Lead frame with pins provided with deformation areas

Abstract

The utility model relates to the technical field of rectifier bridge assemblies, in particular to a lead frame with pins provided with deformation areas, which comprises a plurality of lead frame modules which are arranged side by side and connected in sequence, each lead frame module comprises four rectification copper sheets, one end of each rectification copper sheet is provided with a pin, and the other end of each rectification copper sheet is provided with a deformation area. According to the utility model, the concave arc part is arranged to provide a buffer area, so that the buffer area exists after the end part of the pin is stressed, and the deformation risk of the pin is reduced.

Description

Technical Field

[0001] The present application relates to the technical field of rectifier bridge components, and more specifically to a lead frame with a pin deformation zone. Background Art

[0002] The rectifier bridge uses the unidirectional conductivity of the diode to achieve conduction when the current is positive and shut down when the current is negative, thereby achieving the rectification effect of converting AC to DC. The existing rectifier bridge includes a plurality of rectifier copper sheets with pins, and a plurality of the rectifier copper sheets are provided with rectifier chips. Each of the rectifier copper sheets is connected by a connector, and each of the rectifier copper sheets is then encapsulated by epoxy resin to obtain the rectifier bridge. The plurality of rectifier copper sheets are arranged in an array in a certain manner and connected to each other to form a lead frame, which is obtained by stamping a copper sheet through an external stamping die.

[0003] Our company currently has a lead frame module, such as Figure 1 As shown, it includes four rectifier copper sheets 90, each of which has a pin 901 and a potting area 902 at both ends. After each of the rectifier copper sheets 90 is connected by a connecting sheet, each of the potting areas 902 is encapsulated by epoxy resin. It should be noted that at this time, each of the pins 901 extends out to the outside. However, since the pin 901 is a slender flat plate structure, when the end of the pin 901 away from the potting area 902 is subjected to force, Figure 2 As shown, the connection between the pin 901 and the potting area 902 is easy to bend and form a crease.

[0004] Therefore, there is a need to provide a lead frame with a pin deformation zone, which has a buffer zone after the pin end is subjected to force and reduces the risk of pin deformation. Summary of the invention

[0005] The main purpose of the present application is to provide a lead frame with a pin deformation zone, wherein the lead frame with the pin deformation zone includes a plurality of lead frame modules arranged side by side and connected in sequence, each of the lead frame modules includes four rectifying copper sheets, each of the rectifying copper sheets has a pin at one end, and the root of the pin has a concave arc portion, and a buffer zone is provided by setting the concave arc portion. Compared with the prior art, the lead frame has the advantages of having a buffer zone after the pin end is subjected to force, thereby reducing the risk of pin deformation.

[0006] Another object of the present application is to provide a lead frame with a pin deformation zone, wherein the four rectifying copper sheets are respectively a first copper sheet, a second copper sheet, a third copper sheet and a fourth copper sheet, the second copper sheet and the third copper sheet are located between the first copper sheet and the fourth copper sheet, the second copper sheet has a first notch at one end away from the pin, the second copper sheet has a second notch on a side away from the first copper sheet, the second notch is located at one end of the second copper sheet close to the pin, the third copper sheet has a third notch at one end close to the pin, and the third notch is located on a side of the third copper sheet close to the second copper sheet, the third copper sheet has a hook at one end away from the pin, the hook is located at one end of the second copper sheet away from the pin, the hook has a fourth notch on one side close to the second notch, the first notch and the fourth notch together form a first rectangular notch, the second notch and the third notch together form a second rectangular notch, which provides conditions for having two heat dissipation holes after packaging.

[0007] In order to achieve at least one of the above-mentioned invention purposes, the present application provides a lead frame with a pin having a deformation zone, wherein the lead frame with a pin having a deformation zone comprises:

[0008] A plurality of lead frame modules are arranged side by side and connected in sequence, each of the lead frame modules comprises four rectifying copper sheets, one end of each rectifying copper sheet has a pin, and the root of the pin has a concave arc portion.

