Photosensitive assembly and camera module

Abstract

The utility model relates to a photosensitive component and a camera module, the camera module comprises the photosensitive component and an optical lens arranged on a photosensitive path of the photosensitive component, and the photosensitive component comprises a photosensitive circuit board, a light-transmitting glue layer and a shading glue layer. The photosensitive circuit board comprises a circuit board, a photosensitive chip mounted on the circuit board and a gold wire electrically connected with the circuit board and the photosensitive chip; the light-transmitting glue layer is cured and formed on the gold thread to wrap the gold thread; the shading glue layer is cured and formed on one side, away from the circuit board, of the light-transmitting glue layer and is used for blocking light reflected by the gold thread. In this way, gold thread collapse detection and glue layer cavity detection can be conveniently conducted through a visual optical instrument, the collapse position and the cavity position of the gold thread can be intervened and remedied in time, the product yield is increased, and the production cost is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of camera modules, in particular to a photosensitive component and a camera module. Background Art

[0002] The current camera module uses the COB process to package the photosensitive chip. When the light from the strong light source shines on the edge of the photosensitive chip, it will be reflected by the gold wire on the edge of the chip and generate stray light, which will seriously affect the accuracy of the algorithm calculation and even threaten the safety of the driver and passengers.

[0003] The existing solution is to seal the gold wire with an opaque colloid to achieve the effect of preventing stray light. However, since the gold wire is prone to collapse during the sealing process and bubbles are easily generated during the sealing process, the existing COB process also needs to be detected by precise visual optical instruments and adjusted before the colloid solidifies to achieve the purpose of improving product yield. The existing anti-stray light measures make it impossible to detect gold wire collapse and sealing voids through visual optical instruments during the sealing process, which reduces the product yield of the COB process and increases production costs. Utility Model Content

[0004] In view of the fact that the existing COB process may easily lead to a decrease in product yield in order to achieve the purpose of preventing stray light on the photosensitive chip, it is necessary to provide a photosensitive component and a camera module.

[0005] A photosensitive component, comprising:

[0006] A photosensitive circuit board, the photosensitive circuit board comprising a circuit board, a photosensitive chip mounted on the circuit board, and a gold wire electrically connected to the circuit board and the photosensitive chip;

[0007] a light-transmitting adhesive layer, the light-transmitting adhesive layer is solidified and formed on the gold wire to wrap the gold wire; and a light-shielding adhesive layer, the light-shielding adhesive layer is solidified and formed on a side of the light-transmitting adhesive layer away from the circuit board.

[0008] With such arrangement, since the adhesive layer wrapping the gold wire is light-transmissive, during the curing process of the light-transmissive adhesive layer, it is convenient to use visual optical instruments to detect gold wire collapse and adhesive layer voids, thereby enabling timely intervention and remediation of gold wire collapse and voids, thereby improving product yield and reducing production costs.

[0009] In one of the embodiments, the photosensitive component further includes a filter, and the filter cover is disposed on the photosensitive chip and bonded to the light-shielding adhesive layer.

[0010] Such a setting is beneficial to increasing the integration of the camera module and protecting the photosensitive chip.

[0011] In one embodiment, the light-transmitting adhesive layer has a supporting end protruding from the photosensitive chip in a direction perpendicular to and away from the circuit board, and the edge of the filter extends in a direction parallel to the circuit board to a side of the supporting end away from the circuit board.

[0012] Such a setting is helpful to reduce the tilt of the filter, and can also reduce the impact of dust on the outside of the filter on the photosensitive chip. At the same time, it can also reduce the risk of breakage between the photosensitive chip and the filter due to high and low temperature degradation.

[0013] In one embodiment, the filter is embedded in the light-shielding adhesive layer.

[0014] Such an arrangement increases the tightness of the connection between the filter and the light-shielding adhesive layer, and also prevents some light from entering from both sides of the filter, thereby improving the anti-stray light effect of the light-shielding adhesive layer.

[0015] In one of the embodiments, the light-shielding adhesive layer includes a first light-shielding colloid, and the first light-shielding colloid covers a side of the light-transmitting adhesive layer located between the filter and the photosensitive chip.

[0016] With such an arrangement, it is only necessary to apply a light-shielding adhesive layer on the side of the light-transmitting adhesive layer close to the photosensitive chip to prevent the main stray light reflected by the gold wire.

