Infrared camera device and robot

Abstract

The utility model relates to the technical field of mobile robots, in particular to an infrared camera device and a robot. The infrared camera device comprises an infrared lamp assembly and a photosensitive component; the infrared lamp assembly comprises a lamp panel and one or more infrared lamps assembled on the lamp panel; the lamp panel is provided with a mounting hole, a sealing cylinder is arranged along the edge of the mounting hole, and the photosensitive component is mounted in a channel where the mounting hole is communicated with the sealing cylinder and used for receiving infrared light to sense external objects. In this way, infrared light directly emitted to the photosensitive component by the infrared lamp can be blocked, and the problem that imaging of the photosensitive component is affected by the infrared lamp is solved.

Description

Technical Field

[0001] The present application relates to the technical field of mobile robots, and in particular to an infrared camera device and a robot. Background Art

[0002] A mobile robot is a device that can move with intelligent control to perform various tasks. Mobile robots are gradually being used in the service field, for example, delivery services in restaurants, hotels, and office buildings, and delivery services between buildings.

[0003] Mobile robots are usually equipped with infrared cameras, which can realize navigation, obstacle avoidance, face recognition, object recognition and other functions. Infrared cameras emit infrared light through infrared lamps. After being diffusely reflected by external objects, the infrared light is received by the photosensitive components of the infrared camera to form an image. Infrared cameras do not rely on natural light, and infrared light has better penetrating power, so infrared cameras can work 24 hours a day.

[0004] However, the infrared lamp is usually close to the photosensitive component, and part of the infrared light emitted by the infrared lamp will directly enter the photosensitive component, affecting the imaging of the photosensitive component. Utility Model Content

[0005] The embodiments of the present application aim to provide an infrared camera device and a robot, so as to at least improve the problem that the infrared lamp affects the imaging of the photosensitive component.

[0006] In order to solve the above technical problems, a technical solution adopted in the implementation mode of the present application is: to provide an infrared camera device, the infrared camera device includes an infrared lamp assembly and a photosensitive component; the infrared lamp assembly includes a lamp board and one or more infrared lamps mounted on the lamp board; the photosensitive component, the lamp board is provided with a mounting hole, a sealing tube is provided along the edge of the mounting hole, the photosensitive component is installed in a channel connecting the mounting hole and the sealing tube, and the photosensitive component is used to receive infrared light to perceive external objects.

[0007] In some embodiments, the sealing tube is made of sealing foam.

[0008] In some embodiments, the infrared camera device further includes a heat sink, and the heat sink abuts against the light board.

[0009] In some embodiments, the heat dissipation frame includes a connecting portion and a heat dissipation portion connected to the connecting portion; the connecting portion is an aluminum block, and the heat dissipation portion is a plurality of aluminum plates.

[0010] In some embodiments, the heat dissipation rack further includes mounting posts, a plurality of the mounting posts are disposed on a side of the connecting portion facing away from the infrared lamp assembly, and the plurality of the mounting posts surround the photosensitive component; the photosensitive component is detachably connected to the ends of the plurality of the mounting posts.

[0011] In some embodiments, the infrared camera device further includes a mounting member, which is detachably mounted on the plurality of mounting posts, and the photosensitive component is disposed on a side of the mounting member facing the infrared lamp assembly.

[0012] In some embodiments, the heat dissipation frame is a hollow structure, and a through avoidance hole is provided inside the heat dissipation frame; the avoidance hole, the mounting hole and the sealing tube are connected to form a mounting channel, and the photosensitive component is accommodated in the mounting channel.

[0013] In some embodiments, the infrared camera device also includes an infrared lens and a light-transmitting lens, wherein the infrared lens is ring-shaped; the infrared lens is installed at the edge of the sealing tube, wherein the inner hole of the ring of the infrared lens corresponds to the position of the sealing tube; the light-transmitting lens is installed at the tube mouth of the sealing tube.

[0014] In some embodiments, the inner wall at the mouth of the sealing tube is recessed with an annular mounting groove, the center axis of the mounting groove coincides with the axis of the sealing tube, and the edge of the light-transmitting lens is installed in the mounting groove to install the light-transmitting lens at the mouth of the sealing tube.

[0015] Another technical solution adopted in the implementation manner of the present application is: providing a robot, the body of the robot is provided with an infrared camera device as described in any of the above items.