[0009] In one or more embodiments of the present application, the four rectifier copper sheets are respectively a first copper sheet, a second copper sheet, a third copper sheet and a fourth copper sheet, the second copper sheet and the third copper sheet are located between the first copper sheet and the fourth copper sheet, the second copper sheet has a first notch at the end facing away from the pin, the second copper sheet has a second notch on the side facing away from the first copper sheet, the second notch is located at the end of the second copper sheet close to the pin, the third copper sheet has a third notch at the end close to the pin, and the third notch is located on the side of the third copper sheet close to the second copper sheet, the third copper sheet has a hook at the end facing away from the pin, the hook is located at the end of the second copper sheet facing away from the pin, the hook has a fourth notch on the side close to the second notch, the first notch and the fourth notch together form a first rectangular notch, and the second notch and the third notch together form a second rectangular notch.

[0010] In one or more embodiments of the present application, the middle section of the first copper sheet has a waist-shaped hole, and the end of the fourth copper sheet close to the pin has a positioning circular hole.

[0011] In one or more embodiments of the present application, when the lead frame modules are arranged side by side, the fourth copper sheet in one lead frame module is close to the first copper sheet in another lead frame module, and each of the fourth copper sheets has a protrusion on the side facing away from the third copper sheet, and each of the first copper sheets has a fifth notch on the side facing away from the second copper sheet.

[0012] In one or more embodiments of the present application, the first copper sheet has two first cross marks, the waist-shaped hole is located between the two first cross marks, the second copper sheet and the side of the hook portion close to the fourth copper sheet each have a second cross mark, the second copper sheet and the side of the hook portion close to the first copper sheet each have a first chip mounting area, and the end of the fourth copper sheet having the protrusion also has two second chip mounting areas arranged at intervals.

[0013] In one or more embodiments of the present application, an end portion of the fourth copper sheet facing away from the pin has an identification slope, and the identification slope is located on a side of the fourth copper sheet facing away from the third copper sheet.

[0014] In one or more embodiments of the present application, the spacing between two adjacent pins in each lead frame module is equal.

[0015] In an embodiment of the present application, a lead frame with a pin deformation zone includes a plurality of lead frame modules arranged side by side and connected in sequence, each lead frame module includes four rectifier copper sheets, each rectifier copper sheet has a pin at one end, and the root of the pin has a concave arc portion. A buffer zone is provided by setting the concave arc portion. Compared with the prior art, the buffer zone has the advantages of having a buffer zone after the pin end is subjected to force, thereby reducing the risk of pin deformation. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] These and / or other aspects and advantages of the present application will become clearer and easier to understand from the following detailed description of the embodiments of the present application in conjunction with the accompanying drawings, in which:

[0017] Figure 1 The figure shows a structural schematic diagram of an existing lead frame module;

[0018] Figure 2 The figure shows a schematic diagram of an existing pin being bent;

[0019] Figure 3 The figure shows a schematic structural diagram of a lead frame with a pin deformation zone under a certain viewing angle of the utility model;

[0020] Figure 4 The figure shows a schematic structural diagram of a lead frame with a deformation zone of a pin from another perspective;

[0021] Figure 5The figure shows the structural schematic diagram of the lead frame module packaging. DETAILED DESCRIPTION

[0022] The terms and words used in the following specification and claims are not limited to the literal meanings, but are merely used by the inventor to enable a clear and consistent understanding of the present application. Therefore, it will be apparent to those skilled in the art that the following description of various embodiments of the present application is provided for illustrative purposes only and not for the purpose of limiting the present application as defined by the appended claims and their equivalents.

[0023] It is to be understood that the term "one" should be understood as "at least one" or "one or more", that is, in one embodiment, the number of an element may be one, while in another embodiment, the number of the element may be multiple, and the term "one" should not be understood as a limitation on the quantity.

[0024] Although ordinals such as "first," "second," and the like will be used to describe various components, those components are not limited herein. The term is used only to distinguish one component from another. For example, a first component may be referred to as a second component, and likewise, a second component may be referred to as a first component without departing from the teachings of the utility model concept. The term "and / or" as used herein includes any and all combinations of one or more associated listed items.

