Diffraction light splitting cutting device and laser cutting equipment
By introducing a diffraction spectroscopic cutting device into the laser cutting optical path, the problem of inconsistency in cracks caused by stress release during laser cutting is solved, and a more uniform and accurate cutting effect is achieved.
Patent Information
- Application Number
- CN202420281813.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-02-05
- Publication Date
- 2025-02-11
- Estimated Expiration
- 2034-02-05
AI Technical Summary
When cutting brittle materials, the existing laser cutting optical paths have uneven energy distribution and uneven material distribution, resulting in microcracks extending in the direction of the non-cutting track when stress is released, resulting in the cutting edge becoming larger or the effective lobe cannot be formed.
Design a diffraction spectroscopic cutting device, through the light source generator, diffraction spectroscopic assembly and focusing element, the collimated light beam is diffraction spectroscopic and focusing processed to form a spot that removes side lobe energy and extends in the cutting direction, ensuring that the cracks are in the direction of the cutting track extend.
The generation of cracks at the edge of the cutting path is reduced, ensuring that the cracks and the cutting path are consistent, and cutting accuracy and efficiency are improved.
Smart Images
Figure CN222448702U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of laser processing, in particular to a diffraction beam splitting cutting device and laser cutting equipment. Background Art
[0002] The laser cutting optical path refers to the path that the laser beam emitted by the laser takes after passing through a series of optical elements to reach the cutting head. The design of the optical path has an important influence on the effect of laser cutting.
[0003] Bessel beam is a kind of beam with non-diffraction and self-repairing properties. Its lateral light intensity distribution is described by Bessel function, and its focal depth is deeper than Gaussian beam. The Bessel beam generation part usually uses axicon lens or spatial light modulator to convert the collimated Gaussian beam into Bessel beam. The focusing part usually uses lens or reflector to focus the Bessel beam onto the cutting material to form a Bessel beam with long focal depth.
[0004] However, such a laser cutting optical path has its shortcomings. Due to the probability of uneven distribution of laser energy and the uneven material distribution of brittle materials, when high-energy-density laser acts on brittle materials, microcracks may be generated in the non-cutting track direction due to stress release, resulting in larger cutting edges and even failure to form effective cracks. Utility Model Content
[0005] The main purpose of the utility model is to provide a diffraction beam splitting cutting device, aiming to solve the problem that the existing laser cannot ensure that the stress line crack extends along the cutting track direction.
[0006] In order to achieve the above-mentioned purpose, the utility model provides a diffraction spectroscopic cutting device, which comprises:
[0007] A light source generator, used to generate and emit a laser beam, wherein the laser beam is a collimated beam;
[0008] A diffraction and beam splitting component, facing the output end of the light source generator, and used for diffracting and beam splitting the collimated light beam;
[0009] A focusing element, facing the output end of the diffraction beam splitter component, and used for focusing the diffracted light beam;
[0010] The cutting head is arranged at the output end of the focusing element to receive the focused diffraction light beam and convert it into a cutting light beam to act on the workpiece.
[0011] In some embodiments, the diffraction beam splitting component diffracts and splits into multiple light beams.
[0012] In some embodiments, the diffraction beam splitter component includes a diffraction beam splitter, and the diffraction beam splitter is arranged at the output end of the light source generator.
[0013] In some embodiments, the focusing element is used to focus the spot of the diffracted light beam into a strip-shaped spot.
[0014] In some embodiments, the focusing element is a convex lens and a plane mirror, one end of the convex lens faces the diffraction beam splitter component, and the plane mirror is arranged at the end of the convex lens facing away from the diffraction beam splitter component.
[0015] In some embodiments, the diffraction beam splitter assembly further includes a rotating member, an execution end of which is connected to the diffraction beam splitter to drive the diffraction beam splitter to rotate.
[0016] In some embodiments, the diffraction beam splitting component includes a beam splitter, which is disposed between the diffraction beam splitting component and the light source generator, and the incident end of the beam splitter is directly opposite to the output end of the light source generator.