[0017] In one of the embodiments, the light-shielding adhesive layer further includes a second light-shielding adhesive formed integrally with the first light-shielding adhesive, and the second light-shielding adhesive covers a side of the light-transmitting adhesive layer outside the filter and the photosensitive chip.

[0018] In this configuration, the second light-shielding colloid is used to absorb the light reflected by the gold wire in a direction away from the photosensitive chip, which is beneficial to reduce the diffuse reflection of stray light in the camera module and improve the imaging quality.

[0019] In one of the embodiments, the light shielding glue layer and the photosensitive chip are arranged at intervals.

[0020] Such an arrangement avoids the contact between the light-shielding adhesive layer and the photosensitive chip, which helps to reduce the impact of the shrinkage of the colloid in the light-shielding adhesive layer during the curing process on the photosensitive chip.

[0021] In one embodiment, the light-transmitting adhesive layer is a transparent adhesive member.

[0022] Such an arrangement facilitates the detection of gold wire collapse and transparent adhesive layer voids by visual optical instruments.

[0023] In one of the embodiments, the light-shielding adhesive layer is made of black adhesive.

[0024] Such a setting is conducive to improving the absorption rate of stray light, thereby improving the imaging quality of the camera module.

[0025] In one embodiment, the light-transmitting adhesive layer and the light-shielding adhesive layer are colloids with the same expansion coefficient.

[0026] With such an arrangement, the light-transmitting adhesive layer and the light-shielding adhesive layer will not produce a deformation difference between the two adhesive layers due to different expansion coefficients, thereby increasing the stability of the connection between the filter, the light-shielding adhesive layer, the light-transmitting adhesive layer and the photosensitive chip.

[0027] The utility model also provides a camera module, comprising the above-mentioned photosensitive component and an optical lens, wherein the optical lens is arranged in the photosensitive path of the photosensitive component.

[0028] With such an arrangement, the camera module provided by the utility model can avoid stray light generated by the structure of the photosensitive component itself when a strong light source illuminates the lens, thereby improving the imaging effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 It is a schematic diagram of the structure of a COB photosensitive circuit board in the prior art;

[0030] Figure 2 It is a schematic diagram of the structure of a photosensitive component in the prior art;

[0031] Figure 3 A schematic diagram of the structure of a photosensitive component in an embodiment of the utility model;

[0032] Figure 4 for Figure 3 A partial enlarged view of the X in the middle.

[0033] Reference numerals:

[0034] 10. Photosensitive circuit board; 11. Circuit board; 12. Photosensitive chip; 13. Gold wire; 20. Light-transmitting adhesive layer; 21. Support end; 30. Light-shielding adhesive layer; 31. First light-shielding colloid; 32. Second light-shielding colloid; 40. Filter; 50. HA adhesive layer. DETAILED DESCRIPTION

[0035] In order to make the above-mentioned purposes, features and advantages of the utility model more obvious and easy to understand, the specific implementation methods of the utility model are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the utility model. However, the utility model can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the utility model, so the utility model is not limited by the specific embodiments disclosed below.

[0036] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0037] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present utility model, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0038] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0039] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0040] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used herein are for illustrative purposes only and are not intended to be the only implementation method.

[0041] With the optimization and upgrading of vehicle-mounted camera technology, the shock resistance, wear resistance, high and low temperature resistance of vehicle-mounted cameras have gradually improved, and the image quality has become clearer and clearer.

[0042] In order to control stray light caused by strong frontal light interference such as headlights, and maintain the stability of optical imaging under conditions of extreme temperatures or short-term rapid temperature changes, in addition to improving the algorithm in software, corresponding optimization and upgrades are also required in hardware.

[0043] COB (Chip On Board) is a chip direct mounting technology, which refers to the process of fixing the bare chip directly on the printed circuit board, then performing wire bonding, and then using organic glue to encapsulate and protect the chip and wires, thereby achieving electrical and mechanical connection between the chip and the circuit board electrodes.

[0044] See also Figure 1 , Figure 1 It is a structural schematic diagram of a COB photosensitive circuit board 10P in the prior art. The prior photosensitive circuit board 10P includes a circuit board 11P, a photosensitive chip 12P and a gold wire 13P. The photosensitive chip 12P is mounted on the circuit board 11P, and the two ends of the gold wire 13P are respectively bonded to the pins of the photosensitive chip 12P and the electrodes on the circuit board 11P.

