circuit includes a cooling module 110, a heat exchanger 120, a cold circuit channel 130, a hot circuit channel 140 and a pump body 150. The cooling module 110 is arranged in the probe operating part 20, and is used to absorb the heat of the heating device 210. It can be understood that the cooling module 110 absorbs the heat of the heating device 210, either by direct contact with the heating device 210 for heat conduction, or by indirect contact with the heating device 210 for heat conduction or non-contact heat conduction, as long as the heat of the heating device 210 can be collected. The heat exchanger 120 is arranged in the plug 40, and is used to exchange heat with the heat dissipation device 21 in the host 2. After the plug 40 is connected to the host 2, the heat exchanger 120 can exchange heat with the heat dissipation device 21. It is understandable that the coolant is sealed in the cooling circuit 10, so the coolant in the heat exchanger 120 is not connected to the heat dissipation device 21, and the heat dissipation device 21 performs "non-contact" heat dissipation on the heat exchanger 120. The form of the heat dissipation device 21 is not specifically limited here, such as air cooling or liquid cooling.

[0056] One end of the cold circuit channel 130 is connected to the inlet of the cooling module 110, and the other end is connected to the outlet of the heat exchanger 120. One end of the hot circuit channel 140 is connected to the outlet of the cooling module 110, and the other end is connected to the inlet of the heat exchanger 120, so as to form a circulation loop for the circulation of the cooling liquid. The pump body 150 is arranged in the cold circuit channel 130 or the hot circuit channel 140, and is used to drive the cooling liquid in the cooling circuit 10 to flow. The cooling liquid in the cooling module 110 absorbs the heat of the heating device 210 in the probe operation part 20, and the cooling liquid with increased temperature flows into the heat exchanger 120 through the hot circuit channel 140, and is cooled by the heat dissipation device 21 in the host 2 in the heat exchanger 120, and then the cooled cooling liquid flows back to the cooling module 110 through the cold circuit channel 130, and the cycle continues. That is, the cooling module 110 at the hot end exchanges the heat from the heating device 210 to the low-temperature cooling liquid from the cold end of the circuit, and the hot end of the circuit heats the cooling liquid and sends it back to the cold end for cooling again.

[0057] Using the probe device 1 provided by the utility model, the heat exchanger 120 is arranged on the plug 40 of the probe device 1, and is connected to the cooling module 110 in the probe operating part 20 through the cold circuit channel 130 and the hot circuit channel 140. The cooling circuit 10 is arranged as a whole in the probe device 1, and is an integrally sealed structure. It does not need to be docked with the heat dissipation device 21 in the host 2 to connect the heat exchange medium, that is, the cooling circuit 10 is completely placed inside the probe device 1, and there is no external fluid exchange interface, so it does not affect the disinfection form of the probe device 1, simplifies the daily maintenance method, and eliminates possible abnormal risks such as pipeline contamination and blockage failure. The transfer of heat from the probe operating part 20 to the host 2 does not require the connection of the heat exchange medium, thereby reducing the requirements for the sealing of the docking interface, improving the durability of the relevant structure, and reducing the possibility of corresponding functional performance degradation due to wear and tear of the plug 40 interface.

[0058] In addition, compared with setting a heat sink 21 on the probe device 1, such as the probe operating part 20 as the hot end and the probe surrounding environment as the cold end, the probe device 1 has a pump or fan structure for driving air flow and an exposed air duct interface. The disinfection scenario of the probe device 1 is relatively complex, and structures such as fans are not resistant to conventional disinfection, and the heat exchange area is limited by the volume of the probe device 1. In this application, the heat exchanger 120 is cooled by the heat sink 21 in the host 2, and there is no need to set a heat sink 21 on the probe device 1. Therefore, the heat exchange area is not limited by the volume of the probe device 1, which is conducive to improving the heat dissipation efficiency.

[0059] Furthermore, compared with the probe operating part 20 as the hot end, and the heat sink 21 is set on the probe device 1 as the cold end to form an overall liquid cooling circulation loop, when the heat sink 21 is a passive radiator, the heat dissipation method of natural convection is limited, and a sufficiently large exchange contact area with the air is required. In order to achieve a sufficient cooling effect, the higher the heat dissipation requirement, the more cumbersome the overall structure of the probe device 1 becomes, which seriously affects the product experience, and because the cold end heat dissipation surface area cannot be increased indefinitely, the upper limit of the heat dissipation effect of the probe device 1 is limited. In the present application, the heat sink 21 is set on the host 2, and the heat exchange area is not limited by the volume of the probe device 1, which is conducive to significantly improving the heat dissipation efficiency.