[0016] Different from the related art, the infrared camera device and robot of the embodiment of the present application have a sealing tube at the edge of the mounting hole of the lamp board, and the photosensitive component is arranged in a channel connecting the mounting hole and the sealing tube, so as to block the infrared light directly emitted by the infrared lamp to the photosensitive component, so as to improve the problem of the infrared lamp affecting the imaging of the photosensitive component.

[0017] The above description is only an overview of the technical solution of the present application. In order to more clearly understand the technical means of the present application, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are listed below. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] One or more embodiments are exemplarily described by corresponding drawings, which do not constitute limitations on the embodiments. Elements with the same reference numerals in the drawings represent similar elements, and the figures in the drawings do not constitute proportional limitations unless otherwise stated.

[0019] Figure 1 is a schematic structural diagram of an infrared camera device according to an embodiment of the present application;

[0020] Figure 2 is an exploded view of an infrared camera device according to an embodiment of the present application;

[0021] Figure 3 is another exploded view of the infrared camera device according to an embodiment of the present application;

[0022] Figure 4 yes Figure 1 A front view of the mid-infrared camera device;

[0023] Figure 5 yes Figure 4 Cross-sectional view at AA in the middle.

[0024] The reference numerals in the specific implementation manner are as follows:

[0025] 100. Infrared camera device;

[0026] 1. Infrared lamp assembly; 11. Lamp board; 111. Mounting hole; 12. Infrared lamp;

[0027] 2. Sealing cylinder; 21. Mounting groove;

[0028] 3. Photosensitive components;

[0029] 4. heat dissipation rack; 41. avoidance hole; 42. connection part; 43. mounting column; 44. heat dissipation part;

[0030] 5. Mounting parts;

[0031] 6. Infrared lens;

[0032] 7. Translucent lenses. DETAILED DESCRIPTION

[0033] In order to facilitate the understanding of the present application, the present application is described in more detail below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not intended to limit the present application. It should be noted that when an element is described as "fixed to" another element, it can be directly on the other element, or there can be one or more centered elements therebetween. When an element is described as "connected to" another element, it can be directly connected to the other element, or there can be one or more centered elements therebetween.

[0034] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by technicians in the technical field to which this application belongs; the terms used herein are only for the purpose of describing specific embodiments and are not intended to limit this application; the terms "including" and "having" in the specification and claims of this application and the above-mentioned figure descriptions and any variations thereof are intended to cover non-exclusive inclusions.

[0035] In the description of the embodiments of the present application, the technical terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, which are only for the convenience of describing the embodiments of the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the embodiments of the present application.

[0036] In the description of the embodiments of the present application, the use of words such as "first" and "second" to define components is only for the convenience of distinguishing the corresponding components. Unless otherwise stated, the above words have no special meanings and therefore cannot be understood as limiting the scope of protection of the present application. In the description of the embodiments of the present application, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined.

[0037] Unless otherwise defined, all technical and scientific terms used in this specification have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application. The term "and / or" used in this specification includes any and all combinations of one or more of the related listed items.

[0038] In addition, the technical features involved in the different embodiments of the present application described below can be combined with each other as long as they do not conflict with each other.

[0039] The present application embodiment provides an infrared camera device 100, such as Figures 1 to 3As shown, the infrared camera device 100 includes an infrared lamp assembly 1, a sealing tube 2, a photosensitive component 3, a heat sink 4, a mounting member 5, an infrared lens 6, and a light-transmitting lens 7. The infrared lamp assembly 1 is used to emit infrared light, the photosensitive component 3 is used to receive infrared light to sense external objects, and the sealing tube 2 is used to block the infrared light directly emitted by the infrared lamp 12 to the photosensitive component 3. The infrared lamp assembly 1 and the photosensitive component 3 are both installed on the heat sink 4, and the heat sink 4 is used to enhance the heat dissipation effect of the external lamp assembly and the photosensitive component 3. The mounting member 5 is used to install the photosensitive component 3 on the heat sink 4. The infrared lens 6 is used to allow infrared light to pass through and filter other light, and the infrared lens 6 is also used to protect the infrared lamp assembly 1; the light-transmitting lens 7 is used to allow light to pass through, and the light-transmitting lens 7 is also used to protect the photosensitive component 3.

[0040] For the above infrared lamp assembly 1, if Figures 1 to 3 As shown, the infrared lamp assembly 1 includes a lamp board 11 and an infrared lamp 12. There are multiple infrared lamps 12, and the multiple infrared lamps 12 are installed on the same side of the lamp board 11. The infrared lamps 12 are used to emit infrared light. Optionally, the lamp board 11 is a circuit board, and the infrared lamps 12 are LED lamps.

