Heat dissipation structure of communication gateway

Abstract

The utility model discloses a heat dissipation structure of a communication gateway, and relates to the technical field of communication gateways. The gateway comprises a gateway main body, a base, a temperature sensor, a top shell and a storage frame, the top shell is provided with a heat dissipation mechanism, the heat dissipation mechanism comprises heat dissipation holes, a front refrigeration plate and a side refrigeration plate, the gateway is provided with the temperature sensor, the heat dissipation holes, the front refrigeration plate, the side refrigeration plate and heat dissipation fins, and when the ambient temperature is low, the heat dissipation mechanism can be used for heat dissipation. When the heat dissipation requirement of the gateway main body can be met through the heat dissipation holes, the front refrigeration plate and the side refrigeration plate do not need to be started, after the temperature sensor monitors that the temperature reaches a set value, the refrigeration plate and the side refrigeration plate are started again, the working heat of the gateway main body is absorbed through the Peltier effect, and the heat of the high-temperature face of the refrigeration plate is dissipated through the heat dissipation fins in an auxiliary mode. And compared with heat dissipation by only enhancing air convection, the heat dissipation effect is enhanced by utilizing a heat absorption mode to dissipate heat.

Description

Technical Field

[0001] The utility model relates to the technical field of communication gateways, in particular to a heat dissipation structure of a communication gateway. Background Art

[0002] A communication gateway is also known as an internetwork connector or protocol converter. It realizes network interconnection above the network layer. It is a complex network interconnection device and is only used for interconnection between two networks with different high-level protocols. It can be used for both wide area network interconnection and local area network interconnection. A communication gateway is a computer system or device that performs the important task of conversion and is used between two systems with different communication protocols, data formats or languages, or even completely different architectures. A communication gateway is a translator. Unlike a bridge that simply conveys information, a communication gateway must repackage the received information to meet the needs of the destination system. During the use of the communication gateway, a certain amount of heat will be generated. In order to avoid the influence of heat on the work of the communication gateway, a heat dissipation structure of the communication gateway is required.

[0003] The heat dissipation structure of the existing communication gateway only cools down through heat dissipation holes in cooperation with the heat dissipation fan. The cooling method of the heat dissipation fan only uses forced convection of air to dissipate the heat generated during the use of the communication gateway. Its heat dissipation efficiency needs to be further improved. Utility Model Content

[0004] Based on this, the purpose of the utility model is to provide a heat dissipation structure of a communication gateway to solve the technical problem that the heat dissipation efficiency of the existing heat dissipation structure of the communication gateway needs to be further improved.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a heat dissipation structure of a communication gateway, comprising a gateway body, a base, a temperature sensor, a top shell and a storage frame, the top shell is provided with a heat dissipation mechanism, the heat dissipation mechanism comprises heat dissipation holes, a front cooling plate and a side cooling plate, the outer sides of the front cooling plate and the side cooling plate are provided with heat dissipation fins, a top screen is provided on the top of the top shell, side screens are provided on both sides of the top shell, a front screen is provided on the front side of the top shell, a rear card slot, a front card slot and a side card slot are provided on the base, a front card strip and a side card strip are provided on the bottom of the top shell, and a rear card strip is provided on the rear side of the top shell.

[0006] By adopting the above technical solution, when the temperature monitored by the temperature sensor has not reached the set value, the heat dissipation holes are used to dissipate the heat generated when the gateway body is working, so as to achieve the purpose of cooling. When the temperature monitored by the temperature sensor reaches the set value, the front cooling plate and the side cooling plate begin to absorb heat to cool down the inside of the gateway body.

[0007] Furthermore, the front cooling plate and the side cooling plates are both composed of a plurality of thermoelectric semiconductor cooling components.

[0008] By adopting the above technical solution, the front cooling plate and the side cooling plate do not need additional refrigerant when cooling, and cooling can be achieved by only using the Peltier effect. They can work continuously and have no pollution source.

[0009] Furthermore, the heat dissipation fins are provided in a plurality of groups, each group of the heat dissipation fins is provided with a plurality of heat dissipation fins, the plurality of heat dissipation fins are evenly and equidistantly distributed, and the heat dissipation fins are made of aluminum alloy.

[0010] By adopting the above technical solution, when the front cooling plate and the side cooling plate are cooling, the inner side absorbs heat and the outer side needs to release heat. Multiple sets of heat dissipation fins can assist the outer sides of the front cooling plate and the side cooling plate to release heat.

[0011] Furthermore, the meshes of the top screen, the side screen and the front screen are all relatively fine.

