Light emitting diode packaging structure

Abstract

A light emitting diode packaging structure comprises a light emitting element, a first packaging layer and a second packaging layer. The first packaging layer wraps the light emitting element. The first packaging layer has a first refractive index and is provided with a first light emitting surface. The second packaging layer covers the first light emitting surface of the first packaging layer, defines a junction, has a second refractive index and is provided with a second light emitting surface; wherein the second refractive index is greater than the first refractive index; wherein at least one of the first packaging layer and the second packaging layer is provided with a curved surface.

Description

Technical Field

[0001] The utility model relates to a light emitting diode packaging structure, in particular to a light emitting diode packaging structure having two packaging layers with different refractive indices, so as to make the light shape of the light emitting diode packaging structure more concentrated. Background Art

[0002] The luminous intensity of general light sources, such as light emitting diodes (LEDs), is distributed in a Lambertian radiation pattern in space, and its beam angle is about 120 degrees. Since the beam angle and light energy are not concentrated enough, they cannot meet the demand. In order to improve the light convergence effect and cooperate with actual optical application products (such as lighting devices), it is necessary to distribute the light of the light emitting diode. The prior art generally adds multiple secondary optical lenses to the optical application product to achieve small-angle light distribution. However, this type of product has a complex structure and a large volume, which is not conducive to the simplification of product size.

[0003] Therefore, how to improve the structural design so that optical application products can emit light at a small angle and simplify their structure to overcome the above-mentioned defects has become an important issue that this business wants to solve. Utility Model Content

[0004] The purpose of the embodiment of the utility model is to provide a light emitting diode packaging structure, which reduces the stray light on the side through the improvement of the structure of the packaging layer, concentrates the light emitting angle, increases the light intensity at the center, and thus enhances the light convergence effect.

[0005] To achieve the above-described purpose, one embodiment of the present invention provides a light-emitting diode packaging structure, which includes a light-emitting element, a first packaging layer and a second packaging layer. The first packaging layer covers the light-emitting element, and the first packaging layer has a first refractive index and forms a first light-emitting surface. The second packaging layer covers the first light-emitting surface of the first packaging layer and defines a junction, and the second packaging layer has a second refractive index and forms a second light-emitting surface. The second refractive index is greater than the first refractive index; and at least one of the first packaging layer and the second packaging layer forms a curved surface.

[0006] According to one embodiment of the present invention, the maximum thickness of the first packaging layer is greater than or equal to the thickness of the light emitting element.

[0007] According to one embodiment of the present invention, the light-emitting diode packaging structure includes a carrier having a first surface and a second surface opposite to each other, the light-emitting element is disposed on the first surface of the carrier, and the first packaging layer is disposed on the first surface and completely covers the light-emitting surface and side surfaces of the light-emitting element.

[0008] According to one embodiment of the present invention, the second encapsulation layer completely and directly covers the first light-emitting surface of the first encapsulation layer, and the second encapsulation layer and the first encapsulation layer define the boundary.

[0009] According to one embodiment of the present invention, the second refractive index is at least 0.1 greater than the first refractive index.

[0010] According to one embodiment of the present invention, the first light emitting surface of the first encapsulation layer is planar, and the second light emitting surface of the second encapsulation layer is protruding arc-shaped.

[0011] According to one embodiment of the present invention, the first light emitting surface of the first encapsulation layer forms a concave-convex microstructure, and the second light emitting surface of the second encapsulation layer is in a protruding arc shape.

[0012] According to one embodiment of the present invention, the first light emitting surface of the first encapsulation layer is a protruding curved surface structure, and the second light emitting surface of the second encapsulation layer is a concave arc-shaped curved surface structure.

[0013] According to one embodiment of the present invention, the first light emitting surface of the first encapsulation layer is a concave curved surface structure, and the second light emitting surface of the second encapsulation layer is a protruding arc-shaped curved surface structure.

[0014] According to one embodiment of the present invention, the light-emitting diode packaging structure further includes a shell, which is arranged around the light-emitting element and has a cavity, the first packaging layer fills the cavity, and the second packaging layer is arranged and covers the first light-emitting surface of the first packaging layer.

