Liquid cooling heat dissipation system

Abstract

The utility model discloses a liquid cooling heat dissipation system, and relates to the technical field of heat dissipation equipment. The liquid cooling heat dissipation system comprises a first cooling circulation loop and a second cooling circulation loop; the first cooling loop comprises a first water cooling bar, a semiconductor refrigerator, a first cooling fan, a heat exchange shell, a liquid storage container, a first circulating pump and a first circulating pipe; the liquid storage container is connected with the cold end of the semiconductor refrigerator, and cooling liquid is stored in the liquid storage container; the second cooling circulation loop comprises a second water cooling bar, a second cooling fan, a cooling shell, a second circulating pump and a second circulating pipe; the heat dissipation shell is connected with the hot end of the semiconductor cooler, a liquid storage flow channel is formed in the heat dissipation shell, and cooling liquid is arranged in the liquid storage flow channel. The first cooling circulation loop cools the electronic component, and the second cooling circulation loop dissipates heat and cools the hot end of the semiconductor refrigerator, so that the refrigeration effect of the cold end of the semiconductor refrigerator is integrally improved.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation equipment, in particular to a liquid cooling heat dissipation system. Background Art

[0002] Chip components are widely used in electronic products, and as core components, electronic components such as central processing units generate a lot of heat during operation. In order to prevent the temperature of the heat-generating electronic components from rising due to heat accumulation, which leads to unstable operation, the electronic components usually need to be equipped with heat dissipation devices to assist in heat dissipation, but traditional air cooling sometimes cannot meet the needs.

[0003] In order to solve the above problems, some semiconductor water-cooled radiators have appeared on the market to quickly dissipate heat for electronic products, such as a CPU heat dissipation structure based on semiconductor refrigeration disclosed in Chinese utility model patent CN213659396U. It is a CPU heat dissipation structure based on semiconductor refrigeration. When in use, the coolant is put into the refrigeration box in advance, and a sealed loop is formed between the refrigeration box, the circulation pump, and the circulation pipe. By starting the circulation pump, the coolant is allowed to run continuously in the circulation pipe. The coolant after absorbing heat enters the refrigeration box again, and the refrigeration box quickly cools it down, and then performs the next circulation work. The operation is repeated, and the CPU cover and its surroundings are continuously cooled and dissipated, so that the CPU cover is always in a normal temperature state. The CPU cover is in contact with the CPU chip through the silicone grease layer, and the CPU is quickly and continuously dissipated by the coolant. The temperature of the hot end of the semiconductor refrigerator rises during operation, and the heat cannot be effectively dissipated, which is easy to affect the service life of electronic components near the hot end of the semiconductor refrigerator. Utility Model Content

[0004] The utility model provides a liquid cooling system to overcome at least one defect of the above-mentioned prior art. The liquid cooling system not only has the basic function of cooling electronic components, but also has the function of cooling the hot end of the semiconductor refrigerator, thereby improving the cooling effect of the cold end of the semiconductor refrigerator.

[0005] To achieve the above-mentioned purpose, the technical solution adopted by the utility model is: a liquid cooling heat dissipation system, including a first cooling circulation loop, the first cooling circulation loop including: a first water cooling row, a semiconductor refrigerator, a first cooling fan, a heat exchange shell, a liquid storage container, a first circulation pump and a first circulation pipe; the first cooling fan is arranged on the first water cooling row; the liquid storage container stores cooling liquid, and the liquid storage container is connected to the cold end of the semiconductor refrigerator; the liquid storage container, the first circulation pump, the heat exchange shell and the first water cooling row all form a closed loop through the first circulation pipe; the liquid cooling heat dissipation system also includes: a second cooling circulation loop, the second cooling circulation loop includes: a second water cooling row, a second cooling fan, a heat exchange shell, a second circulation pump and a second circulation pipe; the heat exchange shell is connected to the hot end of the semiconductor refrigerator, a liquid storage flow channel is arranged in the heat exchange shell, and cooling liquid is arranged in the liquid storage flow channel; the second cooling fan is arranged on the second water cooling row; the liquid storage flow channel, the second circulation pump and the second water cooling row form a closed loop through the second circulation pipe.

[0006] Optionally, a cold-keeping layer is provided on the outer side wall of the liquid storage container.

