Refrigerating device capable of quickly cooling and forming
By designing a frozen device including semiconductor refrigeration and heat -exhaust fan, the problem of slow cooling speed during the formation of pearl cotton forming is solved, and the rapid cooling of pearl cotton cotton cotton cotton cotton is used to maintain shape stability and mechanical properties. Production efficiency.
Patent Information
- Application Number
- CN202420270646.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-02-04
- Publication Date
- 2025-01-28
- Estimated Expiration
- 2034-02-04
AI Technical Summary
The slow cooling speed during the forming process of pearl cotton leads to changes in the internal structure and fiber arrangement of the material, affecting the shape stability and mechanical properties. Slow cooling will cause temperature gradient, high heat shrinkage, product dimensional accuracy and texture to decrease, increasing production cost.
A freezing device that includes topboards, feed inlets, heat air fans and semiconductor refrigerations. It provides rapid refrigeration through semiconductor refrigeration film, and uses heat exhaust fan to quickly discharge heat to achieve rapid cooling of pearl cotton cotton.
Through rapid cooling, maintain the shape stability and mechanical properties of pearl cotton cotton, reduce temperature gradient and thermal contraction rate, improve product size accuracy and texture, reduce production costs and improve production efficiency.
Smart Images
Figure CN222407103U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of pearl cotton molding, and relates to a refrigeration device capable of rapid cooling and molding. Background Art
[0002] Pearl cotton is a polyethylene foam cotton, named because its internal structure is similar to pearls. This material has excellent heat insulation, shockproof and sound insulation properties, and is widely used in packaging, thermal insulation, waterproofing and other fields. First of all, freeze molding is a manufacturing process that changes the shape of the material by cooling it to a low temperature and applying pressure. In the manufacturing process of pearl cotton, freeze molding is a very important link. By placing the pearl cotton in a low temperature environment and using cooling and pressurization methods, the shape of the pearl cotton can be made more stable and consistent. This treatment process can effectively improve the compression resistance and durability of the pearl cotton, making it less likely to deform or damage during long-term use. However, the failure to quickly freeze the pearl cotton during the molding process may cause a series of problems, mainly in the following aspects:
[0003] After heating and softening, pearl cotton needs to be cooled quickly to maintain its shape. If the cooling speed is too slow, the material will cool slowly, causing changes in its internal structure and fiber arrangement, which in turn affects its shape stability. The mechanical properties of pearl cotton, such as elasticity and compressive strength, are closely related to the internal structure and fiber arrangement of the material. If the cooling speed is slow, the molecular chains inside the material will have more time to be disordered during the movement, resulting in a decrease in the mechanical properties of the material.
[0004] If the cooling speed is slow, the heat energy inside the material is difficult to dissipate quickly, resulting in a large temperature gradient in the material during the cooling process, which in turn causes a large thermal shrinkage rate. This not only affects the dimensional accuracy of the product, but may also affect its performance. Slow cooling may cause defects such as bubbles and wrinkles on the surface of the material, affecting the appearance and texture of the product. Due to the long cooling time, the waiting time on the production line will also be extended, resulting in a decrease in overall production efficiency and an increase in production costs.
[0005] In summary, rapid freezing is crucial to the pearl cotton forming process. Therefore, a freezing device that can quickly cool and form is urgently needed to solve the above problems. Utility Model Content
[0006] In view of the shortcomings of the prior art, the purpose of the utility model is to provide a freezing device that can quickly cool and shape, so as to solve the problems raised in the above background technology.
[0007] The utility model is realized by the following technical scheme: a refrigeration device capable of rapid cooling and forming, comprising: a top plate, a feed port and a heat exhaust fan, the feed port is arranged on the left side of the upper end of the top plate, and a plurality of fixing bolts are arranged inside the upper end of the top plate;
[0008] A cover plate is provided at the lower end of the top plate, a seat plate is provided at the lower end of the cover plate, a molding cavity is provided inside the seat plate, a semiconductor cooling sheet is provided inside the molding cavity, two groups of wires are provided on the right side of the semiconductor cooling sheet, and a group of connectors are provided on the right side of each group of wires;
[0009] The top plate, the cover plate and the seat plate are connected and fixed by several groups of fixing bolts. The cover plate is a hollow structure. A forming upper groove is opened inside the cover plate. The inside of the forming upper groove is interconnected with the inside of the feed port, and the pearl cotton raw material can be introduced into the forming upper groove through the feed port.
