Electronic equipment irradiation shielding device suitable for neutron spectrometer device

Abstract

The utility model relates to the field of radiation shielding of electronic equipment of a neutron spectrometer device, in particular to an electronic equipment radiation shielding device which can effectively reduce the influence of neutrons and other radiation on the electronic equipment and is suitable for the neutron spectrometer device. The electronic equipment irradiation shielding device is integrally in a three-dimensional case shape, an outer frame of the case is made of boron-containing aluminum materials, a front panel of the case is provided with holes according to specifications of circuit board cards and positions of connectors, guide rails fixed on a left side plate and a right side plate are arranged on two sides of the case, and the circuit board is mounted on the case in a bilateral symmetry structure. The plugging direction of the circuit board is transverse, the front panel is provided with a plugging assisting design, and the circuit board adopts a panel installation and tray installation mode; the neutron irradiation shielding device is simple in structure and easy to implement, the shielding effect is verified by installing and using the neutron irradiation shielding device on the spectrometer, multiple experiments prove that the neutron irradiation shielding device can effectively shield the influence caused by neutron irradiation on electronic equipment, and the stability and reliability of the neutron spectrometer are improved.

Description

Technical Field

[0001] The invention relates to the field of radiation shielding of electronic equipment of a neutron spectrometer device, and in particular to a radiation shielding device for electronic equipment of a neutron spectrometer device, which can effectively reduce the influence of neutrons and other radiations on the electronic equipment and is suitable for the neutron spectrometer device. Background Art

[0002] With the construction of the cooperative spectrometer and the second-phase spectrometer of the China Spallation Neutron Source, the readout system structure used in the first phase could not cooperate well with users to carry out neutron scattering experiments in view of the data flow transmission characteristics and user needs of neutron scattering experiments. Therefore, in the construction of the cooperative spectrometer and the second-phase spectrometer, the readout system structure was upgraded, and the new generation of readout electronics system realized comprehensive data pre-processing functions. The readout electronics with FPGA as the core were upgraded to a SoC (System on Chip) platform that has the advantages of both FPGA and AMR. In terms of the selection of core components, in order to match the increased data processing complexity brought about by the power upgrade of the neutron source accelerator, the electronics system was upgraded from the Virtex-5 platform used in the first phase to Kintex-7, ZYNQ-7000, and even Zynq TM UltraScale+ TM MPSoC and other series of chips are used to process massive amounts of multi-channel data more efficiently and in real time.

[0003] With the upgrade of chips, the process size has gradually dropped from 65nm to 28nm, and even to 16nm. As one of the core parts of the neutron spectrometer, the working state of the electronic equipment is directly related to the efficiency and ability of obtaining scientific data in the neutron scattering experiment. Especially with the upgrade of core devices such as FPGA chips, the process size is getting smaller and smaller, and the electronic system is becoming more and more sensitive to the neutron radiation effect. The stability and reliability of the electronic system caused by neutron irradiation are receiving more and more attention in the neutron spectrometer.

[0004] More specifically, the new generation of electronic systems has introduced SoC technology, and the system complexity has further increased, tending more towards modern complex electronic information systems. In particular, the ARM part in SoCFPGA is more difficult to achieve radiation hardening and is more affected by neutron irradiation. In order to ensure the stable and reliable operation of electronic equipment in the neutron spectrometer device, this technical solution will be based on the large device of the spallation neutron source. By analyzing and merging the abnormal working conditions of electronic equipment in the neutron irradiation environment, a radiation shielding device suitable for electronic equipment in the neutron spectrometer device is designed. Summary of the invention

[0005] Based on the above needs, the present invention tests and classifies the abnormal working conditions of electronic equipment in a neutron irradiation environment. In order to solve the problem, an electronic shielding device suitable for a neutron spectrometer is designed, and the device is installed and used on the spectrometer to verify the effect of the shielding device. The device adopts absorbable shielding materials and a simple and easy-to-implement structure, which can effectively shield the electronic equipment from the impact of neutron radiation and improve the stability and reliability of the neutron spectrometer.

[0006] The technical solution adopted by the present invention for the unresolved technical problem is: an electronic equipment radiation shielding device suitable for a neutron spectrometer device, the electronic equipment radiation shielding device includes an outer frame and panels installed on the outer frame, and the overall shape is a three-dimensional chassis, and the circuit board, connector and connector are installed on the chassis; the chassis outer frame is made of boron-containing aluminum material, the chassis front panel is opened according to the specifications of the circuit board and the position of the connector, and the chassis is arranged into two left-right symmetrical installation cavities, and the left and right sides of the left and right inner cavities are respectively provided with left-right symmetrical guide rails fixed on the left and right side panels, the circuit board is installed on the chassis through the guide rails with a left-right symmetrical structure, the plug-in and unplug direction of the circuit board is horizontal, the front panel is provided with an auxiliary pull-out design, and the circuit board is panel mounted and tray mounted.