[0007] Optionally, the upper surface of the semiconductor refrigerator is connected to the lower surface of the liquid storage container, the lower surface of the semiconductor refrigerator is connected to the upper surface of the heat dissipation shell, and the first circulation pipe passes through the heat dissipation shell and is connected to the liquid storage container.

[0008] Optionally, an isolation portion is provided in the heat dissipation shell, the liquid storage channel is located at the periphery of the isolation portion, and the first circulation pipe passes through the isolation portion and is connected to the liquid storage container.

[0009] Optionally, a liquid outlet hole penetrates each other at the bottom of the liquid storage container and the isolation portion, a liquid inlet hole is provided on the side wall of the liquid storage container, and a first pipe joint is provided on both the liquid outlet hole and the liquid inlet hole, and the first circulation pipe is connected to the liquid storage container through the first pipe joint.

[0010] Optionally, second pipe joints are provided on both sides of the heat dissipation shell, and the second circulation pipe is connected to the liquid storage channel through the second pipe joints.

[0011] Optionally, an opening is provided on the top of the liquid storage container, and a sealing cover is provided on the opening.

[0012] Optionally, the first cooling fan is fixed to the outside of the first water-cooling radiator by screws, and the air inlet of the first cooling fan faces the first water-cooling radiator; the second cooling fan is fixed to the outside of the second water-cooling radiator by screws, and the air inlet of the second cooling fan faces the second water-cooling radiator.

[0013] Optionally, a curved flow channel connected to the first circulation pipe is provided in the heat exchange shell.

[0014] After adopting the above technical scheme, the beneficial effects of the utility model are as follows: a liquid cooling heat dissipation system includes a first cooling circulation loop and a second cooling circulation loop, the first cooling circulation loop is used to cool down the electronic components to be cooled, and realizes the basic function of the liquid cooling heat dissipation system to cool down the electronic components; the first cooling circulation loop includes: a first water cooling row, a semiconductor refrigerator, a first cooling fan, a heat exchange shell, a liquid storage container, a first circulation pump and a first circulation pipe. The heat exchange shell is used to be installed on the electronic components to be cooled, and the liquid storage container stores cooling liquid, and the liquid storage container is connected to the cold end of the semiconductor refrigerator; the second cooling circulation loop is used to dissipate heat and cool down the hot end of the semiconductor refrigerator of the first circulation loop, thereby improving the cooling effect of the cold end of the semiconductor refrigerator; the second cooling circulation loop includes: a second water cooling row, a second cooling fan, a heat dissipation shell, a second circulation pump and a second circulation pipe. The heat dissipation shell is connected to the hot end of the semiconductor refrigerator, and a liquid storage channel is provided in the heat dissipation shell, and a cooling liquid is provided in the liquid storage channel. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0016] Figure 1 It is a top view of the plan structure of the liquid cooling system;

[0017] Figure 2 It is a three-dimensional structural diagram of the liquid cooling system;

[0018] Figure 3 It is a schematic diagram of the structure of the assembly of the liquid storage container and the heat dissipation shell;

[0019] Figure 4 yes Figure 3 Explosion diagram of

[0020] Figure 5 yes Figure 3 A front cross-sectional view of

[0021] Figure 6 It is a top plan cross-sectional view of the heat dissipation shell.

[0022] Explanation of the reference numerals: 100, first cooling circulation loop; 110, first water-cooling radiator; 111, semiconductor refrigerator; 112, first cooling fan; 113, heat exchange shell; 114, liquid storage container; 115, first circulation pump; 116, first circulation pipe; 117, cold insulation layer; 118, first pipe joint; 119, sealing cover; 200, second cooling circulation loop; 210, second water-cooling radiator; 211, second cooling fan; 212, heat dissipation shell; 2121, isolation part; 2122, liquid storage channel; 2123, liquid outlet; 213, second circulation pump; 214, second circulation pipe; 216, second pipe joint. DETAILED DESCRIPTION

[0023] The utility model is further described in detail below in conjunction with the accompanying drawings.

[0024] This specific embodiment is merely an explanation of the present invention and is not a limitation of the present invention. After reading this specification, those skilled in the art may make non-creative modifications to the present embodiment as needed, but such modifications are protected by patent law as long as they are within the scope of the claims of the present invention.