[0045] When using the COB solution, if appropriate protective measures are not taken, the light from the strong light source will be reflected by the gold wire 13P when it hits the edge of the photosensitive chip 12P, generating stray light, which seriously affects the accuracy of the algorithm calculation and may even threaten the safety of the driver and passengers.

[0046] The existing solution is to use opaque colloid to seal the gold wire to achieve the effect of preventing stray light, such as Figure 2 As shown, Figure 2It is a schematic diagram of the structure of the photosensitive component in the prior art, in which the light-shielding glue layer 30P is cured and formed on the gold wire 13P to block external light from irradiating the gold wire 13P. However, since the gold wire is prone to collapse during the sealing process, and bubbles and cavities are easily generated at the gold wire during the sealing process, the existing COB process also needs to be detected by precise visual optical instruments and adjusted before the colloid is cured, so as to achieve the purpose of improving the product yield. The existing anti-stray light measures make it impossible to detect gold wire collapse and sealing cavities through visual optical instruments during the sealing process, which reduces the product yield of the COB process and increases production costs.

[0047] Based on this, it is necessary to provide a photosensitive component and a camera module that can perform gold wire collapse detection and void detection during the sealing process and can also block stray light.

[0048] See also Figure 3 , Figure 3 The schematic diagram of the structure of the photosensitive component in one embodiment of the utility model. The photosensitive component provided by the utility model also includes a light-transmitting adhesive layer 20 and a light-shielding adhesive layer 30. The light-transmitting adhesive layer 20 is solidified and formed on the gold wire 13 to wrap the gold wire 13, and the light-shielding adhesive layer 30 is solidified and formed on the side of the light-transmitting adhesive layer 20 away from the circuit board 11 and is used to block the light reflected by the gold wire 13. Since the adhesive layer wrapping the gold wire 13 is light-transmitting, during the curing process of the light-transmitting adhesive layer 20, it is convenient to use visual optical instruments to detect the collapse of the gold wire 13 and the cavity of the adhesive layer, so that timely intervention and remediation of the gold wire collapse and cavity can be carried out, thereby improving the yield of the product and reducing the production cost.

[0049] In order to increase the integration of the camera module and protect the photosensitive chip 12, the photosensitive component also includes a filter 40. For details, please refer to Figure 3 In the present invention, the filter 40 is covered on the photosensitive chip 12 and adhered to the light shielding adhesive layer 30 .

[0050] See also Figure 2 , Figure 2 Schematic diagram of the structure of the photosensitive component in the prior art. The existing filter 40P is usually directly pasted on the photosensitive chip 12P, and then the gold wire 13P is sealed with glue after being firmly pasted. One process in the traditional technology is:

[0051] S1, gold wire 13P;

[0052] S2, applying HA glue layer 50P, and curing HA glue layer 50P to adhere filter 40P;

[0053] S3, applying a FOG light shielding glue layer 30P, and curing the FOG light shielding glue layer 30P to seal the gold wire 13P.

[0054] See also Figure 2 Specifically, in step S2, after the filter 40P is placed, further pressing is usually required to ensure that the filter 40P and the photosensitive chip 12P are firmly adhered. Since there is a problem of uneven distribution of the HA glue layer 50P during the dispensing process, and the space between the filter 40P and the photosensitive chip 12P is limited, it is difficult for the HA glue layer 50P to diffuse in time when pressed, resulting in uneven force at each point of the filter 40P, thereby causing the filter 40P to tilt. It is worth noting that the HA glue layer 50P and the FOG light-shielding glue layer 30P used for chip packaging are colloids with a certain viscosity, and will not collapse due to their own gravity during the actual dispensing process.

[0055] Based on this, please refer to Figure 4 , Figure 4 for Figure 3 In the partial enlarged view at the X in the middle, in the photosensitive component provided by the utility model, the light-transmitting adhesive layer 20 has a support end 21 protruding from the photosensitive chip 12 in a direction perpendicular to and away from the circuit board 11, and the edge of the filter 40 extends in a direction parallel to the circuit board 11 to the side of the support end 21 away from the circuit board 11. Preferably, in this embodiment, the filter 40 and the photosensitive chip 12 are arranged at intervals. The specific process is as follows:

[0056] S1, gold wire 13;

[0057] S2, apply FOG light-transmitting glue and cure the glue to seal the gold wire 13;

[0058] S3, apply FOG black glue and cure the glue to stick the filter 40.