[0015] According to one embodiment of the present invention, the material of the first encapsulation layer and the second encapsulation layer is silicone, epoxy resin, or a mixture of silicone and epoxy resin.

[0016] To achieve the purpose described above, another embodiment of the present invention provides a light-emitting diode packaging structure, which includes a light-emitting element, a first packaging layer and a second packaging layer, wherein the first packaging layer has a first refractive index and covers the light-emitting element; the second packaging layer is directly connected to the first packaging layer, the second packaging layer has a second refractive index and forms a light-emitting surface; wherein the second refractive index is greater than the first refractive index; wherein at least one of the first packaging layer and the second packaging layer forms a curved surface.

[0017] The beneficial effect of the present invention is that the packaging material of the light-emitting diode packaging structure provided by the embodiment of the present invention has a birefringent packaging structure with a low refractive index (first refractive index) and a high refractive index (second refractive index), which can provide a more concentrated light shape. By utilizing the change in the refractive index of the packaging layer, when the light emitted by the light-emitting element at a large angle passes from the first packaging layer with a low refractive index to the second packaging layer with a high refractive index, the light will be deflected toward the normal line, so that the light on the side will not be directly scattered outward. Therefore, in addition to reducing stray light, the stray light can also be recycled, so that the light intensity can be improved. In short, the light of the light-emitting diode packaging structure of this embodiment can be deflected toward the center and more concentrated.

[0018] In order to further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings provided are only for reference and description and are not intended to limit the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a three-dimensional exploded view of the light emitting diode package structure of the first embodiment of the utility model.

[0020] Figure 2 It is a schematic diagram of light intensity distribution of the light emitting diode packaging structure of the present invention.

[0021] Figure 3 It is a combined cross-sectional view of the light emitting diode packaging structure of the first embodiment of the utility model.

[0022] Figure 4 It is a combined cross-sectional view of a light emitting diode packaging structure according to a second embodiment of the present invention.

[0023] Figure 5 It is a combined cross-sectional view of a light emitting diode packaging structure according to a third embodiment of the utility model.

[0024] Figure 6 It is a combined cross-sectional view of a light emitting diode packaging structure according to a fourth embodiment of the present invention.

[0025] Figure 7 It is a combined cross-sectional view of a light emitting diode packaging structure according to a fifth embodiment of the present invention.

[0026] Figure 8 It is a combined cross-sectional view of a light emitting diode packaging structure according to a sixth embodiment of the present invention.

[0027] 9A to 9C is based on Figure 3 The single refractive index is used as the control group to simulate the light distribution curve, two-dimensional light intensity diagram and two-dimensional illumination distribution diagram.

[0028] FIG. 10A to FIG. 10C So Figure 3 The embodiment simulates a light distribution curve diagram, a two-dimensional light intensity diagram and a two-dimensional illumination distribution diagram.

[0029] FIG. 11A to FIG. 11C is based on Figure 8 The single refractive index is used as the control group to simulate the light distribution curve, two-dimensional light intensity diagram and two-dimensional illumination distribution diagram.

[0030] FIG. 12A to FIG. 12C So Figure 8 The embodiment simulates a light distribution curve diagram, a two-dimensional light intensity diagram and a two-dimensional illumination distribution diagram. DETAILED DESCRIPTION

[0031] The following is an explanation of the disclosed implementation mode of the utility model through specific specific embodiments. Those skilled in the art can understand the advantages and effects of the utility model from the contents disclosed in this specification. The utility model can be implemented or applied through other different specific embodiments, and the details in this specification can also be modified and changed in various ways based on different viewpoints and applications without deviating from the concept of the utility model. In addition, the drawings of the utility model are only simple schematic illustrations and are not depicted according to actual dimensions. It is stated in advance. The following implementation modes will further explain the relevant technical contents of the utility model in detail, but the disclosed contents are not intended to limit the scope of protection of the utility model.