[0041] Furthermore, the lamp board 11 is a copper or aluminum circuit board, which is beneficial to enhancing the heat dissipation effect of the lamp board 11 .

[0042] In the embodiment of the present application, for ease of description, the side of the light board 11 on which the infrared lamp 12 is disposed is taken as the front side, and the infrared lamp 12 is disposed on the front side of the light board 11 and is used to emit infrared light toward the front side of the infrared camera device 100 .

[0043] like Figure 2 As shown, the lamp board 11 is circular, and a mounting hole 111 is provided on the lamp board 11. The mounting hole 111 is located at the center of the lamp board 11, and the mounting hole 111 is also circular, so that the lamp board 11 is ring-shaped. Among them, a plurality of infrared lamps 12 are arranged at equal intervals around the mounting hole 111, so that the brightness of the infrared light emitted by the infrared lamp assembly 1 is more uniform.

[0044] For the above-mentioned sealing cylinder 2, if Figure 4 and Figure 5 As shown, the sealing cylinder 2 is arranged along the edge of the mounting hole 111, that is, one end of the sealing cylinder 2 is connected to the mounting hole 111, and the other end of the sealing cylinder 2 faces the front side of the infrared camera device 100. The sealing cylinder 2 is used to block light and can be made of a non-light-transmitting material. Further, the sealing cylinder 2 can also have heat insulation capabilities. For example, if the sealing cylinder 2 is made of a sealing foam material, the heat transfer efficiency between the inner and outer sides of the sealing cylinder 2 can be reduced. Optionally, the sealing cylinder 2 is cylindrical, and the sealing cylinder 2 is pasted on the edge of the mounting hole 111.

[0045] For the above-mentioned photosensitive member 3, if Figure 2 and Figure 5As shown, the photosensitive component 3 is installed in the channel connected to the installation hole 111 and the sealing cylinder 2. The photosensitive component 3 is used to receive infrared light to sense external objects, so that the photosensitive component 3 and the infrared lamp 12 are respectively located on the inside and outside of the sealing cylinder 2. The sealing cylinder 2 can block the infrared light directly emitted by the infrared lamp 12 to the photosensitive component 3, thereby improving the problem that the infrared lamp 12 directly affects the imaging of the photosensitive component 3. In addition, the sealing cylinder 2 can reduce the gas flow between the photosensitive component 3 and the infrared lamp assembly 1, thereby reducing the heat convection and heat radiation between the photosensitive component 3 and the infrared lamp assembly 1; when the sealing cylinder 2 has heat insulation ability, it can also reduce the heat exchange between the gas on both sides of the sealing cylinder 2 through heat conduction, thereby improving the influence of the infrared lamp assembly 1 on the temperature of the photosensitive component 3.

[0046] like Figure 2 and Figure 5 As shown, the photosensitive component 3 can be cylindrical and can be a camera, and the light-incoming end of the photosensitive component 3 is located in the sealing tube 2.

[0047] For the above heat sink 4, Figure 1 , Figure 4 and Figure 5 As shown, the heat sink 4 abuts against the lamp board 11 and abuts against the rear side of the lamp board 11. The heat sink 4 and the lamp board 11 can transfer heat to each other. When the infrared lamp assembly 1 generates a large amount of heat, the heat can be transferred to the heat sink 4 through the lamp board 11, so that the heat can be dissipated through the heat sink 4, thereby reducing the temperature of the infrared lamp assembly 1. Since the heat of the infrared lamp 12 will also be transferred to the photosensitive component 3, affecting the temperature of the photosensitive component 3, reducing the temperature of the infrared lamp assembly 1 through the heat sink 4 can also indirectly reduce the temperature of the photosensitive component 3.

[0048] Furthermore, the heat sink 4 and the lamp board 11 are fitted to enhance the heat conduction efficiency between the two. The two can be connected by thermal conductive adhesive, or filled with thermal conductive silicone grease to further enhance the heat conduction efficiency between the heat sink 4 and the lamp board 11.

[0049] like Figure 3 As shown, the heat sink 4 as a whole can be in a circular ring shape, that is, the heat sink 4 is a hollow structure. The hole in the middle of the heat sink 4 is an avoidance hole 41, that is, the heat sink 4 is provided with a through avoidance hole 41. The avoidance hole 41, the mounting hole 111 and the sealing cylinder 2 are located on the same axis, and the avoidance hole 41, the mounting hole 111 and the sealing cylinder 2 are connected to form an installation channel, and the photosensitive component 3 is accommodated in the installation channel. Since the photosensitive component 3 has a certain length, by accommodating the photosensitive component 3 in the installation channel, the size of the infrared camera device 100 can be reduced, and the photosensitive component 3 can be protected.

