Multi-channel OTG transmission circuit applied to sound box

Abstract

The utility model discloses a multipath OTG transmission circuit applied to a sound box. Comprising OTG transmission units, a first Type-c interface and a DSP chip used for accessing a total audio signal, the number of the OTG transmission units is at least one, each OTG transmission unit comprises an OTG chip, a voltage stabilizing circuit and a second Type-c interface, the DSP chip is connected with the OTG chip and the first Type-c interface in series, the signal output end of the OTG chip is directly connected with the second Type-c interface in series, and the signal output end of the DSP chip is connected with the first Type-c interface in series. And the power supply input end of the second Type-c interface is connected with the power supply end pin of the OTG chip through the voltage stabilizing circuit so as to meet the working requirements of the OTG chip. According to the utility model, the DSP chip and the first Type-c interface are connected in series, transmission of OTG audio signals of a conventional sound box is directly satisfied, meanwhile, the OTG transmission units are adopted to form another path of OTG audio signal transmission, and according to different numbers of the OTG transmission units, two paths or more than two paths of OTG output transmission effects are formed on the whole, so that the transmission efficiency is improved. Therefore, the use convenience of the sound box is effectively improved.

Description

Technical Field

[0001] The utility model relates to the technical field of electronic circuits, in particular to a multi-channel OTG transmission circuit used in a sound box. Background Art

[0002] As we all know, OTG refers to the working principle of two USB On-The-Go technologies. OTG technology can enable smart devices to switch from slave mode, that is, smart devices can receive data as USB slave devices, and can also send data as USB host, thus realizing two-way data transmission. Two main chips form dual OTG functions to realize normal data and audio connection between two mobile phones or computers.

[0003] At present, there is generally only one OTG interface on ordinary speakers. If the user wants to use two mobile phones or computers to play on two different live broadcast platforms at the same time, one OTG cannot be used. In other words, a single speaker cannot be used for audio transmission between multiple devices. It is necessary to use two speakers to connect two systems at the same time to complete it. Therefore, it will obviously cause trouble for consumers when using it. Utility Model Content

[0004] In view of the above-mentioned deficiencies in the prior art, the purpose of the present invention is to provide a multi-channel OTG transmission circuit for use in a speaker.

[0005] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0006] A multi-channel OTG transmission circuit used in a speaker, comprising an OTG transmission unit, a first Type-c interface and a DSP chip for accessing a total audio signal, wherein the number of the OTG transmission unit is at least one, the OTG transmission unit comprises an OTG chip, a voltage stabilizing circuit and a second Type-c interface, the DSP chip is respectively connected in series with the OTG chip and the first Type-c interface, the signal output end of the OTG chip is directly connected in series with the second Type-c interface, and the power input end of the second Type-c interface is connected to the power supply end pin of the OTG chip through the voltage stabilizing circuit to meet the working requirements of the OTG chip.

[0007] Preferably, the voltage stabilizing circuit includes a positive line and a negative line for power transmission between the second Type-c interface and the OTG chip, magnetic beads are respectively arranged on the positive line and the negative line, and at least two bidirectional voltage stabilizing diodes are arranged at the positive line and the negative line where they are connected to the second Type-c interface, the positive line and the negative line are located on one side of the magnetic bead and are provided with a first capacitor, a second capacitor, and a third capacitor, the positive line and the negative line are located on the other side of the magnetic bead and are provided with a fourth capacitor, a fifth capacitor, and a sixth capacitor, and the fourth capacitor, the fifth capacitor, and the sixth capacitor are located between the bidirectional voltage stabilizing diode and the magnetic bead.

[0008] Preferably, the DSP chip is also connected to a crystal oscillator circuit.

[0009] Preferably, the DSP chip is connected to the working voltage through a voltage input circuit, and the voltage input circuit includes a first resistor, one end of the first resistor is connected to the voltage and the other end is connected to the DSP chip, and the end of the first resistor connected to the DSP chip is grounded through the seventh capacitor and the second resistor and the eighth capacitor connected in series in sequence.

[0010] Preferably, the DSP chip is a HC6288 chip.

[0011] Preferably, the OTG chip is a HC102 chip.