[0060] In some embodiments, the cooling module 110 includes a cold exchanger 111 and a first heat-conducting structure 112. The inlet of the cold exchanger 111 is connected to the cold circuit channel 130, and the outlet of the cold exchanger 111 is connected to the hot circuit channel 140; the first heat-conducting structure 112 is respectively arranged in contact with the heating device 210 and the cold exchanger 111. The heat of the heating device 210 is transferred to the first heat-conducting structure 112, and the first heat-conducting structure 112 exchanges heat with the cold exchanger 111, so that the coolant in the cold exchanger 111 takes away the heat of the first heat-conducting structure 112 and the temperature of the coolant increases. Heat conduction through the first heat-conducting structure 112 facilitates the layout of the cold exchanger 111, and the cold exchanger 111 can be a conventional heat exchanger, and does not need to be arranged according to the shape of the heating device 210. In other embodiments, the cooling module 110 may also only include the cold exchanger 111, and the cold exchanger 111 can be arranged around the heating device 210 to absorb the heat of the heating device 210. Specifically, almost all the heating elements in the probe operating part 20 are fixed to the surface of the first heat-conducting structure 112 through the lowest possible thermal resistance connection, forming a unique conduction node for almost all the heat dissipated by the probe operating part 20. The temperature rise of the entire camera after heating is controlled by controlling the temperature of this node.

[0061] In some embodiments, the first heat-conducting structure 112 includes a heat-vaporizing plate 1121. By providing the heat-vaporizing plate 1121, almost all the heat generated in the probe operating part 20 can be collected, so that the heat in the probe operating part 20 is concentrated and the heat is transferred through the cold exchanger 111 and the shell heat-conducting part 220, thereby further improving the heat dissipation efficiency.

[0062] In some embodiments, the first heat-conducting structure 112 includes a first heat-conducting pad 1122, and the first heat-conducting pad 1122 is disposed between the heating device 210 and the heat-spreading plate 1121, and / or between the heat-spreading plate 1121 and the cold exchanger 111. The heat-conducting connection is made through the first heat-conducting pad 1122, and the thermal resistance is low. While achieving efficient heat conduction, the flexible connection can play a protective role and reduce the assembly precision requirements. In other embodiments, the first heat-conducting structure 112 may also only use a heat-conducting pad or a heat-spreading plate 1121, or other conventional heat-conducting structures.

[0063] In some embodiments, the probe operating part 20 includes a shell heat conducting part 220, and the shell heat conducting part 220 is arranged in contact with the heating device 210, or a second heat conducting structure is provided between the shell heat conducting part 220 and the heating device 210. It is understandable that the shell heat conducting part 220 can be the entire shell of the probe operating part 20, or it can be a part of the shell of the probe operating part 20. By providing the shell heat conducting part 220 and directly contacting the heating device 210 or indirectly contacting it through the second heat conducting structure, the heat of the heating device 210 is directly or indirectly transferred to the shell heat conducting part 220 through the second heat conducting structure, and can be exchanged to the surrounding air environment through the shell heat conducting part 220, that is, the shell heat conducting part 220 exchanges heat with the surrounding air in a passive manner through natural convection. The larger the area of ​​the shell heat conducting part 220, the higher the passive heat dissipation efficiency. Through the provision of the shell heat conducting part 220, passive heat dissipation is combined with active heat dissipation, please refer to Figure 3 , the heat generated by the probe operating part 20 is transferred to the ambient air through two parallel good heat conduction paths, and the heat is conducted in two directions at the same time. The main path from the heating device 210 to the end point is the heating device 210, the first heat conduction structure 112, the cold exchanger 111, the heat circuit channel 140, the heat exchanger 120, the heat dissipation device 21 in the host 2, and the ambient air; the auxiliary path from the heating device 210 source to the end point is the heating device 210, the second heat conduction structure, the shell heat conduction part 220, and the ambient air. The combination of active and passive heat dissipation means that even if the active mode works abnormally, the passive mode can still play a role to prevent excessive heat accumulation from damaging the probe, thereby improving the safety of the probe device 1.

