Novel power module and motor controller
By integrated the heat dissipation module in the power module of the new energy vehicle motor controller, the cooling fluid is used for multi -facet dissipation, which solves the problem of poor insulation and heat dissipation capacity of the bus, improves reliability and power density, and reduces manufacturing costs.
Patent Information
- Application Number
- CN202420177338.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-01-24
- Publication Date
- 2025-01-28
- Estimated Expiration
- 2034-01-24
AI Technical Summary
The poor heat dissipation capacity of busbar capacitors in existing new energy vehicle motor controllers leads to the need to increase the capacitance value and volume, affecting reliability and power density, and increasing manufacturing costs.
Design a new type of power module, integrates the heat dissipation module, and the bus electricity capacity is placed in the capacity department of the heat dissipation module. The heat dissipation flow tract and the transitional runner are set on different side.
Through multi -faceted heat dissipation, the heat dissipation capacity of the bus capacitor is improved, the capacity and volume of the capacity are reduced, the reliability and power density of the motor controller is improved, and the manufacturing cost is reduced.
Smart Images
Figure CN222421651U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of new energy vehicles, and in particular to a novel power module and a motor controller. Background Art
[0002] The bus capacitors in the motor controller of new energy vehicles are usually used to smooth the bus voltage, weaken the bus peak voltage, absorb the bus high pulse current, reduce inductance, etc.
[0003] In the prior art, in order to ensure that the bus capacitor of the new energy motor controller operates at a suitable temperature, indirect heat dissipation or natural heat dissipation is often adopted. In addition, in order to increase the heat dissipation area of the bus capacitor, it is also necessary to increase the capacitance and volume of the bus capacitor, which is not conducive to improving the reliability and power density of the motor controller and increases the manufacturing cost of new energy vehicles.
[0004] Based on this, a new technical solution is needed. Utility Model Content
[0005] In view of this, the embodiments of the present invention provide a novel power module and a motor controller to at least solve the problem of poor heat dissipation of the existing bus capacitor.
[0006] The utility model embodiment provides the following technical solutions:
[0007] The utility model embodiment provides a novel power module, comprising a power module, the novel power module further comprising an integrated heat dissipation capacitor, the integrated heat dissipation capacitor is placed on one side of the power module and connected to the power module;
[0008] The integrated heat dissipation capacitor comprises:
[0009] A bus capacitor connected to the power module;
[0010] A heat dissipation module, the heat dissipation module is sleeved on the outside of the bus capacitor, the heat dissipation module comprises a housing, a heat dissipation channel is arranged on a side of the housing close to the power module, and a transition channel connected to the heat dissipation channel is arranged on a side of the housing;
[0011] The heat dissipation channel and the transition channel are located at different sides of the accommodation portion, and the heat dissipation channel and the transition channel are used to accommodate cooling liquid to dissipate heat for the bus capacitor.
[0012] Furthermore, the accommodation portion includes:
[0013] A heat dissipation cavity, which is arranged on a side of the accommodation portion close to the power module and is communicated with the transition flow channel and is used to accommodate the coolant;
[0014] A cover plate is covered on the accommodating portion and cooperates with the heat dissipation cavity to form the heat dissipation channel.
[0015] Furthermore, the heat dissipation cavities are multiple and spaced apart, so as to cooperate with the cover plate to form multiple heat dissipation channels.
[0016] Furthermore, the transition channel is a grid-type structure and is connected to the coolant inlet and the coolant outlet.
[0017] Furthermore, the heat dissipation module is made of one or more materials including metal materials or plastics.
[0018] Furthermore, the heat dissipation module further includes:
[0019] A laminated busbar, wherein the laminated busbar is connected to the bus capacitor via an input port, and the laminated busbar is connected to the power module via an output port.
[0020] Furthermore, the connection method between the laminated busbar and the power module includes at least one of bolt connection, resistance welding, and laser welding.
[0021] Furthermore, the power module comprises:
[0022] A circuit board, wherein the circuit board is arranged on a side of the heat dissipation module;
[0023] A power semiconductor device is arranged on the circuit board and connected to the bus capacitor through the laminated busbar.