[0012] Due to the adoption of the above-mentioned scheme, the utility model relies on the series connection between the DSP chip and the first Type-c interface to directly meet the transmission of the OTG audio signal of the conventional speaker. At the same time, the OTG transmission unit is used to form another OTG audio signal transmission. According to the number of OTG transmission units, the whole constitutes two or more OTG output transmission functions, which will effectively improve the convenience of using the speaker. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a schematic diagram of the structural principle of an embodiment of the utility model.

[0014] Figure 2 It is a circuit structure schematic diagram of a voltage stabilizing circuit according to an embodiment of the utility model.

[0015] Figure 3 It is a circuit structure schematic diagram of a crystal oscillator circuit according to an embodiment of the utility model.

[0016] Figure 4 It is a circuit structure schematic diagram of a voltage input circuit of an embodiment of the utility model. DETAILED DESCRIPTION

[0017] In order to make the purpose, technical solution and advantages of the utility model more clear, the utility model is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the utility model and are not used to limit the utility model.

[0018] In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present utility model. In addition, the terms "first" and "second" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present utility model, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined.

[0019] In the description of the present utility model, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection. It can be a mechanical connection or an electrical connection. It can be directly connected or indirectly connected through an intermediate medium. It can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0020] like Figures 1 to 4 As shown, the present embodiment provides a multi-channel OTG transmission circuit for use on a speaker, including an OTG transmission unit 103, a first Type-c interface 102 and a DSP chip 101 for accessing a total audio signal, wherein the number of the OTG transmission unit 103 is at least one, and the OTG transmission unit 103 includes an OTG chip 104, a voltage stabilizing circuit 105 and a second Type-c interface 106, the DSP chip 101 is respectively connected in series with the OTG chip 104 and the first Type-c interface 102, the signal output end of the OTG chip 104 is directly connected in series with the second Type-c interface 106, and the power input end of the second Type-c interface 106 is connected to the power supply end pin of the OTG chip 104 through the voltage stabilizing circuit 105 to meet the working requirements of the OTG chip 104.

[0021] This embodiment mainly relies on the series connection between the DSP chip 101 and the first Type-c interface 102 to directly meet the transmission of the OTG audio signal of the conventional speaker. At the same time, the OTG transmission unit 103 is used to form another OTG audio signal transmission. According to the number of OTG transmission units 103, the whole constitutes two or more OTG output transmission functions, which will effectively improve the convenience of using the speaker.

[0022] When transmitting specific audio signals, the DSP chip 101 accesses the audio signal inside the speaker and processes it into two paths for transmission. One path is directly transmitted from the first Type-c interface 102, and the other path is transmitted to the OTG chip 104 in the OTG transmission unit 103. The OTG chip 104 processes the signal and transmits it through the second Type-c interface 106. When there is a signal input from the device connected to the second Type-c interface 106, the OTG chip 104 processes it to share the workload of the DSP chip 101, and then feeds the signal processed by the OTG chip 104 back to the DSP chip 101. Each OTG transmission unit 103 has its own OTG chip 104, so the orderly transmission of the signal can be guaranteed to avoid signal congestion.

[0023] Furthermore, the voltage stabilizing circuit 105 is used to directly draw power from the external connection device to the second Type-c interface 106 to meet the working power demand of the corresponding OTG chip 104, and the specific circuit structure of the voltage stabilizing circuit 105 specifically includes a positive line and a negative line for power transmission between the second Type-c interface 106 and the OTG chip 104, and the positive line and the negative line are respectively provided with magnetic beads FB12 and FB2, and the positive line and the negative line are in contact with the second Type-c interface 106. At least two bidirectional voltage regulator diodes D3 and D4 are arranged at the connection, the positive and negative lines are located on one side of the magnetic beads FB12 and FB2, and the first capacitor C99, the second capacitor C81, and the third capacitor C64 are arranged, and the positive and negative lines are located on the other side of the magnetic beads FB12 and FB2, and the fourth capacitor C96, the fifth capacitor C62, and the sixth capacitor C60 are arranged, and the fourth capacitor C96, the fifth capacitor C62, and the sixth capacitor C60 are located between the bidirectional voltage regulator diodes D3 and D4 and the magnetic beads FB12 and FB2. Among them, the capacitors and magnetic beads in the circuit mainly play the role of voltage stabilization, filtering, and anti-interference, while the two bidirectional voltage regulator diodes D3 and D4 play the role of safety protection when taking power from external devices.