[0007] The circuit board is a SoC module circuit board.

[0008] The circuit boards described require independent plugging and unplugging.

[0009] The connector adopts a panel type wiring method.

[0010] The chassis is provided with fans and heat dissipation ducts on the left and right side panels and the rear side panel according to the heat dissipation requirements of the circuit board.

[0011] The guide rails are single guide rails, with a total of 10 groups, which are respectively arranged in the left and right cavities of the chassis, 5 groups on each side, and each group has two corresponding left and right positions.

[0012] The outer frame of the front panel of the chassis is provided with left and right handles.

[0013] The SoC module circuit board is disassembled and assembled by horizontal plugging and unplugging.

[0014] The left and right inner cavities of the chassis are respectively installed with corresponding circuit boards, and the front panels of the left and right circuit boards are consistent in size except that the PCB fixing block mounting holes and the terminal openings differ by 3mm in the horizontal direction.

[0015] Each panel is a single-layer boron-containing aluminum plate or a multi-layer plate, and the multi-layer plate includes an outer shielding layer, an intermediate shielding layer and an inner shielding layer. The outer shielding layer is made of high-density material, the intermediate shielding layer is made of low-radioactive material, and the inner shielding layer is made of conductive material.

[0016] The beneficial effects of the present invention are as follows: the present invention has a simple structure and is easy to implement. It only needs to install the electronic components in the neutron spectrometer inside to effectively reduce the impact of neutrons and other radiation on electronic equipment. More specifically, the present invention verifies the shielding effect by installing it on the spectrometer. After many experiments, it has been proved that it can effectively shield the impact of neutron radiation on electronic equipment, thereby improving the stability and reliability of the neutron spectrometer. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the structure of the shielding device of the present invention when it is fully loaded with circuit boards or plug-ins.

[0018] Figure 2 It is a schematic diagram of the structure of the shielding device of the present invention when part of the shielding device is loaded with a circuit board or a plug-in.

[0019] Figure 3 It is a schematic structural diagram of the shielding device of the present invention from another viewing angle.

[0020] Figure 4 It is the SoC module circuit board structure.

[0021] Description of the accompanying drawings: 1-shielding device, 2-outer frame, 3-right side panel, 4-rear side panel, 5-front panel, 6-circuit board, 7-guide rail, 8-fan and heat dissipation duct, 9-handle. DETAILED DESCRIPTION

[0022] The specific implementation of the present invention will be described in detail below with reference to the accompanying drawings:

[0023] like Figure 1-4 As shown, the SoC module circuit board is used as a specific embodiment to verify the radiation shielding capability of the present invention.

[0024] An electronic device radiation shielding device suitable for a neutron spectrometer device is based on a shielding experiment of a SoC module circuit board in an irradiation environment. First, when the shielding device in this embodiment is not loaded, the SoC module circuit board is tested in an actual working environment, that is, under neutron irradiation. The SoC module circuit board is directly irradiated at the beam outlet to determine which type of device on the board is most affected by the irradiation effect on the function of the entire board. The specific test experimental conditions and results are as follows:

[0025] As shown in Table 1:

[0026] Test conditions Test Results Turn off the chopper and beam outlet Directly irradiate the ZYNQ chip for 10 minutes The circuit board crashes quickly Turn on the chopper and beam outlet Directly irradiate the ZYNQ chip for 10 minutes The circuit board crashes quickly Turn on the chopper and beam outlet Directly irradiate the DDR3 chip for 10 minutes The circuit board is working properly Turn on the chopper and emit beam Directly irradiate the PHY chip for 10 minutes The circuit board is working properly

[0027] Table 1

[0028] By using the straight-through beam test, the beam outlet is unobstructed and directly irradiated to the chip on the SoC module circuit board. Figure 2As shown in Table 1, the comparative experiments show that one is to turn off the chopper and the other is to turn on the chopper. Both experiments irradiate the ZYNQ chip. It can be seen that even without fast neutrons and gamma rays, the irradiation effect of thermal neutrons on the circuit board is also very large. Considering that the electronic equipment in the neutron spectrometer is mainly exposed to scattered thermal neutrons, the above experiments all turn on the chopper to cut off the fast neutrons and gamma rays, so as to better evaluate the risks that the electronic equipment may face in actual use.

[0029] From Table 1, we can see that after the SoC module circuit board is irradiated by neutrons, the device that has the greatest impact on the function of the entire board is ZYNQ-7000. The phenomenon is that the embedded system running on the circuit board directly freezes, and the circuit board can only resume normal data transmission by restarting the power supply.