[0024] Furthermore, the power semiconductor device is at least one of a direct liquid-cooled three-phase module, a direct liquid-cooled half-bridge module, an indirect liquid-cooled three-phase module, and an indirect liquid-cooled half-bridge module.
[0025] The utility model provides a motor controller, comprising:
[0026] A novel power module as described in any one of the above;
[0027] Wherein, the transition flow channel of the novel power module is respectively connected to the coolant inlet and the coolant outlet of the motor controller;
[0028] The bus capacitor of the novel power module is connected to the DC copper bus of the motor controller via a laminated busbar.
[0029] Compared with the prior art, the at least one technical solution adopted in the embodiment of the utility model can achieve the following beneficial effects:
[0030] The utility model discloses a novel power module, which dissipates heat from multiple sides of the bus capacitor by arranging the bus capacitor in a housing portion of the heat dissipation module, dissipating heat channels and transition channels on different sides of the housing portion, and dissipating coolant in the heat channels and transition channels, thereby solving the problem of poor heat dissipation capacity of the existing bus capacitor. BRIEF DESCRIPTION OF THE DRAWINGS
[0031] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.
[0032] Figure 1 This is a schematic diagram of the structure of a new type of power module according to an embodiment of the utility model;
[0033] Figure 2 A schematic diagram of a power module and an integrated heat dissipation capacitor according to an embodiment of the utility model;
[0034] Figure 3 This is a schematic diagram of the structure of an integrated heat dissipation capacitor according to an embodiment of the utility model;
[0035] Figure 4 An exploded diagram of an integrated heat dissipation capacitor according to an embodiment of the utility model;
[0036] Figure 5 It is a side view of an integrated heat dissipation capacitor according to an embodiment of the utility model.
[0037] The accompanying drawings of the present utility model are as follows:
[0038] 10. Power module; 11. Circuit board; 12. Power semiconductor device;
[0039] 20. Integrated heat dissipation capacitor; 21. Busbar capacitor; 22. Heat dissipation module; 221. Accommodation portion; 2211. Heat dissipation cavity; 2212. Cover plate; 222. Heat dissipation channel; 223. Transition channel; 23. Laminated busbar. DETAILED DESCRIPTION
[0040] The embodiments of the present application are described in detail below with reference to the accompanying drawings.
[0041] The following describes the implementation methods of the present application through specific examples, and those skilled in the art can easily understand other advantages and effects of the present application from the contents disclosed in this specification. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. The present application can also be implemented or applied through other different specific implementation methods, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present application. It should be noted that, in the absence of conflict, the following embodiments and the features in the embodiments can be combined with each other. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without making creative work belong to the scope of protection of the present application.
[0042] It should be noted that various aspects of the embodiments within the scope of the appended claims are described below. It should be apparent that the aspects described herein can be embodied in a wide variety of forms, and any specific structure and / or function described herein is merely illustrative. Based on the present application, it should be understood by those skilled in the art that an aspect described herein can be implemented independently of any other aspect, and two or more of these aspects can be combined in various ways. For example, any number and aspect described herein can be used to implement the device and / or practice the method. In addition, other structures and / or functionalities other than one or more of the aspects described herein can be used to implement this device and / or practice this method.
[0043] It should also be noted that the illustrations provided in the following embodiments are only schematic illustrations of the basic concept of the present application. The drawings only show components related to the present application rather than being drawn according to the number, shape and size of components in actual implementation. In actual implementation, the type, quantity and proportion of each component may be changed arbitrarily, and the component layout may also be more complicated.
[0044] Additionally, in the following description, specific details are provided to facilitate a thorough understanding of the examples. However, it will be understood by those skilled in the art that the examples can be practiced without these specific details.
[0045] In the prior art, indirect heat dissipation is often used to ensure that the bus capacitor 21 operates at a suitable temperature, and the capacity and volume of the bus capacitor 21 need to be increased, which is not conducive to improving the reliability of the bus capacitor 21 and the power density of the motor controller.
