LED (light-emitting diode) crystal grain fixing device

Abstract

The utility model relates to the field of die bonders, in particular to an LED die bonding device which comprises a rack. The counting module is arranged on the rack and is used for detecting the dispensing frequency of the dispensing arm and outputting a dispensing frequency signal; the signal processing module is in signal connection with the signal output end of the counting module, and is used for receiving and comparing the dispensing frequency signal and outputting a cleaning control signal when the dispensing frequency reaches a set value or an integral multiple of the set value; and the cleaning module is fixedly mounted on the rack, is positioned beside the silver adhesive supply mechanism and is used for cleaning the adhesive dispensing head on the adhesive dispensing arm. The technical effect of automatically cleaning the dispensing head can be achieved, and the dispensing precision of the die bonder is guaranteed.

Description

Technical Field

[0001] The present application relates to the field of die bonding machines, and in particular to an LED die bonding device. Background Art

[0002] Light Emitting Diode (LED) is a light-emitting element that can convert electrical energy into light energy. With the development of light-emitting diode (LED) technology, light-emitting diodes are widely used in daily life such as lighting and signal display, and LED manufacturing technology such as die bonding technology has also been continuously developed.

[0003] The purpose of die bonding is to fix the LED crystal (or chip) on the carrier so that the thermal or electrical signal can be input between the crystal and the carrier. The accuracy of the crystal into the carrier packaging position directly affects the device's light-emitting and conductive performance. If the crystal is packaged in the carrier with deviations, the light will not be fully emitted in the lighting device, thus affecting the brightness of the finished product. Therefore, the accuracy of the crystal bonding point on the carrier is very high, so as to effectively ensure the quality of the finished product.

[0004] In the prior art, a common crystal bonding machine mainly includes a frame, on which a digital tube feeding mechanism, a silver glue supply mechanism, a grain feeding mechanism (composed of a blue film, a vacuum nozzle, a pin, etc.), a glue dispensing arm, a glue dispensing drive mechanism, a crystal bonding arm and other structures are installed. During the crystal bonding process, the glue dispensing drive mechanism drives the glue dispensing arm to dispense the silver glue and adhere the silver glue to the digital tube. Then the crystal bonding arm grabs the grain and places it on the silver glue to complete the crystal bonding operation.

[0005] However, in the actual die bonding process, the glue remaining on the dispensing head of the dispensing arm is easily solidified during the dispensing process, thus affecting the dispensing accuracy, and there is room for improvement. Utility Model Content

[0006] In order to achieve the technical effect of automatically cleaning the dispensing head and ensure the dispensing accuracy of the die bonding machine, the present application provides an LED die bonding device.

[0007] The LED die bonding device provided in this application adopts the following technical solution:

[0008] An LED die bonding device comprises a frame; and:

[0009] A counting module, installed on the frame, for detecting the number of dispensing times of the dispensing arm and outputting a dispensing times signal;

[0010] A signal processing module is connected to the signal output terminal of the counting module, and is used to receive and compare the glue dispensing times signal, and output a cleaning control signal when the glue dispensing times reaches a set value or an integral multiple of the set value;

[0011] The cleaning module is fixedly mounted on the frame and located beside the silver glue supply mechanism, and is used to clean the dispensing head on the dispensing arm;

[0012] The signal input end of the dispensing drive mechanism is connected to the signal input end of the signal processing module. The dispensing drive mechanism receives the cleaning control signal and drives the dispensing head on the dispensing arm to move to the cleaning module.

[0013] By adopting the above technical solution, in the actual production and processing process, the dispensing drive mechanism drives the dispensing arm to perform the dispensing action, and the counting module detects the number of times the dispensing arm performs the dispensing action in real time. When the number of dispensing times reaches the set number, the signal processing module controls the dispensing drive mechanism to drive the dispensing arm to move to the cleaning module, and drives the dispensing head to pass through the cleaning module for cleaning, completing the dispensing head cleaning operation, which can effectively reduce the occurrence of the situation where the silver glue remains on the dispensing head and solidifies, affecting the dispensing accuracy. Among them, the control cycle of the signal processing module can be determined according to the actual number of grains on the carrier. For example, if there are 100 points on the carrier that need to be processed for solid crystal processing, after completing the solid crystal operation of a carrier (i.e. 100 dispensing actions), the signal processing module can control the dispensing drive mechanism to drive the dispensing head to the cleaning mechanism.

[0014] Preferably, the counting module comprises:

[0015] An infrared counter-radiation sensor, used for sensing the passing dispensing arm and outputting a first sensing signal;

[0016] The first single chip microcomputer is connected to the signal output terminal of the infrared radiation sensor, and is used to receive the first sensing signal, count the signal, and output the glue dispensing times signal.