[0017] In some embodiments, the diffraction spectrometer component includes a diffraction grating, and the diffraction grating is arranged close to the output end of the light source generator.
[0018] The utility model further provides a laser cutting device, comprising the above-mentioned diffraction spectroscopic cutting device.
[0019] In the technical solution of this embodiment, a diffraction beam splitting component and a focusing element are arranged between the light source generator and the Bessel cutting head, and the collimated light beam generated by the light source generator is subjected to diffraction beam splitting and focusing processing, thereby forming a light spot with side lobe energy removed and extending along the cutting direction. The light spot is converted into a Bessel beam by the Bessel cutting head, and part of the energy is reserved for controlling the extension of the crack along the cutting direction. In this way, not only can the generation of cracks at the edge of the cutting path be reduced, but also the stress line cracks can be ensured to extend along the cutting track direction. BRIEF DESCRIPTION OF THE DRAWINGS
[0020] Figure 1 This is a structural diagram of a diffraction beam splitting cutting device in one embodiment of the utility model;
[0021] Figure 2 It is a structural schematic diagram of a diffraction beam splitting cutting device in another embodiment of the utility model;
[0022] Figure 3 This is a schematic diagram of the spot shape of the focused diffracted light beam in one embodiment of the utility model;
[0023] Figure 4 The figure is a schematic diagram of the spot shape of a Bessel beam in one embodiment of the utility model.
[0024] 100, light source generator; 200, focusing element; 201, convex lens; 202, plane mirror; 300, diffraction spectrometer component; 301, diffraction spectrometer; 302, rotating part; 400, Bessel cutting head.
[0025] The realization of the purpose, functional features and advantages of the utility model will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION
[0026] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the scheme in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0027] It should be noted that all directional indications in the embodiments of the present invention (such as up, down, left, right, front, back...) are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.
[0028] It should also be noted that when an element is referred to as being "fixed on" or "disposed on" another element, it may be directly on the other element or there may be an intermediate element at the same time. When an element is referred to as being "connected to" another element, it may be directly connected to the other element or there may be an intermediate element at the same time.
[0029] In addition, the descriptions of "first", "second", etc. in the present utility model are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the technical solutions between the various embodiments can be combined with each other, but they must be based on the ability of ordinary technicians in this field to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present utility model.
[0030] In conventional Bessel cutting optical paths, the energy density of the central main lobe is concentrated, which is higher than the ablation threshold of the material, while the energy density of the side lobes is dispersed, which is lower than the ablation threshold of the material. The edge of the cutting path will still be affected by the thermal stress of the side lobes, resulting in cracks on the edge of the cutting path. The cracks will extend in the vertical direction of the cutting path, resulting in increased edge collapse of the cutting material and reduced cutting accuracy.
[0031] In this regard, the utility model proposes a diffraction beam splitting cutting device, which can remove the side lobes of the light spot and make the distribution of the light spot consistent with the cutting path. In this way, not only can the generation of cracks at the edge of the cutting path be reduced, but also the direction of the cracks can be kept consistent with the cutting path.
[0032] See also Figure 1 , Figure 1 It is a structural diagram of a diffraction beam splitting cutting device in one embodiment of the utility model.
[0033] In this embodiment, the diffraction beam splitting cutting device includes:
[0034] The light source generator 100 is used to generate and emit a laser beam, and the laser beam is a collimated beam;
[0035] The diffraction and beam splitting component 300 is directly opposite to the output end of the light source generator 100 and is used to perform diffraction and beam splitting on the collimated light beam;
[0036] The focusing element 200 is directly opposite to the output end of the diffraction beam splitter component 300 and is used to focus the diffracted light beam;
[0037] The cutting head 400 is disposed at the output end of the focusing element 200 to receive the focused diffracted light beam and convert it into a cutting light beam to act on the workpiece.