[0032] [First embodiment]

[0033] like Figure 1 and Figure 3 As shown, the utility model provides a light emitting diode packaging structure 1, which includes a light emitting element 20, a first packaging layer 30 and a second packaging layer 40. The first packaging layer 30 has a first refractive index and covers the light emitting element 20, the second packaging layer 40 is located on the first packaging layer 30 and is directly connected to the first packaging layer 30, and the second packaging layer 40 has a second refractive index and forms a light emitting surface. The first refractive index is different from the second refractive index.

[0034] Furthermore, the first packaging layer 30 has a first refractive index and forms a first light emitting surface 31. The second packaging layer 40 covers the first light emitting surface 31 of the first packaging layer 30, and a boundary R (see FIG. 1 ) is defined between the two. Figure 3 ). The second packaging layer 40 has a second refractive index, and forms a second light emitting surface 42 on the outer surface corresponding to the light emitting element 20 and away from the light emitting surface 21. The second refractive index is not less than the first refractive index. In this embodiment, the second refractive index is greater than the first refractive index, but it is not limited to this. In other embodiments, the first refractive index may also be approximately equal to the second refractive index.

[0035] like Figure 3 As shown in the present embodiment, the LED package structure 1 may further include a carrier 10, and the light emitting element 20 is disposed on the carrier 10. The carrier 10 has a first surface 11 and a second surface 12 opposite to each other. Figure 3 For example, the first surface 11 is the upper surface, and the second surface 12 is the lower surface. The light emitting element 20 is disposed on the first surface 11 of the carrier 10. The carrier 10 can be a base or a functional chip. If the carrier 10 is a base, it can be made of materials such as a ceramic substrate, a metal bracket, a circuit board, an EMC (Epoxy Molding Compound, thermosetting epoxy resin) bracket, and a PLCC (Plastic Leaded Chip Carrier); if the carrier 10 is a functional chip, it can be an integrated circuit (IC), but is not limited to this.

[0036] It is further explained that the present invention is not limited to a light-emitting diode package structure with a carrier, but can also be applied to a light-emitting diode package structure without a carrier, such as a chip scale package (CSP) light-emitting diode package structure. In general, chip scale packaging refers to directly packaging the entire chip and then cutting it into individual light-emitting diode chips.

[0037] In the present embodiment, the first packaging layer 30 is disposed on the first surface 11 of the carrier 10 and covers the light emitting element 20. The light emitting element 20 of the present embodiment may be an LED light emitting chip, and the type and quantity of the light emitting element 20 may be determined according to design requirements and are not limited thereto. Furthermore, the maximum thickness of the first packaging layer 30 may be greater than or equal to the thickness of the light emitting element 20. In other words, the first packaging layer 30 may completely cover the light emitting surface 21 and the side surface 22 of the light emitting element 20, while in other embodiments, the first packaging layer 30 may surround and cover the side surface 22 of the light emitting element 20 without covering the light emitting surface 21 of the emitting element 20. In addition, as Figure 1 As shown, the second packaging layer 40 covers the first light emitting surface 31 of the first packaging layer 30, and the surface of the second packaging layer 40 in contact with the first light emitting surface 31 is a light incident surface 41, and a junction R is defined between the two, that is, where the junction of two media with different refractive indices changes.

[0038] The first encapsulation layer 30 and the second encapsulation layer 40 can be a mixture of silicone, epoxy resin, siloxane resin and their adhesive materials, etc. For example, there are two main types of silicone used for light-emitting diode encapsulation, one is silyl methyl, whose refractive index is about 1.4, and the other is silyl phenyl, whose refractive index is about 1.5. The refractive index of epoxy resin is about 1.50-1.56. The refractive index of siloxane resin is about 1.4-1.53. The refractive index can be changed by introducing different materials. For example, sulfide or inorganic nanopowder can be added to epoxy resin to increase the refractive index of epoxy resin. Alternatively, the refractive index of epoxy resin can also be adjusted by adjusting the weight percentage of the hardener containing aromatic rings. In this embodiment, the first encapsulation layer 30 and the second encapsulation layer 40 can be made of materials with different refractive indices. Preferably, the second refractive index of the second encapsulation layer 40 is greater than the first refractive index of the first encapsulation layer 30, and the difference between the two is at least 0.1. For the convenience of explanation, the first refractive index may be referred to as a low refractive index in the following description, and the second refractive index may be referred to as a high refractive index, wherein "low" and "high" refer to the difference between the two refractive indices (Refractive Index, RI). However, this is not limited thereto.