[0012] By adopting the above technical solution, the top screen, the side screen and the front screen adopt a fine mesh structure, so that most of the impurities in the air are intercepted.

[0013] Furthermore, the heat dissipation hole is opened on the top of the top shell, and a plurality of the heat dissipation holes are opened, and the plurality of heat dissipation holes are evenly and equidistantly distributed, and the size of the heat dissipation holes is relatively large.

[0014] By adopting the above technical solution, when the gateway body generates heat due to normal operation, the temperature near the gateway body rises, the hot air density is small, and it will rise to the top. The location of the heat dissipation holes can ensure that the rising hot air can exchange heat with the external cold air as soon as possible to cool down.

[0015] Furthermore, the rear card strip is engaged and slidably moved with the rear card slot, the front card strip is engaged with the front card slot, and the side card strip is engaged with the side card slot.

[0016] By adopting the above technical solution, the installation and disassembly process of the base and the top shell is made simpler and faster, so that the gateway body can be taken out more quickly when it needs to be repaired.

[0017] Furthermore, support seats are provided on both sides of the bottom of the base, wing plates are provided on both sides of the top of the top shell, a spring is provided in the middle of the bottom of the base, a lifting column is provided inside the spring, and a movable plate is provided at the bottom of the spring.

[0018] By adopting the above technical solution, the setting of the support seat can provide good support for the gateway body and the outer shell structure composed of the base and the top shell. The setting of the wing plate makes it convenient to apply force to the top shell through the wing plate when separating the base and the top shell.

[0019] Furthermore, the storage frame is arranged in a U-shaped structure, and the gateway body is engaged with the storage frame.

[0020] By adopting the above technical solution, the connection method between the gateway body and the storage frame makes it easier for the gateway body to be fixed on the base through the storage frame.

[0021] Furthermore, the movable plate and the base are both fixedly connected to the spring, the movable plate is fixedly connected to the lifting column, the lifting column is abutted against the gateway body, and the lifting column is slidably connected to the base.

[0022] By adopting the above technical solution, when the movable plate is lifted, the jacking column fixed on the top thereof moves upward, exerting an upward thrust on the abutting gateway body, thereby facilitating the release of the engagement connection between the gateway body and the storage frame.

[0023] Furthermore, the jacking columns are provided in two groups, and the two groups of jacking columns are symmetrically arranged.

[0024] By adopting the above technical solution, two sets of lifting columns can apply thrust from both sides of the bottom of the gateway body at the same time. Applying force at two positions at the same time has a better lifting effect on the bottom of the gateway body.

[0025] In summary, the utility model mainly has the following beneficial effects:

[0026] 1. The utility model sets a temperature sensor, a heat dissipation hole, a front cooling plate, a side cooling plate and a heat dissipation fin. When the ambient temperature is low and the heat dissipation demand of the gateway body can be met by using the heat dissipation hole, there is no need to start the front cooling plate and the side cooling plate. When the temperature sensor detects that the temperature reaches the set value, the cooling plate and the side cooling plate are started, and the Peltier effect is used to absorb the working heat of the gateway body. The heat of the high-temperature surface of the cooling plate is assisted by the heat dissipation fins. The heat is dissipated by absorbing heat. Compared with only enhancing air convection to dissipate heat, the heat dissipation effect is enhanced.

[0027] 2. The utility model provides a wing plate, a movable plate, a lifting column and a spring. The wing plate is provided so that when the base and the top shell are separated, it is convenient to apply force to the top shell through the wing plate to release the engagement or engagement sliding effect between the slots and the card strips. The movable plate, the lifting column and the spring are provided so that when the gateway body is removed from the base, it is convenient to apply force to the bottom of the gateway body to separate it from the storage frame. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 It is a three-dimensional structural schematic diagram of the utility model;

[0029] Figure 2 It is a rear-view stereoscopic structural schematic diagram of the utility model;

[0030] Figure 3 For this utility model Figure 1 The enlarged structural diagram at A in the middle;

[0031] Figure 4 For this utility model Figure 2 Schematic diagram of the enlarged structure at point B.

[0032] In the figure: 1. Gateway body; 2. Base; 3. Temperature sensor; 4. Top shell; 5. Heat dissipation mechanism; 501. Heat dissipation holes; 502. Top screen; 503. Side screen; 504. Front screen; 505. Front cooling plate; 506. Side cooling plate; 507. Heat dissipation fins; 6. Rear card slot; 7. Rear card strip; 8. Front card strip; 9. Front card slot; 10. Side card strip; 11. Side card slot; 12. Support seat; 13. Storage frame; 14. Wing plate; 15. Moving plate; 16. Lifting column; 17. Spring. DETAILED DESCRIPTION

[0033] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. The embodiments described below with reference to the drawings are exemplary and are only used to explain the utility model, and cannot be understood as limiting the utility model.