[0010] As a preferred embodiment, a silicone film is provided on the upper end of the semiconductor refrigeration plate, and a lifting cylinder is provided in the middle position of the lower end of the base plate. There are two groups of lifting cylinders, which are respectively arranged on the left and right sides of the semiconductor refrigeration plate. The pearl cotton inside the molding cavity can be ejected by using the lifting cylinders.
[0011] As a preferred embodiment, the internal cross-sectional length and width of the molding upper groove are respectively the same as the cross-sectional length and width of the molding cavity. The molding upper groove and the molding cavity constitute an EPE cooling cavity, and the EPE cooling cavity can be used to quickly freeze the EPE.
[0012] As a preferred embodiment, the semiconductor refrigeration plate is located in the middle of the lower end of the EPE cooling chamber, and the semiconductor refrigeration plate and the two sets of wires and the connector are an integrated structure, and the connector is used to connect to an external power module.
[0013] As a preferred embodiment, the upper end of the semiconductor refrigeration plate is a cooling end, and the lower end is a heat release end. The lower end of the heat release end is connected and fixed to a temperature conduction block. The temperature conduction block is made of an aluminum alloy material and can provide a cooling effect to the inside of the pearl cotton cooling cavity by using a semiconductor refrigeration plate.
[0014] As a preferred embodiment, a heat exhaust fan is provided on the left side of the temperature conduction block, and an air vent is provided inside the left side of the temperature conduction block. Several groups of air vent grooves are opened inside the temperature conduction block, and the interiors of several groups of air vent grooves are interconnected with the interior of the heat exhaust fan.
[0015] As a preferred embodiment, the interior of the heat release end of the semiconductor refrigeration plate is interconnected with the interior of the air permeable groove, and a group of side shells are provided on the upper and lower sides of the temperature conduction block. The two groups of side shells are respectively connected and fixed to the upper and lower ends of the heat exhaust fan by bolts, so that the heat release end of the semiconductor refrigeration plate can be discharged through the heat exhaust fan.
[0016] After adopting the above technical scheme, the beneficial effects of the utility model are: by using the feed port to introduce the pearl cotton raw material into the interior of the molding upper groove, by using the ejecting cylinder to eject the pearl cotton inside the molding cavity, by using the pearl cotton cooling cavity to quickly freeze the pearl cotton, by using the semiconductor refrigeration sheet to provide a cooling effect to the interior of the pearl cotton cooling cavity, and by using the heat exhaust fan to discharge the heat from the heat release end of the semiconductor refrigeration sheet. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.
[0018] Figure 1 This is a schematic diagram of the front side top view of a freezing device capable of rapid cooling and forming according to the utility model;
[0019] Figure 2 This is a schematic diagram of the front side structure of a rapid cooling and molding freezing device of the utility model;
[0020] Figure 3 It is a schematic diagram of the top view of the structure of a semiconductor refrigeration sheet in a refrigeration device capable of rapid cooling and forming according to the utility model;
[0021] Figure 4 It is a left oblique structural schematic diagram of a heat exhaust fan in a refrigeration device capable of rapid cooling and molding according to the utility model;
[0022] In the figure: 100-top plate, 110-feed port, 120-fixing bolt, 130-cover plate, 140-base plate, 150-wire, 160-connector, 170-top cylinder, 180-base, 190-molding cavity, 200-semiconductor cooling sheet, 210-silicone film, 220-temperature conduction block, 230-ventilation groove, 240-fixed shell, 250-side shell, 260-heat exhaust fan. DETAILED DESCRIPTION
[0023] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0024] See also Figure 1-Figure 4A freezing device capable of rapid cooling and forming, comprising: a top plate 100, a feed port 110 and a heat exhaust fan 260, wherein the feed port 110 is provided on the left side of the upper end of the top plate 100, and a plurality of fixing bolts 120 are provided inside the upper end of the top plate 100;
[0025] A cover plate 130 is provided at the lower end of the top plate 100, a seat plate 140 is provided at the lower end of the cover plate 130, a molding cavity 190 is provided inside the seat plate 140, a semiconductor cooling sheet 200 is provided inside the molding cavity 190, two groups of wires 150 are provided on the right side of the semiconductor cooling sheet 200, and a group of connectors 160 is provided on the right side of each group of wires 150;
[0026] The top plate 100 is connected and fixed to the cover plate 130 and the seat plate 140 by a plurality of sets of fixing bolts 120. The cover plate 130 is a hollow structure. A molding upper groove is provided inside the cover plate 130. The interior of the molding upper groove is interconnected with the interior of the feed port 110. The pearl cotton raw material can be introduced into the interior of the molding upper groove through the feed port 110.