[0038] In this embodiment, the light source generator 100 refers to a device that generates lasers, and the laser beam generated by the light source is used to perform thermal processing on the workpiece. The cutting light source can be divided into the following types according to different working media and excitation methods:
[0039] 1. Solid-state laser: uses solid materials (such as crystals, glass, ceramics, etc.) as working media, and uses electrical or optical excitation to generate visible or infrared lasers. Common solid-state lasers include ruby lasers, neodymium-doped yttrium aluminum garnet lasers, and neodymium glass lasers. The advantages of solid-state lasers are high peak power, small thermal effect, and high processing accuracy. They are suitable for fine micro-processing of thin, brittle materials and non-metallic materials.
[0040] 2. Gas laser: uses gas (such as carbon dioxide, helium-neon, etc.) as the working medium and uses gas discharge to generate infrared or visible light laser. Common gas lasers include carbon dioxide lasers, helium-neon lasers, etc. The advantages of gas lasers are high average power, strong thermal effect, and high cutting efficiency, which are suitable for the macro processing of metal materials.
[0041] The diffraction beam splitting component 300, as a component for diffracting a single light beam into multiple beams, can be a technology that uses a diffractive optical element (DOE) to split a light beam into multiple light beams. Each light beam diffracted by the diffractive optical element (DOE) has the characteristics of the original light beam (except for power and propagation angle). The number of light beams can be three, five, or even up to millions. The principle is to control the phase and amplitude of the light beam by depicting a specific diffraction pattern on the DOE according to the Fresnel-Kirchhoff diffraction formula, thereby achieving the separation and recombination of the light beam.
[0042] In this embodiment, the cutting head 400 is preferably a Bessel cutting head, which is an optical module for laser processing, and can generate a non-diffraction Bessel beam with a specific focal depth, and is suitable for single-mode lasers. The principle is to use the light field control and beam shaping of refractive and diffractive optical elements to convert the incident laser beam into a Bessel beam, and then focus the Bessel beam on the material surface through a focusing lens for cutting.
[0043] In the process of diffraction and splitting, a light source is required, that is, the light source generator 100 mentioned in this embodiment, which is used to generate a collimated light beam;
[0044] a diffractive optical element (DOE), which can be transmissive or reflective, to split the incident beam into multiple beams;
[0045] A focusing lens or a reflector, that is, the focusing element 200 in this embodiment, is used to focus the split light beams onto a target plane or at infinity; finally, these light beams are focused onto the object to be cut through the Bessel lens of the cutting head 400 to form a Bessel light beam extending along the cutting direction. The Bessel light beam has a high peak power density and a long focal depth, can generate cracks inside the object, and extend along the cutting direction, thereby achieving efficient and precise cutting (unlike an ordinary Bessel light beam, the Bessel light beam removes sidelobe energy, and part of the energy is used to control the extension of the cracks along the cutting direction).
[0046] In the technical solution of this embodiment, a diffraction beam splitting component 300 and a focusing element 200 are arranged between the light source generator 100 and the Bessel cutting head 400, and the collimated light beam generated by the light source generator 100 is subjected to diffraction beam splitting and focusing processing, thereby forming a light spot with side lobe energy removed and extending along the cutting direction. The light spot is converted into a Bessel beam by the Bessel cutting head 400, and part of the energy is reserved for controlling the extension of the crack along the cutting direction. In this way, not only can the generation of cracks at the edge of the cutting path be reduced, but also the direction of the crack and the cutting path can be kept consistent.
[0047] Continue reading Figure 1 In this embodiment, the diffraction beam splitting component 300 diffracts and splits into multiple beams. Figure 1 It can be seen that the diffraction beam splitting component 300 diffracts three beams, but is not limited thereto. In other embodiments, two beams, five beams, etc. can be diffracted and split. However, no matter whether two beams, three beams, five beams, etc. are diffracted, the directions of the light spots are still arranged in sequence and at intervals, which is conducive to the focusing element 200 focusing the focus of multiple beams to form a light spot that removes the side lobe energy and extends along the cutting direction.
[0048] In the embodiment of the present application, a diffraction beam splitter 301 can be used to diffract and split the collimated light beam into multiple beams. Figure 2 , Figure 2 It is a schematic structural diagram of a diffraction beam splitting cutting device in another embodiment of the utility model.