[0039] like Figure 3 Cooperate Figure 2 As shown, the present invention adopts the above-mentioned structural arrangement, and the packaging material of the light emitting diode packaging structure 1 is a birefringent packaging structure with a low refractive index (first refractive index) and a high refractive index (second refractive index), which can provide a more concentrated light shape. Specifically, the present embodiment utilizes the change of the refractive index of the packaging layer. When the light emitted by the light emitting element 20 at a large angle passes through the junction R from the first packaging layer 30 with a low refractive index to the second packaging layer 40 with a high refractive index, the light emitted by the light emitting surface 21 away from the optical axis will be deflected toward the center line C (normal line) by the change of the refractive index of the first packaging layer 30 and the second packaging layer 40 from low to high, which can not only converge the light, but also because the light away from the optical axis will not be directly irradiated to the outside, in addition to reducing stray light, the stray light can also be recycled to improve the light intensity. In short, the light emitted by the light emitting diode packaging structure 1 of the present embodiment will be deflected toward the center line and more concentrated, which can be used for different lighting needs, and the angle and intensity of the light can be adjusted to achieve a better light control effect.

[0040] In this embodiment, the second light emitting surface 42 of the second encapsulation layer 40 corresponding to the light emitting area of ​​the light emitting element 20 is a curved surface, which can be a protruding arc surface, similar to a semi-spherical structure; the junction R between the second encapsulation layer 40 and the first encapsulation layer 30 can be flat. In other words, the light incident surface 41 of the second encapsulation layer 40 is a flat surface, and the first light emitting surface 31 of the first encapsulation layer 30 also has a flat surface. However, it should be noted that the shape, curvature, structure and other designs of the junction R between the first encapsulation layer 30 and the second encapsulation layer 40 can be determined according to needs and are not limited to this. In short, at least one of the first encapsulation layer 30 and the second encapsulation layer 40 is formed with a curved surface. The first light emitting surface 31 of the first encapsulation layer 30 can be a concave-convex microstructure of a roughened surface, a plane, a protruding curved surface, or a concave curved surface. The second light emitting surface 42 of the second encapsulation layer 40 can be a plane, a protruding curved surface, or a concave curved surface. In this way, different lens structures can be matched. The above examples are introduced as follows.

[0041] [Second embodiment]

[0042] like Figure 4 As shown, the difference between the light-emitting diode packaging structure 1a of this embodiment and the first embodiment is that a concave-convex microstructure is formed at the junction Ra between the first packaging layer 30 and the second packaging layer 40. For example, the first light-emitting surface 31a of the first packaging layer 30 can be formed with a concave-convex microstructure, such as a sawtooth or wavy structure. Corresponding to the first light-emitting surface 31a, the light-entering surface 41a of the second packaging layer 40 can also be formed with a concave-convex microstructure. Among them, the first light-emitting surface 31a and the light-entering surface 41a can be partially or completely formed with a concave-convex microstructure. In addition, in this embodiment, the second light-emitting surface 42 of the second packaging layer 40 is in the shape of a protruding arc. The advantage of this embodiment is that the microstructure design can increase the bonding force between the first packaging layer 30 and the second packaging layer 40. The other side can scatter light to provide a soft and uniform lighting effect.

