Cleaning device for SMT (Surface Mount Technology)

Abstract

The utility model discloses a cleaning device for SMT (Surface Mount Technology), which comprises a base, a hollow plate is arranged above the base, a motor is arranged at the upper end of the hollow plate, a plurality of exhaust inlets are arranged at the lower end of the hollow plate, the exhaust inlets are all communicated with the interior of the hollow plate, and the motor is arranged on the base. And a cleaning mechanism for SMT (Surface Mount Technology) mounting is arranged above the base. After the draught fan is started, fine solder paste and dust generated in the cleaning process can be sucked into the hollow plate through the hose, the hollow plate and the exhaust inlets, then the fine solder paste and the dust enter the filter box and are filtered by the filter screen in the filter box, and then the fine solder paste and the dust are filtered by the filter screen in the filter box. By means of the arrangement, the cleaning efficiency of the device is improved to a certain degree, and the workpieces are cleaned more thoroughly.

Description

Technical Field

[0001] The present application relates to the technical field of SMT patches, and in particular to a cleaning device for SMT patches. Background Art

[0002] For example, a cleaning device for SMT patches mentioned in announcement number CN202321296975.4 is an efficient cleaning device for SMT patches. Surface assembly technology refers to a series of process flows based on PCB. Solder paste printing is the basic process for SMT patch production. It is to print solder paste on the pads of PCB to prepare for the welding of components. It is located at the forefront of the SMT production line. Traditionally, the solder paste is placed on the steel mesh, and then the solder paste on the steel mesh is scraped through the gaps of the steel mesh to the pads of the PCB by a scraper. After the scraper scrapes the solder paste on the steel mesh, the excess solder paste on the PCB pad is pressed from the gaps on the steel mesh to the top of the steel mesh, thereby leaving paste on the steel mesh. When the paste solidifies, it needs to be cleaned, and the number of single batch printings will be reduced during the cleaning process.

[0003] The solution is to add a first scraper, a second scraper, a slider and a slide groove on the original basis. When the scraper of the solder paste printer slides back and forth on the steel mesh to print the solder paste, the first scraper moves synchronously with the scraper of the printer, and the bottom of the first scraper is tightly connected to the steel mesh. When the first scraper stops moving, the second scraper is horizontally slid on the first scraper, and the solder paste remaining on the steel mesh is scraped off by the first scraper and the second scraper, thereby reducing the frequency of cleaning the steel mesh and increasing the number of single batch printings.

[0004] With respect to the above-mentioned related technologies, the inventor believes that in actual operation, the device scrapes off the solder paste residue on the steel mesh by the first scraper and the second scraper. However, during the scraping process, fine solder paste and dust are still easily adhered to the steel mesh again, resulting in incomplete cleaning.

[0005] The above information disclosed in the background technology is only used to increase the understanding of the background technology of the present application, and therefore, it may include information that does not constitute the prior art known to ordinary technicians in the field. Utility Model Content

[0006] In order to solve the problem that in actual operation, the device scrapes off the solder paste residue on the steel mesh by a first scraper and a second scraper. However, during the scraping process, fine solder paste and dust are still easy to adhere to the steel mesh again, resulting in incomplete cleaning. The present application provides a cleaning device for SMT patches.

[0007] The present application provides a cleaning device for SMT patches using the following technical solutions:

[0008] A cleaning device for SMT patches comprises a base, a hollow plate is arranged above the base, a motor is installed at the upper end of the hollow plate, a plurality of air suction ports are arranged at the lower end of the hollow plate, the plurality of air suction ports are all connected to the interior of the hollow plate, and a cleaning mechanism for SMT patches is arranged above the base.

[0009] Preferably, two vertical rods are symmetrically fixedly connected to the upper end of the base, and the upper ends of the two vertical rods are commonly fixedly connected to a top plate.

[0010] Preferably, the cleaning mechanism comprises two electric telescopic rods symmetrically installed at the lower end of the top plate, the telescopic ends of the two electric telescopic rods are fixedly connected to the upper end of the hollow plate, and the lower ends of the two hollow plates are rotatably connected to two rotating rods.

[0011] Preferably, the output shaft end of the motor extends to the lower end of the hollow plate and is fixedly connected to one end of the left rotating rod. A transmission assembly is commonly provided on the two rotating rods, and the transmission assembly includes two mutually meshing gears, and the two gears are respectively fixedly connected to the two rotating rods. The lower ends of the two rotating rods are fixedly connected to a turntable, and the lower ends of the two turntables are fixedly connected to a brush layer.