[0059] Furthermore, in step S2, the gold wire 13 collapse detection and cavity detection can be performed by visual optical instruments. If the gold wire 13 collapses or cavities are found during the detection, timely remedial measures are taken, and the glue is solidified after confirmation.

[0060] Since the light shielding adhesive layer 30 is located on the side of the light-transmitting adhesive layer 20 away from the circuit board 11, when the optical filter 40 is placed and pressed, the uncured light shielding adhesive layer 30 can be promptly diffused from the supporting end 21, thereby preventing the optical filter 40 from tilting. Furthermore, even when the optical filter 40 is tilted relative to the photosensitive chip 12, the reserved interval between the optical filter 40 and the photosensitive chip 12 facilitates adjustment.

[0061] In addition, the photosensitive component provided by the present invention has at least two advantages over the traditional technology: 1. When dust enters the camera module, the dust easily blocks the local area of ​​the photosensitive chip 12, thereby affecting the image quality. The light-transmitting adhesive layer 20 supports the light-shielding adhesive layer 30 and the filter 40, that is, the distance between the outer side of the filter 40 and the photosensitive area of ​​the photosensitive chip 12 is increased, so that the actual blocking area of ​​the dust on the photosensitive chip 12 can be reduced or even eliminated, that is, the amount of light entering the camera module is increased; 2. The filter 40, the colloid and the photosensitive chip 12 are not the same. When the ambient temperature of the photosensitive component changes greatly, the filter 40 and the photosensitive chip 12 are close to each other in the traditional technology, and are therefore prone to breakage due to inconsistent deformation differences. In the present invention, the filter 40 is far away from the photosensitive chip 12, and the filter 40 and the photosensitive chip 12 are connected by two layers of colloid. When the ambient temperature changes greatly, the colloid can absorb the deformation of the two as much as possible as a buffer zone, thereby protecting the filter 40 and the photosensitive chip 12.

[0062] Furthermore, in one embodiment of the present invention, the filter 40 is embedded in the light-shielding adhesive layer 30. Specifically, in the present invention, the two side surfaces and part of the bottom surface of the edge of the filter 40 are bonded to the light-shielding adhesive layer 30. This can not only increase the tightness of the connection between the filter 40 and the light-shielding adhesive layer 30, but also prevent part of the light from entering from both sides of the filter 40, thereby improving the anti-stray light effect of the light-shielding adhesive layer 30.

[0063] Specifically, in another embodiment provided by the utility model, the light-shielding adhesive layer 30 also includes a first light-shielding colloid 31 and a second light-shielding colloid 32 that are integrally formed. The first light-shielding colloid 31 covers the side of the light-transmitting adhesive layer 20 between the filter 40 and the photosensitive chip 12, and the second light-shielding colloid 32 covers the side of the light-transmitting adhesive layer 20 outside the filter 40 and the photosensitive chip 12. That is to say, when dispensing, the light-shielding adhesive layer 30 extends from the supporting end 21 of the light-transmitting adhesive layer 20 to both sides to form the first light-shielding colloid 31 and the second light-shielding colloid 32. The first light-shielding colloid 31 is used to absorb the light reflected by the gold wire 13 in the direction close to the photosensitive chip 12, and the second light-shielding colloid 32 is used to absorb the light reflected by the gold wire 13 in the direction away from the photosensitive chip 12, which is beneficial to reduce the diffuse reflection of stray light in the camera module and improve the imaging quality.

[0064] Optionally, in another embodiment provided by the present invention, the light-shielding adhesive layer 30 may also only include a first light-shielding colloid 31, which covers the side of the light-transmitting adhesive layer 20 located between the filter 40 and the photosensitive chip 12. In other words, it is only necessary to apply the light-shielding adhesive layer 30 on the side of the light-transmitting adhesive layer 20 close to the photosensitive chip 12 to prevent the main stray light reflected by the gold wire 13.

