Display device

Abstract

The embodiment of the utility model belongs to the photoelectric technology, and provides a display device which comprises a lamp panel assembly, a light source assembly and a light source assembly. A light source chip disposed on the substrate; the packaging structure covers the light source chip, and the packaging structure comprises a shielding layer; the shielding layer is stacked on the substrate and located on the peripheral side of the light source chip; the at least two packaging layers are arranged in a stacked mode, the at least two packaging layers are arranged on the side, away from the substrate, of the shielding layer, and the refractive indexes of the at least two packaging layers are different. The problem of color cast under a large viewing angle can be improved.

Description

Technical Field

[0001] The embodiments of the present application relate to optoelectronic technology, and more particularly to a display device. Background Art

[0002] As a screen display technology, Light Emitting Diode (LED) has been undergoing a process of continuous change and innovation since its birth. In recent years, sub-millimeter light emitting diodes (Mini Light Emitting Diode, Mini LED) and micro light emitting diode displays (Micro Light Emitting Diode Display, abbreviated as Micro LED) have increasingly become the mainstream trend in the field of screen display technology and are being launched by major brands.

[0003] In the related art, the display device has multiple light board assemblies, and the light board assemblies include a substrate, multiple light source chips, and a packaging structure. Multiple light source chips are arrayed on the substrate, and the packaging structure covers the light source chips arranged in the array. The packaging structure is a single layer of light or heat curing resin layer.

[0004] However, when observing the display panel from different angles, the light distribution curve of the light source chip is inconsistent on the left and right, resulting in inconsistent colors (color cast) under a wide viewing angle, which affects the subjective effect. Utility Model Content

[0005] The embodiments of the present application provide a display device that can improve color consistency under a wide viewing angle.

[0006] In a first aspect, an embodiment of the present application provides a display device, the display device comprising:

[0007] The light board assembly is arranged opposite to the display panel, and the light board assembly includes:

[0008] substrate;

[0009] A light source chip is arranged on the substrate;

[0010] The packaging structure is covered on the light source chip, and the packaging structure includes:

[0011] A shielding layer is stacked on the substrate, and the shielding layer is located around the light source chip;

[0012] At least two stacked encapsulation layers are provided, and the at least two stacked encapsulation layers are provided on a side of the shielding layer away from the substrate, and the at least two encapsulation layers have different refractive indices.

[0013] In this way, by stacking packaging layers with different refractive indices, the light output path and luminous intensity are changed, and the light intensity in the middle part of the light distribution curve is adjusted to both sides. Since the overall luminous flux remains unchanged, the normal light intensity is reduced and the light intensity on both sides is increased, thereby increasing the luminous angle and improving the problem of color cast at a wide viewing angle.

[0014] In some embodiments of the present application, the light source chip includes an electrode and a light-emitting layer and a substrate that are stacked, the electrode is arranged on a side of the light-emitting layer away from the substrate, and the electrode is connected to a pad on the substrate correspondingly;

[0015] The shielding layer is arranged on the peripheral sides of the electrode and the light-emitting layer.

[0016] In this way, the light emitting effect of the top of the light emitting layer is less affected. Compared with the related art, the shielding layer is evenly distributed in each packaging layer, and the shielding layer in this embodiment has less loss on the light emitting brightness of the light emitting layer.

[0017] In some embodiments of the present application, a side of the shielding layer facing away from the substrate is flush with a side of the light-emitting layer facing the substrate.

[0018] When the side of the shielding layer facing away from the substrate is higher than the side of the light-emitting layer facing the substrate, the shielding layer is likely to affect the top light of the light-emitting layer. When the side of the shielding layer facing away from the substrate is lower than the side of the light-emitting layer facing the substrate, the thickness of the shielding layer is small and the effect of reducing the black state brightness is poor.

[0019] In some embodiments of the present application, the thickness of each packaging layer is the same.

[0020] When the overall thickness of the packaging structure is required to be certain, by setting the thickness of each packaging layer to be consistent, it is convenient to determine the thickness of each packaging layer during the process of adjusting the number of packaging layers.

[0021] In some embodiments of the present application, the at least two encapsulation layers include a first encapsulation layer and a second encapsulation layer, the first encapsulation layer and the second encapsulation layer have different refractive indices, the first encapsulation layer is disposed on the light source chip, and the second encapsulation layer is located on a side of the first encapsulation layer away from the light source chip;

[0022] The refractive index of the second encapsulation layer is smaller than the refractive index of the first encapsulation layer.