[0025] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0026] It should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0027] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of some utility models, "plurality" means two or more, unless otherwise clearly and specifically defined.

[0028] This embodiment relates to a liquid cooling system. Figure 1-6As shown, it includes a first cooling circulation loop 100, which is used to cool down the electronic components to be cooled. The first cooling circulation loop 100 includes: a first water cooling row 110, a semiconductor refrigerator 111, a first cooling fan 112, a heat exchange shell 113, a liquid storage container 114, a first circulation pump 115 and a first circulation pipe 116.

[0029] The heat exchange shell 113 is installed on the electronic components to be cooled, and the first cooling fan 112 is arranged on the first water-cooling row 110. The liquid storage container 114 stores cooling liquid, and the liquid storage container 114 is connected to the cold end of the semiconductor refrigerator 111. The liquid storage container 114, the first circulation pump 115, the heat exchange shell 113 and the first water-cooling row 110 all form a closed loop through the first circulation pipe 116.

[0030] The liquid cooling heat dissipation system also includes: a second cooling circulation loop 200, which is used to dissipate heat and cool the hot end of the semiconductor refrigerator 111 of the first circulation loop, thereby improving the cooling effect of the cold end of the semiconductor refrigerator. The second cooling circulation loop 200 includes: a second water cooling row 210, a second heat dissipation fan 211, a heat dissipation shell 212, a second circulation pump 213 and a second circulation pipe 214. The heat dissipation shell 212 is connected to the hot end of the semiconductor refrigerator 111, and a liquid storage channel 2122 is provided in the heat dissipation shell 212, and a coolant is provided in the liquid storage channel 2122. The second heat dissipation fan 211 is arranged on the second water cooling row 210. The liquid storage channel 2122, the second circulation pump 213 and the second water cooling row 210 form a closed loop through the second circulation pipe 214.

[0031] Optionally, in the second cooling circulation loop 200, the coolant is filled in the liquid storage channel 2122, the second circulation pump 213, the second water-cooling row 210 and the second circulation pipe 214. In this embodiment, the first water-cooling row 110 has the same structure as the second water-cooling row 210, and the water-cooling row includes a fin radiator and a metal pipe, and the metal pipe is inserted into the fin radiator. The metal pipe can be curved or corrugated. A curved flow channel connected to the first circulation pipe 116 is provided in the heat exchange shell 113.

[0032] Optionally, the first cooling fan 112 is fixed to the outside of the first water-cooling row 110 by screws, and the air inlet of the first cooling fan 112 faces the first water-cooling row 110. The second cooling fan 211 is fixed to the outside of the second water-cooling row 210 by screws, and the air inlet of the second cooling fan 211 faces the second water-cooling row 210. In some embodiments, the first cooling fan 112 and the second cooling fan 211 can be arranged opposite to each other.

[0033] Optionally, a cold-insulating layer 117 is provided on the outer wall of the liquid storage container 114. The cold-insulating layer 117 can be made of polyurethane material to ensure that the coolant in the liquid storage container 114 is at a low temperature while the outer wall of the liquid storage container 114 keeps the same temperature as the outside, so as to avoid the formation of water droplets on the outer wall of the liquid storage container 114 due to the temperature of the outer wall of the liquid storage container 114 being lower than the outside temperature, and the water droplets falling on the electronic components causing the electronic components to burn out.

[0034] Optionally, the upper surface of the semiconductor refrigerator 111 is connected to the lower surface of the liquid storage container 114, and the lower surface of the semiconductor refrigerator 111 is connected to the upper surface of the heat dissipation shell 212, and the first circulation pipe 116 passes through the heat dissipation shell 212 and communicates with the liquid storage container 114. The semiconductor refrigerator 111 includes a plurality of semiconductor cooling sheets, which are distributed in a straight line. An isolation portion 2121 is provided in the heat dissipation shell 212, and a liquid storage channel 2122 is located outside the isolation portion 2121. The first circulation pipe 116 passes through the isolation portion 2121 and is connected to the liquid storage container 114. The isolation portion 2121 and the inner side wall of the heat dissipation shell 212 form a U-shaped liquid storage channel 2122.