[0043] [Third embodiment]

[0044] like Figure 5As shown, the difference between the light emitting diode package structure 1b of this embodiment and the first embodiment is that the boundary Rb between the first package layer 30 and the second package layer 40 is a curved surface structure that is concave toward the second light emitting surface 42. For example, the first light emitting surface 31b of the first package layer 30 is a protruding curved surface structure, and corresponding to the first light emitting surface 31b, the light incident surface 41b of the second package layer 40 is a concave curved surface structure. In addition, in this embodiment, the second light emitting surface 42 of the second package layer 40 is a protruding curved surface structure. It is supplemented that in other embodiments, the second light emitting surface 42 of the second package layer 40 can be a concave curved surface structure. The advantage of this embodiment is that the light shape emitted by the light emitting diode package structure 1b can be adjusted by adjusting the curvature of the first light emitting surface 31b and the second light emitting surface 42 according to different needs. Specifically, by the protruding curved surface structure of the first light emitting surface 31b, the light shape emitted by the light emitting element 20 can be changed first, so that the light is slightly divergent. Then, the second light emitting surface 42 with a protruding curved surface makes the light converge to the center again. Compared with the light shape of the first embodiment, the light emitting angle and light shape of this embodiment can be adjusted according to the lighting requirements and slightly diverge.

[0045] [Fourth embodiment]

[0046] like Figure 6 As shown, the difference between the light emitting diode package structure 1c of this embodiment and the first embodiment is that the boundary Rc between the first package layer 30 and the second package layer 40 is a curved surface structure protruding downward toward the light emitting element 20. For example, the first light emitting surface 31c of the first package layer 30 is a concave curved surface structure; corresponding to the first light emitting surface 31c, the light incident surface 41c of the second package layer 40 is a curved surface structure protruding downward. In addition, in this embodiment, the second light emitting surface 42 of the second package layer 40 is a protruding curved surface structure. The advantage of this embodiment is that the shape of light emitted by the light emitting diode package structure 1c can be adjusted by adjusting the curvature of the first light emitting surface 31c and the second light emitting surface 42 according to different needs. Specifically, by the first light emitting surface 31c being a concave curved surface structure, the shape of light emitted by the light emitting element 20 can be changed first, so that the light is slightly concentrated toward the middle. Then, the second light emitting surface 42, which is a protruding curved surface, makes the light shape concentrate toward the middle again. Compared with the light shape of the first embodiment, the light emitting angle and light shape of this embodiment can be more focused. On the other hand, if the light shape of this embodiment is the same as the light shape of the first embodiment, the curvature of the second light emitting surface 42 of the second packaging layer 40 can be reduced. In other words, the overall height of the light emitting diode packaging structure 1c can be reduced compared with the first embodiment.

[0047] [Fifth embodiment]

[0048] like Figure 7As shown, the difference between the light-emitting diode package structure 1d of this embodiment and the first embodiment is that the boundary Rd between the first package layer 30 and the second package layer 40 is a concave curved surface structure facing the second light-emitting surface 42. For example, a part of the first light-emitting surface 31d of the first package layer 30 is a protruding curved surface structure, such as a hemispherical shape. Corresponding to the first light-emitting surface 31d, the light-entering surface 41d of the second package layer 40 is a concave curved surface structure. In this embodiment, the second light-emitting surface 42 of the second package layer 40 is a protruding curved surface structure, and the curvature of the first light-emitting surface 31d of the first package layer 30 and the curvature of the second light-emitting surface 42 of the second package layer 40 can be substantially the same. The first package layer 30 can form a first lens structure, and the second package layer 40 can form a second lens structure. The first lens structure and the second lens structure can be formed by molding or dispensing, or the lenses can be made separately and then pasted. However, this is not limited to this.

[0049] [Sixth embodiment]

[0050] like Figure 8 As shown, the difference between this embodiment and the above embodiment is that the light emitting diode package structure 1e further includes a housing 15, which is disposed around the light emitting element 20e and defines a cavity 150. Specifically, in this embodiment, the housing 15 is disposed on the carrier 10e and is disposed around the light emitting element 20e, and the light emitting element 20e is located in the cavity 150.