[0049] The diffraction beam splitter assembly 300 includes a diffraction beam splitter 301 , which is disposed at the output end of the light source generator 100 .
[0050] In this embodiment, a diffraction beam splitter 301 is used to split the collimated light beam generated by the light source generator 100 into multiple light beams. The principle is to use the diffraction characteristics of light waves to split a single light beam into multiple light beams. The multiple light beams can be arranged side by side into an array or matrix, and the characteristics of these light beams are the same. In this embodiment, the diffraction beam splitter 301 is used because it has the characteristics of high efficiency, convenient use, low cost, low complexity, strong adaptability, etc. compared with traditional means such as beam splitters or masks.
[0051] In this embodiment, the diffraction spot of the diffraction beam splitter 301 has the characteristic of removing sidelobe energy, which can reduce the impact of cutting to the edge during the cutting process, thereby improving the cutting quality; at the same time, since the diffraction spot of the diffraction beam splitter 301 extends along the cutting direction, the cutting depth can be increased and the cutting efficiency can be improved.
[0052] See also Figure 2 , Figure 3 and Figure 4 , Figure 2 This is a schematic structural diagram of a diffraction beam splitting cutting device in another embodiment of the utility model. Figure 3 This is a schematic diagram of the spot shape of the focused diffracted light beam in one embodiment of the utility model. Figure 4 The figure is a schematic diagram of the spot shape of a Bessel beam in one embodiment of the utility model.
[0053] In this embodiment, after the diffraction beam splitter 301 performs diffraction beam splitting on the light beam, a lens can be used to focus and shape it, thereby forming a light spot extending along the cutting direction. Therefore, a combination of a convex lens 201 and a plane mirror 202 is used in this embodiment. Specifically, the focusing element 200 is a convex lens 201 and a plane mirror 202, one end of the convex lens 201 faces the diffraction beam splitting component 300, and the plane mirror 202 is arranged at one end of the convex lens 201 facing away from the beam splitting component.
[0054] There are three basic types of convex lens 201, namely, plano-convex lens 201, bi-convex lens 201 and concave-convex lens 201. In this embodiment, plano-convex lens 201 is preferred because it is easy to use, low cost, and suitable for parallel light. Its principle is to use the refraction of the convex surface to converge the parallel light to the focus, which is suitable for holographic imaging, laser cutting, optical instruments, etc.
[0055] The combination of the plano-convex lens 201 and the plane mirror 202 can realize different optical path conversions according to different relative positions and angles, that is, the distance between the two can be adjusted to focus the diffracted light beam into a strip-shaped light spot (such as Figure 3 As shown). Finally, the strip-shaped light spot passes through the Bessel lens of the Bessel cutting head 400, which focuses the light beams on the object to be cut, forming a Bessel beam extending along the cutting direction and without side lobes. The beam has a high peak power density and a long focal depth. Figure 4 It can be seen that the light spot still retains some energy to control the extension of the crack along the cutting direction. In this way, not only can the generation of cracks at the edge of the cutting path be reduced, but also the direction of the crack and the cutting path can be kept consistent.
[0056] Continue reading Figure 2 In this embodiment, the diffraction beam splitter assembly 300 further includes a rotating member 302 , and an execution end of the rotating member 302 is connected to the diffraction beam splitter 301 for driving the diffraction beam splitter 301 to rotate.
[0057] In this embodiment, when cutting a curve, the rotating member 302 will drive the diffraction beam splitter 301 to rotate, so that the direction of the diffraction spot changes accordingly, thereby changing the direction of the focusing spot, and further changing the direction of the Bessel light beam. Therefore, the long axis direction of the focal plane can rotate according to the rotation of the cutting path to achieve curve cutting.
[0058] In the technical solution of this embodiment, due to the rotation of the diffraction beam splitter 301, it is possible to cut curves in different directions without changing the position of the light source generator 100 or the Bessel cutting head 400, thereby improving the flexibility and accuracy of cutting; at the same time, since the diffraction spot of the diffraction beam splitter 301 has the characteristic of removing sidelobe energy, it can reduce the impact on the edge of the cutting path during the cutting process, thereby improving the quality of cutting.