[0023] In this way, the structure of the packaging layer is simpler, which can improve the processing efficiency.

[0024] In some embodiments of the present application, there are multiple encapsulation layers, and the multiple encapsulation layers also include a third encapsulation layer, which is stacked on the second encapsulation layer, and the refractive index of the third encapsulation layer is smaller than the refractive index of the second encapsulation layer.

[0025] In this way, the effect of improving the color cast at a wide viewing angle can be enhanced.

[0026] In some embodiments of the present application, the number of the third encapsulation layers is at least two, and at least two third encapsulation layers are stacked. Along the direction from the first encapsulation layer to the second encapsulation layer, the refractive index of the third encapsulation layer gradually decreases.

[0027] In this way, the effect of improving the color cast at a large viewing angle can be enhanced.

[0028] In some embodiments of the present application, the multiple encapsulation layers also include a fourth encapsulation layer, which is stacked on the side of the third encapsulation layer away from the second encapsulation layer, and the refractive index of the fourth encapsulation layer is greater than the refractive index of the third encapsulation layer close to the fourth encapsulation layer.

[0029] In this way, the effect of improving the color cast at a wide viewing angle can be enhanced.

[0030] In some embodiments of the present application, the encapsulation layer includes a plurality of stacked resin layers.

[0031] In this way, each packaging layer is coated multiple times on the release film and formed into a semi-cured film after pre-curing. The thickness of each layer is highly accurate, and the subsequent processing only requires hot pressing and bonding, which greatly improves efficiency and prevents the precipitation of added materials in the packaging glue, resulting in large concentration differences at different positions.

[0032] In some embodiments of the present application, the shielding layer includes a resin base layer and a black light-shielding material doped in the resin base layer.

[0033] In this way, the shielding layer and the encapsulation layer are both resin layers, which facilitates hot pressing and bonding of the shielding layer and the encapsulation layer. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] In order to more clearly illustrate the implementation methods in the embodiments of the present application or the related technologies, the following is a brief introduction to the drawings required for use in the embodiments or the related technology descriptions. Obviously, the drawings described below are some embodiments of the present application, and a person skilled in the art can also obtain other drawings based on these drawings.

[0035] Figure 1 It is a structural schematic diagram of a light panel assembly in the related art;

[0036] Figure 2 It is a light distribution curve diagram of a light panel assembly in the related art;

[0037] Figure 3 A cross-sectional view of a light panel assembly in a display device provided in an embodiment of the present application;

[0038] Figure 4 A light distribution curve diagram of a light panel assembly in a display device provided in an embodiment of the present application;

[0039] Figure 5A schematic diagram of a structure of an encapsulation layer in a display device provided in an embodiment of the present application;

[0040] Figure 6 for Figure 5 Schematic diagram of the optical path of the package structure;

[0041] Figure 7 Another schematic diagram of the structure of the encapsulation layer in the display device provided in an embodiment of the present application;

[0042] Figure 8 for Figure 7 Schematic diagram of the optical path of the packaging structure.

[0043] Description of reference numerals:

[0044] 110-light board assembly;

[0045] 111-Substrate;

[0046] 112-light source chip;

[0047] 1121 - electrode;

[0048] 1122- light emitting layer;

[0049] 1123-substrate;

[0050] 113- packaging structure;

[0051] 1131-Occlusion layer;

[0052] 1132-first encapsulation layer;

[0053] 1133- second encapsulation layer;

[0054] 1134-third encapsulation layer;

[0055] 1135-the fourth encapsulation layer. DETAILED DESCRIPTION

[0056] In order to make the purpose, implementation mode and advantages of the present application clearer, the exemplary implementation mode of the present application will be clearly and completely described below in conjunction with the drawings in the exemplary embodiments of the present application. Obviously, the described exemplary embodiments are only part of the embodiments of the present application, not all of the embodiments.

[0057] It should be noted that the brief description of terms in this application is only for the convenience of understanding the embodiments described below, and is not intended to limit the embodiments of this application. Unless otherwise specified, these terms should be understood according to their common and usual meanings.