[0064] In some embodiments, the second heat-conducting structure includes a heat-vaporizing plate, which can share the heat-vaporizing plate 1121 with the first heat-conducting structure 112. Specifically, the second heat-conducting structure can also include an auxiliary heat-conducting pad 113, which is arranged between the heat-vaporizing plate 1121 and the shell heat-conducting part 220. Then, the heat of the heating device 210 can be dissipated to the surrounding air environment through the heat-vaporizing plate 1121, the auxiliary heat-conducting pad 113, and the shell heat-conducting part 220.

[0065] In some embodiments, at least part of the cold circuit channel 130 and the hot circuit channel 140 are disposed in the cable 30, and the cable 30 is used for both the transmission of electrical signals and the circulation of cooling liquid. It is understandable that the cold circuit channel 130 and the hot circuit channel 140 can be either separately provided cold circuit conduits and hot circuit conduits, or can be cold circuit conduits and hot circuit conduits surrounded by the cable 30 itself, the outer shell of the probe operating part 20, and the outer shell of the plug 40. By disposing at least part of the cold circuit channel 130 and the hot circuit channel 140 in the cable 30, the structure is simplified, and the appearance of the probe device 1 can be the same as that of a conventional probe device 1, further "hiding" the heat dissipation properties of the probe, so that the use and maintenance of passive and active heat dissipation probe devices 1 are completely consistent. In other embodiments,

[0066] In some embodiments, a heat insulating layer is provided outside the cold circuit channel 130. The heat insulating layer may specifically be a layer of heat-insulating material. By providing a heat insulating layer outside the cold circuit channel 130, it is possible to avoid the cooling liquid absorbing the heat of the surrounding environment as much as possible, thereby improving the energy utilization efficiency of the system. When the cold circuit channel 130 and the hot circuit channel 140 are arranged side by side, a heat insulating layer may also be provided outside the hot circuit channel 140 as needed to avoid the influence of the heat of the hot circuit channel 140 on other components.

[0067] In some embodiments, the pump body 150 is disposed in the hot circuit channel 140. The pump body 150 provides power for the entire circulation loop and is disposed in the hot circuit channel 140, such as at a position close to the cold end of the hot circuit channel 140, to reduce its influence on the cold circuit channel 130. In addition, when a heat insulation layer is disposed outside the cold circuit channel 130, the pump body 150 is disposed in the hot circuit channel 140. Compared with disposing the main body in the cold circuit channel 130, since there is no need to consider the pump body 150 part, the structure of the heat insulation layer is simplified.

[0068] In some embodiments, the pump body 150 is disposed in the plug 40 , so as not to occupy the internal space of the probe operating part 20 and avoid affecting the layout of the components in the probe operating part 20 .

[0069] In some embodiments, the coolant is an environmentally friendly coolant with a low freezing point to ensure reliability in a low temperature environment, and can be water. In other embodiments, the coolant can also be other gases that can flow and exchange heat.

[0070] In some embodiments, a vent 410 is provided on the outer shell of the plug 40 at a position corresponding to the heat exchanger 120 to communicate with the heat dissipation duct in the host 2. That is, the heat dissipation device 21 in the host 2 adopts an air cooling device, which has a heat dissipation duct, and the heat of the high-temperature coolant in the heat exchanger 120 is exchanged to the air in the heat dissipation duct, completing the "contactless" transfer of heat from the camera head to the host 2. The cooling circuit 10 is combined with the air cooling of the host 2 to achieve the conversion between the cooling circuit 10 and the air cooling. By providing the vent 410, the air in the heat dissipation duct can directly exchange heat with the heat exchanger 120, thereby improving the heat dissipation efficiency and simplifying the structure. In other embodiments, the outer shell of the plug 40 can also adopt a heat-conducting outer shell, and then there is no need to provide the vent 410. The heat of the heat exchanger 120 is transferred to the outer shell of the plug 40, and then cooled by the air in the heat dissipation duct.

[0071] In some embodiments, the ventilation holes 410 on the outer shell of the camera plug 40 are in the form of honeycomb holes to provide protection from people and external impacts.