[0065] Optionally, in one embodiment of the present invention, the light shielding adhesive layer 30 is spaced apart from the photosensitive chip 12. It is understandable that the light shielding adhesive layer 30 extends from the supporting end 21 of the light-transmitting adhesive layer 20 along the side of the light-transmitting adhesive layer 20 close to the photosensitive adhesive layer, but maintains a certain gap with the photosensitive chip 12, that is, the light shielding adhesive layer 30 is prevented from contacting the photosensitive chip 12. Since the colloid shrinks during the curing process, if the light shielding adhesive layer 30 is bonded to the photosensitive chip 12, it is easy to form cumulative stress inside the photosensitive chip 12 during the curing process, thereby increasing the risk of chip deformation.

[0066] Optionally, in one embodiment of the utility model, the light-transmitting adhesive layer 20 is made of transparent adhesive, which facilitates the detection of gold wire 13 collapse and light-transmitting adhesive layer 20 voids by visual optical instruments, and the light-shielding adhesive layer 30 is made of black adhesive, which is beneficial to improving the absorption rate of stray light.

[0067] Specifically, in an embodiment provided by the present invention, the light-transmitting adhesive layer 20 and the light-shielding adhesive layer 30 are colloids with the same expansion coefficient, and FOG colloids are used in actual production. In this way, the light-transmitting adhesive layer 20 and the light-shielding adhesive layer 30 are made of the same material, and there will be no deformation difference between the two adhesive layers due to different expansion coefficients, thereby increasing the stability of the connection between the filter 40, the light-shielding adhesive layer 30, the light-transmitting adhesive layer 20 and the photosensitive chip 12.

[0068] The utility model also provides a camera module, including the above-mentioned photosensitive component and an optical lens, wherein the optical lens is arranged in the photosensitive path of the photosensitive component. The camera module provided by the utility model can avoid stray light generated by the structure of the photosensitive component itself when a strong light source illuminates the lens, thereby improving the imaging effect.

[0069] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0070] The above-mentioned embodiments only express several implementation methods of the utility model, and the description is relatively specific and detailed, but it cannot be understood as limiting the scope of the utility model patent. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, which all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.

Claims

1. A photosensitive component, characterized in that: include: A photosensitive circuit board, the photosensitive circuit board comprising a circuit board, a photosensitive chip mounted on the circuit board, and a gold wire electrically connected to the circuit board and the photosensitive chip; a light-transmitting adhesive layer, the light-transmitting adhesive layer being cured and formed on the gold wire to wrap the gold wire; and A light-shielding adhesive layer is solidified and formed on a side of the light-transmitting adhesive layer away from the circuit board.

2. A photosensitive component according to claim 1, characterized in that: The photosensitive component also includes a filter, which is covered on the photosensitive chip and bonded to the light-shielding adhesive layer.

3. A photosensitive component according to claim 2, characterized in that: The light-transmitting adhesive layer has a supporting end protruding from the photosensitive chip in a direction perpendicular to and away from the circuit board, and the edge of the filter extends in a direction parallel to the circuit board to a side of the supporting end away from the circuit board.

4. A photosensitive component according to claim 3, characterized in that: The filter is embedded in the light-shielding adhesive layer.

5. A photosensitive component according to claim 2, characterized in that: The light-shielding adhesive layer includes a first light-shielding colloid, and the first light-shielding colloid covers a side of the light-transmitting adhesive layer located between the filter and the photosensitive chip.

6. A photosensitive component according to claim 5, characterized in that: The light-shielding adhesive layer also includes a second light-shielding adhesive body integrally formed with the first light-shielding adhesive body, and the second light-shielding adhesive body covers a side of the light-transmitting adhesive layer outside the filter and the photosensitive chip.

7. A photosensitive component according to claim 5, characterized in that: The light shielding adhesive layer and the photosensitive chip are arranged at intervals.

8. A photosensitive component according to claim 1, characterized in that: The light-transmitting adhesive layer is made of transparent adhesive; and / or The light-shielding adhesive layer is made of black adhesive.

9. A photosensitive component according to any one of claims 1 to 8, characterized in that: The light-transmitting adhesive layer and the light-shielding adhesive layer are colloids with the same expansion coefficient.

10. A camera module, characterized in that: include: A photosensitive component as described in any one of claims 1 to 9; and An optical lens is arranged in the light-sensing path of the light-sensing component.

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