[0024] Furthermore, the DSP chip 101 needs to provide an effective and normal clock signal when working, so the DSP chip 101 of this embodiment is also connected to a crystal oscillator circuit, such as Figure 3 shown.

[0025] Further, for the power supply of the DSP chip 101, a 3.3V power supply is required. Therefore, the DSP chip 101 of this embodiment is connected to the working voltage through a voltage input circuit. The voltage input circuit includes a first resistor R53. One end of the first resistor R53 is connected to the voltage and the other end is connected to the DSP chip 101. The end of the first resistor R53 connected to the DSP chip 101 is grounded through the seventh capacitor C37 and the second resistor R57 and the eighth capacitor C34 connected in series are grounded.

[0026] Preferably, the DSP chip 101 is a HC6288 chip. It should be noted that the HC6288 is a high-performance 32-bit RISC core with a maximum frequency of 122.88MHZ. It contains a quad-core DSP digital processor with a maximum frequency of 200MHZ, and integrates 256KBybit SDRAM and a built-in 16Mbit SDRAM for DSP delay line. There are 10 digital audio inputs, 12 digital audio outputs, and a single output OTG.

[0027] Preferably, the OTG chip 104 is a HC102 chip. It should be noted that the HC102 chip is a highly integrated, high-performance USB aduio CODEC dedicated digital OTG chip, which is optimized for USB Type-C headphones.

[0028] The above are only preferred embodiments of the present invention, and are not intended to limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made using the contents of the specification and drawings of the present invention, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A multi-channel OTG transmission circuit used in a speaker, characterized in that: It includes an OTG transmission unit, a first Type-c interface and a DSP chip for accessing a total audio signal, wherein the number of the OTG transmission unit is at least one, the OTG transmission unit includes an OTG chip, a voltage stabilizing circuit and a second Type-c interface, the DSP chip is respectively connected in series with the OTG chip and the first Type-c interface, the signal output end of the OTG chip is directly connected in series with the second Type-c interface, and the power input end of the second Type-c interface is connected to the power supply end pin of the OTG chip through the voltage stabilizing circuit to meet the working requirements of the OTG chip.

2. A multi-channel OTG transmission circuit used in a speaker as claimed in claim 1, characterized in that: The voltage stabilizing circuit includes a positive line and a negative line for power transmission between the second Type-c interface and the OTG chip, magnetic beads are respectively arranged on the positive line and the negative line, and at least two bidirectional voltage stabilizing diodes are arranged at the positive line and the negative line where they are connected to the second Type-c interface, the positive line and the negative line are located on one side of the magnetic bead and are provided with a first capacitor, a second capacitor, and a third capacitor, the positive line and the negative line are located on the other side of the magnetic bead and are provided with a fourth capacitor, a fifth capacitor, and a sixth capacitor, and the fourth capacitor, the fifth capacitor, and the sixth capacitor are located between the bidirectional voltage stabilizing diode and the magnetic bead.

3. A multi-channel OTG transmission circuit for use in a speaker as claimed in claim 1, characterized in that: The DSP chip is also connected to a crystal oscillator circuit.

4. A multi-channel OTG transmission circuit for use in a speaker as claimed in claim 1, characterized in that: The DSP chip is connected to the working voltage through a voltage input circuit, and the voltage input circuit includes a first resistor, one end of the first resistor is connected to the voltage and the other end is connected to the DSP chip, and the end of the first resistor connected to the DSP chip is grounded through the seventh capacitor and the second resistor and the eighth capacitor connected in series in sequence.

5. The multi-channel OTG transmission circuit used in a speaker as claimed in claim 1, characterized in that: The DSP chip is a HC6288 chip.

6. A multi-channel OTG transmission circuit for use in a speaker as claimed in claim 1, characterized in that: The OTG chip is a HC102 chip.

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