[0030] The above experiment uses neutrons from the beam outlet to directly irradiate the SoC module circuit board. In fact, the circuit board on the neutron spectrometer device is not used in this way. The experimental conditions are set in this way to quickly locate which device has the greatest impact on the entire board due to neutron irradiation.

[0031] The next set of experiments also takes the SoC module circuit board as an example. Lead bricks and polyethylene are added to the beam outlet to break up the neutrons and scatter them. Then the circuit board is placed naked next to the beam outlet. The specific test experimental conditions and results are shown in Table 2:

[0032] Test conditions Abnormal working state Occurrence The PS side console of the SoC module stops printing information and data upload is interrupted 5 The PS side console of the SoC module prints buserror 1 SoC module PS end embedded Linux freezes 2 SoC module PS side console print pointer read and write error 1

[0033] Table 2

[0034] Table 2 summarizes the problems that occur in a single SoC module circuit board within a day. It can be seen that neutron irradiation seriously affects the working state of the circuit board. In particular, the neutron spectrometer device often installs and uses hundreds of circuit boards, and the probability of abnormal working state is greatly increased. Therefore, electronic shielding devices suitable for neutron spectrometer devices are increasingly needed. Based on the actual working environment requirements and experimental results, this technical solution provides an electronic equipment irradiation shielding device suitable for neutron spectrometer devices, such as Figure 1-3 As shown, the radiation shielding device for electronic equipment includes an outer frame and panels installed on the outer frame, and the whole is in the shape of a three-dimensional chassis, and the circuit board, connector and connector are installed on the chassis; the chassis outer frame is made of boron-containing aluminum material, and the front panel of the chassis is opened according to the specifications of the circuit board and the position of the connector. The chassis is arranged into two left-right symmetrical installation cavities, and the left and right sides of the left and right inner cavities are respectively provided with left-right symmetrical guide rails fixed on the left and right side panels. The circuit board adopts a left-right symmetrical structure and is installed on the chassis through the guide rails. The plug-in and unplug direction of the circuit board is horizontal, and the front panel is provided with an auxiliary pull-out design. The circuit board adopts panel mounting and tray mounting methods.

[0035] The circuit board described is a SoC module circuit board. The SoC module circuit board is installed on the chassis with a left-right symmetrical structure. The guide rail described in the machine is a single guide rail, with a total of 10 groups, which are respectively arranged in the left and right cavities of the chassis, 5 groups on each side, and each group is two corresponding to the left and right positions, which are used for pushing and pushing out when installing circuit boards or other plug-ins. Each guide rail is fixed to the left and right side panels by 3 M3 screws. Since the front panel of the SoC module circuit board is placed on the frame and is flush with the bottom plate, the frame must be flat, so countersunk screws are used to install the double guide rails. The vertical width of the frame is 6mm. Considering the head diameter of the countersunk screw and the stability of the guide rail installation, M3 countersunk screws are used; the corresponding circuit boards are installed in the left and right inner cavities of the chassis respectively. The front panels of the left and right circuit boards are consistent in size except that the PCB fixing block mounting holes and terminal openings differ by 3mm in the horizontal direction. In view of the heat dissipation, installation and equipment connection methods of the current SOC module circuit board and T0 circuit board, an installation scheme suitable for the currently used SOC circuit board and T0 circuit board is designed and developed; the plug-in and unplugging direction of the SOC module circuit board is horizontal, the front panel has an auxiliary pull-out design, the SOC module circuit board is panel-mounted and tray-mounted, the SOC module circuit board requires independent plug-in and unplugging, and the connectors adopt a panel-type wiring method; fans and heat dissipation ducts are planned according to the heat dissipation requirements of the circuit board; in this embodiment, each panel is a single-layer boron-containing aluminum plate or a multi-layer plate, the multi-layer plate includes an outer shielding layer, an intermediate shielding layer and an inner shielding layer, the outer shielding layer is composed of a high-density material, the intermediate shielding layer is composed of a low-radioactive material, and the inner shielding layer is composed of a conductive material.

[0036] In the present invention, in order to deal with the radiation hazards faced by the circuit board when used naked in the neutron spectrometer device, a special shielding device is designed, such as Figure 1-3 As shown, considering the thermal neutrons and 10 The reaction cross section of B is much higher than that of other nuclides, so the outer frame of the shielding device is made of boron-containing aluminum material, which plays the role of circuit board radiation shielding by absorbing scattered neutrons. In addition to playing the role of neutron radiation shielding, the shielding device also provides functions such as centralized installation, heat dissipation, and power supply for multiple circuit boards. In this embodiment, the overall size of the shielding device is 500mm*350mm*500mm, and the circuit board adopts a horizontal plug-in method. In the design of the front panel, in order to ensure the shielding effect of the entire device, the front panel is opened according to the board specifications and connector positions, such as Figure 4 shown.