[0025] The terms used herein are only used for the purpose of describing various embodiments and are not intended to be limiting. As used herein, singular forms are intended to also include plural forms, unless the context clearly indicates an exception. In addition, it will be understood that the terms "including" and / or "having" when used in this specification specify the presence of the described features, numbers, steps, operations, components, elements or combinations thereof, without excluding the presence or addition of one or more other features, numbers, steps, operations, components, elements or groups thereof.

[0026] Application Overview

[0027] In an existing lead frame module, since the pin is a thin and long flat plate-like structure, when the end of the pin away from the potting area is subjected to force, the connection between the pin and the potting area is easy to bend and form a crease.

[0028] Based on the above technical problems, the present application proposes a lead frame with a pin deformation zone, wherein the lead frame with the pin deformation zone has a simple structure, does not involve complex manufacturing processes and expensive materials, and has high economic efficiency. At the same time, for manufacturers, the lead frame with a pin deformation zone provided by the present application is easy to produce and low in cost, which is more conducive to controlling production costs and further conducive to product promotion and use.

[0029] Schematic lead frame with deformation zone.

[0030] refer to Figures 3 to 5 According to a preferred embodiment of the utility model, a lead frame with a pin deformation zone includes a plurality of lead frame modules 10 arranged side by side and connected in sequence, each of the lead frame modules 10 includes four rectifying copper sheets 101, one end of each rectifying copper sheet 101 has a pin 102, and the root of the pin 102 has a concave arc portion 1021.

[0031] It should be noted that the concave arc portion 1021 is obtained by stamping through external stamping equipment. By setting the concave arc portion 1021 at the root of the pin 102, the concave arc portion 1021 constitutes a buffer deformation zone. When the end of the pin 102 away from the concave arc portion 1021 is subjected to force, the force is transmitted to the concave arc portion 1021, and through the deformation of the concave arc portion 1021, the distance that the end of the pin 102 away from the concave arc portion 1021 moves toward the root of the pin 102 due to the force is compensated to a certain extent. Compared with the prior art that the pin 102 is rigidly bent after being subjected to force, it has the advantages of having a buffer zone after the pin end is subjected to force and reducing the risk of pin deformation.

[0032] Furthermore, most existing rectifier bridges are provided with a heat dissipation hole after potting to improve the heat dissipation capacity of the rectifier bridge. In the embodiment of the present application, by changing the structural characteristics and positional relationship of the four rectifier copper sheets 101, a prerequisite is provided for obtaining a rectifier bridge with two heat dissipation holes.

[0033] Specifically, Figure 3 and Figure 5As shown, the four rectifier copper sheets 101 are respectively a first copper sheet 1011, a second copper sheet 1012, a third copper sheet 1013 and a fourth copper sheet 1014, the second copper sheet 1012 and the third copper sheet 1013 are located between the first copper sheet 1011 and the fourth copper sheet 1014, the second copper sheet 1012 has a first notch 10121 at one end away from the pin 102, the second copper sheet 1012 has a second notch 10122 at one side away from the first copper sheet 1011, the second notch 10122 is located at one end of the second copper sheet 1012 close to the pin 102, the third copper sheet 1013 is close to one end of the pin 102 The end of the third copper sheet 1013 has a third notch 10131, and the third notch 10131 is located on a side of the third copper sheet 1013 close to the second copper sheet 1012, the end of the third copper sheet 1013 away from the pin 102 has a hook portion 10132, the hook portion 10132 is located on an end of the second copper sheet 1012 away from the pin 102, and the side of the hook portion 10132 close to the second notch 10122 has a fourth notch 10133, the first notch 10121 and the fourth notch 10133 together form a first rectangular notch, and the second notch 10122 and the third notch 10131 together form a second rectangular notch.

[0034] It should be noted that when pouring epoxy resin, a waist-shaped column is placed at the first rectangular notch and the second rectangular notch. After pouring, the two waist-shaped columns are demolded to obtain a rectifier bridge with two heat dissipation holes. Compared with the rectifier bridge in the prior art, it has the advantage of better heat dissipation performance.

