Microcircuit module multilayer structure

Abstract

The utility model provides a microcircuit module multilayer structure, the structure comprises a metal shell, a first substrate, a connecting assembly and a second substrate, the first substrate is connected with the metal shell, and the first substrate is connected with the second substrate through the connecting assembly. According to the utility model, the spring needles and the nail head leads are adopted, and the flexibility of the spring needles is utilized to buffer the stress of thermal expansion and cold contraction of the colloid in the microcircuit module, thereby preventing the nail head leads from being pulled away from the aluminum substrate and the DBC substrate due to thermal expansion and cold contraction, and realizing the connection between the PCB substrate and the power board of the microcircuit module with a multi-layer structure. The problems that in a traditional connection mode of a multi-layer board and a power board, two board layers are directly connected through a nail head lead, stress limitation is caused, colloid cannot be completely poured into a module, a high heat dissipation effect cannot be achieved, and then high power density is limited are solved, effective connection of the PCB and the power board is achieved, and the service life of the power board is prolonged. And the reliability of the connection of the microcircuit module multilayer board is improved.

Description

Technical Field

[0001] The present application relates to the technical field of microcircuit module multilayer board connection, and in particular to a microcircuit module multilayer structure. Background Art

[0002] With the rapid development of high power density technology, high power and miniaturization of microcircuit modules have become the main trend, which puts higher and higher requirements on the volume and heat dissipation capacity of microcircuit modules. Under the condition of requiring good thermal conductivity, most of them use aluminum substrates or copper-clad substrates (DBC) such as silicon nitride as the carrier of the power device circuit. Since aluminum substrates and DBC substrates cannot realize multi-layer layout and wiring, PCB substrates are used as signal control boards to realize multi-layer layout and wiring. However, the connection between the PCB board and the DBC substrate has become a problem. The internal colloid often expands during temperature cycle, impact and other tests, resulting in thermal expansion and mechanical stress, which causes the connection mode to fall off or poor contact, resulting in reduced reliability of high power density multi-layer structure microcircuit modules.

[0003] There are two ways to connect traditional PCB boards to aluminum substrates (or DBC substrates). One is to use nail head leads to directly connect the two board layers. Due to stress limitations, the inside of the module cannot be fully filled with colloid, and the heat dissipation effect cannot be high, which in turn limits the high power density. The other connection method is to use insulated wires to connect the two layers. Although this connection method can avoid stress limitations, it is complicated to operate and requires a large space, so it is impossible to reduce the size of the module and the mass production cycle is long. Utility Model Content

[0004] In order to solve the above problems, the present application proposes a multi-layer structure of a microcircuit module. The utility model adopts a connection method of nail head leads in combination with spring pins, which solves the problem of poor contact or falling off due to thermal expansion and contraction of the hard connection between the multi-layer board and the power board, and the problem that the multi-layer structure of the high power density module cannot be completely filled with colloid. The effective connection between the PCB board and the power board is realized, and the reliability of the connection of the multi-layer board of the microcircuit module is improved.

[0005] This application is implemented through the following technical solutions:

[0006] The present application proposes a multi-layer structure of a microcircuit module, comprising:

[0007] Metal housing;

[0008] a first substrate;

[0009] Connect components;

[0010] a second substrate;

[0011] The first substrate is connected to the metal housing, and the first substrate is connected to the second substrate through the connecting component.

[0012] Furthermore, the first substrate is a power board.

[0013] Furthermore, the first substrate is an aluminum substrate or a DBC substrate.

[0014] Furthermore, the first substrate is welded inside the metal shell.

[0015] Furthermore, the connecting component includes a nail head lead and a spring pin, one end of the nail head lead is connected to the first substrate, one end of the spring pin is sleeved on the nail head lead and connected to the nail head lead, and the other end of the spring pin is connected to the second substrate.