[0034] The following describes an embodiment of the utility model based on its overall structure.

[0035] Embodiment 1:

[0036] A heat dissipation structure of a communication gateway, such as Figure 1-Figure 4As shown, it includes a gateway body 1, a base 2, a temperature sensor 3, a top shell 4 and a storage frame 13. The top shell 4 is provided with a heat dissipation mechanism 5, and the heat dissipation mechanism 5 includes a heat dissipation hole 501, a front cooling plate 505 and a side cooling plate 506. The outer sides of the front cooling plate 505 and the side cooling plate 506 are provided with heat dissipation fins 507. The top of the top shell 4 is provided with a top screen 502, the two sides of the top shell 4 are provided with side screens 503, and the front side of the top shell 4 is provided with a front screen 504. The base 2 is provided with a rear card slot 6, a front card slot 9 and a side card slot 11. The bottom of the top shell 4 is provided with a front card strip 8 and a side card strip 10. The rear side of the top shell 4 is provided with a rear card strip 7. When the temperature monitored by the temperature sensor 3 has not reached the set value, the heat dissipation hole 501 is used to dissipate the heat generated by the gateway body 1 during operation to achieve the purpose of cooling. When the temperature monitored by the temperature sensor 3 reaches the set value, the front cooling plate 505 and the side cooling plate 506 begin to absorb heat to cool the inside of the gateway body 1. Compared with the direct absorption of heat and the traditional enhanced air convection cooling, the heat dissipation effect is better. Moreover, compared with the cooling fan, the front cooling plate 505 and the side cooling plate 506 will not vibrate or make noise during operation, and the working environment is quieter. The gateway body 1 will not be adversely affected by the working vibration of the heat dissipation structure.

[0037] See also Figure 2 The front cooling plate 505 and the side cooling plate 506 are both composed of a number of thermoelectric semiconductor refrigeration components, so that the front cooling plate 505 and the side cooling plate 506 do not need additional refrigerant when cooling, and can achieve cooling only by using the Peltier effect. They can work continuously and have no pollution source. At the same time, they will not produce a rotation effect, and there is no vibration and noise during operation. In addition, the thermoelectric semiconductor refrigeration component has a very small thermal inertia and a very fast cooling time. The gateway body 1 can be cooled in a short power-on time.

[0038] See also Figure 1 , Figure 3 There are multiple groups of heat dissipation fins 507, each group of heat dissipation fins 507 is provided with multiple heat dissipation fins, and the multiple heat dissipation fins 507 are evenly and equidistantly distributed. The heat dissipation fins 507 are made of aluminum alloy. When the front cooling plate 505 and the side cooling plate 506 are cooling, the inner side absorbs heat and the outer side needs to release heat. The multiple groups of heat dissipation fins 507 can assist the outer sides of the front cooling plate 505 and the side cooling plate 506 to release heat. The multiple heat dissipation fins 507 evenly and equidistantly distributed make the outer sides of the front cooling plate 505 and the side cooling plate 506 have multiple heat dissipation surfaces, and the heat dissipation effect at each position is uniform. The heat dissipation fins 507 made of aluminum alloy make the heat dissipation fins 507 have the advantages of good thermal conductivity, strong corrosion resistance, light weight and low cost.

[0039] See also Figure 1 , Figure 2The meshes of the top screen 502, the side screen 503 and the front screen 504 are all relatively fine. The top screen 502, the side screen 503 and the front screen 504 adopt a fine mesh structure, so that most of the impurities in the air are intercepted and prevented from entering the interior of the outer shell structure formed by the base 2 and the top shell 4, and affecting the normal use of the gateway body 1 and the heat dissipation mechanism 5.

[0040] See also Figure 1 , Figure 2 , Figure 3 The heat dissipation hole 501 is opened on the top of the top shell 4. There are multiple heat dissipation holes 501, and the multiple heat dissipation holes 501 are evenly and equidistantly distributed. The size of the heat dissipation hole 501 is relatively large. When the gateway body 1 generates heat due to normal operation, the temperature near the gateway body 1 increases, and the density of the hot air is small, and it will rise to the top. The opening position of the heat dissipation hole 501 can ensure that the rising hot air exchanges heat with the external cold air as soon as possible to cool down. Multiple evenly and equidistant heat dissipation holes 501 make the heat dissipation uniform at all places on the top when only the heat dissipation holes 501 are used for heat dissipation. Compared with the traditional communication gateway, the heat dissipation outlet on the top is generally smaller. The size of the heat dissipation hole 501 is larger because the top screen 502 can intercept more impurities, and there is no need to worry about the heat dissipation hole 501 being too large to cause impurities to enter.