[0017] By adopting the above technical solution, when the dispensing arm picks up silver glue and moves past the infrared counter-radiation sensor, the infrared counter-radiation sensor outputs a high-level signal as the first sensing signal, and the first single-chip microcomputer receives the first sensing signal and calculates the number of occurrences of the first sensing signal, thereby achieving the technical effect of detecting the number of dispensing actions of the dispensing arm.

[0018] Preferably, the infrared radiation sensor comprises a transmitting end and a receiving end, and the receiving end is fixedly mounted on the frame;

[0019] The dispensing arm is fixedly connected with a mounting seat, and a sensing hole is penetrated through the dispensing arm. The sensing hole is located below the mounting seat, and the receiving end is fixedly mounted on the mounting seat.

[0020] By adopting the above technical solution, when the dispensing arm takes the silver glue and moves to a position opposite to the transmitting end and the receiving end, the infrared light emitted by the transmitting end passes through the sensing hole and is received by the receiving end. The receiving end outputs a high-level signal as the first sensing signal, thereby achieving the technical effect of automatically sensing the number of times the dispensing arm dispenses glue.

[0021] Preferably, the signal processing module includes a second single-chip microcomputer, and a signal input terminal of the second single-chip microcomputer is signal-connected to a signal output terminal of the receiving end.

[0022] By adopting the above technical solution, the second single chip computer can compare the number of dispensing times, and when the number of dispensing times reaches a set value or an integer multiple of the set value, the dispensing drive mechanism is controlled to drive the dispensing head to move to the cleaning module.

[0023] Preferably, the cleaning module comprises:

[0024] A sensing component, fixedly mounted on the frame, connected to the signal output terminal of the second single-chip microcomputer, for receiving the cleaning control signal, detecting the glue dispensing pen, and outputting a second sensing signal;

[0025] The clamping claw cylinder, the cylinder body is fixedly installed on the frame, includes two clamping plates, and cleaning sponges adsorbed with cleaning agent are detachably installed on the two clamping plates, which are connected to the signal output end of the sensing component for receiving the second sensing signal and driving the two cleaning sponges to move toward the direction close to the dispensing head and then recover.

[0026] By adopting the above technical solution, when the dispensing drive mechanism drives the dispensing head on the dispensing arm to slide between the two clamping plates of the clamping cylinder, the sensing component senses the dispensing arm and outputs a second sensing signal. After receiving the second sensing signal, the clamping cylinder drives the two cleaning sponges to move in the direction close to the dispensing head until the two cleaning sponges contact the two sides of the dispensing head. Then the dispensing drive mechanism drives the dispensing head to move up. When the dispensing head moves up, the main body rubs against the two cleaning sponges. Since the cleaning sponge is adsorbed with cleaning agent, the silver glue remaining on the dispensing head can be removed, thereby achieving the technical effect of cleaning the dispensing head.

[0027] Preferably, the sensing component comprises:

[0028] An infrared distance measuring sensor is fixedly mounted on the frame and located above the clamping claw, with a signal input terminal connected to a signal output terminal of the second single-chip microcomputer, and is used to receive the cleaning control signal, detect the distance to the front obstruction, and output a sensing distance signal;

[0029] The third single chip microcomputer has a signal input terminal connected to the signal input terminal of the infrared ranging sensor, and is used to receive and compare the sensing distance signal, and output the second sensing signal when the sensing distance is within a set range.

[0030] By adopting the above technical solution, when the dispensing drive mechanism drives the dispensing arm to move until the dispensing head drops between the two cleaning sponges, the sensing distance measured by the infrared ranging sensor is within the set range, and the third single-chip computer controls the gripper cylinder to drive the two cleaning sponges to move toward the dispensing head, thereby achieving the technical effect of automatically sensing the position of the dispensing head and automatically controlling the gripper cylinder.

[0031] Preferably, the two clamping jaws are fixedly connected with mounting blocks, and the opposite side walls of the two clamping plates are respectively fixedly connected with mounting blocks;

[0032] The two mounting blocks are respectively provided with C-shaped grooves, and the cleaning sponge comprises a connecting portion, and the connecting portion is embedded and installed in the C-shaped grooves.

[0033] By adopting the above technical solution, the operator can install the cleaning sponge on the mounting block through the C-shaped groove, and the operator can disassemble and replace the cleaning sponge.