[0046] Based on this, the present invention proposes a processing solution: Figures 1-2As shown, by arranging the bus capacitor 21 in the accommodating portion 221 of the heat dissipation module 22, and arranging heat dissipation channels 222 and transition channels 223 on different sides of the accommodating portion 221, and arranging coolant in the heat dissipation channels 222 and the transition channels 223, the bus capacitor 21 can be cooled from multiple sides by the coolant in the heat dissipation channels 222 and the transition channels 223, thereby ensuring that the bus capacitor 21 works at a suitable temperature, solving the problem that the existing indirect heat dissipation leads to the need for the capacity and volume of the bus capacitor 21, which is not conducive to improving the reliability of the bus capacitor 21 and the power density of the motor controller.
[0047] The technical solutions provided by various embodiments of the present application are described below in conjunction with the accompanying drawings.
[0048] Example 1
[0049] like Figure 1 As shown, a new type of power module according to an embodiment of the utility model includes a power module 10 and an integrated heat dissipation capacitor 20 . The integrated heat dissipation capacitor 20 is placed on one side of the power module 10 and connected to the power module 10 .
[0050] like Figure 2 As shown, the power module 10 includes a circuit board 11 and a power semiconductor device 12 . The circuit board 11 is arranged on the side of the integrated heat dissipation capacitor 20 ; the power semiconductor device 12 is arranged on the circuit board 11 and connected to the integrated heat dissipation capacitor 20 .
[0051] The connection relationship between the circuit board 11 and the power semiconductor device 12 is the same as that in the prior art, and will not be described in detail here.
[0052] like Figures 3 to 5 As shown, the integrated heat dissipation capacitor 20 includes a bus capacitor 21 and a heat dissipation module 22. The bus capacitor 21 is connected to the power module 10; the heat dissipation module 22 is sleeved on the outside of the bus capacitor 21, and the heat dissipation module 22 is used to dissipate heat from the bus capacitor 21.
[0053] The bus capacitor 21 is sleeved inside the heat dissipation module 22 , so that the heat dissipation module 22 can absorb the heat generated by the bus capacitor 21 , thereby maintaining the heat dissipation module 22 to work at a suitable temperature.
[0054] Specifically, the heat dissipation module 22 includes a housing portion 221, a heat dissipation channel 222 is provided on a side of the housing portion 221 close to the power module 10, and a transition channel 223 connected to the heat dissipation channel 222 is provided on the side of the housing portion 221; wherein the heat dissipation channel 222 and the transition channel 223 are located on different sides of the housing portion 221, and the heat dissipation channel 222 and the transition channel 223 are used to accommodate coolant to dissipate heat from the bus capacitor 21.
[0055] The cooling liquid is used to absorb the heat generated by the bus capacitor 21 through the accommodating portion 221 to maintain the bus capacitor 21 at a suitable temperature.
[0056] In some of the embodiments, the heat dissipation channel 222 is connected to an external coolant inlet and a coolant outlet through the transition channel 223 , so that the coolant flows in the heat dissipation channel 222 and the transition channel 223 .
[0057] Among them, by arranging a heat dissipation channel 222 on a side of the accommodating portion 221 close to the power module 10, the heat dissipation channel 222 is close to the power module 10 to dissipate heat for the power module 10, that is, the coolant in the heat dissipation channel 222 can dissipate heat for the power module 10 and the bus capacitor 21 at the same time, so as to control the overall temperature rise of the new power module.
[0058] In some embodiments, the accommodating portion 221 includes a heat dissipation cavity 2211 and a cover plate 2212. The heat dissipation cavity 2211 is disposed on a side of the accommodating portion 221 close to the power module 10 and communicates with the transition channel 223 for containing the coolant; the cover plate 2212 covers the accommodating portion 221 and cooperates with the heat dissipation cavity 2211 to form the heat dissipation channel 222.
[0059] The heat dissipation cavity 2211 is opened on the side wall of the accommodation portion 221 .
[0060] The cover plate 2212 is connected to the accommodating portion 221 and seals the heat dissipation cavity 2211 , so that the heat dissipation cavity 2211 cooperates with the cover plate 2212 to form a heat dissipation channel 222 , allowing the coolant to flow in the heat dissipation channel 222 .
[0061] Furthermore, there are multiple heat dissipation cavities 2211 arranged at intervals, so as to cooperate with the cover plate 2212 to form multiple heat dissipation channels 222 .
[0062] By providing a plurality of heat dissipation chambers 2211 , the flow rate of the cooling liquid and the heat dissipation area can be increased, thereby improving the heat dissipation capacity of the heat dissipation module 22 .