[0037] In actual use, the shielding device of the present invention is loaded with the required SoC module circuit board and other electronic plug-ins and then installed on the neutron spectrometer for verification. More specifically, the required circuit boards, plug-ins or connectors are installed in the inner cavity of the chassis through the holes opened in the front panel of the chassis before being used. In the experiment, a total of 77 SoC module circuit boards were installed and used on the imaging spectrometer. Before the shielding device was installed, the abnormal working conditions summarized in the above table would randomly occur three times every two days, seriously affecting the operation of the spectrometer. After the shielding device was installed, the probability of the abnormal working condition was greatly reduced. In more than three months, only one abnormal working condition occurred.

[0038] Experiments have shown that the present invention has a simple structure and is easy to implement. It only needs to install the electronic components in the neutron spectrometer inside to effectively reduce the impact of neutrons and other radiation on electronic equipment. More specifically, the present invention verifies the shielding effect by installing it on the spectrometer. After many experiments, it has been proved that it can effectively shield the impact of neutron radiation on electronic equipment, thereby improving the stability and reliability of the neutron spectrometer.

[0039] The above is a preferred specific embodiment of the present invention, but it is not the only specific embodiment of the present invention. Any modification, equivalent substitution and improvement made by any technician familiar with the field within the technical scope disclosed by the present invention in combination with the existing technology or public common sense within the spirit and principle of the present invention should be covered by the protection scope of the present invention.

Claims

1. An electronic equipment radiation shielding device suitable for a neutron spectrometer device, characterized in that: The electronic equipment radiation shielding device comprises an outer frame and panels mounted on the outer frame, and the whole is in the shape of a three-dimensional chassis, and the circuit board, connector and connector are mounted on the chassis; The outer frame of the chassis is made of boron-containing aluminum. The front panel of the chassis is opened according to the specifications of the circuit board and the position of the connector. The chassis is arranged into two left-right symmetrical installation cavities. The left and right sides of the left and right inner cavities are respectively provided with left-right symmetrical guide rails fixed on the left and right side panels. The circuit board adopts a left-right symmetrical structure and is installed on the chassis through the guide rails. The plug-in and unplug direction of the circuit board is horizontal. The front panel is provided with an auxiliary pull-out design, and the circuit board is panel-mounted and tray-mounted.

2. The radiation shielding device for electronic equipment suitable for a neutron spectrometer device according to claim 1, characterized in that: The circuit board is a SoC module circuit board.

3. The radiation shielding device for electronic equipment suitable for a neutron spectrometer device according to claim 1, characterized in that: The circuit boards described require independent plugging and unplugging.

4. The radiation shielding device for electronic equipment suitable for a neutron spectrometer device according to claim 1, characterized in that: The connector adopts a panel type wiring method.

5. The radiation shielding device for electronic equipment suitable for a neutron spectrometer device according to claim 1, characterized in that: The chassis is provided with fans and heat dissipation ducts on the left and right side panels and the rear side panel according to the heat dissipation requirements of the circuit board.

6. The radiation shielding device for electronic equipment suitable for a neutron spectrometer device according to claim 1, characterized in that: The guide rails are single guide rails, with a total of 10 groups, which are respectively arranged in the left and right cavities of the chassis, 5 groups on each side, and each group has two corresponding left and right positions.

7. The radiation shielding device for electronic equipment suitable for a neutron spectrometer device according to claim 1, characterized in that: The outer frame of the front panel of the chassis is provided with left and right handles.

8. The radiation shielding device for electronic equipment suitable for a neutron spectrometer device according to claim 2, characterized in that: The SoC module circuit board is disassembled and assembled by horizontal plugging and unplugging.

9. The radiation shielding device for electronic equipment suitable for a neutron spectrometer device according to claim 1 or 2, characterized in that: The left and right inner cavities of the chassis are respectively installed with corresponding circuit boards, and the front panels of the left and right circuit boards are consistent in size except that the PCB fixing block mounting holes and the terminal openings differ by 3mm in the horizontal direction.

10. The radiation shielding device for electronic equipment suitable for a neutron spectrometer device according to claim 1, characterized in that: Each panel is a single-layer boron-containing aluminum plate or a multi-layer plate, and the multi-layer plate includes an outer shielding layer, an intermediate shielding layer and an inner shielding layer. The outer shielding layer is made of high-density material, the intermediate shielding layer is made of low-radioactive material, and the inner shielding layer is made of conductive material.

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