[0072] In some embodiments, the outer shell of the plug 40 is sealed and connected to the heat exchanger 120 at least on one side of the vent 410 close to the cable 30. The above-mentioned sealing can prevent the air in the heat dissipation duct from flowing into the sealed position of the plug 40, and can also prevent the disinfection process from affecting other components within the sealed position of the plug 40.

[0073] In some embodiments, the heat exchanger 120 includes a liquid-cooled heat exchange unit 121 and an air-cooled heat exchange unit 122, and the air-cooled heat exchange unit 122 is arranged opposite to the ventilation hole 410. The liquid-cooled heat exchange unit 121 is connected to the cold circuit channel 130 and the hot circuit channel 140 respectively, and as the cold end of the circulation loop, absorbs the heat in the high-temperature coolant from the hot end of the loop to achieve the effect of cooling it. The air-cooled heat exchange unit 122 is responsible for exchanging the heat from the liquid-cooled heat exchange unit 121 to the air to complete the "contactless" transfer of heat from the probe to the host 2. The connection between the liquid-cooled heat exchange unit 121 and the air-cooled heat exchange unit 122 is sealed with the outer shell of the plug 40, so that the entire liquid circuit is sealed inside the probe device 1, thereby improving safety. The air-cooled heat exchange unit 122 can specifically use air-cooled fins.

[0074] In some embodiments, the liquid-cooled heat exchange part 121 and the air-cooled heat exchange part 122 are an integrated structure. The integrated structure has a very low connection thermal resistance, so the heat absorbed by the liquid-cooled heat exchange part 121 from the coolant in the heat circuit channel 140 can be efficiently transferred to the air-cooled heat exchange part 122. The liquid-cooled heat exchange part 121 can specifically include a liquid-cooled coil, and the air-cooled heat exchange part 122 can specifically include fins to increase the heat exchange area of ​​liquid cooling and air cooling.

[0075] The present application also provides a host that cooperates with any of the probe devices in the above embodiments. Figure 1 In a specific embodiment, the host 2 includes a housing, a socket 22 and a heat sink 21. The socket 22 is provided in the housing of the host 2, and the socket 22 is used to connect with the plug 40 of the probe device 1. The socket 22 is provided with an air inlet 221 and an air outlet 222, and the air inlet 221 and the air outlet 222 are respectively used to communicate with the ventilation hole 410 of the plug 40. The heat sink 21 is provided in the housing of the host 2, and is used to allow air to enter through the air inlet 221 and flow through the ventilation hole 410 to exchange heat with the heat exchanger 120 of the cooling circuit 10 in the probe device 1 and then be discharged from the air outlet 222. That is, an air-cooling heat dissipation structure is provided on the host 2, and an air inlet 221 and an air outlet 222 are provided on the socket, and their positions specifically correspond to the positions of the ventilation holes 410 on the plug 40, so that the heat on the plug 40 side is dissipated by air cooling.

[0076] The host 2 provided by the utility model is used to cooperate with the probe device 1. By setting the air inlet 221 and the air outlet 222 on the socket 22 and cooperating with the vent 410 of the plug device 1, the heat exchanger 120 of the cooling circuit 10 of the probe device 1 can be radiated by the heat dissipation device 21, and the heat of the heat exchanger 120 can be taken away to cool it down, that is, the cooling liquid in the cooling circuit 10 that absorbs the heat of the probe device 1 and the temperature rises can be cooled down, and the cooling liquid with a lowered temperature can further absorb the heat of the probe device 1, and the cycle continues. With the host 2, there is no need to dock with the plug 40 of the probe device 1 to connect the coolant. The cooling circuit 10 is arranged on the probe device 1 as a whole, and the host 2 is provided with the heat dissipation device 21 accordingly. Therefore, it has no effect on the disinfection form of the probe device 1, simplifies the daily maintenance method, and eliminates the possible abnormal risks such as pipeline contamination and blockage failure. In addition, the transfer of heat from the probe device 1 to the host 2 does not require the connection of the coolant, thereby reducing the requirements for interface sealing, improving the durability of the relevant structure, and reducing the possibility of corresponding functional performance degradation due to wear and tear of the interface. Furthermore, the heat exchanger 120 is cooled by the heat dissipation device 21 in the host 2, and there is no need to set a heat dissipation device on the probe device 1. Therefore, the heat exchange area is not limited by the volume of the probe device, which is conducive to improving the heat dissipation efficiency.