[0034] In summary, the LED die bonding device of the present application includes at least one of the following beneficial technical effects:

[0035] 1. Through the mutual coordination and use of the infrared counter-radiation sensor, the infrared distance sensor, the clamping claw cylinder and the cleaning sponge, the number of times the dispensing machine performs dispensing operations can be automatically detected, and when the number of dispensing operations reaches the set value or an integer multiple of the set value, the dispensing drive mechanism is automatically controlled to drive the dispensing head of the dispensing arm to move between the two cleaning sponges on the clamping claw. The infrared distance sensor is used in conjunction with the third single-chip microcomputer to automatically sense the movement of the dispensing head between the two cleaning sponges on the clamping claw, and automatically control the clamping claw cylinder to drive the two cleaning sponges to slide and fit with the two sides of the dispensing head. After the dispensing head moves up, the two cleaning sponges rub against the dispensing head to remove the residual silver glue on the dispensing head, thereby achieving the technical effect of automatically cleaning the dispensing head and effectively ensuring the dispensing quality of the crystal bonding machine;

[0036] 2. Through the C-shaped groove on the mounting block and the connecting part on the cleaning sponge, a technical effect of a detachable connection between the cleaning sponge and the mounting block can be achieved, which is convenient for operators to regularly disassemble and replace the cleaning sponge. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] Figure 1 It is a schematic diagram of an embodiment of the present application for illustrating the overall structure of a cleaning mechanism.

[0038] Figure 2 yes Figure 1 The enlarged schematic diagram of the structure at A in the middle is mainly used to show the overall structure of the cleaning module.

[0039] Figure 3The embodiment of the present application is a schematic diagram for showing signal transmission inside a die bonding device.

[0040] Explanation of the reference numerals: 1. Frame; 2. Cleaning module; 21. Gripper cylinder; 211. Clamp; 22. Infrared ranging sensor; 23. Mounting block; 231. C-shaped groove; 24. Cleaning sponge; 241. Connecting part; 3. Glue dispensing arm; 31. Mounting seat; 32. Sensing hole; 33. Glue dispensing head; 4. Infrared counter-radiation sensor; 41. Transmitter; 42. Receiving end; 5. Silver glue supply mechanism. DETAILED DESCRIPTION

[0041] The following is combined with Figure 1-3 This application is described in further detail.

[0042] Example

[0043] The present application discloses an LED die bonding device. Figure 1 , including a rack 1.

[0044] And: a counting module, installed on the frame 1, used to detect the number of glue dispensing times of the glue dispensing arm 3 and output a glue dispensing times signal; a signal processing module, connected to the signal output end of the counting module, used to receive and compare the glue dispensing times signal, and output a cleaning control signal when the glue dispensing times reaches a set value or an integer multiple of the set value; a cleaning module 2, fixedly installed on the frame 1, located next to the silver glue supply mechanism 5, used to clean the glue dispensing head 33 on the glue dispensing arm 3.

[0045] The signal input end of the glue dispensing drive mechanism is connected to the signal input end of the signal processing module. The glue dispensing drive mechanism receives the cleaning control signal and drives the glue dispensing head 33 on the glue dispensing arm 3 to move to the cleaning module 2.

[0046] During the actual production and processing process, the dispensing drive mechanism drives the dispensing arm 3 to perform the dispensing action, and the counting module detects the number of times the dispensing arm 3 performs the dispensing action in real time. When the number of dispensing times reaches the set number, the signal processing module controls the dispensing drive mechanism to drive the dispensing arm 3 to move to the cleaning module 2, and drives the dispensing head 33 to pass through the cleaning module 2 for cleaning, completing the cleaning operation of the dispensing head 33, which can effectively reduce the occurrence of silver glue residue solidifying on the dispensing head 33 and affecting the dispensing accuracy.

[0047] Among them, the control cycle of the signal processing module can be determined according to the actual number of grains on the carrier. For example, if there are 100 points on the carrier that need to be processed for solid crystal processing, after completing the solid crystal operation of one carrier (that is, 100 dispensing actions), the signal processing module can control the dispensing drive mechanism to drive the dispensing head 33 to the cleaning mechanism.

[0048] Reference Figure 1 and Figure 3The counting module includes: an infrared counter-radiation sensor 4, which is used to sense the passing dispensing arm 3 and output a first sensing signal; a first single-chip microcomputer, which is connected to the signal output end of the infrared counter-radiation sensor 4, and is used to receive the first sensing signal and count, and output a dispensing number signal.

[0049] When the dispensing arm 3 picks up silver glue and moves past the infrared counter-radiation sensor 4, the infrared counter-radiation sensor 4 outputs a high-level signal as the first sensing signal. The first single-chip microcomputer receives the first sensing signal and calculates the number of occurrences of the first sensing signal, thereby achieving the technical effect of detecting the number of dispensing actions of the dispensing arm 3.