[0058] In addition, the terms "include" and "have" and any variations thereof are intended to cover but not exclude inclusion, for example, a product or device comprising a list of components is not necessarily limited to those components expressly listed but may include other components not expressly listed or inherent to such products or devices.

[0059] In the description of the present application, it should be understood that the terms "center", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0060] The terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise specified, "plurality" means two or more.

[0061] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0062] With the development of LED display technology, LED display screens have gradually evolved from outdoor display screens to indoor display screens to small-pitch display screens to Mini / Micro LED display screens. In the era of Mini / Micro LED display screens, due to the integrated packaging of light board components, individual pixels cannot be graded, resulting in a series of common industry problems such as ink color differences and color cast at large viewing angles. At the same time, due to the small pitch, the above problems are further magnified.

[0063] Each pixel of the Mini LED direct display contains three luminous colors: R (red), G (green), and B (blue). Due to reasons such as materials and production processes, the chip light distribution curve of each luminous color is asymmetrical on the left and right, and the light distribution curves of the three colors are inconsistent. When the Mini LED light board assembly is produced, the same packaging material is used, and its transmittance and refractive index are consistent on both sides of the normal direction of the light board assembly. After being assembled into a display screen, it needs to be calibrated. The brightness and chromaticity of the normal direction (camera position) are compensated by the algorithm through the calibration camera and algorithm to achieve consistency. However, when observed from different angles, due to the inconsistency of the light distribution curve on the left and right, the color is inconsistent (color cast) under a large viewing angle, which affects the subjective effect.

[0064] like Figure 1 The light board assembly 110 includes a substrate 111, a plurality of light source chips 112 and a packaging structure 113. The plurality of light source chips 112 are arranged in an array on the substrate 111, and the packaging structure 113 covers the arrayed light source chips 112. The packaging structure 113 is a single layer of light or heat curing resin. Its light distribution curve is as shown in FIG. Figure 2 shown.

[0065] Figure 2 The horizontal axis is the viewing angle value, and the vertical axis is the display brightness. Figure 2 It can be seen that at larger viewing angles, such as -70 and 70 degrees, the display brightness of the three lights R, G, and B is quite different. In other words, due to the inconsistency of the light distribution curves on the left and right, the colors are inconsistent (color cast) at large viewing angles, affecting the subjective effect.

[0066] In order to solve the above technical problems, the display device provided by the present application has a packaging structure by providing a shielding layer, and the shielding layer is provided on the peripheral side of the light source chip, so that the shielding layer can absorb ambient light and reduce the black state brightness while having little effect on the luminous brightness of the light source chip, thereby improving the display effect. The packaging structure is provided by providing at least two stacked packaging layers, and the refractive index of at least two packaging layers is different.

[0067] In this way, by stacking packaging layers with different refractive indices, the light output path and luminous intensity are changed, and the light intensity in the middle part of the light distribution curve is adjusted to both sides. Since the overall luminous flux remains unchanged, the normal light intensity is reduced and the light intensity on both sides is increased, thereby increasing the luminous angle and improving the problem of color cast at a wide viewing angle.

[0068] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0069] An embodiment of the present application provides a display device, which may be a Mini LED display device, or the display device may be a Micro LED display device.

[0070] Exemplarily, the display device may be an ultra-high-definition large screen for engineering applications, a smart conference interactive system in the commercial field, and an ultra-high-definition home giant screen for home use.

[0071] In some embodiments, the display device includes but is not limited to: a radio frequency unit, a network module, an audio output & input unit, a sensor, a display unit, a user input unit, an interface unit, a memory, a processor, and a power supply. In addition, it can be understood by those skilled in the art that the above structure does not constitute a limitation on the above display device provided in the embodiment of the present disclosure. In other words, the above display device provided in the embodiment of the present disclosure may include more or less of the above components, or combine certain components, or arrange the components differently.

[0072] See also Figure 3 and Figure 4 In this embodiment, the light board assembly 110 includes a substrate 111 , a light source chip 112 and a packaging structure 113 .

[0073] The substrate 111 may be a printed circuit board (PCB).

[0074] Alternatively, the substrate 111 may be a glass substrate.

[0075] The light source chip 112 is disposed on the substrate 111. The light source chip 112 may be a micro light emitting diode such as Mini LED or Micro LED.