[0077] In some embodiments, see Figure 1The housing of the host 2 is provided with an air inlet 201 and an air outlet 202. The heat dissipation device 21 includes an air inlet 211 and an air outlet 212, and a blower 213 and / or an exhaust fan 214. One end of the air inlet 211 is connected to the air inlet 201, and the other end is connected to the air inlet hole 221; one end of the air outlet 212 is connected to the air outlet 202, and the other end is connected to the air outlet hole 222; the blower 213 is arranged in the air inlet 211, and the exhaust fan 214 is arranged in the air outlet 212. The above structure forms an air duct structure for cooling the heat exchanger 120 (specifically, the air-cooling heat exchange part 122) in the plug 40 from the air inlet 201 corresponding to the host 2 through the socket 22 and the plug 40 structure to the air outlet 202. When ventilation holes 410 are provided on the shell of the plug 40, a closed air duct is formed in series along the wind flow direction, which is composed of the air inlet 201, the air inlet duct 211, the air inlet hole 221 of the socket 22, the ventilation hole 410 of the plug 40, the heat exchanger 120 (specifically, it can be the air-cooling heat exchange part 122 of the heat exchanger 120), the ventilation hole 410 of the plug 40, the air outlet 222 of the socket 22, the air outlet duct 212, and the structural area of ​​the air outlet 202.

[0078] It is understandable that the air inlet 211 and the air outlet 212 can be surrounded by the shell of the host 2, or can be a separately arranged duct. The air inlet 211 and the air outlet 212 can guide the air. The air inlet 201 extracts the cold air of the ambient temperature, and the air outlet 202 is specifically arranged at the rear or side of the host 2 to quickly discharge the heated air from the host 2. The positions of the air inlet 201 and the air outlet 202 are as opposite as possible, and can be specifically located at the bottom of the host 2 or the side not adjacent to the air outlet 202 to prevent the heated air from entering the circulation again. In the case where the vent 410 is provided on the shell of the plug 40, the air inlet 221 and the air outlet 222 on the socket 22 correspond to the vent 410 on the plug 40. The blower 213 is used to send the ambient air into the plug 40 part for heat exchange, and the exhaust fan 214 is used to pump the heated air out, and then the fresh air enters the air inlet 211. As required, the air supply fan 213 or the exhaust fan 214 can be provided separately, or the air supply fan 213 and the exhaust fan 214 can be provided simultaneously, and the two can cooperate with each other and work simultaneously or separately when in use, thereby improving system redundancy.

[0079] In some embodiments, a heat insulation layer is provided outside the air inlet duct 211 to reduce the loss of cooling capacity.

[0080] In some embodiments, a semiconductor refrigeration device 23 is further provided in the host 2, and the cold end of the semiconductor refrigeration device 23 is provided in the air inlet 211, and the hot end is provided in the air outlet 212, or the cold end and the hot end of the semiconductor refrigeration device 23 are provided with heat-conducting components 24 respectively, and the heat-conducting component 24 of the cold end is provided in the air inlet 211, and the heat-conducting component 24 of the hot end is provided in the air outlet 212. The cold end of the semiconductor refrigeration device 23 directly or indirectly absorbs the heat of the air in the air inlet 211 through the heat-conducting component 24, so that the temperature of the air entering the air inlet hole 221 is reduced, and the lower the temperature of the air entering the plug 40 for heat exchange, the more conducive to heat conduction, thereby further improving the heat dissipation efficiency. At the same time, the air in the air outlet 212 that has exchanged heat with the plug 40 is used to cool the hot end of the semiconductor refrigeration device 23 to improve the cooling efficiency. The probe system provided by the present application has a very high upper limit value of theoretical heat dissipation. The higher the exchange efficiency of the component design, the higher the cooling power consumption of the semiconductor refrigeration device 23, and the higher the heat that can be taken away. The power consumption corresponds to the circuit performance, so the probe system in this application can theoretically achieve significantly more powerful performance.

[0081] In some embodiments, the heat-conducting component 24 includes a heat exchange fin 241. The cold end of the semiconductor refrigeration device 23 is in direct or indirect contact with the heat exchange fin 241 for heat conduction, and the heat exchange fin 241 can increase the heat exchange area with the air in the air inlet duct 211 or the air outlet duct 212, thereby improving the heat exchange efficiency. The semiconductor refrigeration device 23 is used to provide the heat sink effect capability of the heat exchange fin 241 in the air inlet duct 211.