[0050] like Figure 3As shown, the heat sink 4 includes a connecting portion 42, a mounting post 43 and a heat sink 44. The connecting portion 42 is in a circular ring shape, and the hole in the middle of the connecting portion 42 is at least a part of the avoidance hole 41. The number of the mounting post 43 and the heat sink 44 are both multiple, and the mounting post 43 and the heat sink 44 are arranged on the same side of the connecting portion 42, and are both arranged on the side of the connecting portion 42 away from the infrared lamp assembly 1, that is, arranged on the rear side of the connecting portion 42. Among them, the mounting post 43 is used to connect with the photosensitive component 3, and the heat sink 44 is in a sheet shape. The heat sink 44 is used to increase the heat dissipation area of ​​the heat sink 4 to enhance the heat dissipation capacity of the heat sink 4. Optionally, the connecting portion 42, the mounting post 43 and the heat sink 44 are processed as one piece. Optionally, the connecting portion 42 is an aluminum block, and the heat sink 44 is a plurality of aluminum plates. Aluminum has good thermal conductivity, thereby further enhancing the heat dissipation capacity of the heat sink 4.

[0051] Furthermore, if Figure 2 As shown, a plurality of mounting posts 43 and a plurality of heat dissipation parts 44 are arranged around the central axis of the avoidance hole 41, and the plurality of mounting posts 43, the plurality of heat dissipation parts 44 and the connection part 42 are arranged together to form the avoidance hole 41. When the photosensitive component 3 is received in the mounting channel, the plurality of mounting posts 43 surround the photosensitive component 3.

[0052] For the above-mentioned mounting member 5, if Figure 3 As shown, the mounting member 5 is in the form of a sheet, and the mounting member 5 is detachably connected to the ends of the plurality of mounting posts 43, for example, by screws. In addition, the photosensitive component 3 is disposed on the side of the mounting member 5 facing the infrared lamp assembly 1, that is, the photosensitive component 3 is detachably connected to the ends of the plurality of mounting posts 43. The photosensitive component 3 is connected to the heat sink 4 through the ends of the mounting posts 43, which can reduce the heat conduction from the heat sink 4 to the photosensitive component 3, and improve the influence of the heat sink 4 on the temperature of the photosensitive component 3.

[0053] Optionally, the mounting member 5 is a metal plate. In some other embodiments, the mounting member 5 is a circuit board, and the photosensitive component 3 is fixedly disposed on the mounting member 5 .

[0054] For the above infrared lens 6, if Figures 1 to 3 As shown, the infrared lens 6 is annular and matches the shape and size of the infrared lamp assembly 1. The infrared lens 6 is installed on the edge of the sealing tube 2, wherein the inner hole of the ring of the infrared lens 6 corresponds to the position of the sealing tube 2. That is, the end of the sealing tube 2 is against the infrared lens 6, and the infrared light emitted by the infrared lamp 12 needs to pass through the infrared lens 6 before it can be diffusely reflected by external objects and enter the sealing tube 2 and be received by the photosensitive component 3. Optionally, the infrared lens 6 is bonded to the sealing tube 2. Optionally, the infrared lens 6 is a filter glass lens.

[0055] For the above-mentioned light-transmitting lens 7, if Figures 1 to 3As shown, the light-transmitting lens 7 is adapted to the shape and size of the tube opening of the sealing tube 2, and the light-transmitting lens 7 can be in the shape of a disc, and the light-transmitting lens 7 is installed at the tube opening of the sealing tube 2. That is, the infrared light can only be received by the photosensitive component 3 by passing through the light-transmitting lens 7 from the outside. Optionally, the light-transmitting lens 7 is bonded to the sealing tube 2. Optionally, the light-transmitting lens 7 is a glass lens.

[0056] Furthermore, if Figure 2 and Figure 5 As shown, the inner wall at the mouth of the sealing tube 2 is recessed with an annular mounting groove 21, the central axis of the mounting groove 21 coincides with the axis of the sealing tube 2, and the edge of the light-transmitting lens 7 is mounted in the mounting groove 21, so that the light-transmitting lens 7 is mounted at the mouth of the sealing tube 2. By mounting the light-transmitting lens 7 in the mounting groove 21, the connection stability between the light-transmitting lens 7 and the sealing tube 2 can be increased. Among them, the mounting groove 21 and the inner wall of the sealing tube 2 can also form a step shape, so when installing the light-transmitting lens 7, it is only necessary to push the light-transmitting lens 7 into the mounting groove 21, so that the side of the light-transmitting lens 7 facing the photosensitive component 3 abuts against the inner wall of the mounting groove 21, which is convenient for the installation of the light-transmitting lens 7.