[0063] Preferably, there are two heat dissipation cavities 2211 , which are arranged opposite to each other.
[0064] In some of the embodiments, the heat dissipation cavity 2211 extends from one end of the accommodating portion 221 to the other end of the accommodating portion 221 and is communicated with the transition flow channel 223 .
[0065] In some of the embodiments, the transition channel 223 is a grid-type structure and is connected to the coolant inlet and the coolant outlet.
[0066] The transition channel 223 is connected to the heat dissipation channel 222 , so that the coolant input from the transition channel 223 can enter the heat dissipation channel 222 .
[0067] Specifically, there are two transition channels 223, which are arranged on both sides of the accommodating portion 221. At the same time, the two transition channels 223 are respectively connected to the heat dissipation channel 222, wherein the transition channel 223 on one side is connected to the coolant inlet, and the transition channel 223 on the other side is connected to the coolant outlet. Therefore, after the coolant enters the transition channel 223 through the coolant inlet, the coolant can enter the heat dissipation channel 222 and enter the coolant outlet through the other transition channel 223, thereby forming a coolant circulation to dissipate the heat of the accommodating portion 221, so that the accommodating portion 221 can maintain a suitable temperature.
[0068] In some embodiments, the heat dissipation module 22 is made of one or more materials including metal materials or plastics.
[0069] Preferably, in order to increase the heat dissipation capability of the accommodation portion 221 , the accommodation portion 221 may be made of a metal material.
[0070] In some embodiments, the heat dissipation module 22 further includes a laminated busbar 23, the laminated busbar 23 is connected to the bus capacitor 21 through an input port, and the laminated busbar 23 is connected to the power module through an output port.
[0071] Among them, the laminated busbar 23 can be directly connected to the power module through the input port and the output port, thereby reducing the stray parameters of the bus capacitor 21, reducing the number of bridging copper bars and the copper bar cost, and improving the power density of the motor controller.
[0072] Furthermore, the connection method between the laminated busbar 23 and the power module includes at least one of bolt connection, resistance welding, and laser welding.
[0073] The laminated busbar 23 is connected to the power semiconductor device 12 by one or more of bolt connection, resistance welding or laser welding.
[0074] In some of the embodiments, the circuit board 11 is disposed on the side of the heat dissipation module 22 ; the power semiconductor device 12 is disposed on the circuit board 11 and connected to the bus capacitor 21 through the laminated busbar 23 .
[0075] Furthermore, the circuit board 11 may be a driving circuit board or a driving control circuit board.
[0076] The bus capacitor 21 is connected to the power semiconductor device 12 via a laminated busbar 23 .
[0077] By arranging the heat dissipation channel 222 on a side of the accommodation portion 221 close to the power module 10 , the heat dissipation channel 222 can dissipate heat for the bus capacitor 21 , the laminated busbar 23 and the power semiconductor device 12 at the same time.
[0078] Furthermore, the power semiconductor device 12 is at least one of a direct liquid-cooled three-phase module, a direct liquid-cooled half-bridge module, an indirect liquid-cooled three-phase module, and an indirect liquid-cooled half-bridge module.
[0079] The embodiment of the utility model provides heat dissipation channels 222 and transition channels 223 on different sides of the accommodation portion 221, thereby realizing multi-side cooling of the bus capacitor 21, enhancing the heat dissipation capacity of the bus capacitor 21, reducing the capacitance and volume of the bus capacitor 21, and improving the reliability and power density of the motor controller. The cost is reduced.
[0080] The new power module of the embodiment of the utility model integrates the bus capacitor 21, the laminated copper busbar and the integrated heat dissipation capacitor 20 to form an integrated heat dissipation capacitor 20, so that the overall assembly can adopt a component assembly solution, so that the integrated heat dissipation capacitor 20 and the power module 10 are pre-assembled and can be directly installed in the controller housing after the test is completed, reducing assembly materials and production manufacturing costs.