[0082] In some embodiments, the heat conducting component 24 further includes a second heat conducting pad 242 disposed in contact with the heat exchange fin 241. The heat conducting connection is performed through the second heat conducting pad 242, and the thermal resistance is low. While achieving efficient heat conduction, the flexible connection can play a protective role and reduce the assembly precision requirements.

[0083] The utility model also provides a probe system, which includes a probe device 1 and a host 2. The probe device 1 is any one of the probe devices 1 in the above embodiments, and / or the host 2 is any one of the host 2 in the above embodiments. Since the probe system adopts the probe device 1 or the host 2 in the above embodiments, please refer to the above embodiments for the beneficial effects of the probe system.

[0084] See also Figure 4In some embodiments, a first temperature detection device 60 is provided on the first heat-conducting structure 112 to detect the temperature of the first heat-conducting structure 112, specifically, the temperature of the heat spreader 1121. A second temperature sensor may be provided in the heat exchanger 120 or the cold circuit channel 130 to detect the cold end temperature of the cooling circuit 10. A third temperature sensor may be provided in the air inlet 211 or at the air inlet 201 of the housing of the host 2 to detect the air temperature at the corresponding position. The cooling circuit 10 and the heat sink 21 are controlled by the temperature detection at the above-mentioned different positions. Specifically, the probe system includes a control circuit 90, which adjusts and controls the cooling power of the pump body 150, the air supply fan 213 and / or the exhaust fan 214, and the semiconductor refrigeration device 23 according to the temperature of the first heat-conducting structure 112 collected by the first temperature detection device 60, the temperature of the heat exchanger 120 collected by the second temperature detection device 70, and the temperature of the ambient air collected by the third temperature detection device 80, and finally achieves the control of the temperature rise of the probe operation part 20 to achieve precise temperature control. And through perfect boundary control restrictions, the normal operation and abnormal handling of the entire system can be ensured, providing stable operation throughout the entire life cycle.

[0085] In some embodiments, the control circuit 90 controls the rotation speed of the pump body 150 through a closed-loop control loop to lock the surface temperature of the first heat-conducting structure 112 in the probe operating part 20 to a certain expected absolute value or an expected value relative to the ambient temperature. And the rotation speed of the air supply fan 213 and / or the exhaust fan 214 or the refrigeration air filter of the semiconductor refrigeration device 23 is controlled through a closed-loop control loop to lock the surface temperature of the heat exchanger 120 in the plug 40 of the probe device 1 to a certain expected absolute value or an expected value relative to the ambient temperature. Within the range allowed by the system control boundary parameters, the higher the circulation flow rate achieved by driving the pump body 150, the faster the wind speed in the air duct in the host 2, and the stronger the refrigeration of the semiconductor refrigeration device 23, the more heat can be transferred from the heating device 210 to the ambient air.

[0086] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0087] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present invention. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A probe device, comprising a probe operating part (20), a cable (30) and a plug (40), wherein two ends of the cable (30) are respectively connected to the probe operating part (20) and the plug (40), the probe operating part (20) has a heating device (210), and the plug (40) is used to connect to a host (2) of the probe device; characterized in that: It also includes a cooling circuit (10), wherein a cooling liquid is sealed in the cooling circuit (10), and the cooling circuit (10) includes: A cooling module (110) is disposed in the probe operating portion (20) and is used to absorb heat from the heating element (210); A heat exchanger (120) is disposed in the plug (40) and is used to exchange heat with a heat dissipation device (21) in the host (2); a cold circuit channel (130) and a hot circuit channel (140), wherein one end of the cold circuit channel (130) is connected to the inlet of the cooling module (110), and the other end is connected to the outlet of the heat exchanger (120); and one end of the hot circuit channel (140) is connected to the outlet of the cooling module (110), and the other end is connected to the inlet of the heat exchanger (120); A pump body (150) is disposed in the cold circuit channel (130) or the hot circuit channel (140) to drive the coolant to flow.