[0057] The embodiment of the present application also provides a robot (not shown), the body of which is provided with an infrared camera device 100. The robot has the structural features and beneficial effects of the infrared camera device 100, which will not be described in detail here. The robot can be a distribution robot, a leading robot, a food delivery robot, or a transportation robot, etc. The present application does not limit the appearance and purpose of the robot.

[0058] In the infrared camera device 100 and the robot of the embodiment of the present application, a sealing tube 2 is arranged at the edge of the mounting hole 111 of the lamp board 11, and the photosensitive component 3 is arranged in the channel connecting the mounting hole 111 and the sealing tube 2, so as to block the infrared light of the infrared lamp 12 directly irradiated to the photosensitive component 3, so as to improve the problem that the infrared lamp 12 affects the imaging of the photosensitive component 3. In addition, the sealing tube 2 can reduce the gas flow between the photosensitive component 3 and the infrared lamp assembly 1, and can also reduce the gas on both sides of the sealing tube 2 to exchange heat through heat conduction, thereby improving the influence of the infrared lamp assembly 1 on the temperature of the photosensitive component 3.

[0059] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Under the concept of the present application, the technical features in the above embodiments or different embodiments may also be combined, the steps may be implemented in any order, and there are many other changes in different aspects of the present application as described above, which are not provided in detail for the sake of simplicity. Although the present application has been described in detail with reference to the aforementioned embodiments, a person of ordinary skill in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present application.

Claims

1. An infrared camera device, characterized in that: include: An infrared lamp assembly, comprising a lamp board and one or more infrared lamps mounted on the lamp board; A photosensitive component, wherein the lamp board is provided with a mounting hole, a sealing tube is provided along the edge of the mounting hole, the photosensitive component is installed in a channel connecting the mounting hole and the sealing tube, and the photosensitive component is used to receive infrared light to sense external objects.

2. The infrared camera device according to claim 1, characterized in that: The sealing tube is made of sealing foam.

3. The infrared camera device according to claim 1, characterized in that: It also includes a heat dissipation frame, which is in contact with the lamp panel.

4. The infrared camera device according to claim 3, characterized in that: The heat dissipation frame comprises a connecting portion and a heat dissipation portion connected to the connecting portion; the connecting portion is an aluminum block, and the heat dissipation portion is a plurality of aluminum plates.

5. The infrared camera device according to claim 4, characterized in that: The heat dissipation frame further comprises mounting posts, a plurality of the mounting posts are arranged on a side of the connecting portion away from the infrared lamp assembly, and the plurality of the mounting posts surround the photosensitive component; The photosensitive component is detachably connected to the ends of the plurality of mounting posts.

6. The infrared camera device according to claim 5, characterized in that: The infrared camera device also includes a mounting piece, which is detachably mounted on the plurality of mounting posts, and the photosensitive component is disposed on a side of the mounting piece that faces the infrared lamp assembly.

7. The infrared camera device according to claim 3, characterized in that: The heat dissipation frame is a hollow structure, and a through avoidance hole is arranged inside the heat dissipation frame; The avoidance hole, the mounting hole and the sealing cylinder are connected to form a mounting channel, and the photosensitive component is accommodated in the mounting channel.

8. The infrared camera device according to any one of claims 1 to 7, characterized in that: The infrared camera device also includes an infrared lens and a light-transmitting lens, and the infrared lens is ring-shaped; The infrared lens is installed on the edge of the sealing tube, wherein the inner hole of the ring of the infrared lens corresponds to the position of the sealing tube; The light-transmitting lens is installed at the tube mouth of the sealing tube.

9. The infrared camera device according to claim 8, characterized in that: The inner wall at the mouth of the sealing cylinder is recessed with an annular installation groove, the center axis of the installation groove coincides with the axis of the sealing cylinder, and the edge of the light-transmitting lens is installed in the installation groove to install the light-transmitting lens at the mouth of the sealing cylinder.

10. A robot, characterized in that: The body of the robot is provided with an infrared camera device as described in any one of claims 1 to 9.

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