[0027] A silicone film 210 is provided at the upper end of the semiconductor refrigeration plate 200, and a ejection cylinder 170 is provided at the middle position of the lower end of the seat plate 140. There are two groups of ejection cylinders 170, which are respectively arranged on the left and right sides of the semiconductor refrigeration plate 200. By using the ejection cylinders 170, the pearl cotton inside the molding cavity 190 can be ejected.
[0028] The inner cross-sectional length and width of the upper molding groove are respectively the same as the cross-sectional length and width of the molding cavity 190. The upper molding groove and the molding cavity 190 constitute an EPE cooling cavity, through which the EPE can be rapidly frozen.
[0029] The semiconductor cooling plate 200 is located in the middle of the lower end of the EPE cooling chamber. The semiconductor cooling plate 200 and the two sets of wires 150 and the connector 160 are all integrated. The connector 160 is used to connect to an external power module.
[0030] The upper end of the semiconductor refrigeration plate 200 is a cooling end, and the lower end is a heat release end. The lower end of the heat release end is connected and fixed to the temperature conduction block 220. The temperature conduction block 220 is made of an aluminum alloy material and can provide a cooling effect to the inside of the pearl cotton cooling cavity by using the semiconductor refrigeration plate 200.
[0031] See also Figure 1-Figure 4As the first embodiment of the utility model: In order to solve the problem that the cooling speed of pearl cotton molding is slow, the molecular chains inside the material will have more time to be disordered in the process of movement, resulting in the decrease of the mechanical properties of the material, firstly, the staff introduces the pearl cotton raw material into the molding upper groove through the feed port 110. Since the length and width of the cross section of the molding upper groove are respectively the same as the length and width of the cross section of the molding cavity 190, the molding upper groove and the molding cavity 190 constitute the pearl cotton cooling cavity. After the pearl cotton raw material enters the molding cavity 190, the molding process can be started and wait. To be cooled, the semiconductor refrigeration sheet 200 is located in the middle position of the lower end of the pearl cotton cooling chamber. The semiconductor refrigeration sheet 200 and the two sets of wires 150 and the connector 160 are all integrated structures. The connector 160 is used to connect to an external power module. After the staff energizes the semiconductor refrigeration sheet 200, the refrigeration end of the semiconductor refrigeration sheet 200 will quickly cool down and freeze-form the pearl cotton raw material inside the molding cavity 190. After the molding is completed, the staff removes the cover plate 130 and the top plate 100, and uses the ejection cylinder 170 to take out the molded pearl cotton.
[0032] A heat exhaust fan 260 is provided on the left side of the temperature conducting block 220 , and an air hole is provided inside the left side of the temperature conducting block 220 . A plurality of air vents 230 are provided inside the temperature conducting block 220 , and the interiors of the plurality of air vents 230 are interconnected with the interiors of the heat exhaust fan 260 .