[0076] Since the size of Mini LED is in the range of 100μm-200μm and the size of Micro LED is below 100μm, the resolution of Mini LED and Micro LED products can be higher and the display screen can be more delicate. In addition, a major advantage of Mini LED and Micro LED is that they can be spliced ​​together, and multiple small-sized products can be spliced ​​together to realize large-sized products.

[0077] The packaging structure 113 covers the light source chip 112 .

[0078] It should be noted that the light source chip 112 of each pixel may be single or multiple.

[0079] In this embodiment, there are multiple light source chips 112, including a red light chip (R), a green light chip (G) and a blue light chip (B). The multiple light source chips 112 are arranged in an array, and the packaging structure 113 covers the array of light source chips 112.

[0080] In some embodiments, the light board assembly 110 includes a driver wafer, which is disposed on the substrate 111 and is disposed on the same side of the substrate 111 as the light source chip 112 .

[0081] In some embodiments, the substrate 111 is a printed circuit board (PCB), and the driver IC is mounted on the back side of the PCB (the side away from the light source chip 112) by SMT.

[0082] In other embodiments, the substrate 111 is a glass substrate, and a TFT driving method and an AM driving method can be used. The TFT driving method is to directly grow the TFT circuit on the same side of the chip on the glass substrate. The AM driving method is to place the driver wafer on the same side of the light source chip 112 after solder paste printing.

[0083] In this embodiment, the packaging structure 113 includes: a shielding layer 1131 and at least two stacked packaging layers.

[0084] The shielding layer 1131 is stacked on the substrate 111 and is located around the light source chip 112. In this way, the shielding layer 1131 can absorb ambient light and reduce the black state brightness while having little effect on the light brightness of the light source chip 112, thereby improving the display effect.

[0085] At least two stacked encapsulation layers are arranged on a side of the shielding layer 1131 away from the substrate 111 , and the refractive indexes of at least two encapsulation layers are different.

[0086] In this way, by stacking packaging layers with different refractive indices, the light path and luminous intensity are changed, and the light intensity in the middle part of the light distribution curve is adjusted to both sides. Since the overall luminous flux remains unchanged, the normal light intensity decreases and the light intensity on both sides increases, so that the luminous angle becomes larger, improving the problem of color cast under a wide viewing angle.

[0087] Exemplarily, the number of encapsulation layers may be two, three, six, eight, etc., and the number of encapsulation layers may be adjusted according to actual parameter requirements and light distribution curve test results.

[0088] It should be noted that the refractive indexes of the various encapsulation layers may be different, or the refractive indexes of some of the encapsulation layers may be different.

[0089] See also Figure 3As shown, in some embodiments of the present application, the light source chip 112 includes an electrode 1121 and a stacked light-emitting layer 1122 and a substrate 1123, the electrode 1121 is arranged on the side of the light-emitting layer 1122 away from the substrate 1123, and the electrode 1121 is connected to the corresponding pads on the substrate 111.

[0090] The shielding layer 1131 is disposed around the electrode 1121 and the light-emitting layer 1122. It is understandable that the shielding layer 1131 is disposed around the electrode 1121 and the light-emitting layer 1122, which has little effect on the light-emitting effect of the top of the light-emitting layer 1122. Compared with the related art, in which the shielding layer 1131 is evenly distributed in each packaging layer, the shielding layer 1131 in this embodiment has less loss on the light-emitting brightness of the light-emitting layer 1122.

[0091] In some embodiments of the present application, a side of the shielding layer 1131 facing away from the substrate 111 is flush with a side of the light emitting layer 1122 facing the substrate 1123 .

[0092] It is understandable that when the side of the shielding layer 1131 facing away from the substrate 111 is higher than the side of the light-emitting layer 1122 facing the substrate 1123 , the shielding layer 1131 is likely to affect the top light emission of the light-emitting layer 1122 .

[0093] When the side of the shielding layer 1131 facing away from the substrate 111 is lower than the side of the light-emitting layer 1122 facing the substrate 1123 , the thickness of the shielding layer 1131 is small, and the effect of reducing the black state brightness is poor.

[0094] See also Figure 5 and Figure 6 As shown, in some embodiments of the present application, at least two packaging layers include a first packaging layer 1132 and a second packaging layer 1133, the first packaging layer 1132 and the second packaging layer 1133 have different refractive indices, the first packaging layer 1132 is covered on the light source chip 112, and the second packaging layer 1133 is located on the side of the first packaging layer 1132 away from the light source chip 112.