[0081] From the above content, it can be known that the new power module of the utility model can be used as an independent component for assembly, the power module 10 is installed on the integrated heat sink, the power semiconductor and the bus capacitor 21 share the heat dissipation channel 222 of the heat dissipation module 22, and after the test is completed, the power module can be directly installed in the housing of the motor controller. Therefore, the new power module of the utility model embodiment has the characteristics of high reliability, high power density, low manufacturing cost, and high compatibility and expandability.
[0082] Example 2
[0083] The present utility model embodiment also provides a motor controller, including the novel power module as described in any one of the embodiments 1;
[0084] Among them, the transition channel 223 of the new power module is connected to the coolant inlet and the coolant outlet of the motor controller respectively;
[0085] The bus capacitor 21 of the novel power module is connected to the DC copper bus of the motor controller through the laminated busbar 23.
[0086] Specifically, the heat dissipation channel 222 is respectively connected to the coolant inlet and the coolant outlet of the motor controller through the transition channels 223 on both sides.
[0087] The laminated busbar 23 and the DC copper busbar of the motor controller may be connected by one or more of bolt connection, resistance welding or laser welding.
[0088] The circuit board 11 of the novel power module can be connected to the control circuit board 11 of the motor controller through a connector.
[0089] In this specification, the same or similar parts between the various embodiments can be referred to each other, and each embodiment focuses on the differences from other embodiments. In particular, for the product embodiment described later, since it corresponds to the method, the description is relatively simple, and the relevant parts can be referred to the partial description of the system embodiment.
[0090] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any changes or substitutions that can be easily thought of by a person skilled in the art within the technical scope disclosed in the present application should be included in the protection scope of the present application. Therefore, the protection scope of the present application shall be based on the protection scope of the claims.
Claims
1. A new type of power module, comprising a power module, characterized in that: The novel power module also includes an integrated heat dissipation capacitor, which is placed on the side of the power module and connected to the power module; The integrated heat dissipation capacitor comprises: A bus capacitor connected to the power module; A heat dissipation module, the heat dissipation module is sleeved on the outside of the bus capacitor, the heat dissipation module comprises a housing, a heat dissipation channel is arranged on a side of the housing close to the power module, and a transition channel connected to the heat dissipation channel is arranged on a side of the housing; The heat dissipation channel and the transition channel are located at different sides of the accommodation portion, and the heat dissipation channel and the transition channel are used to accommodate cooling liquid to dissipate heat for the bus capacitor.
2. The novel power module according to claim 1 is characterized in that: The receiving portion comprises: A heat dissipation cavity, which is arranged on a side of the accommodation portion close to the power module and is communicated with the transition flow channel and is used to accommodate the coolant; A cover plate is covered on the accommodating portion and cooperates with the heat dissipation cavity to form the heat dissipation channel.
3. The novel power module according to claim 2 is characterized in that: The heat dissipation cavities are multiple and spaced apart, and are used to cooperate with the cover plate to form multiple heat dissipation channels.
4. The novel power module according to claim 1, characterized in that: The transition channel is a grid-type structure and is connected to a coolant inlet and a coolant outlet.
5. The novel power module according to claim 1, characterized in that: The material of the receiving portion includes one or more of metal material and plastic.
6. The novel power module according to any one of claims 1 to 5, characterized in that: The heat dissipation module also includes: A laminated busbar, wherein the laminated busbar is connected to the bus capacitor via an input port, and the laminated busbar is connected to the power module via an output port.
7. The novel power module according to claim 6, characterized in that: The connection method between the laminated busbar and the power module includes at least one of bolt connection, resistance welding and laser welding.
8. The novel power module according to claim 6, characterized in that: The power module comprises: A circuit board, wherein the circuit board is arranged on a side of the heat dissipation module; A power semiconductor device is arranged on the circuit board and connected to the bus capacitor through the laminated busbar.
9. The novel power module according to claim 8, characterized in that: The power semiconductor module is at least one of a direct liquid-cooled three-phase module, a direct liquid-cooled half-bridge module, an indirect liquid-cooled three-phase module, and an indirect liquid-cooled half-bridge module.
10. A motor controller, characterized in that: include: The novel power module as claimed in any one of claims 1 to 9; Wherein, the transition flow channel of the novel power module is respectively connected to the coolant inlet and the coolant outlet of the motor controller; The bus capacitor of the novel power module is connected to the DC copper bus of the motor controller via a laminated busbar.