[0016] Furthermore, the nail head lead includes a base and a fixing rod, one end of the fixing rod is connected to the base, the spring needle is sleeved on the fixing rod, and one end of the spring needle sleeved on the fixing rod is connected to the base.

[0017] Furthermore, the spring pin is connected to the base by welding.

[0018] Furthermore, the end of the spring pin connected to the second substrate is in a gradually decreasing cone shape.

[0019] Furthermore, the second substrate is a multilayer board.

[0020] Furthermore, the second substrate is a PCB substrate.

[0021] Beneficial effects of the present application: The present invention adopts spring pins and nail head leads, and utilizes the elasticity of the spring pins to buffer the stress of thermal expansion and contraction of the colloid inside the microcircuit module, so as to prevent the nail head leads from being pulled off the aluminum substrate and DBC substrate due to thermal expansion and contraction, thereby realizing the connection between the PCB substrate and the power board of the multi-layer structure microcircuit module. The present invention solves the problem that in the traditional connection method between the PCB board and the aluminum substrate (or DBC substrate), the nail head leads are used to directly connect the two board layers, and due to stress limitations, the colloid cannot be fully perfused inside the module, and the heat dissipation effect cannot be high, which leads to the problem of limited high power density, and the use of insulating wires to connect the two layers, which has the problems of complex operation, large space required, and thus the inability to reduce the size of the module, and the long mass production cycle, and realizes the effective connection between the PCB board and the power board, and improves the reliability of the connection of the multi-layer board of the microcircuit module. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0023] Figure 2 It is a structural schematic diagram of the nail head lead of the utility model.

[0024] The descriptions of the reference numerals in the figures are as follows:

[0025] 1. Metal shell; 2. First substrate; 3. Second substrate; 4. Pin lead; 5. Spring pin; 6. Base; 7. Fixing rod. DETAILED DESCRIPTION

[0026] The technical solutions in the embodiments of the present application will be described clearly and completely below in conjunction with the drawings in the embodiments of the present application, wherein the same or similar reference numerals throughout represent the same or similar elements or elements with the same or similar functions. Obviously, the described embodiments are only a part of the embodiments of the utility model, not all of them. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0027] It should be noted that all directional indications in the embodiments of the present application (such as up, down, left, right, front, back, etc.) are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0028] In addition, the descriptions of "first", "second", etc. in this application are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the technical solutions between the various embodiments can be combined with each other, but they must be based on the ability of ordinary technicians in this field to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by this utility model.

[0029] Please refer to Figure 1-2 The present application proposes a multi-layer structure of a microcircuit module, comprising a metal shell 1, a first substrate 2, a connecting component and a second substrate 3. The first substrate 2 is connected to the metal shell 1, and the first substrate 2 is connected to the second substrate 3 through the connecting component. The elasticity of the connecting component is utilized to buffer the stress of thermal expansion and contraction of the colloid inside the microcircuit module, and to prevent the connecting component from being pulled off the first substrate due to thermal expansion and contraction, so as to realize the connection between the PCB substrate of the microcircuit module with a multi-layer structure and the power board.

[0030] Specifically, in order to improve the heat dissipation characteristics of the structure, in the present embodiment, the shell is made of metal material, and the metal is a metal that is easily thermally conductive. By welding the first substrate 2 to the metal shell 1 and utilizing the thermal conductivity of the metal shell 1, rapid heat dissipation of the first substrate 2 is achieved, thereby reducing the influence of thermal expansion and contraction on the first substrate 2.

[0031] Specifically, in order to realize the assembly of the microcircuit structure and to achieve high power and miniaturization of the microcircuit module, in the present embodiment, the first substrate 2 is a power board, and the first substrate 2 is an aluminum substrate or a DBC substrate, and the aluminum substrate or the DBC substrate is directly welded to the metal shell 1 to realize the rapid transfer of heat generated by the power heating device to the shell.