[0059] The diffraction beam splitter component 300 may use a beam splitter in addition to the diffraction beam splitter 301 in the above-mentioned embodiment.
[0060] In one embodiment, a beam splitter can be used instead of the diffraction beam splitter 301. The beam splitter is a diffraction optical element (DOE) with a special diffraction pattern on its surface, which can generate a Fraunhofer diffraction pattern of an incident light wave into a certain number of lattices of equal light intensity spots 1. The beam splitter can generate a one-dimensional beam array (1×M) and a two-dimensional beam array (N×M) from the incident light, or a light spot array, depending on the diffraction pattern on the DOE. The advantage of the beam splitter is that the light intensity of the light spot array is uniform, which is not affected by the distribution of the incident light wave, and can generate arbitrarily arranged lattices.
[0061] In one embodiment, a diffraction grating can also be used to split the collimated light beam. A diffraction grating is an optical element with a periodic structure, with a series of slits or grooves on its surface, which can produce a diffraction pattern of spectral lines at certain angle intervals for the incident light wave. The diffraction grating can decompose the incident light into beams of different wavelengths to form a colorful spectrum, depending on the period of the grating and the incident angle. The advantage of the diffraction grating is that it has high spectral resolution and can accurately measure the wavelength and frequency of light.
[0062] The utility model further proposes a laser cutting device, including the diffraction spectroscopic cutting device of the aforementioned embodiment. The specific structure of the diffraction spectroscopic cutting device refers to the above embodiment. Since this subject two adopts all the technical solutions of all the above embodiments, it at least has all the technical effects brought by the technical solutions of the above embodiments, which will not be described one by one here.
[0063] The above description is only a partial or preferred embodiment of the present invention. Neither the text nor the drawings can limit the scope of protection of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the overall concept of the present invention, or direct / indirect application in other related technical fields are included in the scope of protection of the present invention.
Claims
1. A diffraction spectroscopic cutting device, characterized in that: include: A light source generator, used to generate and emit a laser beam, wherein the laser beam is a collimated beam; A diffraction and beam splitting component, facing the output end of the light source generator, and used for diffracting and beam splitting the collimated light beam; A focusing element, facing the output end of the diffraction beam splitter component, and used for focusing the diffracted light beam; The cutting head is arranged at the output end of the focusing element to receive the focused diffraction light beam and convert it into a cutting light beam to act on the workpiece.
2. The diffraction spectroscopic cutting device according to claim 1, characterized in that: The diffraction and beam splitting component diffracts and splits into multiple light beams.
3. The diffraction spectroscopic cutting device according to claim 2, characterized in that: The diffraction beam splitter component comprises a diffraction beam splitter, and the diffraction beam splitter is arranged at the output end of the light source generator.
4. The diffraction spectroscopic cutting device according to claim 3, characterized in that: The focusing element is used to focus the light spot of the diffracted light beam into a strip-shaped light spot.
5. The diffraction spectroscopic cutting device according to claim 1 or 4, characterized in that: The focusing element is a convex lens and a plane mirror. One end of the convex lens faces the diffraction beam splitting component, and the plane mirror is arranged at one end of the convex lens facing away from the diffraction beam splitting component.
6. The diffraction spectroscopic cutting device according to claim 3, characterized in that: The diffraction beam splitter assembly further includes a rotating member, an execution end of which is connected to the diffraction beam splitter and is used to drive the diffraction beam splitter to rotate.
7. The diffraction spectroscopic cutting device according to claim 2, characterized in that: The diffraction beam splitting component comprises a beam splitter, which is arranged between the diffraction beam splitting component and the light source generator, and the incident end of the beam splitter is directly opposite to the output end of the light source generator.
8. The diffraction spectroscopic cutting device according to claim 2, characterized in that: The diffraction beam splitting component comprises a diffraction grating, and the diffraction grating is arranged close to the exit end of the light source generator.
9. A laser cutting device, characterized in that: It comprises the diffraction spectroscopic cutting device as described in any one of claims 1 to 8.