[0035] However, in order to obtain the second rectangular notch, the space of the fourth copper sheet 1014 for placing the rectifier chip is actually sacrificed. In view of this, in order to arrange the rectifier chip on the fourth copper sheet 1014, as shown in FIG. Figure 3 As shown, each of the fourth copper sheets 1014 has a protrusion 10141 on a side facing away from the third copper sheet 1013 .

[0036] However, when processing the lead frame with the deformation zone of the pin 102, a long copper sheet is punched out through an external stamping device to obtain a plurality of the lead frame modules 10 arranged side by side. More specifically, after stamping, the lead frame modules 10 are arranged side by side, and the fourth copper sheet 1014 in one lead frame module 10 is close to the first copper sheet 1011 in another lead frame module 10. It is obvious that if the side of the first copper sheet 1011 is a straight edge, in order to ensure that the protrusion 10141 of the adjacent fourth copper sheet 1014 maintains a predetermined distance from the side wall of the first copper sheet 1011, the distance from the side of the fourth copper sheet 1014 on both sides of the protrusion 10141 to the side wall of the first copper sheet 1011 will increase, which will result in a decrease in the number of lead frame modules 10 that can be punched out of the same size of long copper sheet.

[0037] In view of this, in order to make full use of copper materials, such as Figure 3 As shown, each of the first copper sheets 1011 has a fifth notch 10111 on the side facing away from the second copper sheet 1012. When the fourth copper sheet 1014 in one lead frame module 10 is close to the first copper sheet 1011 in another lead frame module 10, the distance from the protrusion 10141 to the fifth notch 10111 is equal to the distance from the side edges of the fourth copper sheet 1014 located on both sides of the protrusion 10141 to the side edges of the first copper sheet 1011 located on both sides of the fifth notch 10111.

[0038] Furthermore, in the prior art, when packaging the four rectifier copper sheets 101, in order to facilitate the positioning of the rectifier copper sheets 101 in the potting mold, two circular holes are usually opened on the first copper sheet 1011 and the fourth copper sheet 1014. However, since the four rectifier copper sheets 101 are in the form of sheets as a whole and are relatively thin, the potting operator needs to make the two circular holes align with the corresponding protrusions in the potting mold before inserting the rectifier copper sheet 101, which is rather troublesome.

[0039] In view of this, in the embodiments of the present application, Figure 3 As shown, the middle section of the first copper sheet 1011 has a waist-shaped hole 10112 , and the end of the fourth copper sheet 1014 close to the pin 102 has a positioning circular hole 10142 .

[0040] It should be noted that by replacing one of the circular holes with the waist-shaped hole 10112, when inserting the rectifying copper sheet 101, the potting operator can first put the waist-shaped hole 10112 on the corresponding protrusion, and then move the rectifying copper sheet 101 and make the other protrusion face the positioning circular hole 10142. Compared with the existing technology, it is more convenient to place.

[0041] Further, in order to facilitate soldering of one end of the connecting piece to the specified position, in the embodiment of the present application, Figure 3 and Figure 5 As shown, the first copper sheet 1011 has two first cross marks 10113, the waist-shaped hole 10112 is located between the two first cross marks 10113, the second copper sheet 1012 and the hook portion 10132 have a second cross mark (not marked in the figure) on one side close to the fourth copper sheet 1014, the second copper sheet 1012 and the hook portion 10132 have a first chip mounting area 10123 on one side close to the first copper sheet 1011, and the fourth copper sheet 1014 has one end of the protrusion 10141 and also has two second chip mounting areas arranged at intervals.

[0042] It should be noted that the first chip mounting area 10123 and the second chip mounting area are both used to place rectifier chips, one end of the external connecting piece is soldered to the first cross mark 10113 or the second cross mark, and the other end of the external connecting piece is soldered to the rectifier chip.