[0032] Specifically, in order to realize the connection between the first substrate 2 and the second substrate 3, form a microcircuit module, and realize the high power and miniaturization of the microcircuit module, in this embodiment, the first substrate 2 is connected to the second substrate 3 through a connecting assembly, wherein the connecting assembly includes a nail head lead 4 and a spring pin 5, the nail head lead 4 includes a base 6 and a fixing rod 7, one end of the fixing rod 7 is connected to the base 6, and the end of the base 6 away from the fixing rod 7 is welded on the first substrate 2, one end of the spring pin 5 is sleeved on the fixing rod 7, and the end of the spring pin 5 sleeved on the fixing rod 7 is welded on the base 6, and the end of the spring pin 5 away from the fixing rod 7 is connected to the second substrate 3. Specifically, the second substrate 3 is a multilayer board, and in this embodiment, the second substrate 3 is a PCB board, a through hole is provided on the second substrate 3, and the end of the spring pin 5 away from the fixing rod 7 passes through the through hole and extends to the upper side of the second substrate 3, and the end of the spring pin 5 passing through the through hole is connected to the second substrate 3 by welding. Among them, the end of the end of the spring pin 5 connected to the second substrate 3 is a tapered shape that gradually becomes smaller. The spring pin 5 is tapered at one end of the PCB board to prevent solder from filling up the middle part of the spring pin.

[0033] The utility model adopts spring pins 5 and nail head leads 4 to form a connection component between the first substrate 2 and the second substrate 3, and utilizes the elasticity of the spring pins 5 to buffer the stress of thermal expansion and contraction of the colloid inside the microcircuit module, so as to prevent the nail head leads 4 from being pulled off the aluminum substrate or DBC substrate due to thermal expansion and contraction, thereby realizing the connection between the PCB substrate of the multi-layer structure microcircuit module and the power board. The utility model solves the problem that in the traditional connection method between the PCB board and the aluminum substrate (or DBC substrate), the nail head leads 4 are used to directly connect the two board layers, and due to stress restrictions, the colloid cannot be fully perfused inside the module, and the heat dissipation effect cannot be high, which leads to the problem of limited high power density, and the use of insulating wires to connect two layers, which has the problems of complex operation, large required space, and thus cannot reduce the module volume, and long mass production cycle.

[0034] Of course, the present application may have many other implementations. Based on the present implementation, other implementations obtained by ordinary technicians in this field without any creative work are all within the scope of protection of the present application.

Claims

1. A multilayer structure of a microcircuit module, characterized in that: include: Metal housing; a first substrate; Connect components; a second substrate; The first substrate is connected to the metal housing, and the first substrate is connected to the second substrate via the connecting component; The connection assembly includes a nail head lead and a spring pin, one end of the nail head lead is connected to the first substrate, one end of the spring pin is sleeved on the nail head lead and connected to the nail head lead, and the other end of the spring pin is connected to the second substrate.

2. The multilayer structure of the microcircuit module according to claim 1, characterized in that: The first substrate is a power board.

3. The multilayer structure of microcircuit module according to claim 2, characterized in that: The first substrate is an aluminum substrate or a DBC substrate.

4. The multilayer structure of the microcircuit module according to claim 1, characterized in that: The first substrate is welded in the metal shell.

5. The multi-layer structure of microcircuit module according to claim 1, characterized in that: The nail head lead comprises a base and a fixing rod, one end of the fixing rod is connected to the base, the spring needle sleeve is arranged on the fixing rod, and one end of the spring needle sleeve arranged on the fixing rod is connected to the base.

6. The multi-layer structure of microcircuit module according to claim 5, characterized in that: The spring pin is connected to the base by welding.

7. The multi-layer structure of microcircuit module according to claim 1, characterized in that: The end of the spring pin connected to the second substrate is in a tapered shape that gradually becomes smaller.

8. The multi-layer structure of microcircuit module according to claim 1, characterized in that: The second substrate is a multi-layer board.

9. The multi-layer structure of microcircuit module according to claim 8, characterized in that: The second substrate is a PCB substrate.

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