[0051] The carrier 10e of this embodiment can be a stamped metal substrate, and the light emitting element 20e can be electrically connected to the carrier 10e by wire bonding. The first packaging layer 30e can be filled in the cavity 150 of the housing 15 by liquid dispensing. The first packaging layer 30e completely covers the wire-bonded metal wire 25. In this embodiment, a planar boundary is defined between the second packaging layer 40e and the first packaging layer 30e. Specifically, the first light emitting surface 31 of the first packaging layer 30e is planar, and the height does not exceed the top surface of the housing 15. In other words, the first light emitting surface 31 of the first packaging layer 30e can be lower than or flush with the top surface of the housing 15, as long as it covers the metal wire 25. The second packaging layer 40e can be used as a lens and is disposed on the first light emitting surface 31 of the first packaging layer 30e. The light incident surface 41 of the second packaging layer 40e adjacent to the first light emitting surface 31 is also planar, and the second light emitting surface 42 can be a protruding curved structure. However, the junction of this embodiment can also be the shape of the other embodiments mentioned above. In addition, it is supplemented that the light emitting element 20e can also be a wire-free method, such as a flip chip LED, and the number of light emitting elements 20e can be determined according to design requirements and is not limited thereto.

[0052] The light distribution curve (polar coordinate diagram), two-dimensional light intensity diagram and two-dimensional equal illumination distribution diagram of the light emitting diode package structure 1 of the present invention are simulated by computer, and compared with the light emitting diode structure of the package colloid with only a single refractive index as follows.

[0053] 9A to 9C is based on Figure 3 The control group of the structure with a single refractive index encapsulating colloid uses an encapsulating colloid with a single refractive index of 1.54 as the encapsulating layer. The simulation results show that the light intensity at 0 degrees is 0.710940. The elliptical range of its light distribution curve is relatively divergent, and the half-height full width is about 74.9 degrees. In addition, there is relatively much stray light.

[0054] FIG. 10A to FIG. 10C It is cooperation Figure 3 In the embodiment, the first encapsulation layer is about 1.4, and the second encapsulation layer is about 1.54. The simulation results show that the light intensity at an angle of 0 degrees is increased to 0.860281. Compared with the encapsulation layer with only a single refractive index of 1.54, the light intensity at an angle of 0 degrees is increased by about 20%. The elliptical range of its light distribution curve is relatively concentrated, and the half-height full width is about 71.6 degrees. In addition, the problem of stray light is greatly reduced.

[0055] FIG. 11A to FIG. 12C is based on Figure 8 The control group of the structure with a single refractive index encapsulating colloid uses an encapsulating colloid with a single refractive index of 1.54 as the encapsulating layer. The simulation results show that the light intensity at an angle of 0 degrees is 0.38500. The elliptical range of its light distribution curve is relatively divergent, and the full width at half maximum is about 74.5 degrees. Similarly, there is relatively more stray light.

[0056] FIG. 12A to FIG. 12C It is cooperation Figure 8 In the embodiment, the first encapsulation layer is about 1.4, and the second encapsulation layer is about 1.54. The simulation results show that the light intensity at an angle of 0 degrees is increased to 0.45109. Compared with the encapsulation layer with only a single refractive index of 1.54, the light intensity at an angle of 0 degrees is increased by about 17%. The elliptical range of its light distribution curve is relatively concentrated, and the half-height full width is about 72.8 degrees. In addition, the problem of stray light is greatly reduced.

[0057] The contents disclosed above are only feasible embodiments of the present invention and are not intended to limit the scope of the present invention. Therefore, all equivalent changes and modifications made using the contents of the present invention specification and drawings are included in the protection scope of the present invention.

Claims

1. A light emitting diode packaging structure, characterized in that: include: A light emitting element: a first packaging layer covering the light emitting element, wherein the first packaging layer has a first refractive index and is formed with a first light emitting surface; as well as a second packaging layer, covering the first light emitting surface of the first packaging layer and defining a boundary, wherein the second packaging layer has a second refractive index and forms a second light emitting surface; wherein the second refractive index is greater than the first refractive index; At least one of the first packaging layer and the second packaging layer is formed with a curved surface.

2. The light emitting diode packaging structure according to claim 1, characterized in that: The maximum thickness of the first packaging layer is greater than or equal to the thickness of the light emitting element.