[0035] Preferably, a liquid outlet hole 2123 is mutually penetrated between the bottom of the liquid storage container 114 and the isolation part 2121, a liquid inlet hole is provided on the side wall of the liquid storage container 114, and a first pipe joint 118 is provided on both the liquid outlet hole 2123 and the liquid inlet hole, and the first circulation pipe 116 is connected to the liquid storage container 114 through the first pipe joint 118. Second pipe joints 216 are provided on both sides of the heat dissipation shell 212, and the second circulation pipe 214 is connected to the liquid storage channel 2122 through the second pipe joint 216.

[0036] It should be noted that the liquid inlet end of the first circulation pump 115 is connected to the first pipe joint 118 at the bottom of the liquid storage container 114 through the first circulation pipe 116, the liquid outlet end of the first circulation pump 115 is connected to one end of the curved flow channel of the heat exchange shell 113 through the first circulation pipe 116, the other end of the curved flow channel is connected to one end of the metal pipe of the first water-cooling row 110 through the first circulation pipe 116, the other end of the metal pipe of the first water-cooling row 110 is connected to another pipe joint through the first circulation pipe 116, the liquid inlet end of the second circulation pump 213 is connected to a second pipe joint 216 through the second circulation pipe 214, the liquid outlet end of the second circulation pump 213 is connected to one end of the metal pipe of the second water-cooling row 210, the other end of the metal pipe of the second water-cooling row 210 is connected to another second pipe joint 216 through the second circulation pipe 214, the second water-cooling row 210 is used to dissipate heat for the coolant flowing through, and the second cooling fan 211 is used to dissipate heat for the second water-cooling row 210.

[0037] When the liquid cooling system is used to cool the electronic components, the cold end of the semiconductor refrigerator 111 cools the coolant in the liquid storage container 114, and the first circulation pump 115 drives the coolant to flow through the first circulation pipe 116 through the curved flow channel in the heat exchange shell 113 in sequence, taking away the heat from the electronic components; the coolant then flows through the first water-cooled row 110 through the first circulation pipe 116 and then flows back to the liquid storage container 114, thus circulating, the first cold water row is used to dissipate the coolant flowing through the metal pipe, and the first cooling fan 112 is used to dissipate the heat of the first cold water row.

[0038] When the temperature of the hot end of the semiconductor refrigerator 111 is too high and needs to be cooled, the second circulation pump 213 starts to work. Under the action of the second circulation pump 213, the coolant in the liquid storage channel 2122 of the heat dissipation shell 212 flows through the metal tube of the second water-cooling row 210 through the second circulation pipe 214 and then flows back into the liquid storage channel 2122. The heat of the hot end of the semiconductor refrigerator 111 is taken away by the flow of the coolant, and the hot end of the semiconductor refrigerator 111 is cooled by this cycle. The hot end of the semiconductor refrigerator 111 is cooled by the second cooling circulation loop 200 to dissipate heat and cool it. On the one hand, the cooling effect of the cold end of the semiconductor refrigerator 111 can be improved, and at the same time, the semiconductor refrigerator 111 can be prevented from burning out due to the excessively high temperature of the hot end.

[0039] Optionally, the top of the liquid storage container 114 is provided with an opening, and a sealing cover 119 is provided on the opening. The sealing cover 119 is detachably mounted on the opening, so as to facilitate opening the liquid storage container 114 to replenish the coolant. The opening of the liquid storage container 114 and the sealing cover 119 are provided with sealing rings to prevent leakage. In some embodiments, the liquid storage container 114 is pot-shaped, and the heat dissipation shell 212 is round. In other embodiments, the liquid storage container 114 may be a polyhedron structure such as a cuboid or a cube. The heat dissipation shell 212 is a flat structure.

[0040] In an optional embodiment of the present application, the liquid cooling system also includes a control circuit board, which is electrically connected to the semiconductor refrigerator 111, the first circulation pump 115, the first cooling fan 112, the second circulation pump 213, and the second cooling fan 211 through wires, and the control circuit is electrically connected to an external power supply.