[0095] The refractive index of the second encapsulation layer 1133 is smaller than that of the first encapsulation layer 1132. When light enters from a denser medium into a less dense medium, the refraction angle is greater than the incident angle (light deviates from the normal line), so the refractive index of the first encapsulation layer 1132 is greater than that of the second encapsulation layer 1133.

[0096] It can be understood that, assuming that the refractive index of the first packaging layer is n1, the angle of light emitted from the light source chip 112 is θ1, the refractive index of the second packaging layer is n2, and the refraction angle is β1, according to sinθ1 / sinβ1=n2 / n1, the refraction angle β1=arc(n1*sinθ1 / n2).

[0097] Light is emitted from the light source chip 112 and enters the first packaging layer 1132. At the interface between the first packaging layer 1132 and the second packaging layer 1133, the light is deflected outward relative to the normal direction due to the different refractive index. In this way, compared with the packaging structure 113 with a single refractive index, the color cast phenomenon at a large viewing angle can be improved.

[0098] In order to improve the effect of improving the color cast at a wide viewing angle, in some embodiments of the present application, there are multiple encapsulation layers, and the multiple encapsulation layers further include a third encapsulation layer 1134, which is stacked on the second encapsulation layer 1133, and the refractive index of the third encapsulation layer 1134 is less than the refractive index of the second encapsulation layer 1133.

[0099] In order to improve the effect of improving color cast at a wide viewing angle, in some embodiments of the present application, the number of third encapsulation layers 1134 is at least two, and at least two third encapsulation layers 1134 are stacked, and the refractive index of the third encapsulation layer 1134 gradually decreases along the direction from the first encapsulation layer 1132 to the second encapsulation layer 1133.

[0100] It should be noted that, according to the actual optical simulation results, the refractive index of each packaging layer and the number of packaging layers can be selected, and the optical path and luminous intensity can be changed to achieve the purpose of making the light distribution curves of the three colors R, G, and B consistent.

[0101] In this embodiment, the light output path and luminous intensity are changed multiple times through packaging layers with different refractive indices, and the light intensity in the middle part of the light distribution curve is adjusted to both sides. Since the overall luminous flux remains unchanged, the normal light intensity decreases and the light intensity on both sides increases, thereby increasing the luminous angle.

[0102] See also Figure 6 As shown, at a certain angle, light is emitted from the light source chip 112 and enters the first packaging layer. At the interface between the first packaging layer and the second packaging layer, the light is refracted at a refraction angle β1 due to the different refractive indices. It is refracted again at the second packaging layer and the third packaging layer, and the refracted parts of each layer continue to refract at the interface of the next layer.

[0103] See also Figure 7 and Figure 8 As shown, in some embodiments of the present application, the multiple encapsulation layers further include a fourth encapsulation layer 1135 .

[0104] Specifically, the fourth encapsulation layer 1135 is stacked on a side of the third encapsulation layer 1134 away from the second encapsulation layer 1133 , and a refractive index of the fourth encapsulation layer 1135 is greater than a refractive index of the third encapsulation layer 1134 close to the fourth encapsulation layer 1135 .

[0105] That is, when the light emitted from the third encapsulation layer 1134 closest to the fourth encapsulation layer 1135 enters the third encapsulation layer 1134, the light is offset inward relative to the normal direction. In this way, the light mixing effect can be further improved and the color cast phenomenon at a wide viewing angle can be improved.

[0106] In some embodiments of the present application, the thickness of each packaging layer is the same, that is, the thickness of each packaging layer with different refractive indices is consistent.

[0107] It is understandable that the overall thickness of the packaging structure 113 is generally required to be 0.1-0.35 mm.

[0108] When the overall thickness of the packaging structure 113 is less than 0.1 mm, the reliability of the packaging is low, which affects the service life of the light panel assembly 110 .

[0109] Therefore, when the overall thickness of the encapsulation structure 113 is required to be certain, by setting the thickness of each encapsulation layer to be consistent, it is convenient to determine the thickness of each encapsulation layer during the process of adjusting the number of encapsulation layers. Therefore, it is convenient to process and improve the processing efficiency.