[0012] Preferably, a fan is installed at the upper end of the top plate, a filter box is provided at the upper end of the top plate, a filter net is provided in the filter box, an air suction end of the fan extends into the filter box, and the filter box is connected to the interior of the hollow plate through a hose.

[0013] Preferably, two vertical plates are fixedly connected to the upper end of the base, a conveying device is arranged between the two vertical plates, and a control switch is arranged on the vertical plate located at the front side, and the control switch is connected with the motor and the fan signal.

[0014] In summary, this application includes the following beneficial technical effects:

[0015] 1. After starting the fan, the fine solder paste and dust generated during the cleaning process can be sucked into the hollow plate through the hose and the hollow plate through multiple suction ports. These fine solder paste and dust then enter the filter box and are filtered by the filter net in the filter box. This setting improves the cleaning efficiency of the device to a certain extent, making the workpiece cleaning more thorough;

[0016] 2. After the motor is started, the rotating rod on the left will rotate. Since the two rotating rods are connected through the transmission assembly, the starting of the motor will cause the two rotating rods to drive the corresponding turntable and brush layer to rotate, and wipe the upper end of the workpiece. And because the transmission assembly is a gear transmission, the rotation directions of the two brush layers are opposite, so that the cleaning effect is better. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the overall structure of the embodiment of the application;

[0018] Figure 2 It is a schematic diagram of the hollow plate structure of the embodiment of the application;

[0019] Figure 3 Schematic diagram of a cleaning component according to an embodiment of the present invention.

[0020] Explanation of the accompanying drawings: 1. base; 2. vertical plate; 3. vertical rod; 4. top plate; 5. fan; 6. filter box; 7. electric telescopic rod; 8. hose; 9. hollow plate; 10. motor; 11. conveying device; 12. air suction port; 13. rotating rod; 14. brush layer; 15. turntable; 16. transmission assembly. DETAILED DESCRIPTION

[0021] The following is combined with Figure 1-3 This application is described in further detail.

[0022] The present application embodiment discloses a cleaning device for SMT patches. Figure 1 A cleaning device for SMT patches includes a base 1, a hollow plate 9 is arranged above the base 1, a motor 10 is installed at the upper end of the hollow plate 9, a plurality of suction ports 12 are arranged at the lower end of the hollow plate 9, and the plurality of suction ports 12 are all connected to the interior of the hollow plate 9, and a cleaning mechanism for SMT patches is arranged above the base 1.

[0023] Reference Figure 1 The upper end of the base 1 is symmetrically fixedly connected to two vertical rods 3, and the upper ends of the two vertical rods 3 are commonly fixedly connected to a top plate 4.

[0024] Reference Figure 1-3 The cleaning mechanism includes two electric telescopic rods 7 symmetrically installed at the lower end of the top plate 4, the telescopic ends of the two electric telescopic rods 7 are fixedly connected to the upper end of the hollow plate 9, and the lower ends of the two hollow plates 9 are rotatably connected to two rotating rods 13, the output shaft end of the motor 10 extends to the lower end of the hollow plate 9 and is fixedly connected to one end of the rotating rod 13 on the left side, and a transmission assembly 16 is commonly provided on the two rotating rods 13, and the transmission assembly 16 includes two mutually meshing gears, and the two gears are respectively fixedly connected to the two rotating rods 13, and the lower ends of the two rotating rods 13 are fixedly connected with a turntable 15, and the lower ends of the two rotating disks 15 are fixedly connected with a brush layer 14, and a fan 5 is installed at the upper end of the top plate 4, and a filter box 6 is provided at the upper end of the top plate 4, and a filter net is provided in the filter box 6, and the suction end of the fan 5 extends into the filter box 6, and the filter box 6 is connected to the interior of the hollow plate 9 through a hose 8.

[0025] After the motor 10 is started, the rotating rod 13 on the left will rotate. Since the two rotating rods 13 are connected through the transmission assembly 16, the start of the motor 10 will cause the two rotating rods 13 to drive the corresponding turntable 15 and the brush layer 14 to rotate, so as to wipe and clean the upper end of the workpiece. Moreover, since the transmission assembly 16 is a gear transmission, the rotation directions of the two brush layers 14 are opposite, so that the cleaning effect is better. After starting the fan 5, the fine solder paste and dust generated during the cleaning process can be sucked into the hollow plate 9 through the hose 8 and the hollow plate 9 through multiple suction ports 12. These fine solder pastes and dust then enter the filter box 6 and are filtered by the filter net in the filter box 6. This arrangement improves the cleaning efficiency of the device to a certain extent.