[0050] Reference Figure 1 The infrared counter-radiation sensor 4 includes a transmitting end 41 and a receiving end 42, and the receiving end 42 is fixedly mounted on the frame 1; the dispensing arm 3 is fixedly connected to a mounting base 31, and a sensing hole 32 is penetrated through the dispensing arm 3, and the sensing hole 32 is located below the mounting base 31, and the receiving end 42 is fixedly mounted on the mounting base 31.

[0051] When the dispensing arm 3 picks up the silver glue and moves to the position where the transmitting end 41 is opposite to the receiving end 42, the infrared ray emitted by the transmitting end 41 passes through the sensing hole 32 and is received by the receiving end 42. The receiving end 42 outputs a high-level signal as the first sensing signal, thereby achieving the technical effect of automatically sensing the number of times the dispensing arm 3 dispenses glue.

[0052] In the embodiment of the present application, the signal processing module adopts a second single chip microcomputer, and the signal input terminal of the second single chip microcomputer is signal-connected to the signal output terminal of the receiving terminal 42 .

[0053] The second single chip computer can compare the number of glue dispensing times, and control the glue dispensing drive mechanism to drive the glue dispensing head 33 to move to the cleaning module 2 when the number of glue dispensing times reaches a set value or an integer multiple of the set value.

[0054] Reference Figure 2 and Figure 3 The cleaning module 2 includes: a sensing component, which is fixedly mounted on the frame 1 and connected to the signal output terminal of the second single-chip computer, and is used to receive a cleaning control signal, detect the glue dispensing pen, and output a second sensing signal; a clamping cylinder 21, whose cylinder body is fixedly mounted on the frame 1, and includes two clamping plates 211, on which cleaning sponges 24 adsorbed with cleaning agents are detachably mounted, respectively, and are connected to the signal output terminal of the sensing component, and are used to receive a second sensing signal and drive the two cleaning sponges 24 to move toward the direction close to the glue dispensing head 33 and then recover.

[0055] When the glue dispensing drive mechanism drives the glue dispensing head 33 on the glue dispensing arm 3 to slide between the two clamping plates 211 of the clamping cylinder 21, the sensing component senses the glue dispensing arm 3 and outputs a second sensing signal. After receiving the second sensing signal, the clamping cylinder 21 drives the two cleaning sponges 24 to move toward the direction close to the glue dispensing head 33 until the two cleaning sponges 24 contact the two sides of the glue dispensing head 33. Then the glue dispensing drive mechanism drives the glue dispensing head 33 to move upward. When the glue dispensing head 33 moves upward, the main body rubs against the two cleaning sponges 24. Since the cleaning sponge 24 is adsorbed with cleaning agent, the residual silver glue on the glue dispensing head 33 can be removed, thereby achieving the technical effect of cleaning the glue dispensing head 33.

[0056] Reference Figure 1 and Figure 3 The sensing component includes: an infrared ranging sensor 22, which is fixedly installed on the frame 1 and located above the clamping claw, and the signal input end is signal-connected with the signal output end of the second single-chip microcomputer, and is used to receive the cleaning control signal and detect the distance to the front obstruction, and output the sensing distance signal; the third single-chip microcomputer, the signal input end is signal-connected with the signal input end of the infrared ranging sensor 22, and is used to receive the sensing distance signal and compare it, and output the second sensing signal when the sensing distance is within the set range.

[0057] When the dispensing drive mechanism drives the dispensing arm 3 to move until the dispensing head 33 drops between the two cleaning sponges 24, the sensing distance measured by the infrared ranging sensor 22 is within the set range, and the third single-chip computer controls the clamping cylinder 21 to drive the two cleaning sponges 24 to move toward the direction close to the dispensing head 33, thereby achieving the technical effect of automatically sensing the position of the dispensing head 33 and automatically controlling the clamping cylinder 21.

[0058] Reference Figure 2 The two clamping jaws are fixedly connected with mounting blocks 23, and the opposite side walls of the two clamping plates 211 are respectively fixedly connected with mounting blocks 23; C-shaped grooves 231 are respectively penetrated through the two mounting blocks 23, and the cleaning sponge 24 includes a connecting portion 241, which is embedded and installed in the C-shaped groove 231.

[0059] The C-shaped groove 231 can facilitate an operator to install the cleaning sponge 24 on the mounting block 23 , and can facilitate an operator to disassemble and replace the cleaning sponge 24 .