3. The light emitting diode packaging structure according to claim 1, characterized in that: The light emitting diode packaging structure further includes a carrier having a first surface and a second surface opposite to each other. The light emitting element is disposed on the first surface of the carrier. The first packaging layer is disposed on the first surface and completely covers the light emitting surface and side surfaces of the light emitting element.

4. The light emitting diode packaging structure according to any one of claims 1 to 3, characterized in that: The second encapsulation layer completely and directly covers the first light-emitting surface of the first encapsulation layer, and the second encapsulation layer and the first encapsulation layer define the boundary.

5. The light emitting diode packaging structure according to claim 4, characterized in that: The second refractive index is at least 0.1 greater than the first refractive index.

6. The light emitting diode packaging structure according to claim 4, characterized in that: The first light-emitting surface of the first encapsulation layer is planar, and the second light-emitting surface of the second encapsulation layer is protruding arc-shaped.

7. The light emitting diode packaging structure according to claim 4, characterized in that: The first light-emitting surface of the first encapsulation layer forms a concave-convex microstructure, and the second light-emitting surface of the second encapsulation layer is in a protruding arc shape.

8. The light emitting diode packaging structure according to claim 4, characterized in that: The first light-emitting surface of the first encapsulation layer is a protruding curved surface structure, and the second light-emitting surface of the second encapsulation layer is a concave arc-shaped curved surface structure.

9. The light emitting diode packaging structure according to claim 4, characterized in that: The first light-emitting surface of the first encapsulation layer is a concave curved surface structure, and the second light-emitting surface of the second encapsulation layer is a protruding arc-shaped curved surface structure.

10. The light emitting diode packaging structure according to claim 4, characterized in that: The light emitting diode packaging structure further includes a shell, which is arranged around the light emitting element and has a cavity. The first packaging layer fills the cavity, and the second packaging layer is arranged on and covers the first light emitting surface of the first packaging layer.

11. The light emitting diode packaging structure according to claim 1, characterized in that: The material of the first packaging layer and the second packaging layer is silicone, epoxy resin, or a mixture of silicone and epoxy resin.

12. A light emitting diode packaging structure, characterized in that: include: A light emitting element: a first packaging layer, the first packaging layer having a first refractive index and covering the light emitting element; as well as a second packaging layer, directly connected to the first packaging layer, the second packaging layer having a second refractive index and forming a light emitting surface; wherein the second refractive index is greater than the first refractive index; At least one of the first packaging layer and the second packaging layer is formed with a curved surface.

13. The light emitting diode packaging structure according to claim 12, characterized in that: The maximum thickness of the first encapsulation layer is greater than or equal to the thickness of the light emitting element.

14. The light emitting diode packaging structure according to claim 12, characterized in that: The material of the first encapsulation layer and the second encapsulation layer is silicone, epoxy resin, or a mixture of silicone and epoxy resin, wherein the second refractive index is at least 0.1 greater than the first refractive index.

15. The light emitting diode packaging structure according to any one of claims 12 to 14, characterized in that: A junction is defined between the second packaging layer and the first packaging layer, and the junction forms a plane.

16. The light emitting diode packaging structure according to any one of claims 12 to 14, characterized in that: A junction is defined between the second packaging layer and the first packaging layer, and a concave-convex microstructure is formed at the junction.

17. The light emitting diode package structure according to any one of claims 12 to 14, characterized in that: A junction is defined between the second packaging layer and the first packaging layer, and the junction is a curved structure.

18. The light emitting diode packaging structure according to claim 12, characterized in that: The light emitting diode packaging structure further includes a carrier having a first surface and a second surface opposite to each other. The light emitting element is disposed on the first surface of the carrier. The first packaging layer is disposed on the first surface and completely covers the light emitting surface and side surfaces of the light emitting element.

19. The light emitting diode packaging structure according to claim 18, characterized in that: The light emitting diode packaging structure further includes a shell, which is arranged around the light emitting element and has a cavity. The first packaging layer fills the cavity, and the second packaging layer is arranged on and covers the first light emitting surface of the first packaging layer.

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