2. The probe device according to claim 1, characterized in that: The cooling module (110) comprises: a cold exchanger (111), wherein an inlet of the cold exchanger (111) is in communication with the cold circuit channel (130), and an outlet of the cold exchanger (111) is in communication with the hot circuit channel (140); The first heat-conducting structure (112) is disposed in contact with the heating device (210) and the cold exchanger (111) respectively.

3. The probe device according to claim 2, characterized in that: The first heat-conducting structure (112) comprises a heat-vaporizing plate (1121) and a first heat-conducting pad (1122), wherein the first heat-conducting pad (1122) is arranged between the heating device (210) and the heat-vaporizing plate (1121), and / or between the heat-vaporizing plate (1121) and the cold exchanger (111).

4. The probe device according to claim 1, characterized in that: The probe operating part (20) comprises a shell heat conducting part (220), and the shell heat conducting part (220) is arranged in contact with the heating device (210), or a second heat conducting structure is arranged between the shell heat conducting part (220) and the heating device (210).

5. The probe device according to claim 1, characterized in that: At least parts of the cold circuit channel (130) and the hot circuit channel (140) are arranged in the cable (30).

6. The probe device according to claim 1, characterized in that: The cold circuit channel (130) is provided with a heat insulation layer outside.

7. The probe device according to claim 1, characterized in that: The pump body (150) is arranged in the hot circuit channel (140).

8. The probe device according to any one of claims 1 to 7, characterized in that: A ventilation hole (410) is provided on the outer shell of the plug (40) at a position corresponding to the heat exchanger (120) so as to communicate with the heat dissipation duct in the host (2).

9. The probe device according to claim 8, characterized in that: The outer shell of the plug (40) is at least located on one side of the ventilation hole (410) close to the cable (30) and is sealedly connected to the heat exchanger (120).

10. The probe device according to claim 8, characterized in that: The heat exchanger (120) comprises a liquid-cooled heat exchange portion (121) and an air-cooled heat exchange portion (122); the air-cooled heat exchange portion (122) is arranged opposite to the ventilation hole (410); and the connection between the liquid-cooled heat exchange portion (121) and the air-cooled heat exchange portion (122) is sealed to the outer shell of the plug (40).

11. The probe device according to claim 10, characterized in that: The liquid-cooling heat exchange part (121) and the air-cooling heat exchange part (122) are an integrated structure.

12. A host, characterized in that: include: shell; A socket (22) is provided on the housing, the socket (22) is used to connect with the plug (40) of the probe device (1), the socket (22) is provided with an air inlet (221) and an air outlet (222), the air inlet (221) and the air outlet (222) are respectively used to communicate with the ventilation hole (410) of the plug (40); The heat dissipation device (21) is arranged in the housing and is used to allow air flow to enter through the air inlet (221) and flow through the ventilation hole (410) to exchange heat with the heat exchanger (120) of the cooling circuit in the probe device (1) and then be discharged from the air outlet (222).

13. The host according to claim 12, characterized in that: The housing is provided with an air inlet (201) and an air outlet (202); the heat dissipation device (21) comprises an air inlet duct (211), an air outlet duct (212), a blower (213) and / or an exhaust fan (214); one end of the air inlet duct (211) is connected to the air inlet (201), and the other end is connected to the air inlet hole (221); one end of the air outlet duct (212) is connected to the air outlet (202), and the other end is connected to the air outlet hole (222); the blower (213) is arranged in the air inlet duct (211), and the exhaust fan (214) is arranged in the air outlet duct (212).

14. The host according to claim 13, characterized in that: It also includes a semiconductor refrigeration device (23), wherein the cold end of the semiconductor refrigeration device (23) is arranged in the air inlet duct (211), and the hot end is arranged in the air outlet duct (212); or, the cold end and the hot end of the semiconductor refrigeration device (23) are respectively provided with heat-conducting components (24), the heat-conducting component (24) of the cold end is arranged in the air inlet duct (211), and the heat-conducting component (24) of the hot end is arranged in the air outlet duct (212).

15. The host according to claim 14, characterized in that: The heat-conducting component (24) comprises a heat-exchanging fin (241) and a second heat-conducting pad (242) arranged in contact with the heat-exchanging fin (241).

16. A probe system, comprising a probe device (1) and a host (2), characterized in that: The probe device (1) is the probe device (1) described in any one of claims 1 to 11, and / or the host (2) is the host (2) described in any one of claims 12 to 15.

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