[0041] See also Figure 1 , Figure 2 The rear card strip 7 is engaged and slid with the rear card slot 6, the front card strip 8 is engaged with the front card slot 9, and the side card strip 10 is engaged with the side card slot 11, making the installation and removal process of the base 2 and the top shell 4 simpler and faster, and convenient for faster removal when the gateway body 1 needs maintenance. The setting of the front card strip 8 and the side card strip 10 assists the connection between the base 2 and the top shell 4, making the connection between the base 2 and the top shell 4 more stable.

[0042] Embodiment 2:

[0043] See also Figure 1 , Figure 2 , Figure 4 , support seats 12 are provided on both sides of the bottom of the base 2, wing plates 14 are provided on both sides of the top of the top shell 4, a spring 17 is provided in the middle of the bottom of the base 2, a lifting column 16 is provided inside the spring 17, and a movable plate 15 is provided at the bottom of the spring 17. The setting of the support seat 12 can provide good support for the shell structure composed of the gateway body 1 and the base 2 and the top shell 4. The setting of the wing plate 14 makes it convenient to apply force to the top shell 4 through the wing plate 14 when separating the base 2 and the top shell 4, so as to release the engagement or engagement sliding effect between the card slots and the card strips. The lifting column 16 is lifted by the movable plate 15, so that the gateway body 1 can be pushed out of the storage frame 13, which is convenient for the gateway body 1 to be separated from the storage frame 13, and will not damage the accessories connected to the gateway body 1.

[0044] See also Figure 1 The storage frame 13 is arranged in a U-shaped structure, and the gateway body 1 is engaged with the storage frame 13. The connection mode between the gateway body 1 and the storage frame 13 makes it easier for the gateway body 1 to be fixed on the base 2 through the storage frame 13, so as to avoid displacement of the gateway body 1 during use. The U-shaped structure of the storage frame 13 can limit the four sides of the gateway body 1 to prevent any form of displacement.

[0045] See also Figure 2 , Figure 4 The movable plate 15 and the base 2 are both fixedly connected with the spring 17, the movable plate 15 is fixedly connected with the lifting column 16, the lifting column 16 abuts against the gateway body 1, and the lifting column 16 is slidably connected with the base 2. When the movable plate 15 is lifted, the lifting column 16 fixed on its top moves up, exerting an upward thrust on the abutting gateway body 1, so as to facilitate the release of the engagement connection between the gateway body 1 and the storage frame 13. When the movable plate 15 moves up, it squeezes the spring 17, and the spring 17 accumulates force in the process. When the gateway body 1 is separated from the storage frame 13 and no longer exerts force on the movable plate 15, the movable plate 15 is reset under the action of the elastic restoring force of the spring 17.

[0046] See also Figure 2 There are two groups of lifting columns 16, which are symmetrically arranged. The two groups of lifting columns 16 can apply thrust from both sides of the bottom of the gateway body 1 at the same time. The simultaneous application of force at two positions has a better lifting effect on the bottom of the gateway body 1. In addition, the two groups of lifting columns 16 are symmetrically arranged, and the lifting forces on both sides of the bottom of the gateway body 1 are completely consistent, ensuring that the gateway body 1 is more smoothly separated from the storage frame 13.

[0047] The implementation principle of the utility model is as follows: first, align the gateway body 1 with the storage frame 13 and press it down to fix it, and align the rear card strip 7 with the rear card slot 6 to make the top shell 4 slide down a distance, fix the flexible connection leads of the front cooling plate 505 and the side cooling plate 506 at the corresponding positions of the gateway body 1, and continue to press the top shell 4 down until it moves down to the limit. At this time, the front card strip 8 is inserted into the front card slot 9, and the side card strip 10 is inserted into the side card slot 11. When the top shell 4 continues to move down, the flexible connection lead is appropriately bent; then, the gateway body 1 is connected to a suitable position for use. When in use, the heat generated by the gateway body 1 will cause the temperature of the internal space formed by the top shell 4 and the base 2 to rise, and the density of the hot air decreases and rises, and is discharged from the heat dissipation hole 501 at the top; thereafter, when the temperature When the temperature sensor 3 detects that the internal temperature has reached the set value, the heat dissipation holes 501 alone cannot meet the heat dissipation requirements. The front cooling plate 505 and the side cooling plate 506 are started by the controller part, and the Peltier effect is used to absorb heat and cool down. The high-temperature surfaces on the outside of the front cooling plate 505 and the side cooling plate 506 are dissipated through the heat dissipation fins 507; finally, if the gateway body 1 needs to be repaired, the wing plate 14 is pulled to press the base 2, the base 2 and the top shell 4 are separated, and the movable plate 15 is squeezed to lift the jacking column 16 and push the gateway body 1 out of the storage frame 13. In this process, the spring 17 is squeezed and contracted to accumulate force. When the gateway body 1 is moved out of the storage frame 13, the movable plate 15 is released and reset under the action of the elastic restoring force of the spring 17.