[0043] Furthermore, in order to facilitate identification of the front and back sides of the rectifier bridge after potting, Figure 3 As shown, the end of the fourth copper sheet 1014 away from the pin 102 has an identification bevel 10143, and the identification bevel 10143 is located on the side of the fourth copper sheet 1014 away from the third copper sheet 1013. It should be noted that by providing the identification bevel 10143, a prerequisite is provided for the subsequent potting bevel not to expose the fourth copper sheet 1014.

[0044] Furthermore, to facilitate layout and aesthetics, the distances between two adjacent pins 102 in each lead frame module 10 are equal.

[0045] In summary, the lead frame with the pin deformation zone based on the embodiment of the present application is explained, which provides the lead frame with the pin deformation zone with advantages such as a buffer zone after the pin end is subjected to force and reduced risk of pin deformation.

[0046] It is worth mentioning that in the embodiment of the present application, the lead frame structure of the pin with deformation zone is simple, does not involve complex manufacturing processes and expensive materials, and has high economic efficiency. At the same time, for manufacturers, the lead frame with deformation zone of the pin provided by the present application is easy to produce and has low cost, which is more conducive to controlling production costs and further conducive to product promotion and use.

[0047] It should be understood by those skilled in the art that the embodiments of the present invention described above and shown in the accompanying drawings are only examples and do not limit the present invention. The purpose of the present invention has been fully and effectively achieved. The functional and structural principles of the present invention have been demonstrated and explained in the embodiments, and the embodiments of the present invention may be deformed or modified in any way without departing from the principles.

Claims

1. A lead frame with a pin having a deformation zone, characterized in that: The lead frame with the pin deformation zone includes A plurality of lead frame modules are arranged side by side and connected in sequence, each of the lead frame modules comprises four rectifying copper sheets, one end of each rectifying copper sheet has a pin, and the root of the pin has a concave arc portion.

2. The lead frame with a lead deformation zone according to claim 1, characterized in that: The four rectifier copper sheets are respectively a first copper sheet, a second copper sheet, a third copper sheet and a fourth copper sheet, the second copper sheet and the third copper sheet are located between the first copper sheet and the fourth copper sheet, the second copper sheet has a first notch at one end away from the pin, the second copper sheet has a second notch on a side away from the first copper sheet, the second notch is located at one end of the second copper sheet close to the pin, the third copper sheet has a third notch at one end close to the pin, and the third notch is located on a side of the third copper sheet close to the second copper sheet, the third copper sheet has a hook at one end away from the pin, the hook is located at one end of the second copper sheet away from the pin, the hook has a fourth notch on a side close to the second notch, the first notch and the fourth notch together form a first rectangular notch, and the second notch and the third notch together form a second rectangular notch.

3. The lead frame with a lead deformation zone according to claim 2, characterized in that: The middle section of the first copper sheet has a waist-shaped hole, and the end of the fourth copper sheet close to the pin has a positioning circular hole.

4. The lead frame with a lead deformation zone according to claim 3, characterized in that: When the lead frame modules are arranged side by side, the fourth copper sheet in one lead frame module is close to the first copper sheet in another lead frame module, and each of the fourth copper sheets has a protrusion on the side facing away from the third copper sheet, and each of the first copper sheets has a fifth notch on the side facing away from the second copper sheet.

5. The lead frame with a lead with a deformation zone according to claim 4, characterized in that: The first copper sheet has two first cross marks, the waist-shaped hole is located between the two first cross marks, the second copper sheet and the side of the hook portion close to the fourth copper sheet each have a second cross mark, the second copper sheet and the side of the hook portion close to the first copper sheet each have a first chip mounting area, and the end of the fourth copper sheet having the protrusion also has two second chip mounting areas arranged at intervals.

6. The lead frame with a lead with a deformation zone according to claim 5, characterized in that: An end portion of the fourth copper sheet facing away from the pin has an identification slope, and the identification slope is located on a side of the fourth copper sheet facing away from the third copper sheet.

7. The lead frame with a lead with a deformation zone according to claim 6, characterized in that: The distances between two adjacent pins in each lead frame module are equal.

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