[0033] The interior of the heat release end of the semiconductor refrigeration plate 200 is interconnected with the interior of the air permeable groove 230. A group of side shells 250 are provided on the upper and lower sides of the temperature conduction block 220. The two groups of side shells 250 are respectively connected and fixed to the upper and lower ends of the heat exhaust fan 260 by bolts. The heat release end of the semiconductor refrigeration plate 200 can be discharged through the heat exhaust fan 260.
[0034] See also Figure 1-Figure 4 , as the second embodiment of the utility model: based on the description in the above embodiments, further, when the semiconductor refrigeration sheet 200 cools the interior of the molding cavity 190, its heat release end releases heat at the same time. Since the interior of the heat release end of the semiconductor refrigeration sheet 200 is interconnected with the interior of the air permeable groove 230, and the interior of several groups of air permeable grooves 230 is interconnected with the interior of the heat exhaust fan 260, the heat at the heat release end of the semiconductor refrigeration sheet 200 can be quickly discharged by starting the heat exhaust fan 260, so as to ensure the cooling effect of the semiconductor refrigeration sheet 200 and extend its service life.
[0035] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.
Claims
1. A freezing device capable of rapid cooling and forming, comprising: A top plate (100), a feed port (110) and a heat exhaust fan (260), characterized in that: a feed port (110) is provided on the left side of the upper end of the top plate (100), and a plurality of sets of fixing bolts (120) are provided inside the upper end of the top plate (100); A cover plate (130) is provided at the lower end of the top plate (100), a seat plate (140) is provided at the lower end of the cover plate (130), a molding cavity (190) is provided inside the seat plate (140), a semiconductor cooling plate (200) is provided inside the molding cavity (190), two groups of wires (150) are provided on the right side of the semiconductor cooling plate (200), and a group of connectors (160) is provided on the right side of each group of wires (150); A silicone film (210) is provided at the upper end of the semiconductor cooling sheet (200), and a top-loading cylinder (170) is provided at the middle position of the lower end of the seat plate (140). Two groups of top-loading cylinders (170) are provided and are respectively arranged on the left and right sides of the semiconductor cooling sheet (200).
2. A freezing device capable of rapid cooling and forming according to claim 1, characterized in that: The top plate (100), the cover plate (130) and the seat plate (140) are connected and fixed by a plurality of groups of fixing bolts (120); the cover plate (130) is a hollow structure; a molded upper groove is provided inside the cover plate (130); the interior of the molded upper groove is communicated with the interior of the feed port (110).
3. A freezing device capable of rapid cooling and forming according to claim 2, characterized in that: The internal cross-sectional length and width of the upper molding groove are respectively the same as the cross-sectional length and width of the molding cavity (190), and the upper molding groove and the molding cavity (190) constitute an EPE cooling cavity.
4. A freezing device capable of rapid cooling and forming according to claim 1, characterized in that: The semiconductor cooling plate (200) is located in the middle of the lower end of the EPE cooling chamber. The semiconductor cooling plate (200) and the two groups of wires (150) and the connector (160) are all integrated structures. The connector (160) is used to connect to an external power module.
5. A freezing device capable of rapid cooling and forming according to claim 4, characterized in that: The upper end of the semiconductor refrigeration plate (200) is a cooling end, and the lower end is a heat release end. The lower end of the heat release end is connected and fixed to a temperature conduction block (220). The temperature conduction block (220) is made of an aluminum alloy material.
6. A freezing device capable of rapid cooling and forming according to claim 5, characterized in that: A heat exhaust fan (260) is provided on the left side of the temperature conducting block (220), and an air vent is provided inside the left side of the temperature conducting block (220). A plurality of groups of air vent grooves (230) are provided inside the temperature conducting block (220), and the interior of the plurality of groups of air vent grooves (230) is interconnected with the interior of the heat exhaust fan (260).
7. A freezing device capable of rapid cooling and forming according to claim 5, characterized in that: The interior of the heat release end of the semiconductor refrigeration plate (200) is interconnected with the interior of the air permeable groove (230), and a group of side shells (250) are provided on both upper and lower sides of the temperature conduction block (220). The two groups of side shells (250) are respectively connected and fixed to the upper and lower ends of the heat exhaust fan (260) by bolts.