[0048] Parts not involved in the present invention are the same as the prior art or can be implemented by using the prior art, and will not be described in detail here.

[0049] Although an embodiment of the utility model has been shown and described, this specific embodiment is only an explanation of the utility model and is not a limitation of the utility model. The specific features, structures, materials or characteristics described may be combined in a suitable manner in any one or more embodiments or examples. After reading this specification, those skilled in the art may make modifications, substitutions and variations to the embodiments without creative contribution as needed without departing from the principles and purpose of the utility model. However, as long as they are within the scope of the claims of the utility model, they are protected by patent law.

Claims

1. A heat dissipation structure of a communication gateway, characterized in that: The invention comprises a gateway body (1), a base (2), a temperature sensor (3), a top shell (4) and a storage frame (13); the top shell (4) is provided with a heat dissipation mechanism (5); the heat dissipation mechanism (5) comprises a heat dissipation hole (501), a front cooling plate (505) and a side cooling plate (506); the outer sides of the front cooling plate (505) and the side cooling plate (506) are provided with heat dissipation fins (507); the top of the top shell (4) is provided with a top screen (502); the two sides of the top shell (4) are provided with side screens (503); the front side of the top shell (4) is provided with a front screen (504); the base (2) is provided with a rear card slot (6), a front card slot (9) and a side card slot (11); the bottom of the top shell (4) is provided with a front card strip (8) and a side card strip (10); the rear side of the top shell (4) is provided with a rear card strip (7).

2. The heat dissipation structure of the communication gateway according to claim 1, characterized in that: The front cooling plate (505) and the side cooling plate (506) are both composed of a plurality of thermoelectric semiconductor cooling components.

3. The heat dissipation structure of the communication gateway according to claim 1, characterized in that: The heat dissipation fins (507) are provided in multiple groups, each group of the heat dissipation fins (507) is provided with multiple heat dissipation fins (507), the multiple heat dissipation fins (507) are evenly and equidistantly distributed, and the heat dissipation fins (507) are made of aluminum alloy.

4. The heat dissipation structure of the communication gateway according to claim 1, characterized in that: The meshes of the top screen (502), the side screen (503) and the front screen (504) are all relatively fine.

5. The heat dissipation structure of the communication gateway according to claim 1, characterized in that: The heat dissipation hole (501) is opened on the top of the top shell (4), a plurality of the heat dissipation holes (501) are opened, the plurality of heat dissipation holes (501) are evenly and equidistantly distributed, and the size of the heat dissipation holes (501) is relatively large.

6. The heat dissipation structure of the communication gateway according to claim 1, characterized in that: The rear card strip (7) is engaged and slidably moved with the rear card slot (6), the front card strip (8) is engaged with the front card slot (9), and the side card strip (10) is engaged with the side card slot (11).

7. The heat dissipation structure of the communication gateway according to claim 1, characterized in that: Support seats (12) are arranged on both sides of the bottom of the base (2), wing plates (14) are arranged on both sides of the top of the top shell (4), a spring (17) is arranged in the middle of the bottom of the base (2), a lifting column (16) is arranged inside the spring (17), and a movable plate (15) is arranged at the bottom of the spring (17).

8. The heat dissipation structure of the communication gateway according to claim 1, characterized in that: The storage frame (13) is arranged in a circular structure, and the gateway body (1) is engaged with the storage frame (13).

9. The heat dissipation structure of the communication gateway according to claim 7, characterized in that: The movable plate (15) and the base (2) are both fixedly connected to the spring (17), the movable plate (15) is fixedly connected to the lifting column (16), the lifting column (16) is in contact with the gateway body (1), and the lifting column (16) is slidably connected to the base (2).

10. The heat dissipation structure of the communication gateway according to claim 7, characterized in that: The jacking columns (16) are provided in two groups, and the two groups of jacking columns (16) are symmetrically arranged.

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