[0110] In some embodiments of the present application, the encapsulation layer includes a plurality of stacked resin layers.

[0111] It can be understood that in this way, each packaging layer is coated multiple times on the release film and formed into a semi-cured film after pre-curing. The thickness of each layer is highly accurate, and the subsequent processing only requires hot pressing and bonding, which greatly improves efficiency and prevents the precipitation of added materials in the packaging glue, resulting in large concentration differences at different positions.

[0112] Specifically, the resin layer may be an epoxy resin layer.

[0113] In this embodiment, each encapsulation layer is a transparent layer.

[0114] In some embodiments, the shielding layer 1131 includes a resin base layer and a black light shielding material doped in the resin base layer. Thus, the cost of the shielding layer 1131 in this embodiment is relatively low.

[0115] Exemplarily, the black light shielding material may be a black pigment.

[0116] Alternatively, the black opaque material may be carbon black particles.

[0117] It can be understood that both the shielding layer 1131 and the encapsulation layer are resin layers, which facilitates hot pressing bonding between the shielding layer 1131 and the encapsulation layer.

[0118] In some embodiments, in order to achieve the goal of shifting the light near the normal line to both sides and propagating part of the light along the original path, diffusion powder is added to each packaging layer to scatter the light.

[0119] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

[0120] For the convenience of explanation, the above description has been made in conjunction with specific embodiments. However, the above exemplary discussion is not intended to be exhaustive or limit the embodiments to the specific forms disclosed above. Based on the above teachings, various modifications and variations can be obtained. The selection and description of the above embodiments are to better explain the principles and practical applications, so that those skilled in the art can better use the embodiments and various different variations of the embodiments suitable for specific use considerations.

Claims

1. A display device, characterized in that: The display device comprises: A light board assembly, the light board assembly comprising: substrate; A light source chip, wherein the light source chip is arranged on the substrate; A packaging structure, the packaging structure covers the light source chip, and the packaging structure includes: A shielding layer; the shielding layer is stacked on the substrate, and the shielding layer is located on the peripheral side of the light source chip; At least two stacked encapsulation layers are provided, and the at least two stacked encapsulation layers are provided on a side of the shielding layer away from the substrate, and the refractive indexes of at least two of the encapsulation layers are different.

2. The display device according to claim 1, characterized in that The light source chip comprises an electrode, a light emitting layer and a substrate which are stacked, wherein the electrode is arranged on a side of the light emitting layer away from the substrate, and the electrode is connected to a pad on the substrate correspondingly; The shielding layer is disposed on the peripheral sides of the electrode and the light-emitting layer.

3. The display device according to claim 2, characterized in that: A side of the shielding layer facing away from the base plate is flush with a side of the light emitting layer facing the substrate.

4. The display device according to any one of claims 1 to 3, characterized in that: The thickness of each packaging layer is the same.

5. The display device according to any one of claims 1 to 3, characterized in that: The at least two packaging layers include a first packaging layer and a second packaging layer, the first packaging layer and the second packaging layer have different refractive indices, the first packaging layer is disposed on the light source chip, and the second packaging layer is located on a side of the first packaging layer away from the light source chip; The refractive index of the second encapsulation layer is smaller than the refractive index of the first encapsulation layer.

6. The display device according to claim 5, characterized in that: There are multiple encapsulation layers, and the multiple encapsulation layers further include a third encapsulation layer, which is stacked on the second encapsulation layer, and the refractive index of the third encapsulation layer is smaller than the refractive index of the second encapsulation layer.

7. The display device according to claim 6, characterized in that: The number of the third encapsulation layers is at least two, and at least two of the third encapsulation layers are stacked. Along the direction from the first encapsulation layer to the second encapsulation layer, the refractive index of the third encapsulation layer gradually decreases.

8. The display device according to claim 7, characterized in that: The plurality of encapsulation layers further include a fourth encapsulation layer, which is stacked on a side of the third encapsulation layer away from the second encapsulation layer, and has a refractive index greater than a refractive index of the third encapsulation layer close to the fourth encapsulation layer.

9. The display device according to any one of claims 1 to 3, characterized in that: The encapsulation layer includes a plurality of stacked resin layers.

10. The display device according to claim 9, characterized in that: The shielding layer includes a resin base layer and a black light shielding material doped in the resin base layer.

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