[0026] Reference Figure 1 Two vertical plates 2 are fixedly connected to the upper end of the base 1, a conveying device 11 is arranged between the two vertical plates 2, a control switch is arranged on the vertical plate 2 at the front side, the control switch is connected with the motor 10 and the fan 5 signal, and the model of the motor 10 can be selected as YE2-6344-37KW.

[0027] The implementation principle of the cleaning device for SMT patches in the embodiment of the present application is as follows: when in use, two brush layers 14 are started to move downward by two electric telescopic rods 7, and the workpiece to be cleaned is placed on the upper end of the conveying device 11, and then the conveying device 11 is started to transport the workpiece, and at the same time, the motor 10 and the fan 5 are started by the control switch;

[0028] After the motor 10 is started, the left rotating rod 13 will rotate. Since the two rotating rods 13 are connected by the transmission assembly 16, the start of the motor 10 will cause the two rotating rods 13 to drive the corresponding rotating disk 15 and the brush layer 14 to rotate, so as to wipe and clean the upper end of the workpiece. Moreover, since the transmission assembly 16 is a gear transmission, the rotation directions of the two brush layers 14 are opposite, so that the cleaning effect is better.

[0029] In the above process, after the fan 5 is started, the fine solder paste and dust generated during the cleaning process can be sucked into the hollow plate 9 through the hose 8 and the hollow plate 9, and then through multiple suction ports 12. These fine solder paste and dust then enter the filter box 6 and are filtered by the filter net in the filter box 6. This arrangement improves the cleaning efficiency of the device to a certain extent, making the cleaning of the workpiece more thorough.

[0030] Finally, a few points should be explained: First, in the description of this application, it should be noted that, unless otherwise specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, which may refer to mechanical connection or electrical connection, or internal communication between two components, or direct connection. "upper", "lower", "left", "right", etc. are only used to indicate relative positional relationships. When the absolute position of the object being described changes, the relative positional relationship may change;

[0031] Secondly: In the drawings of the embodiments disclosed in the present utility model, only the structures related to the embodiments disclosed in the present utility model are involved, and other structures can refer to the general design. In the absence of conflict, the same embodiment and different embodiments of the present utility model can be combined with each other;

[0032] Finally: The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present utility model should be included in the protection scope of the present utility model.

[0033] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A cleaning device for SMT patches, comprising a base (1), characterized in that: A hollow plate (9) is arranged above the base (1), a motor (10) is installed at the upper end of the hollow plate (9), a plurality of air suction ports (12) are arranged at the lower end of the hollow plate (9), and the plurality of air suction ports (12) are all connected to the interior of the hollow plate (9), and a cleaning mechanism for SMT patches is arranged above the base (1).

2. A cleaning device for SMT patches according to claim 1, characterized in that: The upper end of the base (1) is symmetrically fixedly connected to two vertical rods (3), and the upper ends of the two vertical rods (3) are commonly fixedly connected to a top plate (4).

3. A cleaning device for SMT patches according to claim 2, characterized in that: The cleaning mechanism comprises two electric telescopic rods (7) symmetrically mounted on the lower end of the top plate (4), the telescopic ends of the two electric telescopic rods (7) being fixedly connected to the upper end of the hollow plate (9), and the lower ends of the two hollow plates (9) being rotatably connected to two rotating rods (13).

4. A cleaning device for SMT patches according to claim 3, characterized in that: The output shaft end of the motor (10) extends to the lower end of the hollow plate (9) and is fixedly connected to one end of the left rotating rod (13). The two rotating rods (13) are commonly provided with a transmission assembly (16). The transmission assembly (16) comprises two mutually meshing gears. The two gears are respectively fixedly connected to the two rotating rods (13). The lower ends of the two rotating rods (13) are fixedly connected to a rotating disk (15). The lower ends of the two rotating disks (15) are fixedly connected to a brush layer (14).

5. A cleaning device for SMT patches according to claim 4, characterized in that: A fan (5) is installed at the upper end of the top plate (4), a filter box (6) is arranged at the upper end of the top plate (4), a filter screen is arranged inside the filter box (6), an air suction end of the fan (5) extends into the filter box (6), and the filter box (6) is connected to the interior of the hollow plate (9) through a hose (8).

6. A cleaning device for SMT patches according to claim 2, characterized in that: Two vertical plates (2) are fixedly connected to the upper end of the base (1), a conveying device (11) is arranged between the two vertical plates (2), and a control switch is arranged on the vertical plate (2) at the front side, and the control switch is connected to the motor (10) and the fan (5) by signal.

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