[0041] In some embodiments, the liquid cooling system further includes a first temperature switch and a second temperature switch, both of which are electrically connected to the control circuit board. The first temperature switch is located on the electronic component. When the operating temperature of the electronic component reaches a preset temperature value, the first temperature switch controls the first cooling circulation loop 100 to work to dissipate heat and cool the electronic component. The second temperature switch is located on the hot end of the semiconductor refrigerator 111 or on the upper surface of the heat dissipation shell 212. When the temperature of the hot end of the semiconductor refrigerator 111 reaches a preset temperature value, the second temperature switch controls the second cooling circulation loop 200 to work.

[0042] The above is only used to illustrate the technical solution of the utility model rather than to limit it. Other modifications or equivalent substitutions made to the technical solution of the utility model by ordinary technicians in this field should be included in the scope of the claims of the utility model as long as they do not depart from the spirit and scope of the technical solution of the utility model.

Claims

1. A liquid cooling system, comprising a first cooling circulation loop (100), wherein the first cooling circulation loop comprises: A first water-cooling radiator (110), a semiconductor refrigerator (111), a first cooling fan (112), a heat exchange shell (113), a liquid storage container (114), a first circulation pump (115) and a first circulation pipe (116); The first heat dissipation fan (112) is disposed on the first water-cooling radiator (110); The liquid storage container (114) stores cooling liquid, and the liquid storage container (114) is connected to the cold end of the semiconductor refrigerator (111); The liquid storage container (114), the first circulation pump (115), the heat exchange shell (113) and the first water-cooling row (110) all form a closed loop through the first circulation pipe (116); The liquid cooling heat dissipation system further comprises a second cooling circulation loop (200), characterized in that the second cooling circulation loop (200) comprises: a second water cooling row (210), a second cooling fan (211), a heat dissipation shell (212), a second circulation pump (213) and a second circulation pipe (214); The heat dissipation shell (212) is connected to the hot end of the semiconductor refrigerator (111), a liquid storage channel (2122) is provided in the heat dissipation shell (212), and a cooling liquid is provided in the liquid storage channel (2122); The second heat dissipation fan (211) is arranged on the second water-cooling row (210); The liquid storage channel (2122), the second circulation pump (213) and the second water-cooling row (210) form a closed loop via the second circulation pipe (214).

2. The liquid cooling system according to claim 1, characterized in that: A cold-insulating layer (117) is provided on the outer wall of the liquid storage container (114).

3. The liquid cooling system according to claim 1, characterized in that: The upper surface of the semiconductor refrigerator (111) is connected to the lower surface of the liquid storage container (114), the lower surface of the semiconductor refrigerator (111) is connected to the upper surface of the heat dissipation shell (212), and the first circulation pipe (116) passes through the heat dissipation shell (212) and is connected to the liquid storage container (114).

4. The liquid cooling system according to claim 3, characterized in that: An isolation portion (2121) is provided in the heat dissipation shell (212), the liquid storage channel (2122) is located outside the isolation portion (2121), and the first circulation pipe (116) passes through the isolation portion (2121) and is connected to the liquid storage container (114).

5. The liquid cooling system according to claim 4, characterized in that: A liquid outlet (2123) is formed at the bottom of the liquid storage container (114) and the isolation portion (2121), and a liquid inlet is provided on the side wall of the liquid storage container (114). Both the liquid outlet (2123) and the liquid inlet are provided with a first pipe joint (118), and the first circulation pipe (116) is connected to the liquid storage container (114) via the first pipe joint (118).

6. The liquid cooling system according to claim 1, characterized in that: Second pipe joints (216) are provided on both sides of the heat dissipation shell (212), and the second circulation pipe (214) is connected to the liquid storage channel (2122) through the second pipe joints (216).

7. The liquid cooling system according to claim 1, characterized in that: The top of the liquid storage container (114) is provided with an opening, and the opening is covered with a sealing cover (119).

8. The liquid cooling system according to claim 1, characterized in that: The first cooling fan (112) is fixed to the outside of the first water-cooling row (110) by means of screws, and the air inlet of the first cooling fan (112) faces the first water-cooling row (110); The second cooling fan (211) is fixed to the outside of the second water-cooling radiator (210) by means of screws, and an air inlet of the second cooling fan (211) faces the second water-cooling radiator (210).

9. The liquid cooling system according to claim 1, characterized in that: A curved flow channel communicating with the first circulation pipe (116) is provided in the heat exchange shell (113).

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