[0060] The implementation principle of an LED crystal die bonding device in an embodiment of the present application is as follows: through the mutual coordination and use of the infrared counter-radiation sensor 4, the infrared ranging sensor 22, the clamping claw cylinder 21, and the cleaning sponge 24, it is possible to automatically detect the number of times the glue dispensing machine performs the glue dispensing operation, and automatically control the glue dispensing drive mechanism to drive the glue dispensing head 33 of the glue dispensing arm 3 to move between the two cleaning sponges 24 on the clamping claw when the number of glue dispensing operations reaches a set value or an integer multiple of the set value. The infrared ranging sensor 22 is used in conjunction with the third single-chip microcomputer to automatically sense the movement of the glue dispensing head 33 between the two cleaning sponges 24 on the clamping claw, and automatically control the clamping claw cylinder 21 to drive the two cleaning sponges 24 to slide and fit with the two sides of the glue dispensing head 33. After the glue dispensing head 33 moves up, the two cleaning sponges 24 rub against the glue dispensing head 33, so that the residual silver glue on the glue dispensing head 33 can be removed, thereby achieving the technical effect of automatically cleaning the glue dispensing head 33 and effectively ensuring the glue dispensing quality of the crystal bonding machine.

[0061] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. An LED die bonding device, characterized in that: comprising a frame (1); as well as: A counting module, mounted on the frame (1), used for detecting the number of times the glue dispensing arm (3) dispenses glue and outputting a glue dispensing number signal; A signal processing module is connected to the signal output terminal of the counting module, and is used to receive and compare the glue dispensing times signal, and output a cleaning control signal when the glue dispensing times reaches a set value or an integral multiple of the set value; A cleaning module (2) is fixedly mounted on the frame (1) and is located beside the silver glue supply mechanism (5) and is used for cleaning the glue dispensing head (33) on the glue dispensing arm (3); The signal input end of the glue dispensing drive mechanism is signal-connected to the signal input end of the signal processing module. The glue dispensing drive mechanism receives the cleaning control signal and drives the glue dispensing head (33) on the glue dispensing arm (3) to move to the cleaning module (2).

2. The LED die bonding device according to claim 1, characterized in that: The counting module comprises: An infrared counter-radiation sensor (4) is used to sense the passing dispensing arm (3) and output a first sensing signal; The first single chip microcomputer is signal-connected to the signal output terminal of the infrared radiation sensor (4), and is used to receive the first sensing signal, count the signal, and output the glue dispensing times signal.

3. The LED die bonding device according to claim 2, characterized in that: The infrared radiation sensor (4) comprises a transmitting end (41) and a receiving end (42), and the receiving end (42) is fixedly mounted on the frame (1); The dispensing arm (3) is fixedly connected to a mounting seat (31), a sensing hole (32) is formed through the dispensing arm (3), the sensing hole (32) is located below the mounting seat (31), and the receiving end (42) is fixedly mounted on the mounting seat (31).

4. The LED die bonding device according to claim 3, characterized in that: The signal processing module comprises a second single chip microcomputer, the signal input end of the second single chip microcomputer being signal-connected to the signal output end of the receiving end (42).

5. The LED die bonding device according to claim 4, characterized in that: The cleaning module (2) comprises: A sensing component, fixedly mounted on the frame (1), connected to the signal output terminal of the second single-chip microcomputer, used for receiving the cleaning control signal, detecting the glue dispensing pen, and outputting a second sensing signal; The clamping claw cylinder (21) has a cylinder body fixedly mounted on the frame (1), and comprises two clamping plates (211), on which cleaning sponges (24) adsorbed with cleaning agent are detachably mounted, respectively, and are connected to the signal output end of the sensing component for receiving the second sensing signal and driving the two cleaning sponges (24) to move in a direction close to the dispensing head (33) and then return.

6. The LED die bonding device according to claim 5, characterized in that: The sensing component comprises: an infrared distance measuring sensor (22), fixedly mounted on the frame (1), located above the clamping claw, with a signal input end connected to a signal output end of the second single-chip microcomputer, for receiving the cleaning control signal, detecting the distance to the front obstruction, and outputting a sensing distance signal; The third single chip microcomputer has a signal input terminal connected to the signal input terminal of the infrared distance measuring sensor (22), and is used to receive and compare the sensing distance signal, and output the second sensing signal when the sensing distance is within a set range.

7. The LED die bonding device according to claim 5, characterized in that: The two clamping jaws are fixedly connected with mounting blocks (23), and the opposite side walls of the two clamping plates (211) are respectively fixedly connected with mounting blocks (23); The two mounting blocks (23) are respectively provided with C-shaped grooves (231). The cleaning sponge (24) comprises a connecting portion (241), and the connecting portion (241) is embedded and installed in the C-shaped grooves (231).

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